A CIR heat dissipation device and implementation method

Abstract

A CIR heat dissipation device and implementation method, belonging to the field of heat dissipation of wireless communication equipment. It includes a main heat dissipation unit and multiple auxiliary heat dissipation units. The main heat dissipation unit includes a main heat dissipation unit interface, a main heat dissipation fan unit, a power supply unit, an MCU, a main temperature sensor and multiple auxiliary heat dissipation expansion interfaces. The auxiliary heat dissipation unit includes an auxiliary heat dissipation unit interface, an auxiliary temperature sensor and an auxiliary heat dissipation fan unit. Each auxiliary heat dissipation expansion interface is connected to an auxiliary heat dissipation unit interface through a flat cable. Implementation method: The main heat dissipation unit is installed at the CIR fan unit, and each auxiliary heat dissipation unit is installed near the unit with higher heat generation in the chassis. When the CIR is turned on and initialized, the MCU collects the temperature of the temperature sensors of the main and auxiliary heat dissipation units, and automatically controls the fan start and stop of the main and auxiliary fan units according to the set temperature threshold, so as to realize multi-point temperature detection and automatic fan start and stop inside the CIR, timely and effectively dissipate heat and cool the CIR, improve the life of the equipment and save energy consumption.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation of CIR equipment, and in particular to a CIR heat dissipation equipment and an implementation method thereof. Background Art

[0002] CIR is the abbreviation of locomotive integrated wireless communication equipment, which complies with the national standard: QCR651.1-2018. At present, the commonly used heat dissipation device for CIR equipment in my country is a fan unit installed on the CIR, which is usually installed on the reserved panel of the A subframe. There are two main types of existing heat dissipation devices: one is a fan unit controlled by a rocker switch: this fan unit is manually controlled by a rocker switch, the fan starts when the switch is turned on, and the fan stops when the switch is turned off. Its disadvantage is that the operation of the fan has nothing to do with the temperature. It is impossible to automatically start the fan to cool down when the temperature is high, and automatically control the fan to stop when the temperature is low, resulting in insufficient energy saving. In addition, the switch circuit design is simple, and it is impossible to filter out the unexpected clutter generated when the fan rotates, which affects the stability of the CIR power supply; at the same time, manual operation is required, which increases the workload. The other is a fan unit controlled by a temperature sensor: this fan unit has the function of automatically starting and shutting down the fan according to temperature changes, but it has only one temperature sensor and is installed on the fan unit. When the heat inside the CIR is transferred to the fan unit through the air, the heat generation unit of the CIR chassis and its surroundings have accumulated heat for some time. After the fan is started, it will first exhaust the heat near the fan unit due to its short distance. When the temperature sensor detects that the temperature drops to the set value, the fan stops. However, the temperature of other parts of the CIR chassis will not drop as fast as the temperature near the fan unit, causing some CIR units to work in a high temperature environment for a long time, which will reduce the service life of components and increase the probability of equipment failure. Summary of the invention

[0003] In order to solve the above problems in the prior art, the present invention provides a CIR heat dissipation device and an implementation method, which realizes effective heat dissipation of the CIR chassis by partition.

[0004] The technical solution adopted by the present invention is: a CIR heat dissipation device, including a main heat dissipation unit and multiple auxiliary heat dissipation units, the main heat dissipation unit includes a main heat dissipation unit interface, a main heat dissipation fan unit, a power supply unit, an MCU, a main temperature sensor and multiple auxiliary heat dissipation extension interfaces, the main heat dissipation unit is connected to the CIR motherboard unit fan socket through the main heat dissipation unit interface, the main heat dissipation unit interface is respectively unidirectionally connected to the main heat dissipation fan unit, the power supply unit and multiple auxiliary heat dissipation extension interfaces, the power supply unit is respectively unidirectionally connected to the MCU, the main temperature sensor and multiple auxiliary heat dissipation extension interfaces, the MCU is respectively bidirectionally connected to the main heat dissipation unit interface, the main heat dissipation fan unit, the main temperature sensor and multiple auxiliary heat dissipation extension interfaces, the auxiliary heat dissipation unit includes an auxiliary heat dissipation unit interface, an auxiliary temperature sensor and an auxiliary heat dissipation fan unit, the auxiliary heat dissipation unit interface is respectively connected to the auxiliary heat dissipation fan unit and the auxiliary temperature sensor, the multiple auxiliary heat dissipation extension interfaces of the main heat dissipation unit are connected to the auxiliary heat dissipation unit interfaces of multiple auxiliary heat dissipation units, and each auxiliary heat dissipation extension interface corresponds to an auxiliary heat dissipation unit interface.

