A large-current composite circuit board that is easy to assemble and its manufacturing process

Abstract

The present invention discloses an easily assembled high-current composite circuit board and its manufacturing process, which includes a bottom plate assembly. The bottom plate assembly is composed of a housing, an insulating board, a composite circuit board, and an insulating encapsulation layer from top to bottom in sequence. The composite circuit board is provided with insulating grooves and mounting holes for conducting electricity, and the housing and the insulating board are provided with through holes corresponding to the positions of the mounting holes. The structure of the present invention is simple. The bottom plate assembly made of the composite circuit board has a better load-bearing effect. And through riveting technology, conductive posts are riveted on the composite circuit board, and then conductive screws are used to screw and fix connecting wires to the upper ends of the conductive posts, so that electrical connection is formed between components and the composite circuit board. Adopting this structure can simplify the assembly process, improve the assembly efficiency, and can be tested immediately after riveting the conductive posts, which can effectively avoid the situation that the bottom plate assembly is found to be defective after assembling components, reduce the generation of defective products and the rework repair rate, ensure the qualified rate of finished products, and reduce the production cost of enterprises.

Description

Technical Field

[0001] The present invention relates to the technical field of electrical control equipment, and particularly to an easily assembled large-current composite circuit board and its manufacturing process. Background Art

[0002] In electrical control equipment in all walks of life, electrical control boxes are widely used, and are applicable to the field of low-voltage power distribution equipment involved in various large-scale production and manufacturing equipment, construction machinery devices, new energy-related equipment, high-speed trains, ships, buildings, and elevators.

[0003] Currently, in the production process of traditional electrical control boxes on the market, electrical components are manually installed and fixed in the electrical box, and then the electrical wiring and connection are carried out according to the electrical schematic diagram. The entire installation process is completed by workers manually routing and connecting the wires together. By assembling in this way, not only is the production efficiency low, but the labor intensity of workers is also continuously increasing. As the work progresses for a long time, wiring errors are likely to occur, leading to installation errors, resulting in high consumption of raw materials and increased worker costs. And because the wiring is carried out by using connecting wires, multiple wire bundles are formed inside, and the product volume is large and cannot be reduced.

[0004] Currently, some electrical components on the market use PCB boards to replace the traditional wiring method for connection, so that the electrical components and the PCB board are connected together by wires, reducing the wiring situation, and using soldering technology to solder the wires to the PCB board, which can reduce the wire bundles formed inside and reduce the volume. However, when assembling and producing by this method, when soldering the connection between the wire and the PCB board, the assistance of another person is required. One person positions and holds the electrical components in the front, and another person performs soldering processing on the back. Although the production and assembly efficiency can be increased through this structural method, the worker cost is high. And after the product is soldered, it needs to be tested. Once the test fails, disassembling and reassembling are very troublesome and easily cause material waste. And for large-current circuit boards, the soldering process is prone to poor soldering, resulting in insufficient connection stability and poor reliability.

[0005] Therefore, it is necessary to study a new technical solution to solve the above problems. Summary of the Invention

[0006] In view of this, in view of the deficiencies of the existing technology, the main object of the present invention is to provide an easily assembled large-current composite circuit board and its manufacturing process.

[0007] To achieve the above object, the present invention adopts the following technical solutions:

[0008] An easily assembled high-current composite circuit board, including a bottom plate assembly, the bottom plate assembly is successively composed of a housing, an insulating board, a composite circuit board and an insulating encapsulation layer from top to bottom, insulating grooves and mounting holes for conducting electricity are provided on the composite circuit board, and through holes corresponding to the positions of the mounting holes are provided on the housing and the insulating board.

[0009] As a preference, the composite circuit board is successively made by laminating and pressing a metal layer, an adhesive layer and a polymer material insulating layer, and the metal layer is formed with insulating grooves and mounting holes by means of milling and material removal processing.

[0010] As a preference, a sealing glue layer for isolation and protection is filled in the insulating grooves, and the sealing glue layer includes preformed sealing glue sheets made of insulating materials or is formed by flowing and filling with liquid insulating materials.

[0011] As a preference, the insulating board, the insulating encapsulation layer and the sealing glue layer are processed from epoxy resin materials; the polymer material insulating layer is made of epoxy resin, glass fiber board, bakelite board, silica gel board or plastic board.

