A fully automatic eutectic bonding device and its use method

Abstract

The present invention relates to the field of semiconductor packaging technology, and discloses a fully automatic eutectic patch device and a method of using the same, comprising a workbench, an operating table fixedly connected to the top of the workbench, a support seat fixedly connected to the top of the operating table, an air pump fixedly connected to the top of the support seat, and a eutectic patch mechanism, the eutectic patch mechanism comprising an air intake pipe connected to one side of the air pump, an exhaust pipe connected to the side of the air pump away from the air intake pipe, one end of the exhaust pipe connected to a conversion box, one end of the conversion box fixedly connected to one side of the operating table, a limit shell and a clamping plate move downward at the same time, the clamping plate drives the chip to fall, the limit shell and the clamping plate enter the interior of the card slot, the accuracy of the chip during solidification is enhanced, because the magnetic block drives the magnetic ring to move downward, the extrusion force between the chip and the base is generated according to the magnetic connection between the magnetic block and the magnetic ring, thereby preventing the extrusion force from being too large and damaging the chip and the base, and enhancing the protection effect of the device.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a fully automatic eutectic chip mounting device and a method for using the same. Background Art

[0002] There are two main methods of commonly used die bonding methods, one is epoxy resin (conductive glue) bonding, and the other is eutectic bonding. Eutectic bonding avoids chip contamination by organic impurities in epoxy resin, enhances bonding strength, reduces thermal resistance, and improves the long-term stability of device storage.

[0003] During the cooling and curing process of existing eutectic bonding, workers usually align the chip and the base by hand. This operation cannot accurately fit the two together, which will affect the electrical connection of the chip, resulting in poor connection or short circuit. In addition, there may be unexhausted gas inside the adhesive during curing, which will cause a mismatch in shrinkage between the two, increasing the risk of mismatch. Summary of the invention

[0004] The object of the present invention is to provide a fully automatic eutectic bonding equipment and a method of using the same to solve the problems raised in the above background technology.

[0005] In order to solve the above technical problems, the present invention is achieved through the following technical solutions:

[0006] The present invention is a fully automatic eutectic patch equipment, comprising a workbench, the top of the workbench is fixedly connected to an operating table, the top of the operating table is fixedly connected to a support seat, the top of the support seat is fixedly connected to an air pump, and also includes a eutectic patch mechanism, the eutectic patch mechanism includes an intake pipe connected to one side of the air pump, the side of the air pump away from the intake pipe is connected to an exhaust pipe, one end of the exhaust pipe is connected to a conversion box, one end of the conversion box is fixedly connected to one side of the operating table, the inner wall of the conversion box is sleeved and fixedly connected with a condenser, and one end of the intake pipe is provided with a patch assembly.

[0007] Furthermore, the patch assembly includes a connecting ring connected to the end of the suction pipe away from the air pump, the end of the connecting ring away from the suction pipe is connected to a pneumatic suction cup, the outer wall of the connecting ring is sleeved and fixedly connected with a diamond ring, and the outer wall of the diamond ring is fixedly connected with a plurality of cross blocks around, and the bottom of the cross block is fixedly connected to a limiting shell.

[0008] Furthermore, sliding rods are respectively penetrated and slidably connected to the outer wall of the limiting shell, one end of the sliding rod is fixedly connected to a clamping plate, a side of the clamping plate close to the sliding rod is fixedly connected to a return spring, one end of the return spring is fixedly connected to the outer wall of the limiting shell, the end of the sliding rod away from the clamping plate is fixedly connected to a clamping plate, and the end of the cross block away from the diamond ring is fixedly connected to a magnetic ring.

[0009] Furthermore, a connecting frame is fixedly connected to the top of the diamond ring, and elastic tubes are fixedly connected to the two sides of the top of the connecting frame respectively. One end of the elastic tube is connected to the bottom of the inner wall of the conversion box, and a vertical rod is passed through and slidably connected to the top of one end of the connecting frame, and the top of the vertical rod is fixedly connected to the bottom of the outer wall of the conversion box.

