Solid state drive reliability testing system and testing method thereof

Abstract

The present application discloses a solid-state hard disk reliability test system and a test method thereof, and relates to the field of solid-state hard disk test technology. The solid-state hard disk reliability test system includes: an environmental test chamber, in which a plurality of first adapter boards are arranged, and an electrical characteristic measurement and control circuit is arranged on the first adapter board; the first adapter board is electrically connected to the solid-state hard disk to be tested; a mainboard cabinet group, in which a plurality of second adapter boards and a plurality of test mainboards are arranged; a second adapter board is electrically connected to a test mainboard and at least one first adapter board; a test control device, and the test control device is electrically connected to the environmental test chamber, the electrical characteristic measurement and control circuit, and the test mainboard respectively. The present application can reduce the cost of test hardware, automatically test batches of solid-state hard disks, and improve the test efficiency of solid-state hard disks.

Description

Technical Field

[0001] The present application relates to the technical field of solid state drive testing, and in particular to a solid state drive reliability testing system and a testing method thereof. Background Art

[0002] With the rapid development of computer technology, Solid State Drive (SSD) as a storage medium has gradually replaced the traditional mechanical hard disk and become the mainstream storage device. However, the reliability of SSD will be affected under long-term use or adverse environmental conditions, resulting in data loss or system crash. Therefore, it is necessary to conduct reliability testing on SSD.

[0003] At present, in the SSD module industry, the SSD reliability test scheme is implemented by using a PCIE adapter board to extend to an environmental test chamber. The current test system for solid-state drives includes: a computer motherboard and an interface expansion card outside the environmental test chamber, a PCIE adapter board located in the environmental test chamber, and a solid-state drive to be tested; wherein, the interface expansion card is inserted into the PCIE slot of the computer motherboard, and the interface expansion card includes two expansion interfaces, each of which is connected to a PCIE adapter board through an adapter cable; the number of solid-state drives to be tested connected to the PCIE adapter board is limited. Specifically, when the PCIE adapter board is an LRFCF512 board, an LRFCF512 board provides two M.2 PCIe SSD interfaces, and can connect to a maximum of two SSDs; the test system can only test a maximum of four SSDs at a time, and the number of SSDs tested simultaneously is relatively small. And due to the length limit of the adapter cable, the arrangement of the PCIE adapter board in the environmental test chamber is limited, and the number of SSDs that can be tested simultaneously in an environmental test chamber is generally only 8 to 16 SSDs. When using the current test system to perform SSD reliability testing, the number of SSDs tested simultaneously is small, the test efficiency is low, and a large number of expansion cards are used, resulting in a high test cost. Summary of the invention

[0004] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a solid state drive reliability test system and a test method thereof, which can reduce the test hardware cost, automatically test a batch of solid state drives, and improve the test efficiency of solid state drives.

[0005] In a first aspect, an embodiment of the present application provides a solid state drive reliability testing system, comprising:

[0006] An environmental test box, wherein a plurality of first adapter boards are provided in the environmental test box, and an electrical characteristic measurement and control circuit is provided on the first adapter boards; the first adapter boards are electrically connected to the solid-state hard disk to be tested;

[0007] A mainboard cabinet group, wherein a plurality of second adapter boards and a plurality of test mainboards are arranged in the mainboard cabinet group; one of the second adapter boards is electrically connected to one of the test mainboards and at least one of the first adapter boards;

[0008] A test control device, the test control device is electrically connected to the environmental test chamber, the electrical characteristic measurement and control circuit, and the test mainboard respectively;

[0009] The test control device is used to: obtain first power supply voltage control information, first environment control information, and first read-write voltage control information from a preset first test case combination; control the environmental test box to perform temperature adjustment processing according to the first environment control information, and adjust the temperature inside the box to the target ambient temperature; according to the first power supply voltage control information, control the electrical characteristic measurement and control circuit to output an initial power supply voltage to a plurality of solid-state hard disks to be tested, so that the solid-state hard disks to be tested operate under the initial power supply voltage; perform reliability tests on all the solid-state hard disks to be tested under the target ambient temperature and the initial power supply voltage; and perform electrical characteristic tests, control the test mainboard to perform stress read and write operations on the solid-state hard disks to be tested according to the first read-write voltage control information, and obtain first electrical characteristic test data.

[0010] In a second aspect, an embodiment of the present application provides a test method for a solid-state hard disk reliability test system, which is applied to a test control device for a solid-state hard disk reliability test system as described in any one of the embodiments of the first aspect, wherein the solid-state hard disk reliability test system further comprises: an environmental test chamber, a first adapter board, an electrical characteristic measurement and control circuit, a solid-state hard disk to be tested, a motherboard cabinet group, a second adapter board, and a test motherboard, wherein the test control device is electrically connected to the environmental test chamber, the electrical characteristic measurement and control circuit, and the test motherboard, respectively;

[0011] The test method includes:

[0012] Obtain a preset first test case combination;

[0013] Acquire first power supply voltage control information, first environment control information, and first read-write voltage control information from the first test case combination;

[0014] Controlling the environmental test box to perform temperature adjustment processing according to the first environmental control information to adjust the temperature inside the box to the target environmental temperature;

[0015] According to the first power supply voltage control information, controlling the electrical characteristic measurement and control circuit to output an initial power supply voltage to the plurality of solid state hard disks to be tested, so that the solid state hard disks to be tested operate under the initial power supply voltage;

[0016] Under the target ambient temperature and the initial power supply voltage, reliability tests are performed on all the solid-state hard disks to be tested; and electrical characteristic tests are performed, and the test mainboard is controlled to perform stress read and write operations on the solid-state hard disks to be tested according to the first read and write voltage control information to obtain first electrical characteristic test data.

