Display panel and display device

Abstract

The present application discloses a display panel and a display device. The display panel includes: a substrate; a pixel definition layer, which is arranged on one side of the substrate, and the pixel definition layer includes a pixel definition part and a pixel opening formed by the pixel definition part; a light-emitting device, which is arranged in the pixel opening; a first encapsulation layer, which is arranged on the side of the light-emitting device away from the substrate, and the first encapsulation layer includes a first encapsulation part and a first step part, the orthographic projection of the first encapsulation part on the substrate is located within the orthographic projection of the pixel opening on the substrate, the orthographic projection of the first step part on the substrate overlaps at least partially with the orthographic projection of the pixel definition part on the substrate, the first step part is connected to the first encapsulation part, and in the thickness direction of the display panel, there is a height difference between at least a part of the surface of the first step part on the side away from the substrate and the surface of the first encapsulation part on the side away from the substrate, so that the first step part and the first encapsulation part are stepped.

Description

Technical Field

[0001] The present application belongs to the field of display technology, and in particular, relates to a display panel and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat-panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream of display devices.

[0003] However, the performance of current OLED display products needs to be improved. Summary of the invention

[0004] Embodiments of the present application provide a display panel and a display device, aiming to improve the packaging effect of the display panel.

[0005] An embodiment of the first aspect of the present application provides a display panel, comprising: a substrate; a pixel definition layer, arranged on one side of the substrate, the pixel definition layer comprising a pixel defining portion and a pixel opening formed by the pixel defining portion; a light-emitting device, arranged in the pixel opening; a first encapsulation layer, arranged on a side of the light-emitting device away from the substrate, the first encapsulation layer comprising a first encapsulation portion and a first step portion, the orthographic projection of the first encapsulation portion on the substrate is located within the orthographic projection of the pixel opening on the substrate, the orthographic projection of the first step portion on the substrate at least partially overlaps with the orthographic projection of the pixel defining portion on the substrate, the first step portion is connected to the first encapsulation portion, and in the thickness direction of the display panel, there is a height difference between at least a portion of the surface of the first step portion on the side away from the substrate and the surface of the first encapsulation portion on the side away from the substrate, so that the first step portion and the first encapsulation portion are stepped.

[0006] According to an implementation of the first aspect of the present application, the first stepped portion is connected to an edge of the first encapsulation portion facing the pixel defining portion.

[0007] According to any of the aforementioned embodiments of the first aspect of the present application, in the thickness direction of the display panel, the maximum spacing between the surface of the first packaging portion facing away from the substrate and the substrate is a first spacing, the maximum spacing between the surface of the first step portion facing away from the substrate and the substrate is a second spacing, and the first spacing is smaller than the second spacing, so that the first step portion and the first packaging portion are stepped.

[0008] According to any of the aforementioned embodiments of the first aspect of the present application, the side of the first step portion facing away from the substrate has a first flat surface and a first transition surface, the first transition surface is connected to the surface of the first packaging portion facing away from the substrate, the first flat surface is connected to the edge of the first transition surface away from the first packaging portion, and the first transition surface is inclined relative to the first flat surface.

[0009] According to any of the aforementioned embodiments of the first aspect of the present application, the slope of the edge of the first flat surface toward the first transition surface is equal to the slope of the edge of the first transition surface toward the first flat surface.

[0010] According to any of the aforementioned embodiments of the first aspect of the present application, the first stepped portion further has a second transition surface located on a side of the first flat surface away from the first transition surface, and the second transition surface is inclined toward the substrate in a direction away from the first packaging portion.

[0011] According to any of the aforementioned embodiments of the first aspect of the present application, at least a portion of the first transition surface is recessed toward the pixel defining portion to form a recessed structure, and the recessed structure is formed by extending in a direction from the first packaging portion to the first flat surface.

[0012] According to any of the aforementioned embodiments of the first aspect of the present application, there are multiple recessed structures, and the multiple recessed structures are arranged at intervals on the circumferential side of the first packaging portion.

[0013] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel also includes an isolation structure arranged on the side of the pixel defining portion facing away from the substrate, the isolation structure is provided with an isolation opening connected to the pixel opening, the isolation structure includes a first isolation portion and a second isolation portion located on the side of the first isolation portion facing away from the substrate, the second isolation portion is arranged to protrude from the first isolation portion toward the isolation opening.

[0014] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure further includes a third isolation portion located on a side of the first isolation portion facing the substrate, and the third isolation portion is arranged to protrude from the first isolation portion toward the isolation opening.

[0015] According to any of the aforementioned embodiments of the first aspect of the present application, the first encapsulation layer also includes a second encapsulation portion arranged on the side of the isolation structure facing the isolation opening, the maximum thickness of the second encapsulation portion is smaller than the maximum thickness of the first encapsulation portion, and / or the maximum thickness of the second encapsulation portion is smaller than the maximum thickness of the first step portion.

[0016] According to any of the aforementioned embodiments of the first aspect of the present application, the second packaging portion includes a first sub-portion covering the surface of the second isolation portion on the side facing the isolation opening, and the first sub-portion has a third transition surface on the side facing away from the second isolation portion, and in the direction away from the second isolation portion, the third transition surface is inclined toward the side away from the substrate.

[0017] According to any of the aforementioned embodiments of the first aspect of the present application, the distance between the surface of the first step portion facing away from the substrate and the substrate is greater than or equal to the distance between the surface of the second isolation portion facing away from the substrate and the substrate.

[0018] According to any of the aforementioned embodiments of the first aspect of the present application, in the thickness direction of the display panel, the maximum spacing between the surface of the first packaging portion facing away from the substrate and the substrate is a first spacing, the maximum spacing between the surface of the second step portion facing away from the substrate and the substrate is a third spacing, and the first spacing is smaller than the third spacing, so that the second step portion and the first packaging portion are stepped.

[0019] According to any of the aforementioned embodiments of the first aspect of the present application, the second step portion has a second flat surface and a fourth transition surface on the side facing away from the substrate, the second flat surface is connected to the edge of the fourth transition surface on the side away from the isolation opening, and in the direction away from the substrate, the fourth transition surface is inclined in the direction away from the isolation opening.

[0020] According to any of the aforementioned implementations of the first aspect of the present application, the display panel further comprises a second encapsulation layer disposed on a side of the first encapsulation layer facing away from the substrate, and at least a portion of the second encapsulation layer is located in the gap cavity via the conductive opening.

[0021] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel also includes a pixel definition layer arranged on one side of the substrate, the pixel definition layer includes a pixel defining portion and a pixel opening formed by the pixel defining portion, the light-emitting device is arranged in the pixel opening, the orthographic projection of the first packaging portion on the substrate is located within the orthographic projection of the pixel opening on the substrate, the first packaging layer also includes a first step portion, the orthographic projection of the first step portion on the substrate at least partially overlaps with the orthographic projection of the pixel defining portion on the substrate, and the first step portion is connected to the edge of the first packaging portion toward the pixel defining portion.

[0022] An embodiment of the first aspect of the present application also provides a display panel, comprising: a substrate; an isolation structure, arranged on one side of the substrate, the isolation structure having an isolation opening; a light-emitting device, at least partially arranged in the isolation opening; a first encapsulation layer, arranged on a side of the light-emitting device away from the substrate, the first encapsulation layer comprising a first encapsulation portion and a second step portion, the orthographic projection of the first encapsulation portion on the substrate is located within the orthographic projection of the light-emitting device on the substrate, the second step portion is located on the side of the isolation structure away from the substrate, and in the thickness direction of the display panel, there is a height difference between at least a portion of the surface of the second step portion on the side away from the substrate and the surface of the first encapsulation portion on the side away from the substrate, so that the second step portion and the first encapsulation portion are stepped.

[0023] According to the implementation scheme of the first aspect of the present application, in the thickness direction of the display panel, the maximum distance between the surface of the first packaging portion facing away from the substrate and the substrate is a first distance, the maximum distance between the surface of the second step portion facing away from the substrate and the substrate is a third distance, and the first distance is smaller than the third distance, so that the second step portion and the first packaging portion are stepped.

[0024] An embodiment of a second aspect of the present application provides a display device, which includes a display panel according to any of the above embodiments.

