Computer circuit board soldering equipment and solder joint detection method

Abstract

The present invention belongs to the technical field of circuit board welding, and specifically relates to a computer circuit board soldering equipment and a soldering point detection method. The printed circuit board soldering equipment includes a soldering machine body, including a soldering machine body, a clamp used in conjunction with the soldering machine body, a cooling and shaping component for cooling and shaping the soldering point, a circulating pushing component used in conjunction with the cooling and shaping component, and a CCD camera for visually detecting the soldering point; the printed circuit board soldering point detection method includes the following steps: step one, electronic component assembly; step two, pin welding; step three, soldering point cooling and shaping; step four, soldering point detection. The present invention can move the positioning pressure strip of the electronic component after welding is completed, so that it is away from the electronic component, and cool and shape the soldering point at the same time, improve the cooling and shaping efficiency, and reduce the interference with visual detection, so that the detection result is more accurate, avoid duplication of labor, and improve production efficiency.

Description

Technical Field

[0001] The invention belongs to the technical field of circuit board welding, and in particular relates to a computer circuit board soldering device and a soldering point detection method. Background Art

[0002] Computer circuit boards are the core components of computer hardware systems, and are primarily responsible for connecting and transmitting electronic signals, as well as providing installation and support for various computer components. Computer circuit boards are also a type of printed circuit boards, and have different structures depending on the usage scenarios. Printed circuit board soldering equipment is generally used during production.

[0003] The structure of printed circuit board soldering equipment mainly includes three-axis manipulator, printed circuit board fixture, solder paste supply system, high-precision motion control system, heat source system, and control system. These components work together to ensure that the automatic soldering machine can complete the soldering task efficiently and accurately, so that it is widely used in the electronics manufacturing industry and improves production efficiency. The specific introduction is as follows:

[0004] Three-axis robot: plays a key role in soldering equipment. Through three-dimensional all-round adjustment, the UL soldering station, solder nozzle and tin wire do not need to be operated by the operator, completely replacing the hands for welding operations.

[0005] Printed circuit board fixture: used to position the printed circuit board and the electronic components to be soldered. It is the basis for the automatic soldering machine to work continuously and stably, ensuring that each soldering point can be accurately aligned.

[0006] Solder paste supply system: The solder paste supply system provides the right amount of solder paste for each soldering point. It usually uses a syringe feeder or a roller feeder to squeeze the solder paste from the reservoir and apply it to the soldering point through compressed gas or rollers.

[0007] High-precision motion control system: The high-precision motion control system uses servo motors, linear guides and other components, detects position and speed through encoders, and controls the position and speed of moving parts through PID algorithms, ensuring high-precision positioning of the automatic soldering machine during the welding process, thereby improving welding quality and stability.

[0008] Soldering gun system: The soldering gun system usually uses components such as heating plates and infrared heating tubes to melt the solder paste through heating and combine it with the pads on the PCB board.

[0009] Control system: The control system is the brain of the automatic soldering machine, responsible for controlling the operation and parameter settings of the entire equipment. It usually uses devices such as PLC or PC and is operated through a human-machine interface.

[0010] The printed circuit board fixture in the above-mentioned printed circuit board soldering equipment plays a very important positioning role in the welding process. In order to stably position the electronic components on the printed circuit board, the existing printed circuit board fixture generally adopts a hinge connection upper pressing plate. After the electronic components and the printed circuit board are combined, it is pressed on the electronic components to ensure the stable combination of the electronic components and the printed circuit board, so as to ensure the accuracy of welding. However, there are the following defects when using it:

[0011] 1. During welding, a nitrogen blowing tube is usually installed at the welding head of the welding gun to protect the solder joint and accelerate the cooling of the solder joint. However, since the upper pressing plate is pressed on the electronic component, the nitrogen blowing will be blocked by the upper pressing plate and cannot be accurately blown on the solder joint, so that it cannot be effectively cooled, thereby reducing the efficiency of cooling and shaping.

[0012] 2. After welding, since the upper pressure plate is still pressed on the electronic component, when visually inspecting the solder joints, the obstruction of the upper pressure plate will produce shadows on the solder joints, which not only affects the visual inspection effect, but also easily leads to misjudgment due to the existence of shadows, resulting in repeated work and reduced production efficiency. Summary of the invention

[0013] The purpose of the present invention is to provide a computer circuit board soldering equipment and a solder joint detection method, which can move the positioning strip of the electronic component away from the electronic component after soldering is completed, and cool and shape the solder joint at the same time, thereby improving the cooling and shaping efficiency and reducing the interference with visual detection, so as to make the detection result more accurate, avoid duplication of labor, and improve production efficiency.

[0014] The technical solution adopted by the present invention is as follows:

[0015] A computer circuit board soldering device, comprising:

[0016] The soldering machine body is provided with a three-axis driving mechanism, and a welding gun and a welding platform for soldering the pins of electronic components are provided on the three-axis driving mechanism;

[0017] A fixture, comprising an outer frame placed on the welding platform, an annular positioning seat symmetrically installed on both sides of the outer frame, an annular support fixedly installed on the inner side of the annular positioning seat, and a positioning support plate fixedly installed between two groups of the annular supports, an annular gap is provided between the annular positioning seat and the annular support, and a positioning strip for pressing electronic components is movably embedded in the annular gap, and an annular positioning mechanism for adjusting and positioning the positioning strip is provided between the annular positioning seat and the annular support;

