Wafer cleaning device and cleaning equipment

Abstract

The present application relates to a wafer cleaning device and a cleaning equipment. The wafer cleaning device includes: the cleaning device includes a mounting plate, a connector mounted on the mounting plate, a supporting component, a diversion component, a driving component and a diversion component. The supporting component is used to support the wafer, and the diversion component is used to separately recover different cleaning liquids used to clean the wafer, so that different cleaning liquids can be independently diverted to avoid mixing between different cleaning liquids, and the purity and effectiveness of each cleaning liquid can be ensured; when cleaning different types of pollutants, different cleaning liquids can be used for targeted cleaning, and the cleaning liquids can be separately recovered, which is convenient for subsequent processing and reuse, reducing the cleaning cost and reducing pollution to the environment.

Description

Technical Field

[0001] The present application relates to a wafer cleaning device and cleaning equipment, belonging to the technical field of wafer processing. Background Art

[0002] In the field of semiconductor manufacturing, the surface quality of wafers plays a decisive role in the performance of semiconductor devices. During the production process, wafers will be contaminated with various pollutants, such as particles, organic matter, metal ions, etc., so they must be effectively cleaned.

[0003] At present, wafer cleaning mainly adopts wet cleaning, that is, using different chemical cleaning liquids to remove different pollutants on the surface of the wafer. However, there are some problems in the existing wafer cleaning devices when handling different cleaning liquids. On the one hand, when different cleaning liquids are mixed together, it will not only reduce the cleaning effect, but also increase the difficulty and cost of cleaning liquid recycling; on the other hand, when using different cleaning liquids for cleaning, the existing cleaning devices often cannot achieve precise control and independent recovery of the cleaning liquid, which easily causes waste of cleaning liquid and pollution to the environment.

[0004] Therefore, it is necessary to improve the prior art to overcome the above defects in the prior art. Summary of the invention

[0005] In view of this, an embodiment of the present application provides a wafer cleaning device to solve at least one problem existing in the background technology, including:

[0006] Mounting plate;

[0007] A connecting member is mounted on the mounting plate, comprising a hollow mounting portion, a docking portion arranged outside the mounting portion, and an edge portion arranged outside the docking portion, wherein a first annular guide groove is formed between the docking portion and the edge portion;

[0008] A supporting assembly, comprising a first driving member mounted on the mounting portion and a supporting plate connected above the first driving member, wherein the first driving member is capable of driving the supporting plate to rotate relative to the mounting plate;

[0009] The flow dividing component comprises a first flow dividing member arranged around the outer side of the supporting component and a second flow dividing member arranged around the outer side of the first flow dividing member; the first flow dividing member comprises a main body, a first wall extending upward from the main body and a second wall surrounding the outer side of the first wall, the second flow dividing member is at least partially inserted between the first wall and the second wall from top to bottom, a first space is formed between the first wall and the supporting component, the first space is connected with the first annular guide groove to form a first liquid channel, a second annular guide groove is formed between the first wall and the second wall, a second space is formed between the second flow dividing member and the first wall, the second space is connected with the second annular guide groove to form a second liquid channel; the first flow dividing member and the second flow dividing member can move in the height direction relative to the supporting plate under the action of external force, so that in the height direction, the supporting plate is located between the upper end and the lower end of the first flow dividing member or the supporting plate is located between the first flow dividing member and the second flow dividing member;

[0010] A driving assembly, comprising a second driving member connected to the first flow diverter and a third driving member connected to the second flow diverter, wherein the second driving member is capable of driving the first flow diverter to move in a height direction, and the third driving member is capable of driving the second flow diverter to move in a height direction;

[0011] The flow guide assembly includes a flow guide pipe and a fixed block. The first end of the flow guide pipe passes through the mounting plate and the edge portion in sequence and is connected to the second annular flow guide groove. The second end of the flow guide pipe is connected to the second driving member. The fixed block is sleeved on the outside of the flow guide pipe and is located between the flow guide pipe and the edge portion. A seal is also provided between the fixed block and the flow guide pipe.

[0012] Optionally, in the above-mentioned wafer cleaning device, the supporting plate comprises a connecting portion connected to the first driving member and a supporting portion connected to the connecting portion, and the supporting portion is used to support the wafer;

[0013] The cleaning device also includes an isolation sleeve, the upper end of which is sleeved on the outside of the connecting portion, and the lower end of which is connected to the docking portion to form a third space separated from the first space, and the first driving member is located in the third space.

