Housing assembly method, housing and electronic equipment

Abstract

The present application provides a shell assembly method, a shell and an electronic device. The shell assembly method includes: providing a first shell and UV moisture dual-curing glue, arranging the UV moisture dual-curing glue on the first shell to form a UV moisture dual-curing glue layer; UV-curing the UV moisture dual-curing glue layer; providing a second shell, arranging the second shell on the side of the UV moisture dual-curing glue layer away from the first shell; moisture-curing the UV moisture dual-curing glue layer to form a glue layer, the glue layer is bonded between the first shell and the second shell, the shear strength between the glue layer and the first shell is ≥4MPa, and the shear strength between the glue layer and the second shell is ≥4MPa. The shells in the shell assembled by the assembly method are not easy to separate.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a shell assembly method, a shell and an electronic device. Background Art

[0002] When assembling the shell parts of current electronic devices, foam pressure-sensitive adhesive is usually used to bond the shells in the shell parts. However, the bonding strength of the foam pressure-sensitive adhesive is relatively weak, resulting in poor connection reliability between the shells and the shells are easily separated. Summary of the invention

[0003] The purpose of the embodiments of the present application is to provide a shell component assembly method, a shell component and an electronic device, wherein the shell components assembled by the assembly method are not easily separated from each other.

[0004] The present application provides a method for assembling a housing member, including:

[0005] Providing a first shell and UV moisture dual-curing glue, and arranging the UV moisture dual-curing glue on the first shell to form a UV moisture dual-curing glue layer;

[0006] UV light curing of the UV moisture dual curing glue layer;

[0007] Providing a second shell, and arranging the second shell on a side of the UV moisture dual-curing glue layer facing away from the first shell;

[0008] The UV moisture dual-curing glue layer is moisture-cured to form a glue layer, and the glue layer is bonded between the first shell and the second shell. The shear strength between the glue layer and the first shell is ≥4MPa, and the shear strength between the glue layer and the second shell is ≥4MPa.

[0009] An embodiment of the present application provides an assembly method for shell parts, using UV moisture dual-curing glue to bond a first shell and a second shell. The UV moisture dual-curing glue has a certain initial bonding strength after ultraviolet light curing, and can quickly bond the first shell and the second shell. The shear strength between the glue layer formed after moisture curing and the first shell and the second shell can reach more than 4 MPa. The bonding strength of the glue layer is significantly better than the existing foam pressure-sensitive adhesive, and the protection level can be greatly improved, reducing the risk of separation of the first shell and the second shell in falling and impact scenarios for users.

[0010] In a possible implementation, after the step of arranging the second shell on the side of the UV moisture dual-curing glue layer away from the first shell, and before the step of moisture-curing the UV moisture dual-curing glue layer, the method further includes: performing a pressure-maintaining treatment on the first shell and the second shell. By performing a pressure-maintaining treatment on the first shell and the second shell, on the one hand, it is possible to ensure that the first shell and the second shell are firmly bonded, and on the other hand, it is possible to shorten the overall assembly time of the shell parts while ensuring the bonding strength between the first shell and the second shell, thereby improving the assembly efficiency of the shell parts.

[0011] In a possible implementation manner, the pressure holding treatment time is 15s to 120s.

[0012] In a possible implementation, ultraviolet light of 365 nm to 400 nm is used to irradiate the UV-moisture dual-curing glue layer for 5 s to 30 s to perform ultraviolet light curing.

[0013] In a possible implementation, the UV-moisture dual-curing glue layer is left to stand for moisture curing.

[0014] In a possible implementation, in the step of moisture curing the UV moisture dual-curing glue layer, the UV moisture dual-curing glue layer is moisture cured for 5 minutes to form a first transition layer, and the UV moisture dual-curing glue layer is moisture cured for 24 hours to form a second transition layer;

[0015] The shear strength between the first transition layer and the first shell or the second shell is the first shear strength P1, and the first shear strength P1 ≥ 1MPa, which is conducive to rapid bonding of the first shell and the second shell. The shear strength between the second transition layer and the first shell or the second shell is the second shear strength P2, and the second shear strength P2 ≥ 4MPa, so that the UV moisture dual-curing glue can reach a high bonding strength within 24 hours, and the bonding efficiency is high.

[0016] An embodiment of the present application provides a shell component, including a first shell, a second shell and a glue layer, the glue layer is bonded between the first shell and the second shell, the glue layer is made by curing UV moisture dual-curing glue, the shear strength between the glue layer and the first shell is ≥4MPa, and the shear strength between the glue layer and the second shell is ≥4MPa.

[0017] In the shell member provided in the embodiment of the present application, the shear strength between the glue layer and the first shell and the second shell can reach more than 4MPa, and the bonding strength of the glue layer is significantly better than the existing foam pressure-sensitive adhesive, and the protection level can be greatly improved, reducing the risk of separation of the first shell and the second shell in the case of falling and impact. In addition, compared with the solution of using foam pressure-sensitive adhesive for bonding, the cohesion of UV moisture dual-curing glue is better and easy to peel off, so it is easier to clean without residue, which can improve the repair yield of the shell member.

[0018] In a possible implementation, the first shell is a middle frame, the second shell is a back cover, the back cover includes a substrate and an ink layer disposed on the substrate, and the glue layer is bonded between the middle frame and the ink layer.

[0019] In a possible implementation manner, the glue layer is bonded between the edge of the middle frame and the edge of the ink layer.

[0020] In a possible implementation manner, the width of the glue layer is less than 0.8 mm.

[0021] In a possible implementation, the modulus of the glue layer is ≤60MPa. The modulus of the glue layer is not too large. On the one hand, it avoids the film printing problem caused by unevenness on the back cover due to the excessive modulus of the glue layer. On the other hand, it can also avoid the problem of ink layer falling off due to the excessive modulus of the glue layer.

[0022] In a possible implementation, when the glue layer fails to bond the shell under a 200g impact force, the shell can withstand ≥50 impacts. By bonding the first shell and the second shell with the glue layer, the shell has good impact resistance and can avoid the problem of debonding of the shell in a falling scenario.

[0023] In a possible implementation, the time for the first shell to separate from the second shell under a separation force of 1 kg is ≥ 120 hours. The first shell and the second shell are bonded together using a glue layer, and the shell has good creep resistance, which can prevent the shell 100 from lifting, dislocating, emptying, and debonding in a high temperature and high humidity environment.

