Size detection device and silicon wafer sorting system

Abstract

The present application discloses a size detection device, which is applied to a silicon wafer sorting system, and includes: a material detection mechanism and a debris cleaning mechanism, wherein the material detection mechanism includes a first light source assembly and a first shooting assembly, wherein the first light source assembly is located below the conveyor belt, and the first shooting assembly is located above the conveyor belt; the debris cleaning mechanism is installed on the first light source assembly, and is used to clean up the debris scattered on the first light source assembly; the first light source assembly includes a light source, and the light source has a through-portion penetrating itself in the height direction, and the through-portion and the light source both have a center line extending in the height direction, and the center line of the through-portion is substantially coincident with the center line of the first light source assembly; the debris cleaning mechanism includes a first air knife, at least part of the first air knife is located in the through-portion, and the debris is swept from the through-portion to the edge direction of the light source. Through the above arrangement, the sweeping effect of the first air knife is improved, the detection accuracy of the device is improved, and the production capacity of the sorting system is thereby improved.

Description

Technical Field

[0001] The present application relates to the field of photovoltaic silicon wafer sorting equipment, and in particular to a size detection device and a silicon wafer sorting system. Background Art

[0002] As an important industrial raw material, silicon wafers are widely used in photovoltaic and semiconductor fields. Before silicon wafers are produced and shipped out of the factory, their quality needs to be strictly controlled to ensure the quality of solar cells, circuit boards and other products made from silicon wafers. The silicon wafer sorting system is an automated inspection and sorting equipment that integrates automation, measurement, and visual defect detection, and is used in the production process of solar silicon wafers.

[0003] It is difficult to avoid various faults in the sorting system during continuous production, which may damage the silicon wafers. During the material transportation process, the broken materials will fall on the light source surface of the size detection device, resulting in shadows on the light source surface, affecting the accuracy of silicon wafer detection and increasing the false detection rate. In addition, the broken materials on the light source surface need to be cleaned manually at regular intervals, which reduces production capacity. Summary of the invention

[0004] In order to solve the deficiencies of the prior art, the purpose of the present invention is to provide a size detection device and a silicon wafer sorting system to solve the problem that broken materials affect the detection accuracy of silicon wafer size and broken materials cause the capacity of the sorting system to decrease.

[0005] To achieve the above objectives, this application adopts the following technical solutions:

[0006] In a first aspect, the present application provides a size detection device, which is applied to a silicon wafer sorting system, comprising: a material detection mechanism, the material detection mechanism comprising a first light source assembly and a first shooting assembly, the first light source assembly is used to irradiate the material and is located below the conveyor belt, the first shooting assembly is used to perform image detection on the material and is located above the conveyor belt; a debris cleaning mechanism, the debris cleaning mechanism is installed on the first light source assembly, and is used to clean up the debris scattered on the first light source assembly; wherein the first light source assembly comprises a light source, the light source has a through portion penetrating itself in a height direction, the through portion and the light source both have a center line extending in the height direction, and the center line of the through portion basically coincides with the center line of the first light source assembly; the debris cleaning mechanism comprises a first air knife, at least a portion of the first air knife is located in the through portion, and sweeps the debris from the through portion to the edge direction of the light source.

[0007] Furthermore, the first wind knife forms a first ventilation cavity, the first wind knife has a first blowing part distributed around the center line of the through part, and the first ventilation cavity is connected with the outside through the first blowing part; the debris cleaning mechanism includes a first wind speed control unit for providing gas, and the first wind speed control unit is connected with the first ventilation cavity.

[0008] Furthermore, the first wind knife includes an annular side wall and a bottom cover arranged on the side wall, the side wall surrounds to form a first ventilation cavity, the bottom cover closes the first ventilation cavity in the height direction, and the first blowing part is evenly distributed on the outer peripheral surface of the side wall.

[0009] Furthermore, the debris cleaning mechanism also includes a wind knife cover, which is arranged below the first wind knife and fixedly connected to the first wind knife. The wind knife cover has an air duct running through in the height direction, and the first wind speed control unit is connected to the first ventilation cavity through the air duct.

[0010] Furthermore, the first blowing portion includes a first air hole and a second air hole arranged along the height direction, the axis of the first air hole passes through the center line of the through portion, and the second air hole is arranged obliquely relative to the first air hole.

[0011] Furthermore, the light source includes a light emitting surface facing the first shooting component, and the first blowing part is located above the light emitting surface.

[0012] Furthermore, the first light source assembly includes a first light source bracket for supporting the light source, and the debris cleaning mechanism is fixedly connected to the first light source bracket.

[0013] Furthermore, the debris cleaning mechanism includes a wind knife cover and a first mounting bracket. The wind knife cover is arranged below the first wind knife and is fixedly connected to the first wind knife. The wind knife cover has an air duct running through the height direction. The first wind speed control unit is connected to the first ventilation cavity through the air duct. The side of the wind knife cover facing away from the first wind knife is fixedly connected to the first mounting bracket. The first mounting bracket is integrated on the first light source bracket.

[0014] In a second aspect, the present application further provides a silicon wafer sorting system, comprising a size detection device of any one of the above-mentioned first aspects, including: front and rear edge chipping detection devices, the front and rear edge chipping detection devices including an edge chipping detection mechanism and an edge chipping cleaning mechanism, the edge chipping detection mechanism is used to detect whether there are defects on the front and rear edges of the material, and the edge chipping cleaning mechanism is installed on the edge chipping detection mechanism and is used to clean the edge chipping detection mechanism; wherein the edge chipping detection mechanism includes a second light source component for irradiating the material and a second shooting component for performing image detection on the material, and the second shooting component is located above the second light source component; the edge chipping cleaning mechanism includes a second wind knife for cleaning the second light source component, the second wind knife is connected to the second light source component, and has the freedom of movement relative to the second light source component in the height direction, when performing image detection on the material, the second wind knife moves to the standby position; when conveying the material, the second wind knife moves to the working position to clean the second light source component.