[0018] A cooling and shaping component, comprising an elastic water cooling pipe for cooling and shaping the solder joint and a water cooling row installed in the soldering machine body for providing cooling liquid, wherein both ends of the elastic water cooling pipe are respectively connected to the liquid inlet and outlet of the water cooling row, so that the cooling liquid circulates in the elastic water cooling pipe to cool and shape the solder joint;

[0019] A circulation pushing assembly, comprising a bracket parallel to the positioning pressure strip and a pipe positioning seat movably mounted inside the bracket, wherein a semicircular transverse groove for embedding and mounting the elastic water cooling pipe is integrally formed at the bottom of the pipe positioning seat;

[0020] A CCD camera is arranged perpendicular to the welding platform and located directly above the welding platform for welding point detection;

[0021] Among them, a linear drive mechanism is arranged between the bracket and the welding platform to drive the bracket to reciprocate on the fixture, thereby driving the elastic water-cooling tube to cool and shape the welds on the fixture one by one, and gradually disassemble the positioning support plate to reduce the obstruction of the CCD camera during weld detection.

[0022] As a preferred solution, the three-axis drive mechanism includes an X-axis linear drive installed in the soldering machine body, a Y-axis linear drive fixedly installed on one side of the soldering machine body through a gantry, and a Z-axis linear drive fixedly installed on the slide of the Y-axis linear drive. The welding platform is fixedly installed on the slide of the X-axis linear drive, and the welding gun is fixedly installed on the slide of the Z-axis linear drive through a support seat.

[0023] As a preferred solution, the annular positioning mechanism includes a micro servo motor fixedly mounted on one end of the annular positioning seat, transmission rollers rotatably mounted on both ends of the annular positioning seat, and a transmission belt wrapped around the transmission rollers, the power output end of the micro servo motor is directly connected to one of the transmission rollers, the transmission belt is wrapped around and embedded in the upper wall of the annular gap, and a magnetic metal flexible belt is wrapped around and embedded on the inner wall protruding from one side of the transmission roller, a positioning magnetic block is fixedly embedded on the top surface of the annular support, and adsorption magnetic blocks are fixedly embedded at both ends of the positioning strip to match the positioning magnetic block.

[0024] As a preferred solution, an X-cross reversing valve is further arranged between the elastic water-cooling tube and the water-cooling radiator, two inlets and outlets of the X-cross reversing valve are connected to the two ends of the elastic water-cooling tube, and the other two inlets and outlets are respectively connected to the inlets and outlets of the water-cooling radiator through a universal flexible tube, so that the X-cross reversing valve is used to exchange and adjust the flow direction of the coolant in the elastic water-cooling tube.

[0025] As a preferred solution, an elastic ball with the same inner diameter as the elastic water-cooling tube is placed in the elastic water-cooling tube, and expanded tubes with a diameter larger than the elastic ball are integrally formed at both ends of the elastic water-cooling tube. An isolation mesh plate for blocking the elastic ball is fixedly installed on the expanded tube on the side close to the port of the elastic water-cooling tube, so that the elastic ball is pushed back and forth inside the elastic water-cooling tube when the flow direction of the coolant in the elastic water-cooling tube is exchanged and adjusted, and the deformation pressure of the elastic ball is used to shape the welding point.

[0026] As a preferred solution, a positioning groove is provided on the bracket, and positioning columns are fixedly installed at both ends; an upper push plate is fixedly installed on the top surface of the pipe positioning seat, and the upper push plate is slidably embedded in the positioning groove, and both ends are slidably sleeved on the positioning columns; a return spring is fixedly installed between the bottom surfaces of both ends of the upper push plate and the positioning columns; a servo motor is fixedly installed at both ends of the top surface of the bracket, and an eccentric push rod is fixedly installed on its power output end, and the bottom end of the eccentric push rod abuts against the extension plate of the upper push plate to push it to move downward.

[0027] As a preferred solution, a vacuum suction cup is fixedly mounted on the top surface of the bracket, and its suction head extends to the bottom of the bracket for adsorbing the positioning pressure strip, and a vacuum generator is installed on the exhaust port of the vacuum suction cup.

[0028] As a preferred solution, the linear drive mechanism includes a linear actuator fixedly mounted on both sides of the welding platform and perpendicular to the positioning strip, and a thin cylinder fixedly mounted on the slide of the linear actuator, and both ends of the bracket are fixedly mounted between the power output ends of the two groups of the thin cylinders.

[0029] As a preferred solution, the CCD camera is fixedly mounted on the support seat by means of a support plate, a ring-shaped light source matching the CCD camera is fixedly mounted on the bottom surface of the support plate, and the CCD camera is connected to a PC for analyzing feedback data to draw conclusions on solder joint detection.

[0030] A computer circuit board solder joint detection method, using the above-mentioned printed circuit board soldering equipment, comprises the following steps:

[0031] Step 1, electronic component assembly: Place the printed circuit boards one by one in the positioning frame of the positioning support plate, and place the electronic components to be soldered on the surface of the printed circuit boards in a matching manner. After one group is placed, move the positioning strip in the annular gap, press it on the surface of the electronic components, position it, and place multiple groups of electronic components to be soldered in sequence;

[0032] Step 2: Pin welding: After the electronic components and printed circuit boards are assembled and positioned, the fixture is placed on the top surface of the welding platform. The three-axis drive mechanism is used to drive the welding gun to cooperate with the welding platform to weld the pins of the electronic components one by one on the printed circuit board. After one group of welding is completed, the welding gun is synchronously moved to the next group.

