A semiconductor chip processing punching machine

Abstract

The present invention provides a semiconductor chip processing punching machine, which belongs to the field of semiconductor punching technology, and includes a punching processing table, the upper end of which is provided with a lifting assembly, a lateral feeding assembly and a longitudinal feeding assembly, the punching processing table is connected to a collection box, the longitudinal feeding assembly includes an adjustment plate, a slide rail and an electric slider, and also includes: a cooling assembly, which can realize local cooling of the semiconductor circuit board and improve the cleaning effect of debris after the punching process; a punching assembly, which includes a drill bit, and the punching assembly can reduce the mechanical stress on the semiconductor circuit board during punching, and can also be stopped for replacement according to the wear of the drill bit. The beneficial effects of the invention: the degree of passivation of the drill bit is judged by the cooperation of a floating ball, a lifting rod and an infrared signal sensor, so that the quality of the punching can be improved by stopping the machine for replacement, and the mixed liquid is formed into a vortex and quickly discharged from the hole, effectively reducing the adhesion of debris.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor drilling, and in particular to a semiconductor chip processing drilling machine. Background Art

[0002] Semiconductors refer to materials whose electrical conductivity at room temperature is between that of conductors and insulators. Semiconductor circuit boards are electronic components made of semiconductor materials that have the ability to process and control the flow of electric current. Circuit boards are carriers of electronic components for electrical circuit connections. Circuit boards make circuits miniaturized and intuitive, and have an important impact on the mass production of fixed circuits and the optimization of electrical appliance layout. At the same time, circuit boards are also the support of electronic components and the carrier of electrical connections for electronic components, playing a very important role.

[0003] In the practical process of circuit board production, the punching process is an indispensable step, which can meet the wire connection and heat dissipation requirements of the circuit board, and the drilling operation is a more common processing step. Therefore, when punching holes in semiconductor chips, a punching machine is needed to punch them, and the sharpness of the drill bit can determine the quality of the punching effect. As the drill bit is used for a longer time, the cutting edge of the drill bit will become blunt, resulting in uneven force when drilling, thus forming an irregular hole shape. However, when checking the wear degree of the drill bit, the quality after drilling is usually tested, such as the smoothness of the hole wall and the hole diameter. The accuracy and shape of the hole. If the drilling quality decreases, it may be due to the wear of the drill bit. However, it is too late to replace the drill bit at this time. The quality of the drilling has been affected, so it is impossible to provide feedback in time according to the usage. At the same time, a certain amount of debris or waste will be generated after punching. Some of these debris will float away with the flushing of the cooling equipment, but some debris may still adhere to the surface of the semiconductor and is not easy to be flushed away, thereby increasing the subsequent cleaning process and increasing the production cost. How to invent a semiconductor chip processing punching machine to solve these problems has become an urgent problem for technicians in this field. Summary of the invention

[0004] In order to make up for the above shortcomings, the present invention provides a semiconductor chip processing and punching machine, which aims to solve the problem that when checking the degree of drill wear, it is not possible to provide timely feedback based on the usage conditions, thereby affecting the processing quality of the drilling, and the generated debris increases the subsequent cleaning process and increases the production cost.

[0005] The present invention is achieved in that:

[0006] The present invention provides a semiconductor chip processing punching machine, comprising a punching processing table, wherein the upper end of the punching processing table is provided with a lifting assembly, a lateral feeding assembly and a longitudinal feeding assembly, the punching processing table is connected with a collecting box, wherein a filter plate and a supporting fixing frame are provided inside the collecting box, the longitudinal feeding assembly comprises an adjusting plate, a slide rail and an electric slide block, and further comprises:

[0007] A cooling assembly, wherein the cooling assembly is fixedly connected to the electric slider, and the cooling assembly can realize local cooling of the semiconductor circuit board and improve the cleaning effect of debris after the punching process;

[0008] A punching assembly is located below the electric slider. The punching assembly includes a drill bit. The punching assembly can reduce the mechanical stress on the semiconductor circuit board during punching. In addition, the drill bit can be replaced during shutdown according to the wear and tear of the drill bit.

[0009] Preferably, the lifting assembly includes a support column, and the support column is provided in pair. A bearing seat is provided on the side of the two support columns away from each other, the bearing seat is rotatably connected with a threaded column, the side wall of the bearing seat is fixedly connected with a driving motor, one end of the threaded column is fixedly connected to the output end of the driving motor, and the inner side wall of the support column is fixedly connected with a limiting strip.