[0024] In a possible implementation, after the shell is soaked in grease, the shear strength between the glue layer and the first shell is ≥2MPa, and the shear strength between the glue layer and the second shell is ≥2MPa. By bonding the first shell and the second shell with the glue layer, the shell has good grease resistance, which can prevent the shell from debonding in a long-term grease environment.

[0025] In a possible implementation, the UV moisture dual-curing glue includes a UV moisture dual-curing resin, a UV moisture dual-curing monomer, a polyurethane prepolymer, a photoinitiator, a silane coupling agent, a moisture curing catalyst and an auxiliary agent.

[0026] An embodiment of the present application also provides an electronic device, including a shell member and a functional device, wherein the shell member is a shell member assembled according to the above-mentioned shell member assembly method, or the shell member is a shell member as described above, and the functional device is installed in the first shell member. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0028] Figure 1 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0029] Figure 2 for Figure 1 a schematic diagram of the exploded structure of the electronic device shown;

[0030] Figure 3 for Figure 1 A schematic diagram of the cross-sectional structure of part A of the electronic device shown;

[0031] Figure 4 A schematic diagram of the assembly process of the shell member provided in an embodiment of the present application. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0033] See also Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the structure of an electronic device 1 provided in an embodiment of the present application. Figure 2 for Figure 1 A schematic diagram of the exploded structure of the electronic device 1 is shown.

[0034] For the convenience of description, we define Figure 1The width direction of the electronic device 1 is the X-axis direction, the length direction is the Y-axis direction, and the thickness direction is the Z-axis direction. The X-axis direction, the Y-axis direction, and the Z-axis direction are perpendicular to each other. The terms "front" and "rear" and other directional terms mentioned in the description of the electronic device 1 in the embodiment of the present application are based on the attached specification. Figure 1 The description of the directions shown uses the positive direction of the Z axis as “front” and the negative direction of the Z axis as “back”, which does not constitute a limitation on the electronic device 1 in actual application scenarios.

[0035] The electronic device 1 may be a mobile phone, a tablet computer, a notebook computer, a wearable device, a personal computer (PC), a tablet personal computer, a laptop computer, a personal digital assistant (PDA), etc. Among them, the wearable device includes a watch, a smart bracelet, etc.

[0036] The electronic device 1 includes a shell member 100 and a functional device 300, and the functional device 300 is installed on the shell member 100. Among them, the shell member 100 includes a first shell and a second shell, and the second shell is installed on the first shell. In the embodiment of the present application, the electronic device 1 is illustrated by taking a straight-screen mobile phone as an example, the first shell is illustrated by taking the middle frame 10 of the electronic device 1 as an example, and the second shell is illustrated by taking the back cover 50 of the electronic device 1 as an example. It is understandable that in other embodiments, the electronic device 1 may also be a folding mobile phone, and the present application does not limit this. It is understandable that in other embodiments, the first shell and the second shell may also be shells of other parts of the electronic device 1, and the present application does not limit this.

[0037] Specifically, in the embodiment of the present application, the shell member 100 includes a middle frame 10 and a back cover 50, and the back cover 50 is installed on the middle frame 10. Among them, the middle frame 10 includes a middle plate 11 and a frame 13, and the frame 13 is arranged around the middle plate 11. In this embodiment, the middle plate 11 is roughly a rectangular plate-shaped structure. The material of the middle plate 11 can be a metal material or a plastic. In the embodiment of the present application, the metal material includes pure metal and metal alloy. Exemplarily, the metal material includes but is not limited to anodized aluminum, die-cast aluminum, aluminum alloy and other materials. Exemplarily, the plastic includes but is not limited to polycarbonate (PC), polybutylene terephthalate (PBT), acrylic (PMMA) and other materials.

[0038] It is understandable that in order to improve the performance of plastics, additives may also be added to the plastics. The additives include but are not limited to reinforcing agents. For example, the reinforcing agent may be glass fiber (GF) or carbon fiber (CF). For example, the plastic may be polycarbonate with added glass fiber (labeled as PC+GF) or polybutylene terephthalate with added glass fiber (labeled as PBT+GF).

[0039] The material of the frame 13 may be the same as that of the middle plate 11, or may be different from that of the middle plate 11. Exemplarily, the material of the frame 13 may be polycarbonate (PC) or polybutylene terephthalate (PBT). In the present embodiment, the frame 13 is integrally formed with the middle plate 11. It is understandable that in other embodiments, the frame 13 may also be cast on the peripheral side of the middle plate 11 by injection molding, or may be connected to the peripheral side of the middle plate 11 by gluing, welding, etc., so as to realize that the frame 13 is arranged around the middle plate 11. The embodiment of the present application does not limit the connection method between the frame 13 and the middle plate 11.

[0040] The middle frame 10 is provided with a mounting groove 15 and a receiving groove 17. The mounting groove 15 and the receiving groove 17 are provided on the same side of the middle plate 11 along the thickness direction and are spaced apart from each other. In this embodiment, the opening of the mounting groove 15 and the opening of the receiving groove 17 are both provided on the surface of the middle plate 11 along the negative direction of the Z axis. There are two mounting grooves 15, which are located on both sides of the receiving groove 17 along the X axis direction and are spaced apart from the receiving groove 17.

[0041] The back cover 50 may also be referred to as a battery cover, a back cover, etc. The back cover 50 is mounted on one side of the middle plate 11 along the thickness direction, so that the back cover 50 is mounted on the middle frame 10. In this embodiment, the back cover 50 is mounted on one side of the middle plate 11 along the negative direction of the Z axis. The back cover 50 covers the opening of the receiving groove 17 and the opening of the mounting groove 15, so as to cover and protect the contents in the receiving groove 17 and the mounting groove 15.

[0042] The functional device 300 includes a display screen 310, a circuit board 330 and a battery 350. The display screen 310 is mounted on the side of the middle frame 10 away from the back cover 50. Specifically, the display screen 310 includes a display panel and a cover plate, the display panel is mounted on the side of the middle plate 11 away from the back cover 50, and the cover plate is mounted on the side of the display panel away from the middle plate 11. Exemplarily, the display panel may be an organic light-emitting diode (OLED) panel or a liquid crystal panel (LCD). The cover plate may be fixed to the middle plate 11 or the frame 13 in the middle frame 10 to realize the installation of the display screen 310 on the middle frame 10. Exemplarily, the cover plate may be a glass cover plate.

