A high-sensitivity infrared multi-spectrometer based on heat management

Abstract

The present invention provides a high-sensitivity infrared multi-spectrometer based on heat management, which includes a heat-conducting frame and an optical system, a refrigeration and detection component, and an electronic system respectively matched and installed on the heat-conducting frame; the electronic system is electrically connected to the optical system and the refrigeration and detection component respectively; the heat-conducting frame is an integrated frame structure, and the contact surfaces with the optical system, the refrigeration and detection component, and the electronic system are all equipped with heat-conducting materials to guide the internal heat of the optical system, the refrigeration and detection component, and the electronic system to the bottom of the heat-conducting frame. The present invention has a reasonable and compact structural design, high internal space utilization, good internal temperature uniformity, and good heat dissipation effect, which can effectively ensure that each internal component has long-term, stable, and reliable performance, and extend the service life of each internal component.

Description

Technical Field

[0001] The invention relates to a spectrometer, in particular to a high-sensitivity infrared multi-spectrometer based on heat uniformity management. Background Art

[0002] Since 2003, countries have gradually developed low-orbit satellite constellations, and microsatellites weighing hundreds of kilograms account for more than half of the annual number of satellites launched. To this end, the mass of the microsatellite's onboard infrared detection system needs to be reduced to the order of ten kilograms, and the miniaturized high-sensitivity infrared multi-spectrometer means that the thermal noise problem caused by the internal thermal field of the instrument is more prominent. The impact of thermal noise on sensitivity, how to maintain uniform temperature inside the detector, and how to more effectively conduct internal heat away have become important directions for related research. The small multi-spectral infrared detector developed by the Institute of Mechanics is mainly composed of an optical system, an electronic system, a thermal conductive structure and a detector assembly. The heat mainly comes from the filter in the optical system, the stepper motor that drives the filter wheel, and the power module in the electronic system. The refrigerator is used to cool the entire system through the Dewar.

[0003] Miniaturized high-sensitivity infrared multi-spectrometers are used to detect infrared background radiation in the limb atmosphere, and have high sensitivity requirements. Generally speaking, the more sensitive the detector, the larger its cooling system. However, due to the requirements of the micro-satellite platform, the requirements for miniaturization, lightness, and integration of the equipment are extremely stringent. The overall equipment weight is in the order of ten kilograms, and the thermal noise problem is more prominent, making it difficult to achieve high sensitivity. Traditional design solutions are difficult to balance the requirements of equipment miniaturization and high-sensitivity cooling and heat dissipation capabilities.

[0004] The noise of infrared detection systems can be generally divided into internal noise of the detector and background noise of the target. For highly integrated, miniaturized, and highly sensitive infrared multi-spectrometers, the influence of optomechanical thermal noise caused by the internal thermal field is very obvious. It is necessary to make the overall temperature of the optical system low enough and the temperature balanced to reduce the influence of thermal noise, but the heat transfer path of the existing heat dissipation structure is difficult to meet the requirements.

[0005] Optical and electronic equipment mainly rely on micro-satellite platforms for heat dissipation, but the focal plane of infrared detectors needs to dissipate heat autonomously, which requires new ways to optimize the heat dissipation structure. Summary of the invention

[0006] In response to the problems existing in the above-mentioned background technology, the present invention proposes a high-sensitivity infrared multi-spectrometer based on heat management, which has a reasonable and compact structural design, high internal space utilization, good internal temperature uniformity and good heat dissipation effect, and can effectively ensure that each internal component has long-term, stable and reliable performance, and extend the service life of each internal component.

[0007] In order to solve the above technical problems, the present invention provides a high-sensitivity infrared multi-spectrometer based on uniform heat management, which includes a heat-conducting frame and an optical system, a refrigeration and detection component, and an electronic system respectively mounted on the heat-conducting frame; the electronic system is electrically connected to the optical system and the refrigeration and detection component, respectively; the heat-conducting frame is an integrated frame structure, and its contact surfaces with the optical system, the refrigeration and detection component, and the electronic system are all equipped with heat-conducting materials to guide the internal heat of the optical system, the refrigeration and detection component and the electronic system to the bottom of the heat-conducting frame.

