Electrochemical polishing method, system, electronic device and storage medium for metal workpiece

Abstract

The present invention discloses an electrochemical polishing method, system, electronic device and storage medium for a metal workpiece, the method comprising: obtaining the pressure value of the polishing wheel on the metal workpiece, and the rotation speed of the motor or the rotation speed of the polishing wheel; calculating a reference current value based on the pressure value and the rotation speed based on a calculation model; and controlling a power supply to output the reference current value as a polishing current. The embodiment of the present invention adjusts the polishing current value in real time through the pressure value and the rotation speed, thereby eliminating the need to fix the pressure value and the rotation speed, and avoiding the polishing effect being affected by fluctuations in the power supply equipment during the polishing process.

Description

Technical Field

[0001] The present invention relates to the technical field of metal polishing, and in particular to an electrochemical polishing method, system, electronic equipment and storage medium for a metal workpiece. Background Art

[0002] Electrochemical polishing uses the workpiece to be polished as the anode and the insoluble metal as the cathode. Both electrodes are immersed in an electrolytic cell at the same time and direct current is passed through to produce selective anodic dissolution, thereby achieving the effect of increasing the surface smoothness of the workpiece.

[0003] Existing electrochemical polishing is generally divided into two types. One is to treat the workpiece surface purely by electrochemical means. This method has low efficiency and poor surface finish treatment effect. The other is a method of combining electrochemical and mechanical polishing. This method has greatly improved efficiency and better surface finish treatment effect.

[0004] Electrochemical combined with mechanical polishing is currently a common way to improve polishing effects, but there are still some problems with existing electrochemical combined with mechanical polishing:

[0005] 1. The electrochemical parameters and mechanical parameters need to be debugged many times through experience before they can be implemented. It takes a lot of work in the early stage, and the polishing time is relatively long;

[0006] 2. When some parameters are adjusted actively or passively, the polishing effect will deteriorate, and other parameters cannot be adaptively adjusted to match the actively or passively adjusted parameters. Summary of the invention

[0007] In order to overcome the shortcomings of the prior art, the purpose of the embodiments of the present invention is to provide an electrochemical polishing method, system, electronic device and storage medium for a metal workpiece, which can adaptively adjust the polishing current according to electrochemical parameters and / or mechanical parameters to ensure the polishing effect while improving efficiency.

[0008] To solve the above problems, a first aspect of an embodiment of the present invention discloses an electrochemical polishing method for a metal workpiece, which comprises the following steps:

[0009] Obtain the pressure value of the polishing wheel on the metal workpiece, as well as the rotation speed of the motor or the rotation speed of the polishing wheel;

[0010] According to the pressure value and the rotation speed, a reference current value is calculated based on a calculation model;

[0011] The control power supply outputs the reference current value as the polishing current.

[0012] As an optional implementation manner, in the first aspect of the embodiment of the present invention, the reference current value is calculated based on the calculation model according to the pressure value and the rotation speed, including:

[0013] The reference current value is calculated based on the first calculation model:

[0014] ,

[0015] Among them, I0 is the reference current value, β is the relationship coefficient, F is the pressure value, and V is the speed.

[0016] As an optional implementation, in the first aspect of the embodiment of the present invention, the step of obtaining the pressure value of the polishing wheel on the metal workpiece, and the rotation speed of the motor or the rotation speed of the polishing wheel also includes:

[0017] Determine the pressure value and / or the rotation speed according to the polishing stage and the polishing time;

[0018] The polishing stage is divided into rough polishing, medium polishing and fine polishing in order of polishing time, and the pressure value and the rotation speed of the rough polishing, medium polishing and fine polishing decrease in turn;

[0019] The pressure value and / or the rotation speed in each polishing stage gradually decreases with the polishing time sequence, and the reference current value gradually decreases with the polishing time sequence.

[0020] As an optional implementation, in the first aspect of the embodiment of the present invention, determining the pressure value and / or the rotation speed according to the polishing stage and the polishing time includes:

[0021] Determine the target polishing stage of the metal workpiece;

[0022] The pressure value and / or the rotation speed corresponding to the metal workpiece are adjusted according to the target parameter curve corresponding to the target polishing stage, and the target parameter curve is a pressure curve and / or a rotation speed curve.

[0023] As an optional implementation, in the first aspect of the embodiment of the present invention, determining the pressure value and / or the rotation speed according to the polishing stage and the polishing time includes:

[0024] Determine the target polishing stage of the metal workpiece;

[0025] Determine the initial pressure value and / or rotation speed of the target polishing stage according to the target polishing stage and the pH value and temperature of the electropolishing liquid;

[0026] The pressure value and / or the rotation speed of the entire target polishing stage are determined according to the initial pressure value and / or the rotation speed and the pressure change information and / or the rotation speed change information corresponding to the target polishing stage.

[0027] As an optional implementation, in the first aspect of the embodiment of the present invention, obtaining the pressure value of the polishing wheel on the metal workpiece, and the rotation speed of the motor or the rotation speed of the polishing wheel also includes:

[0028] Obtaining the pressure value of the polishing wheel on the metal workpiece, as well as the rotation speed of the motor or the rotation speed of the polishing wheel, and obtaining the pH value of the electro-polishing liquid and the temperature of the electro-polishing liquid;

[0029] According to the pressure value and the rotation speed, a reference current value is calculated based on a calculation model, including:

[0030] A reference current value is calculated based on the second calculation model according to the pressure value, rotation speed, pH value and temperature.

