Ingot cutting machine

By setting up multiple cutting stations and cutting guide mechanisms in the crystal rod cutting machine, multiple crystal rods can be cut at the same time, and the cutting chamfer is completed in the same equipment, which solves the low production efficiency and chamfer in the prior art. The problem of integration improves production efficiency and reduces costs.

CN118876252BActive Publication Date: 2024-12-13TONGWEI MICROELECTRONICS CO LTD
View PDF 14 Cites 0 Cited by

Patent Information

Application Number
CN202411377105.9
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-09-30
Publication Date
2024-12-13
Estimated Expiration
2044-09-30

AI Technical Summary

Technical Problem

The existing wafer cutting technology can only cut one crystal rod in a single time, which has low production efficiency and the chamfering mechanism is usually set separately, so it is impossible to achieve integrated cutting and chamfering, which increases production cost and equipment maintenance difficulty.

Method used

Design a crystal rod cutting machine, set up multiple cutting stations in the installation frame, use cutting and laying and collecting mechanisms to provide line driving force, and form a nip roller angle structure through multiple cutting guide mechanisms to realize the multi-crystal rod Cut simultaneously and finish cutting chamfering in the same device.

Benefits of technology

Improve production efficiency, avoid resin block bonding, realize integrated cutting and chamfering, and reduce equipment costs and maintenance difficulties.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN118876252B_ABST
    Figure CN118876252B_ABST
Patent Text Reader

Abstract

The present invention provides a crystal rod cutting machine, which relates to the field of semiconductor technology. The crystal rod cutting machine includes a mounting frame, a cutting wire release mechanism, a cutting wire take-up mechanism and a plurality of cutting guide mechanisms. A plurality of cutting stations are arranged in the middle of the mounting frame; the cutting wire release mechanism and the cutting wire take-up mechanism are arranged on the mounting frame; a plurality of cutting guide mechanisms are arranged on the mounting frame and correspond to the plurality of cutting stations respectively, and the cutting wires are rolled and wound around the plurality of cutting guide mechanisms in sequence. Compared with the prior art, the present invention simultaneously fixes a plurality of crystal rods by setting a plurality of cutting stations, and simultaneously realizes the cutting of a plurality of crystal rods by using a plurality of cutting guide mechanisms, thereby improving production efficiency.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a crystal rod cutting machine. Background Art

[0002] In the production process of silicon carbide substrates, the silicon carbide crystal rods that have been grown need to be cut into wafers through wafer cutting technology. However, the existing wafer cutting technology usually uses wire cutting equipment to cut only one crystal rod at a time, which has low production efficiency. Summary of the invention

[0003] The objectives of the present invention include, for example, providing a crystal rod cutting machine that can cut multiple crystal rods at the same time, thereby improving production efficiency.

[0004] The embodiments of the present invention can be implemented as follows:

[0005] In a first aspect, the present invention provides a crystal rod cutting machine, comprising:

[0006] An installation frame, wherein a crystal rod cutting area is provided in the middle of the installation frame, and the crystal rod cutting area has a plurality of cutting stations for fixing the ends of the crystal rods;

[0007] A cutting and releasing mechanism, which is arranged on the mounting frame and located at the edge of the crystal rod cutting area, and is used for cyclically outputting cutting lines to the crystal rod cutting area;

[0008] A cutting wire collection mechanism, which is disposed on the mounting frame and located at the edge of the crystal rod cutting area, and is used to collect the cutting wire in the crystal rod cutting area;

[0009] A plurality of cutting guide mechanisms are provided on the mounting frame and are arranged around the crystal rod cutting area, and the plurality of cutting guide mechanisms are respectively arranged in one-to-one correspondence with the plurality of cutting stations, the cutting wire is rolled and wound around the plurality of cutting guide mechanisms in sequence, and a plurality of clamping roller angle structures are formed which are respectively clamped on both sides of the plurality of crystal rods, and the clamping roller angle structures are used to cut the crystal rod on the corresponding cutting station under the drive of the corresponding cutting guide mechanism.

[0010] In an optional embodiment, each cutting guide mechanism includes a cutting line guide roller, a guide slide rail, a sliding bearing block and a cutting drive member, the guide slide rail is fixedly arranged on the mounting frame and installed on the outer side of the corresponding cutting station, the sliding bearing block is slidably arranged on the guide slide rail, the cutting line guide roller is rotatably arranged on the sliding bearing block, the cutting line is rolled and wound around the cutting line guide roller, the cutting drive member is arranged on the guide slide rail and is transmission-connected to the sliding bearing block, for driving the sliding bearing block to slide reciprocatingly along the guide slide rail.

[0011] In an optional embodiment, at least two cutting rollers are provided on the inner side of each cutting station, and the cutting rollers are rotatably provided on the mounting frame. The two cutting rollers and the corresponding cutting wire guide rollers on the outer side of the cutting station are arranged in a triangle, and the cutting wire is wound around the inner side of the cutting rollers and wound around the outer side of the cutting wire guide rollers.

[0012] In an optional embodiment, the cutting station corresponds to the inner side of the middle part of the guide rail, and the two cutting rollers and the corresponding cutting line guide rollers on the outer side of the cutting station are arranged to form a cutting triangle;

[0013] When the cutting line guide roller is located in the middle of the guide rail, the crystal rod on the cutting station is located within the range of the cutting triangle;

[0014] When the cutting line guide rollers are located at both ends of the guide rails, the crystal rod on the cutting station is located outside the range of the cutting triangle.