[0008] The high-sensitivity infrared multi-spectrometer based on heat-average management, wherein: the electronic system includes a detector imaging device, a refrigerator drive module, a detector interface board, an image processing module, a stepper motor drive board and a power conversion board matched and mounted on the heat-conducting frame; the power conversion board is electrically connected to the detector imaging device, the refrigerator drive module, the detector interface board, the image processing module and the stepper motor drive board respectively; the contact surface between the heat-conducting frame and the refrigerator drive module is equipped with a heat-conducting material.

[0009] The high-sensitivity infrared multi-spectrometer based on uniform heat management, wherein: the optical system is matched and installed on one side of the heat-conducting frame, and includes a lens base, a filter wheel bracket, a filter wheel, a stepper motor, a filter, a lens barrel, a lens and a light shield; the lens base is matched and fixed to the inner bottom of one side of the heat-conducting frame; the filter wheel bracket is matched and arranged on the upper part of the lens base; the filter wheel is hingedly installed on the top of the filter wheel bracket through a rotating shaft with a bearing, and the filter is evenly installed along the circumference; the stepper motor is matched and fixed to the inner bottom of one side of the heat-conducting frame; the filter wheel bracket is matched and arranged on the upper part of the lens base; the filter wheel is hingedly installed on the top of the filter wheel bracket through a rotating shaft with a bearing, and the filter is evenly installed along the circumference; The motor is matched and installed horizontally on one side of the top end of the filter wheel bracket, and its power output end is matched and connected with the rotating shaft of the filter wheel; the filter wheel is driven to rotate by the stepper motor to realize detection of different spectral bands; the stepper motor is also electrically connected to the stepper motor drive board; the lens barrel is matched and installed horizontally in the middle of a side surface of the filter wheel bracket facing away from the stepper motor; the inner hole at the head end of the lens barrel is matched and installed with the lens, and the outer matching sleeve is equipped with the light shield; the head end of the light shield horizontally extends to the outside of the heat-conducting frame.

[0010] The high-sensitivity infrared multi-spectrometer based on uniform heat management, wherein: the wheel surface of the filter wheel is evenly installed with 8 filters of different spectral bands along the circumference.

[0011] The high-sensitivity infrared multi-spectrometer based on heat equalization management, wherein: the refrigeration and detection component is matched and installed on the inner bottom of the other side of the heat-conducting frame, and includes a mounting frame, a compressor, an expansion valve and a detector; the mounting frame is matched and fixedly installed on the inner bottom of the other side of the heat-conducting frame; the compressor is matched and installed on the upper part of one end of the mounting frame, and is also electrically connected to the refrigerator drive module and the power conversion board respectively; the expansion valve is matched and installed on the upper part of the mounting frame on one side of the compressor, and its input end is connected to the compressor through a pipeline; the contact surface between the heat-conducting frame and the expansion valve is equipped with heat-conducting material; the detector is matched and installed on the output end of the expansion valve, and is also electrically connected to the detector imaging device, the detector interface board and the image processing module respectively.

[0012] The high-sensitivity infrared multi-spectrometer based on uniform heat management, wherein: the detector is a cold focusing focal plane photovoltaic detector.

[0013] The high-sensitivity infrared multi-spectrometer based on heat distribution management, wherein: the heat-conducting frame has an accommodating space inside, which is composed of a base plate located at the bottom, a heat-conducting bracket vertically connected to a group of opposite side edges of the base plate, and a top frame horizontally connected to the top of a pair of heat-conducting brackets; the heat-conducting frame is matched with cover plates installed on its side and the top side of the top frame; and the cover plate installed on the side of the heat-conducting frame can completely cover the heat-conducting bracket, and the cover plate installed on the top side of the top frame can completely cover the top frame; the detector imaging device, the refrigerator drive module, the detector interface board, the stepper motor drive board and the power conversion board are respectively matched and installed on the inner walls of the heat-conducting brackets on the opposite sides of the heat-conducting frame; the image processing module is matched and installed on the inner side of the top frame through the bracket.

[0014] The high-sensitivity infrared multi-spectrometer based on heat distribution management, wherein: the power conversion board includes a power board and an MFL power module, an EMI power module and an MTR power module respectively arranged on the power board; the MFL power module, the EMI power module and the MTR power module are all electrically connected to the power board through an internal circuit; the power board is in contact with the thermally conductive bracket.

[0015] The high-sensitivity infrared multi-spectrometer based on uniform heat management, wherein: the image processing module is composed of an upper image processing board and a lower image processing board; the center of the upper image processing board is in contact with and connected to the cover plate installed on the top frame, and the lower image processing board is in contact with and connected to the top frame on its peripheral side.