[0010] Preferably, the lateral feed assembly includes a fixed frame and a movable plate, the side wall of the movable plate is slidingly connected to the limit bar, one end of the movable plate passes through the support column and is threadedly connected to the threaded column, the other end of the movable plate is fixedly connected to the side wall of the fixed frame, one end of the side wall of the fixed frame is fixedly connected to the feed motor, the inner wall of the fixed frame is rotatably connected to a threaded rod, one end of the threaded rod passes through the side wall of the fixed frame and is fixedly connected to the feed motor.

[0011] Preferably, one end of the adjustment plate is threadedly connected to the threaded rod, the adjustment plate is arranged in an "L" shape, the side wall of the adjustment plate is fixedly connected to the slide rail, and the slide rail and the electric slider slide in a limited manner.

[0012] Preferably, the cooling assembly includes a water tank and a connecting pipe, the water tank is fixedly connected to the upper side wall of the electric slider, the upper side wall of the water tank is fixedly connected to a water pump, and the lower side wall of the water tank is fixedly connected to one end of the connecting pipe.

[0013] Preferably, the punching assembly also includes a punching motor, the upper end of the punching motor is fixedly connected to the lower side wall of the electric slider, one end of the punching motor is detachably connected to the drill bit, and the lower end of the punching motor is provided with a support rod, and the support rod is provided with a pair, one end of the support rod is cylindrical, and the other end of the support rod is plate-shaped, and the cylindrical end of the support rod is fixedly connected to the lower side wall of the punching motor.

[0014] Preferably, a movable rod is sleeved on the side wall of one end of the support rod away from the punching motor, a buffer spring is provided on the outer wall of the movable rod, one end of the movable rod is fixedly connected to a support plate, and both ends of the buffer spring are respectively fixedly connected to the side wall of the support rod and the side wall of the support plate.

[0015] Preferably, the support plate is located directly below the drill bit, the lower side wall of the support plate is fixedly connected with a pressure cylinder, the upper side wall of the support plate is fixedly connected with a vertical pole, a pair of vertical poles are provided, the upper ends of the two vertical poles are fixedly connected with infrared signal sensors on the opposite side walls, the side wall of the support plate is movably connected with a lifting rod, one end of the lifting rod is fixedly connected with a floating ball, the lifting rod is arranged in a "T" shape, the upper end of the lifting rod is arranged in a square plate shape, and the lower end of the lifting rod is arranged in a cylindrical shape.

[0016] Preferably, one of the movable rods is fixedly connected to the piston head at one end away from the support plate, a docking groove is provided on one outer wall of the piston head, connecting grooves are provided inside the piston head, the movable rod and the support plate, a through hole is provided on the middle side wall of the support plate, one end opening of the connecting groove is connected to the docking groove, and the other end opening of the connecting groove is connected to the through hole, and the outer diameter of the drill bit is smaller than the inner diameter of the through hole.

[0017] Preferably, the two ends of one of the support rods are respectively fixedly connected with a fixing plate and a rubber tube, the inner wall of the rubber tube is interference fit with the outer wall of the piston head, one end of the fixing plate is fixedly connected to the end of the connecting pipe away from the water tank, the other end of the fixing plate is fixedly connected to the outer wall of the rubber tube, and a drainage groove is provided at the connection between the fixing plate and the rubber tube.

[0018] The beneficial effects of the present invention are:

[0019] During the semiconductor drilling process, the buffer spring and the pressure cylinder can effectively reduce the mechanical stress on the semiconductor components caused by the vibration of the drilling motor when driving the drill bit to rotate, thereby reducing the damage caused by the drill bit to the semiconductor components during the drilling process. In addition, the degree of bluntness of the drill bit can be timely judged through the cooperation of the floating ball, the lifting rod and the infrared signal sensor during the drilling process, so as to stop the machine for replacement, thereby avoiding the bluntness of the cutting edge of the drill bit, which leads to uneven force during drilling, thereby forming an irregular hole shape, affecting the quality of semiconductor component drilling, and after the processing is completed, the mixed liquid can be rotated to form a vortex and quickly discharged from the hole, effectively reducing the adhesion of debris and reducing the subsequent cleaning cost. At the same time, the debris in the mixed liquid will rub against the burrs at the opening during discharge, thereby reducing the generation of burrs after the precision work is completed and reducing the subsequent burr removal cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 It is a schematic diagram of the overall structure of a semiconductor chip processing punching machine provided by an embodiment of the present invention;