[0017] The embodiments of the present application include: a solid-state hard disk reliability test system includes: an environmental test chamber, a mainboard cabinet group, and a test control device; wherein, a plurality of first adapter boards are arranged in the environmental test chamber, and an electrical characteristic measurement and control circuit is arranged on the first adapter board; the first adapter board is electrically connected to the solid-state hard disk to be tested; a plurality of second adapter boards and a plurality of test mainboards are arranged in the mainboard cabinet group; a second adapter board is electrically connected to a test mainboard and at least one first adapter board; the test control device is electrically connected to the environmental test chamber, the electrical characteristic measurement and control circuit, and the test mainboard, respectively; the solid-state hard disk reliability test system does not use an interface expansion card, but uses a first adapter board and a second adapter board with a simple structure and low cost to achieve batch access to the solid-state hard disks to be tested, which effectively reduces the hardware cost of the test. In the process of testing using the solid-state hard disk reliability test system, through the test control device, first, the first power supply voltage control information, the first environment control information, and the first read-write voltage control information are obtained from the obtained preset first test case combination; secondly, the environmental test box is controlled to perform temperature adjustment processing according to the first environment control information, and the temperature in the box is adjusted to the target environmental temperature; then, according to the first power supply voltage control information, the electrical characteristic measurement and control circuit is controlled to output the initial power supply voltage to multiple solid-state hard disks to be tested, so that the solid-state hard disks to be tested work under the initial power supply voltage; finally, under the target environmental temperature and the initial power supply voltage, reliability tests are performed on all solid-state hard disks to be tested; and electrical characteristic tests are performed, and the test mainboard is controlled to perform stress read-write operations on the solid-state hard disks to be tested according to the first read-write voltage control information to obtain the first electrical characteristic test data; it can automatically complete the SSD reliability test and electrical characteristic test on the batch of solid-state hard disks to be tested based on the test case combination, thereby improving the test efficiency of the solid-state hard disk. That is to say, the embodiment of the present application can reduce the test hardware cost, automatically test the batch of solid-state hard disks, and improve the test efficiency of the solid-state hard disk. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a schematic diagram of a test system currently used to test solid-state drives;

[0019] Figure 2 It is a schematic diagram of the overall structure of a solid state drive reliability testing system provided by an embodiment of the present application;

[0020] Figure 3 This is a cross-sectional schematic diagram of a solid state drive reliability test system provided by an embodiment of the present application.

[0021] Figure 4 This is a schematic diagram of electrical control connections of a solid state drive reliability test system provided by an embodiment of the present application;

[0022] Figure 5A is a front view of a first adapter plate provided in one embodiment of the present application;

[0023] Figure 5B is a top view of a first adapter plate provided in one embodiment of the present application;

[0024] Figure 5C is a bottom view of a second adapter plate provided in one embodiment of the present application;

[0025] Fig. 6A is a front view of a second adapter plate provided in one embodiment of the present application;

[0026] Figure 6B is a top view of a second adapter plate provided in one embodiment of the present application;

[0027] Figure 7 is a schematic diagram of the connection state of a first adapter board and a second adapter board provided by an embodiment of the present application;

[0028] Figure 8 It is a flowchart of the steps of a testing method of a solid state drive reliability testing system provided by an embodiment of the present application. DETAILED DESCRIPTION

[0029] In order to make the objectives, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0030] It should be understood that in the description of the present application, the orientation descriptions, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0031] It should be noted that although a logical order is shown in the flowchart in the description of the present application, in some cases, the steps shown or described may be performed in an order different from that in the flowchart. In the description of the present application, a number of means one or more, and a plurality of means two or more. The description of "first" and "second" is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein are only for the purpose of describing the embodiments of this application and are not intended to limit this application.

[0033] First, some terms used in this application are explained:

[0034] The RDT area, or Reliability Demonstration Testing area, is an area where solid-state drives are tested.

[0035] BIT area: usually refers to the Built-In Self-Test area, which is used to detect the integrity and functionality of the hardware.

[0036] At present, in the SSD module industry, the PCIE adapter board is extended to the environmental test chamber to implement the SSD reliability test solution. Figure 1 As shown, Figure 1 This is a schematic diagram of the current test system for testing solid-state drives. The current test system for solid-state drives includes: a computer motherboard and an interface expansion card outside the environmental test chamber, a PCIE adapter board located inside the environmental test chamber, and a solid-state drive to be tested; wherein the interface expansion card is inserted into the PCIE slot of the computer motherboard, and the interface expansion card includes two expansion interfaces, each expansion interface is connected to a PCIE adapter board through an adapter cable; the number of solid-state drives to be tested connected to the PCIE adapter board is limited. Specifically, when the PCIE adapter board is a LRFCF512 board, one LRFCF512 board provides two M.2 PCIeSSD interfaces, and can connect to up to two SSDs; Figure 1 The test system shown can only test four SSDs at a time, so the number of SSDs that can be tested simultaneously is relatively small. Also, due to the length of the adapter cable, the arrangement of the PCIE adapter board in the environmental test chamber is limited, and the number of SSDs that can be tested simultaneously in one environmental test chamber is generally only 8-16. Figure 1 When the test system shown performs SSD reliability testing, the number of SSDs tested simultaneously is small, the test efficiency is low, and more expansion cards are used, resulting in a high test cost.

[0037] Based on this, the present application discloses a solid-state hard disk reliability test system and a test method for the solid-state hard disk reliability test system, which relate to the field of solid-state hard disk test technology. The solid-state hard disk reliability test system includes: an environmental test chamber, in which a plurality of first adapter boards are arranged, and an electrical characteristic measurement and control circuit is arranged on the first adapter board; the first adapter board is electrically connected to the solid-state hard disk to be tested; a mainboard cabinet group, in which a plurality of second adapter boards and a plurality of test mainboards are arranged; a second adapter board is electrically connected to a test mainboard and at least one first adapter board; a test control device, and the test control device is electrically connected to the environmental test chamber, the electrical characteristic measurement and control circuit, and the test mainboard respectively. The present application can reduce the cost of test hardware, automatically test batches of solid-state hard disks, and improve the test efficiency of solid-state hard disks.

[0038] The embodiments of the present application are further described below in conjunction with the accompanying drawings.