[0033] Step 3: Cooling and shaping the solder joints: Use the circulating push assembly to drive the elastic water cooling tube to move to a group of electronic components that have been soldered in step 2, lift the positioning strip, and use the annular positioning mechanism to move it to the bottom of the positioning support plate, and at the same time, attach the elastic water cooling tube to the group of solder joints, and use the water cooling row to circulate the coolant in the elastic water cooling tube to quickly cool and shape the solder joints;

[0034] Step 4, solder joint inspection: After all electronic components are soldered in steps 2 and 3, and the solder joints are cooled and finalized, the positioning strips on the annular positioning seat are moved to the bottom of the positioning support plate by the annular positioning mechanism, so that the CCD camera is unobstructed, and the solder joints can be clearly visually inspected through the CCD camera.

[0035] The technical effects achieved by the present invention are:

[0036] The present invention cooperates with a cooling and shaping component by arranging a circulation pushing component. After a group of electronic components are welded to a printed circuit board, a linear actuator is used to drive the elastic water cooling tube to the top of the welding spot, and a servo motor is used to push the elastic water cooling tube down to fit on the welding spot through an eccentric push rod and an upper push plate. The welding spot is rapidly cooled by circulating coolant in the elastic water cooling tube through a water-cooled row, thereby shaping the welding spot, reducing the influence of the upper pressure plate on the cooling of the welding spot in the prior art, making the welding efficiency of the welding spot higher and the consistency higher, so as to improve the welding quality of the circuit board.

[0037] The present invention arranges an elastic ball in an elastic water-cooling tube, and arranges an X-cross reversing valve between the elastic water-cooling tube and the water-cooling radiator. The X-cross reversing valve can be used to alternately convert the flow direction of the coolant, so that the flow thrust of the coolant is used to push the elastic ball to move back and forth in the elastic water-cooling tube, so that the deformation pressure is used to make the pin and the welding point more closely combined, and the welding point is plasticized to make it more consistent, thereby further improving the welding quality.

[0038] The present invention cooperates with a clamp and a circulating pushing component. During the cooling of the welding spot, a thin cylinder is used to push the vacuum suction cup down to the surface of the positioning pressure strip, and the vacuum suction cup is used to cooperate with a vacuum generator to adsorb it. Then, a thin cylinder is used to push it upward so that it is adsorbed on the surface of the magnetic metal flexible belt by an adsorption magnetic block, and a micro servo motor is used to transport it to the bottom of the annular positioning seat through a transmission roller and a transmission belt, so as to get rid of the obstruction of the group of electronic components. Then, when the CCD camera performs visual inspection on the welding spot, the inspection picture can be captured more clearly, so that the inspection result is more accurate, misjudgment is reduced, and production efficiency is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 is a schematic diagram of the three-dimensional structure of an embodiment of the present invention;

[0040] Figure 2 It is a schematic diagram of the main structure of an embodiment of the present invention;

[0041] Figure 3 It is a schematic diagram of the combined structure of the clamp, the cooling and shaping component and the circulating pushing component in an embodiment of the present invention;

[0042] Figure 4 is a schematic structural diagram of a clamp in an embodiment of the present invention;

[0043] Figure 5 is an exploded view of a clamp in an embodiment of the present invention;

[0044] Figure 6 is a schematic diagram of a partial structure of a clamp in an embodiment of the present invention;

[0045] Figure 7 The present invention Figure 6 A schematic diagram of the side structure of

[0046] Figure 8 The present invention Figure 6 A schematic diagram of the structure of a cross section at one end;

[0047] Fig. 9 It is a schematic diagram of the combined structure of the cooling and shaping component and the circulating pushing component in an embodiment of the present invention;

[0048] Fig.10 The present invention Fig. 9 Exploded diagram of

[0049] Fig.11 is a schematic diagram of the structure of a cooling and shaping component in an embodiment of the present invention;

[0050] Fig.12 is a schematic structural diagram of a cross section of an elastic water cooling tube in an embodiment of the present invention;

[0051] Fig.13 The present invention Fig.12 A magnified view of the part in the middle;

[0052] Fig.14 is a side view of a bracket and related components in an embodiment of the present invention.

[0053] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0054] 1. Soldering machine body;

[0055] 11. Welding gun; 12. Welding platform; 13. X-axis linear drive; 14. Y-axis linear drive; 15. Z-axis linear drive; 16. Support seat; 17. Positioning seat;

[0056] 2. Fixture;

[0057] 21. outer frame; 22. annular positioning seat; 23. annular support; 24. positioning support plate; 25. positioning pressure strip; 26. micro servo motor; 27. transmission roller; 28. transmission belt; 29. ​​magnetic metal flexible belt; 210. positioning magnetic block; 211. adsorption magnetic block;

[0058] 3. Cooling and shaping components;

[0059] 31. Elastic water cooling pipe; 311. Elastic ball; 312. Expanded pipe; 313. Isolation mesh plate; 32. Water cooling radiator; 33. X-cross reversing valve; 34. Universal flexible pipe;

[0060] 4. Circular push component;

[0061] 41. Bracket; 42. Pipe positioning seat; 43. Positioning slide; 44. Positioning column; 45. Upper push plate; 46. Return spring; 47. Servo motor; 48. Eccentric push rod; 49. Vacuum suction cup; 410. Vacuum generator; 411. Linear actuator; 412. Thin cylinder;

[0062] 5.CCD camera;

[0063] 51. Support plate; 52. Ring light source. DETAILED DESCRIPTION

[0064] In order to make the purpose and advantages of the present invention more clearly understood, the present invention is specifically described below in conjunction with embodiments. It should be understood that the following text is only used to describe one or several specific embodiments of the present invention, and does not strictly limit the scope of protection of the specific claims of the present invention.