[0016] The high-sensitivity infrared multi-spectrometer based on heat distribution management, wherein: the thermal conductive material is Tfle ex600 series thermal conductive silicone sheet, the main body of which is silicone rubber and the filler is boron nitride.

[0017] By adopting the above technical solution, the present invention has the following beneficial effects:

[0018] The high-sensitivity infrared multi-spectrometer based on heat-average management of the present invention has a reasonable and compact structural design and good heat dissipation effect. In particular, the thermal conductive structure design of the integrated thermal conductive frame is adopted. The thermal conductive frame plays a heat-conducting role while supporting the main structure, and also meets the internal temperature uniformity requirement of the detector as much as possible. The internal heat of the components installed on the thermal conductive frame can be uniformly guided to the bottom mounting surface, that is, the bottom plate of the thermal conductive frame, thereby improving the uniformity of the internal temperature of the infrared multi-spectrometer, ensuring the stable and reliable performance of each component inside the infrared multi-spectrometer, and extending the service life of each component inside the infrared multi-spectrometer.

[0019] The present invention adopts an integrated power module integration method, three power modules are respectively arranged on a power board, and then the power board is contacted and connected with a heat-conducting frame for heat conduction. This thermal structure optimization design that integrates the power board with the three power modules avoids heat accumulation in a single module, plays a good heat dissipation role, reduces heat accumulation inside the infrared multi-spectrometer, and further improves the internal space utilization of the spectrometer.

[0020] The structural design of the present invention can provide important theoretical and data support for establishing a thermal simulation model of an infrared multi-spectrometer and performing thermal design optimization.

[0021] The present invention can significantly reduce equipment failures caused by overheating, thereby enhancing the reliability of the equipment; the new structure is simpler than the traditional structure, making it easier for experimenters to troubleshoot failures, thereby increasing the practicability of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 It is a schematic structural diagram of a high-sensitivity infrared multi-spectrometer based on heat uniformity management of the present invention;

[0024] Figure 2 Another structural schematic diagram of the high-sensitivity infrared multi-spectrometer based on heat-average management of the present invention;

[0025] Figure 3 It is a schematic structural diagram of a heat-conducting frame of a high-sensitivity infrared multi-spectrometer based on heat-average management according to the present invention;

[0026] Figure 4 It is a schematic diagram of the structure of the optical system of the high-sensitivity infrared multi-spectrometer based on heat uniformity management of the present invention;

[0027] Figure 5 It is a right view of the optical system of the high-sensitivity infrared multi-spectrometer based on heat-average management of the present invention;

[0028] Figure 6 It is a schematic diagram of the structure of the cooling and detection components of the high-sensitivity infrared multi-spectrometer based on heat uniformity management of the present invention. DETAILED DESCRIPTION

[0029] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] The present invention is further explained below in conjunction with specific implementation modes.

[0031] like Figure 1-2 As shown, this embodiment provides a high-sensitivity infrared multi-spectrometer based on heat uniformity management, including a heat-conducting frame 1, an optical system 2, a cooling and detection component 3 and an electronics system 4.

[0032] like Figure 3 As shown, the heat-conducting frame 1 adopts an integrated frame structure and has an accommodating space inside. It is composed of a bottom plate 11 located at the bottom, a heat-conducting bracket 12 vertically connected to a group of opposite sides of the bottom plate 11, and a top frame 13 horizontally connected to the top of a pair of heat-conducting brackets 12; the heat-conducting frame 1 is matched with a cover plate installed on its four sides and the top side of the top frame 13; and the cover plate installed on the sides of the heat-conducting frame 1 can completely cover the heat-conducting bracket 12, and the cover plate installed on the top side of the top frame 13 can completely cover the top frame 13. The heat-conducting frame 1 is used to support the main structural parts and guide the heat of the components installed on the bottom plate 11, the heat-conducting bracket 12, the top frame 13 and the cover plate into the bottom plate 11. The initial thermal structure idea of ​​the entire spectrometer is to guide the internal heat to its bottom, that is, the bottom plate 11, through the heat-conducting frame 1, and then conduct it to the radiation heat dissipation surface of the satellite platform through the bottom plate 11 for heat dissipation.

