Electroplating device and electroplating method

Abstract

The present application discloses an electroplating device and an electroplating method, which relate to the field of electroplating technology. The electroplating device includes an electroplating tank, in which an electroplating solution is provided, and the electroplating solution includes metal salts and graphene; an anode and a cathode, which are located in the electroplating solution and are arranged relatively along a first direction; and a first coil, which is located in the electroplating solution. When the first coil is energized, the direction of the first magnetic field generated is parallel to the first direction. The electroplating device provided by the present application can realize local stirring of the electroplating solution near the graphene, promote the uniform distribution of the graphene in the electroplating solution, and improve the dispersion stability of the graphene in the electroplating solution; the first coil is widely adaptable and applicable to electroplating solutions of various metal salts, and has high adaptability; and the first coil has a simple structure, simple chemical composition, low cost, and can be used repeatedly, which is conducive to reducing costs and increasing efficiency.

Description

Technical Field

[0001] The present application relates to the field of electroplating technology, and in particular to an electroplating device and an electroplating method. Background Art

[0002] Graphene is a sp 2 Two-dimensional nanomaterials with hybrid-connected single carbon atomic layers have excellent properties such as high conductivity, high thermal conductivity, high strength, high flexibility, strong chemical inertness, and excellent gas barrier properties. They show great application potential in electrical conductivity, thermal conductivity, anti-static, anti-corrosion coatings, and metal current collector materials.

[0003] Electroplating is a technical means of combining graphene with metal. Due to the strong π-π bond between graphene, it is easy to agglomerate, resulting in poor uniform dispersion of graphene in the plating solution system, which seriously affects the application of graphene in the coating. In order to improve the uniform dispersion of graphene in the liquid solution, a dispersant is usually introduced to disperse the graphene particles so that it can be evenly dispersed to achieve a smooth electrodeposition process.

[0004] However, the applicability of dispersants varies significantly under different electroplating systems, and the precise screening of their compatibility has become a major bottleneck in the research and development process. In addition, the introduction of dispersants not only increases the resistance to metal ion migration in the plating solution, but may also lead to uneven distribution of metal ions and graphene concentrations on the surface of the coating and in the vicinity, thereby affecting the uniform dispersion of graphene in the coating, and even changing the grain morphology formed by the reduction of metal ions during the electroplating process, affecting the performance of the final coating. Summary of the invention

[0005] In view of this, the present application provides an electroplating device and an electroplating method.

[0006] The embodiment of the present application is implemented as follows. In a first aspect, the embodiment of the present application provides an electroplating device, comprising:

[0007] An electroplating tank, wherein an electroplating solution is provided in the electroplating tank, and the electroplating solution includes a metal salt and graphene;

[0008] an anode and a cathode, the anode and the cathode being located in the electroplating solution and arranged opposite to each other along a first direction; and

[0009] A first coil is located in the electroplating solution. When the first coil is powered on, the direction of the generated first magnetic field is parallel to the first direction.

[0010] Optionally, in some embodiments of the present application, the metal salt includes one or more of copper salt, nickel salt, silver salt, tin salt, palladium salt, and chromium salt; and / or

[0011] In the electroplating solution, the mass concentration of the metal salt is 5g / L to 380g / L; and / or

[0012] In the electroplating solution, the mass concentration of the graphene is 0.5 g / L to 1.5 g / L.

[0013] Optionally, in some embodiments of the present application, the first coil is wound and extended along the first direction; and / or

[0014] The first coil is located on a side of the anode away from the cathode; and / or

[0015] The first coil is located between the anode and the cathode; and / or

[0016] The distance between the first coil and the anode is smaller than the distance between the first coil and the cathode.

[0017] Optionally, in some embodiments of the present application, the electroplating device further includes a second power supply, and the first coil is connected to the second power supply; wherein,

[0018] The voltage output by the second power supply is a constant voltage, and the constant voltage is 180V~260V; and / or

[0019] The intensity of the first magnetic field is 2T~4T.

[0020] Optionally, in some embodiments of the present application, the electroplating device further includes a second coil, the second coil is located in the electroplating solution, and when the second coil is energized, the direction of the generated second magnetic field is parallel to the first direction.

[0021] Optionally, in some embodiments of the present application, the second coil is wound and extended along the first direction; and / or

[0022] The second coil is located between the anode and the cathode; and / or

[0023] The distance between the second coil and the cathode is smaller than the distance between the second coil and the anode; and / or

[0024] The distance between the first coil and the bottom of the electroplating tank is the same as the distance between the second coil and the bottom of the electroplating tank.

[0025] Optionally, in some embodiments of the present application, the electroplating device further includes a third power supply, and the second coil is connected to the third power supply; wherein,

[0026] The voltage output by the third power supply is a first pulse voltage, the first pulse voltage is 250V~260V, and the frequency of the first pulse voltage is 2Hz~4Hz; the first pulse voltage is a first cycle intermittent pulse voltage, the single operation time of the first cycle intermittent pulse voltage is 6s~8s, and the interval time between two adjacent operations is 2s~3s; and / or

[0027] The intensity of the second magnetic field is less than that of the first magnetic field; the intensity of the second magnetic field is 0.2T~0.3T.

[0028] Optionally, in some embodiments of the present application, the electroplating device further comprises a third coil, wherein the third coil is located on a side of the cathode close to the bottom of the electroplating tank, and a third magnetic field generated when the third coil is energized at least partially covers the cathode.