[0022] Figure 2 It is a schematic diagram of the structure of a lifting assembly of a semiconductor chip processing punching machine provided by an embodiment of the present invention;

[0023] Figure 3 It is a schematic structural diagram of a transverse feeding assembly and a longitudinal feeding assembly of a semiconductor chip processing punching machine provided by an embodiment of the present invention;

[0024] Figure 4 It is a schematic diagram of the structure of a filter plate of a semiconductor chip processing punching machine provided by an embodiment of the present invention;

[0025] Figure 5 It is a schematic structural diagram of a punching assembly and a cooling assembly of a semiconductor chip processing punching machine provided by an embodiment of the present invention;

[0026] Figure 6 It is a schematic diagram of the structure of a drill bit for a semiconductor chip processing punching machine provided by an embodiment of the present invention;

[0027] Figure 7 It is a partial half-section structural schematic diagram of a punching assembly and a cooling assembly of a semiconductor chip processing punching machine provided by an embodiment of the present invention;

[0028] Figure 8 It is a schematic diagram of the structure of a movable rod of a semiconductor chip processing punching machine provided by an embodiment of the present invention;

[0029] Fig. 9 It is a schematic diagram of the structure of a support plate of a semiconductor chip processing punching machine provided by an embodiment of the present invention;

[0030] Fig.10 It is a schematic diagram of the internal structure of a pressing cylinder of a semiconductor chip processing punching machine provided in an embodiment of the present invention.

[0031] In the figure: 1, punching table; 2, collecting box; 21, filter plate; 3, lifting assembly; 31, support column; 32, driving motor; 33, bearing seat; 34, threaded column; 35, limit strip; 4, horizontal feed assembly; 41, feed motor; 42, moving plate; 43, fixed frame; 44, threaded rod; 5, water pump; 6, cooling assembly; 61, water storage tank; 62, connecting pipe; 7, longitudinal feed assembly; 71, adjustment plate; 72, slide rail; 73. Electric slider; 8. Support bracket; 9. Punching assembly; 91. Punching motor; 92. Support rod; 93. Support plate; 931. Pressing cylinder; 932. Floating ball; 933. Lifting rod; 934. Vertical pole; 935. Infrared signal sensor; 94. Drill bit; 95. Movable rod; 96. Buffer spring; 97. Fixing plate; 971. Drain trough; 98. Rubber tube; 99. Connecting groove; 910. Piston head; 9101. Docking groove. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] Example, see Figure 1-Figure 10 A semiconductor chip processing punching machine includes a punching table 1, a lifting assembly 3, a lateral feeding assembly 4 and a longitudinal feeding assembly 7 are arranged at the upper end of the punching table 1, the punching table 1 is connected to a collecting box 2, a filter plate 21 and a supporting frame 8 are arranged inside the collecting box 2, the longitudinal feeding assembly 7 includes an adjusting plate 71, a slide rail 72 and an electric slider 73, and also includes:

[0034] A cooling assembly 6, which is fixedly connected to the electric slider 73, and can achieve local cooling of the semiconductor circuit board and improve the cleaning effect of debris after punching;

[0035] The punching assembly 9 is located below the electric slider 73. The punching assembly 9 includes a drill bit 94. The punching assembly 9 can reduce the mechanical stress on the semiconductor circuit board during punching. In addition, the drill bit 94 can be replaced during shutdown according to the wear and tear of the drill bit 94.