[0039] First, as Figures 2 to 4 As shown, an embodiment of the present application provides a solid state drive reliability testing system 100 , including: an environmental testing box 110 , a mainboard cabinet group 120 , and a test control device 130 .

[0040] Among them, a plurality of first adapter boards 111 are arranged in the environmental test box 110, and an electrical characteristic measurement and control circuit 112 is arranged on the first adapter board 111; the first adapter board 111 is electrically connected to the solid state hard disk 140 to be tested; a plurality of second adapter boards 121 and a plurality of test mainboards 124 are arranged in the mainboard cabinet group 120; a second adapter board 121 is electrically connected to a test mainboard 124 and at least one first adapter board 111; the test control device 130 is electrically connected to the environmental test box 110, the electrical characteristic measurement and control circuit 112, and the test mainboard 124, respectively.

[0041] It can be seen that in terms of hardware structure, the solid-state drive reliability testing system 100 provided in the embodiment of the present application does not use an interface expansion card, but instead uses a simple-structured, low-cost first adapter board 111 and a second adapter board 121 to achieve batch access to the solid-state drives 140 to be tested, effectively reducing the hardware cost of the test.

[0042] It is understandable that the environmental test chamber 110 is used to provide a temperature-adjustable test environment to facilitate the construction of different test scenarios and simulate different solid state drive usage scenarios.

[0043] It can be understood that the electrical characteristic measurement and control circuit 112 is used to provide a power supply voltage for the solid state drive 140 to be tested.

[0044] It is understandable that the test motherboard 124 is used to perform read and write operations on the solid state drive 140 to be tested, and perform read and write stress testing.

[0045] Specifically, the solid-state drive reliability test system 100 of the embodiment of the present application can test the solid-state drives 140 to be tested, including the five major categories of products: 2.5-inch SATA, mSATA, M.2 sATA, M.2 PCIe 3.0, and M.2 PCIe 4.0, which can cover all product type testing requirements of the current consumer market and OEM market. Therefore, the solid-state drive reliability test system 100 of the embodiment of the present application tests compatibility.

[0046] The test control device 130 is used to: obtain the first power supply voltage control information, the first environment control information, and the first read-write voltage control information from the obtained preset first test case combination; control the environmental test box 110 to perform temperature adjustment processing according to the first environment control information, and adjust the temperature inside the box to the target ambient temperature; according to the first power supply voltage control information, control the electrical characteristic measurement and control circuit 112 to output the initial power supply voltage to multiple solid-state hard disks 140 to be tested, so that the solid-state hard disks 140 to be tested work under the initial power supply voltage; at the target ambient temperature and the initial power supply voltage, perform reliability tests on all solid-state hard disks 140 to be tested; and perform electrical characteristic tests, control the test mainboard 124 to perform stress read and write operations on the solid-state hard disks 140 to be tested according to the first read-write voltage control information, and obtain first electrical characteristic test data.

[0047] Specifically, the test control device 130 can communicate with the test mainboard 124 to enable the test mainboard 124 to start the corresponding SSD stress test. The test control device 130 can communicate with the environmental test box 110 to control the operation of the environmental test box 110 and read the internal environmental conditions of the environmental test box 110 to make the environment in the environmental test box 110 meet the expectations. The test control device 130 can communicate with the electrical characteristic measurement and control circuit 112 to adjust the SSD power supply voltage in real time and record the voltage and current values ​​of the SSD.

[0048] Specifically, an RDT area and a BIT area are provided in the environmental test. The RDT area can be used to implement SSD reliability testing, and the BIT area can be used to detect the integrity and functionality of the solid state drive 140 to be tested.

[0049] like Figure 3 As shown, a plurality of power modules 125 are also provided in the motherboard cabinet group 120, and each power module 125 is electrically connected to a test motherboard 124. The power module 125 is used to output a power supply voltage signal to supply power to the test motherboard 124 so that the test motherboard 124 can start working normally.

[0050] According to the solid-state drive reliability test system 100 provided in the embodiment of the present application, during the test of the solid-state drive 140 to be tested, the test control device 130 first obtains the first power supply voltage control information, the first environment control information, and the first read-write voltage control information from the obtained preset first test case combination; secondly, the environmental test box 110 is controlled to perform temperature adjustment processing according to the first environment control information, and the temperature in the box is adjusted to the target ambient temperature; then, according to the first power supply voltage control information, the electrical characteristic measurement and control circuit 112 is controlled to output the initial power supply voltage to multiple solid-state drives 140 to be tested, so that the solid-state drives 140 to be tested work under the initial power supply voltage; finally, at the target ambient temperature and the initial power supply voltage, reliability tests are performed on all the solid-state drives 140 to be tested; and electrical characteristic tests are performed, and the test mainboard 124 is controlled to perform stress read and write operations on the solid-state drives 140 to be tested according to the first read-write voltage control information to obtain first electrical characteristic test data; the SSD reliability test and electrical characteristic test can be automatically completed for a batch of solid-state drives to be tested based on the test case combination, thereby improving the test efficiency of the solid-state drives. Therefore, the embodiments of the present application can reduce the cost of testing hardware, automatically test batches of solid-state drives, and improve the testing efficiency of solid-state drives.

[0051] like Figure 5A , Figure 5B , Fig. 6A , Figure 6B and Figure 7 As shown, according to some embodiments of the present application, the test mainboard 124 includes: an SSD mainboard test interface 124A; the first adapter board 111 includes: multiple SSD interfaces 111B and multiple first high-speed connectors 111A, and the SSD interface 111B is pluggable and connected to the solid-state hard disk 140 to be tested; the second adapter board 121 includes: a contact connector 121B and a second high-speed connector 121A, the contact connector 121B is electrically connected to the SSD mainboard test interface 124A, and the second high-speed connector 121A is electrically connected to the first high-speed connector 111A through a high-speed signal harness 150.