[0015] In an optional embodiment, the cutting station corresponds to the inner side of the first end of the guide rail, and the two cutting rollers and the corresponding cutting line guide rollers on the outer side of the cutting station are arranged to form a cutting triangle;

[0016] When the cutting line guide roller is located at the first end of the guide rail, the crystal rod on the cutting station is located within the range of the cutting triangle;

[0017] When the cutting line guide roller is located at the second end of the guide rail, the crystal rod on the cutting station is located outside the range of the cutting triangle.

[0018] In an optional embodiment, the guide rail is linear, and the cutting drive component includes a motor and a driving screw. The motor is fixedly arranged at one end of the guide rail, and the driving screw is rotatably arranged in the guide rail and is drivingly connected to the output shaft of the motor. The sliding bearing block is threadedly assembled on the driving screw and performs linear reciprocating motion under the drive of the driving screw.

[0019] In an optional embodiment, the guide rail is arc-shaped, the cutting drive component includes a motor and a driving gear, and a driving rack is also provided on the guide rail. The extension direction of the driving rack is the same as the extension direction of the guide rail. The motor is arranged on the sliding bearing block, and the driving gear is arranged on the output shaft of the motor and meshes with the driving rack. The sliding bearing block is used to make an arc reciprocating motion along the guide rail driven by the driving gear.

[0020] In an optional embodiment, the cutting and wire-paying mechanism includes a wire payer, a wire feed roller, a first drive roller and a first buffer roller group. The wire payer is fixedly arranged on the mounting frame and is used to pay out the cutting wire. The first drive roller is arranged on the wire outlet side of the wire payer, the wire feed roller is arranged on the side of the first drive roller away from the wire payer, the first buffer roller group is movably arranged between the first drive roller and the wire feed roller, the cutting wire is rolled and wound around the wire feed roller, the first buffer roller group and the first drive roller in sequence, the first drive roller is used to drive the cutting wire to move toward the wire feed roller, the wire feed roller is used to convey the cutting wire to a plurality of the cutting guide mechanisms, and the first buffer roller group is used to adjust the tension of the cutting wire.

[0021] In an optional embodiment, the cutting and wire-taking mechanism includes a wire take-up device, a wire take-up roller, a second drive roller and a second buffer roller group, the wire take-up device is fixedly disposed on the mounting frame and is used to take up the cutting line, the second drive roller is disposed on the line-entry side of the wire take-up device, the wire take-up roller is disposed on the side of the second drive roller away from the wire take-up device, the second buffer roller group is movably disposed between the second drive roller and the wire take-up roller, the cutting line is rolled and wound around the wire take-up roller, the second buffer roller group and the second drive roller in sequence, the second drive roller is used to drive the cutting line to move toward the wire take-up device, the wire take-up roller is used to take up the cutting line conveyed by the plurality of cutting guide mechanisms, and the second buffer roller group is used to adjust the tension of the cutting line.

[0022] In an optional embodiment, the crystal rod cutting machine also includes a chamfering mechanism, which includes an auxiliary plug, a chamfering rod and a driving roller. The auxiliary plug is used to place the cut wafer, and the driving roller and the chamfering rod are both arranged at the bottom of the auxiliary plug. The driving roller is used to roll and abut against the edge of the wafer to drive the wafer to rotate. The chamfering rod is provided with a chamfering groove for chamfering the edge of the wafer.

[0023] The beneficial effects of the embodiments of the present invention include, for example:

[0024] The crystal rod cutting machine provided by the embodiment of the present invention has a crystal rod cutting area arranged in the middle of the mounting frame, and the crystal rod cutting area is provided with a plurality of cutting stations, each of which can fix the inner end of the crystal rod, thereby avoiding the resin block from being bonded to the periphery of the crystal rod. The cutting wire release mechanism and the cutting wire take-up mechanism are both arranged on the mounting frame and are both located at the edge of the crystal rod cutting area, and can input and retract the cutting wire into the crystal rod cutting area, and provide a wire driving force. A plurality of cutting guide mechanisms are arranged around the crystal rod cutting area, and are respectively arranged one by one corresponding to a plurality of cutting stations, and the cutting wire can be rolled and wound around the plurality of cutting guide mechanisms in turn, and a clamping roller angle structure clamped on both sides of the crystal rod is formed, and the clamping roller angle structure can cut the crystal rod on the corresponding cutting station under the drive of the cutting guide mechanism, thereby realizing the simultaneous cutting of a plurality of crystal rods. Compared with the prior art, the crystal rod cutting machine provided in the embodiment of the present invention simultaneously fixes multiple crystal rods by setting up multiple cutting stations, and uses multiple cutting guide mechanisms to form multiple clamping roller angle structures for cutting, thereby simultaneously realizing the cutting of multiple crystal rods and improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0026] Figure 1 A schematic structural diagram of a crystal rod cutting machine provided in a first embodiment of the present invention;

[0027] Figure 2 for Figure 1 Structural diagram of the middle cutting station;

[0028] Figure 3 for Figure 1 A schematic diagram of the structure of the cutting guide mechanism in the initial state;

[0029] Figure 4 for Figure 1 A schematic diagram of the structure of the cutting guide mechanism in the cutting completion state;

[0030] Figure 5 for Figure 1 Structural schematic diagram of the middle cutting wire-releasing mechanism and the cutting wire-retrieving mechanism;

[0031] Figure 6 for Figure 1 Structural schematic diagram of the chamfering mechanism;

[0032] Figure 7 for Figure 6Schematic diagram of the structure of the middle chamfering rod;

[0033] Figure 8 is a schematic structural diagram of a cutting guide mechanism in an initial state in a second embodiment of the present invention;

[0034] Fig. 9 is a schematic structural diagram of a cutting guide mechanism in a second embodiment of the present invention when cutting is completed;

[0035] Fig.10 Schematic diagram of the structure of the cutting guide mechanism in the third embodiment of the present invention.