[0065] like Figure 1-Figure 14As shown, a computer circuit board soldering equipment includes a soldering machine body 1, a clamp 2 used in conjunction with the soldering machine body 1, a cooling and shaping component 3 for cooling and shaping the solder joints, a circulating pushing component 4 used in conjunction with the cooling and shaping component 3, and a CCD camera 5 for visually inspecting the solder joints.

[0066] Refer to the attached Figure 1-Figure 2 The soldering machine body 1 is provided with an X-axis linear drive 13 on its top platform, and a Y-axis linear drive 14 is fixedly installed on one side of the soldering machine body 1 through a gantry, and a Z-axis linear drive 15 is fixedly installed on the slide of the Y-axis linear drive 14, and a welding platform 12 is fixedly installed on the slide of the X-axis linear drive 13, and positioning seats 17 for positioning the fixture 2 are fixedly installed at the four corners thereof, and then a welding gun 11 is fixedly installed on the slide of the Z-axis linear drive 15 through a support seat 16, and the relative position of the welding gun 11 and the welding platform 12 can be adjusted by using the X-axis linear drive 13, the Y-axis linear drive 14 and the Z-axis linear drive 15 to weld electronic components and printed circuit boards.

[0067] Among them, in this embodiment, two groups of welding guns 11 are arranged in parallel to improve welding efficiency, and are matched with tin wire and nitrogen spray pipes. At the same time, the X-axis linear drive 13, the Y-axis linear drive 14 and the Z-axis linear drive 15 are all composed of a linear track support plate, a screw rod rotatably connected to the inside of the linear track support plate, a nut seat threadedly connected to the screw rod, and a servo motor fixedly installed on one end of the linear track support plate, and a slide is fixedly installed on the nut seat to drive the components connected thereto to move; of course, in other embodiments, other existing linear drive methods can be selected as needed.

[0068] Refer to the attached Figure 4-Figure 8 The fixture 2 includes an outer frame 21 placed on the welding platform 12, an annular positioning seat 22 symmetrically installed on both sides of the outer frame 21, an annular support 23 fixedly installed on the inner side of the annular positioning seat 22, and a positioning support plate 24 fixedly installed between the two groups of annular supports 23. An annular gap is formed between the annular positioning seat 22 and the annular support 23, and a positioning pressure strip 25 for pressing electronic components is movably embedded in the annular gap. The positioning pressure strip 25 is used to press the printed circuit board and electronic components placed on the positioning support plate 24 to complete the positioning. At the same time, the positioning pressure strip 25 can move in the annular gap, and the gap width between the two ends of the annular support 23 and the annular positioning seat 22 is greater than the gap width at other positions. In this way, the positioning support plate 24 can move along the annular gap from the top surface of the annular positioning seat 22 to its bottom surface without getting stuck at both ends, thereby ensuring smooth movement.

[0069] The number of positioning strips 25 is the same as the number of electronic component groups to be welded. In this embodiment, ten groups are provided. In other embodiments, the number of positioning strips 25 can be set according to specific needs.

[0070] In order to drive and position the positioning pressure strip 25, a micro servo motor 26 is fixedly installed at one end of the annular positioning seat 22, and transmission rollers 27 are rotatably installed at both ends of the annular positioning seat 22, and a transmission belt 28 is installed around the transmission rollers 27. By directly connecting the power output end of the micro servo motor 26 with one of the transmission rollers 27, the micro servo motor 26 can be used to drive the transmission belt 28 to move around in the annular gap; further, the transmission belt 28 is embedded around the upper wall of the annular gap, and on the inner wall protruding from one side of the transmission roller 27, the transmission belt 28 is inserted into the upper wall of the annular gap. A magnetically attracted metal flexible belt 29 (which may be one of the metals that can be attracted by a magnet, such as an iron alloy, a cobalt alloy or a nickel alloy) is embedded around it. In contrast, a positioning magnetic block 210 is fixedly embedded on the top surface of the annular support 23, and adsorption magnetic blocks 211 are fixedly embedded at both ends of the positioning pressure strip 25 to match the positioning magnetic block 210, so that when the positioning pressure strip 25 moves up and down in the annular gap, the magnetic attraction force of the adsorption magnetic block 211 can be used to adsorb on the magnetically attracted metal flexible belt 29 or the positioning magnetic block 210, so as to achieve clamping and loosening of electronic components and printed circuit boards.

[0071] The number of positioning magnetic blocks 210 is consistent with the number of positioning pressure strips 25, that is, the same as the number of groups of electronic components during welding. At the same time, the magnetic poles at the bottom of the adsorption magnetic block 211 are opposite to the magnetic poles of the positioning magnetic block 210, so that the magnetic attraction force is used to adsorb each other, and the positioning pressure strips 25 are adsorbed and positioned on the group of electronic components and the printed circuit board to complete the positioning of the group (such as the attached Figure 4 As shown in the figure, when clamping the electronic components and the printed circuit board, the electronic components and the printed circuit board can be assembled in sequence, and the positioning strip 25 can be moved to the position by utilizing the annular gap, and can be positioned and clamped by magnetic attraction; and the positioning magnetic block 210 and the adsorption magnetic block 211 are both cylindrical magnets with the same diameter, so as to ensure accurate positioning.