[0052] By setting the first adapter board 111 and the second adapter board 121 to form an SSD adapter device, the SSD mainboard test interface 124A of the test mainboard 124 is extended through the second adapter board 121 and the high-speed signal harness 150, so that any first adapter board 111 can be transferred, and the solid-state hard disk 140 to be tested is plugged into the first adapter board 111. The tester can plug multiple solid-state hard disks 140 to be tested into multiple first adapter boards 111 according to the test requirements, and optionally connect one or more first adapter boards 111 to the second adapter board 121, which greatly improves the adaptability of the test system.

[0053] like Figure 5A , Figure 5B , Figure 5C As shown, the first adapter board 111 also includes a base plate, and a plurality of first high-speed connectors 111A are arranged side by side on the same side of the base plate along the length direction of the base plate, and a plurality of SSD interfaces 111B are arranged side by side on the other side of the base plate along the length direction of the base plate. One first high-speed connector 111A is symmetrical with one SSD interface 111B. By arranging neatly arranged SSD interfaces 111B on the first adapter board 111, the solid-state hard disk 140 to be tested can be neatly plugged in, which is convenient for inspection and maintenance of the solid-state hard disk 140 to be tested; by arranging neatly arranged first high-speed connectors 111A on the first adapter board 111, the leads are neatly arranged, which is convenient for maintenance.

[0054] like Figure 7 As shown, the second high-speed connector 121A is electrically connected to the first high-speed connector 111A through the high-speed signal harness 150, and different first high-speed connectors 111A on the first adapter board 111 can be connected to different second adapter boards 121. Alternatively, Figure 3 As shown, the first high-speed connectors 111A on two or more first adapter boards 111 are all connected to the same second adapter board 121. Alternatively, the second adapter board 121 is only connected to the first high-speed connector 111A on the same first adapter board 111. Therefore, the embodiment of the present application does not impose any specific restrictions on the specific connection state between the first adapter board 111 and the second adapter board 121.

[0055] It can be understood that the embodiment of the present application ensures high-speed transmission of data and signals during the test process by adopting the first high-speed connector 111A, the second high-speed connector 121A and the high-speed signal harness 150, ensuring that the test of the solid-state drive 140 to be tested can be carried out stably and at high speed, which is conducive to improving the test efficiency.

[0056] like Figure 3 As shown, according to some embodiments of the present application, the environmental test box 110 also includes: a metal support box 160; the metal support box 160 includes: an installation panel 161, on which the first adapter plates 111 are arranged in sequence; an in-box connecting wire 163, which is arranged in the metal support box 160, one end of the in-box connecting wire 163 is connected to the first high-speed connector 111A of the first adapter plate 111, and the other end of the in-box connecting wire 163 is detachably connected to the high-speed signal harness 150; a lead panel 162, and the lead panel 162 is used to lead out the in-box connecting wire 163.

[0057] It is understandable that, on the installation panel 161, a plurality of first adapter plates 111 are arranged in sequence from top to bottom to form a neat and reasonable layout, which maximizes the use of the surface area of ​​the installation panel 161. By arranging a plurality of first adapter plates 111 neatly and orderly, the plugged solid state drives 140 to be tested are also arranged neatly and orderly, which is convenient for maintenance and management, and the internal space of the environmental test box 110 is efficiently used.

[0058] It can be understood that the first adapter board 111 and the solid-state hard disk 140 to be tested inserted into the first adapter board 111 both have a certain weight. By setting up the metal support box 160, a stronger supporting force can be provided, so that the multiple first adapter boards 111 with the solid-state hard disks 140 to be tested can be neatly and stably arranged on the installation panel 161.

[0059] It is understandable that the side wall of the environmental test box 110 has a certain thickness, and frequently using the high-speed signal harness 150 to pass through the side wall of the environmental test box 110 to connect the first high-speed connector 111A and the second high-speed connector 121A will be troublesome in operation. Therefore, in some embodiments, by setting one end of the in-box connecting wire 163 to lead out the first high-speed connector 111A, and then using the other end of the in-box connecting wire 163 to be detachably connected to one end of the high-speed signal harness 150, and the other end of the high-speed signal harness 150 is connected to the second high-speed connector 121A, the wiring operation is simplified.

[0060] It can be understood that by providing the lead panel 162, the connecting wires 163 in the box can be better arranged to facilitate maintenance and management.

[0061] According to some embodiments of the present application, the main board cabinet group 120 includes: a first main board cabinet 122, which is arranged on one side of the environmental testing box 110 and is detachably connected to the environmental testing box 110; and a second main board cabinet 123, which is arranged on the other side of the environmental testing box 110 and is detachably connected to the environmental testing box 110.

[0062] By setting up the mutually independent first mainboard cabinet 122, the second mainboard cabinet 123 and the environmental test box 110, the overall solid state drive reliability test system 100 has a neat appearance and occupies a small area. The first mainboard cabinet 122, the second mainboard cabinet 123 and the environmental test box 110 can be quickly disassembled and assembled, which is convenient for moving. When the first mainboard cabinet 122, the second mainboard cabinet 123 and the environmental test box 110 are aged and need to be repaired, they are easy to replace and maintain.

[0063] It is understandable that the tester can also assemble only the environmental test box 110 and one mainboard cabinet according to actual needs, or can assemble the environmental test box 110 and two mainboard cabinets. Therefore, the present application does not impose a specific limit on the number of mainboard cabinets used.

[0064] like Figure 3 As shown, a plurality of bearing plates are also provided in the first mainboard cabinet 122 and the second mainboard cabinet 123. The bearing plates are arranged in sequence from top to bottom, and a test mainboard 124 is placed on each bearing plate. The test mainboards 124 are neatly placed for easy search and maintenance.

[0065] like Figure 4 As shown, according to some embodiments of the present application, the solid state drive reliability testing system 100 also includes: a first display module 126, which is arranged on the first main board cabinet 122 and is electrically connected to the test control device 130; a second display module 127, which is arranged on the second main board cabinet 123 and is electrically connected to the test control device 130.

