Heat dissipation device and epitaxial wafer heating device

Abstract

The present invention provides a heat dissipation device and an epitaxial wafer heating device, which relate to the technical field of epitaxial wafer heating devices. The heat dissipation device comprises a base, and mounting positions arranged in an array are arranged on the base. A first main flow channel and a second main flow channel extending along the longitudinal direction of the array, and a first confluence flow channel and a second confluence flow channel extending along the transverse direction of the array are arranged inside the base; a first confluence flow channel and a second confluence flow channel are arranged under each horizontal mounting position; a first branch flow channel connected to the first confluence flow channel, and a second branch flow channel connected to the second confluence flow channel are arranged on each mounting position; in the longitudinal direction, the length of the first confluence flow channel is less than the length of the second confluence flow channel; there is at least one mounting position which is an electrode mounting position, and the electrode mounting position has an electrode mounting portion extending along the vertical direction.

Description

Technical Field

[0001] The invention relates to the technical field of epitaxial wafer heating devices, and in particular to a heat dissipation device and an epitaxial wafer heating device. Background Art

[0002] In the existing epitaxial wafer heating device, a plurality of heat sinks arranged in an array are mounted on the heat dissipation surface of the heat dissipation device, and a chip is mounted on each heat sink.

[0003] The heat dissipation device is provided with a water inlet flow channel and a water return flow channel, and the water inlet flow channel and the water return flow channel are respectively connected with each heat dissipation seat so that the coolant flows through the heat dissipation seat.

[0004] The flow channel design in the existing heat sink is unreasonable, which requires additional electrode insertion area, which will result in a larger surface area of ​​the heat sink. Summary of the invention

[0005] The object of the present invention is to provide a heat dissipation device and an epitaxial wafer heating device to alleviate the technical problem of the large surface area of ​​the existing heat dissipation device.

[0006] In a first aspect, the present invention provides a heat dissipation device, comprising: a base, a plurality of mounting positions arranged in an array on the base, the mounting positions being used to mount the heat dissipation base; a first main flow channel and a second main flow channel extending in the longitudinal direction of the array, and a first confluence flow channel and a second confluence flow channel extending in the transverse direction of the array are arranged inside the base, the first confluence flow channel is connected to the first main flow channel, and the second confluence flow channel is connected to the second main flow channel;

[0007] A first converging flow channel and a second converging flow channel are provided below each horizontal installation position; a first branch flow channel connected to the first converging flow channel and a second branch flow channel connected to the second converging flow channel are provided at each installation position;

[0008] In the longitudinal direction, the length of the first confluence flow channel is shorter than the length of the second confluence flow channel; in the vertical direction, the length of the first confluence flow channel is longer than the length of the second confluence flow channel; the transverse direction, the longitudinal direction and the vertical direction are perpendicular to each other;

[0009] At least one installation position is an electrode installation position, and the electrode installation position has an electrode installation portion extending vertically. The first and second confluence channels below the electrode installation position are arranged longitudinally with the electrode installation portion on the electrode installation position.

[0010] Furthermore, the cross-section of the first converging flow channel is rectangular or elliptical.

[0011] Further, the first converging flow channel includes at least two sub-channels arranged in a vertical direction, and both of the sub-channels are connected to the first main flow channel;

[0012] In the longitudinal direction, the length of the sub-channel is shorter than the length of the second converging flow channel;

[0013] In the vertical direction, the sum of the lengths of all the sub-channels is greater than the length of the second converging flow channel;

[0014] Each first branch flow channel is communicated with all the sub-channels arranged vertically therebelow.

[0015] Furthermore, among the at least two sub-channels distributed in the vertical direction, the sub-channel located at the bottom is tangentially connected to the bottom end of the first main flow channel;

[0016] And / or, the second converging flow channel is tangentially connected to the top of the second main flow channel.

[0017] Furthermore, in the same vertical row of installation positions, the first branch flow channels and the second branch flow channels at each installation position are distributed in the same manner;

[0018] In the longitudinal direction, the first converging flow channel corresponding to the same horizontal installation position is located between the electrode installation portion and the second converging flow channel.