[0029] Optionally, in some embodiments of the present application, the electroplating device further includes a fourth power supply, and the third coil is connected to the fourth power supply; wherein,

[0030] The voltage output by the fourth power supply is a second pulse voltage, the second pulse voltage is 220V~240VV, and the frequency of the second pulse voltage is 3Hz~5Hz; the second pulse voltage is a second cycle intermittent pulse voltage, the single operation time of the second cycle intermittent pulse voltage is 2s~3s, and the interval time between two adjacent operations is 6s~8s; and / or

[0031] When the third coil is powered on, the intensity of the generated third magnetic field is less than the intensity of the first magnetic field; the intensity of the third magnetic field is 0.4T~0.5T; and / or

[0032] The third coil is wound and extends along a second direction, and the second direction is perpendicular to the first direction; and / or

[0033] When the third coil is energized, the direction of the generated third magnetic field is parallel to the second direction, and the second direction is perpendicular to the first direction.

[0034] In a second aspect, an embodiment of the present application further provides an electroplating method, which is performed using any of the electroplating devices described above, and comprises the following steps:

[0035] Providing an electroplating solution, wherein the electroplating solution includes a metal salt and graphene, and placing the electroplating solution in an electroplating tank;

[0036] Providing a workpiece to be plated and a first coil, using the workpiece to be plated as a cathode and an anode, immersing the first coil in the electroplating solution, and the anode and the cathode are arranged opposite to each other along a first direction;

[0037] The anode and the cathode are energized, and the first coil is energized to form a plating layer on the surface of the workpiece to be plated.

[0038] Optionally, in some embodiments of the present application, the electroplating method further includes: providing a second coil, immersing the second coil in the electroplating solution; when the anode and the cathode are energized, the method further includes: energizing the second coil, and when the second coil is energized, the direction of the second magnetic field generated is parallel to the first direction; and / or

[0039] The electroplating method also includes: providing a third coil, and arranging the third coil on the side of the cathode close to the bottom of the electroplating tank; when the anode and the cathode are energized, it also includes: energizing the third coil, and the third magnetic field generated by energizing the third coil at least partially covers the cathode.

[0040] Optionally, in some embodiments of the present application, energizing the second coil includes intermittently energizing the second coil; and / or

[0041] The energizing the third coil comprises intermittently energizing the third coil; and / or

[0042] The second coil and the third coil are not energized at the same time.

[0043] The electroplating device provided in the present application has a first coil arranged between the anode and the wall of the electroplating tank, and the first coil is wound and extended along a first direction from the anode to the cathode. The first coil can generate a first magnetic field roughly parallel to the first direction when energized. During the electroplating process, the flow of current in the plating solution relies on ion transfer. When ions encounter obstacles such as graphene during movement, the local direction of ion movement changes, generating a current that is not parallel to the original current direction. New magnetic flux lines are generated under the action of the first magnetic field, and eddy currents are generated near the graphene obstacle under the action of the Lorentz force, thereby achieving local stirring of the plating solution near the graphene. Stirring can not only disperse the graphene, but also promote the uniform distribution of the graphene in the plating solution, thereby improving the dispersion stability of the graphene in the plating solution.

[0044] The electroplating device provided in the present application has a first coil with wide adaptability and is applicable to electroplating solutions of various metal salts, with high adaptability; the first coil has a simple structure and a simple chemical composition and will not affect the components in the electroplating solution; in addition, the first coil has a low cost and can be used repeatedly, which is conducive to reducing costs and increasing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0046] Figure 1 is a structural schematic diagram of an electroplating device provided in an embodiment of the present application;

[0047] Figure 2 It is a flow chart of an electroplating method provided in an embodiment of the present application.

[0048] Description of reference numerals:

[0049] 100 - electroplating device; 10 - electroplating tank; 20 - electroplating solution; 30 - anode; 40 - cathode; 50 - first power supply; 60 - first coil; 61 - second power supply; 70 - second coil; 71 - third power supply; 80 - third coil; 81 - fourth power supply. DETAILED DESCRIPTION

[0050] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application, and are not used to limit the present application.

[0051] In this application, unless otherwise stated, directional words such as "upper" and "lower" generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the accompanying drawings; while "inner" and "outer" refer to the outline of the device. In addition, in the description of this application, the term "including" means "including but not limited to". The terms first, second, third, etc. are used only as labels and do not impose numerical requirements or establish an order.

[0052] In this application, "and / or" describes the association relationship of associated objects, indicating that there may be three relationships. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. A and B can be singular or plural.

[0053] In this application, "at least one" means one or more, and "plurality" means two or more. "One or several", "at least one of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, "at least one of a, b, or c", or "at least one of a, b, and c" can all mean: a, b, c, ab (i.e., a and b), ac, bc, or abc, where a, b, and c can be single or multiple.

[0054] Various embodiments of the present application may be presented in the form of a range; it should be understood that the description in the form of a range is only for convenience and brevity, and should not be understood as a rigid limitation on the scope of the present application; therefore, the range description should be considered to have specifically disclosed all possible sub-ranges and single numerical values ​​within the range. For example, the range description from 1 to 6 should be considered to have specifically disclosed sub-ranges, such as from 1 to 3, from 1 to 4, from 1 to 5, from 2 to 4, from 2 to 6, from 3 to 6, etc., as well as single numbers within the range, such as 1, 2, 3, 4, 5 and 6, which apply regardless of the range. In addition, whenever a numerical range is indicated herein, it is meant to include any cited number (fractional or integer) within the indicated range.