[0012] As a preference, the metal layer is made of copper sheet, alloy copper sheet or alloy aluminum sheet, the material used for the adhesive layer is a prepreg, the thickness of the metal layer is 0.2 mm - 3 mm, the thickness of the polymer material insulating layer is 0.5 mm - 5 mm, and the total thickness of the composite circuit board is 0.9 mm - 8.2 mm.

[0013] As a preference, it further includes conductive posts, the conductive posts are composed of an upper end part and a lower end part, the diameter of the lower end part is smaller than that of the upper end part, the lower end part of the conductive post sequentially passes through the through holes of the housing and the insulating board and the mounting holes of the composite circuit board and is fixedly installed on the bottom plate assembly, and an internal threaded hole extending downward from top to bottom is provided on the upper end surface of the upper end part of the conductive post.

[0014] As a preference, the conductive posts are installed and fixed on the bottom plate assembly by riveting technology, so that the lower end parts of the conductive posts are riveted and fixed on the lower end surface of the composite circuit board.

[0015] As a preference, it further includes components and connecting wires, the components are installed and fixed on the bottom plate assembly, the connecting wires are arranged between the components and the conductive posts, one end of the connecting wire is connected and fixed to the components, and the other end is screwed and installed in the internal threaded hole of the conductive post through a conductive screw, so as to achieve a conduction state.

[0016] A manufacturing process of an easily assembled high-current composite circuit board

[0017] S1: Material preparation and lamination molding of the composite circuit board. Press the metal layer, adhesive layer, and polymer material insulating layer through a pressing device to form them into a single integrated board.

[0018] S2: Processing of the composite circuit board. Use a CNC milling machine to perform milling and material removal processing on the metal plate of the composite circuit board to process and form insulating grooves and mounting holes.

[0019] S3: Place a sealant layer in the insulating grooves on the composite circuit board. The sealant layer can be pre-fabricated or injected into the insulating grooves in a fluid manner.

[0020] S4: Use a laser device to cut the outer shell and process it into shape through sheet metal processing equipment.

[0021] S5: Print circuit markings and relevant data information on the formed outer shell.

[0022] S6: Install conductive posts. According to the pre-opened mounting holes, use a riveting machine to rivet the conductive posts onto the composite circuit board so that the lower ends of the conductive posts are riveted and fixed to the composite circuit board to form a conduction function.

[0023] S7: Assembly of the bottom plate assembly. Place the insulating board and the composite circuit board with riveted conductive posts into the outer shell in sequence for stacking and assembly. Then, a glue material for bonding and stabilizing is provided at the connection between the composite circuit board and the inner end face of the outer shell.

[0024] S8: Preliminary test and inspection. Conduct a power-on test on the bottom plate assembly with conductive posts installed to detect whether there are short circuits or other conditions.

[0025] S9: After the preliminary test is completed, brush glue on the riveting surface of the qualified bottom plate assembly for insulation protection.

[0026] S10: Install the components according to the pre-opened hole positions and keep a certain distance between adjacent components for heat dissipation.

[0027] S11: Install connecting wires. Connect one end of the connecting wire to the component and fix them together. Then, place the other end on the conductive post and use a conductive screw to pass through and screw it onto the conductive post to form a complete electrical conduction state.

[0028] S12: Final product test. Conduct a re-test on the assembled finished product to screen out defective products.

[0029] S13: Pack and box.

[0030] As an option, after the bottom plate assembly is made in S9, it can be immediately used for assembly or stored in a warehouse for future use.

[0031] The present invention has obvious advantages and beneficial effects compared with the prior art. Specifically, as can be seen from the above technical solutions:

[0032] The structure of the present invention is simple and convenient to use. The bottom plate assembly made of a composite circuit board has better load-bearing effect, and the conductive posts are riveted on the composite circuit board through riveting technology. Then, the connecting wires are screwed and fixed on the upper ends of the conductive posts through conductive screws, so that the components and the composite circuit board form an electrical connection. This structure can simplify the assembly process, improve the assembly efficiency, and has good safety and reliability. Moreover, after the conductive posts are riveted, testing can be carried out, which can effectively avoid the situation that the bottom plate assembly is found to be defective after assembling the components, reduce the generation of defective products and the rework repair rate, ensure the qualified rate of the finished products, and reduce the production cost of the enterprise.