[0036] Furthermore, the lifting assembly 3 includes a support column 31, a pair of support columns 31, a bearing seat 33 is provided on the side of the two support columns 31 away from each other, the bearing seat 33 is rotatably connected with a threaded column 34, the side wall of the bearing seat 33 is fixedly connected with a drive motor 32, one end of the threaded column 34 is fixedly connected to the output end of the drive motor 32, and the inner side wall of the support column 31 is fixedly connected to a limit bar 35; the lateral feeding assembly 4 includes a fixed frame 43 and a movable plate 42, the side wall of the movable plate 42 is limitedly slidably connected with the limit bar 35, and one end of the movable plate 42 is fixedly connected to the limit bar 35. One end of the movable plate 42 passes through the supporting column 31 and is threadedly connected to the threaded column 34, the other end of the movable plate 42 is fixedly connected to the side wall of the fixed frame 43, one end of the side wall of the fixed frame 43 is fixedly connected to the feed motor 41, the inner wall of the fixed frame 43 is rotatably connected to the threaded rod 44, one end of the threaded rod 44 passes through the side wall of the fixed frame 43 and is fixedly connected to the feed motor 41; one end of the adjusting plate 71 is threadedly connected to the threaded rod 44, the adjusting plate 71 is arranged in an "L" shape, the side wall of the adjusting plate 71 is fixedly connected to the slide rail 72, and the slide rail 72 and the electric slider 73 slide in a limited position.

[0037] It should be noted that the lifting assembly 3, the lateral feeding assembly 4 and the longitudinal feeding assembly 7 are important components for completing the punching of semiconductor components. When punching the semiconductor components, the driving motor 32 can be started in the initial state to drive the threaded column 34 to rotate, and the threaded connection between the movable plate 42 and the threaded column 34 can be used to raise the fixing frame 43 to the highest position, so as to leave enough operating space below to facilitate the operator or the manipulator to load the materials. When loading, the semiconductor components can be placed on the surface of the supporting frame 8, and a magnetic magnet can be provided inside the supporting frame 8 to fix the components by the effect of magnetic attraction, or fasteners can be provided on the supporting frame 8 to fix the four ends of the components to avoid misalignment during processing. The filter plate 21 is provided to filter the mixed liquid generated when the components are drilled, and then The debris generated during the drilling process is screened out, and then the filtered coolant is collected through the collection box 2, and the collection box 2 and the water pump 5 are connected by a bellows. The advantage of this is that it realizes the recycling of resources, saves resources and production costs, and replenishes the coolant inside the water storage tank 61 in time to ensure the smooth drilling process; the filter plate 21 inside the collection box 2 is located below the supporting frame 8 because the advantage of doing so is that during the drilling process, due to the height difference, the generated mixed liquid can be better diffused to the surface of the filter plate 21 to improve the filtering effect, and the mixed liquid can be quickly cooled. In addition, the supporting frame 8 is detachably connected to the column inside the collection box 2, so that the filter plate 21 can be easily taken out from the collection box 2 for cleaning and replacement, so as to reduce the cost of later maintenance and replacement;

[0038] After completing the installation of the semiconductor components, the feed motor 41 is controlled to be turned on through the external processing end according to the position of the hole to be drilled, so as to drive the rotation of the threaded rod 44, and cooperate with the threaded connection between the threaded rod 44 and the adjustment plate 71 to adjust the horizontal X-axial position of the drill bit 94, and then the electric slider 73 is controlled by the signal to slide on the slide rail 72, so as to adjust the horizontal Y-axial position of the drill bit 94, thereby completing the precise positioning of the drilling position, and finally controlling the drive motor 32 to drive the drill bit 94 to move downward to complete the drilling process.

[0039] Reference Figure 5-Figure 8 , further; the cooling assembly 6 includes a water tank 61 and a connecting pipe 62, the water tank 61 is fixedly connected to the upper side wall of the electric slider 73, the upper side wall of the water tank 61 is fixedly connected to the water pump 5, and the lower side wall of the water tank 61 is fixedly connected to one end of the connecting pipe 62; the punching assembly 9 also includes a punching motor 91, the upper end of the punching motor 91 is fixedly connected to the lower side wall of the electric slider 73, one end of the punching motor 91 is detachably connected to the drill bit 94, and the lower end of the punching motor 91 is provided with a support rod 92, the support rod 92 is provided with a pair, one end of the support rod 92 is cylindrical, the other end of the support rod 92 is plate-shaped, and the cylindrical end of the support rod 92 is fixedly connected to the lower side wall of the punching motor 91; the side wall of the end of the support rod 92 away from the punching motor 91 is sleeved with a movable rod 95, the outer wall of the movable rod 95 is provided with a buffer spring 96, one end of the movable rod 95 is fixedly connected to the support plate 93, and the two ends of the buffer spring 96 are respectively It is fixedly connected to the side wall of the support rod 92 and the side wall of the support plate 93; one end of the movable rod 95 is fixedly connected to the piston head 910 away from the support plate 93, and a docking groove 9101 is provided on one outer wall of the piston head 910. A connecting groove 99 is provided inside the piston head 910, the movable rod 95 and the support plate 93, and a through hole is provided on the middle side wall of the support plate 93. One end opening of the connecting groove 99 is connected to the docking groove 9101, and the other end opening of the connecting groove 99 is connected to the through hole. The outer diameter of the drill bit 94 is smaller than the inner diameter of the through hole; the two ends of one of the support rods 92 are respectively fixedly connected to a fixing plate 97 and a rubber tube 98, and the inner wall of the rubber tube 98 is interference fit with the outer wall of the piston head 910, one end of the fixing plate 97 is fixedly connected to the end of the connecting pipe 62 away from the water tank 61, and the other end of the fixing plate 97 is fixedly connected to the outer wall of the rubber tube 98, and a drainage groove 971 is provided at the connection between the fixing plate 97 and the rubber tube 98.