[0055] The technical solution of this application is as follows:

[0056] First, see Figure 1 The present application embodiment provides an electroplating device 100, comprising:

[0057] An electroplating tank 10, wherein an electroplating solution 20 is disposed in the electroplating tank 10, and the electroplating solution 20 includes a metal salt and graphene;

[0058] an anode 30 and a cathode 40, wherein the anode 30 and the cathode 40 are located in the electroplating solution 20 and are arranged opposite to each other along a first direction; and

[0059] The first coil 60 is located in the electroplating solution 20 . When the first coil 60 is powered on, the direction of the generated first magnetic field is parallel to the first direction.

[0060] It should be noted that the anode 30 and the cathode 40 are arranged relative to each other along a first direction. In other words, when the anode 30 and the cathode 40 are energized, the direction of the current from the anode 30 to the cathode 40 in the electroplating solution 20 is the first direction.

[0061] It should also be noted that electroplating is a process that uses electrolysis to attach a metal film to the surface of a metal or other material part, thereby preventing metal oxidation, improving wear resistance, conductivity, reflectivity, corrosion resistance, and enhancing aesthetics. During the electroplating process, the cathode 40 is the part to be plated, and the metal ions in the metal salt flow to the cathode 40 under the action of the current, and a reduction reaction occurs on the cathode 40, thereby forming a coating on the part to be plated.

[0062] The electroplating device 100 provided in the present application is provided with a first coil 60 between the anode 30 and the wall of the electroplating tank 10, and the first coil 60 is wound and extended along the first direction from the anode 30 to the cathode 40. The first coil 60 can generate a first magnetic field substantially parallel to the first direction when energized. During the electroplating process, the flow of current in the electroplating solution 20 relies on ion transfer. When ions encounter obstacles such as graphene during movement, the local direction of ion movement changes, generating a current that is not parallel to the original current direction. New magnetic flux lines are generated under the action of the first magnetic field, and eddy currents are generated near the graphene obstacle under the action of the Lorentz force, thereby achieving local stirring of the electroplating solution 20 near the graphene. Stirring can not only disperse the graphene, but also promote the uniform distribution of the graphene in the electroplating solution 20, thereby improving the dispersion stability of the graphene in the electroplating solution 20.

[0063] The electroplating device 100 provided in the present application is provided with a first coil 60 which has wide adaptability and is applicable to electroplating solutions 20 of various metal salts, and has high adaptability; and the first coil 60 has a simple structure and a simple chemical composition, and will not affect the components in the electroplating solution 20; in addition, the first coil 60 has a low cost and can be used repeatedly, which is beneficial to reducing costs and increasing efficiency.

[0064] It can be understood that the electroplating solution 20 can be used for electroplating metals. The electroplating solution 20 contains graphene, which can improve the electrical conductivity, thermal conductivity and other properties of the coating.

[0065] In some embodiments, the metal salt includes one or more of copper salt, nickel salt, silver salt, tin salt, palladium salt, and chromium salt.

[0066] Exemplarily, the copper salt includes one or more of copper sulfate, copper chloride, and copper aminosulfate.

[0067] The nickel salt includes one or more of nickel sulfate, nickel chloride and nickel nitrate.

[0068] The silver salt includes one or more of silver nitrate, silver chloride, and aminosilver nitrate.

[0069] The tin salt includes one or more of tin chloride, tin sulfate, and tin aminosulfate.

[0070] The palladium salt includes one or more of palladium chloride, palladium sulfate, palladium nitrate, and palladium acetate.

[0071] The chromium salt includes one or more of sodium chromate and chromic anhydride.

[0072] In some embodiments, in the electroplating solution 20, the mass concentration of the metal salt is 5 g / L to 380 g / L, for example, 10 g / L, 50 g / L, 100 g / L, 150 g / L, 200 g / L, 250 g / L, 300 g / L, 350 g / L, or a range between any two values, etc. Within the mass concentration range, the metal salt is facilitated to be dispersed and dissolved.

[0073] In some embodiments, in the electroplating solution 20, the mass concentration of the graphene is 0.5 g / L to 1.5 g / L, for example, 0.6 g / L, 0.8 g / L, 0.9 g / L, 1 g / L, 1.2 g / L, or a range between any two values, etc. Within the mass concentration range, the graphene is dispersed and dissolved.

[0074] It is understandable that other substances known in the art may be added to the electroplating solution 20 according to actual needs, such as buffers, complexing agents, brighteners, leveling agents, displacement agents, softeners, degreasing agents, stabilizers, wetting agents, etc.

[0075] Specifically, when nickel is electroplated, the electroplating solution 20 may include 12 g / L to 20 g / L nickel chloride, 340 g / L to 380 g / L nickel sulfamate, 20 g / L to 45 g / L boric acid, and 10 g / L to 30 g / L phosphomolybdic acid.

[0076] When silver is electroplated, the electroplating solution 20 may include 5 g / L to 10 g / L of nitrate and 120 g / L to 210 g / L of potassium cyanide.

[0077] When electroplating copper-tin alloy, the electroplating solution 20 may include 22 g / L to 25 g / L of cuprous cyanide, 0.5 g / L to 1.5 g / L of stannous chloride, 5 g / L to 10 g / L of sodium cyanide, 5 g / L to 10 g / L of sodium hydroxide and 0.8 g / L to 1.5 g / L of gelatin.

[0078] In some embodiments, the electroplating device 100 further includes a first power source 50 , and the anode 30 and the cathode 40 are connected to the positive electrode and the negative electrode of the first power source 50 , respectively.