[0015] Furthermore, the second light source assembly includes a light source compartment, which includes a light-transmitting surface facing the second shooting assembly. When the second wind knife is in the standby position, the second wind knife is lower than the light-transmitting surface. When the second wind knife is in the working position, the second wind knife is higher than the light-transmitting surface.

[0016] Furthermore, the chipped edge cleaning mechanism includes a second mounting bracket, the second wind knife is fixedly connected to the second mounting bracket, the second mounting bracket includes a limiting groove extending along the height direction, and the second light source assembly includes a support bracket distributed on both sides of the light source compartment, the support bracket is slidably connected to the second mounting bracket, and at least a portion of the support bracket is embedded in the limiting groove.

[0017] Furthermore, a second wind knife is formed around a second ventilation cavity, and the second wind knife has a second blowing part distributed along the front-to-back direction of the second light source assembly, and the second ventilation cavity is connected to the outside through the second blowing part; the edge chip cleaning mechanism includes a second wind speed control unit for providing gas, and the second wind speed control unit is connected to the second ventilation cavity.

[0018] Furthermore, the second blowing part includes a third air hole and a fourth air hole distributed along the height direction, the third air hole is located above the fourth air hole, the axis of the third air hole is basically parallel to the light-transmitting surface, and the fourth air hole is inclined relative to the third air hole.

[0019] In a third aspect, the present application further provides a silicon wafer sorting system, comprising any one of the size detection devices of the first aspect, the silicon wafer sorting system further comprising: a front and rear edge collapse detection device, the front and rear edge collapse detection device comprising an edge collapse detection mechanism, the edge collapse detection mechanism is used to detect whether there are defects on the front and rear edges of the material, the edge collapse detection mechanism comprises a second light source component for irradiating the material and a second shooting component for performing image detection on the material, the second shooting component is located above the second light source component; wherein the second light source component comprises: a light source bin, the light source bin comprises a feed channel extending along the front and rear direction of the second light source component, a light-transmitting portion extending along the height direction is provided on an end face of the light source bin facing the second shooting component, the light-transmitting portion extends along the left and right direction of the second light source component; a light-emitting unit, the light-emitting unit is installed in the light source bin and is located above the feed channel, when the material enters the light source bin and is in the detection position, the light-emitting unit irradiates the front / rear edge of the material; a reflection unit, the reflection unit is installed in the light source bin, at least part of the reflection unit is located below the feed channel, the reflection unit emits the light emitted by the light-emitting unit along the light-transmitting portion, the second shooting component collects the light, and performs image detection on the material.

[0020] Furthermore, the light-emitting unit includes a first light source and a second light source, the second light source and the second light source are distributed along the front-to-back direction, and the two are mirror-symmetrical, and the first light source is located on the rear side of the second light source; the reflecting unit includes a first reflector and a second reflector, the first reflector and the second reflector are located below the feed channel, the two are distributed along the front-to-back direction, and are mirror-symmetrical, and the first reflector is located on the rear side of the second reflector.

[0021] Furthermore, the reflection unit also includes a third reflector and a fourth reflector, which are located above the feed channel, distributed along the front-to-back direction and mirror-symmetrical, and the third reflector is located in front of the fourth reflector.

[0022] Furthermore, the second light source assembly also includes a chamfered light source, which is arranged on the left and right sides of the light source bin and is located below the feed channel. The chamfered light source is used to illuminate the left and right ends of the light-transmitting portion.

[0023] Compared with the prior art, the size detection device of the present invention sets a through portion in the middle of the light source so that the first air knife is set in the through portion and can spray gas along the direction from the first air knife to the edge of the light source to sweep away the debris scattered on the surface of the light source. The above setting can achieve a more uniform sweeping effect, avoid uneven airflow on the surface of the light source, and avoid debris far from the air knife from remaining on the surface of the light source, thereby improving the detection accuracy of the device and further improving the production capacity of the sorting system. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic diagram of the structure of the sorting system in the implementation manner of the present application;

[0025] Figure 2 This is a schematic diagram of the structure of a size detection device in an embodiment of the present application;

[0026] Figure 3 This is a schematic diagram of the structure of the first light source assembly in an embodiment of the present application;

[0027] Figure 4 An exploded view of the first light source assembly in an embodiment of the present application;

[0028] Figure 5 This is a structural block diagram of the debris cleaning mechanism in the implementation manner of the present application;

[0029] Figure 6 A cross-sectional view of the first air knife in the embodiment of the present application;

[0030] Figure 7 This is a schematic structural diagram of a front and rear edge chipping detection device from a first perspective in an embodiment of the present application;

[0031] Figure 8It is a structural schematic diagram of the front and rear edge chipping detection device from a second viewing angle in an embodiment of the present application;

[0032] Fig. 9 In the implementation mode of this application Figure 8 A magnified image of point A;

[0033] Fig.10 This is a schematic diagram of the structure of the second air knife in the implementation manner of the present application;

[0034] Fig.11 is a cross-sectional view of a second light source assembly in an embodiment of the present application;

[0035] Fig.12 It is a schematic diagram of the structure of the second light source assembly in an embodiment of the present application.

[0036] Description of reference numerals:

[0037] Silicon wafer sorting system 100;

[0038] Material detection mechanism 11; first light source assembly 111; light source 1111; light emitting surface 1111a; through portion 1112; first light source bracket 1113; first shooting assembly 112; debris cleaning mechanism 12; first wind knife 121; side wall 1211; bottom cover 1212; first blowing portion 1213; first air hole 1213a; second air hole 1213b; first wind speed control unit 122; first ventilation cavity 123; wind knife cover 124; first mounting bracket 125;

[0039] Front and rear edge collapse detection device 20; edge collapse detection mechanism 21; second light source assembly 211; light source compartment 2111; light transmission surface 2111a; light transmission part 2111b; heat dissipation part 2111c; light emitting unit 2112; first light source 2112a; second light source 2112b; support frame 2113; reflection unit 2114; first reflector 2114a; second reflector 2114b; third reflector 2114c; fourth reflector 2114d; feeding channel 2115; chamfering light source 2116; second shooting assembly 212; edge collapse cleaning mechanism 22; second air knife 221; second blowing part 2211; third air hole 2211a; fourth air hole 2211b; second mounting bracket 222; limiting groove 2221; second ventilation cavity 223;

[0040] Conveyor belt 30. DETAILED DESCRIPTION

[0041] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the specific implementation manner of the present application will be clearly and completely described below in conjunction with the drawings in the implementation manner of the present application.