[0010] Furthermore, a lifting assembly is provided on the inner wall of the magnetic ring, and the lifting assembly includes a vertical tube slidably connected to the inner wall of the magnetic ring, the top of the vertical tube is connected to the bottom of the inner wall of the conversion box, and a plurality of elastic ropes are fixedly connected around the top of the inner wall of the conversion box, one end of the elastic rope is fixedly connected to a piston, and the piston is arranged inside the vertical tube.

[0011] Furthermore, a magnetic block is fixedly connected to the bottom of the piston, a round rod is fixedly connected to the bottom of the magnetic block, a square groove is opened on one side of the outer wall of the bottom end of the vertical tube, a cross bar is fixedly connected to one side of the inner wall of the square groove, and a rotating plate is sleeved and rotatably connected to the outer wall of the cross bar.

[0012] Furthermore, a bearing assembly is provided on the top of the workbench, and the bearing assembly includes a square shell seat fixedly connected to the center of the top of the workbench, a plurality of track holes are respectively opened around the outer wall of the square shell seat, a track block is sleeved and slidably connected to the inner wall of the track hole, a square plate is fixedly connected to one side of the track block, a connecting block is fixedly connected to the side of the track block away from the square plate, an elastic plate is fixedly connected to the side of the connecting block away from the track block, and an air bag is fixedly connected to the bottom of the inner wall of the square shell seat.

[0013] Furthermore, a condensation plate is fixedly connected to the bottom of the inner wall of the airbag, a support ring column is fixedly connected to the center of the bottom of the inner wall of the square shell seat, the inner wall of the airbag is sleeved and contacts the outer wall of the support ring column, a number of sliding holes are respectively opened around the outer wall of the bottom end of the support ring column, a slider is slidably connected to the inner wall of the sliding hole, an extrusion plate is fixedly connected to one side of the slider, four sliders are provided, and a connecting column is fixedly connected between the four sliders.

[0014] Furthermore, the top of the connecting column is fixedly connected to the base, the middle end of the outer wall of the supporting ring column is sleeved and fixedly connected to a fixing plate, a plurality of vibration springs are fixedly connected to the top and sides of the fixing plate, one end of the vibration spring away from the fixing plate is fixedly connected to the bottom of the base, a slot is provided on the top of the base, and the top of the inner wall of the airbag is connected to deflation pipes, one end of the deflation pipes passes through the fixing plate and extends to the outside of the fixing plate, and the top of the deflation pipe is connected to a diffusion bucket.

[0015] A method for using a fully automatic eutectic bonding device comprises the following steps:

[0016] Step 1: Place the coated base at the top center of the base platform, place the chip at the bottom of the pneumatic suction cup, the chip pushes the clamping plate, the clamping plate drives the card plate to move, the card plate drives the reset spring to stretch, and the air pump is started at the same time. Through the settings of the suction pipe, the connecting ring, and the pneumatic suction cup, the chip is adsorbed, and through the settings of the exhaust pipe, the conversion box, the vertical pipe, and the elastic rope, the piston drives the magnetic block to move down, the magnetic block drives the magnetic ring to move down, the magnetic ring drives the cross block to move down, the cross block drives the limit shell to move down, the cross block drives the diamond ring to move down, and the diamond ring drives the connecting ring to move down, thereby solving the problem of inaccurate positioning during chip patching;

[0017] Step 2: When the magnetic block descends, it drives the round rod to move downward. During the downward movement of the round rod, it touches the rotating plate. The untouched end of the rotating plate moves upward, so that the rotating plate pushes the square plate to rise. The square plate drives the track block to rise. The track block drives the connecting block to rise. The connecting block drives the elastic plate to rise. During the rising process of the elastic plate, it comes into contact with the vibration spring, causing the vibration spring to reciprocate. The vibration spring drives the base to reciprocate, thereby solving the problem of bubbles inside the adhesive on the base.

[0018] Step three: the limiting shell and the clamping plate move downward at the same time, the clamping plate drives the chip to fall, the limiting shell and the clamping plate enter the inside of the card slot, the base platform moves downward under force, the base platform drives the connecting column to move downward, the connecting column drives the slider to move downward, the slider drives the extrusion plate to move downward, the extrusion plate squeezes the airbag, and the setting of the airbag, condensation plate, venting pipe, diffusion bucket, diamond ring, connecting frame, and elastic tube is used to solve the problem of uneven cooling process.