[0019] Furthermore, in the vertical direction, the first main flow channel and the second main flow channel are staggered.

[0020] Further, in the longitudinal direction, there are at least two adjacent installation positions, namely the first installation position and the second installation position, and the second branch flow channel at the first installation position, the first branch flow channel at the first installation position, the first branch flow channel at the second installation position, and the second branch flow channel at the second installation position are arranged in sequence in the longitudinal direction;

[0021] The first installation position and the second installation position share a first converging flow channel.

[0022] Furthermore, in the longitudinal direction, the first converging flow channel is located between the first branch flow channel at the first installation position and the first branch flow channel at the second installation position, and is tangentially connected to the first branch flow channel at the first installation position and the first branch flow channel at the second installation position respectively.

[0023] Furthermore, the heat dissipation device further comprises a plurality of cross beams, which are arranged in the longitudinal direction; the cross beams are used to fix a plurality of heat dissipation seats arranged in the transverse direction; the cross beams comprise fixed ends at both ends thereof, and a limiting portion connected between the two fixed ends;

[0024] The fixed end is connected to the base, a plurality of heat sinks arranged in the transverse direction are located between the two fixed ends, the limiting portion is used to connect with the limiting groove on the side wall of the heat sink, the limiting groove extends in the transverse direction, and the limiting portion is used to prevent the heat sink from moving vertically;

[0025] The limiting parts of two longitudinally adjacent cross beams prevent the heat sink from moving in the longitudinal direction.

[0026] In a second aspect, the present invention provides an epitaxial wafer heating device, comprising the above-mentioned heat dissipation device.

[0027] The present invention has at least the following advantages or beneficial effects:

[0028] The heat dissipation device provided by the present invention comprises: a base, a plurality of installation positions arranged in an array are provided on the base, and the installation positions are used to install the heat dissipation base; a first main flow channel and a second main flow channel extending along the longitudinal direction of the array, and a first confluence flow channel and a second confluence flow channel extending along the transverse direction of the array are provided inside the base, the first confluence flow channel is connected to the first main flow channel, and the second confluence flow channel is connected to the second main flow channel; a first confluence flow channel and a second confluence flow channel are provided below each horizontal installation position; a first branch flow channel connected to the first confluence flow channel, and a second branch flow channel connected to the second confluence flow channel are provided on each installation position; in the longitudinal direction, the length of the first confluence flow channel is less than the length of the second confluence flow channel; in the vertical direction, the length of the first confluence flow channel is greater than the length of the second confluence flow channel; the transverse, longitudinal and vertical directions are perpendicular to each other; at least one installation position is an electrode installation position, and the electrode installation position has an electrode installation portion extending along the vertical direction, and the first confluence flow channel and the second confluence flow channel below the electrode installation position are arranged in the longitudinal direction with the electrode installation portion on the electrode installation position.

[0029] In the prior art, the first bus channel and the second bus channel have the same shape and size. In the present solution, the cross-section of the first bus channel is set to be shorter in the longitudinal direction and longer in the vertical direction, so that the longitudinal space at the positions of the first bus channel and the second bus channel is released, that is, the first bus channel and the second bus channel occupy less longitudinal space, and the electrode mounting portion at the electrode mounting position has setting space, and the electrode vertically inserted into the electrode mounting portion will not be interfered with by the first bus channel and the second bus channel. Therefore, there is no need to additionally expand the longitudinal length of the heat sink in order to set the electrode mounting portion. The longitudinal length of the base in this embodiment is smaller, and the surface area of ​​the heat sink is smaller.