[0072] Among them, the inner surface of the magnetic metal flexible belt 29 is a frosted surface to increase the friction between the positioning strip 25 and the magnetic metal flexible belt 29. In this way, when the positioning strip 25 is attached to the magnetic metal flexible belt 29 using the adsorption magnetic block 211, the transmission belt 28 can be driven by the micro servo motor 26 to move around in the annular gap, thereby driving the positioning strip 25 adsorbed on the magnetic metal flexible belt 29 to move, so that it can move around along the annular gap from the top surface of the annular positioning seat 22 to its bottom surface, and will not produce relative movement with the magnetic metal flexible belt 29.

[0073] In this embodiment, a signal transmission and power connection plug (not shown in the figure) is provided on the outer frame 21, and a signal transmission and power connection socket (not shown in the figure) is provided on the positioning seat 17, so as to facilitate the power supply to the electronic components in the clamp 2 and connect to the control system of the device to synchronously control them; of course, in other embodiments, a battery can be provided to power the electronic components in the clamp 2 and control them wirelessly, which can be selected according to needs.

[0074] Refer to the attached Figure 3 and Fig.11 The cooling and shaping component 3 includes an elastic water-cooling tube 31 for cooling and shaping the solder joint and a water-cooling radiator 32 installed in the soldering machine body 1 for providing coolant. The two ends of the elastic water-cooling tube 31 are respectively connected to the liquid inlet and outlet of the water-cooling radiator 32. By covering the elastic water-cooling tube 31 on the solder joint after welding, the water-cooling radiator 32 can be used to circulate the coolant in the elastic water-cooling tube 31, absorb the heat on the surface of the solder joint, and quickly cool and shape the solder joint, thereby compensating for the problems of inaccurate nitrogen blowing and incomplete cooling in the prior art.

[0075] Please refer to the attached Figure 11-13 In this embodiment, an X-cross reversing valve 33 is further provided between the elastic water-cooling pipe 31 and the water-cooling row 32 [that is, an electro-hydraulic reversing valve, which usually has four ports, namely, P (oil inlet), A, B (oil inlet and oil outlet of the actuator), and T (oil return port). By controlling the energization of the electromagnet, the position of the valve core can be changed, thereby realizing the alternating connection of the P, A, B, and T interfaces]. By connecting two inlets and outlets of the X-cross reversing valve 33 to both ends of the elastic water-cooling pipe 31, and the other two inlets and outlets are respectively connected to the inlets and outlets of the water-cooling row 32 through the universal flexible pipe 34, the X-cross reversing valve 33 is used to exchange and adjust the flow direction of the coolant in the elastic water-cooling pipe 31, so that the coolant can enter from one port of the elastic water-cooling pipe 31 and exit from the other port, and can enter from the opposite port and exit from the opposite port in the next cycle.

[0076] In coordination therewith, an elastic ball 311 having the same inner diameter as the elastic water-cooling tube 31 is placed in the elastic water-cooling tube 31, and an expansion tube 312 having a diameter larger than the elastic ball 311 is integrally formed at both ends thereof. An isolation mesh plate 313 for blocking the elastic ball 311 is fixedly installed on the expansion tube 312 on one side close to the end of the elastic water-cooling tube 31, so as to push the elastic ball 311 back and forth inside the elastic water-cooling tube 31 when the flow direction of the coolant in the elastic water-cooling tube 31 is adjusted. When the liquid pushes the elastic ball 311 to move in the elastic water-cooling tube 31 and encounters a welding point, the elastic ball 311 will first deform at the obstruction of the welding point to pass through the node, thereby utilizing the elastic ball 311 The deformation pressure shapes the welding point, making the pin and the welding point more tightly combined, and plasticizing the welding point to make it more consistent, further improving the welding quality; when the elastic ball 311 moves to the two ends of the elastic water-cooling tube 31, it will enter the expansion tube 312 area, and then it will no longer cause a large obstacle to the fluid, and at the same time it will be intercepted by the isolation mesh plate 313, so that the coolant can flow back smoothly, and the elastic ball 311 will not be discharged. In the next reverse cycle, the coolant flows in from the opposite direction, and then pushes it back into the elastic water-cooling tube 31, and the welding point is shaped by repeating this cycle.

[0077] Of course, in other embodiments, the X-cross reversing valve 33 , the elastic ball 311 , the expansion tube 312 and the isolation mesh plate 313 may not be provided, and the elastic water cooling tube 31 may be directly used for cooling and shaping.

[0078] Refer to the attached Figure 9-10 In order to push the elastic water-cooling tube 31 to cool the solder joint after welding, the circulation pushing component 4 includes a bracket 41 parallel to the positioning strip 25 and a pipe positioning seat 42 movably installed inside the bracket 41, and a semicircular transverse groove is integrally formed at the bottom of the pipe positioning seat 42 to embed and install the elastic water-cooling tube 31 inside it. By fixing the linear actuator 411 on both sides of the welding platform 12 and perpendicular to the positioning strip 25, and fixing both ends of the bracket 41 on the slide seat of the linear actuator 411, the linear actuator 411 can be used to drive the bracket 41, the pipe positioning seat 42 and the elastic water-cooling tube 31 to move on the fixture 2. After a group of electronic components are welded to the printed circuit board, the elastic water-cooling tube 31 can be moved to just above it.