[0019] The present invention has the following beneficial effects:

[0020] (1) In the present invention, the limit shell and the clamping plate move downward at the same time, the clamping plate drives the chip to fall, and the limit shell and the clamping plate enter the interior of the card slot, thereby enhancing the accuracy of the chip during solidification. Because the magnetic block drives the magnetic ring to move downward, the extrusion force between the chip and the base is generated based on the magnetic connection between the magnetic block and the magnetic ring, thereby preventing the extrusion force from being too large and damaging the chip and the base, thereby enhancing the protection effect of the device.

[0021] (2) In the present invention, the coated base is placed at the top center of the base platform, and the chip is placed at the bottom of the pneumatic suction cup. The chip pushes the clamping plate, and the clamping plate drives the card plate to move. The card plate drives the reset spring to stretch, thereby strengthening the device's clamping and stabilizing effect on the chip. The air pump is started, and the air pump generates suction that enters the interior of the connecting ring through the suction pipe. The suction enters the interior of the pneumatic suction cup through the connecting ring, so that the pneumatic suction cup adsorbs the chip. At the same time, the other end of the air pump is exhausted, and the airflow enters the interior of the conversion box through the exhaust pipe. The airflow enters the interior of the vertical pipe through the conversion box and pushes the piston, which drives the magnetic block to move downward, which drives the magnetic ring to move downward, which drives the cross block to move downward, and the magnetic ring slides on the outside of the vertical pipe, and the cross block drives the limit shell to move downward, which drives the diamond ring to move downward, and the diamond ring drives the connecting ring to move downward, thereby enhancing the stability during the falling process, and the base platform is always penetrated by the vertical pipe, so that the base on the base platform and the chip during the falling process can be always in an aligned state, thereby enhancing the alignment accuracy during the device patch.

[0022] (3) In the present invention, when the magnetic block descends, it drives the round rod to move downward. During the downward movement of the round rod, it touches the rotating plate. The end of the rotating plate that is not touched moves upward, so that the rotating plate pushes the square plate to rise. The square plate drives the track block to rise. The track block drives the connecting block to rise. The connecting block drives the elastic plate to rise. During the rising process of the elastic plate, it comes into contact with the vibration spring, causing the vibration spring to reciprocate. The vibration spring drives the base to reciprocate. During this vibration process, bubbles can be discharged from the inside of the adhesive, thereby enhancing the compactness of the adhesive and improving the quality between the cured chip and the base.

[0023] (4) In the present invention, the base platform is squeezed, the base platform drives the connecting column to move downward, the connecting column drives the slider to move downward, the slider drives the extrusion plate to move downward, and the extrusion plate squeezes the airbag. Due to the setting of the condensation plate, the cold air flow inside the airbag enters into the diffusion bucket through the vent pipe, thereby cooling the bottom of the base during the curing process. At the same time, the diamond ring drives the connecting frame to move downward, and the connecting frame drives the elastic tube to move downward. Due to the setting of the condenser, the cold air flow enters into the elastic tube through the conversion box, and cools the top of the chip during the curing process, thereby expanding the cooling range during the curing process and enhancing the quality of the base and the chip during the curing process.

[0024] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for describing the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0026] Figure 1 It is a schematic diagram of the overall side structure of the present invention;

[0027] Figure 2 It is a schematic diagram of the overall half-section side structure of the present invention;

[0028] Figure 3 For the present invention Figure 2 A magnified view of middle;

[0029] Figure 4 It is a schematic diagram of a partially half-sectioned side structure of the present invention;

[0030] Figure 5 For the present invention Figure 4 Enlarged view of middle B;

[0031] Figure 6 It is a schematic diagram of a partial top view of the structure of the present invention;

[0032] Figure 7 This is a schematic diagram of the internal half-section side structure of the present invention;

[0033] Figure 8 For the present invention Figure 7 Enlarged view of middle C;

[0034] Fig. 9 It is a schematic diagram of the working process of the present invention.