[0033] 1. Using a composite circuit board to replace the previous PCB board enhances the load-bearing capacity of the bottom plate assembly, enabling it to bear the weight and current of more components. Slots and holes are made in the composite circuit board to achieve circuit conduction effect. Also, insulating materials are filled in the slots to play a role in isolation and protection, avoiding short-circuit situations. The bottom plate assembly is made of a four-layer structure, namely an outer shell, an insulating board, a composite circuit board, and an insulating encapsulation layer. By printing electrical symbols, component names, numbers and other information patterns on the upper end face of the outer shell, it is convenient for subsequent assembly, improves efficiency, and the bottom plate assembly can also be pre-assembled in advance. When needed, it is transported to the assembly workshop, reducing the overall assembly time and further improving the production and assembly efficiency.

[0034] 2. The conductive posts are made of copper material, which has good electrical conductivity and is fixed on the composite circuit board through riveting technology. An internal thread is provided at the upper inner end of the conductive post, enabling the connecting wire to be quickly screwed and fixed on the conductive post through a conductive screw with a locking function, thus forming a conduction effect and having good reliable stability.

[0035] 3. The components used are connected to the conductive posts by multiple connecting wires to achieve an electrical connection state, enabling the components to be quickly disassembled and assembled, improving the assembly efficiency, and also being able to achieve non-destructive disassembly and assembly, reducing the scrapping of parts.

[0036] 4. During the assembly process, multiple insulating layers are also used for protection, which can effectively protect the connection stability and safety of the internal composite circuit board and components, and has good effects of dust-proof, waterproof, moisture-proof, anti-corrosion, anti-aging and anti-vibration offset.

[0037] 5. The composite circuit board used is a purple copper board, an alloy copper board or an alloy aluminum board, all of which can withstand the operation of large currents, enabling the bottom plate assembly to have more selectivity and applicability and meeting the usage requirements and scenarios of different customers.

[0038] 6. Moreover, the total thickness of the selected composite circuit board is 0.9 mm - 8.2 mm, where the thickness of the metal layer is 0.2 mm - 3 mm and the thickness of the polymer material insulation layer is 0.5 mm - 5 mm. By using different thickness combinations, the usage requirements of different scenarios can be met. Brief Description of the Drawings

[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0040] Figure 1 It is a schematic diagram of the overall structure of the bottom component of the present invention.

[0041] Figure 2 It is a schematic top view structure diagram of the bottom plate assembly of the present invention.

[0042] Figure 3 It is a schematic partial cross-sectional structure diagram of the bottom plate assembly of the present invention.

[0043] Figure 4 It is a schematic top view structure diagram of the composite circuit board of the present invention.

[0044] Figure 5 It is a schematic exploded structure diagram of the composite circuit board of the present invention.

[0045] Figure 6 It is a schematic assembly structure diagram of the electrical components of the present invention.

[0046] Figure 7 It is a schematic exploded structure diagram of the electrical components of the present invention.

[0047] Among them, the reference numerals in the drawings are as follows:

[0048] 100, bottom plate assembly; 110, outer shell; 120, insulating board; 130, composite circuit board; 131, metal layer; 132, adhesive layer; 133, polymer material insulation layer; 134, insulating groove; 135, mounting hole; 136, sealant layer; 140, insulating encapsulation layer; 150, through hole; 200, conductive post; 210, upper end; 211, internal thread hole; 220, lower end; 300, component; 400, connecting wire. Detailed Embodiments

[0049] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application clearer and more understandable, the following further details this application in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not used to limit this application.

[0050] It should be noted that when an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0051] It should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to this application.

[0052] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of this application, "a plurality of" means two or more, unless otherwise specifically defined.

[0053] In order to make the purpose, technical solution and advantages of the present invention clearer and more understandable, the following further details the present invention in conjunction with the accompanying drawings and embodiments.

[0054] Refer to the attached Figures 1-3 As shown: An easily assembled large-current composite circuit board includes a bottom plate assembly 100. The bottom plate assembly 100 is successively composed of a housing 110, an insulating board 120, a composite circuit board 130, and an insulating encapsulation layer 140 from top to bottom. An insulating groove 134 and mounting holes 135 for conducting electricity are provided on the composite circuit board 130. Through holes 150 corresponding to the positions of the mounting holes 135 are provided on the housing 110 and the insulating board 120.