[0014] Optionally, in the above-mentioned wafer cleaning device, the second diverter component includes a plug-in portion and a diverter portion, at least a portion of the plug-in portion is inserted between the first wall body and the second wall body, and the plug-in portion is arranged close to the second wall body, and the diverter portion is connected to the third driving component.

[0015] Optionally, in the above-mentioned wafer cleaning device, the main body includes a protruding opening protruding downward, and the protruding opening communicates with the second annular guide groove and the guide pipe;

[0016] The guide assembly also includes a connecting sleeve, which includes a fixing portion and a retaining portion extending inward along the inner wall of the fixing portion, the upper portion of the retaining portion abuts against the protruding opening, and the side portion of the retaining portion is clamped with the outer wall of the guide tube.

[0017] The present application also provides a wafer cleaning device, comprising at least a cleaning device as described in any one of the above.

[0018] Optionally, the above-mentioned wafer cleaning equipment further comprises a transfer device and a centering device arranged on one side of the cleaning device, the transfer device can take out the wafer in the wafer box and transfer it to the centering device, and the centering device can center the wafer.

[0019] Optionally, in the above-mentioned wafer cleaning equipment, the centering device includes a first driving cylinder arranged along the height direction and a lifting platform connected to the first driving cylinder, a second driving cylinder arranged in pairs on both sides of the first driving cylinder, two connecting rods respectively connected to the second driving cylinder, and a centering piece respectively connected to the two connecting rods, the two centering pieces are respectively located on both sides of the lifting platform, the lifting platform is used to support the wafer, and the second driving cylinder can drive the two centering pieces to approach the lifting platform so that the wafer coincides with the center of the lifting platform.

[0020] Optionally, the wafer cleaning device described above further comprises a baffle mounted on the mounting plate, wherein the baffle separates the transfer device from the cleaning device;

[0021] The baffle is provided with a conveying port, and the transfer device can convey the wafer to the cleaning device through the conveying port.

[0022] Optionally, the above-mentioned wafer cleaning equipment further comprises a liquid storage device arranged on one side of the cleaning device, and the liquid storage device is used to provide cleaning liquid to the cleaning device.

[0023] Optionally, in the above-mentioned wafer cleaning equipment, the liquid storage device includes an inner tank and an outer tank arranged outside the inner tank, the inner tank is used to contain the cleaning liquid, the outer tank is used to contain pure water, and a heating element is also arranged in the outer tank.

[0024] Compared with the prior art, the present application has the following beneficial effects: by providing a first diverter and a second diverter surrounding the outside of the first diverter, the first diverter includes a main body, a first wall extending upward from the main body, and a second wall surrounding the outside of the first wall, the second diverter is at least partially inserted from top to bottom between the first wall and the second wall, a first space is formed between the first wall and the supporting assembly, the first space is connected to the first annular guide groove to form a first liquid channel, a second annular guide groove is formed between the first wall and the second wall, a second space is formed between the second diverter and the first wall, the second space is connected to the second annular guide groove to form a second liquid channel, and the first diverter and the second diverter can move in the height direction relative to the supporting plate under the action of an external force, so that in the height direction , the support plate is located between the upper end and the lower end of the first diverter or the support plate is located between the first diverter and the second diverter, so that different cleaning liquids can be independently diverted to avoid mixing between different cleaning liquids, and the purity and effectiveness of each cleaning liquid can be ensured; when cleaning different types of pollutants, different cleaning liquids can be used for targeted cleaning, and the cleaning liquids can be recovered separately, which is convenient for subsequent treatment and reuse, reducing the cleaning cost and reducing the pollution to the environment; on the other hand, the first end of the guide tube is connected to the second annular guide groove, and the second end is connected to the second driving member, so that the guide tube can be used as an actuator to actuate the first diverter to move in the height direction, and its hollow setting can also be used as a waste discharge channel to discharge waste, realizing the integration of functions, on the one hand, saving the space of the device, avoiding the increase in the size and complexity of the device caused by the setting of multiple independent components. On the other hand, the number of parts is reduced, the manufacturing and maintenance costs are reduced, and at the same time, the process of actuating the first diverter is also simpler, reducing the risk of failure caused by complex actuation mechanisms. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is a top view of the wafer cleaning apparatus shown in the present application;