[0033] like Figure 4-5As shown, the optical system 2 is matched and mounted on the right side of the heat-conducting frame 1 and is electrically connected to the electronic system 4, and includes a lens base 21, a filter wheel bracket 22, a filter wheel 23, a stepper motor 24, a filter 25, a lens barrel 26, a lens 27 and a light shield 28. The lens base 21 is matched and fixed on the bottom plate 11 on the right side of the heat-conducting frame 1; the filter wheel bracket 22 is matched and arranged on the upper part of the lens base 21. The filter wheel 23 is hingedly mounted on the top of the filter wheel bracket 22 through a rotating shaft and a bearing, and the wheel surface is evenly provided with filter mounting holes along the circumference, and a filter 25 is matched and embedded in each filter mounting hole. In this embodiment, the filter wheel is equipped with 8 filters 25 of different spectrum bands; the stepper motor 24 is matched and horizontally mounted on one side of the top of the filter wheel bracket 22, and its power output end is matched and connected with the rotating shaft of the filter wheel 23. The filter wheel 23 is driven to rotate by the stepper motor 24, so as to realize the detection of different spectrum bands. The lens barrel 26 is matched and horizontally mounted in the middle of one side of the filter wheel bracket 22 and is located on a different side from the stepper motor 24; the inner hole of the head end of the lens barrel 26 is matched and mounted with a lens 27, and the outer side is matched and equipped with a light shield 28; the head end of the light shield 28 horizontally extends to the right side of the heat conduction frame 1. Due to the requirement of miniaturization of the spectrometer, the optical system 2 has no independent refrigeration, and mainly relies on the satellite platform for heat dissipation.

[0034] like Figure 6 As shown, the refrigeration and detection assembly 3 is matched and installed on the bottom plate 11 on the left side of the heat-conducting frame 1 and is electrically connected to the electronic system 4, and includes a mounting frame 31, a compressor 32, an expansion valve 33 and a detector 34. The mounting frame 31 is matched and fixedly installed on the bottom plate 11 on the left side of the heat-conducting frame 1; the compressor 32 is matched and installed on the upper part of one end of the mounting frame 31; the expansion valve 33 is matched and installed on the upper part of the mounting frame 31 on one side of the compressor 32, and its input end is connected to the compressor 32 through a pipeline; the detector 34 is matched and installed on the output end of the expansion valve 33. Among them, the detector 34 is a cold focusing focal plane photovoltaic detector. In this embodiment, the cold focusing focal plane photovoltaic detector can adopt a medium-wave high-sensitivity infrared multi-spectrometer, with a pixel size of about 15μm, a pixel number of 640×512, a response band of about 3-5μm, and a focal plane operating temperature of about 60K; in this embodiment, the cold focusing focal plane photovoltaic detector can also adopt a long-wave high-sensitivity infrared multi-spectrometer, with a pixel size of about 30μm, a pixel number of 320×256, a response band of about 7-11μm, a focal plane operating temperature of 80K, a material of HgCdTe, and an integrated detector Dewar refrigeration component.

[0035] The electronic system 4 is matched and installed inside the heat-conducting frame 1 , and includes a detector imaging device 41 , a refrigerator driving module 42 , a detector interface board 43 , an image processing module 44 , a stepper motor driving board 45 and a power conversion board 46 .

[0036] The detector imaging device 41 is mounted on the inner wall of one side of the heat-conducting bracket 12 and is electrically connected to the detector 34 of the refrigeration and detection assembly 3, so as to realize the conversion of the received long-wave infrared signal into an electrical signal output.

[0037] The refrigerator driving module 42 is used to control the temperature of the compressor 32 of the refrigeration and detection assembly 3 . It matches the inner wall of the heat-conducting bracket 12 installed on the rear side of the heat-conducting frame 1 and is electrically connected to the compressor 32 of the refrigeration and detection assembly 3 .

[0038] The detector interface board 43 matches the inner wall of the middle section of the heat-conducting bracket 12 installed on the rear side of the heat-conducting frame 1 and is electrically connected to the detector 34 of the refrigeration and detection assembly 3 to pre-process the output signal of the detector 34 .

[0039] The image processing module 44 is mounted on the inner side of the top frame 13 of the heat-conducting frame 1 through a bracket, which is convenient for connecting external transmission cables and indirectly conducts heat to the frame 1 through the bracket. The image processing module 44 is also electrically connected to the detector 34 of the refrigeration and detection assembly 3; the image processing module 44 is composed of an upper and lower image processing board; the center of the upper image processing board contacts the cover plate on the upper side of the heat-conducting frame 1 for heat conduction, and the lower image processing board contacts the top frame 13 around it for heat conduction.