[0031] As an optional implementation manner, in the first aspect of the embodiment of the present invention, the reference current value is calculated based on the second calculation model according to the pressure value, the rotation speed, the pH value and the temperature, including:

[0032] Construct the second computing base model:

[0033] ,

[0034] Among them, I0 is the reference current value, F is the pressure value, V is the speed, PH is the pH value, T is the temperature, , , are respectively the first calculation parameter, the second calculation parameter and the third calculation parameter;

[0035] The first calculation parameter, the second calculation parameter and the third calculation parameter are obtained by fitting through a logistic regression method, and after being substituted into the calculation basic model, a second calculation model is obtained;

[0036] The pressure value, rotation speed, pH value and temperature are input into the second calculation model to obtain the reference current value.

[0037] As an optional implementation manner, in the first aspect of the embodiment of the present invention, the reference current value is calculated based on the second calculation model according to the pressure value, the rotation speed, the pH value and the temperature, including:

[0038] Construct the second computing base model through LSTM network;

[0039] Training the second computing basic model based on the sample data to obtain a trained second computing model;

[0040] The pressure value, rotation speed, pH value and temperature are input into the second calculation model to obtain the reference current value.

[0041] As an optional implementation, in the first aspect of the embodiment of the present invention, the second computing base model of the LSTM network includes an input layer, a hidden layer and an output layer;

[0042] The second computing basic model is trained based on the sample data to obtain a trained second computing model, including:

[0043] Input the sample data into the corresponding first LSTM unit for model training to obtain an input layer;

[0044] Inputting the output result of the input layer into the second LSTM unit for model training to obtain a hidden layer;

[0045] The output result of the hidden layer is input into the third LSTM unit for recognition training to obtain the output layer, and the reference current value result of the output layer is output. The second calculation model is obtained by continuously performing model training until the training requirements are met.

[0046] As an optional implementation, in the first aspect of the embodiment of the present invention, the control power supply outputs the reference current value as the polishing current, including:

[0047] Get the actual polishing current value;

[0048] Inputting the reference current value and the actual polishing current value into a PID control model to obtain a current output value;

[0049] The output current of the power supply is controlled according to the current output value.

[0050] A second aspect of an embodiment of the present invention discloses an electrochemical polishing device for a metal workpiece, comprising:

[0051] An acquisition unit, used to acquire the pressure value of the polishing wheel on the metal workpiece, and the rotation speed of the motor or the rotation speed of the polishing wheel;

[0052] A calculation unit, configured to calculate a reference current value based on a calculation model according to the pressure value and the rotation speed;

[0053] The output unit is used to control the power supply to output the reference current value as the polishing current.

[0054] A third aspect of an embodiment of the present invention discloses an electrochemical polishing system for a metal workpiece, which includes: an electropolishing liquid, a polishing wheel, a motor, a power supply, a pressure sensor, a speed sensor, and a controller;

[0055] The pressure sensor is used to obtain the pressure value of the polishing wheel on the metal workpiece, and the speed sensor is used to collect the speed of the polishing wheel or the speed of the motor driving the polishing wheel to rotate;

[0056] The metal workpiece is immersed in the electropolishing liquid, the polishing wheel is partially or completely placed in the electropolishing liquid, the positive electrode of the power supply is electrically connected to the metal workpiece, and the negative electrode of the power supply is electrically connected to a conductive structure placed in the electropolishing liquid, and the conductive structure is placed in the electropolishing liquid and is located on a side opposite to the surface to be polished of the metal workpiece; or, the electropolishing liquid is sprayed on the part to be polished of the metal workpiece, the positive electrode of the power supply is electrically connected to the metal workpiece, and the negative electrode of the power supply is electrically connected to the polishing wheel through the conductive structure;

[0057] The controller is used to receive the pressure value and the rotation speed, and calculate a reference current value based on the pressure value and the rotation speed based on a calculation model, and then control the power supply to output the reference current value as the polishing current.

[0058] As an optional implementation, in the third aspect of the embodiment of the present invention, the conductive structure is a metal rod or a mercury slip ring; when a metal rod is used, the metal rod is fixedly or rotatably connected to the polishing wheel; when a mercury slip ring is used, the mercury slip ring is rotatably connected to the polishing wheel.

[0059] A fourth aspect of an embodiment of the present invention discloses an electronic device, comprising: a memory storing executable program code; a processor coupled to the memory; the processor calls the executable program code stored in the memory to execute an electrochemical polishing method for a metal workpiece disclosed in the first aspect of the embodiment of the present invention.

[0060] A fifth aspect of an embodiment of the present invention discloses a computer-readable storage medium storing a computer program, wherein the computer program enables a computer to execute an electrochemical polishing method for a metal workpiece disclosed in the first aspect of an embodiment of the present invention.

[0061] A sixth aspect of an embodiment of the present invention discloses a computer program product. When the computer program product is run on a computer, the computer executes an electrochemical polishing method for a metal workpiece disclosed in the first aspect of an embodiment of the present invention.

[0062] A seventh aspect of an embodiment of the present invention discloses an application publishing platform, which is used to publish a computer program product. When the computer program product runs on a computer, the computer executes an electrochemical polishing method for a metal workpiece disclosed in the first aspect of an embodiment of the present invention.