[0055] Refer to the attached Figures 4-5As shown: In this embodiment, the composite circuit board 130 is successively made by laminating and pressing a metal layer 131, an adhesive layer 132, and a polymer material insulating layer 133. The metal layer 131 is formed with an insulating groove 134 and a mounting hole 135 by milling and cutting, resulting in a thinning area and a usage area on the metal layer 131. The thinning area is the processed insulating groove 134.

[0056] Furthermore, the insulating groove 134 is filled with a sealing glue layer 136 for insulation protection. The sealing glue layer 136 includes a preformed sealing glue sheet made of an insulating material or is formed by flowing and filling a liquid insulating material. By prefabricating the sealing glue sheet in advance, the sealing glue sheet can be placed into the insulating groove 134 for insulation protection after the insulating groove 134 is processed. Or by pouring a liquid insulating material into the insulating groove 134, the insulating material is evenly filled into the insulating groove 134 to form the sealing glue layer 136 to achieve the effect of insulation protection.

[0057] In this embodiment, the insulating board 120, the insulating encapsulation layer 140, and the sealing glue layer 136 are made of epoxy resin material, having a good insulation protection effect; the polymer material insulating layer 133 is made of epoxy resin, fiberglass board, bakelite board, silica gel board, or plastic board, which can achieve the insulation effect of separating the upper and lower layers and prevent the two from conducting to cause short circuits and other situations.

[0058] In this embodiment, the metal layer 131 is made of red copper plate, alloy copper plate, or alloy aluminum plate. The material used for the adhesive layer 132 is a prepreg. The thickness of the metal layer 131 is 0.2 mm - 3 mm, the thickness of the polymer material insulating layer 133 is 0.5 mm - 5 mm, and the total thickness of the composite circuit board 130 is 0.9 mm - 8.2 mm.

[0059] Specifically, the composite circuit board 130 can select a board with a suitable thickness according to usage requirements. For example, for a thin and light composite circuit board 130, a 0.2 - mm - thick metal layer 131 and a 0.5 - mm - thick polymer material insulating layer 133 can be selected for assembly and use, so that the overall thickness of the composite circuit board 130 is 0.9 mm, which can be applied to products with limited space. Conventional - thickness composite circuit boards 130 can also be selected, such as a 1 - mm - thick metal layer 131 and a 2 - mm - thick polymer material insulating layer 133, so that the composite circuit board 130 can meet daily use. If components 300 that need to carry more and larger currents are required, a relatively thicker composite circuit board 130 can be selected for use, such as a 3 - mm - thick metal layer 131 and a 5 - mm - thick polymer material insulating layer 133, so that components 300 that can carry more, heavier, and larger currents can be used, and the insulation protection effect is correspondingly increased.

[0060] In this embodiment, it further includes a conductive post 200. The conductive post 200 is composed of an upper end portion 210 and a lower end portion 220. The diameter of the lower end portion 220 is smaller than that of the upper end portion 210. The lower end portion 220 of the conductive post 200 sequentially passes through the through hole 150 of the outer housing 110 and the insulating plate 120 and the mounting hole 135 of the composite circuit board 130 and is fixedly installed on the bottom plate assembly 100. An internal threaded hole 211 extending downward from top to bottom is provided on the upper end surface of the upper end portion 210 of the conductive post 200.

[0061] In this embodiment, the conductive post 200 is installed and fixed on the bottom plate assembly 100 through riveting technology, so that the lower end portion 220 of the conductive post 200 is fixedly riveted to the lower end surface of the composite circuit board 130.

[0062] Refer to the attached Figures 6-7 As shown in the figure: In this embodiment, it further includes a component 300 and a connecting wire 400. The component 300 is installed and fixed on the bottom plate assembly 100. The connecting wire 400 is arranged between the component 300 and the conductive post 200. One end of the connecting wire 400 is fixedly connected to the component 300, and the other end is screwed and installed in the internal threaded hole 211 of the conductive post 200 through a conductive screw, thereby achieving a conducting state.