[0005] The main cooling unit and the auxiliary cooling unit are respectively installed in the CIR, wherein the main cooling unit is installed at the CIR fan unit, and each auxiliary cooling unit is respectively installed at a heat generating position in the CIR chassis, the auxiliary cooling extension interface is connected to the auxiliary cooling unit interface, the UART serial port of the main cooling unit MCU is connected to the RS485 serial port of the main cooling unit interface, the MMI human-computer interaction interface is connected to the switching unit of the CIR, and the switching unit of the CIR is connected to the main control unit of the CIR.

[0006] The implementation method of CIR heat dissipation equipment, the working steps are as follows:

[0007] Step 1. CIR cooling device function detection and initial settings: Power on the CIR for initialization. After the CIR cooling device is initialized, all fans start and stop after a few seconds. The start and stop of the main cooling unit and each auxiliary cooling unit fan are controlled by the MCU of the main cooling unit. The fan speed of the main cooling unit and each auxiliary cooling unit and the temperature data of the temperature sensor are collected by the MCU of the main cooling unit. The speed of the main cooling unit and each auxiliary cooling unit fan and the detected temperature can be viewed through the MMI human-computer interaction interface. In manual mode, all fans can be manually turned on or off through the MMI human-computer interaction interface. In automatic mode, the temperature threshold and temperature hysteresis are set by the program to automatically start the fan when the temperature exceeds the threshold, and automatically stop the fan when the temperature is lower than the hysteresis temperature of the threshold;

[0008] Step 2. Temperature collection and fan control: The temperature sensors on the main cooling unit and each auxiliary cooling unit collect the ambient temperature. The main cooling unit MCU cyclically queries the temperature of the main temperature sensor and each auxiliary temperature sensor through the IIC bus, and compares it with the set threshold. When the temperature collected by the temperature sensor of a certain auxiliary cooling unit exceeds the threshold, the MCU of the main cooling unit controls the fan of the auxiliary cooling unit to start, and dissipate the heat at the location where the auxiliary cooling unit is installed in the CIR in time. When the temperature sensor of the main cooling unit detects that the temperature of the main cooling unit position inside the CIR chassis is higher than the set temperature threshold, the fan of the main cooling fan unit is started to exhaust and cool down;

[0009] Step 3. Temperature monitoring and fan stop: After the fan of the main cooling fan unit or the fan of a sub-cooling fan unit is started, the MCU continuously queries the temperature data of the temperature sensors of the main cooling unit and each sub-cooling unit of the CIR cooling device. When the temperature is detected to be lower than the hysteresis temperature of the set threshold, the MCU automatically controls each fan to stop rotating.

[0010] The beneficial effects of the present invention are as follows: the present invention realizes temperature detection and heat dissipation at multiple points in different zones through the cooperation of the main heat dissipation unit and the auxiliary heat dissipation unit, and effectively solves the problem that the existing heat dissipation equipment cannot be automatically started and stopped according to the temperature, and the heat dissipation efficiency is low. The main heat dissipation unit controls the main fan according to the overall ambient temperature, and the auxiliary heat dissipation unit controls the auxiliary fan according to the local temperature, ensuring that the temperature is balanced everywhere, extending the life of the components and reducing the failure rate. In addition, the device also uses the CIR human-computer interaction interface, and the user can manually control the fan, or set the automatic mode, and intelligently adjust the fan according to the temperature change, thereby saving energy consumption. The device adopts a modular structure in the design, so that the main heat dissipation unit and the auxiliary heat dissipation unit can be expanded and replaced as needed, which improves the flexibility and maintainability of the system. At the same time, the high sensitivity of the temperature sensor and the rapid response capability of the MCU make the heat dissipation control more accurate and further improve the heat dissipation efficiency. In summary, the present invention has the advantages of improving heat dissipation efficiency, extending the life of the equipment, and reducing energy consumption, which is of great significance to improving the stability and reliability of railway locomotive communication equipment. In addition, the design idea of ​​the device can also be promoted and applied to other electronic equipment fields that require efficient heat dissipation, and has a wide range of application prospects. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a structural block diagram of the CIR heat dissipation device of the present invention;