[0063] Compared with the prior art, the embodiments of the present invention have the following beneficial effects:

[0064] 1. The embodiment of the present invention adjusts the polishing current value in real time through the pressure value and the rotation speed, so there is no need to fix the pressure value and the rotation speed, thereby avoiding the polishing effect being affected by the fluctuation of the power supply equipment during the polishing process;

[0065] 2. By setting the pressure curve and speed curve, the polishing parameters can be dynamically adjusted in each polishing stage, so that the polishing effect is further improved;

[0066] 3. Based on logistic regression or neural network algorithm, more parameters that affect the polishing effect are integrated, such as the pH value of the electropolishing liquid and the temperature of the electropolishing liquid (or the surface temperature of the metal workpiece), so as to obtain better polishing effect;

[0067] 4. The power output is controlled by comparing the reference current value and the actual polishing current through the PID algorithm, making the control of the polishing current more accurate and stable, ensuring that the polishing effect can meet expectations. BRIEF DESCRIPTION OF THE DRAWINGS

[0068] Figure 1 It is a schematic flow chart of a method for electrochemical polishing of a metal workpiece disclosed in Embodiment 1 of the present invention;

[0069] Figure 2 It is a schematic diagram of the principle of an electrochemical polishing method for a metal workpiece disclosed in the first embodiment of the present invention;

[0070] Figure 3 It is a schematic flow chart of a method for electrochemical polishing of a metal workpiece disclosed in the second embodiment of the present invention;

[0071] Figure 4 It is a schematic diagram of the principle of an electrochemical polishing method for a metal workpiece disclosed in the second embodiment of the present invention;

[0072] Figure 5 It is a structural schematic diagram of an electrochemical polishing system for a metal workpiece disclosed in Embodiment 3 of the present invention;

[0073] Figure 6 It is a schematic structural diagram of an electrochemical polishing device for a metal workpiece disclosed in a fourth embodiment of the present invention;

[0074] Figure 7 It is a structural schematic diagram of an electronic device disclosed in Embodiment 5 of the present invention. DETAILED DESCRIPTION

[0075] This specific implementation manner is merely an explanation of the present invention and is not a limitation of the present invention. After reading this specification, those skilled in the art may make non-creative modifications to this embodiment as needed, but such modifications are protected by patent law as long as they are within the scope of the claims of the present invention.

[0076] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0077] The term "comprise" and any variations thereof in the specification and claims of the present application are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus comprising a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products or apparatuses.

[0078] In the embodiments of the present invention, words such as "exemplarily" or "for example" are used to indicate examples, illustrations or explanations. Any embodiment or design described as "exemplarily" or "for example" in the embodiments of the present invention should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplarily" or "for example" is intended to present related concepts in a specific way.

[0079] The embodiment of the present invention adjusts the polishing current value in real time through the pressure value and the rotation speed, thereby eliminating the need to fix the pressure value and the rotation speed, thereby avoiding the polishing effect being affected by fluctuations in the power supply equipment during the polishing process. The following is a detailed description with reference to the accompanying drawings.

[0080] Embodiment 1

[0081] See also Figure 1 , Figure 1 It is a schematic flow chart of an electrochemical polishing method for a metal workpiece disclosed in an embodiment of the present invention. The electrochemical polishing of a metal workpiece in the embodiment of the present invention is to perform polishing operations on the metal workpiece simultaneously by electrochemical and mechanical methods. The executor of the embodiment of the present invention is a controller, and the controller can be used to adjust the position of the polishing wheel and / or the metal workpiece, the speed of the motor that drives the polishing wheel to rotate, and the output of the polishing current. In a preferred embodiment of the present invention, a combination of electrochemical and mechanical polishing is used to achieve the polishing of the metal workpiece. The metal workpiece, for example, can be an aluminum plate, an aluminum alloy plate, a stainless steel plate, etc., which is not further limited here.

[0082] Electrochemistry mainly uses electropolishing liquid to produce selective anodic dissolution through direct current. Mechanical polishing uses the front or side of the polishing wheel to polish the surface to be polished of the metal workpiece. The combination of electrochemical and mechanical polishing can be through spraying or immersion. When the spray method is used, the metal workpiece is used as the anode and the polishing wheel is used as the cathode. The electropolishing liquid is sprayed on the surface to be polished, so that an electrolytic reaction occurs to achieve the purpose of electrochemical polishing. At the same time, combined with the polishing of the polishing wheel, electrochemical mechanical polishing is achieved. Another method is to immerse the metal workpiece and the polishing wheel in the electropolishing liquid, with the metal workpiece as the anode and the polishing wheel or inert metal as the cathode to achieve electrochemical mechanical polishing.

[0083] In a preferred embodiment of the present invention, the position of the polishing wheel and the workpiece to be polished can be adjusted by an adjustment mechanism. For example, the front-to-back and left-to-right movement of the workpiece to be polished can be controlled by the X-axis and Y-axis adjustment structures, and the up-and-down movement of the polishing wheel can be controlled by the Z-axis adjustment structure. Of course, in other embodiments, only the position of the polishing wheel or the metal workpiece can be adjusted, and the other structure does not make any adjustment. For example, the position of the polishing wheel can be adjusted by the X-axis, Y-axis and Z-axis adjustment structures, while the position of the metal workpiece does not change.

[0084] In other embodiments, an angle adjustment structure may be provided to adjust the angle of the polishing wheel and / or the metal workpiece.

[0085] The main factors affecting electrochemical mechanical polishing are the pressure between the polishing wheel and the metal workpiece, the rotation speed of the polishing wheel and the polishing current. Therefore, the polishing current can be adjusted by obtaining the pressure value of the polishing wheel on the metal workpiece and the rotation speed of the polishing wheel, thereby achieving the purpose of adaptively adjusting the polishing parameters. In other embodiments, any two of the above parameters can be obtained to obtain the specific value of the remaining parameter.