[0035] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0036] In the figure: 1, workbench; 2, operating table; 3, support seat; 4, air pump; 5, eutectic patch mechanism; 51, suction pipe; 52, exhaust pipe; 53, conversion box; 54, condenser; 55, patch assembly; 56, lifting assembly; 57, bearing assembly; 551, connecting ring; 552, pneumatic suction cup; 553, diamond ring; 554, cross block; 555, limit shell; 556, sliding rod; 557, reset spring; 558, card plate; 559, clamping plate; 5510, magnetic ring; 5511, connecting frame; 5512, vertical rod; 5513, elastic tube; 561, vertical tube; 562, Elastic rope; 563, piston; 564, magnetic block; 565, round rod; 566, square groove; 567, cross bar; 568, rotating plate; 571, square shell seat; 572, track hole; 573, track block; 574, square plate; 575, connecting block; 576, elastic plate; 577, air bag; 578, condensation plate; 579, supporting ring column; 5710, sliding hole; 5711, slider; 5712, extrusion plate; 5713, connecting column; 5714, fixing plate; 5715, vibration spring; 5716, vent pipe; 5717, diffusion bucket; 5718, base platform; 5719, slot. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] Example 1, please refer to Figure 1-Figure 9 As shown, the present invention is a fully automatic eutectic bonding device, comprising a workbench 1, a top of the workbench 1 is fixedly connected to an operating table 2, the purpose of such a setting is to operate the device, the top of the operating table 2 is fixedly connected to a support base 3, the top of the support base 3 is fixedly connected to an air pump 4, and also includes;

[0039] The eutectic patch mechanism 5 includes an air intake pipe 51 connected to one side of the air pump 4, and an exhaust pipe 52 is connected to the side of the air pump 4 away from the air intake pipe 51. One end of the exhaust pipe 52 is connected to a conversion box 53, and one end of the conversion box 53 is fixedly connected to one side of the operating table 2. A condenser 54 is sleeved and fixedly connected to the inner wall of the conversion box 53. The purpose of this arrangement is to generate cold air. A patch assembly 55 is arranged at one end of the air intake pipe 51.

[0040] The patch assembly 55 includes a connecting ring 551 connected to the end of the suction pipe 51 away from the air pump 4. The end of the connecting ring 551 away from the suction pipe 51 is connected to a pneumatic suction cup 552. The outer wall of the connecting ring 551 is sleeved and fixedly connected with a diamond ring 553. The outer wall of the diamond ring 553 is fixedly connected with a plurality of cross blocks 554 around it. The bottom of the cross block 554 is fixedly connected to a limiting shell 555.

[0041] Sliding rods 556 are respectively passed through and slidably connected to the outer wall of the limiting shell 555, and one end of the sliding rod 556 is fixedly connected to a clamping plate 558. The purpose of this arrangement is to prevent the sliding rod 556 from falling off. A return spring 557 is fixedly connected to the side of the clamping plate 558 close to the sliding rod 556, and one end of the return spring 557 is fixedly connected to the outer wall of the limiting shell 555. The end of the sliding rod 556 away from the clamping plate 558 is fixedly connected to a clamping plate 559, and the end of the cross block 554 away from the diamond ring 553 is fixedly connected to a magnetic ring 5510.

[0042] The top of the diamond ring 553 is fixedly connected to a connecting frame 5511, and elastic tubes 5513 are fixedly connected to the two sides of the top of the connecting frame 5511 respectively. One end of the elastic tube 5513 is connected to the bottom of the inner wall of the conversion box 53, and a vertical rod 5512 passes through the top of one end of the connecting frame 5511 and is slidably connected. The purpose of this arrangement is to limit the lifting process. The top of the vertical rod 5512 is fixedly connected to the bottom of the outer wall of the conversion box 53.

[0043] A lifting assembly 56 is provided on the inner wall of the magnetic ring 5510. The lifting assembly 56 includes a vertical pipe 561 slidably connected to the inner wall of the magnetic ring 5510. The top of the vertical pipe 561 is connected to the bottom of the inner wall of the conversion box 53. Several elastic ropes 562 are fixedly connected around the top of the inner wall of the conversion box 53. The purpose of this arrangement is to enable reset. One end of the elastic rope 562 is fixedly connected to a piston 563. The piston 563 is arranged inside the vertical pipe 561.