[0042] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. "First", "second", "third", "fourth" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first", "second", "third", "fourth" may explicitly or implicitly include at least one of the features. The singular forms "a", "said", and "the" used in this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0043] like Figure 1 As shown, the present application provides a silicon wafer sorting system 100, which is mainly used to detect various quality indicators of silicon wafers, including size, thickness, chamfer, edge collapse, dirt, hidden cracks, etc. By introducing visual inspection technology, using high-quality light sources, professional cameras and precise algorithms, comprehensive control of silicon wafer quality is achieved.

[0044] like Figure 1 As shown, the silicon wafer sorting system 100 includes a size detection device 10 and a front and rear edge collapse detection device 20. The front and rear edge collapse detection device 20 is located downstream of the size detection device 10, and the material (i.e., silicon wafer) is sequentially conveyed from the size detection device 10 to the front and rear edge collapse detection device 20 through a conveyor belt 30. The size detection device 10 is used to detect the appearance size of the material, and the front and rear edge collapse detection device 20 is used to detect whether there are defects on the front and rear edges of the material.

[0045] like Figure 2 As shown, as an implementation method, the size detection device 10 includes a material detection mechanism 11 and a debris cleaning mechanism 12. The material detection mechanism 11 is used to perform image detection on the material, and transmit the obtained material image to the control terminal, and the material image is identified, analyzed and calculated by the control terminal to obtain the accurate material size. Since the material is transmitted in contact with the surface of the conveyor belt 30, the conveyor belt 30 will jump during the material transportation process, and it is difficult to ensure the stability of the transportation process. Therefore, during the transportation process, part of the material will be stuck, causing the material to break and fall into the size detection device 10. The debris cleaning mechanism 12 is used to clean up the debris (the debris is the fragments of the material) scattered in the size detection device 10 to prevent the debris from affecting the image detection results.

[0046] Specifically, the material detection mechanism 11 includes a first light source assembly 111 and a first shooting assembly 112. The first light source assembly 111 is used to illuminate the material and is located below the conveyor belt 30, and the first shooting assembly 112 is used to perform image detection on the material and is located above the conveyor belt 30. The first light source assembly 111 provides a light source to improve the imaging effect of the material image.

[0047] The conveyor belt 30 transports the material to the top of the first light source assembly 111, and the first light source assembly 111 irradiates the material upward. Since the material blocks part of the light transmitted from the first light source assembly 111 to the first shooting assembly 112, the part of the light not blocked by the material is captured by the first shooting assembly 112, so that the first shooting assembly 112 captures the material image. The first shooting assembly 112 transmits the material image to the control terminal, and the control terminal recognizes, analyzes and calculates the image to obtain the accurate material size.

[0048] In some examples, the first shooting component 112 may be an industrial camera such as an area array camera and / or a line array camera, for example, a CCD industrial camera, which has the advantage of being able to directly obtain two-dimensional image information and to measure images intuitively. It can be exposed for a short time, which is conducive to capturing dynamic scenes, and can also capture static scenes; a CMOS camera is used to capture static targets and has a lower cost.

[0049] like Figure 3 and Figure 4 As shown, further, the first light source assembly 111 includes a light source 1111, and the light source 1111 has a through portion 1112 that penetrates the light source 1111 in the height direction, and the through portion 1112 is basically located in the middle area of ​​the light source 1111. The through portion 1112 and the light source 1111 both have a center line extending in the height direction, and the center line of the through portion 1112 and the center line of the light source 1111 are basically coincident. The debris cleaning mechanism 12 includes a first air knife 121, at least part of the first air knife 121 is located in the through portion 1112, and the first air knife 121 is used to spray gas toward the light source 1111, and can sweep the debris scattered on the light source 1111 from the through portion 1112 to the edge direction of the light source 1111.

[0050] Exemplarily, the through portion 1112 is a cylindrical hollow channel, the light source 1111 is substantially square in shape, the center line of the through portion 1112 is the axis of the hollow channel, and the center line of the through portion 1112 passes through the intersection of the diagonals of the light source 1111 .

[0051] Through the above arrangement, since the first air knife 121 is arranged in the middle area of ​​the light source 1111, the first air knife 121 can evenly generate gas for sweeping the debris in the horizontal direction, thereby improving the cleaning effect of the size detection device 10. It is avoided that uncleaned debris still remains in the area where the light source 1111 is far away from the first air knife 121 due to uneven gas flow rate.

[0052] In the embodiment of the present application, the first light source assembly 111 further includes a first light source bracket 1113, which is located below the light source 1111 and is fixedly connected to the light source 1111, and supports the light source 1111 through the first light source bracket 1113. In addition, the debris cleaning mechanism 12 is installed on the first light source bracket 1113, so that the overall structure of the size detection device 10 is more compact.

[0053] like Figure 5 As shown, as an implementation method, the debris cleaning mechanism 12 includes a first wind speed control unit 122, which provides gas for blowing away the debris and is connected to the first wind knife 121. The first wind speed control unit 122 includes a control circuit, a pneumatic element, and a speed regulating valve. The control circuit stores programming instructions for controlling the start / stop time of the pneumatic element. The pneumatic element is an element that performs work through the force generated by the pressure or expansion of the gas, and is a component that converts the elastic energy of compressed air into kinetic energy, such as a cylinder, a pneumatic motor, etc. The pneumatic element is connected to the speed regulating valve through an air pipe, and the air volume entering the first wind knife 121 is adjusted by the speed regulating valve.