[0030] The epitaxial wafer heating device provided by the present invention includes the above-mentioned heat dissipation device. Because the epitaxial wafer heating device provided by the present invention uses the above-mentioned heat dissipation device, the epitaxial wafer heating device provided by the present invention also has the advantages of the heat dissipation device. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0032] Figure 1 A top view of the heat dissipation device provided in Embodiment 1 of the present invention;

[0033] Figure 2 for Figure 1 A partial enlarged view of position B in the middle;

[0034] Figure 3 for Figure 1 Cross-sectional view in CC direction;

[0035] Figure 4 for Figure 3 A partial enlarged view of the middle G position;

[0036] Figure 5 for Figure 1 Cross-sectional view in the middle DD direction;

[0037] Figure 6 for Figure 5 A partial enlarged view of the H position in the middle;

[0038] Figure 7 for Figure 1 Cross-sectional view in the EE direction;

[0039] Figure 8 for Figure 1 Cross-sectional view in the FF direction;

[0040] Fig. 9 for Figure 1 Sectional view in the AA direction;

[0041] Fig.10 A schematic diagram of an assembly surface of a heat dissipation device provided in Embodiment 1 of the present invention;

[0042] Fig.11 for Fig.10 A partial enlarged view of the middle L position;

[0043] Fig.12 A schematic diagram of a heat sink that cooperates with the heat sink provided in Example 1 of the present invention;

[0044] Fig.13 A cross-sectional view of a heat dissipation device provided in Embodiment 2 of the present invention;

[0045] Fig.14 A cross-sectional view of the heat dissipation device provided in Example 3 of the present invention.

[0046] Icons: 100-base; 111-first opening; 112-second opening; 120-first main flow channel; 130-second main flow channel; 140-first confluence flow channel; 141-sub-channel; 150-second confluence flow channel; 160-first branch flow channel; 170-second branch flow channel; 180-electrode installation position; 181-electrode installation portion;

[0047] 200-heat sink; 210-limiting slot; 220-first limiting half slot; 230-second limiting half slot; 240-combination hole;

[0048] 300 - cross beam; 310 - fixed end; 320 - limiting portion; 321 - limiting through hole. DETAILED DESCRIPTION

[0049] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0050] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0051] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0052] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the invention is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0053] In addition, the terms "horizontal", "vertical" and the like do not mean that the components are required to be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0054] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0055] Example 1

[0056] like Figure 1-Figure 9 As shown, the heat dissipation device provided by the present invention includes: a base 100, and the top surface of the base 100 can be circular or square.

[0057] like Figure 1-Figure 6 As shown, the top surface of the base 100 is provided with a plurality of mounting positions arranged in an array, and the mounting positions are used to mount the heat sink 200. The mounting positions support the bottom surface of the heat sink 200, and the surface of the mounting positions is provided with a first opening 111 and a second opening 112, the first opening 111 is connected to the first branch flow channel 160, and the second opening 112 is connected to the second branch flow channel 170. Fig.12 As shown, a first joint connected to the first through hole and a second joint connected to the second through hole are provided on the bottom surface of the heat sink 200 , so as to realize the flow of the coolant in the heat sink 200 .

[0058] like Figure 3-Figure 6 As shown, a first main flow channel 120 and a second main flow channel 130 extending in the longitudinal direction of the array are provided inside the base 100. The first main flow channel 120 and the second main flow channel 130 are provided at the side of the base 100. A first confluence flow channel 140 and a second confluence flow channel 150 extending in the transverse direction of the array are also provided inside the base 100. The first confluence flow channel 140 is connected to the first main flow channel 120, and the second confluence flow channel 150 is connected to the second main flow channel 130.

[0059] In this embodiment, the number of the first confluence channels 140 and the number of the second confluence channels 150 are the same as the number of horizontal rows of the array, and correspond one to one. A first confluence channel 140 and a second confluence channel 150 are arranged under each horizontal installation position, and the first confluence channel 140 and the second confluence channel 150 are staggered in the vertical direction to avoid interference.

[0060] A first confluence channel 140 and a second confluence channel 150 are arranged under each horizontal installation position; each installation position may be provided with a first branch channel 160 extending vertically and connected to the first confluence channel 140, and a second branch channel 170 extending vertically and connected to the second confluence channel 150; longitudinally, the length of the first confluence channel 140 is smaller than the length of the second confluence channel 150.