[0012] Figure 2 It is a circuit connection block diagram of the main heat dissipation unit of the present invention;

[0013] Figure 3 It is a circuit connection block diagram of the auxiliary heat dissipation unit of the present invention;

[0014] Figure 4 The soft start circuit, fan filter circuit and fan unit circuit diagram of the present invention;

[0015] Figure 5 This is a structural block diagram of embodiment 1 of the present invention. DETAILED DESCRIPTION

[0016] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0017] like Figure 1-2 As shown, a CIR heat dissipation device includes a main heat dissipation unit and several auxiliary heat dissipation units, wherein the main heat dissipation unit includes a main heat dissipation unit interface, a main heat dissipation fan unit, a power supply unit, an MCU, a main temperature sensor and several auxiliary heat dissipation extension interfaces; the main heat dissipation unit is connected to the fan socket of the CIR motherboard unit through the main heat dissipation unit interface, which is used to provide 13.8V power input to the main heat dissipation unit and to transmit data with the main control unit of the CIR, the main heat dissipation unit interface is respectively unidirectionally connected to the main heat dissipation fan unit, the power supply unit and the auxiliary heat dissipation extension interface, which is used to provide DC13.8V power supply, the power supply unit is respectively unidirectionally connected to the MCU, the main temperature sensor and the auxiliary heat dissipation extension interface, which is used to transform the DC13.8V voltage input from the main heat dissipation unit interface to provide DC3.3V power supply; the MCU is respectively bidirectionally connected to the main heat dissipation fan unit, the main heat dissipation unit interface, the main temperature sensor and the auxiliary heat dissipation extension interface for transmitting data;

[0018] The auxiliary cooling unit includes an auxiliary cooling unit interface, an auxiliary temperature sensor and an auxiliary cooling fan unit, wherein the auxiliary cooling unit interface is unidirectionally connected to the auxiliary temperature sensor and the auxiliary cooling fan unit for power supply, and bidirectionally connected to the auxiliary cooling fan unit and the auxiliary temperature sensor for data transmission. The auxiliary cooling extension interface of the main cooling unit is connected to the auxiliary cooling unit interface of the auxiliary cooling unit to provide power for the auxiliary cooling unit and provide a path for data transmission between the main cooling unit and the auxiliary cooling unit. Each auxiliary cooling extension interface corresponds to an auxiliary cooling unit interface.

[0019] The MCU model of the main cooling unit is STM32F103RCT6, the power supply unit mainly includes a power supply chip of model LM22670, and the main temperature sensor and the auxiliary temperature sensor are model LM75BIM.

[0020] Taking the expansion of a single auxiliary cooling unit as an example, the circuit connection of the main cooling unit is as follows: the main cooling unit is installed in the CIR through the main cooling unit interface, so that the input DC13.8V power supply is output to the main cooling fan unit, the power supply unit and the auxiliary cooling extension interface respectively. The UART serial port of the MCU is connected to the RS485 serial port of the main cooling unit interface through the RS485 transceiver chip for data transmission. The power supply unit transforms the input DC13.8V power supply and provides DC3.3V power input for the MCU, the main temperature sensor and the auxiliary cooling extension interface respectively. A group of GPIO interfaces of the MCU, GPIO_PA15 and GPIO_PC1 pins are bidirectionally connected to the main cooling fan unit, and another group of GPIO interfaces, GPIO_PA6 and GPIO_PA7 pins are bidirectionally connected to the auxiliary cooling extension interface. The IIC bus interface of the MCU is bidirectionally connected to the main temperature sensor and the IIC bus interface of the auxiliary cooling extension interface respectively; the main cooling fan unit includes a soft start circuit, a fan filter circuit and a fan unit.

[0021] like Figure 3 As shown, taking a single auxiliary cooling unit as an example, the circuit connection of the auxiliary cooling unit is as follows: the 13.8V input end of the auxiliary cooling unit interface is unidirectionally connected to the auxiliary cooling fan unit to power the auxiliary cooling fan unit, the GPIO interface of the auxiliary cooling unit interface is bidirectionally connected to the auxiliary cooling fan unit, and provides a connection path between the auxiliary cooling fan unit and the GPIO_PA6 and GPIO_PA7 pins of the main cooling unit MCU, the 3.3V input of the auxiliary cooling unit interface is unidirectionally connected to the auxiliary temperature sensor to power the auxiliary temperature sensor, the IIC bus interface of the auxiliary cooling unit interface is bidirectionally connected to the auxiliary temperature sensor, and provides a bidirectional connection path between the IIC bus interface of the auxiliary temperature sensor and the IIC bus interface of the main cooling unit MCU, the auxiliary cooling fan unit includes the same soft start circuit, fan filter circuit and fan unit as the main cooling fan unit, the difference is that different fans are selected, the main cooling unit uses a large fan, and the auxiliary cooling unit uses a smaller fan.