[0025] In a display panel provided in an embodiment of the present application, the display panel includes a substrate, a pixel definition layer, a light-emitting device, and a first encapsulation layer. The pixel definition layer is arranged on one side of the substrate, the pixel definition layer includes a pixel defining portion and a pixel opening formed by the pixel defining portion, the light-emitting device is arranged in the pixel opening, and the pixel definition layer can be used to divide the sub-pixels of the display panel. The first encapsulation layer is arranged on the side of the light-emitting device away from the substrate, and the first encapsulation layer can be used to encapsulate the light-emitting device. The first encapsulation layer includes a first encapsulation portion and a first stepped portion, the orthographic projection of the first encapsulation portion on the substrate is located within the orthographic projection of the pixel opening on the substrate, and the first encapsulation portion can better encapsulate the light-emitting device in the pixel opening. The first stepped portion is connected to the first encapsulation portion, the orthographic projection of the first stepped portion on the substrate at least partially overlaps with the orthographic projection of the pixel defining portion on the substrate, and the first stepped portion can encapsulate the light-emitting device located on the pixel defining portion. In the thickness direction of the display panel, there is a height difference between at least a portion of the surface of the first step portion facing away from the substrate and the surface of the first packaging portion facing away from the substrate, so that the first step portion and the first packaging portion are stepped, so that the first packaging layer can better follow the raised morphology of the pixel defining portion below relative to the substrate to produce a corresponding undulating step morphology, so that the first packaging portion above the pixel opening and the first step portion are not prone to have too large a thickness difference, thereby better improving the packaging effect of the first packaging layer on the light-emitting device. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0027] Figure 1a is a partial cross-sectional view of a display panel provided in an embodiment of the present application;

[0028] Figure 1b is a partial cross-sectional view of a display panel provided in an embodiment of the present application;

[0029] Figure 2 It is a partial structural schematic diagram of an isolation structure provided in an embodiment of the present application;

[0030] Figure 3 is a partial cross-sectional view of a display panel provided by another embodiment of the present application;

[0031] Figure 4 is a partial cross-sectional view of a display panel provided in yet another embodiment of the present application;

[0032] Figure 5 is a partial cross-sectional view of a display panel provided in yet another embodiment of the present application;

[0033] Figure 6a is a schematic diagram of a partial structure of a first encapsulation layer provided in an embodiment of the present application;

[0034] Figure 6b is a schematic diagram of a partial structure of a first encapsulation layer provided in an embodiment of the present application;

[0035] Figure 7 is a partial cross-sectional view of a display panel provided in another embodiment of the present application;

[0036] Figure 8 This is a partial cross-sectional view of a display panel provided in another embodiment of the present application.

[0037] Description of reference numerals:

[0038] 10. Display panel;

[0039] 100, substrate; 110, substrate; 120, first insulating layer; 130, second insulating layer; 140, third insulating layer; 150, transistor; 151, gate; 152, source and drain; 160, storage capacitor; 161, first plate; 162, second plate;

[0040] 200, pixel definition layer; 210, pixel definition portion; 211, side wall surface; 220, pixel opening;

[0041] 300, isolation structure; 300a, isolation opening; 310, first isolation part; 320, second isolation part; 330, third isolation part;

[0042] 400, light emitting device; 410, first electrode; 420, light emitting layer; 430, second electrode;

[0043] 500, first packaging layer; 500a, gap cavity; 500b, conduction opening; 510, first packaging part; 520, first stepped part; 521, first flat surface; 522, first transition surface; 522a, recessed structure; 522b, raised structure; 523, second transition surface; 530, second packaging part; 531, first sub-part; 531a, third transition surface; 540, second stepped part; 541, second flat surface; 542, fourth transition surface;

[0044] 600, second encapsulation layer;

[0045] 700, third encapsulation layer;

[0046] X, thickness direction. DETAILED DESCRIPTION

[0047] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present application and are not configured to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

[0048] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0049] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or another region, it may mean that it is directly on the other layer or another region, or that other layers or regions are included between it and the other layer or another region. Moreover, if the component is turned over, the layer or a region will be "below" or "beneath" another layer or another region.

[0050] Embodiments of the present application provide a display panel and a display device. Embodiments of the display panel and the display device will be described below in conjunction with the accompanying drawings.

[0051] Figure 1a , Figure 1b 1 is a partial cross-sectional view of a display panel 10 provided in an embodiment of the present application, in which the X direction is the thickness direction of the display panel 10 .

[0052] like Figure 1a , Figure 1b As shown, an embodiment of the first aspect of the present application provides a display panel 10, comprising: a substrate 100; a pixel definition layer 200, disposed on one side of the substrate 100, the pixel definition layer 200 comprising a pixel defining portion 210 and a pixel opening 220 formed by the pixel defining portion 210; a light emitting device 400, disposed in the pixel opening 220; a first encapsulation layer 500, disposed on a side of the light emitting device 400 away from the substrate 100, the first encapsulation layer 500 comprising a first encapsulation portion 510 and a first stepped portion 520, the first encapsulation portion 510 being disposed on the substrate 100. The orthographic projection of the first step portion 520 on the substrate 100 is located within the orthographic projection of the pixel opening 220 on the substrate 100, the orthographic projection of the first step portion 520 on the substrate 100 at least partially overlaps with the orthographic projection of the pixel defining portion 210 on the substrate 100, the first step portion 520 is connected to the first packaging portion 510, and in the thickness direction X of the display panel 10, there is a height difference between at least a portion of the surface of the first step portion 520 on the side facing away from the substrate 100 and the surface of the first packaging portion 510 on the side facing away from the substrate 100, so that the first step portion 520 and the first packaging portion 510 are stepped.

[0053] It should be noted that the orthographic projection of the first packaging part 510 on the substrate 100 is located within the orthographic projection of the pixel opening 220 on the substrate 100, which means that the orthographic projection of the first packaging part 510 on the substrate 100 can be smaller than the orthographic projection of the pixel opening 220 on the substrate 100, or can be equal to the orthographic projection of the pixel opening 220 on the substrate 100.

[0054] In a display panel 10 provided in an embodiment of the present application, the display panel 10 includes a substrate 100, a pixel definition layer 200, a light emitting device 400, and a first encapsulation layer 500. The pixel definition layer 200 is disposed on one side of the substrate 100, the pixel definition layer 200 includes a pixel defining portion 210 and a pixel opening 220 formed by the pixel defining portion 210, the light emitting device 400 is disposed in the pixel opening 220, and the pixel definition layer 200 can be used to divide the sub-pixels of the display panel 10.

[0055] Optionally, the pixel opening 220 may communicate with the isolation opening 300 a .

[0056] Optionally, the orthographic projection of the first encapsulation part 510 on the substrate 100 is located within the orthographic projection of the pixel opening 220 on the substrate 100, so as to better encapsulate the light emitting device 400 in the pixel opening 220. Optionally, the isolation structure 300 can be disposed on the side of the pixel defining part 210 away from the substrate 100.

[0057] The first encapsulation layer 500 is disposed on a side of the light emitting device 400 away from the substrate 100, and the first encapsulation layer 500 can be used to encapsulate the light emitting device 400. The first encapsulation layer 500 includes a first encapsulation portion 510 and a first stepped portion 520, and the orthographic projection of the first encapsulation portion 510 on the substrate 100 is located within the orthographic projection of the pixel opening 220 on the substrate 100, and the first encapsulation portion 510 can better encapsulate the light emitting device 400 in the pixel opening 220.

[0058] The first stepped portion 520 is connected to the first encapsulation portion 510. For example, the first stepped portion 520 may be connected to the edge of the first encapsulation portion 510 facing the pixel defining portion 210. The orthographic projection of the first stepped portion 520 on the substrate 100 at least partially overlaps with the orthographic projection of the pixel defining portion 210 on the substrate 100. The first stepped portion 520 may encapsulate the light emitting device 400 located on the pixel defining portion 210. In the thickness direction X of the display panel 10, there is a height difference between at least a portion of the surface of the first step portion 520 on the side facing away from the substrate 100 and the surface of the first packaging portion 510 on the side facing away from the substrate 100, so that the first step portion 520 and the first packaging portion 510 are stepped, which may mean that the height of the first step portion 520 compared to the substrate 100 may be higher than the height of the first packaging portion 510 compared to the substrate 100, so that the first packaging layer 500 can better follow the raised morphology of the pixel defining portion 210 below relative to the substrate 100 to produce a corresponding undulating step morphology, so that the first packaging portion 510 above the pixel opening 220 and the first step portion 520 are not prone to have too large a thickness difference, thereby being able to better improve the packaging effect of the first packaging layer 500 on the light-emitting device 400.

[0059] In some embodiments of the present application, there are multiple ways to set the substrate 100. Optionally, the substrate 100 includes a substrate 110 and a transistor 150 disposed on the side of the substrate 110 facing the isolation structure 300, and the transistor 150 includes a gate 151 and a source / drain 152. Optionally, the substrate 100 may also include a storage capacitor 160. Exemplarily, the storage capacitor 160 may include a first electrode 161 and a second electrode 162 located on the side of the first electrode 161 away from the substrate 110. Patents PCT / CN2023 / 134518, 202310759370.2, 202311117143.6, 202310771071.0, 202310771124.9, and 202311499823.9 record the relevant contents of the isolation structure 300 for reference.