[0043] The circuit board 330 is installed in the installation slot 15 of the middle frame 10 to realize the installation of the circuit board 330 in the middle frame 10. In this embodiment, the circuit board 330 includes a main circuit board 331 and a sub-circuit board 333. The main circuit board 331 and the sub-circuit board 333 are respectively installed in two installation slots 15. Among them, the main circuit board 331 can be used to integrate a control chip. Exemplarily, the control chip can be an application processor (AP), a double data rate synchronous dynamic random access memory (DDR), and a universal flash storage (UFS). The sub-circuit board 333 can be used to integrate electronic devices such as antenna RF front end, universal serial bus (USB) devices, and vibrators. In this embodiment, the sub-circuit board 333 is electrically connected to the main circuit board 331 to realize signal transmission between the sub-circuit board 333 and the main circuit board 331. It can be understood that in other embodiments, the circuit board 330 may also include only the main circuit board 331, but not the sub-circuit board 333.

[0044] The battery 350 is installed in the receiving groove 17 of the middle frame 10, so that the battery 350 is installed in the middle frame 10. The battery 350 is used to supply power to components such as the display screen 310 and the circuit board 330.

[0045] Combined with reference Figure 3 , Figure 3 for Figure 1 The cross-sectional structure diagram of the A part of the electronic device 1 is shown. Figure 3 The circuit board 330 and the battery 350 are not shown.

[0046] The back cover 50 includes a substrate 51 and an ink layer 53 provided on the substrate 51. The substrate 51 is installed on the middle plate 11 of the middle frame 10 to achieve the installation of the back cover 50 on the middle frame 10. Exemplarily, the substrate 51 can be an acrylic (Polymethyl Methacrylate, PMMA) board, a polycarbonate (Polycarbonate, PC) board, a composite board formed by stacking an acrylic board and a polycarbonate board, glass, etc.

[0047] The ink layer 53 is disposed on the side of the substrate 51 facing the middle plate 11 of the middle frame 10. Usually, the substrate 51 is a transparent member, and the user can observe the devices inside the electronic device 1, such as the battery 350, through the substrate 51. By providing the ink layer 53 on the side of the substrate 51 facing the middle frame 10, the ink layer 53 can play a shielding role to enhance the appearance of the electronic device 1. In this embodiment, the ink layer 53 is disposed on the surface of the substrate 51 along the thickness direction and facing the middle plate 11. It can be understood that in other embodiments, the back cover 50 may also include other film layers, which are disposed on the surface of the substrate 51 away from the ink layer 53, or are disposed between the substrate 51 and the ink layer 53.

[0048] The ink layer 53 includes at least one layer. Exemplarily, the ink layer 53 can be one layer, two layers, three layers, etc., and the embodiment of the present application does not limit the number of layers of the ink layer 53. The material of the ink layer 53 includes a main resin. Exemplarily, the main resin includes but is not limited to a polyester resin. It is understandable that in order to improve the performance of the ink layer 53, an additive can also be added to the ink layer 53. Exemplarily, the additive can be a matte powder, and by adding matte powder to the ink layer 53, the printability and printing effect of the ink layer 53 can be improved. Among them, the matte powder includes but is not limited to precipitated silica, bentonite, etc. Exemplarily, the additive can also be a flame retardant to improve the flame retardant properties of the back cover 50.

[0049] In the embodiment of the present application, the housing 100 further includes a glue layer 70, which is bonded between the edge of the middle plate 11 of the middle frame 10 and the edge of the ink layer 53, so as to achieve the glue layer 70 being bonded between the edge of the middle frame 10 and the edge of the ink layer 53, thereby achieving a fixed connection between the middle frame 10 and the ink layer 53, and further achieving a fixed connection between the middle frame 10 and the back cover 50. The glue layer 70 is made by curing UV moisture dual-curing glue. Exemplarily, the width of the glue layer 70 is less than 0.8 mm.

[0050] In the embodiment of the present application, "UV moisture dual-curing glue" refers to a material that can be dual-cured by ultraviolet (UV) curing and moisture curing. Among them, the curing characteristics of the UV moisture dual-curing glue during UV light curing meet the following requirements: the curing time under ultraviolet light conditions of 365nm~400nm is less than 15s, and the curing depth of the UV moisture dual-curing glue layer formed by the UV moisture dual-curing glue is ≥0.4mm. The UV moisture dual-curing glue can be quickly photocured, which is beneficial for the rapid bonding of the middle plate 11 of the middle frame 10 and the ink layer 53 of the back cover 50, thereby facilitating the improvement of the assembly efficiency of the shell part 100, and the curing depth of the UV moisture dual-curing glue layer is deeper, and the polymerization degree of the UV moisture dual-curing glue is higher, which is beneficial for improving the bonding performance of the cured glue layer 70.

[0051] The curing characteristics of the UV moisture dual-curing glue during moisture curing meet the following conditions: moisture curing can be performed at room temperature of 23±2°C and humidity of 60±10%RH. Here, "RH" represents relative humidity. Since the UV moisture dual-curing glue can be cured by standing still at room temperature, the UV moisture dual-curing glue after UV light curing can be left standing to achieve UV moisture dual-curing glue curing to form a glue layer 70.

[0052] The UV moisture dual-curing glue is in liquid state, and the glue layer 70 formed after the UV moisture dual-curing glue is cured is in solid state. Among them, it can be judged whether the UV moisture dual-curing glue is cured to form the glue layer 70 by appearance observation and Fourier Transform Infrared (FTIR) spectroscopy. Specifically, on the one hand, it is judged by appearance whether the glue layer 70 is completely cured and has no obvious abnormalities, and on the other hand, the FTIR characterization satisfies the 24h curing rate of the UV moisture dual-curing glue to be above 90%, indicating that the glue layer 70 is completely cured.

[0053] For example, the viscosity of UV moisture dual-curing adhesive is between 10,000 cps and 500,000 cps. Seconds. In the embodiment of the present application, the viscosity is measured by using a rheometer, using a 25# rotor (the diameter of the rotor is 25mm), testing under a 0.5mm gap condition, and recording the viscosity at 10rpm. Among them, "rpm" means revolutions per minute. Compared with the method of using tape to bond between the middle frame 10 and the back cover 50, when assembling the electronic device 1, the embodiment of the present application can use liquid UV moisture dual-curing glue to fill between the middle plate 11 of the middle frame 10 and the ink layer 53 of the back cover 50. Since the liquid UV moisture dual-curing glue has fluidity, it can make up for the installation tolerance between the middle frame 10 and the back cover 50, thereby improving the assembly accuracy of the assembled electronic device 1.