[0079] It is understood that the anode 30 may be made of materials known in the art, and should have stable electrochemical properties in the electrolyte and not be prone to self-dissolution or other chemical reactions.

[0080] In some embodiments, the anode 30 and the cathode 40 are surface-treated anodes 30 and cathodes 40 .

[0081] Furthermore, the surface treatment includes cleaning, roughening, etc. Cleaning can be performed by alkaline cleaning, acid cleaning, alcohol cleaning or ultrasonic cleaning to remove impurities such as grease and dust on the surface, and roughening can produce a micro-concave and convex microstructure on the surface of the cathode 40 by mechanical or chemical means to improve the adhesion of the coating.

[0082] In some embodiments, the first coil 60 is wound and extends along the first direction.

[0083] In some embodiments, the first coil 60 is located on a side of the anode 30 away from the cathode 40 .

[0084] In some embodiments, the first coil 60 is located between the anode 30 and the cathode 40 .

[0085] In some embodiments, the distance between the first coil 60 and the anode 30 is smaller than the distance between the first coil 60 and the cathode 40 .

[0086] In some embodiments, the electroplating device 100 further includes a second power supply 61 , and the first coil 60 is connected to the second power supply 61 .

[0087] In some embodiments, the voltage output by the second power supply 61 is a constant voltage.

[0088] Further, the constant voltage is 180V-260V, for example, 190V, 200V, 210V, 220V, 230V, 240V or a range between any two values, etc. The range of the constant voltage can promote the generation of a first magnetic field of suitable strength.

[0089] In some embodiments, the intensity of the first magnetic field is 2T to 4T, for example, 2.5T, 3T, 3.5T or any range between two values, etc. Under the intensity of the first magnetic field, when the ions encounter an obstacle and their moving direction is deflected, the first magnetic field can generate magnetic flux lines by acting on the deflected current, thereby achieving a stirring effect on the vicinity of the obstacle.

[0090] In some embodiments, the electroplating device 100 further includes a second coil 70 , and the second coil 70 is located in the electroplating solution 20 . When the second coil 70 is energized, the direction of the generated second magnetic field is parallel to the first direction.

[0091] In some embodiments, the second coil 70 is located between the anode 30 and the cathode 40 .

[0092] In some embodiments, the second coil 70 is wound and extends along the first direction.

[0093] Furthermore, the distance between the second coil 70 and the cathode 40 is smaller than the distance between the second coil 70 and the anode 30. In other words, the second coil 70 is closer to the cathode 40.

[0094] When the second coil 70 is powered on, it can produce the same local micro-stirring effect as the first coil 60, so that the metal ions and graphene near the cathode 40 are evenly dispersed, thereby ensuring that the grain size of the plated metal on the cathode 40 to be plated is uniform and the graphene is evenly distributed.

[0095] In some embodiments, the distance between the first coil 60 and the bottom of the electroplating tank 10 is the same as the distance between the second coil 70 and the bottom of the electroplating tank 10. In other words, the first coil 60 and the second coil 70 are located on the same horizontal line.

[0096] In some embodiments, the electroplating device 100 further includes a third power supply 71 , and the second coil 70 is connected to the third power supply 71 .

[0097] In some embodiments, the voltage output by the third power supply 71 is a first pulse voltage. The first pulse voltage causes the second coil 70 to generate a pulse magnetic field, which interacts with the electric field from the anode 30 to the cathode 40, and can shrink the electroplated metal, and then in the process of metal ions obtaining electrons and reducing to generate metal, dendrites break, thereby playing a role in refining grains.

[0098] Furthermore, the first pulse voltage is 250V~260V, for example, it can be 251V, 252V, 253V, 254V, 255V, 256V, 257V, 258V, 259V or a range between any two values.

[0099] The frequency of the first pulse voltage is 2 Hz to 4 Hz, for example, 2.2 Hz, 2.5 Hz, 2.8 Hz, 3 Hz, 3.2 Hz, 3.5 Hz, 3.8 Hz or a range between any two values.

[0100] In some embodiments, the first pulse voltage is a first cycle intermittent pulse voltage.

[0101] Furthermore, the single operation time of the first cycle intermittent pulse voltage is 6s~8s, for example, it can be 6.2s, 6.5s, 6.8s, 7s, 7.2s, 7.5s, 7.8s or a range between any two values.

[0102] The interval time between two adjacent operations of the first cycle gap pulse voltage is 2s-3s, for example, it can be 1.2s, 1.5s, 1.8s or a range between any two values.

[0103] In this way, under the condition of the first pulse voltage, when ions encounter obstacles near the cathode 40, they are deflected, which is beneficial for the second coil 70 to act on the ions under the action of the first pulse voltage, thereby achieving a stirring effect near the cathode 40.

[0104] In some embodiments, the strength of the second magnetic field is less than the strength of the first magnetic field.

[0105] Further, the intensity of the second magnetic field is 0.2T~0.3T, for example, it can be 0.22T, 0.25T, 0.28T or a range between any two values, etc. It can be understood that the second coil 70 is arranged close to the cathode 40, that is, the workpiece to be plated, and the intensity of the second magnetic field is small, which can ensure the stability of the electroplating solution 20 on the surface of the workpiece to be plated, thereby improving the uniformity of the metal grain size and the uniform distribution of graphene in the plated layer on the workpiece to be plated.

[0106] In some embodiments, the electroplating device 100 further includes a third coil 80 , which is located on a side of the cathode 40 close to the bottom of the electroplating tank 10 . When the third coil 80 is energized, the generated third magnetic field at least partially covers the cathode 40 .