[0060] As an example, the substrate 100 may further include a first insulating layer 120, a second insulating layer 130, and a third insulating layer 140 which are located on a side of the substrate 110 facing the transistor 150 and are sequentially stacked on the substrate 110. The gate 151 and the first electrode 161 may be provided in the same layer. For example, the gate 151 and the first electrode 161 may be located on a side of the first insulating layer 120 facing the substrate 110. The second electrode 162 may be located between the first insulating layer 120 and the second insulating layer 130, and the source / drain 152 may be located between the second insulating layer 130 and the third insulating layer 140.

[0061] In some embodiments of the present application, in a direction away from the substrate 100 , the light emitting device 400 may include a first electrode 410 , a light emitting layer 420 , and a second electrode 430 stacked in sequence.

[0062] Optionally, the light emitting layer 420 may include a hole injection layer (HIL), a hole transport layer (HTL), a light emitting structure, an electron injection layer (EIL) and an electron transport layer (ETL).

[0063] Optionally, the first electrode 410 and the second electrode 430 may be used as pixel electrodes of the display panel 10. Specifically, one of the first electrode 410 and the second electrode 430 may be used as an anode, and the other may be used as a cathode to drive the light-emitting layer 420 to emit light. In the embodiment of the present application, the first electrode 410 is used as the anode of the display panel 10, and the second electrode 430 is used as the cathode of the display panel 10 for illustration.

[0064] Optionally, part of the light-emitting device 400 may also be located on one side of the back substrate 100 of the pixel defining portion 210. For example, the light-emitting device 400 may extend from the pixel opening 220 to the side of the pixel defining portion 210 away from the substrate 100. The first step portion 520 may better encapsulate the light-emitting device 400 above the pixel defining portion 210.

[0065] In some optional embodiments, the material of the first encapsulation layer 500 may include inorganic material, so that the first encapsulation layer 500 is not easy to absorb water, so that the first encapsulation layer 500 can better limit the invasion of external water vapor into the light-emitting device 400, so that the first encapsulation layer 500 can have a better encapsulation effect.

[0066] Optionally, the first packaging layer 500 can be prepared by a chemical vapor deposition (CVD) process, so that the prepared first packaging layer 500 can better follow the ups and downs of the underlying film layer structure to produce a corresponding undulating step morphology, thereby better improving the packaging effect of the first packaging layer 500.

[0067] In some optional embodiments, the first step portion 520 and the first packaging portion 510 are stepped, which may mean that the height of the first step portion 520 compared to the substrate 100 may be higher than the height of the first packaging portion 510 compared to the substrate 100, so that the first packaging layer 500 follows the raised morphology of the pixel defining portion 210 below relative to the substrate 100 to produce a corresponding undulating step morphology.

[0068] Optionally, in the thickness direction X of the display panel 10, the maximum distance between the surface of the first encapsulation portion 510 on the side facing away from the substrate 100 and the substrate 100 is a first distance, and the maximum distance between the surface of the first step portion 520 on the side facing away from the substrate 100 and the substrate 100 is a second distance, and the first distance is smaller than the second distance, so that the first step portion 520 and the first encapsulation portion 510 are stepped, that is, the height of the first step portion 520 relative to the substrate 100 can be higher than the height of the first encapsulation portion 510 relative to the substrate 100, so that the first encapsulation layer 500 can better follow the raised morphology of the pixel defining portion 210 below relative to the substrate 100 to produce a corresponding undulating stepped morphology, and the thickness of the first step portion 520 located on the pixel defining portion 210 can be close to the thickness of the first encapsulation portion 510, so as to better improve the encapsulation effect of the first encapsulation layer 500.

[0069] In some optional embodiments, the first stepped portion 520 has a first flat surface 521 and a first transition surface 522 on a side away from the substrate 100, the first transition surface 522 is connected to the surface of the first encapsulation portion 510 on a side away from the substrate 100, the first flat surface 521 is connected to the edge of the first transition surface 522 away from the first encapsulation portion 510, and the first transition surface 522 is inclined relative to the first flat surface 521. For example, in the direction away from the substrate 100, the first transition surface 522 is inclined toward the direction away from the first encapsulation portion 510, so that in the direction away from the first encapsulation portion 510, the first transition surface 522 can gradually move away from the substrate 100, so that the height of the first stepped portion 520 compared to the substrate 100 can be gradually increased, so as to facilitate the leveling of the film structure prepared subsequently, thereby being able to better reduce the difficulty of preparing the display panel 10.

[0070] Optionally, in the direction away from the substrate 100, the first transition surface 522 is tilted toward the direction away from the first packaging portion 510, which may mean that the end of the first transition surface 522 away from the substrate 100 may be closer to the isolation structure 300 than the end of the first transition surface 522 toward the substrate 100.

[0071] Optionally, the surface of the first packaging portion 510 facing away from the substrate 100 may be parallel to at least a portion of the surface facing away from the substrate 100 during light emission in the pixel opening 220, so that the first packaging portion 510 may have better thickness uniformity, thereby better improving the packaging effect of the first packaging portion 510 on the light-emitting device 400 in the pixel opening 220.

[0072] Optionally, at least a portion of the first flat surface 521 is parallel to the surface of the first packaging portion 510 on the side away from the substrate 100, so that the first flat surface 521 located on the side of the pixel defining portion 210 away from the substrate 100 can have better flatness, which can facilitate the leveling of the subsequently prepared film layer structure and make the film layer thickness of the first step portion 520 at the first flat surface 521 more uniform, thereby better improving the packaging effect of the first step portion 520 on the light-emitting device 400 on the pixel defining portion 210.

[0073] Optionally, in the thickness direction X of the display panel 10 , the distance between the first flat surface 521 and the substrate 100 may be a second distance.

[0074] In some optional embodiments, a side of the pixel defining portion 210 facing the pixel opening 220 has a side wall surface 211 .

[0075] Optionally, the side wall surface 211 is tilted relative to the first flat surface 521. For example, in a direction away from the substrate 100, the side wall surface 211 is tilted toward a direction away from the pixel opening 220.

[0076] Optionally, in the direction away from the substrate 100 , the side wall surface 211 is inclined toward the direction away from the pixel opening 220 , so that the cross-sectional area of ​​the pixel defining portion 210 gradually decreases in the direction away from the substrate 100 .

[0077] Optionally, the orthographic projection of the side wall surface 211 on the substrate 100 is located within the orthographic projection of the first transition surface 522 on the substrate 100 .

[0078] In these optional embodiments, in the direction away from the substrate 100, by setting the first transition surface 522 and the side wall surface 211 to be inclined in the direction away from the first packaging portion 510, the first transition surface 522 and the side wall surface 211 can gradually move away from the substrate 100 in the direction away from the first packaging portion 510, so that the heights of the first step portion 520 and the pixel defining portion 210 compared to the substrate 100 can be gradually increased, so that the first step portion 520 can better follow the undulating morphology of the pixel defining portion 210 compared to the substrate 100 to produce a corresponding undulating step morphology, so that the first step portion 520 above the pixel defining portion 210 can have better thickness uniformity.

[0079] Optionally, the first transition surface 522 may include a curved surface, so that in a direction away from the first packaging portion 510 , the height of the first step portion 520 is less likely to change suddenly compared to the substrate 100 , which can further facilitate the leveling of the subsequently prepared film layer structure.

[0080] Optionally, the first transition surface 522 may include a curved surface convex toward the side away from the substrate 100 , so that the first step portion 520 above the side wall surface 211 may have a better thickness to enhance the packaging effect of the first step portion 520 on the light-emitting device 400 above the side wall surface 211 .

[0081] In some optional embodiments, the slope of the edge of the first flat surface 521 toward the first transition surface 522 is equal to the slope of the edge of the first transition surface 522 toward the first flat surface 521, so that the connection between the first flat surface 521 and the first transition surface 522 can be relatively smooth, and stress concentration is not prone to occur at the connection between the first flat surface 521 and the first transition surface 522, thereby better improving the structural stability of the first packaging layer 500.

[0082] Figure 2 is a partial structural diagram of an isolation structure 300 provided in an embodiment of the present application, Figure 3 It is a partial cross-sectional view of a display panel 10 provided in another embodiment of the present application.