[0066] It can be understood that the first display module 126 is used to display the first electrical characteristic test data of the solid state drive 140 to be tested connected to the first mainboard cabinet 122; the second display module 127 is used to display the first electrical characteristic test data of the solid state drive 140 to be tested connected to the second mainboard cabinet 123. In the embodiment of the present application, by setting the first display module 126 and the second display module 127 in the solid state drive reliability test system 100, the tester can timely obtain the electrical characteristic test data of the solid state drive 140 to be tested under various working conditions, which can be used as a more reliable reference to determine whether the SSD is abnormal or provide electrical parameter reference in the future.

[0067] Specifically, the solid-state drive reliability test system 100 provided in the embodiment of the present application has good test compatibility and SSD batch testing capabilities. In terms of test compatibility, it can cover all product type testing requirements in the current consumer market and OEM market. In terms of batch test quantity, in practice, the solid-state drive reliability test system 100 provided in the embodiment of the present application can test 160 PCIe3.0 / 4.0 SSDs and 200 m.2 Sata / mSATA / 2.5-inch SATA at the same time. During the test, while applying working pressure to the solid-state drive 140 to be tested, environmental pressure and electrical characteristic pressure are applied; and its reliability parameters and electrical parameters are recorded; the reliability of the SSD product can be evaluated more comprehensively. And it is uniformly deployed by the test control device 130 to realize the combined test of environmental pressure, power supply voltage, and read-write working pressure; it can simulate the stress of various application scenarios, and the test scenario coverage rate is high.

[0068] It is understandable that the solid-state drive reliability testing system 100 provided in the embodiment of the present application can also be used in all other compatibility testing and aging testing applications in the IC industry that require batch testing.

[0069] The solid-state drive reliability testing system 100 provided in accordance with the first aspect of the present application can greatly reduce the cost of SSD reliability testing, increase the number of batch tests of the solid-state drives 140 to be tested, and combine electrical characteristic testing with environmental factors for testing, thereby improving the efficiency and test coverage of SSD reliability testing.

[0070] Those skilled in the art will appreciate that the system structure shown in the figure does not constitute a limitation on the embodiments of the present application, and may include more or fewer components than shown in the figure, or a combination of certain components, or a different arrangement of components.

[0071] The system embodiments described above are merely illustrative, and the units described as separate components may or may not be physically separated, that is, they may be located in one place or distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the present embodiment.

[0072] Those skilled in the art will appreciate that the system architecture and application scenarios described in the embodiments of the present application are intended to more clearly illustrate the technical solutions of the embodiments of the present application, and do not constitute a limitation on the technical solutions provided in the embodiments of the present application. Those skilled in the art will appreciate that with the evolution of the system architecture and the emergence of new application scenarios, the technical solutions provided in the embodiments of the present application are equally applicable to similar technical problems.

[0073] Based on the above system structure, various embodiments of the testing method of the solid state drive reliability testing system of the present application are proposed below.

[0074] Second, as Figure 8 As shown, the present application embodiment provides a test method for a solid state drive reliability test system, which is applied to Figure 2 The test control device of the solid state drive reliability test system shown in the figure, the solid state drive reliability test system also includes: an environmental test box, a first adapter board, an electrical characteristic measurement and control circuit, a solid state drive to be tested, a motherboard cabinet group, a second adapter board, and a test motherboard, and the test control device is electrically connected to the environmental test box, the electrical characteristic measurement and control circuit, and the test motherboard respectively. The test method of the solid state drive reliability test system includes but is not limited to steps S110 to S150.

[0075] Step S110: Obtain a preset first test case combination.

[0076] Step S120: Acquire first power supply voltage control information, first environment control information, and first read-write voltage control information from the first test case combination.

[0077] Step S130: Control the environmental test box to perform temperature adjustment processing according to the first environmental control information, and adjust the temperature inside the box to the target environmental temperature.

[0078] Step S140: According to the first power supply voltage control information, the electrical characteristic measurement and control circuit is controlled to output an initial power supply voltage to the plurality of solid state drives to be tested, so that the solid state drives to be tested operate under the initial power supply voltage.

[0079] Step S150: Perform reliability tests on all SSDs to be tested at the target ambient temperature and initial power supply voltage; and perform electrical characteristic tests, controlling the test mainboard to perform stress read and write operations on the SSDs to be tested according to the first read and write voltage control information to obtain first electrical characteristic test data.

[0080] Specifically, the first power supply voltage control information includes: a first operating voltage, a second operating voltage, and a third operating voltage.

[0081] Specifically, the first environment control information includes: environment temperature control information, and the environment temperature control information includes: first working temperature, second working temperature, constant temperature delay, temperature reduction delay, temperature increase delay, and preset number threshold.

[0082] Specifically, the first environmental control information also includes: environmental pressure control information and environmental humidity control information.

[0083] Specifically, the first electrical characteristic test data includes: SSD voltage value and SSD current value collected in real time.

[0084] Specifically, in step S150, in some embodiments, the electrical characteristic test includes: adjusting the SSD power supply voltage in real time, thereby collecting the SSD voltage value and SSD current value of the solid state drive to be tested in real time. At the same time, the stress test program is turned on to put the solid state drive to be tested in a high working pressure state, perform read and write operations under high pressure, and read the first electrical characteristic test data.

[0085] Through step S110 to step S150, in the process of testing using the solid state drive reliability test system, through the test control device, first, the first power supply voltage control information, the first environment control information, and the first read-write voltage control information are obtained from the obtained preset first test case combination; secondly, the environmental test box is controlled to perform temperature adjustment processing according to the first environment control information, and the temperature in the box is adjusted to the target environmental temperature; then, according to the first power supply voltage control information, the electrical characteristic measurement and control circuit is controlled to output the initial power supply voltage to multiple solid state drives to be tested, so that the solid state drives to be tested work under the initial power supply voltage; finally, under the target environmental temperature and the initial power supply voltage, reliability tests are performed on all solid state drives to be tested; and electrical characteristic tests are performed, and the test mainboard is controlled to perform stress read and write operations on the solid state drives to be tested according to the first read-write voltage control information to obtain the first electrical characteristic test data; it can automatically complete the SSD reliability test and electrical characteristic test on the batch of solid state drives to be tested based on the test case combination, thereby improving the test efficiency of the solid state drives. Therefore, the embodiment of the present application can reduce the test hardware cost, automatically test the batch of solid state drives, and improve the test efficiency of the solid state drives.