[0022] It should be noted that when the MCU controls and detects the cooling fan unit, two GPIO pins need to be allocated, one as a trigger pin for enabling the soft start chip, which is turned on by a high level and turned off by a low level, and is used to start the fan, and the other is a pin for detecting the fan speed. In this embodiment, the GPIO_PA15 and GPIO_PC1 pins are connected to the main cooling fan unit, the GPIO_PA15 pin is used to trigger the enable end of the soft start chip of the main cooling fan unit, and the GPIO_PC1 pin is used to detect the fan speed of the main cooling fan unit. The GPIO_PA6 and GPIO_PA7 pins are connected to the auxiliary cooling fan unit, the GPIO_PA6 pin is used to trigger the enable end of the soft start chip of the auxiliary cooling fan unit, and the GPIO_PA7 pin is used to detect the fan speed of the auxiliary cooling fan unit. It is controlled by the program, and multiple groups of GPIO interfaces can be set to connect the main cooling fan unit and multiple auxiliary cooling fan units to achieve partition detection and control.

[0023] like Figure 4 As shown, taking the main cooling fan unit as an example, the specific circuit connection of the main cooling fan unit is as follows: the soft start circuit includes a soft start chip N2 of model TPS22810, a resistor R2 and a capacitor C7, the 1st pin of the soft start chip N2 is connected to a 13.8V power supply, the 2nd pin is grounded, and the 3rd pin is connected to the GPIO_PA15 pin of the main cooling unit MCU. In this embodiment, the GPIO_PA15 pin is used as a trigger pin for enabling the soft start chip. When the level is high, the 6th pin of N2 outputs a 13.8V power supply, and when the level is low, the 6th pin of N2 shuts off the 13.8V power output, which is all controlled by the program; the 4th pin of the soft start chip N2 is grounded through the capacitor C7, which is used to set the soft start time to ensure that the output voltage rises steadily, and the function setting of each port of the MCU can be completed by programming; the 5th pin of the soft start chip N2 is connected to one end of the resistor R2, and the other end of the resistor R2 is connected to the 6th pin of the soft start chip N2, and is connected to the fan filter circuit at the same time.

[0024] The soft start chip TPS22810 has the function of configurable rise time. It only needs to configure a capacitor C7 between the 4th pin of the soft start chip N2 and the ground. By configuring the voltage rise time through capacitor C7, the surge current generated by the charging of the large-capacity load capacitor can be greatly reduced, thereby reducing or eliminating the power supply voltage drop; when the 13.8V power supply passes through the soft start chip N2, the 6th pin output voltage of the soft start chip N2 rises from 0V to 13.8V from low to high. The rise time of the output voltage is configured by the capacitor C7 between the 4th pin of the soft start chip N2 and the ground. The value of the capacitor C7 in this circuit is 10nF. According to the TPS22810 chip manual, the rise time is 2368us. The rise time refers to the time required for the output voltage to rise monotonically from 10% to 90% of the target value 13.8V.

[0025] The fan filter circuit includes a resistor R3, a resistor R4, a capacitor C4, a capacitor C5, a capacitor C6 and a diode VD3. One end of the resistor R3 is connected to the 6th pin of the soft start chip N2 of the soft start circuit, and the other end of the resistor R3 is connected to the positive electrode of the capacitor C4 and one end of the resistor R4; the negative electrode of the capacitor C4 is grounded; the other end of the resistor R4 is connected to the negative electrode of the diode VD3, the positive electrode of the capacitor C5, one end of the capacitor C6 and the positive electrode V_FAN of the fan unit fan; the positive electrode of the diode VD3 is grounded; the negative electrode of the capacitor C5 and the other end of the capacitor C6 are grounded. According to actual conditions, the ripple generated when the fan is rotated is tested to calculate the range of RC filtering, which can effectively reduce the crosstalk of the unwanted harmonics generated by the fan rotation on the equipment to the 13.8V input power supply and improve the power supply stability of the equipment.