[0083] like Figure 2 and Figure 3As shown, in some optional embodiments, the display panel 10 also includes an isolation structure 300 arranged on the side of the pixel defining portion 210 away from the substrate 100, the isolation structure 300 is provided with an isolation opening 300a connected to the pixel opening 220, the isolation structure 300 includes a first isolation portion 310 and a second isolation portion 320 located on the side of the first isolation portion 310 away from the substrate 100, and the second isolation portion 320 is arranged to protrude from the first isolation portion 310 toward the isolation opening 300a.

[0084] By arranging the second isolating portion 320 to protrude from the first isolating portion 310 toward the isolating opening 300a, when the light-emitting layer 420 and the second electrode 430 of the display panel 10 are evaporated, the second isolating portion 320 can block at least a portion of the material used to prepare the light-emitting layer 420 and the second electrode 430, so as to separate the light-emitting layer 420 and the second electrode 430 between adjacent sub-pixels, which can facilitate the formation of a plurality of light-emitting devices 400 arranged at intervals, thereby eliminating the need to set a mask with high precision when evaporating the light-emitting layer 420 and the second electrode 430 of the display panel 10. For example, there is no need to set a high-precision metal mask (Fine Metal Mask, FMM) when evaporating the light-emitting layer 420 and the second electrode 430, thereby effectively reducing the production cost of the display panel 10.

[0085] Optionally, both the pixel definition layer 200 and the isolation structure 300 may be mesh-shaped, wherein the hollow areas in the mesh-shaped pixel definition layer 200 may be pixel openings 220 , and the hollow areas in the mesh-shaped isolation structure 300 may be isolation openings 300 a .

[0086] Optionally, the material of the isolation structure 300 may include a conductive material, and the second electrode 430 of the light-emitting device 400 may extend from the pixel opening 220 to connect with the isolation structure 300, so that the second electrode 430 of the light-emitting device 400 in the adjacent isolation opening 300a can be electrically connected through the isolation structure 300, that is, the second electrodes 430 in the adjacent isolation openings 300a can be interconnected through the isolation structure 300 to form a surface electrode, so as to facilitate the control of the second electrode 430 in the display panel 10.

[0087] Optionally, the isolation structure 300 also includes a third isolation portion 330 located on the side of the first isolation portion 310 facing the substrate 100. The third isolation portion 330 is arranged to protrude from the first isolation portion 310 toward the isolation opening 300a, so that the second electrode 430 in the isolation opening 300a can be easily overlapped with the third isolation portion 330, and the connection area between the second electrode 430 and the isolation structure 300 can be better improved, thereby better reducing the electrical connection resistance between the isolation structure 300 and the second electrode 430.

[0088] In some optional embodiments, the first packaging layer 500 also includes a second packaging portion 530 disposed on the side of the isolation structure 300 facing the isolation opening 300a. The second packaging portion 530 disposed on the side of the isolation structure 300 facing the isolation opening 300a can better extend the path for external water vapor to invade the light-emitting device 400, thereby better improving the packaging effect of the first packaging layer 500 on the light-emitting device 400.

[0089] Optionally, the maximum thickness of the second encapsulation part 530 is less than the maximum thickness of the first encapsulation part 510, and / or, the maximum thickness of the second encapsulation part 530 is less than the maximum thickness of the first stepped part 520. By providing a second encapsulation part 530 with a smaller thickness, the second encapsulation part 530 can better follow the undulating morphology of the surface of the isolation structure 300 facing the pixel opening 220 in a relatively narrow space (for example, a relatively narrow space between the second isolation part 320 and the pixel defining part 210) to generate a corresponding undulating morphology, thereby better improving the thickness uniformity of the second encapsulation part 530 and better improving the bonding effect between the second encapsulation part 530 and the isolation structure 300.

[0090] In some optional embodiments, the first stepped portion 520 further includes a second transition surface 523 located on a side of the first flat surface 521 away from the first transition surface 522, and the second transition surface 523 is tilted relative to the first flat surface 521. For example, in a direction away from the first packaging portion 510, the second transition surface 523 is tilted toward the substrate 100.

[0091] Optionally, in the direction away from the first packaging portion 510, the second transition surface 523 is tilted toward the substrate 100, which may mean that the end of the second transition surface 523 close to the substrate 100 may be farther away from the isolation structure 300 than the end of the second transition surface 523 away from the substrate 100.

[0092] Optionally, in a direction away from the first packaging portion 510 , the second transition surface 523 is tilted toward the substrate 100 , which may also mean that in a direction close to the isolation structure 300 , the second transition surface 523 is tilted toward the substrate 100 .

[0093] In these optional embodiments, by being arranged in a direction away from the first packaging portion 510, the second transition surface 523 is inclined toward the substrate 100, so that in a direction close to the isolation structure 300, the height of the first step portion 520 relative to the substrate 100 can be gradually reduced, that is, the thickness of the first step portion 520 can be gradually reduced, so that during the preparation process of the first packaging layer 500, the material of the portion of the first step portion 520 formed on the side close to the isolation structure 300 is not easy to block the material of the second packaging portion 530 that needs to be moved to the surface of the isolation structure 300, that is, the material of the second packaging portion 530 can be easily moved into the relatively narrow space between the second isolation portion 320 and the pixel defining portion 210, thereby facilitating the formation of the second packaging portion 530.

[0094] Optionally, an edge of the second transition surface 523 close to the substrate 100 may be connected to the second packaging portion 530 .

[0095] Optionally, the second transition surface 523 may include a curved surface to facilitate the material of the second encapsulation portion 530 to move into a relatively narrow space between the second isolation portion 320 and the pixel defining portion 210 .

[0096] Optionally, the second transition surface 523 may include a curved surface that is recessed toward the side of the substrate 100, so as to better reduce the shielding effect of the first step portion 520 on the material of the second packaging portion 530, thereby better facilitating the movement of the material of the second packaging portion 530 into the relatively narrow space between the second isolation portion 320 and the pixel defining portion 210.

[0097] like Figure 3 As shown, in some optional embodiments, the thickness of the first stepped portion 520 can be adjusted so that at least part of the first flat surface 521 can be connected to the second encapsulation portion 530, so that the first stepped portion 520 can provide a better support for the second encapsulation portion 530, so that the second encapsulation portion 530 is not likely to fall off toward the pixel opening 220. For example, the first flat surface 521 can be connected to the surface of the second isolation portion 320 that is covered on the side facing the pixel opening 220, so that the second encapsulation portion 530 is not likely to fall off toward the pixel opening 220.

[0098] Optionally, when the first flat surface 521 is connected to the second packaging portion 530 , an edge of the second transition surface 523 facing away from the substrate 100 may also be connected to the second packaging portion 530 .

[0099] Figure 4 It is a partial cross-sectional view of a display panel 10 provided in yet another embodiment of the present application.

[0100] like Figure 4 As shown, in some other optional embodiments, the first flat surface 521 may also be spaced apart from the second packaging portion 530 .

[0101] Optionally, the second transition surface 523 may be connected to a side of the first flat surface 521 away from the first transition surface 522 .

[0102] In this embodiment, when the second encapsulation part 530 falls off relative to the isolation structure 300, the first step part 520 having a height difference with the first encapsulation part 510 can effectively restrict the material of the second encapsulation part 530 that falls off from falling toward the first encapsulation part 510 above the pixel opening 220, so that the second encapsulation part 530 that falls off is not easy to damage the light-emitting device 400 in the pixel opening 220, thereby effectively improving the working reliability of the display panel 10. In addition, by providing a conductive opening 500b on the gap cavity 500a, the material of the film layer structure prepared subsequently can enter the gap cavity 500a through the conductive opening 500b, so that the film layer structure prepared subsequently can be at least partially located in the gap cavity 500a and play a good supporting role for the second encapsulation part 530, so that the second encapsulation part 530 is not easy to fall off toward the pixel opening 220, thereby effectively improving the structural stability of the display panel 10.

[0103] Optionally, the conductive opening 500 b may be in a ring shape on the circumference of the first packaging portion 510 , so as to further facilitate the material of the film layer structure prepared subsequently to enter the gap cavity 500 a through the conductive opening 500 b .

[0104] Optionally, the slope of the edge of the first flat surface 521 toward the second transition surface 523 is not equal to the slope of the edge of the second transition surface 523 toward the first flat surface 521, so that in the direction from the first flat surface 521 to the second transition surface 523, the thickness of the first step portion 520 can be reduced to a large extent, so as to better reduce the shielding effect of the first step portion 520 on the material of the second packaging portion 530, thereby better facilitating the movement of the material of the second packaging portion 530 into the relatively narrow space between the second isolation portion 320 and the pixel defining portion 210.