[0036] Icons: 100-crystal rod cutting machine; 110-mounting frame; 111-cutting station; 113-bonding chassis; 115-feeding drive; 130-cutting and unwinding mechanism; 131-unwinding device; 132-wire feed roller; 133-first driving roller; 134-first buffer roller group; 135-buffer roller body; 136-buffer driving member; 137-buffer roller; 150-cutting and unwinding mechanism; 151-unwinding device; 152-unwinding roller; 153-second driving roller; 154-first Two buffer roller groups; 170-cutting guide mechanism; 171-cutting line guide roller; 172-guide rail; 1721-driving rack; 173-sliding bearing block; 174-cutting drive member; 1741-motor; 1743-driving screw rod; 1745-driving gear; 175-cutting roller; 180-cutting line; 190-chamfering mechanism; 191-auxiliary plug; 193-chamfering rod; 195-chamfering groove; 196-driving roller; 200-crystal rod; 210-wafer. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0038] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0040] In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. appear to indicate an orientation or position relationship, they are based on the orientation or position relationship shown in the accompanying drawings, or are the orientation or position relationship in which the product of the invention is usually placed when used. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0041] In addition, the terms “first”, “second”, etc., if used, are merely used to distinguish between the descriptions and should not be understood as indicating or implying relative importance.

[0042] As disclosed in the background technology, the prior art ingot cutting process usually adopts single ingot cutting, that is, a single ingot is fixed by a resin block arranged at the periphery, and then cut by a single wire, so that only one ingot can be cut at a time, which is inefficient. When mass production is required, the number of cutting equipment can only be increased, which greatly increases the equipment cost, and the cutting wires of multiple equipment are driven and controlled independently, which also brings great challenges to equipment maintenance.

[0043] In addition, the chamfering mechanism is usually set up separately, and it is impossible to achieve integrated cutting and chamfering, which undoubtedly reduces production efficiency and increases production costs.

[0044] In order to solve the above problems, an embodiment of the present invention provides a crystal rod cutting machine. It should be noted that the features in the embodiments of the present invention can be combined with each other without conflict.

[0045] First embodiment

[0046] See also Figures 1 to 4 The crystal rod cutting machine 100 provided in the embodiment of the present invention can cut multiple crystal rods 200 at the same time, thereby improving production efficiency; and can fix the ends of the crystal rods 200 without the need for resin blocks to bond the edges of the crystal rods 200, and the cutting and chamfering processes can be performed in the same device, thereby realizing integrated cutting and chamfering.

[0047] The ingot cutting machine 100 provided in this embodiment includes an installation frame 110, a cutting wire release mechanism 130, a cutting wire take-up mechanism 150, a chamfering mechanism 190 and a plurality of cutting guide mechanisms 170. A ingot cutting area is provided in the middle of the installation frame 110, and the ingot cutting area has a plurality of cutting stations 111 for fixing the ends of the ingots 200; the cutting wire release mechanism 130 is provided on the installation frame 110 and is located at the edge of the ingot cutting area, and is used to cyclically output a cutting wire 180 to the ingot cutting area; the cutting wire take-up mechanism 150 is provided on the installation frame 110 and is located at the edge of the ingot cutting area, and is used to retract the cutting wire 180 in the ingot cutting area. 80; a plurality of cutting guide mechanisms 170 are arranged on the mounting frame 110 and are arranged around the crystal rod cutting area, and the plurality of cutting guide mechanisms 170 are arranged one by one corresponding to the plurality of cutting stations 111, and the cutting line 180 is rolled and wound around the plurality of cutting guide mechanisms 170 in sequence, and a plurality of clamping roller angle structures are formed which are clamped on both sides of the plurality of crystal rods 200, respectively, and the clamping roller angle structures are used to cut the crystal rod 200 on the corresponding cutting station 111 under the drive of the corresponding cutting guide mechanism 170; a chamfering mechanism 190 is arranged on the mounting frame 110 and is arranged in the central area of ​​the crystal rod cutting area, and is used to chamfer the edges of the cut wafer 210.