[0054] In the embodiment of the present application, the thixotropic index Ti of the UV moisture dual-curing glue is ≥ 2. The thixotropic index Ti is determined by using a rheometer, a 25# rotor (the diameter of the rotor is 25 mm), testing under a gap of 0.5 mm, and recording the viscosity ratio at 1 rpm and 10 rpm. Since the thixotropic index Ti of the UV moisture dual-curing glue is relatively large, the UV moisture dual-curing glue is not easy to fall while maintaining fluidity, which helps the UV moisture dual-curing glue to form a good glue point shaping and prevent sagging and collapse, thereby helping to improve the gluing efficiency and molding effect of the UV moisture dual-curing glue, and further helping to improve the assembly efficiency and assembly effect of the electronic device 1.

[0055] Among them, the open time (Open time) of UV moisture dual-cure glue is ≥3min. "Open time" refers to the operational time from the application of UV moisture dual-cure glue to the start of curing. In this embodiment, the method for determining the open time is: use UV moisture dual-cure glue to bond the sample within the operational time, the UV moisture dual-cure glue is dry without skinning before UV irradiation, and perform a butt bonding strength test (refer to the determination process of butt bonding strength below), the shear strength decreases ≤30%, and the glue width changes after pressing ≤20%. In this embodiment, the open time of UV moisture dual-cure glue is relatively long, which can provide sufficient assembly time for assembling the electronic device 1.

[0056] The shear strength between the glue layer 70 and the middle frame 10 or the shear strength between the glue layer 70 and the back cover 50 is P. Among them, "shear strength" is a way of characterizing the bonding strength. In the embodiment of the present application, the shear strength between the glue layer 70 and the middle frame 10 is ≥4Mpa, and the shear strength between the glue layer 70 and the back cover 50 is ≥4Mpa. The shear strength of the glue layer 70 is significantly better than the existing foam pressure-sensitive adhesive, and the protection level can be greatly improved, reducing the risk of separation of the middle frame 10 and the back cover 50 in the case of falling and impact. In the embodiment of the present application, the shear strength P of the glue layer 70 is determined as follows: take a sample of the middle frame 10 and a sample of the back cover 50, apply UV moisture dual-curing glue between the sample of the middle frame 10 and the sample of the back cover 50, and the UV moisture dual-curing glue is bonded between the middle frame 10 and the back cover 50. The glue thickness of the material layer formed by the UV moisture dual-curing glue is 0.12mm~0.15mm, and after UV curing, the pressure is maintained for 15s under the condition of maintaining a pressure of 1kg. After maintaining the pressure, the glue width of the material layer formed by the UV moisture dual-curing glue is 1.0mm±0.2mm, and then it is left to stand for 24h. The material layer formed by the UV moisture dual-curing glue is moisture-cured to form a glue layer 70, and a sample of the shell part 100 is obtained. The shear strength of Lap-shear when pulled apart is tested using mechanical equipment under the environmental conditions of a temperature of 23±2℃ and a humidity of 60±10%RH. Among them, the test rate is 10mm / min.

[0057] In the embodiment of the present application, the tensile modulus of the glue layer 70 is ≤60MPa, and the modulus of the glue layer 70 is not too large. On the one hand, it avoids the problem of film printing caused by the unevenness of the back cover 50 due to the excessive modulus of the glue layer 70. On the other hand, it can also avoid the problem of the ink layer 53 falling off due to the excessive modulus of the glue layer 70. In the embodiment of the present application, the modulus is measured with reference to ASTM D638. Among them, the measurement standard includes: providing a dumbbell-shaped glue layer 70 with a thickness of 0.2~0.5mm, using mechanical equipment for testing, and the test rate is 300mm / min.

[0058] In the embodiment of the present application, the elongation at break of the glue layer 70 is ≥500%. The glue layer 70 has good ductility and tensile deformation ability, and can undergo large deformation without breaking when subjected to force, thereby providing protection for the electronic device 1 under stress conditions such as physical impact, which is beneficial to improving the durability of the electronic device 1. In the embodiment of the present application, the elongation at break is measured with reference to ASTM D638. Among them, the measurement standard is: provide a dumbbell-shaped glue layer 70 with a thickness of 0.2~0.5mm, use mechanical equipment for testing, and the test rate is 300mm / min.

[0059] The following is a case member 100 formed by assembling the glue layer 70, the middle frame 10 and the back cover 50, and the performance of the case member 100 is described in detail. In the following experiment involving the performance test of the case member 100, the case member 100 is prepared in the following manner: PC+GF-ink glass is used as a sample of the middle frame 10, aluminum alloy sheet-ink glass is used as a sample of the back cover 50, and the sample of the middle frame 10 and the sample of the back cover 50 are used as two butt joint samples, and UV moisture dual-curing glue is applied between the two butt joint samples, and the glue thickness of the material layer formed by the UV moisture dual-curing glue is 0.12~0.15mm, and after UV curing, the pressure is maintained for 15s under the condition of maintaining a pressure of 1kg, and the glue width of the material layer formed by the UV moisture dual-curing glue after maintaining the pressure is 1.0mm±0.2mm, and the sample of the case member 100 is obtained, and the sample of the case member 100 is left to stand and cure for more than 48h.

[0060] In the embodiment of the present application, when the glue layer 70 of the shell part 100 fails to bond under an impact force of 200g, the number of impact resistance of the shell part 100 is ≥50 times, so that the assembled electronic device 1 has good impact resistance and can prevent the electronic device 1 from debonding in a falling scene. Among them, "glue layer 70 bonding failure" means that the glue layer 70 is separated from the first shell or the second shell, or the glue layer 70 fails cohesively under the impact force. In the embodiment of the present application, the method for determining the number of impact resistance is: the sample size of the shell part 100 is 10 (pieces, pcs), and the DuPont drop ball impact test is performed on the shell part 100, wherein the hammer weight used in the DuPont drop ball impact test is 200g, and the number of impacts when the glue layer 70 in the shell part 100 fails to bond is recorded, and the average value is taken.