[0040] The stepper motor driving board 45 is matched and mounted on the inner wall of the middle section of the heat-conducting bracket 12 at the front side of the heat-conducting frame 1 and is electrically connected to the stepper motor 24 of the optical system 2 .

[0041] The image processing module 44 is responsible for converting the detector 34 signal into a digital image and outputting it, and then responding to the instruction including driving and controlling the stepper motor 24 through the stepper motor driving board 45 .

[0042] The power conversion board 46 matches the inner wall of the heat-conducting bracket 12 installed on the front side of the heat-conducting frame 1, and is used to filter the power supply to ensure the stable operation of the compressor 32 of the refrigeration and detection component 3; and the power conversion board 46 is also electrically connected to the compressor 32, the detector imaging device 41, the refrigerator drive module 42, the detector interface board 43, the image processing module 44 and the stepper motor drive board 45 respectively. Among them, the power conversion board 46 includes a power board 461 and an MFL power module 462, an EMI power module 463 and an MTR power module 464 respectively arranged on the power board 461; the MFL power module 462, the EMI power module 463 and the MTR power module 464 are all electrically connected to the power board 461 through an internal circuit; the power conversion board 46 integrates the MFL power module 462, the EMI power module 463 and the MTR power module 464 together and places them on the power board 461, and then contacts and connects the power board 461 with the heat-conducting frame 1, so that the heat loss between the power modules installed on the power board 461 can be evenly guided to the heat-conducting frame 1, reducing the heat accumulation inside it, and at the same time further improving the internal space utilization of the spectrometer.

[0043] The thermally conductive frame 1 uses Tflex 600 series thermally conductive silicone sheets as thermally conductive materials. The main material is silicone rubber, and the filler is boron nitride, which has self-adhesiveness and insulation properties. The thermally conductive silicone sheets of this type are installed on the contact surfaces of the refrigerator drive module 42, the power conversion board 46, and the expansion valve 33 with the thermally conductive frame 1 to improve the thermal conductivity. At the same time, the strategy of compaction is adopted for the area where the thermally conductive silicone sheets are installed to further improve the thermal conductivity coefficient.

[0044] In order to reduce the influence of the external thermal environment on the spectrometer, the outer surfaces of the spectrometer except the mounting surface need to be covered with multi-layer thermal insulation components; the light shield 25 of the optical system 2, the cover plate of the heat-conducting frame 1, the bottom plate 11 and the surface of the heat-conducting bracket 12 are black anodized, and the infrared hemispherical emissivity ε h >0.85.

[0045] The present invention has a reasonable and compact structural design, high internal space utilization, good temperature uniformity of internal components and good heat dissipation effect, can effectively ensure stable and reliable use performance of internal components, extend the service life of internal components, and is suitable for promotion and application.

[0046] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A high-sensitivity infrared multi-spectrometer based on heat management. Features: The infrared multi-spectrometer comprises a heat-conducting frame (1) and an optical system (2), a cooling and detection component (3), and an electronic system (4) which are matched and mounted on the heat-conducting frame (1); the electronic system (4) is electrically connected to the optical system (2) and the cooling and detection component (3) respectively; the heat-conducting frame (1) is an integrated frame structure, and the contact surfaces with the optical system (2), the cooling and detection component (3), and the electronic system (4) are all provided with heat-conducting materials so as to guide the internal heat of the optical system (2), the cooling and detection component (3), and the electronic system (4) to the bottom of the heat-conducting frame (1); The electronic system (4) comprises a detector imaging device (41), a refrigerator driving module (42), a detector interface board (43), an image processing module (44), a stepper motor driving board (45) and a power conversion board (46) which are matched and mounted on the heat-conducting frame (1); the power conversion board (46) is electrically connected to the detector imaging device (41), the refrigerator driving module (42), the detector interface board (43), the image processing module (44) and the stepper motor driving board (45) respectively; the contact surface between the heat-conducting frame (1) and the refrigerator driving module (42) is provided with a heat-conducting material; The power conversion board (46) comprises a power board (461) and an MFL power module (462), an EMI power module (463) and an MTR power module (464) respectively arranged on the power board (461); the MFL power module (462), the EMI power module (463) and the MTR power module (464) are all electrically connected to the power board (461) via an internal circuit; the power board (461) is in contact with a heat-conducting bracket (12) and is mounted on the heat-conducting frame (1) via the heat-conducting bracket (12).