[0054] The first wind speed control unit 122 controls the blowing holding time of the first wind knife 121, the start and stop time of the first wind knife 121, the air flow rate blown out by the first wind knife 121, etc. When the silicon wafer sorting system 100 is shut down for maintenance, the first wind speed control unit 122 is started to clean the debris from the surface of the light source 1111, thereby solving the problem of production capacity being affected by manual operation.

[0055] like Figure 6 As shown, the first air knife 121 is surrounded by a first ventilation cavity 123 for accommodating gas, and the first ventilation cavity 123 is communicated with the first wind speed control unit 122 to store the acquired gas in the first ventilation cavity 123. The first air knife 121 has a first blowing portion 1213 distributed around the center line of the through portion 1112, and the first ventilation cavity 123 is communicated with the outside through the first blowing portion 1213. Through a plurality of first blowing portions 1213 with smaller calibers, the gas in the first ventilation cavity 123 is ejected outward in a high-pressure and high-speed manner to clean up the debris scattered on the light source 1111; wherein, the number of the first blowing portions 1213 is set to be a plurality, and the blowing area of ​​the first air knife 121 is increased or decreased by increasing or decreasing the number of the first blowing portions 1213.

[0056] Specifically, the air volume in the first air knife 121 is greater than or equal to 0.2 MPa and less than or equal to 0.6 MPa, so that a circulation is formed in the first ventilation cavity 123, which has a better blowing effect.

[0057] Optionally, according to the shape of the light source 1111 , different numbers of first blowing parts 1213 may be provided in different directions of the first wind knife 121 .

[0058] In order to prevent the debris from affecting the results of image detection, an airflow with a set velocity and a set flow rate is generated by operating the first wind speed control unit 122. The airflow enters the first ventilation cavity 123 and is ejected outward through the first blowing portion 1213. Since the first blowing portion 1213 is evenly distributed around the center line of the through portion 1112, the ejected airflow can relatively evenly sweep away the debris scattered on the light source panel in the horizontal direction.

[0059] Further, the first air knife 121 includes an annular side wall 1211 and a bottom cover 1212 covering the side wall 1211, the side wall 1211 surrounds and forms a first ventilation cavity 123, the bottom cover 1212 is located on the side of the side wall 1211 facing the conveyor belt 30, and the first ventilation cavity 123 is closed in the height direction by the bottom cover 1212, so that the gas in the first ventilation cavity 123 can only be ejected from the first blowing part 1213. The first blowing part 1213 is evenly distributed on the outer peripheral surface of the side wall 1211. Through the above arrangement, the cleaning effect of the first air knife 121 on any position of the light source 1111 remains basically consistent.

[0060] In the example of the present application, the light source 1111 includes a light emitting surface 1111a facing the first shooting assembly 112, and the light emitting surface 1111a extends substantially in the horizontal direction. The first air blowing portion 1213 is located above the light emitting surface 1111a, and the height of the first air blowing portion 1213 is slightly higher than the height of the light emitting surface 1111a, so that the airflow blown out by the first air blowing portion 1213 in the horizontal direction can act on the fragments scattered on the light emitting surface 1111a.

[0061] As an implementation, the first blowing part 1213 includes a first air hole 1213a and a second air hole 1213b, wherein the first air hole 1213a is evenly distributed on the outer peripheral surface of the first air knife 121 along the circumference of the first air knife 121, and similarly, the second air hole 1213b is evenly distributed on the outer peripheral surface of the first air knife 121 along the circumference of the first air knife 121. The interval between the first air hole (1213a) and the second air hole (1213b) in the height direction is greater than or equal to 0. Optionally, if the interval between the first air hole (1213a) and the second air hole (1213b) in the height direction is greater than 0, the first air hole (1213a) is located above the second air hole (1213b). Optionally, if the interval between the first air hole (1213a) and the second air hole (1213b) in the height direction is equal to 0, the first air hole (1213a) and the second air hole (1213b) are staggered.

[0062] Exemplarily, the first air hole 1213a is a straight hole, that is, the axis of the first air hole 1213a passes through the center line of the through portion 1112. The second air hole 1213b is an oblique hole, that is, the second air hole 1213b is inclined relative to the first air hole 1213a. The airflow ejected through the first air hole 1213a and the second air hole 1213b can more completely cover the light-emitting surface 1111a, thereby improving the cleaning effect of the debris. The second air hole 1213b is inclined toward the direction of the light-emitting surface 1111a, and the application does not specifically limit the inclination angle of the second air hole 1213b.

[0063] As another optional implementation, the first blowing portion 1213 includes two groups of hollow grooves (not shown) arranged vertically, and the upper and lower groups of hollow grooves are each evenly distributed on the outer peripheral surface of the first wind knife 121 in a circumferential direction around the first wind knife 121 .

[0064] like Figure 4 and Figure 5 As shown, as an implementation, the debris cleaning mechanism 12 further includes a wind knife cover 124, which is used to support the wind knife and shorten the height of the first wind knife 121. The wind knife cover 124 is disposed below the first wind knife 121 and is fixedly connected to the first wind knife 121.

[0065] The wind knife cover 124 has an air duct 1241 extending along the height direction, one end of the air duct 1241 is connected to the first ventilation cavity 123, and the other end of the air duct 1241 is connected to the first wind speed control unit 122, so as to transmit the gas generated by the first wind speed control unit 122 to the first ventilation cavity 123.

[0066] Because the wind knife cover 124 shortens the height of the first wind knife 121, the volume of the first ventilation cavity 123 is reduced. When the pneumatic unit generates the same flow rate of gas, a higher air pressure can be generated in the first ventilation cavity 123, thereby improving the cleaning effect of the light source 1111 and reducing the power consumption of the first wind speed control unit 122.