[0044] The coated base is placed at the top center of the base platform 5718, and the chip is placed at the bottom of the pneumatic suction cup 552. The chip pushes the clamping plate 559, and the clamping plate 559 drives the clamping plate 558 to move. The clamping plate 558 drives the return spring 557 to stretch, thereby strengthening the clamping and stabilizing effect of the device on the chip. The air pump 4 is started, and the air pump 4 generates suction and enters the interior of the connecting ring 551 through the suction pipe 51. The suction enters the interior of the pneumatic suction cup 552 through the connecting ring 551, so that the pneumatic suction cup 552 adsorbs the chip. At the same time, the other end of the air pump 4 is exhausted, and the airflow enters the interior of the conversion box 53 through the exhaust pipe 52, and the airflow enters the vertical pipe 551 through the conversion box 53. 61, the piston 563 is pushed, the piston 563 drives the magnetic block 564 to move downward, the magnetic block 564 drives the magnetic ring 5510 to move downward, the magnetic ring 5510 drives the cross block 554 to move downward, and the magnetic ring 5510 slides on the outside of the vertical tube 561, the cross block 554 drives the limiting shell 555 to move downward, the cross block 554 drives the diamond ring 553 to move downward, and the diamond ring 553 drives the connecting ring 551 to move downward, thereby enhancing the stability during the falling process, and the base platform 5718 is always penetrated by the vertical tube 561, so that the base on the base platform 5718 and the chip during the falling process can be always in an aligned state, thereby enhancing the alignment accuracy when the device is mounted.

[0045] In Example 2, a magnet 564 is fixedly connected to the bottom of the piston 563, a round rod 565 is fixedly connected to the bottom of the magnet 564, a square groove 566 is provided on one side of the outer wall of the bottom end of the vertical tube 561, a cross bar 567 is fixedly connected to one side of the inner wall of the square groove 566, and a rotating plate 568 is sleeved and rotatably connected to the outer wall of the cross bar 567.

[0046] A bearing assembly 57 is provided on the top of the workbench 1, and the bearing assembly 57 includes a square shell seat 571 fixedly connected to the center of the top of the workbench 1, and a plurality of track holes 572 are respectively opened around the outer wall of the square shell seat 571, and a track block 573 is sleeved and slidably connected to the inner wall of the track hole 572, and a square plate 574 is fixedly connected to one side of the track block 573, and a connecting block 575 is fixedly connected to the side of the track block 573 away from the square plate 574, and an elastic plate 576 is fixedly connected to the side of the connecting block 575 away from the track block 573, and an air bag 577 is fixedly connected to the bottom of the inner wall of the square shell seat 571.

[0047] A condensation plate 578 is fixedly connected to the bottom of the inner wall of the airbag 577, a support ring column 579 is fixedly connected to the center of the bottom of the inner wall of the square shell seat 571, the inner wall of the airbag 577 is sleeved and contacts the outer wall of the support ring column 579, a plurality of sliding holes 5710 are respectively provided around the outer wall of the bottom end of the support ring column 579, a slider 5711 is slidably connected to the inner wall of the sliding hole 5710, an extrusion plate 5712 is fixedly connected to one side of the slider 5711, four sliders 5711 are provided, and a connecting column 5713 is fixedly connected between the four sliders 5711.

[0048] The top of the connecting column 5713 is fixedly connected to a base platform 5718, the middle end of the outer wall of the supporting ring column 579 is sleeved and fixedly connected to a fixing plate 5714, a plurality of vibration springs 5715 are fixedly connected to the top and sides of the fixing plate 5714, one end of the vibration spring 5715 away from the fixing plate 5714 is fixedly connected to the bottom of the base platform 5718, a slot 5719 is provided on the top of the base platform 5718, and the top of the inner wall of the airbag 577 is connected to air release pipes 5716, one end of the air release pipes 5716 penetrates the fixing plate 5714 and extends to the outside of the fixing plate 5714, and the top of the air release pipe 5716 is connected to a diffusion bucket 5717. The purpose of this arrangement is to diffuse the airflow.