[0048] It is worth noting that in this embodiment, a crystal rod cutting area is set in the middle of the mounting frame 110, and the crystal rod cutting area is provided with a plurality of cutting stations 111, each of which can fix the inner end of the crystal rod 200, thereby avoiding the bonding of resin blocks around the crystal rod 200. The cutting wire release mechanism 130 and the cutting wire take-up mechanism 150 are both arranged on the mounting frame 110, and are both located at the edge of the crystal rod cutting area, and can input and retract the cutting wire 180 into the crystal rod cutting area, and provide a line driving force. A plurality of cutting guide mechanisms 170 are arranged around the crystal rod cutting area, and are respectively arranged one by one with a plurality of cutting stations 111, and the cutting wire 180 can be rolled and wound around the plurality of cutting guide mechanisms 170 in sequence, and form a clamping roller angle structure clamped on both sides of the crystal rod 200, and the clamping roller angle structure can cut the crystal rod 200 on the corresponding cutting station 111 under the drive of the cutting guide mechanism 170, so as to realize the simultaneous cutting of a plurality of crystal rods 200, thereby improving the production efficiency. The chamfering mechanism 190 is disposed on the mounting frame 110 and is located in the central area of ​​the crystal rod cutting area, and can directly chamfer the edges of the wafer 210 formed after cutting, thereby realizing integrated cutting and chamfering.

[0049] It should be noted that, in this embodiment, the cutting station 111 is provided with a bonding chassis 113, and a receiving groove is provided on the bonding chassis 113. The end of the crystal rod 200 is correspondingly accommodated in the receiving groove, and is bonded and fixed by a resin block, thereby achieving the fixation of the end face of the crystal rod 200. Of course, in order to further improve the bonding and fixing effect, an annular protrusion can also be provided on the bonding chassis 113, and an annular groove can be pre-opened on the end face of the crystal rod 200 to increase the bonding area. Furthermore, in order to feed the crystal rod 200 according to the cutting process, a feed drive 115 is also provided on the bonding chassis 113. The feed drive 115 can be an oil cylinder, which can drive the crystal rod 200 to feed axially, so as to facilitate cutting by the cutting line 180.

[0050] Furthermore, the ingot cutting machine 100 in this embodiment further includes a mechanical arm arranged at the edge of the mounting frame 110, which can move autonomously and transfer the wafer 210 formed after cutting at the cutting station 111 to the chamfering mechanism 190 by vacuum adsorption. Of course, in other preferred embodiments of the present invention, the cut wafer 210 can also be transferred to the chamfering mechanism 190 by manual handling, which is not specifically limited here.

[0051] It should be noted that in this embodiment, the free end of the mechanical arm is provided with a suction cup structure, and the suction cup structure is used to absorb and transfer the wafer 210. In addition, since the crystal rod 200 needs to be subjected to force during the cutting process, and the cut wafer 210 needs to be absorbed and transferred in time, the suction cup structure of the mechanical arm can be always absorbed on the outer end face of the crystal rod 200 (i.e., the end face not fixed to the cutting station 111) during the cutting process. At this time, there can be multiple mechanical arms, so that absorption and transfer can be performed separately.

[0052] Each cutting guide mechanism 170 includes a cutting line guide roller 171, a guide rail 172, a sliding bearing block 173 and a cutting drive 174. The guide rail 172 is fixedly arranged on the mounting frame 110 and installed on the outer side of the corresponding cutting station 111. The sliding bearing block 173 is slidingly arranged on the guide rail 172. The cutting line guide roller 171 is rotatably arranged on the sliding bearing block 173. The cutting line 180 is rolled and wound on the cutting line guide roller 171. The cutting drive 174 is arranged on the guide rail 172 and is transmission-connected with the sliding bearing block 173, and is used to drive the sliding bearing block 173 to slide back and forth along the guide rail 172. Specifically, the cutting line guide roller 171 can move along the guide rail 172 under the drive of the sliding bearing block 173, and the movement and movement speed are controlled by the cutting drive 174, so that the cutting line 180 on the cutting line guide roller 171 can be driven to pass over the crystal rod 200, so as to achieve cutting of the crystal rod 200, and the cutting process is faster and more controllable.

[0053] It should be noted that the rolling winding mentioned in this embodiment means that the cutting line 180 is wound around the cutting line guide roller 171 and can drive the cutting line guide roller 171 to rotate through friction. Its basic principle can refer to the existing cutting line 180 roller structure.

[0054] Furthermore, at least two cutting rollers 175 are provided inside each cutting station 111, and the cutting rollers 175 are rotatably provided on the mounting frame 110. The two cutting rollers 175 and the cutting wire guide rollers 171 outside the corresponding cutting station 111 are provided in a triangular configuration, and the cutting wire 180 is wound around the inside of the cutting rollers 175 and the outside of the cutting wire guide rollers 171. Specifically, the cutting wire 180 is wound around the inside of the cutting rollers 175, which means passing through the side of the cutting rollers 175 close to the center of the crystal rod cutting area, and the cutting wire 180 is wound around the outside of the cutting wire guide rollers 171, which means passing through the side of the cutting wire guide rollers 171 away from the center of the crystal rod cutting area. Through this arrangement, a tight cutting line 180 can be formed between the cutting roller 175 and the cutting line guide roller 171, and a clamping roller angle structure is formed between the cutting rollers 175 and the cutting line guide rollers 171 on both sides, which is beneficial to cutting, and the position of the cutting roller 175 will not change. Therefore, the cutting line guide roller 171 will cause the cutting line 180 to move during its movement, thereby better realizing the cutting of the crystal rod 200.