[0026] Figure 2 for Figure 1 A partial schematic diagram of a wafer cleaning device is shown;

[0027] Figure 3 for Figure 1 A schematic structural diagram of a centering device for a wafer cleaning device shown;

[0028] Figure 4 for Figure 1 A schematic structural diagram of a cleaning device of a wafer cleaning device shown;

[0029] Figure 5 for Figure 4A cross-sectional view of a wafer cleaning apparatus is shown;

[0030] Figure 6 for Figure 5 A partial enlarged view of a wafer cleaning device is shown;

[0031] Figure 7 for Figure 4 A cross-sectional view of the wafer cleaning device in another direction;

[0032] Figure 8 for Figure 1 The structural schematic diagram of the liquid storage device of the wafer cleaning equipment is shown.

[0033] Reference numerals:

[0034] 1-Transfer device;

[0035] 2-centering device, 21-first driving cylinder, 22-lifting platform, 23-second driving cylinder, 24-connecting rod, 25-centering piece;

[0036] 3-cleaning device, 31-mounting plate, 32-connecting member, 321-mounting portion, 322-docking portion, 323-edge portion, 324-first annular guide groove, 33-supporting assembly, 331-first driving member, 332-supporting plate, 3321-connecting portion, 3322-supporting portion, 34-diverter assembly, 341-first diverter, 3411-main body, 3412-first wall, 3413-second wall, 3414-first space, 3415-protruding opening, 342-second diverter, 3421-second annular guide groove, 3423-plug-in part, 3424-diverter part, 35-driving assembly, 351-second driving member, 352-third driving member, 36-flow guide assembly, 361-flow guide pipe, 362-fixing block, 363-connecting sleeve, 3631-fixing part, 3632-holding part, 364-sealing member, 37-cleaning assembly;

[0037] 4-liquid storage device, 41-inner tank, 42-outer tank;

[0038] 5- baffle, 51- delivery port;

[0039] 6-isolation set, 61-third space. DETAILED DESCRIPTION

[0040] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. It is to be understood that the specific embodiments described herein are only used to explain the present application, rather than to limit the present application. It should also be noted that, for ease of description, only some structures related to the present application are shown in the accompanying drawings, rather than all structures. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0041] The terms "including" and "having" and any variations thereof in this application are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products or devices.

[0042] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0043] See also Figure 1 As shown, a wafer cleaning device shown in a preferred embodiment of the present application is used for cleaning wafers. The cleaning device includes a transfer device 1, a centering device 2 arranged on one side of the transfer device 1, a cleaning device 3 and a liquid storage device 4. The transfer device 1 is used to transfer the wafer between the wafer box and the centering device 2 and between the centering device 2 and the cleaning device 3; the centering device 2 is used to center the wafer so that the wafer is in the correct position; the cleaning device 3 is used to clean the wafer with at least one cleaning liquid; and the liquid storage device 4 is used to store the cleaning liquid to provide it to the cleaning device 3.

[0044] It should be noted that since several wafers may present different inclination angles when placed in a wafer box, when the transfer device 1 transfers the wafers in the wafer box to the cleaning device 3, it may be impossible to accurately place the wafers in the cleaning device 3, resulting in the wafers being unable to be cleaned smoothly. Therefore, the wafers taken out of the wafer box need to be centered before being transferred to the cleaning device 3 for cleaning.

[0045] It is worth noting that in the present embodiment, two cleaning devices 3 and two liquid storage devices 4 are provided, which can improve the cleaning efficiency of the wafer and prevent the possibility of shutdown when a cleaning device 3 or a liquid storage device 4 fails.

[0046] In this embodiment, reference Figure 2 As shown, the cleaning device further includes a baffle 5 mounted on the mounting plate 31, and the baffle 5 separates the transfer device 1 from the cleaning device 3 to prevent the cleaning liquid on the cleaning device 3 from splashing onto the transfer device 1, causing waste of the cleaning liquid and damage to other components. It should be noted that a delivery port 51 is provided on the baffle 5, and the transfer device 1 can deliver the wafer to the cleaning device 3 through the delivery port 51.