[0086] According to some embodiments of the present application, specifically, the first environmental control information includes: environmental temperature control information, and the environmental temperature control information includes: a first working temperature, a second working temperature, a constant temperature delay, a cooling delay, a heating delay, and a preset number of thresholds. The temperature adjustment process includes a temperature control cycle process; further describing step S130, step S130: controlling the environmental test box to perform temperature adjustment processing according to the first environmental control information, adjusting the temperature inside the box to the target environmental temperature, including but not limited to steps S131 to S135.

[0087] Step S131: adjusting the temperature inside the box to the first working temperature, and maintaining the temperature inside the box at the first working temperature during the constant temperature delay.

[0088] Step S132: After the constant temperature delay, the temperature inside the box is reduced from the first working temperature to the second working temperature within the temperature reduction delay.

[0089] Step S133: After the temperature drop delay, the temperature inside the box is maintained at a constant second working temperature during the constant temperature delay.

[0090] Step S134: After the constant temperature delay, within the temperature increase delay, the temperature inside the box is increased from the second working temperature to the first working temperature, completing a temperature control cycle process.

[0091] Step S135: When the number of completed temperature control cycle processing is equal to the preset number threshold, the temperature control cycle processing is terminated.

[0092] Through step S131 to step S135, rapid heating and cooling are achieved in an alternating cycle in the environmental test chamber, simulating an extreme temperature change usage scenario and improving the test scenario coverage of the solid state drive reliability test system.

[0093] An example is given to illustrate the temperature control cycle processing provided by the embodiment of the present application.

[0094] First, set the first working temperature to 70℃, the second working temperature to 0℃, the constant temperature delay to 4 hours, the cooling delay to 0.5 hours, and the heating delay to 0.5 hours. Then, control the environmental test chamber to start, and conduct a high and low temperature cycle experiment from 0℃ to 70℃: adjust the temperature in the chamber to 70℃, and maintain a constant temperature (70℃) for 4 hours; after 4 hours, adjust the temperature in the chamber from 70℃ to 0℃ within 0.5 hours, and maintain a constant temperature (0℃) for 4 hours; after 4 hours, adjust the temperature in the chamber from 0℃ to 70℃ within 0.5 hours, and complete a temperature control cycle. Continue to maintain a constant temperature (70℃) for 4 hours, and cycle alternately to increase and decrease the temperature.

[0095] It is understandable that the ambient temperature control information can be set according to the actual application scenario required to simulate the application scenario of the ambient temperature and periodic alternating change. This application does not make specific restrictions here.

[0096] In some embodiments, the temperature adjustment process includes: constant temperature timing process. For example, the environment temperature control information is set as follows: the first working temperature is not zero, the second working temperature is 0, the constant temperature delay is not zero, the cooling delay is 0, the heating delay is 0, and the preset number threshold is 0; based on the environment temperature control information, the box temperature is adjusted to the first working temperature and maintained constant, and the test is terminated after the constant temperature delay; simulating a single, constant temperature application scenario.

[0097] The first environmental control information also includes: environmental pressure control information and environmental humidity control information.

[0098] In some embodiments, the testing method also includes: controlling the environmental test chamber to adjust the pressure inside the chamber to the target environmental pressure value according to the environmental pressure control information, and adjusting the humidity inside the chamber to the target environmental humidity value, simulating the application scenario of the solid-state drive to be tested, further improving the coverage of the simulation scenario, and improving the authenticity of the SSD reliability stress test.

[0099] The temperature, humidity, and pressure inside the environmental test box provided in the embodiment of the present application can be controlled and adjusted, and can simulate extreme temperature change usage scenarios; this is conducive to enriching the test scenarios and improving the reliability of the test.

[0100] According to some embodiments of the present application, the first power supply voltage control information includes: a first working voltage, a second working voltage, and a third working voltage; further illustrating step S140, step S140: according to the first power supply voltage control information, control the electrical characteristic measurement and control circuit to output an initial power supply voltage to multiple solid-state hard drives to be tested, so that the solid-state hard drives to be tested operate under the initial power supply voltage, including but not limited to steps S141 to S144.

[0101] Step S141: determining a first test group, a second test group, and a third test group from a plurality of solid state drives to be tested.

[0102] Step S142: Control the electrical characteristic measurement and control circuit to output the first operating voltage to the first test group, so that each solid-state hard disk to be tested in the first test group operates at the first operating voltage.

[0103] Step S143: Control the electrical characteristic measurement and control circuit to output the second operating voltage to the second test group, so that each solid-state hard disk to be tested in the second test group operates at the second operating voltage.

[0104] Step S144: controlling the electrical characteristic measurement and control circuit to output a third operating voltage to the third test group, so that each solid-state hard disk to be tested in the third test group operates at the third operating voltage.

[0105] Specifically, further illustrating step S141, the first test group, the second test group, and the third test group all include: at least one solid-state hard disk to be tested.

[0106] Specifically, to further illustrate step S142, the first power supply voltage control information also includes: test grouping information; the test grouping information is used to indicate the number of the first adapter board corresponding to each test group; step S142 includes: determining the first test group, the second test group, and the third test group from multiple solid-state hard disks to be tested according to the test grouping information. For example: the test grouping information indicates: the first test group is the first adapter board No. 1 to 10; the second test group is the first adapter board No. 11 to 20; the third test group is the first adapter board No. 21 to 30; then grouping is performed based on the number range. Alternatively, the engineering personnel inputs a test grouping instruction to the test control device, so that the test control device determines each test group in response to the test grouping instruction.

[0107] Specifically, the first operating voltage is the maximum operating voltage allowed by the solid state drive to be tested, the second operating voltage is the rated operating voltage of the solid state drive to be tested, and the third operating voltage is the minimum operating voltage allowed by the solid state drive to be tested.