[0061] In the embodiment of the present application, in the static creep test, the time for the first shell and the second shell to separate under the action of a separation force of 1 kg for the shell 100 is ≥ 120 hours, that is, the average time for the shell 100 to fall off is ≥ 120 hours, and the glue layer 70 has good creep resistance, which avoids the problems of lifting, dislocation, empty position and debonding of the glue layer 70 in the electronic device 1 in a high temperature and high humidity environment. In the embodiment of the present application, the test process of the static creep test is as follows: the sample size of the shell 100 is 10 pieces (pcs), a 1 kg weight is mounted on one end of the shell 100, and then it is placed in a 55°C / 95%RH environmental chamber for aging, and the time for the weight to fall is recorded and the average value is taken.

[0062] In the embodiment of the present application, in the grease resistance test, after the shell part 100 is immersed in grease, the shear strength between the glue layer 70 in the shell part 100 and the middle frame 10 is ≥2MPa, and the shear strength between the glue layer 70 and the back cover 50 is ≥2MPa. The glue layer 70 has good grease resistance and can solve the problem that the electronic device 1 is easy to debond in a long-term grease environment. In the embodiment of the present application, the process of the grease resistance test is: after the shell part 100 is immersed in grease, it is placed in a 55℃ / 95%RH environmental box for 48 hours. Among them, the shear strength between the glue layer 70 and the middle frame 10, and the shear strength between the glue layer 70 and the back cover 50 can refer to the measurement process of the shear strength P in the previous text.

[0063] See also Figure 4 , Figure 4 A schematic diagram of the assembly process of the housing member 100 provided in an embodiment of the present application.

[0064] The embodiment of the present application also provides an assembly method of the housing 100, including:

[0065] Step S1 : providing a first shell and UV moisture dual-curing glue, and placing the UV moisture dual-curing glue on the first shell to form a UV moisture dual-curing glue layer 103 .

[0066] In this embodiment, the first shell is illustrated by taking the middle frame 10 as an example. Among them, the first shell includes a first bonding area 101, and the first bonding area 101 is a partial surface of the middle plate 11 of the middle frame 10. In this embodiment, the first bonding area 101 is located at the edge of the middle frame 10 and is roughly annular. It can be understood that in other embodiments, the first bonding area 101 can also be a strip area arranged at multiple intervals, and the present application does not limit this. In this embodiment, a dispensing machine is used to dispensing UV moisture dual-curing glue in the first bonding area 101. In other embodiments, UV moisture dual-curing glue can also be set in the first bonding area 101 by spraying at below 60°C.

[0067] Step S2, ultraviolet light curing the UV moisture dual curing glue layer 103.

[0068] In this embodiment, ultraviolet light of 365nm to 400nm is used to irradiate the UV moisture dual-curing glue layer 103, and the ultraviolet light irradiation time is 5s to 30s, so as to achieve ultraviolet light curing of the UV moisture dual-curing glue layer 103. When the UV moisture dual-curing glue layer 103 is irradiated with ultraviolet light, the UV moisture dual-curing glue in the UV moisture dual-curing glue layer 103 can be activated, so that the UV moisture dual-curing glue is pre-cured, so that the UV moisture dual-curing glue has a certain initial bonding strength, which is conducive to quickly bonding the first shell and the second shell.

[0069] Step S3, providing a second shell, and arranging the second shell on a side of the UV moisture dual-curing glue layer 103 away from the first shell.

[0070] In this embodiment, the second housing is described by taking the rear cover 50 as an example. The second housing includes a second bonding area, which is a portion of the surface of the ink layer 53 in the rear cover 50 away from the substrate 51. In this embodiment, the second bonding area is located at the edge of the ink layer 53 in the rear cover 50.

[0071] Step S4, moisture-curing the UV moisture dual-curing glue layer 103 to form a glue layer 70, the glue layer 70 is bonded between the first shell and the second shell, the shear strength between the glue layer 70 and the first shell is ≥4MPa, and the shear strength between the glue layer 70 and the second shell is ≥4MPa.

[0072] In this embodiment, the UV moisture dual curing glue layer 103 can be left standing to achieve moisture curing of the UV moisture dual curing glue layer 103 to form a glue layer 70. During the standing process of the UV moisture dual curing glue layer 103, on the one hand, the UV moisture dual curing glue activated by ultraviolet light continues to cure, and on the other hand, the UV moisture dual curing glue can also be moisture cured to achieve curing to form the glue layer 70. In this embodiment, the middle frame 10, the glue layer 70 and the back cover 50 are assembled to form the housing 100.

[0073] In this embodiment, the UV moisture dual-curing glue layer 103 forms a first transition layer when it is moisture-cured for 5 minutes, and forms a second transition layer when it is moisture-cured for 24 hours. Among them, the shear strength between the first transition layer and the first shell or the second shell is the first shear strength P1, and the first shear strength P1 ≥ 1MPa, and the shear strength between the second transition layer and the first shell or the second shell is the second shear strength P2, and the second shear strength P2 ≥ 4MPa. In this embodiment, the first transition layer formed by the UV moisture dual-curing glue after moisture curing for 5 minutes has good bonding strength, which enables the middle frame 10 and the back cover 50 to be quickly fixed through the first transition layer. The bonding strength of the second transition layer formed by the UV moisture dual-curing glue after moisture curing for 24 hours is further improved, so that it is not easy to debond between the middle frame 10 and the back cover 50, which is conducive to improving the bonding effect between the middle frame 10 and the back cover 50, thereby facilitating the assembly effect of the shell 100.

[0074] It is understandable that the second transition layer is allowed to stand still so that the second transition layer continues to be moisture cured to form the glue layer 70. Since the UV moisture dual-curing glue in the second transition layer can continue to be moisture cured during the standing process, so that the shear strength of the glue layer 70 is further improved, the shear strength of the glue layer 70 is ≥ the second shear strength P2 ≥ 4MPa.

[0075] The assembly method of the shell component 100 provided in the embodiment of the present application uses UV moisture dual-curing glue to bond the first shell and the second shell. The UV moisture dual-curing glue has a certain initial bonding strength after ultraviolet light curing, and can quickly bond the first shell and the second shell. The shear strength between the glue layer 70 formed after moisture curing and the first shell and the second shell can reach more than 4 MPa. The bonding strength of the glue layer 70 is significantly better than the existing foam pressure-sensitive adhesive, and the protection level can be greatly improved, reducing the risk of separation of the first shell and the second shell in falling and impact scenarios.

[0076] In the assembly method of the shell component 100 provided in the embodiment of the present application, after step S3 and before step S4, it also includes step S31: performing a pressure-maintaining treatment on the first shell and the second shell.