[0047] Please refer to Figure 1 and Figure 3 As shown, the centering device 2 includes a first driving cylinder 21 arranged along the height direction and a lifting platform 22 connected to the first driving cylinder 21, a second driving cylinder 23 arranged in pairs on both sides of the first driving cylinder 21, two connecting rods 24 respectively connected to the second driving cylinder 23, and a centering piece 25 respectively connected to the two connecting rods 24, the two centering pieces 25 are respectively located on both sides of the lifting platform 22, the lifting platform 22 is used to support the wafer, and the second driving cylinder 23 can drive the two centering pieces 25 to approach the lifting platform 22 so that the wafer coincides with the center of the lifting platform 22. Specifically, the transfer device 1 takes out the wafer from the wafer box and transfers it to the lifting platform 22. The first driving cylinder 21 drives the lifting platform 22 to descend to the position corresponding to the centering piece 25. The second driving cylinder 23 drives the centering piece 25 to move toward the lifting platform 22 to achieve the centering of the wafer. Then the first driving cylinder 21 drives the lifting platform 22 to rise, and the transfer device 1 takes out the centered wafer and transfers it to the cleaning device 3. By providing a pair of second driving cylinders 23, connecting rods 24 and centering pieces 25, the wafer can be centered from both sides at the same time to ensure that the wafer and the center of the lifting platform 22 are accurately overlapped, providing an accurate position basis for subsequent processing and improving the accuracy and quality of wafer processing.

[0048] Please refer to Figure 4-Figure 7 As shown, the cleaning device 3 includes a mounting plate 31, a connecting member 32 mounted on the mounting plate 31, a supporting assembly 33, a flow dividing assembly 34, a driving assembly 35 and a flow guiding assembly 36. The supporting assembly 33 is used to support the wafer, and the flow dividing assembly 34 is used to separately recover different cleaning solutions used to clean the wafer.

[0049] Specifically, the connecting member 32 includes a hollow mounting portion 321, a docking portion 322 arranged outside the mounting portion 321, and an edge portion 323 arranged outside the docking portion 322, a first annular guide groove 324 is formed between the docking portion 322 and the edge portion 323, and the supporting assembly 33 is suitable for being installed on the mounting portion 321.

[0050] The supporting assembly 33 includes a first driving member 331 mounted on the mounting portion 321 and a supporting plate 332 connected above the first driving member 331 . The supporting plate 332 is used to support the wafer. The first driving member 331 can drive the supporting plate 332 to rotate relative to the mounting plate 31 .

[0051] The cleaning device 3 also includes a cleaning component 37 arranged on the supporting component 33, and the cleaning component 37 is suitable for providing cleaning liquid to the wafers on the supporting plate 332. The first driving member 331 drives the supporting plate 332 to rotate to generate centrifugal force, thereby throwing out the cleaning liquid for cleaning the wafers.

[0052] The flow dividing component 34 includes a first flow dividing member 341 disposed around the outside of the supporting component 33 and a second flow dividing member 342 disposed around the outside of the first flow dividing member 341. Specifically, the first flow dividing member 341 includes a main body 3411, a first wall 3412 extending upward from the main body 3411, and a second wall 3413 surrounding the outside of the first wall 3412, the second flow dividing member 342 is at least partially inserted from top to bottom between the first wall 3412 and the second wall 3413, a first space 3414 is formed between the first wall 3412 and the supporting component 33, and the first space 3414 is connected to the first annular guide groove 324 to form a first liquid channel. A second annular guide groove 3421 is formed between the first wall body 3412 and the second wall body 3413, a second space is formed between the second diverter 342 and the first wall body 3412, and the second space is connected to the second annular guide groove 3421 to form a second liquid channel, so that different cleaning liquids can flow out from the first liquid channel and the second liquid channel respectively, and are independently guided to avoid mixing between different cleaning liquids, thereby ensuring the purity and effectiveness of each cleaning liquid. When cleaning different types of pollutants, different cleaning liquids can be used for targeted cleaning, and the cleaning liquids can be separately recovered for easy subsequent processing and reuse, thereby reducing cleaning costs and reducing pollution to the environment.

[0053] Specifically, the second flow diverter 342 includes a plug-in portion 3423 and a diverter portion 3424, at least part of the plug-in portion 3423 is inserted between the first wall 3412 and the second wall 3413, and the plug-in portion 3423 is arranged close to the second wall 3413, and the diverter portion 3424 is connected to the second driving member 352. The purpose of such arrangement is that when only the second liquid channel is required to work, even if the second flow diverter 342 is driven to rise, the plug-in portion 3423 of the second flow diverter 342 at least partially overlaps with the second wall 3413 in the horizontal direction, so that the cleaning liquid passing through the second liquid channel will not splash out.