[0079] For further details, please refer to the attached Fig.14In order to push the elastic water-cooling pipe 31 to fit on the welding point, a positioning groove 43 is provided on the bracket 41, and positioning columns 44 are fixedly installed inside at both ends. At the same time, an upper push plate 45 is fixedly installed on the top surface of the pipeline positioning seat 42, and the upper push plate 45 is slidably embedded in the positioning groove 43, and the two ends are slidably sleeved on the positioning columns 44. Then, a return spring 46 is fixedly installed between the bottom surfaces of the two ends of the upper push plate 45 and the positioning columns 44. By fixing a servo motor 47 on both ends of the top surface of the bracket 41, and fixing an eccentric push rod 48 on its power output end, the eccentric The bottom end of the push rod 48 abuts against the extension plate of the upper push plate 45, and the servo motor 47 is used to drive the eccentric push rod 48 to rotate to push the upper push plate 45 and the pipe positioning seat 42 downward along the positioning column 44, and push the elastic water-cooling tube 31 downward to make it fit on the surface of the welding point, cool it and shape it, and after cooling, the servo motor 47 is used to reset the eccentric push rod 48, and at the same time, the upper push plate 45, the pipe positioning seat 42 and the elastic water-cooling tube 31 are also reset under the compression rebound force of the reset spring 46, so as to cool the next group of welding points, and so on.

[0080] In this embodiment, two groups of servo motors 47 and eccentric push rods 48 are provided at both ends of the bracket 41 so that the two ends can push smoothly and synchronously; in other embodiments, at least one group of servo motors 47 and eccentric push rods 48 is provided.

[0081] Refer to the attached Figure 1-Figure 2 The CCD camera 5 is fixedly mounted on the support seat 16 by providing a support plate 51, and a ring light source 52 matching the CCD camera 5 is fixedly mounted on the bottom surface of the support plate 51, and the CCD camera 5 is arranged perpendicular to the welding platform 12 and located directly above it for welding spot detection. By connecting the CCD camera 5 to the PC, the captured image can be transmitted to the PC to analyze the feedback data to draw conclusions on welding spot detection.

[0082] Refer to the attached Fig. 9 , Fig.10 as well as Fig.14In order to reduce the obstruction of the visual inspection of the CCD camera 5, a vacuum suction cup 49 is fixedly installed on the top surface of the bracket 41, and its suction head extends to the bottom of the bracket 41 for adsorbing the positioning pressure strip 25, and a vacuum generator 410 is installed on the exhaust port of the vacuum suction cup 49 to generate a vacuum adsorption force. At the same time, a thin cylinder 412 is fixedly installed on the slide seat of the linear actuator 411, and the two ends of the bracket 41 are fixedly installed between the power output ends of the two groups of thin cylinders 412. When the linear actuator 411 is cooling and shaping, the vacuum suction cup 49 can be synchronously moved to the positioning pressure strip 25 of the group, and the thin cylinder 412 is used to push the bracket 41 and the vacuum suction cup 49 downward. At the same time, the vacuum generator 410 is started to generate a vacuum adsorption force to adsorb the positioning pressure strip 25, and then the thin cylinder 412 is pushed upward. The bracket 41, the vacuum suction cup 49 and the positioning strip 25 make the positioning strip 25 leave the magnetic attraction range of the positioning magnetic block 210, and the positioning strip 25 is attached to the magnetic metal flexible belt 29 by using the adsorption magnetic block 211, and then the micro servo motor 26 is started to drive the transmission belt 28 to move around in the annular gap, and the positioning strip 25 is moved around along the annular gap from the top surface of the annular positioning seat 22 to its bottom surface, and then cooled and formed. The above operation is repeated after each group of electronic components and the printed circuit board are welded. After the welding is completed, all the positioning strips 25 can be moved to the bottom surface of the annular positioning seat 22, and the visual detection of the CCD camera 5 will no longer be blocked, so that it can capture the detection picture more clearly, making the detection result more accurate, reducing misjudgment, and improving production efficiency.

[0083] In this embodiment, two groups of vacuum suction cups 49 and vacuum generators 410 are provided at both ends of the bracket 41 so that the two ends can synchronously adsorb and lift the positioning pressure strip 25; in other embodiments, at least one group of vacuum suction cups 49 and vacuum generators 410 is provided.

[0084] like Figure 1-Figure 14 As shown, a computer circuit board solder joint detection method is used to cool and shape the solder joints and visually detect the solder joints, comprising the following steps:

[0085] Step 1, electronic component assembly: Place the printed circuit boards one by one in the positioning frame of the positioning support plate 24, and place the electronic components to be soldered on its surface in a manner matching the printed circuit boards. After one group is placed, the positioning strip 25 can be manually moved in the annular gap to be directly above the group of positioning magnetic blocks 210, so that the positioning magnetic blocks 210 are opposite to the adsorption magnetic blocks 211, and then the positioning strip 25 is pressed downward to allow the positioning magnetic blocks 210 to be accurately adsorbed to the adsorption magnetic blocks 211, thereby pressing the positioning strip 25 on the surface of the electronic components to position them, and then multiple groups of electronic components to be soldered are placed in sequence to fill the positioning support plate 24.

[0086] Step 2, pin welding: After the electronic components and the printed circuit board are assembled and positioned, the fixture 2 is placed in the positioning seat 17, and the signal transmission between the two is connected to the power connection plug and socket to facilitate power supply and control. Then, the X-axis linear drive 13, the Y-axis linear drive 14 and the Z-axis linear drive 15 are used to drive the welding gun 11 and the welding platform 12 to weld the pins of the electronic components one by one on the printed circuit board, and after one group of welding is completed, the welding gun 11 is synchronously moved to the next group.