[0040] It should be noted that: in the process of driving the punching motor 91 to move downward by the driving motor 32, the pressing cylinder 931 will first contact the upper surface of the semiconductor element. The pressing cylinder 931 is made of rubber material, which can ensure the sealing effect of contact with the semiconductor element. In the gradual downward movement of the punching motor 91, the buffer spring 96 will be compressed through the interaction with the semiconductor element, and at the same time drive the movable rod 95 to move upward. The advantage of this arrangement is that the elastic buffering of the buffer spring 96 and the pressing cylinder 931 can effectively reduce the mechanical stress on the semiconductor element caused by the vibration of the punching motor 91 when driving the drill bit 94 to rotate, thereby reducing the damage caused to the semiconductor element by the drill bit 94 during the drilling process, and the elastic limit of the buffer spring 96 can control the drilling depth of the drill bit 94, reduce the damage to the drill bit 94, and increase the drilling process. In addition, when the drill bit 94 moves downward, the piston head 910 moves upward inside the rubber tube 98, and the docking groove 9101 gradually connects with the drainage groove 971. At this time, the drainage groove 971 will transport the cooling lubricant in the water tank 61 to the docking groove 9101 through the connecting pipe 62, and then discharge it to the inside of the pressure cylinder 931 through the connecting groove 99. The piston head 910 has an interference fit in the rubber tube 98, and when the drill bit 94 moves downward to the maximum distance, the opening of the docking groove 9101 is always inside the rubber tube 98. Because the rubber tube 98 is made of rubber material and the piston head 910 is made of hard material, the outer diameter of the piston head 910 is larger than the inner diameter of the rubber tube 98. Therefore, the piston head 910 can have an interference fit with the rubber tube 98, so the cooling lubricant will not be discharged from the inside of the rubber tube 98.

[0041] The cooling lubricant delivered to the inside of the pressing cylinder 931 will perform local pre-cooling treatment on the drilling part of the semiconductor element. The advantage of this is that the influence of the heat generated during drilling on the material is reduced, thereby reducing thermal stress, and cooling by the cooling lubricant can shrink the material, improve the rigidity of the material, reduce vibration and deformation during the drilling process, thereby improving the accuracy of drilling; at this time, the lower end of the drill bit 94 is located inside the pressing cylinder 931 but is not in contact with the semiconductor element. As the downward movement continues, the drilling motor 91 can be started to drive the drill bit 94 to rotate to perform drilling treatment on the semiconductor element. In this process, the cooling lubricant will be continuously added to the inside of the pressing cylinder 931, and the heat generated during drilling can be better absorbed by increasing the capacity, so as to reduce the influence of the thermal stress generated by friction on the semiconductor element, and can effectively reduce the wear rate of the drill bit 94 and increase the service life; during the drilling process, the The debris will be mixed with the cooling lubricant. At the same time, due to the rotation of the drill bit 94, a vortex will be formed in the mixed liquid inside the pressure cylinder 931. The rotation direction of the vortex is the same as the opposite direction of the rotation of the drill bit 94. Therefore, after the drilling is completed, the drill bit 94 gradually rises. At this time, the mixed liquid will form a vortex from the hole and be quickly discharged. At the same time, the debris in the mixed liquid will rub against the burrs at the opening, thereby reducing the generation of burrs after fine processing and reducing the subsequent burr removal costs. In addition, during the upward movement of the drill bit 94, the connecting groove 99 will continue to discharge cooling lubricant to clean the surface of the semiconductor component inside the processing pressure cylinder 931, so as to further reduce the adhesion of debris and improve the cleanliness of the component surface. Finally, with the rise of the pressure cylinder 931 and the reset of the buffer spring 96, the mutual misalignment of the docking groove 9101 and the drainage groove 971 is achieved, thereby avoiding the dripping of the cooling lubricant.