[0086] like Figure 1 As shown, a method for electrochemical polishing of a metal workpiece comprises the following steps:

[0087] S110, obtaining the pressure value of the polishing wheel on the metal workpiece, and the rotation speed of the motor or the rotation speed of the polishing wheel.

[0088] The pressure value of the polishing wheel on the metal workpiece can be realized through a pressure sensor installed under the metal workpiece. Under normal circumstances, the metal workpiece has a certain gravity. When the polishing wheel polishes it, a certain pressure needs to be applied to the metal workpiece. The difference between the signal value collected by the pressure sensor at this time and the initial gravity of the metal workpiece is regarded as the pressure value of the polishing wheel on the metal workpiece.

[0089] In other embodiments, the pressure value can also be characterized by the displacement of the Z-axis adjustment mechanism (whether it drives the polishing wheel to move up and down or drives the metal workpiece to move up and down). If the polishing wheel is driven by a pulley, the pressure value can also be characterized by the tightness (i.e., tension) of the pulley.

[0090] The rotation speed of the motor or the polishing wheel can be collected through an encoder or a speed sensor. Since there is a certain corresponding relationship between the rotation speed of the motor and the rotation speed of the polishing wheel, it is sufficient to obtain only one of the rotation speeds.

[0091] In a preferred embodiment of the present invention, the pressure value and the rotational speed are collected using the same sampling frequency and the same sampling time point. The controller can simultaneously trigger the pressure sensor and the encoder to start acquiring corresponding signals and send the collected signals to the controller.

[0092] S120 . Calculate a reference current value based on the pressure value and the rotation speed and based on a first calculation model.

[0093] In a preferred embodiment of the present invention, a spray-type electrochemical polishing method is adopted.

[0094] The greater the rotation speed, the higher the efficiency of mechanical polishing, and the greater the polishing current, the higher the efficiency of electrochemical polishing. In order to complete the entire polishing process within the preset time, it can be seen that the rotation speed and polishing current are inversely proportional, and both are related to the pressure of the polishing wheel on the metal workpiece (mechanical polishing is obviously directly related to the polishing pressure, and during electrochemical polishing, an electric field is generated between the polishing wheel and the metal workpiece, so it is also related to the distance between the polishing wheel and the metal workpiece).

[0095] Based on this, the correlation between pressure value, rotation speed and polishing current is constructed, which is recorded as the first calculation model:

[0096] ,

[0097] Among them, I0 is the reference current value, β is the relationship coefficient, F is the pressure value, and V is the speed.

[0098] From this, it can be seen that when the polishing pressure value is maintained unchanged or increased and the rotation speed is reduced, the reference current value (corresponding to the polishing current) will increase. At this time, electrochemical mechanical polishing is mainly electrochemical polishing, supplemented by mechanical polishing. Conversely, if the polishing pressure value is maintained unchanged or reduced and the rotation speed is increased, the reference current value (corresponding to the polishing current) will decrease. At this time, electrochemical mechanical polishing is mainly mechanical polishing, supplemented by electrochemical polishing.

[0099] Of course, there is a constraint value for both polishing pressure and polishing current. If the constraint value is exceeded, the surface to be polished may be damaged. For example, in the polishing scheme for aluminum plate in the embodiment of the present invention, the polishing pressure value is generally set at 12-21N, the polishing current is set at 0.3-0.5A, and the polishing wheel speed is set at 1000-3500rmp. Of course, other constraints can also be set according to the material of the metal workpiece, polishing requirements, etc. Similarly, there are certain constraints for the relationship coefficient, such as 20-50.

[0100] In a preferred embodiment of the present invention, the entire polishing process (for any polishing point) can be divided into three polishing stages: rough polishing, medium polishing and fine polishing. The main polishing method, that is, the proportion of mechanical polishing and electrochemical polishing, can be set for each polishing stage.

[0101] For example, the rough polishing can be set to be mainly mechanical polishing, for which a larger polishing pressure value and a faster rotation speed can be set (the ratio of the pressure value to the rotation speed is smaller than that of other polishing stages). For example, the polishing pressure value is set to 17-21N, and the rotation speed is set to 2500-3200 rpm. At this time, the polishing current is approximately 0.3A.

[0102] During medium polishing, mechanical polishing and electrochemical polishing can occupy a similar proportion. For example, the polishing pressure value is set to 15-17N, and the speed is set to 1500-2000 rpm. At this time, the polishing current is roughly around 0.4A.

[0103] When fine polishing, it is set to mainly electrochemical polishing. For example, the polishing pressure value is set to 12-15N, and the speed is set to 1000-1500rmp accordingly. At this time, the polishing current is roughly around 0.5A.

[0104] Based on this, the polishing pressure value and the polishing wheel speed can be adjusted in real time on the basis of this method to achieve the proportion of mechanical polishing and electrochemical polishing. For example, at the beginning of rough polishing, the polishing pressure value and the polishing wheel speed can be set to the maximum value of the constraint value, and then gradually reduced as the polishing time progresses. For example, the pressure curve and the speed curve can be set in the controller by setting the pressure curve and the speed curve, and the controller adjusts the pressure value and the speed value in real time according to the pressure curve and the speed curve.

[0105] At the same time, you can also set the time of each polishing stage according to polishing requirements, and set the corresponding pressure curve and speed curve according to the time of each polishing stage. Generally, the polishing time ratio of rough polishing, medium polishing and fine polishing can be set to 0.1D, 0.3D and 0.6D, where D is the overall polishing time, which can be set as needed. If you need to shorten the overall polishing time, you can also adjust the proportion of rough polishing appropriately.