[0107] In some embodiments, the third coil 80 is wound and extended along a second direction, and the second direction is perpendicular to the first direction. In other words, the third coil 80 and the cathode 40 are distributed along the second direction.

[0108] In some embodiments, when the third coil 80 is energized, the direction of the generated third magnetic field is parallel to the second direction.

[0109] The third coil 80 generates a third magnetic field during the power-on process. When the metal ions are in the process of obtaining electrons to reduce to metal, the magnetic field is applied from different directions of the cathode 40, which can not only further refine the metal grains, but also make the metal ions obtain electrons to reduce the metal so that the metals are arranged in the best conductive order. It should be noted that the order of arrangement in the best conductive order means that when different metals have different grain orientations and different conductive properties, under the action of electric and magnetic fields, the metals will be arranged in the best conductive orientation. When this conductive orientation arrangement is well maintained, the conductivity of the coating can be improved.

[0110] In some embodiments, the electroplating device 100 further includes a fourth power source 81 , and the third coil 80 is connected to the fourth power source 81 .

[0111] In some embodiments, the voltage output by the fourth power supply 81 is a second pulse voltage.

[0112] Furthermore, the second pulse voltage is 220V~240V, for example, it can be 225V, 230V, 235V or a range between any two values.

[0113] The frequency of the second pulse voltage is 3 Hz to 5 Hz, for example, 3.2 Hz, 3.5 Hz, 3.8 Hz, 4 Hz, 4.2 Hz, 4.5 Hz, 4.8 Hz or a range between any two values.

[0114] In some embodiments, the second pulse voltage is a second cyclic intermittent pulse voltage.

[0115] Furthermore, the single operation time of the second cycle intermittent pulse voltage is 2s to 3s, for example, it can be 1.2s, 1.5s, 1.8s or a range between any two values.

[0116] The interval time between two adjacent operations of the second cyclic intermittent pulse voltage is 6s~8s, for example, it can be 6.2s, 6.5s, 6.8s, 7s, 7.2s, 7.5s, 7.8s or a range between any two values.

[0117] It should be noted that the third power supply 71 and the fourth power supply 81 do not operate at the same time. In other words, when the second coil 70 generates a magnetic field, the third coil 80 is not powered, and when the third coil 80 generates a magnetic field, the second coil 70 is not powered. In this way, the second coil 70 and the third coil 80 can promote the fracture of metal dendrites from multiple angles and further refine the grains.

[0118] Thus, under the condition of the second pulse voltage, the metal ions are facilitated to arrange in the optimal conductive orientation under the action of the magnetic field generated by the metal ions and the electric field of electroplating, thereby improving the electrical conductivity and thermal conductivity of the coating.

[0119] In some embodiments, the strength of the third magnetic field is less than the strength of the first magnetic field.

[0120] Further, the intensity of the third magnetic field is 0.4T~0.5T, for example, it can be 0.42T, 0.45T, 0.48T or a range between any two values, etc. It can be understood that the third coil 80 is arranged close to the cathode 40, that is, the workpiece to be plated. Under the intensity range of the third magnetic field, it can not only refine the grains and arrange the metal in the optimal conductive orientation, but also ensure the stability of the electroplating solution 20 on the surface of the workpiece to be plated, and promote the uniformity and stability of the film formation of the coating.

[0121] It should be noted that the winding of the first coil 60 , the second coil 70 and the third coil 80 means that the coils extend in a spiral manner.

[0122] Second, see Figure 2 The present application also provides an electroplating method, which is performed using the electroplating device 100, and includes the following steps:

[0123] S11, providing an electroplating solution 20, wherein the electroplating solution 20 includes a metal salt and graphene, and placing the electroplating solution 20 in an electroplating tank 10;

[0124] S12, providing a workpiece to be plated and a first coil 60, using the workpiece to be plated as a cathode 40 and an anode 30, and immersing the first coil 60 in the electroplating solution 20, wherein the anode 30 and the cathode 40 are arranged opposite to each other along a first direction;

[0125] S13, energizing the anode 30 and the cathode 40, energizing the first coil 60, and forming a plating layer on the surface of the workpiece to be plated.

[0126] In some embodiments, the electroplating method further includes: providing a second coil 70, immersing the second coil 70 in the electroplating solution; when the anode 30 and the cathode 40 are energized, it also includes: energizing the second coil 70, and when the second coil 70 is energized, the direction of the second magnetic field generated is parallel to the first direction.

[0127] In some embodiments, the electroplating method further includes: providing a third coil 80, and arranging the third coil 80 on the side of the cathode 40 close to the bottom of the electroplating tank 10; when the anode 30 and the cathode 40 are energized, it also includes: energizing the third coil 80, and the third magnetic field generated by energizing the third coil 80 at least partially covers the cathode 40.

[0128] In some embodiments, energizing the second coil 70 includes intermittently energizing the second coil 70 .

[0129] In some embodiments, energizing the third coil 80 includes intermittently energizing the third coil 80 .

[0130] In some embodiments, the second coil 70 and the third coil 80 are not energized at the same time.

[0131] The electroplating solution 20 , the anode 30 , the cathode 40 , the first coil 60 , the second coil 70 , and the third coil 80 may be referred to above and will not be described in detail herein.