[0055] In this embodiment, there can be four cutting guide mechanisms 170, and there can be five cutting rollers 175. The cutting pay-off mechanism 130 and the cutting take-up mechanism 150 can be arranged adjacent to each other at one point. In cooperation with the four cutting line guide rollers 171, the cutting line 180 can be formed into an approximate five-pointed star structure. The four cutting line guide rollers 171 and the input and output points are respectively located at the five outer corners of the five-pointed star structure, and the five cutting rollers 175 are located at the five inner corners of the five-pointed star structure, thereby forming four clamping roller angle structures and cutting four crystal rods 200 at the same time.

[0056] In this embodiment, the cutting station 111 corresponds to the inner side of the middle part of the guide rail 172, and the two cutting rollers 175 and the corresponding cutting line guide rollers 171 on the outer side of the cutting station 111 are arranged to form a cutting triangle; when the cutting line guide rollers 171 are located in the middle part of the guide rail 172, the crystal rod 200 on the cutting station 111 is located within the range of the cutting triangle; when the cutting line guide rollers 171 are located at both ends of the guide rail 172, the crystal rod 200 on the cutting station 111 is located outside the range of the cutting triangle. Specifically, the length of the guide rail 172 can be reasonably limited to ensure that the cutting line 180 can completely cut the crystal rod 200.

[0057] During the cutting process, the crystal ingot 200 is first fixed on the cutting station 111. At this time, the cutting line guide roller 171 is located in the middle of the guide rail 172. The cutting triangle formed by the cutting line guide roller 171 and the two cutting rollers 175 is an isosceles triangle, and the crystal ingot 200 is located in the cutting triangle. After the crystal ingot 200 is placed, it is cut. The cutting line guide roller 171 moves from the middle position of the guide rail 172 to one end, driving the cutting line 180 on one side to cut the crystal ingot 200. When the cutting line guide roller 171 moves to the end of the guide rail 172, the cutting line 180 completely passes over the crystal ingot 200, and the cutting is completed. At this time, the crystal ingot 200 is located outside the area of ​​the cutting triangle. When the first wafer is cut, the crystal rod 200 can be fed a short distance by the feed drive 115, and the cutting line guide roller 171 will cut the crystal rod 200 again when it moves toward the middle position of the guide slide 172 to complete the cutting of the second wafer. When the cutting line guide roller 171 returns to the middle position, the crystal rod 200 can be fed a short distance again by the feed drive 115, and the cutting line guide roller 171 moves toward the other end of the guide slide 172. After reaching the end, the cutting of the third wafer is completed. Similarly, the crystal rod 200 can be fed a short distance under the drive of the feed drive 115. When the cutting line guide roller 171 returns to the middle position, the cutting of the fourth wafer can be completed, and a cutting cycle is completed. This cutting method greatly improves the cutting efficiency and greatly improves the production efficiency of wafers.

[0058] In other preferred embodiments of the present invention, during cutting, the cutting line guide roller 171 may be first moved to one end of the guide rail 172, and then moved to the other end of the guide rail 172. In this case, the length of the guide rail 172 may be appropriately shortened to reduce the occupied space of the overall equipment, so that when the cutting line guide roller 171 moves to one end of the guide rail 172, the crystal rod 200 does not completely leave the cutting triangle area, that is, the crystal rod 200 is not completely cut off, and the uncut part is cut off when the cutting line guide roller 171 moves to the other end of the guide rail 172.

[0059] In this embodiment, the guide rail 172 is in a straight line shape, and the cutting drive member 174 includes a motor 1741 and a driving screw 1743. The motor 1741 is fixedly arranged at one end of the guide rail 172, and the driving screw 1743 is rotatably arranged in the guide rail 172 and is connected to the output shaft of the motor 1741. The sliding bearing block 173 is threadedly assembled on the driving screw 1743 and performs linear reciprocating motion driven by the driving screw 1743. Specifically, the motor 1741 can be a stepping motor 1741, and can provide a stable and reliable driving force, so that the sliding bearing block 173 can be driven to move stably through the driving screw 1743, and drive the cutting line 180 to achieve cutting of the crystal rod 200.

[0060] See also Figure 5 The cutting and paying-off mechanism 130 includes a pay-off device 131, a line-in-line roller 132, a first driving roller 133 and a first buffer roller group 134. The pay-off device 131 is fixedly arranged on the mounting frame 110 and is used to pay out the cutting line 180. The first driving roller 133 is arranged on the line-out side of the pay-off device 131. The line-in-line roller 132 is arranged on the side of the first driving roller 133 away from the pay-off device 131. The first buffer roller group 134 is movably arranged between the first driving roller 133 and the line-in-line roller 132. The cutting line 180 is rolled and wound around the line-in-line roller 132, the first buffer roller group 134 and the first driving roller 133 in sequence. The first driving roller 133 is used to drive the cutting line 180 to move toward the line-in-line roller 132. The line-in-line roller 132 is used to pay out the line. The first buffer roller group 134 is used to adjust the tension of the cutting line 180. Specifically, the wire unwinder 131 can output the cleaned cutting line 180 outward, the wire feed roller 132 can be set near the outer corner of the five-pointed star structure, the first drive roller 133 can be driven autonomously to provide wire feed power, and the setting of the first buffer roller group 134 can achieve a buffering function, thereby offsetting the tension change of the cutting line 180 caused by the movement of the cutting line guide roller 171.