[0087] Step 3, welding spot cooling and shaping: after a group of welding is completed, the linear actuator 411 is used to drive the bracket 41 and the related components thereon to move to the position of the welding point of the group, so that the vacuum suction cup 49 moves to the positioning pressure strip 25 of the group, and the thin cylinder 412 is used to push the bracket 41 and the vacuum suction cup 49 downward, and at the same time, the vacuum generator 410 is started to generate a vacuum adsorption force to suck the positioning pressure strip 25, and then the thin cylinder 412 pushes the bracket 41, the vacuum suction cup 49 and the positioning pressure strip 25 upward, so that the positioning pressure strip 25 is out of the magnetic attraction range of the positioning magnetic block 210, and the positioning pressure strip 25 is attached to the magnetic metal flexible belt 29 by the adsorption magnetic block 211, and then the micro servo motor 26 is started to drive the transmission belt 28 to move around in the annular gap, and the positioning pressure strip 25 is moved around along the annular gap from the top surface of the annular positioning seat 22 to its bottom surface.

[0088] Secondly, the servo motor 47 is used to drive the eccentric push rod 48 to rotate and push the upper push plate 45 and the pipe positioning seat 42 downward along the positioning column 44, and push the elastic water-cooling tube 31 downward to make it fit on the surface of the welding point, cool it and shape it, and after cooling, the servo motor 47 is used to reset the eccentric push rod 48, and at the same time, the upper push plate 45, the pipe positioning seat 42 and the elastic water-cooling tube 31 are also reset under the compression rebound force of the reset spring 46, so as to cool the next group of welding points, and so on.

[0089] Step 4, solder joint detection: After all electronic components are soldered in steps 2 and 3, and the solder joints are cooled and finalized, the positioning strips 25 on the annular positioning seat 22 are moved to the bottom of the positioning support plate 24, so that the CCD camera 5 is not blocked. At this time, the X-axis linear driver 13, the Y-axis linear driver 14 and the Z-axis linear driver 15 can cooperate to drive the CCD camera 5 and the welding platform 12 to move relative to each other, and each solder joint is accurately detected, and the captured image is transmitted to the PC to analyze the feedback data to draw conclusions on the solder joint detection, and then the welding gun 11 can continue to be controlled to promptly repair the solder joints of the leaked and cold solder joints.

[0090] The above is only a preferred embodiment of the present invention. It should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the principles of the present invention, and these improvements and modifications should also be considered as the protection scope of the present invention. The structures, devices and operating methods not specifically described and explained in the present invention shall be implemented according to the conventional means in the art unless otherwise specified and limited.

Claims

1. A computer circuit board soldering device, characterized in that: include: A soldering machine body (1) is provided with a three-axis driving mechanism, and a welding gun (11) and a welding platform (12) for soldering pins of electronic components are provided on the three-axis driving mechanism; A fixture (2), comprising an outer frame (21) placed on the welding platform (12), an annular positioning seat (22) symmetrically mounted on both sides of the outer frame (21), an annular support (23) fixedly mounted on the inner side of the annular positioning seat (22), and a positioning support plate (24) fixedly mounted between two groups of the annular supports (23), an annular gap being provided between the annular positioning seat (22) and the annular support (23), a positioning strip (25) for pressing electronic components being movably embedded in the annular gap, and an annular positioning mechanism for adjusting and positioning the positioning strip (25) being provided between the annular positioning seat (22) and the annular support (23); The annular positioning mechanism comprises a micro servo motor (26) fixedly mounted on one end of the annular positioning seat (22), a transmission roller (27) rotatably mounted on both ends of the annular positioning seat (22), and a transmission belt (28) wrapped around the transmission rollers (27); the power output end of the micro servo motor (26) is directly connected to one of the transmission rollers (27); the transmission belt (28) is wrapped around and embedded in the upper wall of the annular gap, and a magnetic metal flexible belt (29) is wrapped around and embedded on the inner wall protruding from one side of the transmission roller (27); a positioning magnetic block (210) is fixedly embedded on the top surface of the annular support (23); and adsorption magnetic blocks (211) are fixedly embedded at both ends of the positioning pressure strip (25) to match the positioning magnetic block (210); A cooling and shaping component (3), comprising an elastic water cooling pipe (31) for cooling and shaping the solder joint, and a water cooling radiator (32) installed in the soldering machine body (1) for providing cooling liquid, wherein both ends of the elastic water cooling pipe (31) are respectively connected to a liquid inlet and an outlet of the water cooling radiator (32), so that the cooling liquid circulates in the elastic water cooling pipe (31) to cool and shape the solder joint; A circulating pushing assembly (4), comprising a bracket (41) parallel to the positioning pressure strip (25) and a pipe positioning seat (42) movably mounted inside the bracket (41), wherein the bottom of the pipe positioning seat (42) is integrally formed with a semicircular transverse groove for embedding and mounting the elastic water cooling pipe (31); A CCD camera (5) is arranged perpendicular to the welding platform (12) and is located directly above the welding platform (12) for performing welding point detection; A linear drive mechanism is provided between the bracket (41) and the welding platform (12) for driving the bracket (41) to reciprocate on the fixture (2), thereby driving the elastic water cooling tube (31) to cool and shape the weld points on the fixture (2) one by one, and gradually disassemble the positioning support plate (24), thereby reducing the obstruction of the CCD camera (5) during weld point detection.