[0067] like Figure 3 As shown, further, the debris cleaning mechanism 12 also includes a first mounting bracket 125, the first mounting bracket 125 is used to support the first wind knife 121, and the first mounting bracket 125 is integrated on the first light source bracket 1113. The first wind knife 121 is connected to the first mounting bracket 125 through the wind knife cover 124, the first mounting bracket 125 basically extends in the horizontal direction, and the first light source bracket 1113 includes two light source support members, and the two ends of the first mounting bracket 125 are respectively fixedly connected to the light source support members in their respective directions, so as to improve the compactness of the overall structure of the size detection device 10.

[0068] The first mounting bracket 125 may be configured as a sheet metal component, which has the advantages of low cost, simple installation, and compact structure.

[0069] like Figure 7 As shown, as an implementation method, the front and rear edge chipping detection device 20 is installed downstream of the size detection device 10, and the front and rear edge chipping detection device 20 includes an edge chipping detection mechanism 21 and an edge chipping cleaning mechanism 22. The edge chipping detection mechanism 21 is used to detect whether there are defects on the front and rear edges of the material, and the edge chipping cleaning mechanism 22 is used to clean the dirt on the edge chipping detection mechanism 21, such as dust, debris, etc.

[0070] Specifically, the edge collapse detection mechanism 21 includes a second light source assembly 211 and a second camera assembly 212, and at least a portion of the second light source assembly 211 is disposed above the conveyor belt 30, so that when the material passes through the front and rear edge collapse detection devices 20, the material can pass through the second light source assembly 211. The second camera assembly 212 is disposed above the second light source assembly 211, and is used to perform image detection on the front and rear edges of the material, wherein the second camera assembly 212 is substantially the same as the first camera assembly 112, and an industrial camera such as an area array camera and / or a line array camera may also be selected.

[0071] In order to clearly illustrate the technical solution of the present application, the following is also provided: Figure 7 The up-down, left-right, front-back directions shown are the up-down, left-right, front-back directions of the second light source assembly 211. It should be noted that the height direction described in the following section is parallel to the up-down direction of the second light source assembly 211.

[0072] The edge chip cleaning mechanism 22 includes a second wind knife 221, which is used to clean the second light source assembly 211. The second wind knife 221 has the freedom of movement relative to the second light source assembly 211 in the height direction. When the material is image-detected, the second wind knife 221 moves to the standby position to prevent the second wind knife 221 from affecting the result of the image detection. When the material is conveyed, the second wind knife 221 moves to the working position to clean the second light source assembly 211.

[0073] like Figure 8 As shown, further, the second light source assembly 211 includes a light source compartment 2111 and a light emitting unit 2112 disposed in the light source compartment 2111 (see Fig.11), the light source bin 2111 includes a light-transmitting surface 2111a facing the second shooting component 212, and the light generated by the light-emitting unit 2112 can be emitted from the light-transmitting surface 2111a. Therefore, the cleanliness of the light-transmitting surface 2111a directly affects the image detection result of the material. When performing image detection on the material, the second wind knife 221 is in the standby position, and the position of the second wind knife 221 is lower than the position of the light-transmitting surface 2111a to avoid the second wind knife 221 sweeping the light-transmitting surface 2111a when performing image detection on the material, causing deviation in the image detection result. When conveying the material, the second wind knife 221 is in the working position, and the position of the second wind knife 221 is higher than the position of the light-transmitting surface 2111a. At this time, the second wind knife 221 cleans the dirt on the light-transmitting surface 2111a to ensure the cleanliness of the light-transmitting surface 2111a.

[0074] like Fig. 9 As shown, in the example of the present application, the edge collapse cleaning mechanism 22 also includes a second mounting bracket 222, and the second mounting bracket 222 is fixedly connected to the second wind knife 221. In order to enable the second wind knife 221 to move relative to the second light source assembly 211 in the height direction, the second mounting bracket 222 includes a limiting groove 2221 extending in the height direction. The second light source assembly 211 includes a support frame 2113, and the support frame 2113 is distributed on both sides of the light source bin 2111 to support the light source bin 2111. The support frame 2113 is slidably connected to the second mounting bracket 222, and at least part of the support frame 2113 is embedded in the limiting groove 2221. Through the mutual cooperation between the support frame 2113 and the second mounting bracket 222, the second wind knife 221 can move in the height direction. And the maximum moving distance of the second wind knife 221 is limited by the limiting groove 2221, and the maximum moving distance of the second wind knife 221 is the length of the limiting groove 2221 extending in the height direction.

[0075] By providing a freely movable second air knife 221 , the installation position of the second air knife 221 is made more flexible, thereby improving the compactness of the overall structure of the front and rear edge chipping detection device 20 .

[0076] like Fig. 9 and Fig.10 As shown, as an implementation method, the second air knife 221 surrounds and forms a second ventilation cavity 223, and the second air knife 221 has a second blowing portion 2211 distributed along the front-to-back direction of the second light source assembly 211, and the second ventilation cavity 223 is connected to the outside through the second blowing portion 2211. The chipping cleaning structure also includes a second wind speed control unit (not shown) for providing gas, and the second wind speed control unit is connected to the second ventilation cavity 223.

[0077] The specific structure and function of the second wind speed control unit are basically the same as those of the first wind speed control unit 122. The second wind speed control unit includes a control circuit storing programming instructions to achieve control of gas flow rate and gas flow. The second wind speed control unit also includes pneumatic elements connected to the control circuit, which will not be elaborated here.

[0078] Exemplarily, the second wind knife 221 is disposed on the left or right side of the second light source assembly 211, and the second wind knife 221 is a rod-shaped structure, and extends along the front-rear direction of the second light source assembly 211. One end of the second wind knife 221 is closed, and the other end forms an opening, and the second wind knife 221 is connected to the second wind speed control unit through the opening.

[0079] Specifically, the second blowing part 2211 includes a third air hole 2211a and a fourth air hole 2211b, and the third air hole 2211a and the fourth air hole 2211b are distributed along the height direction, and the third air hole 2211a is located above the fourth air hole 2211b. The light-transmitting surface 2111a is cleaned through the upper and lower air holes to improve the cleaning effect of the chipped edge cleaning mechanism 22.