[0061] The cutting and wire-taking mechanism 150 includes a wire take-up device 151, a wire take-up roller 152, a second driving roller 153 and a second buffer roller group 154. The wire take-up device 151 is fixedly arranged on the mounting frame 110 and is used to take back the cutting line 180. The second driving roller 153 is arranged on the wire-entry side of the wire take-up device 151. The wire take-up roller 152 is arranged on the side of the second driving roller 153 away from the wire take-up device 151. The second buffer roller group 154 ​​is movably arranged between the second driving roller 153 and the wire take-up roller 152. The cutting line 180 is rolled and wound around the wire take-up roller 152, the second buffer roller group 154 ​​and the second driving roller 153 in sequence. The second driving roller 153 is used to drive the cutting line 180 to move toward the wire take-up device 151. The wire take-up roller 152 is used to take back the cutting line 180 conveyed by multiple cutting guide mechanisms 170. The second buffer roller group 154 ​​is used to adjust the tension of the cutting line 180. Specifically, the wire take-up device 151 can retract the cutting line 180 after cutting, the wire take-up roller 152 can be arranged near the outer corner of the five-pointed star structure and adjacent to the wire input roller 132, and the second drive roller 153 can also be driven autonomously to provide wire take-up power, and the setting of the second buffer roller group 154 ​​can realize the buffering function, thereby offsetting the tension change of the cutting line 180 caused by the movement of the cutting line guide roller 171.

[0062] It should be noted that, in this embodiment, the wire pay-off device 131 and the wire take-up device 151 can also be provided integrally, so as to realize the cyclic pay-off and take-up of the wire.

[0063] It is worth noting that the structures of the first buffer roller group 134 and the second buffer roller group 154 ​​in this embodiment are similar. The buffer principle thereof is described below by taking the first buffer roller group 134 as an example. The first buffer roller group 134 includes a buffer roller body 135, a buffer driving member 136 and two buffer rollers 137. The two buffer rollers 137 are arranged opposite to each other, and the buffer roller body 135 is arranged between the two buffer rollers 137. The cutting line 180 is rolled and wound around the buffer roller 137 and the buffer roller body 135 in sequence. The buffer roller body 135 can be driven by the buffer driving member 136 to approach or move away from the buffer roller 137, thereby achieving buffering. Specifically, when the cutting line 180 passes through the roller and moves toward the end of the guide rail 172, the tension of the cutting line 180 will be increased. At this time, the buffer roller body 135 can be driven by the buffer driving member 136 to move close to the two buffer rollers 137 to reduce the tension and offset the corresponding tension changes. When the cutting line 180 passes through the roller and moves toward the middle of the guide rail 172, the tension of the cutting line 180 will be reduced. At this time, the buffer roller body 135 can be driven by the buffer driving member 136 to move away from the two buffer roller bodies 135 to increase the tension and offset the corresponding tension changes.

[0064] See also Figure 6 and Figure 7 In this embodiment, the chamfering mechanism 190 includes an auxiliary plug 191, a chamfering rod 193 and a driving roller 196. The auxiliary plug 191 is used to place the cut wafer 210. The driving roller 196 and the chamfering rod 193 are both arranged at the bottom of the auxiliary plug 191. The driving roller 196 is used to roll against the edge of the wafer 210 to drive the wafer 210 to rotate. The chamfering rod 193 is provided with a chamfering groove for chamfering the edge of the wafer 210. Specifically, the chamfering rod 193 is provided with four chamfering grooves 195, which can chamfer four wafers 210 at the same time. In addition, there can be two driving rollers 196, which are respectively arranged on both sides of the chamfering rod 193, so that they can rotate left or right at the same time under the drive of the motor 1741, drive the wafer 210 to rotate, and assist the chamfering rod 193 to chamfer four wafers 210 at the same time.

[0065] In summary, the ingot cutting machine 100 provided in this embodiment has an ingot cutting area arranged in the middle of the mounting frame 110, and the ingot cutting area is provided with a plurality of cutting stations 111, and each cutting station 111 can fix the inner end of the ingot 200. The cutting wire release mechanism 130 and the cutting wire take-up mechanism 150 are both arranged on the mounting frame 110, and are both located at the edge of the ingot cutting area, and can input and retract the cutting wire 180 into the ingot cutting area, and provide a line driving force. A plurality of cutting guide mechanisms 170 are arranged around the ingot cutting area, and are respectively arranged one by one with a plurality of cutting stations 111, and the cutting wire 180 can be rolled and wound around the plurality of cutting guide mechanisms 170 in sequence, and form a clamping roller angle structure clamped on both sides of the ingot 200, and the clamping roller angle structure can cut the ingot 200 on the corresponding cutting station 111 under the drive of the cutting guide mechanism 170, so as to realize the simultaneous cutting of a plurality of ingots 200. The chamfering mechanism 190 is arranged on the mounting frame 110 and is located in the central area of ​​the crystal rod cutting area, and can directly chamfer the edges of the wafer 210 formed after cutting. Compared with the prior art, the crystal rod cutting machine 100 provided in the embodiment of the present invention simultaneously fixes multiple crystal rods 200 by setting multiple cutting stations 111, and uses multiple cutting guide mechanisms 170 to form multiple clamping roller angle structures for cutting, thereby simultaneously realizing the cutting of multiple crystal rods 200 and improving production efficiency. In addition, the cutting and chamfering process can be performed in the same device, realizing integrated cutting and chamfering.