[0106] In other embodiments of the present invention, a basic polishing pressure value can be set for each polishing stage, and the proportion of mechanical polishing and electrochemical polishing in the polishing process can be changed by adjusting the rotation speed. For example, polishing pressures of 18 N, 16 N, and 14 N can be set for rough polishing, medium polishing, and fine polishing, respectively.

[0107] S130, controlling the power supply to output the reference current value as the polishing current.

[0108] The reference current value obtained is the polishing current output by the power supply. If the polishing current corresponding to the electrochemical polishing is carried out according to the reference current value, a better polishing effect can be obtained.

[0109] In order to make the power supply output the reference current value, it can be achieved by any of the following methods:

[0110] Method 1: The reference current value can be used as a feedback value and input into a feedback terminal of a power management chip. The power management chip adjusts the output duty cycle based on the feedback value, thereby outputting the reference current value.

[0111] Method 2: To make the polishing current modulation more stable, the polishing current can be controlled by a PID controller. Figure 2 As shown, the actual polishing current is obtained. The acquisition method can be achieved through a current transformer or a current sampling circuit, which is loaded to the positive electrode of the power supply output end to obtain the actual polishing current, and then the reference current value and the actual polishing current are input into a PID control model (mainly including proportional control, integral control and differential control, and the specific control parameters of the three can be obtained and optimized using existing conventional technologies) to obtain the current output value, and then the power supply is controlled to output the current output value. The power supply output current output value can also be based on the feedback method in method one.

[0112] Embodiment 2

[0113] See also Figure 3 , Figure 3 Schematic diagram of a process flow of an electrochemical polishing method for a metal workpiece disclosed in the second embodiment of the present invention. Figure 3 As shown, a method for electrochemical polishing of a metal workpiece comprises the following steps:

[0114] S210, obtaining the pressure value of the polishing wheel on the metal workpiece, the rotation speed of the motor or the rotation speed of the polishing wheel, the pH value of the electro-polishing liquid, and the temperature of the electro-polishing liquid.

[0115] The electropolishing liquid itself, such as the pH value of the electropolishing liquid and the temperature of the electropolishing liquid (or the temperature of the polishing surface), will also have a certain impact on the electrochemical polishing. Although its impact is smaller than the polishing current, polishing voltage and polishing wheel speed, in order to further improve the polishing effect, the pH value and temperature of the electropolishing liquid can also be integrated into the parameters of electrochemical mechanical polishing.

[0116] The pH value of the electropolishing liquid can be collected by a pH sensor, and the temperature of the electropolishing liquid (or the temperature of the polishing surface) can be collected by a temperature sensor.

[0117] S220. Calculate a reference current value based on a second calculation model according to the pressure value of the polishing wheel on the metal workpiece, the rotation speed of the motor or the rotation speed of the polishing wheel, the pH value of the electro-polishing liquid, and the temperature of the electro-polishing liquid.

[0118] For example, the basic polishing pressure value can be determined according to the pH value and temperature of the electro-polishing liquid, and then the reference current value can be adaptively adjusted through the first calculation model based on the method of the first embodiment.

[0119] In a preferred embodiment of the present invention, the pH value and temperature of the electropolishing liquid, as well as the polishing pressure and the polishing wheel speed, can be used as input parameters of the calculation model to determine the reference current value. To distinguish them, the calculation model here is recorded as the second calculation model.

[0120] There are many ways to implement the second calculation model. For example, the polishing pressure, the polishing wheel speed, the pH value of the electro-polishing liquid, and the temperature of the electro-polishing liquid can be used as polishing parameters, and the calculation coefficient of each polishing parameter can be determined by logistic regression, for example:

[0121] ,

[0122] Among them, I0 is the reference current value, F is the pressure value, V is the speed, PH is the pH value, T is the temperature, , , , They are respectively the first calculation parameter, the second calculation parameter, the third calculation parameter and the fourth calculation parameter.

[0123] During logistic regression, the calculation coefficients can be fitted through multiple groups of actual sample data to obtain the first calculation parameter, the second calculation parameter, the third calculation parameter and the fourth calculation parameter, and then the reference current value is determined based on these calculation coefficients and the values ​​of each polishing parameter.

[0124] It can be understood that the above-mentioned polishing parameters also have certain constraints, among which the polishing pressure and polishing wheel speed can be similar to those in Example 1, while the pH value requires sampling of alkaline polishing liquid, and the pH value constraint value can be set to 8-10, and the temperature constraint value can be set to 20-45°C.

[0125] It can be seen from the first embodiment that the polishing pressure and the polishing wheel speed can jointly affect the reference current value, so the two can also be combined, and the corresponding second calculation model is:

[0126] ,

[0127] The second calculation model can also be implemented using a neural network. By utilizing the powerful learning ability of the neural network, it can be better reflected in the adaptive adjustment of the reference current value. Since the change relationship between the polishing parameters before and after and the correlation between the polishing parameters will also have a certain impact on the acquisition of the reference current value, the second calculation basic model can be constructed through the LSTM network. LSTM (Long Short-Term Memory) is a time recursive neural network that is suitable for processing and predicting important events in time series with relatively long intervals and / or delays.

[0128] Based on this, a second basic computing model is constructed through an LSTM network; the second basic computing model is trained based on sample data to obtain a trained second computing model;

[0129] The pressure value, rotation speed, pH value and temperature are input into the second calculation model to obtain the reference current value.