[0080] It should be noted that the number of the third air holes 2211a and the number of the fourth air holes 2211b are both set to be multiple, and the present application does not specifically limit the number of the third air holes 2211a and the fourth air holes 2211b.

[0081] The axis of the third air hole 2211 a is parallel to the left-right direction of the second light source assembly 211 , and the fourth air hole 2211 b is inclined relative to the third air hole 2211 a .

[0082] Optionally, the axis of the third air hole 2211a is parallel to the left-right direction of the second light source assembly 211, the fourth air hole 2211b is inclined toward the light-transmitting surface 2111a, and an angle is formed between the axis of the fourth air hole 2211b and the light-transmitting surface 2111a.

[0083] Optionally, the axis of the third air hole 2211a is parallel to the left-right direction of the second light source assembly 211, the axis of the fourth air hole 2211b is parallel to the light-transmitting surface 2111a, and the axis of the fourth air hole 2211b forms an angle with the axis of the third air hole 2211a. The application does not specifically limit the inclination direction of the fourth air hole 2211b.

[0084] Through the above arrangement, the second air knife 221 can move relative to the second light source assembly 211 in the height direction, making the installation position of the second air knife 221 more flexible and avoiding the interference of the second air knife 221 with the image detection result. In addition, by setting two groups of air holes in different directions, the cleaning ability of the second air knife 221 is improved, thereby improving the detection effect of the edge collapse detection mechanism 21.

[0085] like Fig.11 and Fig.12 As shown, as an implementation, the second light source assembly 211 also includes a reflective unit 2114 disposed in the light source bin 2111. The light source bin 2111 is connected along the front-to-back direction of the second light source assembly 211, and forms a feed channel 2115 for materials to enter and exit the light source bin 2111. The conveyor belt 30 passes through the feed channel 2115, so that the materials can enter the light source bin 2111 along the rear of the light source bin 2111, and leave the light source bin 2111 through the front of the light source bin 2111, and the materials complete the detection of the front and rear edges of the materials in the light source bin 2111. A light-transmitting portion 2111b that penetrates along the height direction is provided on one side end surface of the light source chamber 2111 facing the second shooting component 212 (i.e., the light-transmitting surface 2111a). The light-transmitting portion 2111b extends along the left-right direction of the second light source component 211. The light-transmitting portion 2111b is a hollow groove on the light-transmitting surface 2111a, so that the light generated by the light-emitting unit 2112 can leave the light source chamber 2111 through the light-transmitting portion 2111b and be acquired by the second shooting component 212.

[0086] The light emitting unit 2112 is located above the feeding channel 2115 . When the material enters the light source bin 2111 and is located at the detection position, the light emitting unit 2112 illuminates the front / rear edge of the material.

[0087] The reflective unit 2114, at least part of which is located below the feed channel 2115, emits the light emitted by the light-emitting unit 2112 along the light-transmitting portion 2111b, and the second shooting component 212 collects the light emitted by the light-transmitting portion 2111b and performs image detection on the material. The second shooting component 212 transmits the obtained material image to the control terminal, and the control terminal identifies, analyzes and calculates the material image to confirm whether there are defects on the front and rear edges of the material.

[0088] The above configuration reduces the cost of the front and rear edge chipping detection device 20. In addition, the technical solution of the present application only needs to set up a second light source assembly 211 to realize image detection of the front and rear edges of the material, making the overall structure of the front and rear edge chipping detection device 20 more compact.

[0089] As an implementation, the light emitting unit 2112 includes a first light source 2112a and a second light source 2112b, which are distributed along the front-to-back direction and are mirror-symmetrical, wherein the first light source 2112a is located behind the second light source 2112b.

[0090] The reflection unit 2114 includes a first reflector 2114a and a second reflector 2114b, which are located below the feed channel 2115, distributed along the front-to-back direction and mirror-symmetrical, wherein the first reflector 2114a is located on the rear side of the second reflector 2114b.

[0091] When the conveyor belt 30 transports the material to the first detection position, the front edge of the material is located between the first light source 2112a and the first reflector 2114a, and the light emitted by the first light source 2112a illuminates the material. Part of the light that is not blocked by the material passes through the material and illuminates the first reflector 2114a. The light is emitted along the light-transmitting portion 2111b out of the light source bin 2111 through the first reflector 2114a, and the second shooting component 212 collects the light emitted by the light-transmitting portion 2111b and performs image detection on the material.

[0092] When the conveyor belt 30 conveys the material to the second detection position, the rear edge of the material is located between the second light source 2112b and the second reflector 2114b. The part of the light emitted by the second light source 2112b that is not blocked by the material passes through the material and shines on the second reflector 2114b. The light is emitted along the light-transmitting portion 2111b out of the light source bin 2111 through the second reflector 2114b. The second shooting component 212 collects the light emitted by the light-transmitting portion 2111b and performs image detection on the material.

[0093] Through the above arrangement, the front and rear edges of the material can be detected. Since the light propagates in the light source bin 2111, light leakage can be avoided, thereby improving the imaging effect of the material image.

[0094] Since the area of ​​the light-transmitting portion 2111b is relatively fixed, in order to prevent the light reflected by the first reflector 2114a or the second reflector 2114b from completely passing through the light-transmitting portion 2111b, more reflectors may be provided to change the light path so that the light reflected by the first reflector 2114a or the second reflector 2114b can completely pass through the light-transmitting portion 2111b, thereby improving the imaging effect of the material image and providing the material image with a clearer boundary between light and dark.

[0095] As an implementation method, the reflection unit 2114 also includes a third reflector 2114c and a fourth reflector 2114d, which are located above the feed channel 2115, distributed along the front-to-back direction and mirror-symmetrical, wherein the third reflector 2114c is located in front of the fourth reflector 2114d.