[0105] In some optional embodiments, the second encapsulation part 530 includes a first sub-portion 531 covering the surface of the second isolation part 320 facing the isolation opening 300a, and the first sub-portion 531 has a third transition surface 531a on the side away from the second isolation part 320, and the third transition surface 531a is inclined relative to the surface of the first encapsulation part 510 facing away from the substrate 100. For example, in the direction away from the second isolation part 320, the third transition surface 531a is inclined toward the side away from the substrate 100, which can better improve the covering effect of the first sub-portion 531 on the second isolation part 320, and can reduce the first sub-portion 531 to move the material of the second encapsulation part 530 to the relatively narrow space between the second isolation part 320 and the pixel defining part 210, so as to form the second encapsulation part 530 located between the second isolation part 320 and the pixel defining part 210 and covering the surface of the first isolation part 310 and the third isolation part 330 facing the pixel opening 220.

[0106] Optionally, in the direction away from the second isolation portion 320, the third transition surface 531a is tilted toward the side away from the substrate 100, which may mean that the end of the third transition surface 531a close to the substrate 100 may be closer to the isolation structure 300 than the end of the third transition surface 531a away from the substrate 100.

[0107] In some optional embodiments, the third transition surface 531a may include a curved surface.

[0108] Optionally, the third transition surface 531 a may include a curved surface convex toward one side of the substrate 100 .

[0109] In these optional embodiments, by setting the third transition surface 531a to be at least partially curved, the first sub-portion 531 can gradually move away from the first step portion 520 in the direction away from the isolation structure 300, so that the material of the subsequently prepared film layer structure can better enter the relatively narrow space between the second isolation portion 320 and the pixel defining portion 210, so that the subsequently prepared film layer structure can also play a better supporting role for the second packaging portion 530.

[0110] In some optional embodiments, the first encapsulation layer 500 also includes a second step portion 540 connected to the second encapsulation portion 530 and located on the side of the isolation structure 300 away from the substrate 100. In the thickness direction X of the display panel 10, there is a height difference between at least a portion of the surface of the second step portion 540 away from the substrate 100 and the surface of the first step portion 520 away from the substrate 100, so that the second step portion 540 and the first step portion 520 are stepped.

[0111] Optionally, the second stepped portion 540 may be connected to an edge of the second packaging portion 530 away from the substrate 100 . For example, the second stepped portion 540 may be connected to an edge of the first sub-portion 531 away from the substrate 100 .

[0112] Optionally, the second stepped portion 540 may be spaced apart from the isolation structure 300 .

[0113] In these optional embodiments, during the preparation process of the display panel 10, the second step portion 540 located on the side of the isolation structure 300 away from the substrate 100 can also be used to limit the intrusion of water vapor into the light-emitting device 400 in the pixel opening 220, so that the second step portion 540 can play a certain packaging and protection effect. In the thickness direction X of the display panel 10, there is a height difference between at least part of the surface of the second step portion 540 on the side away from the substrate 100 and the surface of the first step portion 520 on the side away from the substrate 100, so that the second step portion 540 and the first step portion 520 are stepped, so that the first encapsulation layer 500 can better follow the convex morphology of the isolation structure 300 below relative to the pixel defining portion 210 to produce a corresponding undulating step morphology, so that the first step portion 520 above the pixel defining portion 210 and the second step portion 540 are not likely to have too large a thickness difference, so that the second step portion 540 can play a better packaging and protection effect during the preparation process of the display panel 10.

[0114] In some optional embodiments, the second step portion 540 and the first step portion 520 are stepped, which may mean that the height of the second step portion 540 compared to the substrate 100 may be higher than the height of the first step portion 520 compared to the substrate 100, so that the first encapsulation layer 500 follows the raised morphology of the lower isolation structure 300 relative to the pixel defining portion 210 to produce a corresponding undulating step morphology.

[0115] Optionally, in the thickness direction X of the display panel 10, the maximum spacing between the surface of the first step portion 520 on the side facing away from the substrate 100 and the substrate 100 is a second spacing, and the maximum spacing between the surface of the second step portion 540 on the side facing away from the substrate 100 and the substrate 100 is a third spacing, and the second spacing is smaller than the third spacing, so that the second step portion 540 and the first step portion 520 are stepped, that is, the height of the second step portion 540 relative to the substrate 100 can be higher than the height of the first step portion 520 relative to the substrate 100, so that the first encapsulation layer 500 can better follow the raised morphology of the lower isolation structure 300 relative to the pixel defining portion 210 to produce a corresponding undulating step morphology, and the thickness of the second step portion 540 located on the side of the isolation structure 300 facing away from the substrate 100 can be close to the thickness of the first step portion 520, so as to better improve the encapsulation protection effect of the first encapsulation layer 500.

[0116] Figure 6b It is a schematic diagram of the partial structure of a first packaging layer provided in an embodiment of the present application.

[0117] like Figure 5 and Figure 6b As shown, in the direction from the isolation structure 300 to the pixel opening 220, the second step portion 540, the first step portion 520 and the first packaging portion 510 can be in a stepped shape that gradually descends toward the substrate 100, so that the first packaging layer 500 can better follow the undulating morphology of the isolation structure 300 and the pixel definition layer 200 below it to produce a corresponding undulating step morphology, thereby being able to better improve the packaging effect of the first packaging layer 500.

[0118] like Figure 5 As shown, in some optional embodiments, the second step portion 540 has a second flat surface 541 and a fourth transition surface 542 on a side away from the substrate 100, the second flat surface 541 and the fourth transition surface 542 are connected at the edge of the side away from the isolation opening 300a, and the fourth transition surface 542 is inclined relative to the second flat surface 541. For example, in the direction away from the substrate 100, the fourth transition surface 542 is inclined toward the direction away from the isolation opening 300a.

[0119] Optionally, in the direction away from the substrate 100, the fourth transition surface 542 is tilted toward the direction away from the isolation opening 300a, which may mean that the end of the fourth transition surface 542 facing away from the substrate 100 may be farther away from the isolation opening 300a than the end of the fourth transition surface 542 close to the substrate 100.

[0120] Optionally, at least a portion of the second flat surface 541 is parallel to the surface of the first packaging portion 510 facing away from the substrate 100, so that the second flat surface 541 can have a good flatness, which can facilitate the leveling of the film structure prepared later, and also make the film thickness of the second step portion 540 at the second flat surface 541 more uniform, so as to better improve the packaging protection effect of the second step portion 540. Optionally, at least a portion of the second flat surface 541 is parallel to the first flat surface 521.

[0121] Optionally, in the thickness direction X of the display panel 10 , the distance between the second flat surface 541 and the substrate 100 may be a third distance.

[0122] Optionally, the fourth transition surface 542 may be connected to the surface of the second packaging portion 530 facing away from the isolation structure 300. For example, the edge of the fourth transition surface 542 facing the substrate 100 may be connected to the edge of the third transition surface 531a facing away from the substrate 100.

[0123] In these optional embodiments, in the direction away from the substrate 100, by setting the fourth transition surface 542 to be inclined in the direction away from the isolation opening 300a, the second step portion 540 connected to the second packaging portion 530 can be better bypassed to the side of the isolation structure 300 away from the substrate 100, so as to form the morphology of the second step portion 540.

[0124] In some optional embodiments, the fourth transition surface 542 may include a curved surface.

[0125] Optionally, the fourth transition surface 542 may include a curved surface that is convex toward a side away from the substrate 100 .

[0126] Optionally, the maximum thickness of the second packaging portion 530 is smaller than the maximum thickness of the second stepped portion 540 .

[0127] In these optional embodiments, by setting the fourth transition surface 542 to be at least partially curved, the thickness of the second step portion 540 can gradually increase in the direction away from the isolation opening 300a, so as to enhance the packaging and protection effect of the second step portion 540 on the material of the light-emitting device 400 during the preparation process of the display panel 10.

[0128] Optionally, the slope of the edge of the second flat surface 541 toward the fourth transition surface 542 is equal to the slope of the edge of the fourth transition surface 542 toward the second flat surface 541, so that the connection between the second flat surface 541 and the fourth transition surface 542 can be relatively smooth, and stress concentration is not prone to occur at the connection between the second flat surface 541 and the fourth transition surface 542, thereby better improving the structural stability of the first packaging layer 500.

[0129] Figure 5 It is a partial cross-sectional view of a display panel 10 provided in yet another embodiment of the present application.

[0130] like Figure 5 As shown, the display panel 10 further includes a second encapsulation layer 600 , which is located on a side of the first encapsulation layer 500 away from the substrate 100 . The second encapsulation layer 600 at least covers the first encapsulation layer 500 to further encapsulate the display panel 10 .