[0026] The fan unit includes a fan interface XS3 and a fan. XS3 is a socket for connecting to the fan. Pin 1 of XS3 is connected to the positive terminal of the fan and the positive terminal of the fan filter circuit capacitor C5, pin 2 is connected to the GPIO_PC1 pin of the main cooling unit MCU to detect the fan speed, and pin 3 is grounded. In this embodiment, the GPIO_PC1 pin of the MCU is used as a port for detecting the fan speed through programming.

[0027] Example 1: Figure 5 As shown, the main cooling unit and the auxiliary cooling unit of the CIR cooling device are respectively installed in the CIR, wherein the main cooling unit is installed at the CIR fan unit, and each auxiliary cooling unit is respectively installed at a heat generating position in the CIR chassis. Use a flat cable to connect the corresponding auxiliary cooling extension interface with the auxiliary cooling unit interface, thereby connecting the main cooling unit with each auxiliary cooling unit. The UART serial port of the main cooling unit MCU is connected to the RS485 serial port of the main cooling unit interface through the RS485 transceiver chip to realize data transmission with the CIR main control unit. The MMI human-computer interaction interface is connected to the switching unit of the CIR through the MMI control cable, and the switching unit of the CIR is connected to the main control unit of the CIR for communication.

[0028] The control program code is written in advance and written into the MCU, especially the corresponding ports of the main cooling unit and the auxiliary cooling unit corresponding to each GPIO, as well as the communication query address between the IIC bus interface and each temperature sensor. The start, stop, speed and temperature monitoring of the fans of the main cooling unit and each auxiliary cooling unit and their installation positions are controlled and collected by the MCU of the main cooling unit. Through the MMI human-computer interaction interface, the speed and detected temperature of the fans of the main cooling unit and each auxiliary cooling unit can be viewed, and all fans can be turned on or off manually, or the automatic mode can be set.

[0029] In automatic mode, you can set a temperature threshold. When the temperature exceeds the threshold, the fan will automatically start. When the temperature is lower than the hysteresis temperature of the threshold, the fan will automatically stop. In automatic mode, each cooling unit is controlled individually according to temperature changes, thus saving energy.

[0030] The present invention has a temperature hysteresis function, which can avoid frequent starting and stopping of the fan when the internal temperature of the CIR chassis fluctuates above and below the temperature threshold, thereby reducing the wear of the fan and extending its service life. In this embodiment, a temperature threshold of 50°C and a temperature hysteresis of 5°C are used as an example. The temperature hysteresis function is reflected in that when the temperature of a certain area inside the CIR chassis exceeds 50°C, the fan of the heat dissipation unit in the area is started to dissipate heat. As the fan runs, the internal temperature of the CIR chassis drops. When the temperature is lower than 50°C, the fan does not stop immediately, but continues to run until the temperature sensor detects that the temperature of the area is lower than 45°C.

[0031] The implementation method of CIR heat dissipation equipment, the working steps are as follows:

[0032] Step 1. CIR cooling device function detection and initial setting: Power on the CIR to initialize and detect whether the cooling device functions normally. After the CIR cooling device is initialized, all fans in the CIR cooling device start for a few seconds and then stop. In this embodiment, it is 5 seconds. This process is used to detect whether the cooling device and fan functions are normal during production and startup. The start and stop of the fans of the main cooling unit and each auxiliary cooling unit are controlled by the MCU of the main cooling unit. The fan speed of the main cooling unit and each auxiliary cooling fan unit and the temperature data of the temperature sensor are collected by the MCU of the main cooling unit. The MMI human-machine exchange interface The page can be used to view the speed and detected temperature of the fans of the main cooling unit and each auxiliary cooling unit, and to set the manual mode and the automatic mode; in the manual mode, all fans can be turned on or off manually through the MMI human-machine exchange interface; in the automatic mode, the temperature threshold and temperature hysteresis can be set. In this embodiment, the temperature threshold is set to 50°C and the temperature hysteresis is set to 5°C; so that the fan is automatically started when the temperature of each area inside the CIR device exceeds the threshold, and the fan is automatically stopped when the temperature is lower than the hysteresis temperature of the threshold; in the automatic mode, the fans in each cooling unit are individually controlled by the MCU according to the temperature change.