[0061] like Figure 4 As shown, in this embodiment, the first confluence flow channel 140 includes at least two sub-channels 141 arranged vertically, and the sub-channels 141 are connected to the first main flow channel 120, and each first branch flow channel 160 is respectively connected to all the sub-channels 141 arranged vertically below it. In the longitudinal direction, the length of the sub-channel 141 is less than the length of the second confluence flow channel 150. For example, the cross-section of the sub-channel 141 can be circular, and the cross-section of the second confluence flow channel 150 is also circular, and the radius r2 of the sub-channel 141 is less than the radius r1 of the second confluence flow channel 150.

[0062] In the vertical direction, the length of the first converging flow channel 140 is greater than the length of the second converging flow channel 150 .

[0063] In this embodiment, in the vertical direction, the sum of the lengths of all sub-channels 141 is greater than the length of the second converging flow channel 150; in this embodiment, the number of sub-channels 141 is two, that is, 2r2 is greater than r1. Therefore, the sum of the cross-sectional areas of all sub-channels 141 under the same transversely arranged multiple installation positions is not less than the cross-sectional area of ​​the second converging flow channel 150, thereby ensuring flow balance.

[0064] In this embodiment, the first main flow channel 120 can be a liquid inlet flow channel, and the second main flow channel 130 can be a liquid outlet flow channel. The coolant enters the base 100 from the first main flow channel 120, and then flows into each sub-channel 141 of the branch flow channel. The coolant in the sub-channel 141 enters the heat sink 200 through the first branch flow channel 160 to dissipate heat from the heat sink 200. The coolant flowing out of the heat sink 200 returns to the base 100 through the second branch flow channel 170, and then flows through the second converging flow channel 150 into the second main flow channel 130, and finally flows out from the base 100.

[0065] like Fig. 9As shown, in the present embodiment, two sub-channels 141 distributed vertically are used to reduce the longitudinal space, so that the longitudinal space occupied by the second confluence channel 150 and the sub-channel 141 is smaller, and the electrode mounting portion 181 on the electrode mounting position 180 has a setting space, and the electrode vertically inserted into the electrode mounting portion 181 will not be interfered by the sub-channel 141 and the second confluence channel 150. Therefore, there is no need to additionally expand the longitudinal length of the heat dissipation device in order to set the electrode mounting portion 181. The longitudinal length of the base 100 in the present embodiment is smaller, and the surface area of ​​the heat dissipation device is smaller.

[0066] The electrode mounting portion 181 may be a hole-shaped structure or a groove-shaped structure.

[0067] Not all installation positions are provided with electrodes. For the sake of distinction, in this application, the installation position where an electrode is installed is named electrode installation position 180. The electrode installation position 180 has an electrode installation portion 181 extending vertically. Figure 1 In the embodiment, the heat sink 200 is not installed at the electrode installation position 180, while the heat sink 200 is installed at other installation positions.

[0068] like Fig. 9 As shown, the first bus channel 140 and the second bus channel 150 below the electrode mounting position 180 and the electrode mounting portion 181 on the electrode mounting position 180 are arranged longitudinally. It is because the longitudinal length of the first bus channel 140 is reduced that the electrode mounting portion 181 is provided. The first bus channel 140, the second bus channel 150 and the electrode mounting portion 181 are arranged longitudinally, the space utilization rate is high, and the heat dissipation device has a compact structure.

[0069] like Figure 4 and Figure 6 As shown, in order to make the structure of the heat dissipation device more compact, among the at least two sub-channels 141 distributed vertically, the lowest sub-channel 141 is tangentially connected to the bottom end of the first main flow channel 120, and the second converging flow channel 150 is tangentially connected to the top end of the second main flow channel 130, thereby utilizing the vertical space and making the vertical length (thickness) of the base 100 smaller.

[0070] like Figure 4 and Figure 6 As shown, in the present embodiment, among the multiple installation positions arranged along the longitudinal direction, the distribution positions of the first branch flow channel 160 and the second branch flow channel 170 of each installation position are the same, and the arrangement manner of the first branch flow channel 160 and the second branch flow channel 170 are the same, so that the arrangement manner of the first joint and the second joint on the heat sink 200 is also the same. During assembly, the same heat sink 200 is used to complete the assembly of the epitaxial wafer heating device.