[0108] Through steps S141 to S144, multiple solid-state hard drives to be tested are grouped to obtain multiple test groups, so that the solid-state hard drives to be tested in different test groups operate under different operating voltages, and are tested under different power supply voltages under the same environmental conditions. The test groups form test controls with each other, further enriching the test scenarios.

[0109] Take an example to explain step S141 to step S144. Specifically, when 30 SSDs to be tested are inserted into the SSD reliability test system, the power supply voltage of the 10 SSDs to be tested in the first test group is adjusted to 3.6V (the maximum allowed operating voltage) through the electrical characteristic measurement and control circuit, the power supply voltage of the 10 SSDs to be tested in the second test group is maintained at the rated operating voltage of 3.3V, and the power supply voltage of the 10 SSDs to be tested in the third test group is adjusted to 3.0V (the minimum allowed operating voltage).

[0110] In the test method provided in the embodiment of the present application, a test control device is used for unified deployment to realize a combined test of environmental pressure, power supply voltage, and read-write working pressure; the stress of various application scenarios can be simulated, and the test scenario coverage is high. Among them, environmental pressure refers to the solid-state hard disk to be tested being in an environmental test chamber, and the environmental pressure is applied by the environmental test chamber to simulate the environmental pressure of different usage scenarios such as different regions and different altitudes. The power supply voltage refers to the experiment of pulling up and pulling down the power supply voltage through the electrical characteristic measurement and control circuit to verify the long-term stability of the product in a high or low voltage environment. The read-write working pressure refers to running a stress test program through the test motherboard to perform high-pressure read and write operations on the solid-state hard disk to be tested.

[0111] According to some embodiments of the present application, the testing method further includes but is not limited to steps S210 to S250.

[0112] Step S210: Obtain an updated second test case combination.

[0113] Step S220: Obtain second power supply voltage control information, second environment control information, and second read-write voltage control information from the second test case combination.

[0114] Step S230: Control the environmental test box to perform temperature adjustment processing according to the second environmental control information, and adjust the temperature inside the box to the target environmental temperature.

[0115] Step S240: According to the second power supply voltage control information, the electrical characteristic measurement and control circuit is controlled to output an initial power supply voltage to the plurality of solid state drives to be tested, so that the solid state drives to be tested operate under the initial power supply voltage.

[0116] Step S250: Perform reliability tests on all solid-state drives to be tested under the target ambient temperature and initial power supply voltage; and perform electrical characteristic tests, control the test mainboard to perform stress tests according to the second read-write voltage control information, perform stress read and write operations on the solid-state drives to be tested, and obtain second electrical characteristic test data.

[0117] It can be understood that the second test case combination is different from the first test case combination, which is conducive to creating another test environment and different test scenarios.

[0118] Through steps S210 to S250, when the reliability test and electrical characteristic test based on the first test case combination are completed, the updated second test case combination is automatically called, and the environmental test chamber, electrical characteristic measurement and control circuit, and test mainboard are controlled based on the second test case combination to build a new test environment, test scenario, and test condition, so as to achieve a more complete and fully automated SSD reliability test.

[0119] According to some embodiments of the present application, the motherboard cabinet group includes: a first motherboard cabinet and a second motherboard cabinet, and the solid-state hard disk reliability test system also includes: a first display module and a second display module; after obtaining the first electrical characteristic test data, the test method also includes: recording the first electrical characteristic test data; controlling the first display module to display the first electrical characteristic test data of the solid-state hard disk to be tested connected to the first motherboard cabinet; controlling the second display module to display the first electrical characteristic test data of the solid-state hard disk to be tested connected to the second motherboard cabinet. In this way, the test personnel can timely obtain the electrical characteristic test data of the solid-state hard disk to be tested under various working conditions, which can be used as a more reliable reference to determine whether the SSD is abnormal or provide electrical parameter reference in the future.

[0120] According to the solid state drive reliability test system and test method provided by the embodiment of the present application, when using the same environmental test chamber, the number of solid state drives to be tested in the embodiment of the present application is increased by 100 times compared to the traditional test method, and the interface compatibility is good. And through the flexible combination of test cases, the stress of various application scenarios can be simulated, and the test coverage rate is high.

[0121] The above is a specific description of the preferred implementation of the present application, but the present application is not limited to the above-mentioned implementation mode. Technical personnel familiar with the field can also make various equivalent deformations or substitutions without violating the spirit of the present application. These equivalent deformations or substitutions are all included in the scope defined by the present application.

Claims

1. A solid state drive reliability testing system, characterized in that: include: An environmental test box, wherein a plurality of first adapter boards are provided in the environmental test box, and an electrical characteristic measurement and control circuit is provided on the first adapter boards; the first adapter boards are electrically connected to the solid-state hard disk to be tested; A mainboard cabinet group, wherein a plurality of second adapter boards and a plurality of test mainboards are arranged in the mainboard cabinet group; one of the second adapter boards is electrically connected to one of the test mainboards and at least one of the first adapter boards; A test control device, the test control device is electrically connected to the environmental test chamber, the electrical characteristic measurement and control circuit, and the test mainboard respectively; The test control device is used to: obtain first power supply voltage control information, first environment control information, and first read-write voltage control information from a preset first test case combination; control the environmental test box to perform temperature adjustment processing according to the first environment control information, and adjust the temperature inside the box to the target ambient temperature; according to the first power supply voltage control information, control the electrical characteristic measurement and control circuit to output an initial power supply voltage to a plurality of the solid-state hard disks to be tested, so that the solid-state hard disks to be tested work under the initial power supply voltage; perform reliability tests on all the solid-state hard disks to be tested under the target ambient temperature and the initial power supply voltage; and perform electrical characteristic tests, control the test mainboard to perform stress read and write operations on the solid-state hard disks to be tested according to the first read-write voltage control information, and obtain first electrical characteristic test data; The test mainboard includes: an SSD mainboard test interface; the first adapter board includes: a plurality of SSD interfaces and a plurality of first high-speed connectors, the SSD interfaces are pluggably connected to the solid-state hard disk to be tested; the second adapter board includes: a contact connector and a second high-speed connector, the contact connector is electrically connected to the SSD mainboard test interface, and the second high-speed connector is electrically connected to the first high-speed connector through a high-speed signal harness; The environmental test box also includes: a metal support box; the metal support box includes: An installation panel, on which the first adapter plates are arranged in sequence; An in-box connecting wire is arranged in the metal support box, one end of the in-box connecting wire is connected to the first high-speed connector of the first adapter board, and the other end of the in-box connecting wire is detachably connected to the high-speed signal harness; A lead panel is used to lead out the connecting wires in the box.