[0033] Step 2. Temperature collection and fan control: The temperature sensors on the main cooling unit and each auxiliary cooling unit collect the ambient temperature; the main cooling unit MCU cyclically queries the temperature of the main temperature sensor and each auxiliary temperature sensor through the IIC bus, and compares it with the set threshold; when the temperature collected by the temperature sensor of a certain auxiliary cooling unit exceeds 50°C, the MCU of the main cooling unit will control the fan of the auxiliary cooling unit to start, and dissipate the heat at the location where the auxiliary cooling unit is installed in the CIR in time; the rotation of the fan drives the air flow inside the CIR, so that the air temperature of each space inside the CIR tends to be consistent; when the main cooling fan temperature sensor detects that the temperature at the main cooling unit location inside the CIR chassis is higher than 50°C, the main cooling fan is started to exhaust and cool down.

[0034] Step 3. Temperature monitoring and fan stop: After the fan of the main cooling fan unit or a certain auxiliary cooling fan unit is started, the MCU continuously queries the temperature data of the temperature sensors of the main cooling unit and each auxiliary cooling unit inside the CIR; when it is detected that the regional temperature of a cooling unit drops to 45°C, the MCU automatically controls the fan of the cooling fan unit to stop rotating. The above steps are continuously performed to realize the partition temperature detection and temperature reduction control inside the CIR device.

Claims

1. A CIR heat dissipation device, characterized in that: It includes a main cooling unit and multiple auxiliary cooling units, wherein the main cooling unit includes a main cooling unit interface, a main cooling fan unit, a power supply unit, an MCU, a main temperature sensor and multiple auxiliary cooling extension interfaces, the main cooling unit is connected to the CIR motherboard unit fan socket through the main cooling unit interface, the main cooling unit interface is respectively unidirectionally connected to the main cooling fan unit, the power supply unit and multiple auxiliary cooling extension interfaces, the power supply unit is respectively unidirectionally connected to the MCU, the main temperature sensor and multiple auxiliary cooling extension interfaces, the MCU is respectively bidirectionally connected to the main cooling unit interface, the main cooling fan unit, the main temperature sensor and multiple auxiliary cooling extension interfaces, the auxiliary cooling unit includes an auxiliary cooling unit interface, an auxiliary temperature sensor and an auxiliary cooling fan unit, the auxiliary cooling unit interface is respectively connected to the auxiliary cooling fan unit and the auxiliary temperature sensor, the multiple auxiliary cooling extension interfaces of the main cooling unit are connected to the auxiliary cooling unit interfaces of multiple auxiliary cooling units, and each auxiliary cooling extension interface corresponds to an auxiliary cooling unit interface; The circuit connection of the main heat dissipation unit is as follows: the main heat dissipation unit is installed in the CIR through the main heat dissipation unit interface, and is used to output the DC13.8V power input by the CIR to the main heat dissipation fan unit, the power supply unit and the auxiliary heat dissipation extension interface respectively. The UART serial port of the MCU is connected to the RS485 serial port of the main heat dissipation unit interface through the RS485 transceiver chip for data transmission. The power supply unit provides a DC3.3V power input for the MCU, the main temperature sensor and the auxiliary heat dissipation extension interface after the input DC13.8V power is transformed. A group of GPIO interfaces of the MCU is bidirectionally connected to the main heat dissipation fan unit, and multiple groups of GPIO interfaces are bidirectionally connected to multiple auxiliary heat dissipation extension interfaces. The IIC bus interface of the MCU is bidirectionally connected to the main temperature sensor and multiple auxiliary heat dissipation extension interfaces respectively. The main heat dissipation fan unit includes a soft start circuit, a fan filter circuit and a fan unit; The circuit connection of the auxiliary cooling unit is as follows: the 13.8V input end of the auxiliary cooling unit interface is unidirectionally connected to the auxiliary cooling fan unit to power the auxiliary cooling fan unit; the GPIO interface of the auxiliary cooling unit interface is bidirectionally connected to the auxiliary cooling fan unit; the 3.3V input end of the auxiliary cooling unit interface is unidirectionally connected to the auxiliary temperature sensor to power the auxiliary temperature sensor; the IIC bus interface of the auxiliary cooling unit interface is bidirectionally connected to the auxiliary temperature sensor to provide a bidirectional connection path between the IIC bus interface of the auxiliary temperature sensor and the IIC bus interface of the main cooling unit MCU; the auxiliary cooling fan unit includes a soft start circuit, a fan filter circuit and a fan unit; The circuit connection of the soft start circuit, fan filter circuit and fan unit of the main cooling fan unit is as follows: the soft start circuit includes a soft start chip N2 of model TPS22810, a resistor R2 and a capacitor C7, and the 4th pin of the soft start chip N2 is grounded through the capacitor C7; the 1st pin of the soft start chip N2 is connected to the 13.8V power supply, the 2nd pin is grounded, and the 3rd pin is connected to the GPIO_PA15 pin of the main cooling unit MCU; for the start signal, the 5th pin of the soft start chip N2 is connected to one end of the resistor R2, and the other end of the resistor R2 is connected to the 6th pin of the soft start chip N2, and is connected to the fan filter circuit at the same time; The fan filter circuit includes a resistor R3, a resistor R4, a capacitor C4, a capacitor C5, a capacitor C6 and a diode VD3, one end of the resistor R3 is connected to the 6th pin of the soft start chip N2 of the soft start circuit, the other end of the resistor R3 is connected to the positive electrode of the capacitor C4 and one end of the resistor R4; the negative electrode of the capacitor C4 is grounded; the other end of the resistor R4 is connected to the negative electrode of the diode VD3, the positive electrode of the capacitor C5, one end of the capacitor C6 and the positive electrode V_FAN of the fan unit fan; the positive electrode of the diode VD3 is grounded; the negative electrode of the capacitor C5 and the other end of the capacitor C6 are grounded; The fan unit includes a fan interface XS3 and a fan, XS3 is a socket for connecting to the fan, pin 1 of the fan interface XS3 is connected to the positive terminal V_FAN of the fan and the positive terminal of the fan filter circuit capacitor C5, pin 2 is connected to the GPIO_PC1 pin of the main cooling unit MCU for detecting the fan speed, and pin 3 is grounded; The main cooling unit and the auxiliary cooling unit are respectively installed in the CIR, wherein the main cooling unit is installed at the CIR fan unit, and each auxiliary cooling unit is respectively installed at a heat generating position in the CIR chassis, the auxiliary cooling extension interface is connected to the auxiliary cooling unit interface, the UART serial port of the main cooling unit MCU is connected to the RS485 serial port of the main cooling unit interface, the MMI human-computer interaction interface is connected to the switching unit of the CIR, and the switching unit of the CIR is connected to the main control unit of the CIR.