[0049] When the magnetic block 564 descends, it drives the round rod 565 to move downward. During the downward movement of the round rod 565, it touches the rotating plate 568. The untouched end of the rotating plate 568 moves upward, so that the rotating plate 568 pushes the square plate 574 to rise. The square plate 574 drives the track block 573 to rise. The track block 573 drives the connecting block 575 to rise. The connecting block 575 drives the elastic plate 576 to rise. During the rising process of the elastic plate 576, it comes into contact with the vibration spring 5715, so that the vibration spring 5715 reciprocates. The vibration spring 5715 drives the base platform 5718 to reciprocate. During this vibration process, bubbles can be discharged from the inside of the adhesive, thereby enhancing the density of the adhesive and improving the quality between the cured chip and the base.

[0050] The limiting shell 555 and the clamping plate 559 move downward at the same time, and the clamping plate 559 drives the chip to fall. The limiting shell 555 and the clamping plate 559 enter the interior of the card slot 5719, which enhances the accuracy of chip solidification. Because the magnetic block 564 drives the magnetic ring 5510 to move downward, the extrusion force between the chip and the base is generated according to the magnetic connection between the magnetic block 564 and the magnetic ring 5510, thereby preventing the extrusion force from being too large and damaging the chip and the base, thereby enhancing the protection effect of the device.

[0051] The base platform 5718 is squeezed, and the base platform 5718 drives the connecting column 5713 to move downward, and the connecting column 5713 drives the slider 5711 to move downward, and the slider 5711 drives the extrusion plate 5712 to move downward, and the extrusion plate 5712 squeezes the air bag 577. Due to the setting of the condensation plate 578, the cold air flow inside the air bag 577 enters the interior of the diffusion bucket 5717 through the venting pipe 5716, thereby cooling the bottom of the base during the curing process. At the same time, the diamond ring 553 drives the connecting frame 5511 to move downward, and the connecting frame 5511 drives the elastic tube 5513 to move downward. Due to the setting of the condenser 54, the cold air flow enters the interior of the elastic tube 5513 through the conversion box 53, and cools the top of the chip during the curing process, thereby expanding the cooling range during the curing process and enhancing the quality of the base and the chip during the curing process.

[0052] A method for using a fully automatic eutectic bonding device comprises the following steps:

[0053] Step 1: Place the coated base at the top center of the base platform 5718, place the chip at the bottom of the pneumatic suction cup 552, the chip pushes the clamping plate 559, the clamping plate 559 drives the card plate 558 to move, the card plate 558 drives the reset spring 557 to stretch, and the air pump 4 is started at the same time. Through the settings of the suction pipe 51, the connecting ring 551, and the pneumatic suction cup 552, the chip is adsorbed, and through the settings of the exhaust pipe 52, the conversion box 53, the vertical pipe 561, and the elastic rope 562, the piston 563 drives the magnetic block 564 to move downward, the magnetic block 564 drives the magnetic ring 5510 to move downward, the magnetic ring 5510 drives the cross block 554 to move downward, the cross block 554 drives the limiting shell 555 to move downward, the cross block 554 drives the diamond ring 553 to move downward, and the diamond ring 553 drives the connecting ring 551 to move downward, thereby solving the problem of inaccurate positioning during chip patching;

[0054] Step 2: When the magnetic block 564 descends, it drives the round rod 565 to move downward. During the downward movement of the round rod 565, it touches the rotating plate 568. The untouched end of the rotating plate 568 moves upward, so that the rotating plate 568 pushes the square plate 574 to rise. The square plate 574 drives the track block 573 to rise. The track block 573 drives the connecting block 575 to rise. The connecting block 575 drives the elastic plate 576 to rise. During the rising process of the elastic plate 576, it comes into contact with the vibration spring 5715, so that the vibration spring 5715 reciprocates. The vibration spring 5715 drives the base 5718 to reciprocate, which solves the problem of bubbles inside the adhesive on the base.