[0130] During training, the model unit of the second computing basic model based on the LSTM network can be divided into an input layer, a hidden layer and an output layer, and then the sample data is input into the corresponding first LSTM unit for model training to obtain the input layer; the output result of the input layer is input into the second LSTM unit for model training to obtain the hidden layer; the output result of the hidden layer is input into the third LSTM unit for recognition training to obtain the output layer, and the reference current value result of the output layer is output, and the model training is continuously performed until the training requirements are met.

[0131] Whether the training requirements are met can be determined by comparing the reference current value output by the output layer with the actual reference current value of the sample, and comparing the comparison result with the preset threshold value using variance and other methods.

[0132] Similar to the first embodiment, the polishing voltage and the polishing wheel speed in the second embodiment can also set a pressure curve and / or a speed curve according to the polishing stage, or set a basic polishing pressure value.

[0133] S230, controlling the power supply to output the reference current value as the polishing current.

[0134] The adjustment of the polishing current output by the power supply can be similar to that in the first embodiment. Please refer to Figure 4 As shown, the collected polishing pressure, polishing wheel speed, pH value of the electro-polishing liquid, and temperature of the electro-polishing liquid can be input into a second calculation model, and the output result of the second calculation model, i.e., the reference current value and the actual polishing current value collected in real time, can be input into a PID controller to determine the current output value, thereby controlling the power supply to output the current output value.

[0135] Embodiment 3

[0136] See also Figure 5 , Figure 5 Schematic diagram of the structure of an electrochemical polishing system for a metal workpiece disclosed in an embodiment of the present invention. Figure 5 As shown, an electrochemical polishing system for a metal workpiece includes an electropolishing liquid (not shown), a polishing wheel 340, a motor 330, a power supply 370, a pressure sensor 360, a rotation speed sensor 350, and a controller 310;

[0137] The pressure sensor is used to obtain the pressure value of the polishing wheel on the metal workpiece 320, and the speed sensor is used to collect the speed of the polishing wheel or the speed of the motor driving the polishing wheel to rotate, and here it is used to collect the speed of the polishing wheel;

[0138] As an implementation method, the metal workpiece is immersed in the electro-polishing liquid, the polishing wheel is partially or completely placed in the electro-polishing liquid, the positive electrode of the power supply (i.e., the positive output end of the power supply) is electrically connected to the metal workpiece, and the negative electrode of the power supply (i.e., the negative output end of the power supply) is electrically connected to a conductive structure placed in the electro-polishing liquid, and the conductive structure is placed in the electro-polishing liquid and is located on a side of the metal workpiece opposite to the surface to be polished;

[0139] As another implementation, the electropolishing liquid is sprayed on the area to be polished of the metal workpiece, the positive pole of the power supply is electrically connected to the metal workpiece, and the negative pole of the power supply is electrically connected to the polishing wheel through a conductive structure.

[0140] A polishing current is formed between the positive and negative electrodes of the power supply;

[0141] The controller is used to receive the pressure value and the rotation speed, and calculate a reference current value based on the pressure value and the rotation speed based on a calculation model, and then control the power supply to output the reference current value as the polishing current.

[0142] When the electropolishing liquid is sprayed on the part of the metal workpiece to be polished, the conductive structure can use a metal rod or a mercury slip ring to realize the electrical connection between the polishing wheel and the negative electrode of the power supply. When a metal rod is used, the metal rod can be fixed or rotatably connected to the polishing wheel; when a mercury slip ring is used, the mercury slip ring can be rotatably connected to the polishing wheel.

[0143] Embodiment 4

[0144] See also Figure 6 , Figure 6 Schematic diagram of the structure of an electrochemical polishing device for a metal workpiece disclosed in an embodiment of the present invention. Figure 6 As shown, the electrochemical polishing device for the metal workpiece may include:

[0145] An acquisition unit 410 is used to acquire the pressure value of the polishing wheel on the metal workpiece, and the rotation speed of the motor or the rotation speed of the polishing wheel;

[0146] A calculation unit 420, configured to calculate a reference current value based on a calculation model according to the pressure value and the rotation speed;

[0147] The output unit 430 is used to control the power supply to output the reference current value as the polishing current.

[0148] As an optional implementation, the calculation unit 420 may include:

[0149] The reference current value is calculated based on the first calculation model:

[0150] ,

[0151] Among them, I0 is the reference current value, β is the relationship coefficient, F is the pressure value, and V is the speed.

[0152] Preferably, the acquiring unit 410 further includes:

[0153] Determine the pressure value and / or the rotation speed according to the polishing stage and the polishing time;

[0154] The polishing stage is divided into rough polishing, medium polishing and fine polishing in order of polishing time, and the pressure value and the rotation speed of the rough polishing, medium polishing and fine polishing decrease in turn;

[0155] The pressure value and / or the rotation speed in each polishing stage gradually decreases with the polishing time sequence, and the reference current value gradually decreases with the polishing time sequence.

[0156] Preferably, the pressure value and / or the rotation speed are determined according to the polishing stage and the polishing time, including:

[0157] Determine the target polishing stage of the metal workpiece;

[0158] The pressure value and / or the rotation speed corresponding to the metal workpiece are adjusted according to the target parameter curve corresponding to the target polishing stage, and the target parameter curve is a pressure curve and / or a rotation speed curve.