[0131] Optionally, at least part of the second encapsulation layer 600 is filled in the conductive opening 500b and the gap cavity 500a, so that the second encapsulation layer 600 can better support the second encapsulation part 530, making it difficult for the second encapsulation part 530 to fall off toward the pixel opening 220, thereby better improving the structural stability of the display panel 10.

[0132] Optionally, the material of the second encapsulation layer 600 may include an organic material, so that the material of the second encapsulation layer 600 has good fluidity, so that when preparing the second encapsulation layer 600, the material of the second encapsulation layer 600 can easily enter the gap cavity 500a through the conductive opening 500b. In addition, the surface of the second encapsulation layer 600 facing away from the substrate 100 can have good flatness, so as to facilitate the subsequent formation of a film layer or a device on the second encapsulation layer 600.

[0133] Optionally, the second encapsulation layer 600 may be prepared by inkjet printing (IJP).

[0134] In some optional embodiments, the display panel 10 may further include a third encapsulation layer 700, which is located on a side of the second encapsulation layer 600 away from the substrate 100. By providing the third encapsulation layer 700 on a side of the second encapsulation layer 600 away from the substrate 100, the encapsulation effect of the display panel 10 can be further improved.

[0135] Optionally, the material of the third encapsulation layer 700 may include inorganic material, so that the third encapsulation layer 700 is not easy to absorb water, so that the third encapsulation layer 700 can better limit the invasion of external water vapor into the light-emitting device 400, so that the third encapsulation layer 700 can have a better encapsulation effect.

[0136] Optionally, the third encapsulation layer 700 may be prepared by a chemical vapor deposition process.

[0137] In some optional embodiments, the display panel 10 further includes a touch layer, a polarizing layer, and a cover plate located on the side of the third encapsulation layer 700 away from the substrate 100. The touch layer can be used to realize the touch operation of the display panel 10, the polarizing layer can be used to filter light to improve the display effect of the display panel 10, and the cover plate can be used to protect the film layer below to improve the strength of the display panel 10.

[0138] Figure 6a It is a schematic diagram of a partial structure of a first encapsulation layer 500 provided in an embodiment of the present application.

[0139] like Figure 6a As shown, in some optional embodiments, at least a portion of the first transition surface 522 is recessed toward the pixel defining portion 210 to form a recessed structure 522a. The setting of the recessed structure 522a can increase the surface area of ​​the first transition surface 522, which is beneficial to increase the connection area between the first packaging layer 500 and the subsequently prepared film layer structure, so as to better improve the structural stability of the first packaging layer 500 and the subsequently prepared film layer structure, and can better reduce the influence of the setting of the first step portion 520 on the structural stability of the upper film layer structure.

[0140] For example, the provision of the recessed structure 522 a is beneficial to increasing the connection area between the first encapsulation layer 500 and the second encapsulation layer 600 , so as to better enhance the structural stability of the first encapsulation layer 500 and the second encapsulation layer 600 .

[0141] Optionally, there are multiple recessed structures 522a, and the multiple recessed structures 522a are arranged at intervals on the circumferential side of the first packaging portion 510, so as to better enhance the connection area between the first transition surface 522 on the circumferential side of the first packaging portion 510 and the subsequently prepared film layer structure, so as to better reduce the influence of the setting of the first step portion 520 on the structural stability of the upper film layer structure.

[0142] In some optional embodiments, the recessed structure 522a is extended and formed in a direction from the first packaging portion 510 to the first flat surface 521, so that in the direction from the first packaging portion 510 to the first flat surface 521, the first transition surface 522 can be better attached to the upper film layer structure, so as to better improve the structural stability of the first packaging layer 500 and the subsequently prepared film layer structure.

[0143] Optionally, the recessed structure 522a may be slit-shaped and extend in a direction from the first packaging portion 510 to the first flat surface 521. A convex structure 522b may be formed between adjacent recessed structures 522a, and the convex structure 522b may be strip-shaped and extend in a direction from the first packaging portion 510 to the first flat surface 521.

[0144] Figure 7 It is a partial cross-sectional view of a display panel 10 provided in another embodiment of the present application.

[0145] like Figure 7 As shown, in some optional embodiments, the distance between the surface of the first step portion 520 facing away from the substrate 100 and the substrate 100 is greater than or equal to the distance between the surface of the second isolation portion 320 facing away from the substrate 100 and the substrate 100, so that there is less likely to be a large step difference between the first step portion 520 and the isolation structure 300 and / or the partial structure above the isolation structure 300, so as to facilitate the leveling of the subsequently prepared film layer structure, thereby facilitating the arrangement and preparation of the subsequent film layer structure.

[0146] For example, by setting the distance between the surface of the first step portion 520 facing away from the substrate 100 and the substrate 100 to be greater than or equal to the distance between the surface of the second isolation portion 320 facing away from the substrate 100 and the substrate 100, it is less likely that there will be a large step difference between the first step portion 520 and the isolation structure 300 and / or the second step portion 540 above the isolation structure, so as to facilitate the leveling of the subsequently prepared second encapsulation layer 600, thereby facilitating the arrangement and preparation of the subsequent film layer structure.

[0147] When the distance between the surface of the first stepped portion 520 facing away from the substrate 100 and the substrate 100 is greater than or equal to the distance between the surface of the second isolation portion 320 facing away from the substrate 100 and the substrate 100, the first encapsulation layer 500 may not have the third transition surface 531a.

[0148] Figure 8 It is a partial cross-sectional view of a display panel 10 provided in another embodiment of the present application.

[0149] Please combine Figures 1a to 7 Also see Figure 8 The embodiment of the first aspect of the present application further provides a display panel 10, comprising: a substrate 100; an isolation structure 300, arranged on one side of the substrate 100, the isolation structure 300 having an isolation opening 300a; a light-emitting device 400, at least partially arranged in the isolation opening 300a; a first encapsulation layer 500, arranged on a side of the light-emitting device 400 away from the substrate 100, the first encapsulation layer 500 comprising a first encapsulation portion 510 and a second stepped portion 540, the orthographic projection of the first encapsulation portion 510 on the substrate 100 being located within the orthographic projection of the light-emitting device 400 on the substrate 100, the second stepped portion 540 being located on the side of the isolation structure 300 away from the substrate 100, and in the thickness direction X of the display panel 10, at least a portion of the surface of the second stepped portion 540 on the side away from the substrate 100 has a height difference with the surface of the first encapsulation portion 510 on the side away from the substrate 100, so that the second stepped portion 540 and the first encapsulation portion 510 are stepped.

[0150] In a display panel 10 provided in an embodiment of the present application, the display panel 10 includes a substrate 100, an isolation structure 300, a light emitting device 400, and a first encapsulation layer 500. The isolation structure 300 is disposed on one side of the substrate 100, and the isolation structure 300 is provided with an isolation opening 300a, and at least part of the light emitting device 400 is disposed in the isolation opening 300a. The isolation structure 300 can be used to divide the sub-pixels of the display panel 10.

[0151] The first encapsulation layer 500 is disposed on the side of the light emitting device 400 away from the substrate 100, and the first encapsulation layer 500 can be used to encapsulate the light emitting device 400. The first encapsulation layer 500 includes a first encapsulation portion 510 and a second stepped portion 540. The orthographic projection of the first encapsulation portion 510 on the substrate 100 is located within the orthographic projection of the pixel opening 220 on the substrate 100. The first encapsulation portion 510 can better encapsulate the light emitting device 400 in the isolation opening 300a.

[0152] The second step portion 540 is located on the side of the isolation structure 300 away from the substrate 100. During the preparation process of the display panel 10, the second step portion 540 located on the side of the isolation structure 300 away from the substrate 100 can also be used to limit the intrusion of water vapor into the light-emitting device 400 in the pixel opening 220, so that the second step portion 540 can play a certain packaging and protection effect. In the thickness direction X of the display panel 10, there is a height difference between at least part of the surface of the second step portion 540 on the side away from the substrate 100 and the surface of the first packaging portion 510 on the side away from the substrate 100, so that the second step portion 540 and the first packaging portion 510 are stepped, so that the first packaging layer 500 can better follow the convex morphology of the isolation structure 300 below relative to the substrate 100 to produce a corresponding undulating step morphology, so that the first packaging portion 510 above the substrate 100 and the second step portion 540 are not likely to have too large a thickness difference, so that the second step portion 540 can play a better packaging and protection effect during the preparation process of the display panel 10.

[0153] In some optional embodiments, the second step portion 540 and the first packaging portion 510 are stepped, which may mean that the height of the second step portion 540 compared to the substrate 100 may be higher than the height of the first packaging portion 510 compared to the substrate 100, so that the first packaging layer 500 follows the raised morphology of the lower isolation structure 300 relative to the substrate 100 to produce a corresponding undulating step morphology.