[0063] Specifically, the components 300 used include electronic components 300 and electrical components 300, which are selected and used according to the usage requirements of different scenarios to meet the needs of different customers.

[0064] Furthermore, this product is suitable for installation and use in electrical boxes or electrical cabinets, replacing the traditional wiring mode, making assembly and use more convenient and fast, and being able to withstand a larger current.

[0065] A manufacturing process for an easily assembled large-current composite circuit board

[0066] S1: Material preparation. The metal layer 131, the adhesive layer 132, and the polymer material insulating layer 133 are subjected to a lamination process through a lamination device to form them into a single-piece composite circuit board 130.

[0067] S2: Processing of the composite circuit board 130. The metal plate of the composite circuit board 130 is subjected to milling and material removal processing through a CNC milling machine to process and form an insulating groove 134 and a mounting hole 135.

[0068] S3: The sealing glue layer 136 is placed in the insulating groove 134 of the composite circuit board 130. The sealing glue layer 136 can be pre-made or injected into the insulating groove 134 in a fluid manner.

[0069] S4: Use the outer shell 110 of the laser device for laser cutting to process a through hole 150 on the outer shell 110, and then process and form the outer shell 110 through sheet metal processing equipment;

[0070] S5: Print circuit markings and related data information on the upper end face of the formed outer shell 110;

[0071] S6: Install the conductive posts 200. According to the pre-drilled mounting holes 135, first rivet the conductive posts 200 to the composite circuit board 130 through a riveting machine, so that the lower end of the conductive post 200 is riveted and fixed to the composite circuit board 130 to form a conduction function;

[0072] S7: Assembly of the bottom plate assembly 100. Sequentially place the insulating board 120 and the composite circuit board 130 with the riveted conductive posts 200 into the outer shell 110 for stacking and assembly. Then, a glue material for bonding and stabilizing is provided at the connection between the composite circuit board 130 and the inner end face of the outer shell 110, so that when the two are placed into the outer shell 110, they can be firmly connected in the outer shell 110 through the glue material; Among them, the glue material includes glue made of an adhesive and adhesive tape with an adhesive;

[0073] S8: Preliminary test and inspection. Conduct a power-on test on the bottom plate assembly 100 equipped with the conductive posts 200 to detect whether there is a short circuit or other situations;

[0074] S9: After the initial test is completed, brush glue on the riveting surface of the qualified bottom plate assembly 100 to form an insulating encapsulation layer 140, which plays an insulating and protective role;

[0075] S10: Install the components 300 according to the pre-drilled hole positions, and keep a certain spacing between adjacent components 300 for heat dissipation;

[0076] S11: Install the connecting wires 400. Connect one end of the connecting wire 400 to the component 300 and fix them together. Then place the other end on the conductive post 200 and screw it to the conductive post 200 through a conductive screw to form a complete electrical conduction state;

[0077] S12: Final product test. Conduct a re-test on the assembled finished product to further screen out defective products and prevent defective products from flowing out;

[0078] S13: Pack and box.

[0079] In this embodiment, after the bottom plate assembly 100 is made in S9, it can be immediately used for assembly or stored in a warehouse for later use.

[0080] The above are only preferred embodiments of the present invention, and only specifically describe the technical principles of the present invention. These descriptions are only for explaining the principles of the present invention and cannot be interpreted as limiting the scope of protection of the present invention in any way. Based on the explanations here, any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention, and other specific implementations of the present invention that can be associated with by technicians in this field without creative labor, should be included in the scope of protection of the present invention.