[0077] In this embodiment, the first shell and the second shell can be subjected to pressure-holding treatment for 15s to 120s with the aid of a pressure-holding fixture to achieve rapid pressure-holding of the first shell and the second shell. Exemplarily, the time for the pressure-holding treatment can be 15s, 30s, 45s, 60s, 75s, 90s, 105s, 120s, etc. By performing pressure-holding treatment on the first shell and the second shell, on the one hand, it can ensure that the first shell and the second shell are firmly bonded, and on the other hand, it can shorten the overall assembly time of the shell part 100 while ensuring the bonding strength between the first shell and the second shell, which is beneficial to improving the assembly efficiency of the shell part 100. It can be understood that in other embodiments, the pressure-holding treatment may not be performed, which is equivalent to the time of the pressure-holding treatment being 0s.

[0078] The embodiment of the present application also provides an assembly method of the electronic device 1, comprising:

[0079] Step P1 : providing a first structural member and UV moisture dual-curing glue, wherein the first structural member includes a first shell, and setting the UV moisture dual-curing glue on the first shell to form a UV moisture dual-curing glue layer 103 .

[0080] Step P2, ultraviolet light curing the UV moisture dual curing glue layer 103.

[0081] Step P3, providing a second structural member, the second structural member includes a second shell, and the second shell is arranged on a side of the UV moisture dual-curing glue layer 103 away from the first shell.

[0082] Step P4, moisture-curing the UV moisture dual-curing glue layer 103 to form a glue layer 70, the glue layer 70 is bonded between the first shell and the second shell, the shear strength between the glue layer 70 and the first shell is ≥4MPa, and the shear strength between the glue layer 70 and the second shell is ≥4MPa.

[0083] In the embodiment of the present application, the first structural member, the glue layer 70 and the second structural member are assembled to form the electronic device 1. It is understandable that before the step of arranging the second shell on the side of the UV moisture dual-curing glue layer 103 away from the first shell, the step of installing the functional components 300 such as the display screen 310, the circuit board 330 and the battery 350 on the first shell in the first structural member is also included.

[0084] The housing member 100 provided in the embodiment of the present application is described below in combination with a comparative example and a first example.

[0085] Comparative Example 1 provides a housing component, and the assembly method of the housing component includes:

[0086] Step S1, providing a first shell component, the first shell component is a middle frame, and the middle frame includes a first bonding area.

[0087] Step S2, providing a second shell, the second shell is a back cover, the back cover includes an ink layer, and the ink layer is provided with a second bonding area.

[0088] Step S3: Use foam pressure-sensitive adhesive to bond and fix the middle frame and the ink layer of the back cover, wherein the foam pressure-sensitive adhesive is bonded between the first bonding area of ​​the middle frame and the second bonding area of ​​the ink layer.

[0089] Comparative Example 2 provides a housing component, and the assembly method of the housing component includes:

[0090] Step S1, providing a first shell component, wherein the first shell component is a middle frame, and the middle frame includes a first sub-adhesive area and a second sub-adhesive area.

[0091] Step S2, providing a second shell, the second shell is a back cover, the back cover includes an ink layer, and the ink layer is provided with a third sub-adhesive area and a fourth sub-adhesive area.

[0092] Step S3, using foam pressure-sensitive adhesive and hot-melt adhesive to bond and fix the middle frame and the ink layer of the back cover, wherein the foam pressure-sensitive adhesive is bonded between the first sub-bonding area of ​​the middle frame and the third sub-bonding area of ​​the ink layer, and the hot-melt adhesive is bonded between the second sub-bonding area of ​​the middle frame and the fourth sub-bonding area of ​​the ink layer.

[0093] The first example provides a housing member 100, and the assembly method of the housing member 100 includes:

[0094] Step S1, providing a first shell component, the first shell component is a middle frame 10, the middle frame 10 includes a first bonding area 101, and using a dispensing machine to dispense UV moisture dual-curing glue to the first bonding area 101 of the middle frame 10, and the UV moisture dual-curing glue forms a UV moisture dual-curing glue layer 103.

[0095] Step S2: Then, the UV-moisture dual-curing glue layer 103 is irradiated with ultraviolet light of 365 nm to 400 nm for 5 s to 30 s to perform pre-curing.

[0096] Step S3, providing a second housing, the second housing being a back cover 50, the back cover 50 comprising an ink layer 53, the ink layer 53 being provided with a second bonding area. Then, the back cover 50 is attached to the side of the middle frame 10 away from the UV moisture dual-curing glue layer 103.

[0097] Step S31 : Press the middle frame 10 and the back cover 50 together with a pressure-maintaining jig to perform a pressure-maintaining treatment. The time of the pressure-maintaining treatment is 15 seconds.

[0098] Step S4, leaving the UV moisture dual-curing glue layer 103 to stand for more than 24 hours, so that the UV moisture dual-curing glue layer 103 is moisture-cured to form a glue layer 70, and the glue layer 70 is bonded between the first bonding area 101 of the middle frame 10 and the second bonding area of ​​the ink layer 53.

[0099] In the first example, the middle frame 10, the back cover 50 and the glue layer 70 are assembled to form the housing 100. The performance parameters and measurement standards of the UV moisture dual-curing glue, the glue layer 70 and the housing 100 in the first example are shown in Table 1.

[0100] Table 1 Performance parameters and measurement standards of UV moisture dual-curing glue, glue layer 70 and shell member 100 in the first example

[0101]

[0102] In the solution of using pure foam pressure-sensitive adhesive to bond the middle frame and the back cover, on the one hand, there is a problem that the bonding width of pure foam pressure-sensitive adhesive is large (more than 0.8mm), and the bonding area requirement is large. On the other hand, the mechanical reliability test performance after bonding with pure foam pressure-sensitive adhesive is poor, and the middle frame and the back cover are easy to separate. In the solution of point-to-back bonding using a combination of pressure-sensitive adhesive and hot-melt adhesive, on the one hand, the cost is high and the processing efficiency is low. On the other hand, there is a risk of the ink layer of the back cover falling off.