[0055] Step three: the limiting shell 555 and the clamping plate 559 move downward at the same time, the clamping plate 559 drives the chip to fall, the limiting shell 555 and the clamping plate 559 enter the interior of the card slot 5719, the base 5718 moves downward under force, the base 5718 drives the connecting column 5713 to move downward, the connecting column 5713 drives the slider 5711 to move downward, the slider 5711 drives the extrusion plate 5712 to move downward, the extrusion plate 5712 squeezes the airbag 577, and the setting of the airbag 577, the condensation plate 578, the venting pipe 5716, the diffusion bucket 5717, and the setting of the diamond ring 553, the connecting frame 5511, and the elastic tube 5513 solves the problem of uneven cooling process.

[0056] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A fully automatic eutectic bonding equipment, characterized by: It comprises a workbench (1), the top of the workbench (1) is fixedly connected to an operating table (2), the top of the operating table (2) is fixedly connected to a support base (3), the top of the support base (3) is fixedly connected to an air pump (4), and further comprises: A eutectic patch mechanism (5), the eutectic patch mechanism (5) comprising an air intake pipe (51) connected to one side of an air pump (4), a side of the air pump (4) away from the air intake pipe (51) being connected to an exhaust pipe (52), one end of the exhaust pipe (52) being connected to a conversion box (53), one end of the conversion box (53) being fixedly connected to one side of an operating table (2), a condenser (54) being sleeved on an inner wall of the conversion box (53) and being fixedly connected thereto, and a patch assembly (55) being provided at one end of the air intake pipe (51); The patch assembly (55) comprises a connecting ring (551) connected to an end of the suction pipe (51) away from the air pump (4); the end of the connecting ring (551) away from the suction pipe (51) is connected to a pneumatic suction cup (552); a diamond ring (553) is sleeved on and fixedly connected to the outer wall of the connecting ring (551); a plurality of cross blocks (554) are fixedly connected to the outer wall of the diamond ring (553); and the bottom of the cross block (554) is fixedly connected to a limit shell (555); Sliding rods (556) are respectively passed through and slidably connected to the outer wall of the limiting shell (555); one end of the sliding rod (556) is fixedly connected to a clamping plate (558); a side of the clamping plate (558) close to the sliding rod (556) is fixedly connected to a return spring (557); one end of the return spring (557) is fixedly connected to the outer wall of the limiting shell (555); one end of the sliding rod (556) away from the clamping plate (558) is fixedly connected to a clamping plate (559); and one end of the cross block (554) away from the diamond ring (553) is fixedly connected to a magnetic ring (5510); The top of the diamond ring (553) is fixedly connected to a connecting frame (5511), and both sides of the top of the connecting frame (5511) are respectively fixedly connected to elastic tubes (5513), one end of the elastic tube (5513) is connected to the bottom of the inner wall of the conversion box (53), and a vertical rod (5512) penetrates and is slidably connected to the top of one end of the connecting frame (5511), and the top of the vertical rod (5512) is fixedly connected to the bottom of the outer wall of the conversion box (53); The inner wall of the magnetic ring (5510) is provided with a lifting assembly (56), the lifting assembly (56) comprising a vertical tube (561) slidably connected to the inner wall of the magnetic ring (5510), the top of the vertical tube (561) being connected to the bottom of the inner wall of the conversion box (53), a plurality of elastic ropes (562) being fixedly connected around the top of the inner wall of the conversion box (53), one end of the elastic rope (562) being fixedly connected to a piston (563), and the piston (563) being arranged inside the vertical tube (561); The bottom of the piston (563) is fixedly connected to a magnetic block (564), the bottom of the magnetic block (564) is fixedly connected to a round rod (565), a square groove (566) is provided on one side of the outer wall of the bottom end of the vertical tube (561), a cross bar (567) is fixedly connected to one side of the inner wall of the square groove (566), and a rotating plate (568) is sleeved on the outer wall of the cross bar (567) and rotatably connected.

2. The fully automatic eutectic bonding equipment according to claim 1, characterized in that: A bearing assembly (57) is arranged on the top of the workbench (1), and the bearing assembly (57) comprises a square shell seat (571) fixedly connected to the center of the top of the workbench (1); a plurality of track holes (572) are respectively opened around the outer wall of the square shell seat (571); a track block (573) is sleeved and slidably connected to the inner wall of the track hole (572); a square plate (574) is fixedly connected to one side of the track block (573); a connecting block (575) is fixedly connected to the side of the track block (573) away from the square plate (574); an elastic plate (576) is fixedly connected to the side of the connecting block (575) away from the track block (573); and an air bag (577) is fixedly connected to the bottom of the inner wall of the square shell seat (571).