[0159] Preferably, the acquisition unit 410 may include:

[0160] Obtaining the pressure value of the polishing wheel on the metal workpiece, as well as the rotation speed of the motor or the rotation speed of the polishing wheel, and obtaining the pH value of the electro-polishing liquid and the temperature of the electro-polishing liquid;

[0161] According to the pressure value and the rotation speed, a reference current value is calculated based on a calculation model, including:

[0162] A reference current value is calculated based on the second calculation model according to the pressure value, rotation speed, pH value and temperature.

[0163] As an optional implementation, the calculation unit 420 may include:

[0164] Construct the second computing base model:

[0165] ,

[0166] Among them, I0 is the reference current value, F is the pressure value, V is the speed, PH is the pH value, T is the temperature, , , are respectively the first calculation parameter, the second calculation parameter and the third calculation parameter;

[0167] The first calculation parameter, the second calculation parameter and the third calculation parameter are obtained by fitting through a logistic regression method, and after being substituted into the calculation basic model, a second calculation model is obtained;

[0168] The pressure value, rotation speed, pH value and temperature are input into the second calculation model to obtain the reference current value.

[0169] Preferably, the reference current value is calculated based on the second calculation model according to the pressure value, rotation speed, pH value and temperature, including:

[0170] Construct the second computing base model through LSTM network;

[0171] Training the second computing basic model based on the sample data to obtain a trained second computing model;

[0172] The pressure value, rotation speed, pH value and temperature are input into the second calculation model to obtain the reference current value.

[0173] Preferably, the second computing base model of the LSTM network includes an input layer, a hidden layer and an output layer;

[0174] The second computing basic model is trained based on the sample data to obtain a trained second computing model, including:

[0175] Input the sample data into the corresponding first LSTM unit for model training to obtain an input layer;

[0176] Inputting the output result of the input layer into the second LSTM unit for model training to obtain a hidden layer;

[0177] The output result of the hidden layer is input into the third LSTM unit for recognition training to obtain the output layer, and the reference current value result of the output layer is output, and the model training is continuously performed until the training requirements are met.

[0178] Preferably, the output unit 430 may include:

[0179] Obtaining the actual polishing current;

[0180] Inputting the reference current value and the actual polishing current into a PID control model to obtain a current output value;

[0181] The power supply is controlled to output the current output value.

[0182] Embodiment 5

[0183] See also Figure 7 , Figure 7 A schematic diagram of an electronic device that can be used to implement an embodiment of the present invention is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices (such as helmets, glasses, watches, etc.) and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the embodiments of the present invention described or / and claimed herein.

[0184] like Figure 7As shown, the electronic device includes at least one processor 510, and a memory connected to the at least one processor 510, such as a ROM (read-only memory) 520, a RAM (random access memory) 530, etc., wherein the memory stores a computer program that can be executed by at least one processor, and the processor 510 can perform various appropriate actions and processes according to the computer program stored in the ROM 520 or the computer program loaded from the storage unit 580 to the random access memory RAM 530. In the RAM 530, various programs and data required for the operation of the electronic device can also be stored. The processor 510, the ROM 520, and the RAM 530 are connected to each other via a bus 540. The I / O (input / output) interface 550 is also connected to the bus 540.

[0185] A number of components in the electronic device are connected to the I / O interface 550, including: an input unit 560, such as a keyboard, a mouse, etc.; an output unit 570, such as various types of displays, speakers, etc.; a storage unit 580, such as a disk, an optical disk, etc.; and a communication unit 590, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 590 allows the electronic device to exchange information / data with other devices through a computer network such as the Internet or / and various telecommunication networks.

[0186] The processor 510 may be a variety of general or / and special processing components with processing and computing capabilities. Some examples of the processor 510 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any appropriate processor, controller, microcontroller, etc. The processor 510 performs one or more steps of the electrochemical polishing method of a metal workpiece described in the first or third embodiment above.

[0187] In some embodiments, a method for electrochemical polishing of a metal workpiece may be implemented as a computer program, which is tangibly contained in a computer-readable storage medium, such as a storage unit 580. In some embodiments, part or all of the computer program may be loaded or / and installed on an electronic device via a ROM 520 or / and a communication unit 590. When the computer program is loaded into the RAM 530 and executed by the processor 510, one or more steps of the method for electrochemical polishing of a metal workpiece described in the first or third embodiment above may be performed. Alternatively, in other embodiments, the processor 510 may be configured to perform a method for electrochemical polishing of a metal workpiece in any other appropriate manner (e.g., by means of firmware).

[0188] Various embodiments of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on chips (SOCs), load programmable logic devices (CPLDs), computer hardware, firmware, software, or / and combinations thereof. These various embodiments may include: being implemented in one or more computer programs, which may be executed or / and interpreted on a programmable system including at least one programmable processor, which may be a special purpose or general purpose programmable processor, which may receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0189] The computer programs for implementing the methods of the embodiments of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, so that when the computer program is executed by the processor, the functions / operations specified in the flow chart or / and the block diagram are implemented. The computer program may be executed entirely on the machine, partially on the machine, partially on the machine and partially on a remote machine as a stand-alone software package, or entirely on a remote machine or server.

[0190] In the context of an embodiment of the present invention, a computer-readable storage medium may be a tangible medium that may contain or store a computer program for use by or in conjunction with an instruction execution system, device, or equipment. A computer-readable storage medium may include, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, device, or equipment, or any suitable combination of the foregoing. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. A more specific example of a machine-readable storage medium may include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0191] To provide interaction with a user, the systems and techniques described herein may be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or trackball) through which the user can provide input to the electronic device. Other types of devices may also be used to provide interaction with the user; for example, the feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form (including acoustic input, voice input, or tactile input).