[0103] As can be seen from Table 1, in the shell part 100 provided in the first example of the present application, a UV moisture dual-curing glue is used to cure and form a glue layer 70 to achieve bonding of the middle frame 10 and the back cover 50. The UV moisture dual-curing glue is in liquid form and can be applied according to the area of ​​the bonding surface. The width of the formed glue layer 70 can be less than 0.8 mm, which can be suitable for bonding on a narrower bonding surface. After the UV moisture dual-curing glue is cured by ultraviolet light, the UV moisture dual-curing glue is activated by ultraviolet light to start pre-curing, and then pressed for 15 seconds under the action of a pressure-holding fixture. When it is left to stand for moisture curing for 5 minutes, the first shear strength P1 ≥ 1MPa between the first transition layer and the middle frame 10 or the back cover 50 is formed, which is conducive to the rapid bonding of the middle frame 10 and the back cover 50. When the moisture curing is continued for 24 hours, the second shear strength P2 between the second transition layer and the middle frame 10 or the back cover 50 can reach 4MPa or more, so that the UV moisture dual-curing glue can reach a high shear strength within 24 hours, and the bonding efficiency is high. The shear strength of the glue layer 70 formed by the final curing of the UV moisture dual-curing glue reaches more than 4MPa. The bonding strength of the glue layer 70 is significantly better than the existing foam pressure-sensitive adhesive, and the protection level can be greatly improved, reducing the risk of separation of the back cover 50 and the middle frame 10 in the case of falling and impact.

[0104] On the one hand, the adhesive strength of the glue layer 70 is significantly better than that of the cotton tape, and the protection level can be greatly improved, reducing the risk of separation of the back cover 50 and the middle frame 10 in the case of falling and impact. On the other hand, the adhesive strength of the glue layer 70 is moderate, which avoids the problem of the ink layer 53 of the back cover 50 falling off due to the excessive adhesive strength of the glue layer 70, making it difficult for the middle frame 10 and the back cover 50 to debond, and improving the adhesive strength between the glue layer 70 and the middle frame 10 and the back cover 50, thereby improving the assembly effect of the housing 100.

[0105] In the first example of the present application, UV moisture dual-curing glue is used for light activation, and the assembly of the shell 100 can be completed after pressure treatment (within 2 minutes), and the assembly processing efficiency is high and the cost is low. In addition, compared with the method of using foam pressure-sensitive adhesive in comparative examples 1 and 2, the glue layer 70 used in the first example of the present application does not contain a foam layer, and the glue layer 70 has better cohesion and is easy to peel off, so it is easier to clean and will not leave residue, which can improve the repair yield of the shell 100. In addition, in the first example, PC+GF-ink glass and aluminum alloy sheet-ink glass are used as samples of the shell 100 to test the butt bonding strength. Among them, when the sample of the shell 100 is PC+GF-ink glass, the sample of the middle frame 10 is polycarbonate (PC+GF) with added glass fiber, and the sample of the back cover 50 is ink glass. The ink glass includes glass and an ink layer provided on the surface of the glass, and the glue layer 70 is bonded between the polycarbonate with added glass fiber and the ink layer. When the shell member 100 is an aluminum alloy sheet-ink glass, the sample of the middle frame 10 is an aluminum alloy sheet, and the sample of the back cover 50 is an ink glass. The ink glass includes ink and an ink layer arranged on the glass surface, and the glue layer 70 is bonded between the aluminum alloy sheet and the ink layer. The experimental results show that the bonding strength between the glue layer 70 and the aluminum alloy, PC+GF and the ink layer reaches more than 4MPa after being placed and cured for 24 hours, and the glue layer 70 has excellent bonding effects with the aluminum alloy, PC+GF and ink layer interfaces. The present application also conducted a large number of experiments, and the experimental results showed that the glue layer 70 formed after the UV moisture dual-curing glue was cured has excellent bonding effects with the bonding interfaces such as anodized aluminum, die-cast aluminum, aluminum alloy, PC+GF, PBT+GF, and ink layers, which is beneficial to improve the bonding effect between the glue layer 70 and the middle frame 10 and the back cover 50, thereby improving the assembly effect of the shell member 100.

[0106] In addition, the UV moisture dual-curing glue used in the first example of the present application is a single-component glue, which has dual curing properties of UV curing and moisture curing. Compared with glue that can only be moisture-cured, the UV moisture dual-curing glue used in the embodiment of the present application can provide initial bonding strength after UV curing, so that the middle frame 10 and the back cover 50 can be quickly bonded. In addition, the glue that can only be UV-cured has the problems of low viscosity, thin glue, difficulty in bonding on a very narrow bonding surface, and difficulty in assembly. In addition, the hardness of the glue layer after curing will be relatively large and easy to fall off. The viscosity of the UV moisture dual-curing glue used in the embodiment of the present application is between 10000cps and 500000cps, which can be well attached to the first bonding area 101 of the middle frame 10 or to the second bonding area of ​​the back cover 50, reducing the difficulty of assembling the shell 100.

[0107] Among them, in the composition of UV moisture dual-curing glue, the auxiliary agent includes a rheology modifier and / or a filler. In this example, according to the mass of UV moisture dual-curing glue, the UV moisture dual-curing glue includes 10% to 50% of UV moisture dual-curing resin, 5% to 30% of UV moisture dual-curing monomer, 5% to 30% of polyurethane prepolymer, 0.5% to 5% of photoinitiator, 0.5% to 5% of silane coupling agent, 0.5-5% moisture curing catalyst, 0.5% to 5% of rheology modifier and 0.5% to 5% of filler. Exemplarily, the UV moisture dual-curing resin can be a resin containing an isocyanate group and a free radical polymerizable group. Exemplarily, the UV moisture dual-curing monomer can be a monomer compound or a mixture containing an isocyanate group and a free radical polymerizable group. Exemplarily, the polyurethane prepolymer can be a compound whose terminal group of the reaction of a polyol and an isocyanate curing agent is an isocyanate group. Exemplarily, the photoinitiator includes at least one of benzophenone compounds, acetophenone compounds, acylphosphine oxide compounds, titanocene compounds, oxime ester compounds, benzoin ether compounds, and thioxanthone. Exemplarily, the silane coupling agent includes at least one of an amino coupling agent containing methoxysilicon or ethoxysilicon with a hydrolyzable functional group, an epoxy silane coupling agent, a mercaptosilane coupling agent, and the like. Exemplarily, the rheology modifier includes at least one of silicon dioxide, calcium carbonate, and barium sulfate. In the UV moisture dual-curing glue provided in this example, the resins used all contain moisture-cured NCO (isocyanate) groups, so the UV moisture dual-curing glue can also achieve higher strength by pure moisture curing. Among them, the use of small molecular isocyanate acrylate monomers instead of traditional pure acrylate monomers can enable the UV moisture dual-curing adhesive to maintain a lower viscosity and UV initial viscosity. In addition, the addition of tackifying resins such as thermoplastic acrylic resins also enables the UV moisture dual-curing adhesive to present higher initial bonding strength and final bonding strength.