[0096] When the conveyor belt 30 transports the material to the first detection position, the front edge of the material is located between the first light source 2112a and the first reflector 2114a, and the light emitted by the first light source 2112a illuminates the material. Part of the light that is not blocked by the material passes through the material and illuminates the first reflector 2114a, and the light is reflected by the first reflector 2114a to the third reflector 2114c, and then emitted from the light source bin 2111 along the light-transmitting portion 2111b by the third reflector 2114c. The second shooting component 212 collects the light emitted by the light-transmitting portion 2111b and performs image detection on the material.

[0097] When the conveyor belt 30 conveys the material to the second detection position, the rear edge of the material is located between the second light source 2112b and the second reflector 2114b, and the part of the light emitted by the second light source 2112b that is not blocked by the material passes through the material and shines on the second reflector 2114b, and is reflected by the second reflector 2114b to the fourth reflector 2114d, and then is emitted along the light-transmitting portion 2111b out of the light source bin 2111 through the fourth reflector 2114d, and the second shooting component 212 collects the light emitted by the light-transmitting portion 2111b and performs image detection on the material.

[0098] Furthermore, the number of light-transmitting portions 2111b is set to two, and the two light-transmitting portions 2111b are distributed along the front-to-back direction of the second light source assembly 211, the front light-transmitting portion 2111b allows the light generated by the first light source 2112a to pass through, and the rear light-transmitting portion 2111b allows the light generated by the second light source 2112b to pass through.

[0099] like Fig.12 As shown, optionally, the light-transmitting surface 2111a has a heat dissipation portion 2111c that penetrates along the height direction, and the heat dissipation portion 2111c is located between two light-transmitting portions 2111b distributed front and back to avoid overheating and damage of the light-emitting unit 2112 and extend the service life of the device.

[0100] As an implementation, the second light source assembly 211 further includes a chamfered light source 2116 (see Figure 8 ), the chamfered light source 2116 is installed in the light source bin 2111 and is respectively arranged on the left and right sides of the light source bin 2111. The chamfered light source 2116 is arranged below the feed channel 2115 to reinforce the light at the left and right ends of the light-transmitting portion 2111b.

[0101] When the conveyor belt 30 transports the material to the first detection position or the second detection position, the chamfering light source 2116 irradiates the material upward, and part of the light not blocked by the material passes through the material and through the light-transmitting portion 2111b. The second shooting component 212 collects the light emitted by the light-transmitting portion 2111b and performs image detection on the material to confirm whether the chamfer of the material is complete.

[0102] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the claims attached to this application.

Claims

1. A size detection device, used in silicon wafer sorting system, It is characterized in that include: A material detection mechanism (11), the material detection mechanism (11) comprising a first light source assembly (111) and a first shooting assembly (112), the first light source assembly (111) being used to illuminate the material and being located below the conveyor belt (30), the first shooting assembly (112) being used to perform image detection on the material and being located above the conveyor belt (30); a debris cleaning mechanism (12), the debris cleaning mechanism (12) being mounted on the first light source assembly (111) and being used to clean debris scattered on the first light source assembly (111); Wherein, the first light source assembly (111) comprises a light source (1111), the light source (1111) having a through portion (1112) penetrating the light source (1111) in a height direction, the through portion (1112) and the light source (1111) both having a center line extending in the height direction, the center line of the through portion (1112) substantially coincides with the center line of the first light source assembly (111); the debris cleaning mechanism (12) comprises a first air knife (121), the first air knife (121) is inserted into the through portion (1112), at least a portion of the first air knife (121) protrudes from a light emitting surface (1111a) of the light source (1111), and sweeps the debris from the through portion (1112) to the edge direction of the light source (1111); The first air knife (121) comprises a first ventilation cavity (123) and a first blowing portion (1213) distributed around the center line of the through portion (1112); the first ventilation cavity (123) is connected to the outside through the first blowing portion (1213); the first air knife (121) comprises an annular side wall (1211) and a bottom cover (1212) covered on the side wall (1211); the side wall (1211) surrounds and forms the first ventilation cavity (123); the bottom cover (1212) closes the first ventilation cavity (123) in the height direction; and the first blowing portion (1213) is evenly distributed on the outer peripheral surface of the side wall (1211).

2. The size detection device according to claim 1, It is characterized in that The debris cleaning mechanism (12) comprises a first wind speed control unit (122) for providing gas, and the first wind speed control unit (122) is in communication with the first ventilation cavity (123).

3. The size detection device according to claim 2, It is characterized in that The debris cleaning mechanism (12) further comprises a wind knife cover plate (124), wherein the wind knife cover plate (124) is disposed below the first wind knife (121) and is fixedly connected to the first wind knife (121), the wind knife cover plate (124) having an air passage (1241) extending along the height direction, and the first wind speed control unit (122) is connected to the first ventilation cavity (123) via the air passage (1241); And / or, the first blowing portion (1213) comprises a first air hole (1213a) and a second air hole (1213b), the interval between the first air hole (1213a) and the second air hole (1213b) in the height direction is greater than or equal to 0, the axis of the first air hole (1213a) passes through the center line of the through portion (1112), and the second air hole (1213b) is arranged obliquely relative to the first air hole (1213a); And / or, the light source (1111) comprises a light emitting surface (1111a) facing the first shooting component (112), and the first blowing portion (1213) is located above the light emitting surface (1111a).

4. The size detection device according to claim 2, It is characterized in that The first light source assembly (111) comprises a first light source bracket (1113) for supporting the light source (1111), and the debris cleaning mechanism (12) is fixedly connected to the first light source bracket (1113).

5. The size detection device according to claim 4, It is characterized in that The debris cleaning mechanism (12) comprises a wind knife cover (124) and a first mounting bracket (125); the wind knife cover (124) is arranged below the first wind knife (121) and is fixedly connected to the first wind knife (121); the wind knife cover (124) has an air passage (1241) that passes through along the height direction; the first wind speed control unit (122) is connected to the first ventilation cavity (123) through the air passage (1241); the side of the wind knife cover (124) that faces away from the first wind knife (121) is fixedly connected to the first mounting bracket (125); and the first mounting bracket (125) is integrated on the first light source bracket (1113).