[0132] In the electroplating method provided by the present application, the first coil 60 can generate a first magnetic field that is roughly parallel to the first direction when energized. During the electroplating process, the flow of current in the electroplating solution 20 relies on ion transfer. When ions encounter obstacles such as graphene during movement, the local direction of ion movement changes, generating a current that is not parallel to the original current direction. New magnetic flux lines are generated under the action of the first magnetic field, and eddy currents are generated near the graphene obstacle under the action of the Lorentz force, thereby achieving local stirring of the electroplating solution 20 near the graphene. Stirring can not only disperse the graphene, but also promote the graphene in the electroplating solution 20. Uniform distribution improves the dispersion stability of graphene in the electroplating solution 20; the second coil 70 can produce the same local micro-stirring effect as the first coil 60 during the power-on process, so that the metal ions and graphene near the cathode 40 are evenly dispersed, thereby ensuring that the grain size of the plated metal on the workpiece to be plated is uniform and the graphene distribution is uniform; the third coil 80 generates a magnetic field during the power-on process. In the process of metal ions obtaining electron reduction to the metal, the magnetic field is applied from different directions of the cathode 40, which can not only further refine the metal grains, but also enable the metal ions to obtain electron reduction process so that the metal is arranged in the best conductive order.

[0133] The grains of the plated metal obtained by the electroplating method provided in the present application are uniformly refined and arranged in the optimal conductive order. Graphene is evenly dispersed in the plated layer without agglomeration, which effectively improves the density and uniformity of the plated layer. The conductivity, thermal conductivity and other properties of the plated layer are also effectively improved through graphene.

[0134] The present application is described in detail below through specific embodiments. The following embodiments are only partial embodiments of the present application and are not limitations of the present application.

[0135] Example 1

[0136] This embodiment provides an electroplating device and a method for electroplating using the electroplating device, including:

[0137] Providing an electroplating solution, the electroplating solution comprising copper salt copper sulfate and graphene, wherein the mass concentration of copper sulfate is 25 g / L, and the mass concentration of graphene is 1 g / L, and placing the electroplating solution in an electroplating tank;

[0138] Providing a workpiece to be plated and a first coil, immersing the workpiece to be plated as a cathode and an anode in a plating solution, the anode and the cathode are arranged opposite to each other along a first direction, the first coil is arranged on a side of the anode away from the cathode, and the first coil is wound and extended along the first direction;

[0139] The anode and the cathode are energized, and the first coil is energized. The voltage of the first coil is 200V, and the intensity of the generated first magnetic field is 3T, forming a copper graphene coating on the surface of the workpiece to be plated.

[0140] Example 2

[0141] This embodiment provides an electroplating device and a method for electroplating using the electroplating device, including:

[0142] Providing an electroplating solution, the electroplating solution comprising copper salt copper sulfate and graphene, wherein the mass concentration of copper sulfate is 25 g / L, and the mass concentration of graphene is 1 g / L, and placing the electroplating solution in an electroplating tank;

[0143] A workpiece to be plated and a first coil are provided, and the workpiece to be plated is immersed in a plating solution as a cathode and an anode, the anode and the cathode are arranged opposite to each other along a first direction, the first coil is arranged on a side of the anode away from the cathode, and the first coil is wound and extended along the first direction; a second coil is provided, and the second coil is arranged on a side of the cathode close to the anode, and the second coil is wound and extended along the first direction;

[0144] The anode and cathode are energized, the first coil is energized with a voltage of 200V, and the intensity of the first magnetic field generated is 3T. The second coil is energized intermittently with a pulse voltage of 250V and a frequency of 3Hz, and the intensity of the second magnetic field generated is 0.2T. The system runs for 7s and then again with an interval of 3s, to form a copper graphene coating on the surface of the workpiece to be plated.

[0145] Example 3

[0146] This embodiment provides an electroplating device and a method for electroplating using the electroplating device, including:

[0147] Providing an electroplating solution, the electroplating solution comprising copper salt copper sulfate and graphene, wherein the mass concentration of copper sulfate is 25 g / L, and the mass concentration of graphene is 1 g / L, and placing the electroplating solution in an electroplating tank;

[0148] Provide a workpiece to be plated and a first coil, immerse the workpiece to be plated as a cathode and an anode in an electroplating solution, the anode and the cathode are arranged opposite to each other along a first direction, the first coil is arranged on a side of the anode away from the cathode, and the first coil is wound and extended along the first direction; provide a third coil, arrange the third coil on a side of the cathode close to the bottom of the electroplating tank, and the third coil is wound and extended along a second direction, the second direction being perpendicular to the first direction;

[0149] The anode and cathode are energized, the first coil is energized with a voltage of 200V, and the intensity of the first magnetic field generated is 3T. The third coil is energized intermittently with a pulse voltage of 220V and a frequency of 4Hz, and the intensity of the third magnetic field generated is 0.4T. The system runs for 3s and then again with an interval of 7s, to form a copper graphene coating on the surface of the workpiece to be plated.

[0150] Example 4

[0151] This embodiment provides an electroplating device and a method for electroplating using the electroplating device, including:

[0152] Providing an electroplating solution, the electroplating solution comprising copper salt copper sulfate and graphene, wherein the mass concentration of copper sulfate is 25 g / L, and the mass concentration of graphene is 1 g / L, and placing the electroplating solution in an electroplating tank;

[0153] Provide a workpiece to be plated and a first coil, immerse the workpiece to be plated as a cathode and an anode in an electroplating solution, the anode and the cathode are arranged opposite to each other along a first direction, the first coil is arranged on a side of the anode away from the cathode, and the first coil is wound and extended along the first direction; provide a second coil, arrange the second coil on a side of the cathode close to the anode, and the second coil is wound and extended along the first direction; provide a third coil, arrange the third coil on a side of the cathode close to the bottom of the electroplating tank, and the third coil is wound and extended along a second direction, and the second direction is perpendicular to the first direction;

[0154] The anode and cathode are energized, and the first coil is energized with a voltage of 200V. The intensity of the first magnetic field generated is 3T. The second and third coils are energized complementarily and operated alternately. The pulse voltage of the second coil is 250V, and the frequency is 3Hz. The intensity of the second magnetic field generated is 0.2T. It runs for 7s and then runs again after 3s. The pulse voltage of the third coil is 220V, and the frequency is 4Hz. The intensity of the third magnetic field generated is 0.4T. It runs for 3s and then runs again after 7s. A copper graphene coating is formed on the surface of the workpiece to be plated.