[0054] In this embodiment, the driving component 35 includes a second driving member 351 connected to the first diverter member 341 and a second driving member 352 connected to the second diverter member 342. The second driving member 351 can drive the first diverter member 341 to move in the height direction, and the second driving member 352 can drive the second diverter member 342 to move in the height direction, so that in the height direction, the supporting plate 332 is located between the upper end and the lower end of the first diverter member 341 or the supporting plate 332 is located between the first diverter member 341 and the second diverter member 342, so that the cleaning liquid can flow out from the first liquid channel or the second liquid channel.

[0055] In this embodiment, the supporting plate 332 includes a connecting portion 3321 connected to the first driving member 331 and a supporting portion 3322 connected to the connecting portion 3321, and the supporting portion 3322 is used to support the wafer; the cleaning device 3 also includes an isolation sleeve 6, the upper end of the isolation sleeve 6 is sleeved on the outside of the connecting portion 3321, and the lower end of the isolation sleeve 6 is connected to the docking portion 322 to form a third space 61 separated from the first space 3414, and the first driving member 331 is located in the third space 61 to prevent the cleaning liquid from splashing onto the first driving member 331.

[0056] As described above, the flow guide assembly 36 includes a flow guide pipe 361 and a fixing block 362. The first end of the flow guide pipe 361 passes through the mounting plate 31 and the edge portion 323 in sequence to communicate with the second annular flow guide groove 3421, and the second end of the flow guide pipe 361 is connected to the second driving member 351. The flow guide pipe 361 is used as both an actuator and a waste discharge channel to achieve functional integration. On the one hand, it saves space for the device and avoids the increase in device volume and complex structure caused by the provision of multiple independent components; on the other hand, it reduces the number of parts and components, and reduces manufacturing and maintenance costs; and the dual functions of the flow guide pipe 361 make the layout of the entire device more reasonable, and in a limited space, it can better coordinate the positions and functions of various components to improve the overall performance of the device.

[0057] Specifically, the main body 3411 includes a protruding opening 3415 protruding downward, and the protruding opening 3415 connects the second annular guide groove 3421 and the guide pipe 361; the guide assembly 36 also includes a connecting sleeve 363, the connecting sleeve 363 includes a fixing portion 3631 and a retaining portion 3632 extending inward along the inner wall of the fixing portion 3631, the upper portion of the retaining portion 3632 is abutted against the protruding opening 3415, and the side of the retaining portion 3632 is clamped against the outer wall of the guide pipe 361, so that the connection between the guide pipe 361 and the protruding opening 3415 is stable, and the cleaning liquid is prevented from overflowing at the connection.

[0058] More specifically, the fixing block 362 is sleeved on the outside of the guide tube 361 and is located between the guide tube 361 and the edge portion 323. A sealing member 364 is also provided between the fixing block 362 and the guide tube 361 to further ensure sealing and prevent the cleaning liquid from flowing out.

[0059] Please refer to Figure 8 The liquid storage device 4 includes an inner tank 41 and an outer tank 42 arranged outside the inner tank 41. The inner tank 41 is used to hold the cleaning liquid, and the outer tank 42 is used to hold pure water. A heating element is also arranged in the outer tank 42 to heat the pure water through the heating element, thereby heating the cleaning liquid in the inner tank 41. This heating method, on the one hand, can provide a stable and uniform heating environment for the cleaning liquid in the inner tank 41, and can accurately control the temperature of the cleaning liquid to avoid damage to the wafer caused by local overheating or uneven temperature, while ensuring that the cleaning liquid exerts the best cleaning effect at an appropriate temperature; on the other hand, since the heating element does not directly contact the cleaning liquid, the risk of accidents caused by heating element failure to the cleaning liquid is reduced, thereby improving the safety and reliability of the device.

[0060] The above is only a specific implementation of the present application, and any other improvements made based on the concept of the present application are deemed to be within the protection scope of the present application.