[0108] In addition, in the first example, the performance test of the assembled shell part 100 was also carried out. The experimental results show that the number of impact resistance of the shell part 100 is ≥50 times. The experimental results show that the glue layer 70 formed by curing the UV moisture dual-curing glue to bond the middle frame 10 and the back cover 50, the shell part 100 has good impact resistance, and can avoid the problem of debonding of the shell part 100 in the falling scene. In the static creep test of the shell part 100, the time for the first shell to separate from the second shell of the shell part 100 is ≥120h under the action of a separation force of 1Kg. The experimental results show that the glue layer 70 formed by curing the UV moisture dual-curing glue to bond the middle frame 10 and the back cover 50, the shell part 100 has good creep resistance, and can avoid the problems of lifting, dislocation, virtual position and debonding of the shell part 100 in a high temperature and high humidity environment. In the grease resistance test, after the shell 100 is immersed in grease, the shear strength between the glue layer 70 in the shell 100 and the middle frame 10 is ≥2MPa, and the shear strength between the glue layer 70 and the back cover 50 is ≥2MPa. The experimental results show that the glue layer 70 formed by UV moisture dual-curing glue is bonded to the middle frame 10 and the back cover 50, and the shell 100 has good grease resistance, which can prevent the shell 100 from debonding in a long-term grease environment.

[0109] What is disclosed above is only a preferred embodiment of the present application, and it certainly cannot be used to limit the scope of rights of the present application. Ordinary technicians in this field can understand that all or part of the processes of implementing the above embodiments and equivalent changes made according to the claims of the present application are still within the scope covered by the present application.

Claims

1. A method for assembling a housing, characterized in that: include: A first shell and UV moisture dual-curing glue are provided, wherein the viscosity of the UV moisture dual-curing glue is between 10000cps and 500000cps, and the UV moisture dual-curing glue is arranged on the first shell to form a UV moisture dual-curing glue layer, wherein the curing characteristics of the UV moisture dual-curing glue are: the curing time of the UV moisture dual-curing glue under ultraviolet light conditions of 365nm to 400nm is less than 15s, and the curing depth is ≥0.4mm; Performing ultraviolet light curing on the UV moisture dual-curing glue layer; Providing a second shell, the second shell comprising a substrate and an ink layer disposed on the substrate, and disposing the second shell on a side of the UV moisture dual-curing glue layer away from the first shell; The UV moisture dual-curing glue layer is moisture-cured to form a glue layer, the glue layer is bonded between the ink layers of the first shell and the second shell, the shear strength between the glue layer and the first shell is ≥4MPa, the shear strength between the glue layer and the second shell is ≥4MPa, and the tensile modulus of the glue layer is ≤60MPa; In the step of moisture curing the UV moisture dual-curing glue layer, the UV moisture dual-curing glue layer forms a first transition layer when it is moisture cured for 5 minutes, and forms a second transition layer when it is moisture cured for 24 hours; The shear strength between the first transition layer and the first shell or the second shell is a first shear strength P1, and the first shear strength P1≥1MPa. The shear strength between the second transition layer and the first shell or the second shell is a second shear strength P2, and the second shear strength P2≥4MPa.

2. The method for assembling a housing member according to claim 1, characterized in that: After the step of arranging the second shell on the side of the UV moisture dual-curing glue layer away from the first shell and before the step of moisture-curing the UV moisture dual-curing glue layer, it also includes: performing pressure-maintaining treatment on the first shell and the second shell.

3. The method for assembling a housing member according to claim 2, characterized in that: The time of the pressure holding treatment is 15s to 120s.

4. The method for assembling a housing member according to claim 1, characterized in that: The UV-moisture dual-curing glue layer is irradiated with ultraviolet light of 365nm-400nm for 5s-30s to perform the ultraviolet curing.

5. The method for assembling a housing member according to claim 1, characterized in that: The UV-moisture dual-curing glue layer is left to stand to perform the moisture curing.

6. A housing member, characterized in that: The invention comprises a first shell, a second shell and a glue layer, wherein the second shell comprises a substrate and an ink layer arranged on the substrate, the glue layer is bonded between the ink layers of the first shell and the second shell, the glue layer is made by curing UV moisture dual-curing glue, the viscosity of the UV moisture dual-curing glue is between 10000cps and 500000cps, and the curing characteristics of the UV moisture dual-curing glue are: the curing time of the UV moisture dual-curing glue under ultraviolet light conditions of 365nm to 400nm is less than 15s, the curing depth is ≥0.4mm, the shear strength between the glue layer and the first shell is ≥4MPa, the shear strength between the glue layer and the second shell is ≥4MPa, and the tensile modulus of the glue layer is ≤60MPa.

7. The housing member according to claim 6, characterized in that: The first shell is a middle frame, the second shell is a back cover, the back cover includes a substrate and an ink layer arranged on the substrate, and the glue layer is bonded between the middle frame and the ink layer.

8. The housing member according to claim 7, characterized in that: The glue layer is bonded between the edge of the middle frame and the edge of the ink layer.

9. The housing member according to any one of claims 6 to 8, characterized in that: The width of the glue layer is less than 0.8 mm.

10. The housing member according to any one of claims 6 to 8, characterized in that: When the glue layer fails to adhere to the shell component under an impact force of 200g, the shell component can resist impacts ≥50 times.

11. The housing member according to any one of claims 6 to 8, characterized in that: When the shell component is subjected to a separation force of 1 kg, the time for the first shell to separate from the second shell is ≥ 120 hours.

12. The housing member according to any one of claims 6 to 8, characterized in that: After the shell part is immersed in grease, the shear strength between the glue layer and the first shell is ≥2MPa, and the shear strength between the glue layer and the second shell is ≥2MPa.

13. The housing member according to any one of claims 6 to 8, characterized in that: The UV moisture dual-curing glue comprises a UV moisture dual-curing resin, a UV moisture dual-curing monomer, a polyurethane prepolymer, a photoinitiator, a silane coupling agent, a moisture curing catalyst and an auxiliary agent.

14. An electronic device, characterized in that: It includes a shell part and a functional device, wherein the shell part is a shell part assembled according to the shell part assembly method according to any one of claims 1 to 5, or the shell part is a shell part according to any one of claims 6 to 13, and the functional device is installed on the first shell.

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