2. A method for implementing a CIR heat dissipation device, based on the CIR heat dissipation device according to claim 1, characterized in that: The working steps are as follows: Step 1. CIR cooling device function detection and initial settings: Power on the CIR for initialization. After the CIR cooling device is initialized, all fans start and stop after a few seconds. The start and stop of the main cooling unit and each auxiliary cooling unit fan are controlled by the MCU of the main cooling unit. The fan speed of the main cooling unit and each auxiliary cooling unit and the temperature data of the temperature sensor are collected by the MCU of the main cooling unit. The speed of the main cooling unit and each auxiliary cooling unit fan and the detected temperature can be viewed through the MMI human-computer interaction interface. In manual mode, all fans can be manually turned on or off through the MMI human-computer interaction interface; in automatic mode, the temperature threshold and temperature hysteresis are set by the program to automatically start the fan when the temperature exceeds the threshold, and automatically stop the fan when the temperature is lower than the hysteresis temperature of the threshold; Step 2. Temperature collection and fan control: The temperature sensors on the main cooling unit and each auxiliary cooling unit collect the ambient temperature. The MCU of the main cooling unit cyclically queries the temperature of the main temperature sensor and each auxiliary temperature sensor through the IIC bus, and compares it with the set threshold. When the temperature collected by the temperature sensor of a certain auxiliary cooling unit exceeds the threshold, the MCU of the main cooling unit controls the fan of the auxiliary cooling unit to start, and dissipate the heat at the location where the auxiliary cooling unit is installed in the CIR in time. When the temperature sensor of the main cooling unit detects that the temperature of the main cooling unit position inside the CIR chassis is higher than the set temperature threshold, the fan of the main cooling fan unit is started to exhaust and cool down; Step 3. Temperature monitoring and fan stop: After the fan of the main cooling fan unit or the fan of a sub-cooling fan unit is started, the MCU continuously queries the temperature data of the temperature sensors of the main cooling unit and each sub-cooling unit of the CIR cooling device. When the temperature is detected to be lower than the hysteresis temperature of the set threshold, the MCU automatically controls each fan to stop rotating.

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