[0071] like Fig. 9 As shown, in the longitudinal direction, the first convergence channel 140 corresponding to the same horizontal installation position is located between the electrode mounting portion 181 and the second convergence channel 150. The sub-channel 141 with a smaller length in the longitudinal direction reduces the occupation of the longitudinal space and provides space for the electrode mounting portion 181. Therefore, the electrode mounting portion 181 is set on the side of the sub-channel 141 facing away from the second convergence flow, and the sub-channel 141 will not be interfered with by the sub-channel 141 or the second convergence channel 150.

[0072] like Figure 6 As shown, in the vertical direction, the first main flow channel 120 and the second main flow channel 130 are staggered to reduce the vertical occupied space, thereby making the vertical length (thickness) of the base 100 smaller.

[0073] like Figure 10-12 As shown, the heat dissipation device also includes a plurality of beams 300, and the plurality of beams 300 are arranged longitudinally; the beams 300 are used to fix a plurality of heat sinks 200 arranged transversely; the beams 300 include fixed ends 310 located at both ends thereof, and a limiting portion 320 connected between the two fixed ends 310; the fixed ends 310 are connected to the base 100, and the plurality of heat sinks 200 arranged transversely are located between the two fixed ends 310, and the limiting portion 320 is used to connect with the limiting groove 210 on the side wall of the heat sink 200, the limiting groove 210 extends transversely, and the limiting portion 320 is used to prevent the heat sink 200 from moving vertically; the limiting portions 320 of two longitudinally adjacent beams 300 prevent the heat sink 200 from moving longitudinally.

[0074] In the prior art, each heat sink 200 is connected to the base 100 separately. The more heat sinks 200 there are, the longer the assembly time is. In this embodiment, the heat sink 200 is fixed by a crossbeam 300, and multiple heat sinks 200 with the same horizontal distribution are installed by one crossbeam 300. The first crossbeam 300 can be fixed on the base 100 first, and the multiple heat sinks 200 arranged horizontally are placed between the two fixed ends 310 of the first crossbeam 300. The multiple limiting grooves 210 on the multiple heat sinks 200 distributed horizontally are connected to form a whole and face away from the first crossbeam 300; then the limiting portion 320 on the second crossbeam 300 adjacent in the longitudinal direction is placed into the integrated limiting groove 210, and then the fixed end 310 of the second crossbeam 300 is fixedly connected to the base 100. The heat sink 200 of the first horizontal row cannot move vertically under the obstruction of the limiting portion 320. The limiting portion 320 on the first cross beam 300 and the limiting portion 320 on the second cross beam 300 clamp the first transverse heat sink 200 to limit the heat sink 200 in the longitudinal direction.

[0075] A space for accommodating the heat sink 200 is formed between the two fixed ends 310 on the crossbeam 300, and the lateral length of the space matches the lateral total length of the multiple heat sinks 200 that can be accommodated, so as to prevent the heat sink 200 in the middle of the fixed ends 310 from being displaced in the lateral direction. The crossbeam 300 can be used to limit the heat sink 200 in the lateral, longitudinal and vertical directions, and multiple heat sinks 200 in the lateral direction can be fixed in one assembly, which has high assembly efficiency.

[0076] like Fig.12 As shown, the four circumferential sides of the heat sink 200 are sequentially the first side, the second side, the third side and the fourth side, and the limiting groove 210 is arranged on the first side. The second side and the third side may be provided with a first limiting half groove 220 and a second limiting half groove 230, and the first limiting half groove 220 and the second limiting half groove 230 extend in the longitudinal direction. In two heat sinks 200 adjacent to each other in the transverse direction, the first limiting half groove 220 on one heat sink 200 and the second limiting half groove 230 on the other heat sink 200 form a complete combination hole 240. The limiting portion 320 is provided with a limiting through hole 321 extending in the longitudinal direction, and the limiting through hole 321 is aligned with the position of the combination hole 240. The heat dissipation device also includes a limit rod (not shown in the figure), which is inserted into the limit through hole 321 and the combination hole 240 along the longitudinal direction. The limit rod is fixedly connected to the base 100. The insertion end of the limit rod can be provided with a thread. After passing through the combination hole 240 and the limit through hole 321, the threaded end is threadedly connected to the screw hole on the edge of the base 100. The limit rod is used to prevent the heat dissipation seat 200 from moving horizontally and vertically, thereby playing a further positioning role and increasing the structural stability during operation.