Claims

1. A large-current composite circuit board that is easy to assemble, characterized in that: It includes a bottom plate assembly, which is composed of a housing, an insulating board, a composite circuit board, and an insulating encapsulation layer from top to bottom in sequence. Insulating grooves and mounting holes for conducting electricity are provided on the composite circuit board, and through holes corresponding to the positions of the mounting holes are provided on the housing and the insulating board; The composite circuit board is made by laminating and pressing a metal layer, an adhesive layer, and a polymer material insulating layer in sequence. The metal layer is formed with insulating grooves and mounting holes by milling and subtractive machining; The metal layer is made of a copper plate, an alloy copper plate, or an alloy aluminum plate. The material used for the adhesive layer is a prepreg. The thickness of the metal layer is 0.2 mm - 3 mm, the thickness of the polymer material insulating layer is 0.5 mm - 5 mm, and the total thickness of the composite circuit board is 0.9 mm - 8.2 mm; Circuit markings and relevant data information are printed on the formed housing; It also includes a conductive post, which is composed of an upper end part and a lower end part. The diameter of the lower end part is smaller than that of the upper end part. The lower end part of the conductive post passes through the through holes of the housing and the insulating board and the mounting hole of the composite circuit board in sequence and is fixedly installed on the bottom plate assembly. An internal threaded hole extending downward from top to bottom is provided on the upper end surface of the upper end part of the conductive post; As well as components and connecting wires. The components are installed on the bottom plate assembly. One end of the connecting wire is fixedly connected to the component, and the other end is screwed to the internal threaded hole of the conductive post through a conductive screw; The circuit board is applicable to an electrical box or an electrical cabinet.

2. The easily assembled high-current composite circuit board according to claim 1, wherein: The insulating grooves are filled with a sealing glue layer for isolation and protection. The sealing glue layer includes a preformed sealing glue sheet made of an insulating material or is formed by flowing and filling with a liquid insulating material.

3. The easy-to-assemble high-current composite circuit board according to claim 2, wherein: The insulating board, the insulating encapsulation layer, and the sealing glue layer are processed from epoxy resin materials; The polymer material insulating layer is made of epoxy resin, a glass fiber board, a bakelite board, a silica gel board, or a plastic board.

4. The easily assembled high-current composite circuit board according to claim 1, wherein: The conductive post is installed and fixed on the bottom plate assembly through riveting technology, so that the lower end part of the conductive post is riveted and fixed to the lower end surface of the composite circuit board.

5. The easily assembled high-current composite circuit board according to claim 1, wherein: It also includes components and connecting wires. The components are installed and fixed on the bottom plate assembly. The connecting wires are arranged between the components and the conductive posts. One end of the connecting wire is connected and fixed to the component, and the other end is screwed and installed in the internal threaded hole of the conductive post through a conductive screw, so as to achieve a conducting state.

6. A manufacturing process of an easily assembled high-current composite circuit board, including the easily assembled high-current composite circuit board according to any one of claims 1 - 5, characterized in that: S1: Material preparation, the composite circuit board is pressed and formed. The metal layer, the adhesive layer, and the polymer material insulating layer are pressed through a pressing device to form them into a whole board; S2: Processing of the composite circuit board. The metal plate of the composite circuit board is processed by milling and subtractive machining through a numerical control milling machine to form insulating grooves and mounting holes S3: A sealing glue layer is placed in the insulating grooves of the composite circuit board, and the sealing glue layer can be pre-made or injected into the insulating grooves in a fluid manner; S4: The housing of the laser device is cut by a laser, and it is processed and formed by sheet metal processing equipment; S5: Print circuit identification and relevant data information on the formed outer housing; S6: Install conductive posts. According to the pre-drilled installation holes, use a riveting machine to rivet the conductive posts on the composite circuit board, so that the lower ends of the conductive posts are riveted and fixed to the composite circuit board to form a conduction function; S7: Assembly of the bottom plate assembly. Place the insulating board and the composite circuit board with the conductive posts riveted in sequence into the outer housing for stacking and assembly. Then, at the connection between the composite circuit board and the inner end face of the outer housing, there is an adhesive material for bonding and stabilizing; S8: Preliminary test and inspection. Conduct a power-on test on the bottom plate assembly with conductive posts installed to detect whether there is a short circuit; S9: After the preliminary test is completed, brush glue on the riveting surface of the qualified bottom plate assembly for insulation protection; S10: Install the components according to the pre-drilled hole positions, and keep a certain distance between adjacent components for heat dissipation; S11: Install the connecting wires. Connect one end of the connecting wire to the component and fix them together. Then place the other end on the conductive post and screw it to the conductive post through a conductive screw to make them form a complete electrical conduction state; S12: Final product test. Conduct a re-test on the assembled finished product to screen out defective products; S13: Pack and box.

7. The manufacturing process of the easily assembled high-current composite circuit board according to claim 6, characterized in that: After the bottom plate assembly is made in S9, it can be immediately used for assembly or stored in the warehouse for future use.

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