2. The high-sensitivity infrared multi-spectrometer based on heat management as claimed in claim 1, Features: The optical system (2) is matched and mounted on one side of the heat-conducting frame (1), and comprises a lens base (21), a filter wheel bracket (22), a filter wheel (23), a stepping motor (24), a filter (25), a lens barrel (26), a lens (27) and a light shield (28); The lens base (21) is matched and fixed to the inner bottom of one side of the heat-conducting frame (1); The filter wheel bracket (22) is matched and arranged on the upper part of the lens base (21); The filter wheel (23) is hingedly mounted on the top of the filter wheel bracket (22) through a rotating shaft matched with a bearing, and the filter (25) is evenly mounted along the circumference; The stepper motor (24) is matched and horizontally mounted on one side of the top end of the filter wheel bracket (22), and its power output end is matched and connected with the rotating shaft of the filter wheel (23); the filter wheel (23) is driven to rotate by the stepper motor (24) to realize detection of different spectrum bands; the stepper motor (24) is also electrically connected to the stepper motor driving board (45); The lens barrel (26) is mounted horizontally in a matching manner on the middle of a side surface of the filter wheel bracket (22) facing away from the stepping motor (24); the lens (27) is mounted in a matching manner on the inner hole of the head end of the lens barrel (26), and the light shield (28) is mounted in a matching manner on the outside; the head end of the light shield (28) extends horizontally to the outside of the heat-conducting frame (1).

3. The high-sensitivity infrared multi-spectrometer based on heat management as claimed in claim 2, Features: The wheel surface of the filter wheel (23) is evenly mounted with eight filters (25) of different spectrum bands along the circumference.

4. The high-sensitivity infrared multi-spectrometer based on heat management as claimed in claim 1, Features: The refrigeration and detection assembly (3) is matched and installed on the inner bottom of the other side of the heat-conducting frame (1), and comprises a mounting frame (31), a compressor (32), an expansion valve (33) and a detector (34); The mounting frame (31) is matched and fixedly mounted on the inner bottom of the other side of the heat-conducting frame (1); The compressor (32) is matched and mounted on the upper part of one end of the mounting frame (31), and is also electrically connected to the refrigerator drive module (42) and the power conversion board (46) respectively; The expansion valve (33) is matched and mounted on the upper part of the mounting frame (31) on one side of the compressor (32), and its input end is connected to the compressor (32) through a pipeline; the contact surface between the heat-conducting frame (1) and the expansion valve (33) is provided with a heat-conducting material; The detector (34) is mounted on the output end of the expansion valve (33) and is electrically connected to the detector imaging device (41), the detector interface board (43) and the image processing module (44) respectively.

5. The high-sensitivity infrared multi-spectrometer based on heat management as claimed in claim 4, Features: The detector (34) is a cold focusing focal plane photovoltaic detector.

6. The high-sensitivity infrared multi-spectrometer based on heat management as claimed in claim 2, Features: The heat-conducting frame (1) has a storage space inside, which is composed of a bottom plate (11) located at the bottom, the heat-conducting brackets (12) vertically connected to a group of opposite side edges of the bottom plate (11), and a top frame (13) horizontally connected to the top ends of a pair of heat-conducting brackets (12); the heat-conducting frame (1) is matched with cover plates installed on its side and the top side of the top frame (13); and the cover plate installed on the side of the heat-conducting frame (1) can completely cover the heat-conducting brackets (12), and the cover plate installed on the top side of the top frame (13) can completely cover the top frame (13); The detector imaging device (41), the refrigerator driving module (42), the detector interface board (43), the stepper motor driving board (45) and the power conversion board (46) are respectively mounted on the inner walls of the heat-conducting bracket (12) on opposite sides of the heat-conducting frame (1); and the image processing module (44) is mounted on the inner side of the top frame (13) through the bracket.

7. The high-sensitivity infrared multi-spectrometer based on heat management as claimed in claim 6, Features: The image processing module (44) is composed of an upper image processing board and a lower image processing board; the center of the upper image processing board is in contact with the cover plate installed on the top frame (13), and the lower image processing board is in contact with the top frame (13) on its peripheral side.

8. The high-sensitivity infrared multi-spectrometer based on heat management as claimed in claim 1, Features: The thermal conductive material is T-flex 600 series thermal conductive silicone sheet, the main body of which is silicone rubber and the filler is boron nitride.

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