[0077] Example 2

[0078] like Fig.13 As shown, the difference from Example 1 is that in this embodiment, the first confluence channel 140 is a whole, and the shape of its cross section is no longer circular. The shape of the cross section of the first confluence channel 140 can be, but is not limited to, a rectangle or an ellipse, and of course, other irregular shapes are also possible. Taking the shape of the cross section of the first confluence channel 140 as a rectangle as an example, in this solution, the shape of the cross section of the first confluence channel 140 is set to a rectangle that is shorter in the longitudinal direction and longer in the vertical direction, so that the longitudinal space where the first confluence channel 140 and the second confluence channel 150 are located is released, that is, the first confluence channel 140 and the second confluence channel 150 occupy less longitudinal space, and the electrode mounting portion 181 on the electrode mounting position 180 has a setting space, and the electrode inserted vertically into the electrode mounting portion 181 will not be interfered by the first confluence channel 140 and the second confluence channel 150, so there is no need to additionally expand the longitudinal length of the heat sink in order to set the electrode mounting portion 181. The longitudinal length of the base 100 in this embodiment is smaller, and the surface area of ​​the heat sink is smaller.

[0079] Example 3

[0080] like Fig.14 As shown, the difference from Example 1 is that, along the longitudinal direction, there are at least two adjacent installation positions, namely the first installation position and the second installation position, and the second branch flow channel 170 at the first installation position, the first branch flow channel 160 at the first installation position, the first branch flow channel 160 at the second installation position, and the second branch flow channel 170 at the second installation position are arranged in sequence along the longitudinal direction; the first installation position and the second installation position share a first confluence flow channel 140.

[0081] The first branch flow channel 160 at the first installation position and the first branch flow channel 160 at the second installation position are arranged adjacent to each other. If the first installation position and the second installation position share a first converging flow channel 140, the number of openings in the base 100 can be reduced, and the difficulty of processing can be reduced. The radius r3 of the sub-channel 141 in this embodiment is greater than the radius r2 of the sub-channel 141 in Example 1, so as to ensure that it fully supplies the installation positions of the two horizontal rows.

[0082] In the longitudinal direction, the first converging channel 140 is located between the first branch channel 160 at the first installation position and the first branch channel 160 at the second installation position, and is tangentially connected to the first branch channel 160 at the first installation position and the first branch channel 160 at the second installation position, respectively. By utilizing the space between the first branch channel 160 at the first installation position and the first branch channel 160 at the second installation position, the connection is achieved by tangential connection, which can reduce the longitudinal space.

[0083] The epitaxial wafer heating device provided by the present invention includes the above-mentioned heat dissipation device. Because the epitaxial wafer heating device provided by the present invention uses the above-mentioned heat dissipation device, the epitaxial wafer heating device provided by the present invention also has the advantages of the heat dissipation device.