[0042] Reference Figure 9-10 , further; the support plate 93 is located directly below the drill bit 94, the lower side wall of the support plate 93 is fixedly connected with a pressure cylinder 931, the upper side wall of the support plate 93 is fixedly connected with a vertical rod 934, a pair of vertical rods 934 are provided, the upper ends of the two vertical rods 934 are fixedly connected with infrared signal sensors 935 on the opposite side walls, the side wall of the support plate 93 is movably connected with a lifting rod 933, one end of the lifting rod 933 is fixedly connected with a floating ball 932, the lifting rod 933 is arranged in a "T" shape, the upper end of the lifting rod 933 is arranged in a square plate shape, and the lower end of the lifting rod 933 is arranged in a cylindrical shape.

[0043] It should be noted that the floating ball 932 and the lifting rod 933 are made of a plastic material with a density lower than that of the cooling lubricant. Therefore, when the cooling lubricant accumulates inside the pressing cylinder 931, the floating ball 932 will drive the lifting rod 933 to float upward. During the normal drilling process of the drill bit 94, the drill bit 94 drills a hole for a short time. At this time, the accumulated liquid level of the cooling lubricant is not enough to drive the lifting rod 933 to block the infrared signal sensor 935, and the cooling lubricant can be discharged in time after the hole is drilled. Therefore, it can be judged that the wear degree of the end of the drill bit 94 is still relatively good and does not need to be replaced. However, when the wear degree of the end of the drill bit 94 is large, the drill bit 94 is no longer sharp. When the speed of the drill bit 94 is kept constant, The time required for drilling a hole increases, and as time goes by, the capacity of the cooling lubricant inside the pressing cylinder 931 will increase. At this time, the floating ball 932 will float higher than usual, and the upward height of the end of the lifting rod 933 will also increase, thereby blocking the signal of the infrared signal sensor 935 (the infrared signal sensor 935 is already a prior art, so the working principle is no longer described in detail here). At this moment, the infrared signal sensor 935 can feed back the signal to the terminal processor, and the terminal processor can stop the action of the punching motor 91 in time and replace the drill bit 94 to avoid the blunting of the cutting edge of the drill bit 94, which will cause uneven force during drilling, thereby forming an irregular hole shape, affecting the quality of drilling holes in semiconductor components.

[0044] It should be noted that the specific model and specifications of the motor need to be selected and determined based on the actual specifications of the device, and the specific selection calculation method adopts the existing technology in this field, so it will not be described in detail.