Claims

1. A wafer cleaning device, characterized in that: include: Mounting plate; a connecting member, mounted on the mounting plate, comprising a hollow mounting portion, a docking portion disposed outside the mounting portion, and an edge portion disposed outside the docking portion, wherein a first annular guide groove is formed between the docking portion and the edge portion; a supporting assembly comprising a first driving member mounted on the mounting portion and a supporting plate connected above the first driving member, wherein the first driving member is capable of driving the supporting plate to rotate relative to the mounting plate; The flow dividing assembly comprises a first flow dividing member disposed around the outside of the supporting assembly and a second flow dividing member disposed around the outside of the first flow dividing member; The first flow diverter includes a main body, a first wall extending upward from the main body, and a second wall surrounding the outside of the first wall. The second flow diverter is at least partially inserted between the first wall and the second wall from top to bottom. A first space is formed between the first wall and the supporting assembly. The first space is connected to the first annular guide groove to form a first liquid channel. A second annular guide groove is formed between the first wall and the second wall. A second space is formed between the second flow diverter and the first wall. The second space is connected to the second annular guide groove to form a second liquid channel. The first flow divider and the second flow divider can be moved relative to the support plate in a height direction under the action of an external force, so that in the height direction, the support plate is located between the upper end and the lower end of the first flow divider or the support plate is located between the first flow divider and the second flow divider; a driving assembly comprising a second driving member connected to the first diverter member and a third driving member connected to the second diverter member, wherein the second driving member is capable of driving the first diverter member to move in a height direction, and the third driving member is capable of driving the second diverter member to move in a height direction; The guide assembly includes a guide pipe and a fixed block. The first end of the guide pipe passes through the mounting plate and the edge portion in sequence and is connected to the second annular guide groove. The second end of the guide pipe is connected to the second driving member. The fixed block is sleeved on the outside of the guide pipe and is located between the guide pipe and the edge portion. A seal is also provided between the fixed block and the guide pipe.

2. The wafer cleaning device according to claim 1, wherein: The supporting plate includes a connecting portion connected to the first driving member and a supporting portion connected to the connecting portion, wherein the supporting portion is used to support the wafer; The cleaning device also includes an isolation sleeve, the upper end of which is sleeved on the outside of the connecting portion, and the lower end of which is connected to the docking portion to form a third space separated from the first space, and the first driving member is located in the third space.

3. The wafer cleaning device according to claim 1, wherein: The second diverter includes a plug-in portion and a diverter portion. At least a portion of the plug-in portion is inserted between the first wall and the second wall. The plug-in portion is arranged close to the second wall. The diverter portion is connected to the third driving member.

4. The wafer cleaning device according to claim 1, wherein: The main body includes a protruding opening protruding downward, and the protruding opening is connected to the second annular guide groove and the guide pipe; The guide assembly also includes a connecting sleeve, which includes a fixing portion and a retaining portion extending inward along the inner wall of the fixing portion. The upper portion of the retaining portion abuts against the protruding opening, and the side portion of the retaining portion is clamped with the outer wall of the guide tube.

5. A wafer cleaning device, characterized in that: At least comprising the cleaning device according to any one of claims 1-4.

6. The wafer cleaning equipment according to claim 5, characterized in that: The cleaning equipment further includes a transfer device and a centering device arranged on one side of the cleaning device. The transfer device can take out the wafers in the wafer box and transfer them to the centering device, and the centering device can center the wafers.

7. The wafer cleaning equipment according to claim 6, characterized in that: The centering device includes a first driving cylinder arranged along the height direction and a lifting platform connected to the first driving cylinder, a second driving cylinder arranged in pairs on both sides of the first driving cylinder, two connecting rods respectively connected to the second driving cylinder, and a centering piece respectively connected to the two connecting rods. The two centering pieces are respectively located on both sides of the lifting platform. The lifting platform is used to support the wafer. The second driving cylinder can drive the two centering pieces toward the lifting platform so that the wafer coincides with the center of the lifting platform.

8. The wafer cleaning equipment according to claim 6, characterized in that: The cleaning device further comprises a baffle mounted on the mounting plate, the baffle separating the transfer device from the cleaning device; The baffle is provided with a conveying port, and the transfer device can convey the wafer to the cleaning device through the conveying port.

9. The wafer cleaning equipment according to claim 5, characterized in that: The wafer cleaning equipment further includes a liquid storage device disposed on one side of the cleaning device, and the liquid storage device is used to provide cleaning liquid to the cleaning device.

10. The wafer cleaning equipment according to claim 9, characterized in that: The liquid storage device includes an inner tank and an outer tank arranged outside the inner tank. The inner tank is used to accommodate cleaning liquid, and the outer tank is used to accommodate pure water. A heating element is also arranged in the outer tank.

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