[0154] In some optional embodiments, in the thickness direction X of the display panel 10, the maximum distance between the surface of the first packaging portion 510 on the side facing away from the substrate 100 and the substrate 100 is a first distance, and the maximum distance between the surface of the second step portion 540 on the side facing away from the substrate 100 and the substrate 100 is a third distance, and the first distance is smaller than the third distance, so that the second step portion 540 and the first packaging portion 510 are stepped, that is, the height of the second step portion 540 relative to the substrate 100 can be higher than the height of the first packaging portion 510 relative to the substrate 100, so that the first packaging layer 500 can better follow the raised morphology of the lower isolation structure 300 relative to the substrate 100 to produce a corresponding undulating stepped morphology, and the thickness of the second step portion 540 located on the side of the isolation structure 300 facing away from the substrate 100 can be close to the thickness of the first packaging portion 510, so as to better improve the packaging protection effect of the first packaging layer 500.

[0155] Optionally, a display panel 10 provided in an embodiment of the first aspect of the present application may be the display panel 10 in any of the aforementioned embodiments. Therefore, a display panel 10 provided in an embodiment of the present application may have the beneficial effects of the display panel 10 in any of the aforementioned embodiments, and the present application will not elaborate on it.

[0156] For example, the substrate 100 may be the substrate 100 described in any of the foregoing embodiments. For example, the light-emitting device 400 may be the light-emitting device 400 described in any of the foregoing embodiments. For example, the isolation structure 300 may be the isolation structure 300 described in any of the foregoing embodiments, and the isolation structure 300 may include the first isolation portion 310, the second isolation portion 320, and the third isolation portion 330 in any of the foregoing embodiments. The isolation structure 300 may be used to isolate the materials of the light-emitting layer 420 and the second electrode 430 when preparing the light-emitting layer 420 and the second electrode 430 of the light-emitting device 400.

[0157] Optionally, the display panel 10 also includes the pixel definition layer 200 described in any of the aforementioned embodiments, the pixel definition layer 200 includes a pixel defining portion 210 and a pixel opening 220 formed by the pixel defining portion 210, the light-emitting device 400 is arranged in the pixel opening 220, and the orthographic projection of the first packaging portion 510 on the substrate 100 is located within the orthographic projection of the pixel opening 220 on the substrate 100.

[0158] Optionally, the first encapsulation layer 500 may be the first encapsulation layer 500 described in any of the aforementioned embodiments, and the first encapsulation layer 500 may include the first encapsulation portion 510, the first stepped portion 520, the second encapsulation portion 530, and the second stepped portion 540 described in any of the aforementioned embodiments. In the direction from the isolation structure 300 to the pixel opening 220, the second stepped portion 540, the first stepped portion 520, and the first encapsulation portion 510 may be in a stepped shape gradually descending toward the substrate 100, so that the first encapsulation layer 500 can better follow the undulating morphology of the isolation structure 300 and the pixel definition layer 200 thereunder to produce a corresponding undulating stepped morphology, thereby being able to better improve the encapsulation effect of the first encapsulation layer 500.

[0159] Please combine Figures 1a to 8The embodiment of the first aspect of the present application further provides a display panel 10, comprising: a substrate 100; a pixel definition layer 200, disposed on one side of the substrate 100, the pixel definition layer 200 comprising a pixel defining portion 210 and a pixel opening 220 formed by the pixel defining portion 210; an isolation structure 300, disposed on a side of the pixel defining portion 210 away from the substrate 100, the isolation structure 300 having an isolation opening 300a connected to the pixel opening 220; a light emitting device 400, disposed in the pixel opening 220; a first encapsulation layer 500, disposed on a side of the light emitting device 400 away from the substrate 100 00, the first encapsulation layer 500 includes a first stepped portion 520 and a second stepped portion 540, the orthographic projection of the first stepped portion 520 on the substrate 100 at least partially overlaps with the orthographic projection of the pixel defining portion 210 on the substrate 100, the second stepped portion 540 is located on the side of the isolation structure 300 away from the substrate 100, and in the thickness direction X of the display panel 10, there is a height difference between at least a portion of the surface of the second step portion 540 on the side away from the substrate 100 and the surface of the first step portion 520 on the side away from the substrate 100, so that the second step portion 540 and the first step portion 520 are stepped.

[0160] In a display panel 10 provided in an embodiment of the present application, the display panel 10 includes a substrate 100, a pixel definition layer 200, an isolation structure 300, a light-emitting device 400, and a first encapsulation layer 500. The pixel definition layer 200 is disposed on one side of the substrate 100, and the pixel definition layer 200 includes a pixel definition portion 210 and a pixel opening 220 formed by the pixel definition portion 210. The isolation structure 300 is disposed on a side of the pixel definition portion 210 away from the substrate 100, and the isolation structure 300 is provided with an isolation opening 300a connected to the pixel opening 220, and the light-emitting device 400 is disposed in the pixel opening 220, and both the pixel definition layer 200 and the isolation structure 300 can be used to divide the sub-pixels of the display panel 10.

[0161] The first encapsulation layer 500 is disposed on a side of the light emitting device 400 away from the substrate 100, and the first encapsulation layer 500 can be used to encapsulate the light emitting device 400. The first encapsulation layer 500 includes a first stepped portion 520 and a second stepped portion 540, and the orthographic projection of the first stepped portion 520 on the substrate 100 at least partially overlaps with the orthographic projection of the pixel defining portion 210 on the substrate 100, and the first stepped portion 520 can encapsulate the light emitting device 400 located on the pixel defining portion 210.

[0162] The second step portion 540 is located on the side of the isolation structure 300 away from the substrate 100. During the preparation process of the display panel 10, the second step portion 540 located on the side of the isolation structure 300 away from the substrate 100 can also be used to limit the intrusion of water vapor into the light-emitting device 400 in the pixel opening 220, so that the second step portion 540 can play a certain packaging and protection effect. In the thickness direction X of the display panel 10, there is a height difference between at least a portion of the surface of the second step portion 540 on the side facing away from the substrate 100 and the surface of the first step portion 520 on the side facing away from the substrate 100, so that the second step portion 540 and the first step portion 520 are stepped, so that the first encapsulation layer 500 can better follow the raised morphology of the isolation structure 300 below relative to the pixel defining portion 210 to produce a corresponding undulating step morphology, so that the first step portion 520 and the second step portion 540 above the pixel defining portion 210 are not prone to have too large a thickness difference, so that the second step portion 540 can play a better encapsulation and protection effect during the preparation process of the display panel 10.

[0163] Optionally, a display panel 10 provided in an embodiment of the first aspect of the present application may be the display panel 10 in any of the aforementioned embodiments. Therefore, a display panel 10 provided in an embodiment of the present application may have the beneficial effects of the display panel 10 in any of the aforementioned embodiments, and the present application will not elaborate on it.

[0164] For example, the substrate 100 may be the substrate 100 in any of the foregoing embodiments. For example, the light-emitting device 400 may be the light-emitting device 400 in any of the foregoing embodiments. For example, the pixel definition layer 200 may be the pixel definition layer 200 in any of the foregoing embodiments. For example, the isolation structure 300 may be the isolation structure 300 in any of the foregoing embodiments, and the isolation structure 300 may include the first isolation portion 310, the second isolation portion 320, and the third isolation portion 330 in any of the foregoing embodiments. The isolation structure 300 may be used to isolate the materials of the light-emitting layer 420 and the second electrode 430 when preparing the light-emitting layer 420 and the second electrode 430 of the light-emitting device 400.

[0165] Optionally, the first encapsulation layer 500 may be the first encapsulation layer 500 in any of the aforementioned embodiments, and the first encapsulation layer 500 may include the first encapsulation portion 510, the first stepped portion 520, the second encapsulation portion 530, and the second stepped portion 540 in any of the aforementioned embodiments. In the direction from the isolation structure 300 to the pixel opening 220, the second stepped portion 540, the first stepped portion 520, and the first encapsulation portion 510 may be in a stepped shape gradually descending toward the substrate 100, so that the first encapsulation layer 500 can better follow the undulating morphology of the isolation structure 300 and the pixel definition layer 200 thereunder to produce a corresponding undulating stepped morphology, thereby being able to better improve the encapsulation effect of the first encapsulation layer 500.

[0166] The embodiment of the second aspect of the present application provides a display device, and the display device includes the display panel 10 of any of the above-mentioned embodiments. Since the display device provided by the embodiment of the second aspect of the present application includes the display panel 10 of any of the above-mentioned first aspects, the display device provided by the embodiment of the second aspect of the present application has the beneficial effects of the display panel 10 of any of the above-mentioned first aspects, which will not be repeated here.