[0066] Second embodiment

[0067] The basic structure, principle and technical effects of the ingot cutting machine 100 provided in the embodiment of the present invention are the same as those of the first embodiment. For the sake of brief description, for parts not mentioned in this embodiment, reference may be made to the corresponding contents in the first embodiment.

[0068] See also Figure 8 and Fig. 9 In this embodiment, the cutting station 111 corresponds to the inner side of the first end of the guide rail 172, and the two cutting rollers 175 and the corresponding cutting line guide rollers 171 on the outer side of the cutting station 111 are arranged to form a cutting triangle; when the cutting line guide rollers 171 are located at the first end of the guide rail 172, the crystal rod 200 on the cutting station 111 is located within the range of the cutting triangle; when the cutting line guide rollers 171 are located at the second end of the guide rail 172, the crystal rod 200 on the cutting station 111 is located outside the range of the cutting triangle.

[0069] Specifically, during the cutting process, the crystal rod 200 is first fixed on the cutting station 111, at which time the cutting line guide roller 171 is located at the first end of the guide rail 172, and the crystal rod 200 is located in the cutting triangle. After the crystal rod 200 is placed, it is cut, and the cutting line guide roller 171 moves from the first end to the second end of the guide rail 172, driving the cutting line 180 on one side to cut the crystal rod 200. When the cutting line guide roller 171 moves to the second end of the guide rail 172, the cutting line 180 completely passes over the crystal rod 200 to complete the cutting. At this time, the crystal rod 200 is located outside the area of ​​the cutting triangle. Due to the end-to-end drive method, the cutting coverage area in this embodiment is wider than that in the first embodiment, so the length of the guide rail 172 can be appropriately shortened to reduce the occupied space of the overall equipment.

[0070] Third embodiment

[0071] The basic structure, principle and technical effects of the ingot cutting machine 100 provided in the embodiment of the present invention are the same as those of the first embodiment. For the sake of brief description, for parts not mentioned in this embodiment, reference may be made to the corresponding contents in the first embodiment.

[0072] See also Fig.10 In this embodiment, the guide rail 172 is arc-shaped, the cutting drive member 174 includes a motor 1741 and a driving gear 1745, and a driving rack 1721 is also provided on the guide rail 172. The extension direction of the driving rack 1721 is the same as that of the guide rail 172. The motor 1741 is arranged on the sliding bearing block 173, and the driving gear 1745 is arranged on the output shaft of the motor 1741 and meshes with the driving rack 1721. The sliding bearing block 173 is used to make arc reciprocating motion along the guide rail 172 driven by the driving gear 1745. Specifically, the guide rail 172 is arc-shaped, which can make the distance between the cutting line guide roller 171 and the cutting roller 175 almost unchanged during the movement of the guide rail 172, so the tension of the cutting line 180 does not change much, and the subsequent buffer roller structure can be omitted. In addition, the mode of meshing the driving rack 1721 and the driving gear 1745 also makes the driving process more stable and reliable.

[0073] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the present invention should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A crystal rod cutting machine, It is characterized in that include: An installation frame (110), wherein a crystal rod cutting area is provided in the middle of the installation frame (110), and the crystal rod cutting area has a plurality of cutting stations (111) for fixing the ends of the crystal rods (200); a cutting and releasing mechanism (130), the cutting and releasing mechanism (130) being arranged on the mounting frame (110) and located at an edge of the crystal rod cutting area, and being used for cyclically outputting a cutting line (180) to the crystal rod cutting area; a cutting wire collection mechanism (150), the cutting wire collection mechanism (150) being arranged on the mounting frame (110) and located at an edge of the crystal rod cutting area, and being used to collect the cutting wire (180) in the crystal rod cutting area; a plurality of cutting guide mechanisms (170), the plurality of cutting guide mechanisms (170) being arranged on the mounting frame (110) and surrounding the crystal rod cutting area, and the plurality of cutting guide mechanisms (170) being arranged in one-to-one correspondence with the plurality of cutting stations (111), the cutting wire (180) being rolled and wound around the plurality of cutting guide mechanisms (170) in sequence, and forming a plurality of clamping roller angle structures respectively clamped on both sides of the plurality of crystal rods (200), the clamping roller angle structures being used to cut the corresponding crystal rod (200) under the drive of the corresponding cutting guide mechanism (170); Each cutting guide mechanism (170) comprises a cutting line guide roller (171), a guide rail (172), a sliding bearing block (173) and a cutting drive member (174); the guide rail (172) is fixedly arranged on the mounting frame (110) and mounted on the outer side of the corresponding cutting station (111); the sliding bearing block (173) is slidably arranged on the guide rail (172); the cutting line guide roller (171) is rotatably arranged on the sliding bearing block (173); the cutting line (180) is rolled and wound around the cutting line guide roller (171); the cutting drive member (174) is arranged on the guide rail (172) and is transmission-connected to the sliding bearing block (173) for driving the sliding bearing block (173) to slide back and forth along the guide rail (172); At least two cutting rollers (175) are also arranged on the inner side of each cutting station (111); the cutting rollers (175) are rotatably arranged on the mounting frame (110); the two cutting rollers (175) and the cutting line guide rollers (171) on the outer side of the corresponding cutting station (111) are arranged in a triangular shape; the cutting line (180) is wound around the inner side of the cutting rollers (175) and is wound around the outer side of the cutting line guide rollers (171); The cutting station (111) corresponds to the inner side of the middle part of the guide rail (172), and the two cutting rollers (175) and the corresponding cutting line guide rollers (171) on the outer side of the cutting station (111) are arranged to form a cutting triangle; when the cutting line guide rollers (171) are located in the middle part of the guide rail (172), the crystal rod (200) on the cutting station (111) is located within the range of the cutting triangle; when the cutting line guide rollers (171) are located at both ends of the guide rail (172), the crystal rod (200) on the cutting station (111) is located outside the range of the cutting triangle; or, The cutting station (111) corresponds to the inner side of the first end of the guide rail (172), and the two cutting rollers (175) and the corresponding cutting line guide rollers (171) on the outer side of the cutting station (111) are arranged to form a cutting triangle; when the cutting line guide rollers (171) are located at the first end of the guide rail (172), the crystal rod (200) on the cutting station (111) is located within the range of the cutting triangle; when the cutting line guide rollers (171) are located at the second end of the guide rail (172), the crystal rod (200) on the cutting station (111) is located outside the range of the cutting triangle.