[0155] Example 5

[0156] This embodiment provides an electroplating device and a method for electroplating using the electroplating device, including:

[0157] Providing an electroplating solution, the electroplating solution comprising nickel salt nickel chloride, nickel sulfamate and graphene, wherein the mass concentration of the nickel chloride is 12 g / L, the mass concentration of the nickel sulfamate is 340 g / L, and the mass concentration of the graphene is 1 g / L, and the electroplating solution is placed in an electroplating tank;

[0158] Providing a workpiece to be plated and a first coil, immersing the workpiece to be plated as a cathode and an anode in a plating solution, the anode and the cathode are arranged opposite to each other along a first direction, the first coil is arranged on a side of the anode away from the cathode, and the first coil is wound and extended along the first direction;

[0159] The anode and cathode are energized, and the first coil is energized. The voltage of the first coil is 200V, and the intensity of the generated first magnetic field is 3T, forming a nickel graphene coating on the surface of the workpiece to be plated.

[0160] Example 6

[0161] This embodiment provides an electroplating device and a method for electroplating using the electroplating device, including:

[0162] Providing an electroplating solution, the electroplating solution comprising nickel salt nickel chloride, nickel sulfamate and graphene, wherein the mass concentration of the nickel chloride is 12 g / L, the mass concentration of the nickel sulfamate is 340 g / L, and the mass concentration of the graphene is 1 g / L, and the electroplating solution is placed in an electroplating tank;

[0163] A workpiece to be plated and a first coil are provided, and the workpiece to be plated is immersed in a plating solution as a cathode and an anode, the anode and the cathode are arranged opposite to each other along a first direction, the first coil is arranged on a side of the anode away from the cathode, and the first coil is wound and extended along the first direction; a second coil is provided, and the second coil is arranged on a side of the cathode close to the anode, and the second coil is wound and extended along the first direction;

[0164] The anode and cathode are energized, the first coil is energized with a voltage of 200V, and the intensity of the first magnetic field generated is 3T. The second coil is energized intermittently with a pulse voltage of 250V and a frequency of 3Hz, and the intensity of the second magnetic field generated is 0.2T. The system runs for 7s and then again with an interval of 3s, to form a nickel graphene coating on the surface of the workpiece to be plated.

[0165] Example 7

[0166] This embodiment provides an electroplating device and a method for electroplating using the electroplating device, including:

[0167] Providing an electroplating solution, the electroplating solution comprising nickel salt nickel chloride, nickel sulfamate and graphene, wherein the mass concentration of the nickel chloride is 12 g / L, the mass concentration of the nickel sulfamate is 340 g / L, and the mass concentration of the graphene is 1 g / L, and the electroplating solution is placed in an electroplating tank;

[0168] Provide a workpiece to be plated and a first coil, immerse the workpiece to be plated as a cathode and an anode in an electroplating solution, the anode and the cathode are arranged opposite to each other along a first direction, the first coil is arranged on a side of the anode away from the cathode, and the first coil is wound and extended along the first direction; provide a third coil, arrange the third coil on a side of the cathode close to the bottom of the electroplating tank, and the third coil is wound and extended along a second direction, the second direction being perpendicular to the first direction;

[0169] The anode and cathode are energized, the first coil is energized with a voltage of 200V, and the intensity of the first magnetic field generated is 3T. The third coil is energized intermittently with a pulse voltage of 220V and a frequency of 4Hz, and the intensity of the third magnetic field generated is 0.4T. The system runs for 3s and then again with an interval of 7s, to form a nickel graphene coating on the surface of the workpiece to be plated.

[0170] Example 8

[0171] This embodiment provides an electroplating device and a method for electroplating using the electroplating device, including:

[0172] Providing an electroplating solution, the electroplating solution comprising nickel salt nickel chloride, nickel sulfamate and graphene, wherein the mass concentration of the nickel chloride is 12 g / L, the mass concentration of the nickel sulfamate is 340 g / L, and the mass concentration of the graphene is 1 g / L, and the electroplating solution is placed in an electroplating tank;

[0173] Provide a workpiece to be plated and a first coil, immerse the workpiece to be plated as a cathode and an anode in an electroplating solution, the anode and the cathode are arranged opposite to each other along a first direction, the first coil is arranged on a side of the anode away from the cathode, and the first coil is wound and extended along the first direction; provide a second coil, arrange the second coil on a side of the cathode close to the anode, and the second coil is wound and extended along the first direction; provide a third coil, arrange the third coil on a side of the cathode close to the bottom of the electroplating tank, and the third coil is wound and extended along a second direction, and the second direction is perpendicular to the first direction;

[0174] The anode and cathode are energized, and the first coil is energized with a voltage of 200V. The intensity of the first magnetic field generated is 3T. The second and third coils are energized complementarily and operated alternately. The pulse voltage of the second coil is 250V, and the frequency is 3Hz. The intensity of the second magnetic field generated is 0.2T. It runs for 7s and then runs again after 3s. The pulse voltage of the third coil is 220V, and the frequency is 4Hz. The intensity of the third magnetic field generated is 0.4T. It runs for 3s and then runs again after 7s. A nickel graphene coating is formed on the surface of the workpiece to be plated.