6. A silicon wafer sorting system, comprising the size detection device according to any one of claims 1 to 5, It is characterized in that include: A front and rear edge collapse detection device (20), the front and rear edge collapse detection device (20) comprising an edge collapse detection mechanism (21) and an edge collapse cleaning mechanism (22), the edge collapse detection mechanism (21) being used to detect whether there are defects on the front and rear edges of the material, and the edge collapse cleaning mechanism (22) being installed on the edge collapse detection mechanism (21) and being used to clean the edge collapse detection mechanism (21); The edge chipping detection mechanism (21) comprises a second light source assembly (211) for irradiating the material and a second shooting assembly (212) for performing image detection on the material, wherein the second shooting assembly (212) is located above the second light source assembly (211); the edge chipping cleaning mechanism (22) comprises a second air knife (221) for cleaning the second light source assembly (211), wherein the second air knife (221) is connected to the second light source assembly (211) and has the freedom of movement relative to the second light source assembly (211) in the height direction, and when performing image detection on the material, the second air knife (221) moves to a standby position; when conveying the material, the second air knife (221) moves to a working position to clean the second light source assembly (211).

7. The silicon wafer sorting system according to claim 6, It is characterized in that The second light source assembly (211) comprises a light source chamber (2111), the light source chamber (2111) comprising a light-transmitting surface (2111a) facing the second shooting assembly (212); when the second wind knife (221) is in the standby position, the second wind knife (221) is lower than the light-transmitting surface (2111a); when the second wind knife (221) is in the working position, the second wind knife (221) is higher than the light-transmitting surface (2111a).

8. The silicon wafer sorting system according to claim 7, It is characterized in that The chipped edge cleaning mechanism (22) comprises a second mounting frame (222), the second wind knife (221) is fixedly connected to the second mounting frame (222), the second mounting frame (222) comprises a limiting groove (2221) extending along the height direction, the second light source assembly (211) comprises a support frame (2113) distributed on both sides of the light source compartment (2111), the support frame (2113) is slidably connected to the second mounting frame (222), and at least a portion of the support frame (2113) is embedded in the limiting groove (2221).

9. The silicon wafer sorting system according to claim 7, It is characterized in that The second air knife (221) surrounds and forms a second ventilation cavity (223); the second air knife (221) has a second blowing portion (2211) distributed along the front-to-rear direction of the second light source assembly (211); the second ventilation cavity (223) is connected to the outside through the second blowing portion (2211); the chipped edge cleaning mechanism (22) comprises a second wind speed control unit for providing gas, and the second wind speed control unit is connected to the second ventilation cavity (223).

10. The silicon wafer sorting system according to claim 9, It is characterized in that The second blowing portion (2211) comprises a third air hole (2211a) and a fourth air hole (2211b) distributed along the height direction, the third air hole (2211a) is located above the fourth air hole (2211b), the axis of the third air hole (2211a) is substantially parallel to the light-transmitting surface (2111a), and the fourth air hole (2211b) is arranged obliquely relative to the third air hole (2211a).

11. A silicon wafer sorting system, comprising the size detection device according to any one of claims 1 to 5, It is characterized in that The silicon wafer sorting system also includes: A front and rear edge chipping detection device (20), the front and rear edge chipping detection device (20) comprising an edge chipping detection mechanism (21), the edge chipping detection mechanism (21) being used to detect whether there are defects on the front and rear edges of a material, the edge chipping detection mechanism (21) comprising a second light source component (211) for irradiating the material and a second shooting component (212) for performing image detection on the material, the second shooting component (212) being located above the second light source component (211); Wherein, the second light source assembly (211) comprises: A light source bin (2111), the light source bin (2111) comprising a feeding channel (2115) extending in a front-to-rear direction of the second light source assembly (211), a light-transmitting portion (2111b) extending in a height direction is provided on an end surface of the light source bin (2111) facing the second shooting assembly (212), the light-transmitting portion (2111b) extending in a left-right direction of the second light source assembly (211); a light emitting unit (2112), the light emitting unit (2112) being installed in the light source bin (2111) and being located above the feeding channel (2115); when the material enters the light source bin (2111) and is in a detection position, the light emitting unit (2112) illuminates the front / rear edge of the material; A reflection unit (2114), wherein the reflection unit (2114) is installed in the light source bin (2111), and at least a portion of the reflection unit (2114) is located below the feed channel (2115). The reflection unit (2114) emits the light emitted by the light-emitting unit (2112) along the light-transmitting portion (2111b), and the second shooting component (212) collects the light and performs image detection on the material.

12. The silicon wafer sorting system according to claim 11, It is characterized in that The light-emitting unit (2112) comprises a first light source (2112a) and a second light source (2112b), wherein the first light source (2112a) and the second light source (2112b) are distributed along the front-to-back direction and are mirror-symmetrical, and the first light source (2112a) is located at the rear side of the second light source (2112b); The reflection unit (2114) comprises a first reflector (2114a) and a second reflector (2114b), wherein the first reflector (2114a) and the second reflector (2114b) are located below the feed channel (2115), are distributed along the front-to-back direction, and are mirror-symmetrical, wherein the first reflector (2114a) is located on the rear side of the second reflector (2114b).

13. The silicon wafer sorting system according to claim 12, It is characterized in that The reflection unit (2114) further comprises a third reflector (2114c) and a fourth reflector (2114d), wherein the third reflector (2114c) and the fourth reflector (2114d) are located above the feed channel (2115), are distributed along the front-to-back direction and are mirror-symmetrical, and the third reflector (2114c) is located in front of the fourth reflector (2114d).

14. The silicon wafer sorting system according to claim 11, It is characterized in that The second light source assembly (211) further comprises a chamfered light source (2116), wherein the chamfered light source (2116) is disposed on the left and right sides of the light source bin (2111) and is located below the feed channel (2115), and the chamfered light source (2116) is used to illuminate the left and right ends of the light-transmitting portion (2111b).

Images