2. The ingot cutting machine according to claim 1, It is characterized in that The guide rail (172) is in a straight line shape. The cutting drive member (174) comprises a motor (1741) and a driving screw (1743). The motor (1741) is fixedly arranged at one end of the guide rail (172). The driving screw (1743) is rotatably arranged in the guide rail (172) and is drivingly connected to the output shaft of the motor (1741). The sliding bearing block (173) is threadedly assembled on the driving screw (1743) and performs linear reciprocating motion under the drive of the driving screw (1743).

3. The ingot cutting machine according to claim 1, It is characterized in that The guide rail (172) is arc-shaped, the cutting drive member (174) comprises a motor (1741) and a driving gear (1745), a driving rack (1721) is also provided on the guide rail (172), the extension direction of the driving rack (1721) is the same as the extension direction of the guide rail (172), the motor (1741) is arranged on the sliding bearing block (173), the driving gear (1745) is arranged on the output shaft of the motor (1741) and meshes with the driving rack (1721), and the sliding bearing block (173) is used to make arc reciprocating motion along the guide rail (172) driven by the driving gear (1745).

4. The ingot cutting machine according to claim 1, It is characterized in that The cutting and paying-off mechanism (130) comprises a pay-off device (131), a line-inlet roller (132), a first driving roller (133) and a first buffer roller group (134); the pay-off device (131) is fixedly arranged on the mounting frame (110) and is used to pay out the cutting line (180); the first driving roller (133) is arranged on the line-out side of the pay-off device (131); the line-inlet roller (132) is arranged on a side of the first driving roller (133) away from the pay-off device (131); and the first buffer roller group (134) is movably arranged on the side of the first driving roller (133) away from the pay-off device (131). Between the first driving roller (133) and the wire-entry roller (132), the cutting wire (180) is rolled and wound around the wire-entry roller (132), the first buffer roller group (134) and the first driving roller (133) in sequence; the first driving roller (133) is used to drive the cutting wire (180) to move toward the wire-entry roller (132); the wire-entry roller (132) is used to convey the cutting wire (180) to a plurality of the cutting guide mechanisms (170); and the first buffer roller group (134) is used to adjust the tension of the cutting wire (180).

5. The ingot cutting machine according to claim 1, It is characterized in that The cutting and wire-retrieving mechanism (150) comprises a wire-retrieving device (151), a wire-retrieving roller (152), a second driving roller (153) and a second buffer roller group (154); the wire-retrieving device (151) is fixedly arranged on the mounting frame (110) and is used to retrieve the cutting wire (180); the second driving roller (153) is arranged on the wire-entry side of the wire-retrieving device (151); the wire-retrieving roller (152) is arranged on a side of the second driving roller (153) away from the wire-retrieving device (151); and the second buffer roller group (154) is movably arranged on the first side of the second driving roller (153). Between the two driving rollers (153) and the wire take-up roller (152), the cutting wire (180) is rolled and wound around the wire take-up roller (152), the second buffer roller group (154) and the second driving roller (153) in sequence; the second driving roller (153) is used to drive the cutting wire (180) to move toward the wire take-up device (151); the wire take-up roller (152) is used to retract the cutting wire (180) delivered by the plurality of cutting guide mechanisms (170); and the second buffer roller group (154) is used to adjust the tension of the cutting wire (180).

6. The ingot cutting machine according to claim 1, It is characterized in that The crystal rod cutting machine also includes a chamfering mechanism (190), the chamfering mechanism (190) including an auxiliary plug (191), a chamfering rod (193) and a driving roller (196), the auxiliary plug (191) being used to place the cut wafer (210), the driving roller (196) and the chamfering rod (193) being both arranged at the bottom of the auxiliary plug (191), the driving roller (196) being used to roll against the edge of the wafer (210) to drive the wafer (210) to rotate, and the chamfering rod (193) being provided with a chamfering groove (195) for chamfering the edge of the wafer (210).

Citation Information

Patent Citations

  • Wafer slicer and its wire supplying and receiving device and wafer slicing method

    CN108789893A

  • Multi-station squaring equipment and cutting method thereof

    CN111844490A

  • Silicon crystal bar slicing device for chip manufacturing

    CN113146869A

  • Sapphire crystal bar processing system and method

    CN114260811A

  • Wire saw cutting device capable of automatically threading and replacing wires and wire threading and replacing method

    CN114311087A