3. The fully automatic eutectic bonding equipment according to claim 2, characterized in that: A condensation plate (578) is fixedly connected to the bottom of the inner wall of the airbag (577); a support ring column (579) is fixedly connected to the center of the bottom of the inner wall of the square shell seat (571); the inner wall of the airbag (577) is sleeved on and contacts the outer wall of the support ring column (579); a plurality of sliding holes (5710) are respectively provided around the outer wall of the bottom end of the support ring column (579); a slider (5711) is slidably connected to the inner wall of the sliding hole (5710); an extrusion plate (5712) is fixedly connected to one side of the slider (5711); four sliders (5711) are provided, and a connecting column (5713) is fixedly connected between the four sliders (5711).

4. The fully automatic eutectic bonding equipment according to claim 3, characterized in that: The top of the connecting column (5713) is fixedly connected to a base platform (5718), the middle end of the outer wall of the supporting ring column (579) is sleeved and fixedly connected to a fixing plate (5714), a plurality of vibration springs (5715) are fixedly connected to the top and sides of the fixing plate (5714), one end of the vibration spring (5715) away from the fixing plate (5714) is fixedly connected to the bottom of the base platform (5718), a slot (5719) is provided on the top of the base platform (5718), and the top of the inner wall of the airbag (577) is connected to the surrounding areas with deflation pipes (5716), one end of the deflation pipe (5716) penetrates the fixing plate (5714) and extends to the outside of the fixing plate (5714), and the top of the deflation pipe (5716) is connected to a diffusion bucket (5717).

5. A method for using a fully automatic eutectic bonding device, using the fully automatic eutectic bonding device as claimed in claim 4, characterized in that: The steps include: Step 1: Place the coated base at the top center of the base platform (5718), place the chip at the bottom of the pneumatic suction cup (552), the chip pushes the clamping plate (559), the clamping plate (559) drives the clamping plate (558) to move, the clamping plate (558) drives the return spring (557) to stretch, and at the same time start the air pump (4), through the setting of the suction pipe (51), the connecting ring (551), and the pneumatic suction cup (552), the chip is adsorbed, and through the exhaust pipe ( 52), the conversion box (53), the vertical pipe (561), and the elastic rope (562), the piston (563) drives the magnetic block (564) to move downward, the magnetic block (564) drives the magnetic ring (5510) to move downward, the magnetic ring (5510) drives the cross block (554) to move downward, the cross block (554) drives the limit shell (555) to move downward, the cross block (554) drives the diamond ring (553) to move downward, and the diamond ring (553) drives the connecting ring (551) to move downward; Step 2: When the magnetic block (564) descends, it drives the round rod (565) to move downward. During the downward movement of the round rod (565), it touches the rotating plate (568). The end of the rotating plate (568) that is not touched moves upward, so that the rotating plate (568) pushes the square plate (574) to rise. The square plate (574) drives the track block (573) to rise. The track block (573) drives the connecting block (575) to rise. The connecting block (575) drives the elastic plate (576) to rise. During the upward movement of the elastic plate (576), it contacts the vibration spring (5715), so that the vibration spring (5715) reciprocates. The vibration spring (5715) drives the base (5718) to reciprocate. Step 3: The limiting shell (555) and the clamping plate (559) move downward at the same time, the clamping plate (559) drives the chip to fall, the limiting shell (555) and the clamping plate (559) enter the interior of the card slot (5719), the base platform (5718) moves downward under force, the base platform (5718) drives the connecting column (5713) to move downward, the connecting column (5713) drives the slider (5711) to move downward, the slider (5711) drives the extrusion plate (5712) to move downward, the extrusion plate (5712) squeezes the airbag (577), and the airbag (577), the condensation plate (578), the venting pipe (5716), the diffusion bucket (5717) and the diamond ring (553), the connecting frame (5511) and the elastic tube (5513) are arranged.

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