[0192] The systems and techniques described herein may be implemented in a computing system that includes backend components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes frontend components (e.g., a user computer with a graphical user interface or a web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such backend components, middleware components, or frontend components. The components of the system may be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), a blockchain network, and the Internet.

[0193] A computing system may include a client and a server. The client and the server are generally remote from each other and usually interact through a communication network. The client and server relationship is generated by computer programs running on the corresponding computers and having a client-server relationship with each other. The server may be a cloud server, also known as a cloud computing server or cloud host, which is a host product in the cloud computing service system to solve the defects of difficult management and weak business scalability in traditional physical hosts and VPS services.

[0194] The above is a detailed introduction to the electrochemical polishing method, system, electronic device and storage medium for a metal workpiece disclosed in the present invention. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea; at the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A method for electrochemical polishing of a metal workpiece, characterized in that: It includes the following steps: Obtaining the pressure value of the polishing wheel on the metal workpiece, and the rotation speed of the motor driving the polishing wheel or the rotation speed of the polishing wheel; According to the pressure value and the rotation speed, a reference current value is calculated based on a calculation model; Controlling the power supply to output the reference current value as the polishing current; Wherein, the reference current value is calculated based on the calculation model according to the pressure value and the rotation speed, including: The reference current value is calculated based on the first calculation model: Among them, I0 is the reference current value, β is the relationship coefficient, F is the pressure value, V is the speed, and the constraint condition of the relationship coefficient is 20-50.

2. The electrochemical polishing method for a metal workpiece according to claim 1, characterized in that: The step of obtaining the pressure value of the polishing wheel on the metal workpiece, and the rotation speed of the motor or the rotation speed of the polishing wheel also includes: Determine the pressure value and the rotation speed according to the polishing stage and the polishing time; The polishing stage is divided into rough polishing, medium polishing and fine polishing in order of polishing time, and the pressure value and the rotation speed of the rough polishing, medium polishing and fine polishing decrease in turn; The pressure value and the rotation speed of each polishing stage gradually decrease with the polishing time sequence, and the reference current value gradually decreases with the polishing time sequence.

3. The electrochemical polishing method for a metal workpiece according to claim 2, characterized in that: The pressure value and the rotation speed are determined according to the polishing stage and the polishing time, including: Determine the target polishing stage of the metal workpiece; The pressure value and the rotation speed corresponding to the metal workpiece are adjusted according to the target parameter curve corresponding to the target polishing stage, and the target parameter curve is a pressure curve and a rotation speed curve.

4. The electrochemical polishing method for a metal workpiece according to claim 2, characterized in that: The pressure value and the rotation speed are determined according to the polishing stage and the polishing time, including: Determine the target polishing stage of the metal workpiece; Determining an initial pressure value and a rotation speed of the target polishing stage according to the target polishing stage and the pH value and temperature of the electropolishing liquid; The pressure value and the rotation speed of the entire target polishing stage are determined according to the initial pressure value and the rotation speed and the pressure change information and the rotation speed change information corresponding to the target polishing stage.

5. The electrochemical polishing method for a metal workpiece according to any one of claims 1 to 4, characterized in that: The control power supply outputs the reference current value as the polishing current, comprising: Get the actual polishing current value; Inputting the reference current value and the actual polishing current value into a PID control model to obtain a current output value; The output current of the power supply is controlled according to the current output value.

6. An electrochemical polishing system for a metal workpiece, characterized in that: It includes: Electropolishing fluid, polishing wheel, motor, power supply, pressure sensor, speed sensor, controller; The pressure sensor is used to obtain the pressure value of the polishing wheel on the metal workpiece, and the speed sensor is used to collect the speed of the polishing wheel or the speed of the motor driving the polishing wheel to rotate; The metal workpiece is immersed in the electropolishing liquid, the polishing wheel is partially or completely placed in the electropolishing liquid, the positive electrode of the power supply is electrically connected to the metal workpiece, and the negative electrode of the power supply is electrically connected to a conductive structure placed in the electropolishing liquid, and the conductive structure is placed in the electropolishing liquid and is located on a side opposite to the surface to be polished of the metal workpiece; or, the electropolishing liquid is sprayed on the part to be polished of the metal workpiece, the positive electrode of the power supply is electrically connected to the metal workpiece, and the negative electrode of the power supply is electrically connected to the polishing wheel through the conductive structure; A polishing current is formed between the positive and negative electrodes of the power supply; The controller is used to receive the pressure value and the rotation speed, and calculate a reference current value based on the pressure value and the rotation speed based on a calculation model, and then control the power supply to output the reference current value as the polishing current; The reference current value is calculated based on the calculation model, including: The reference current value is calculated based on the first calculation model: Among them, I0 is the reference current value, β is the relationship coefficient, F is the pressure value, V is the speed, and the constraint condition of the relationship coefficient is 20-50.

7. The electrochemical polishing system for a metal workpiece according to claim 6, characterized in that: The conductive structure is a metal rod or a mercury slip ring. When a metal rod is used, the metal rod is fixedly or rotatably connected to the polishing wheel. When a mercury slip ring is used, the mercury slip ring is rotatably connected to the polishing wheel.

8. An electronic device, characterized in that: It comprises: a memory storing executable program codes; a processor coupled to the memory; the processor calls the executable program codes stored in the memory to execute the electrochemical polishing method for a metal workpiece according to any one of claims 1 to 5.

9. A computer-readable storage medium, characterized in that: It stores a computer program, wherein the computer program enables a computer to execute the electrochemical polishing method for a metal workpiece according to any one of claims 1 to 5.

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