[0084] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A heat dissipation device, characterized in that: include: A base (100), the base (100) being provided with a plurality of mounting positions arranged in an array, the mounting positions being used to mount a heat sink (200); the base (100) being provided with a first main flow channel (120) and a second main flow channel (130) extending longitudinally along the array, and a first converging flow channel (140) and a second converging flow channel (150) extending transversely along the array, the first converging flow channel (140) being connected to the first main flow channel (120), and the second converging flow channel (150) being connected to the second main flow channel (130); The first converging flow channel (140) and the second converging flow channel (150) are arranged below each horizontal installation position; a first branch flow channel (160) connected to the first converging flow channel (140) and a second branch flow channel (170) connected to the second converging flow channel (150) are arranged at each installation position; In the longitudinal direction, the length of the first converging flow channel (140) is shorter than the length of the second converging flow channel (150); in the vertical direction, the length of the first converging flow channel (140) is longer than the length of the second converging flow channel (150); the transverse direction, the longitudinal direction and the vertical direction are perpendicular to each other; At least one installation position is an electrode installation position (180), the electrode installation position (180) having an electrode installation portion (181) extending in a vertical direction, and a first confluence flow channel (140) and a second confluence flow channel (150) below the electrode installation position (180) being arranged in the longitudinal direction with the electrode installation portion (181) on the electrode installation position (180).

2. The heat dissipation device according to claim 1, characterized in that: The cross-section of the first converging flow channel (140) is rectangular or elliptical.

3. The heat dissipation device according to claim 1, characterized in that: The first converging flow channel (140) comprises at least two sub-channels (141) arranged in a vertical direction, and the sub-channels (141) are both connected to the first main flow channel (120); In the longitudinal direction, the length of the sub-channel (141) is smaller than the length of the second converging flow channel (150); In the vertical direction, the sum of the lengths of all the sub-channels (141) is greater than the length of the second converging flow channel (150); Each of the first branch flow channels (160) is respectively connected to all the sub-channels (141) arranged vertically therebelow.

4. The heat dissipation device according to claim 3, characterized in that: Among the at least two sub-channels (141) distributed in the vertical direction, the sub-channel (141) located at the bottom is tangentially connected to the bottom end of the first main flow channel (120); And / or, the second converging flow channel (150) is tangentially connected to the top end of the second main flow channel (130).

5. The heat dissipation device according to claim 1, characterized in that: In the same vertical row of installation positions, the first branch flow channels (160) and the second branch flow channels (170) at each installation position are distributed in the same manner; In the longitudinal direction, the first converging flow channel (140) corresponding to the same horizontal installation position is located between the electrode installation portion (181) and the second converging flow channel (150).

6. The heat dissipation device according to claim 1, characterized in that: In the vertical direction, the first main flow channel (120) and the second main flow channel (130) are arranged in a staggered manner.

7. The heat dissipation device according to claim 1, characterized in that: In the longitudinal direction, there are at least two adjacent installation positions, namely a first installation position and a second installation position, and the second branch flow channel (170) at the first installation position, the first branch flow channel (160) at the first installation position, the first branch flow channel (160) at the second installation position, and the second branch flow channel (170) at the second installation position are arranged in sequence in the longitudinal direction; The first installation position and the second installation position share a first converging flow channel (140).

8. The heat dissipation device according to claim 7, characterized in that: In the longitudinal direction, the first converging flow channel (140) is located between the first branch flow channel (160) at the first installation position and the first branch flow channel (160) at the second installation position, and is tangentially connected to the first branch flow channel (160) at the first installation position and the first branch flow channel (160) at the second installation position, respectively.

9. The heat dissipation device according to claim 1, characterized in that: The heat dissipation device further comprises a plurality of crossbeams (300), the plurality of crossbeams (300) being arranged in a longitudinal direction; the crossbeams (300) being used to fix a plurality of heat dissipation seats (200) arranged in a transverse direction; the crossbeam (300) comprises fixed ends (310) at both ends thereof, and a limiting portion (320) connected between the two fixed ends (310); The fixed end (310) is connected to the base (100), a plurality of heat sinks (200) arranged in a transverse direction are located between two fixed ends (310), the limiting portion (320) is used to connect to a limiting groove (210) on a side wall of the heat sink (200), the limiting groove (210) extends in a transverse direction, and the limiting portion (320) is used to prevent the heat sink (200) from moving in a vertical direction; The limiting portions (320) of two longitudinally adjacent cross beams (300) prevent the heat sink (200) from moving in the longitudinal direction.

10. An epitaxial wafer heating device, characterized in that: A heat dissipation device comprising any one of claims 1 to 9.

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