[0045] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A semiconductor chip processing punching machine, comprising a punching table (1), wherein the upper end of the punching table (1) is provided with a lifting assembly (3), a lateral feeding assembly (4) and a longitudinal feeding assembly (7), wherein the punching table (1) is connected to a collecting box (2), wherein a filter plate (21) and a supporting frame (8) are provided inside the collecting box (2), wherein the longitudinal feeding assembly (7) comprises an adjusting plate (71), a slide rail (72) and an electric slide block (73), wherein: Also includes: A cooling assembly (6), wherein the cooling assembly (6) is fixedly connected to the electric slider (73); A punching assembly (9), the punching assembly (9) being located below the electric slide block (73), the punching assembly (9) comprising a drill bit (94); The cooling assembly (6) comprises a water tank (61) and a connecting pipe (62), wherein the water tank (61) is fixedly connected to the upper side wall of the electric slider (73), the upper side wall of the water tank (61) is fixedly connected to a water pump (5), and the lower side wall of the water tank (61) is fixedly connected to one end of the connecting pipe (62); The punching assembly (9) further comprises a punching motor (91), the upper end of the punching motor (91) being fixedly connected to the lower side wall of the electric slider (73), one end of the punching motor (91) being detachably connected to the drill bit (94), the lower end of the punching motor (91) being provided with a support rod (92), the support rod (92) being provided with a pair, one end of the support rod (92) being arranged in a cylindrical shape, the other end of the support rod (92) being arranged in a plate shape, and the cylindrical end of the support rod (92) being fixedly connected to the lower side wall of the punching motor (91); A movable rod (95) is sleeved on the side wall of one end of the support rod (92) away from the punching motor (91); a buffer spring (96) is provided on the outer wall of the movable rod (95); one end of the movable rod (95) is fixedly connected to a support plate (93); and two ends of the buffer spring (96) are respectively fixedly connected to the side wall of the support rod (92) and the side wall of the support plate (93); The support plate (93) is located directly below the drill bit (94); a pressure cylinder (931) is fixedly connected to the lower side wall of the support plate (93); a vertical rod (934) is fixedly connected to the upper side wall of the support plate (93); a pair of vertical rods (934) are provided; infrared signal sensors (935) are fixedly connected to the upper ends of the two vertical rods (934) facing the side walls; a lifting rod (933) is movably connected to the side wall of the support plate (93); a floating ball (932) is fixedly connected to one end of the lifting rod (933); the lifting rod (933) is arranged in a "T" shape; the upper end of the lifting rod (933) is arranged in a square plate shape; and the lower end of the lifting rod (933) is arranged in a cylindrical shape; One end of one of the movable rods (95) away from the support plate (93) is fixedly connected to the piston head (910); a docking groove (9101) is provided on an outer wall of one side of the piston head (910); a connecting groove (99) is provided inside the piston head (910), the movable rod (95) and the support plate (93); a through hole is provided on the middle side wall of the support plate (93); one end opening of the connecting groove (99) is connected to the docking groove (9101); the other end opening of the connecting groove (99) is connected to the through hole; and the outer diameter of the drill bit (94) is smaller than the inner diameter of the through hole; The two ends of one of the support rods (92) are respectively fixedly connected to a fixing plate (97) and a rubber tube (98); the inner wall of the rubber tube (98) is interference-fitted with the outer wall of the piston head (910); one end of the fixing plate (97) is fixedly connected to an end of the connecting pipe (62) away from the water storage tank (61); the other end of the fixing plate (97) is fixedly connected to the outer wall of the rubber tube (98); and a connection between the fixing plate (97) and the rubber tube (98) is provided. The drill bit (94) moves downward to cause the piston head (910) to move upward inside the rubber cylinder (98), so that the docking groove (9101) and the drain groove (971) are connected to each other. The drain groove (971) transports the cooling lubricating liquid inside the water storage tank (61) to the inside of the docking groove (9101) through the connecting pipe (62). The docking groove (9101) discharges the cooling lubricating liquid into the inside of the pressing cylinder (931) through the connecting groove (99).

2. A semiconductor chip processing punching machine according to claim 1, characterized in that: The lifting assembly (3) comprises a support column (31), wherein a pair of the support columns (31) are provided, and a bearing seat (33) is provided on the side of the two support columns (31) that is away from each other, the bearing seat (33) is rotatably connected to a threaded column (34), a side wall of the bearing seat (33) is fixedly connected to a driving motor (32), one end of the threaded column (34) is fixedly connected to an output end of the driving motor (32), and an inner side wall of the support column (31) is fixedly connected to a limiting strip (35).

3. A semiconductor chip processing punching machine according to claim 2, characterized in that: The transverse feeding assembly (4) comprises a fixed frame (43) and a movable plate (42); a side wall of the movable plate (42) is slidably connected to a limit bar (35); one end of the movable plate (42) passes through a support column (31) and is threadedly connected to a threaded column (34); the other end of the movable plate (42) is fixedly connected to a side wall of the fixed frame (43); one end of the side wall of the fixed frame (43) is fixedly connected to a feeding motor (41); a threaded rod (44) is rotatably connected to an inner wall of the fixed frame (43); one end of the threaded rod (44) passes through the side wall of the fixed frame (43) and is fixedly connected to the feeding motor (41).

4. A semiconductor chip processing punching machine according to claim 3, characterized in that: One end of the adjustment plate (71) is threadedly connected to the threaded rod (44); the adjustment plate (71) is arranged in an "L" shape; a side wall of the adjustment plate (71) is fixedly connected to a slide rail (72); and the slide rail (72) and the electric slide block (73) slide in a limited manner.

Images