2. The solid state drive reliability testing system according to claim 1, characterized in that: The mainboard cabinet group includes: A first mainboard cabinet is disposed on one side of the environmental test box and is detachably connected to the environmental test box; The second mainboard cabinet is arranged at the other side of the environmental test box and is detachably connected to the environmental test box.

3. The solid state drive reliability testing system according to claim 2, characterized in that: The solid state drive reliability testing system further comprises: A first display module, arranged on the first mainboard cabinet and electrically connected to the test control device; The second display module is arranged on the second mainboard cabinet and is electrically connected to the test control device.

4. A testing method for a solid state drive reliability testing system, characterized in that: A test control device applied to a solid-state hard disk reliability test system as claimed in any one of claims 1 to 3, wherein the solid-state hard disk reliability test system further comprises: an environmental test chamber, a first adapter board, an electrical characteristic measurement and control circuit, a solid-state hard disk to be tested, a mainboard cabinet group, a second adapter board, and a test mainboard, wherein the test control device is electrically connected to the environmental test chamber, the electrical characteristic measurement and control circuit, and the test mainboard respectively; The test method includes: Obtain a preset first test case combination; Acquire first power supply voltage control information, first environment control information, and first read-write voltage control information from the first test case combination; Controlling the environmental test box to perform temperature adjustment processing according to the first environmental control information to adjust the temperature inside the box to the target environmental temperature; According to the first power supply voltage control information, controlling the electrical characteristic measurement and control circuit to output an initial power supply voltage to the plurality of solid state hard disks to be tested, so that the solid state hard disks to be tested operate under the initial power supply voltage; Under the target ambient temperature and the initial power supply voltage, reliability tests are performed on all the solid-state hard disks to be tested; and electrical characteristic tests are performed, and the test mainboard is controlled to perform stress read and write operations on the solid-state hard disks to be tested according to the first read and write voltage control information to obtain first electrical characteristic test data.

5. The testing method of the solid state drive reliability testing system according to claim 4, characterized in that: The first environment control information includes: environment temperature control information, the environment temperature control information includes: first working temperature, second working temperature, constant temperature delay, temperature drop delay, temperature rise delay, preset times threshold; the temperature adjustment process includes temperature control cycle process; The controlling the environmental test box to perform temperature adjustment processing according to the first environmental control information to adjust the temperature inside the box to the target environmental temperature includes: Adjusting the temperature in the box to the first working temperature, and maintaining the temperature in the box at the first working temperature during the constant temperature delay; After the constant temperature delay, the temperature inside the box is reduced from the first operating temperature to the second operating temperature within the temperature reduction delay; After the temperature-falling time delay, the temperature inside the box is maintained at the second working temperature during the constant temperature time delay; After the constant temperature delay, the temperature in the box is increased from the second working temperature to the first working temperature within the temperature increase delay, completing a temperature control cycle process; When the number of times the temperature control cycle process is completed is equal to the preset number threshold, the temperature control cycle process is terminated.

6. The testing method of the solid state drive reliability testing system according to claim 4, characterized in that: The first power supply voltage control information includes: a first operating voltage, a second operating voltage, and a third operating voltage; The step of controlling the electrical characteristic measurement and control circuit to output an initial power supply voltage to the plurality of solid state hard disks to be tested according to the first power supply voltage control information, so that the solid state hard disks to be tested operate under the initial power supply voltage, comprises: Determine a first test group, a second test group, and a third test group from the plurality of solid state drives to be tested; Controlling the electrical characteristic measurement and control circuit to output a first operating voltage to the first test group, so that each of the solid-state hard disks to be tested in the first test group operates at the first operating voltage; Controlling the electrical characteristic measurement and control circuit to output a second operating voltage to the second test group, so that each of the solid-state hard disks to be tested in the second test group operates at the second operating voltage; The electrical characteristic measurement and control circuit is controlled to output a third operating voltage to the third test group, so that each of the solid-state hard disks to be tested in the third test group operates at the third operating voltage.

7. The testing method of the solid state drive reliability testing system according to claim 4, characterized in that: The method further comprises: Get an updated second test case combination; Acquire second power supply voltage control information, second environment control information, and second read-write voltage control information from the second test case combination; Controlling the environmental test box to perform temperature adjustment processing according to the second environmental control information to adjust the temperature inside the box to the target environmental temperature; According to the second power supply voltage control information, controlling the electrical characteristic measurement and control circuit to output an initial power supply voltage to the plurality of solid state hard disks to be tested, so that the solid state hard disks to be tested operate under the initial power supply voltage; Under the target ambient temperature and the initial power supply voltage, reliability tests are performed on all the solid-state hard disks to be tested; and electrical characteristic tests are performed, and the test mainboard is controlled to perform stress tests according to the second read-write voltage control information, and stress read and write operations are performed on the solid-state hard disks to be tested to obtain second electrical characteristic test data.

8. The testing method of the solid state drive reliability testing system according to claim 4, characterized in that: The mainboard cabinet group includes: a first mainboard cabinet and a second mainboard cabinet, and the solid state hard disk reliability test system also includes: a first display module and a second display module; After obtaining the first electrical characteristic test data, the method further includes: Recording the first electrical characteristic test data; Controlling the first display module to display the first electrical characteristic test data of the solid state drive to be tested connected to the first mainboard cabinet; The second display module is controlled to display the first electrical characteristic test data of the solid state drive to be tested which is connected to the second mainboard cabinet.

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