[0167] The display device in the embodiments of the present application includes but is not limited to mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, consoles, and other devices with display functions.

[0168] According to the embodiments of the present application as above, these embodiments do not describe all the details in detail, nor do they limit the invention to specific embodiments. Obviously, many modifications and changes can be made based on the above description. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present application, so that those skilled in the art can make good use of the present application and the modifications based on the present application. The present application is only limited by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized in that: include: substrate; A pixel definition layer is disposed on one side of the substrate, wherein the pixel definition layer comprises a pixel definition portion and a pixel opening formed by the pixel definition portion; A light emitting device is disposed in the pixel opening; a first encapsulation layer, arranged on a side of the light-emitting device away from the substrate, the first encapsulation layer comprising a first encapsulation portion and a first stepped portion, the orthographic projection of the first encapsulation portion on the substrate being located within the orthographic projection of the pixel opening on the substrate, the orthographic projection of the first stepped portion on the substrate at least partially overlapping with the orthographic projection of the pixel defining portion on the substrate, The first stepped portion is connected to the first packaging portion. In the thickness direction of the display panel, there is a height difference between at least a portion of the surface of the first stepped portion on the side away from the substrate and the surface of the first packaging portion on the side away from the substrate, so that the first stepped portion and the first packaging portion are stepped. The first stepped portion has a first flat surface, a first transition surface, and a second transition surface located on the side of the first flat surface away from the first packaging portion. The first transition surface is connected to the surface of the first packaging portion on the side away from the substrate. The first flat surface is connected to the edge of the first transition surface away from the first packaging portion. In the direction away from the first packaging portion, the second transition surface is inclined toward the substrate. At least a portion of the first transition surface is recessed toward the pixel defining portion to form a recessed structure. There are multiple recessed structures, and the multiple recessed structures are spaced apart on the peripheral side of the first packaging portion. The recessed structures are strip-shaped and extend in a direction from the first packaging portion to the first flat surface.

2. The display panel according to claim 1, characterized in that: The first stepped portion is connected to an edge of the first encapsulation portion facing the pixel defining portion.

3. The display panel according to claim 1, characterized in that: In the thickness direction of the display panel, the maximum distance between the surface of the first packaging portion facing away from the substrate and the substrate is a first distance, the maximum distance between the surface of the first step portion facing away from the substrate and the substrate is a second distance, and the first distance is smaller than the second distance, so that the first step portion and the first packaging portion are stepped.

4. The display panel according to claim 1, characterized in that: The first transition surface is inclined relative to the first flat surface.

5. The display panel according to claim 4, characterized in that: The slope of the edge of the first flat surface toward the first transition surface is equal to the slope of the edge of the first transition surface toward the first flat surface.

6. The display panel according to claim 1, characterized in that: The display panel also includes an isolation structure arranged on the side of the pixel defining portion away from the substrate, the isolation structure is provided with an isolation opening connected to the pixel opening, the isolation structure includes a first isolation portion and a second isolation portion located on the side of the first isolation portion away from the substrate, the second isolation portion is arranged to protrude from the first isolation portion toward the isolation opening.

7. The display panel according to claim 6, characterized in that: The isolation structure further includes a third isolation portion located on a side of the first isolation portion facing the substrate, and the third isolation portion is disposed protruding from the first isolation portion toward the isolation opening.

8. The display panel according to claim 6, characterized in that: The first encapsulation layer also includes a second encapsulation portion arranged on a side of the isolation structure facing the isolation opening, the maximum thickness of the second encapsulation portion is smaller than the maximum thickness of the first encapsulation portion, and / or the maximum thickness of the second encapsulation portion is smaller than the maximum thickness of the first step portion.

9. The display panel according to claim 8, characterized in that: The second packaging part includes a first sub-part covering the surface of the second isolation part facing the isolation opening, and the first sub-part has a third transition surface on the side away from the second isolation part. In the direction away from the second isolation part, the third transition surface is inclined toward the side away from the substrate.

10. The display panel according to claim 9, characterized in that: The first packaging layer includes a second stepped portion, which is located on the side of the isolation structure away from the substrate. The second stepped portion has a second flat surface and a fourth transition surface on the side away from the substrate. The second flat surface is connected to the edge of the fourth transition surface away from the isolation opening. In the direction away from the substrate, the fourth transition surface is inclined toward the direction away from the isolation opening.

11. The display panel according to any one of claims 6 to 10, characterized in that: A distance between a surface of the first step portion facing away from the substrate and the substrate is greater than or equal to a distance between a surface of the second isolation portion facing away from the substrate and the substrate.

12. The display panel according to claim 6, characterized in that: In the thickness direction of the display panel, the maximum distance between the surface of the first packaging part facing away from the substrate and the substrate is a first distance, the first packaging layer includes a second step portion, the second step portion is located on the side of the isolation structure facing away from the substrate, the maximum distance between the surface of the second step portion facing away from the substrate and the substrate is a third distance, and the first distance is smaller than the third distance, so that the second step portion and the first packaging part are stepped.

13. The display panel according to claim 6, characterized in that: The first packaging layer also includes a second packaging portion arranged on the side of the isolation structure facing the isolation opening, the first step portion has a first transition surface on the side away from the substrate, the first transition surface is connected to the surface of the first packaging portion on the side away from the substrate, the first flat surface is connected to the edge of the first transition surface away from the first packaging portion, the second transition surface is located on the side of the first flat surface away from the first transition surface, the second transition surface and the second packaging portion enclose a gap cavity, and the first flat surface and the second packaging portion are spaced apart to form a conductive opening on the side of the gap cavity away from the substrate.

14. The display panel according to claim 13, characterized in that: The display panel further includes a second encapsulation layer disposed on a side of the first encapsulation layer away from the substrate, and at least a portion of the second encapsulation layer is located in the gap cavity via the conductive opening.

15. The display panel according to claim 1, characterized in that: The display panel also includes a pixel definition layer arranged on one side of the substrate, the pixel definition layer includes a pixel defining portion and a pixel opening surrounded by the pixel defining portion, the light-emitting device is arranged in the pixel opening, the orthographic projection of the first packaging portion on the substrate is located within the orthographic projection of the pixel opening on the substrate, the first packaging layer also includes a first step portion, the orthographic projection of the first step portion on the substrate at least partially overlaps with the orthographic projection of the pixel defining portion on the substrate, and the first step portion is connected to the edge of the first packaging portion toward the pixel defining portion.

16. A display panel, characterized in that: include: substrate; A pixel definition layer is disposed on one side of the substrate, wherein the pixel definition layer comprises a pixel definition portion and a pixel opening formed by the pixel definition portion; An isolation structure is disposed on one side of the substrate, and the isolation structure is provided with an isolation opening; a light emitting device, at least partially disposed in the isolation opening and the pixel opening; a first encapsulation layer, arranged on a side of the light-emitting device away from the substrate, the first encapsulation layer comprising a first encapsulation portion, a first stepped portion and a second stepped portion, the orthographic projection of the first encapsulation portion on the substrate being located within the orthographic projection of the light-emitting device on the substrate, the orthographic projection of the first stepped portion on the substrate at least partially overlaps with the orthographic projection of the pixel defining portion on the substrate, the first stepped portion is connected to the first encapsulation portion, and the second stepped portion is located on a side of the isolation structure away from the substrate, In the thickness direction of the display panel, there is a height difference between at least a portion of the surface of the second stepped portion on a side away from the substrate and a surface of the first encapsulation portion on a side away from the substrate, so that the second stepped portion and the first encapsulation portion are in a stepped shape. Among them, the side of the first step portion facing away from the substrate has a first flat surface and a first transition surface, the first transition surface is connected to the surface of the first packaging portion facing away from the substrate, the first flat surface is connected to the edge of the first transition surface away from the first packaging portion, at least part of the first transition surface is recessed toward the pixel defining portion to form a recessed structure, the number of the recessed structures is multiple, and the multiple recessed structures are spaced apart on the circumference of the first packaging portion, and the recessed structures are strip-shaped and extend in a direction from the first packaging portion to the first flat surface.

17. The display panel according to claim 16, characterized in that: In the thickness direction of the display panel, the maximum distance between the surface of the first packaging portion facing away from the substrate and the substrate is a first distance, the maximum distance between the surface of the second step portion facing away from the substrate and the substrate is a third distance, and the first distance is smaller than the third distance, so that the second step portion and the first packaging portion are stepped.

18. A display device, characterized in that: Comprising the display panel as claimed in any one of claims 1 to 17.

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