2. A computer circuit board soldering device according to claim 1, characterized in that: The three-axis drive mechanism comprises an X-axis linear drive (13) installed in the soldering machine body (1), a Y-axis linear drive (14) fixedly installed on one side of the soldering machine body (1) via a gantry, and a Z-axis linear drive (15) fixedly installed on a slide seat of the Y-axis linear drive (14); the welding platform (12) is fixedly installed on the slide seat of the X-axis linear drive (13); and the welding gun (11) is fixedly installed on the slide seat of the Z-axis linear drive (15) via a support seat (16).

3. A computer circuit board soldering device according to claim 1, characterized in that: An X-cross reversing valve (33) is also provided between the elastic water-cooling pipe (31) and the water-cooling radiator (32), wherein two inlets and outlets of the X-cross reversing valve (33) are connected to two ends of the elastic water-cooling pipe (31), and the other two inlets and outlets are respectively connected to the inlets and outlets of the water-cooling radiator (32) via a universal flexible pipe (34), thereby utilizing the X-cross reversing valve (33) to exchange and adjust the flow direction of the coolant in the elastic water-cooling pipe (31).

4. A computer circuit board soldering device according to claim 3, characterized in that: An elastic ball (311) having the same inner diameter as the elastic water cooling tube (31) is placed inside the elastic water cooling tube (31), and an expansion tube (312) having a diameter larger than the elastic ball (311) is integrally formed at both ends of the elastic water cooling tube. An isolation mesh plate (313) for blocking the elastic ball (311) is fixedly installed on the expansion tube (312) at one side close to the end of the elastic water cooling tube (31), so that the elastic ball (311) is reciprocatedly pushed to move inside the elastic water cooling tube (31) when the flow direction of the coolant in the elastic water cooling tube (31) is exchanged and adjusted, and the deformation pressure of the elastic ball (311) is used to shape the welding point.

5. The computer circuit board soldering equipment according to claim 1, characterized in that: The bracket (41) is provided with a positioning groove (43), and positioning columns (44) are fixedly installed at both ends. An upper push plate (45) is fixedly installed on the top surface of the pipeline positioning seat (42). The upper push plate (45) is slidably embedded in the positioning groove (43), and both ends are slidably sleeved on the positioning columns (44). Reset springs (46) are fixedly installed between the bottom surfaces of both ends of the upper push plate (45) and the positioning columns (44). A servo motor (47) is fixedly installed at both ends of the top surface of the bracket (41), and an eccentric push rod (48) is fixedly installed on its power output end. The bottom end of the eccentric push rod (48) contacts the extension plate of the upper push plate (45) to push it to move downward.

6. A computer circuit board soldering device according to claim 1, characterized in that: A vacuum suction cup (49) is fixedly mounted on the top surface of the bracket (41), and its suction head extends to the bottom of the bracket (41) for adsorbing the positioning pressure strip (25), and a vacuum generator (410) is mounted on the air extraction port of the vacuum suction cup (49).

7. The computer circuit board soldering equipment according to claim 1, characterized in that: The linear drive mechanism comprises a linear actuator (411) fixedly mounted on both sides of the welding platform (12) and perpendicular to the positioning pressure strip (25), and a thin cylinder (412) fixedly mounted on a slide seat of the linear actuator (411), and both ends of the bracket (41) are fixedly mounted between the power output ends of two groups of the thin cylinders (412).

8. The computer circuit board soldering equipment according to claim 2, characterized in that: The CCD camera (5) is fixedly mounted on the support seat (16) by means of a support plate (51); a ring-shaped light source (52) matching the CCD camera (5) is fixedly mounted on the bottom surface of the support plate (51); the CCD camera (5) is connected to a PC terminal for analyzing feedback data to obtain a solder joint detection conclusion.

9. A computer circuit board solder joint detection method, applied to the computer circuit board soldering equipment according to any one of claims 1 to 8, characterized in that: The following steps are involved: Step 1, assembling electronic components: placing printed circuit boards one by one in the positioning frame of the positioning support plate (24), and placing the electronic components to be soldered on the surface thereof in a manner matching the printed circuit boards. After one group is placed, moving the positioning strip (25) in the annular gap, pressing it on the surface of the electronic components, positioning them, and placing multiple groups of electronic components to be soldered in sequence; Step 2, pin welding: after the electronic component and the printed circuit board are assembled and positioned, the fixture (2) is placed on the top surface of the welding platform (12), and the three-axis driving mechanism is used to drive the welding gun (11) to cooperate with the welding platform (12) to weld the pins of the electronic component one by one on the printed circuit board, and after one group of welding is completed, the welding gun (11) is synchronously moved to the next group; Step 3: Cooling and shaping the solder joints: using the circulating push assembly (4) to drive the elastic water cooling tube (31) to move to a group of electronic components that have been soldered in step 2, lifting the positioning strip (25), and using the annular positioning mechanism to move it to the bottom of the positioning support plate (24), while attaching the elastic water cooling tube (31) to the group of solder joints, and using the water cooling radiator (32) to circulate the coolant in the elastic water cooling tube (31), so as to quickly cool and shape the solder joints; Step 4: solder joint inspection: After all electronic components have been soldered in steps 2 and 3, and the solder joints have been cooled and finalized, the positioning strips (25) on the annular positioning seat (22) are moved to the bottom of the positioning support plate (24) by the annular positioning mechanism, so that the CCD camera (5) is not blocked, and the solder joints can be clearly visually inspected through the CCD camera (5).

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