[0175] Comparative Example 1

[0176] This comparative example provides an electroplating device and a method for electroplating using the electroplating device, comprising:

[0177] Providing an electroplating solution, the electroplating solution includes copper salt copper sulfate, wherein the mass concentration of copper sulfate is 25 g / L, and placing the electroplating solution in an electroplating tank;

[0178] Providing a workpiece to be plated, and immersing the workpiece to be plated as a cathode and an anode into a plating solution;

[0179] The anode and cathode are energized to form a copper coating on the surface of the workpiece.

[0180] Comparative Example 2

[0181] This comparative example provides an electroplating device and a method for electroplating using the electroplating device, comprising:

[0182] Providing an electroplating solution, the electroplating solution comprising copper salt copper sulfate and graphene, wherein the mass concentration of copper sulfate is 25 g / L, and the mass concentration of graphene is 1 g / L, and placing the electroplating solution in an electroplating tank;

[0183] Providing a workpiece to be plated, and immersing the workpiece to be plated as a cathode and an anode into the electroplating solution;

[0184] The anode and the cathode are energized to form a copper graphene coating on the surface of the workpiece to be plated.

[0185] Comparative Example 3

[0186] This comparative example provides an electroplating device and a method for electroplating using the electroplating device, comprising:

[0187] Providing an electroplating solution, the electroplating solution comprising nickel salt nickel chloride and nickel sulfamate, wherein the mass concentration of the nickel chloride is 12 g / L, and the mass concentration of the nickel sulfamate is 340 g / L, and placing the electroplating solution in an electroplating tank;

[0188] Providing a workpiece to be plated, and immersing the workpiece to be plated as a cathode and an anode into the electroplating solution;

[0189] The anode and cathode are energized to form a nickel coating on the surface of the workpiece.

[0190] Comparative Example 4

[0191] This comparative example provides an electroplating device and a method for electroplating using the electroplating device, comprising:

[0192] Providing an electroplating solution, the electroplating solution comprising nickel salt nickel chloride, nickel sulfamate and graphene, wherein the mass concentration of the nickel chloride is 12 g / L, the mass concentration of the nickel sulfamate is 340 g / L, and the mass concentration of the graphene is 1 g / L, and the electroplating solution is placed in an electroplating tank;

[0193] Providing a workpiece to be plated, and immersing the workpiece to be plated as a cathode and an anode into a plating solution;

[0194] The anode and the cathode are energized to form a nickel graphene coating on the surface of the workpiece to be plated.

[0195] The electrical conductivity and thermal conductivity of the coatings of Examples 1 to 8 and Comparative Examples 1 to 4 were tested, and the results are shown in Table 1.

[0196] Among them, the test method for electrical conductivity includes the four-probe method, and the test method for thermal conductivity includes the steady-state method (hot wire method).

[0197] Table 1

[0198]

[0199] As can be seen from Table 1, the electroplating device provided by the present application significantly improves the electrical conductivity and thermal conductivity of the coating by electroplating. This is mainly because the first coil, the second coil, and the third coil interact with the current in the plating solution by generating a magnetic field, thereby locally stirring the plating solution, improving the dispersion of graphene, thereby improving the uniformity of graphene in the coating, and the second coil and the third coil are close to the workpiece to be plated, and the pulsed magnetic field is used to refine the metal grains, thereby promoting the metal to be arranged in the optimal conductive order, thereby effectively improving the performance of the coating.

[0200] The technical solutions provided by the embodiments of the present application are introduced in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. An electroplating device, characterized in that: include: An electroplating tank, wherein an electroplating solution is provided in the electroplating tank, and the electroplating solution includes a metal salt and graphene; an anode and a cathode, the anode and the cathode being located in the electroplating solution and arranged opposite to each other along a first direction; a first coil, the first coil being located in the electroplating solution, and when the first coil is energized, a direction of a first magnetic field generated is parallel to the first direction; a second coil, the second coil being located in the electroplating solution, and when the second coil is energized, a direction of a second magnetic field generated is parallel to the first direction; as well as The third coil is located on a side of the cathode close to the bottom of the electroplating tank. When the third coil is energized, the third magnetic field generated at least partially covers the cathode, and the direction of the third magnetic field is parallel to the second direction, and the second direction is perpendicular to the first direction.

2. The electroplating device according to claim 1, characterized in that: The metal salt comprises one or more of copper salt, nickel salt, silver salt, tin salt, palladium salt and chromium salt; and / or In the electroplating solution, the mass concentration of the metal salt is 5g / L to 380g / L; and / or In the electroplating solution, the mass concentration of the graphene is 0.5 g / L to 1.5 g / L.

3. The electroplating device according to claim 1, characterized in that: The first coil is wound and extends along the first direction; and / or The first coil is located on a side of the anode away from the cathode; and / or The first coil is located between the anode and the cathode; and / or The distance between the first coil and the anode is smaller than the distance between the first coil and the cathode.

4. The electroplating device according to claim 1 or 3, characterized in that: The electroplating device further includes a second power supply, and the first coil is connected to the second power supply; wherein, The voltage output by the second power supply is a constant voltage, and the constant voltage is 180V~260V; and / or The intensity of the first magnetic field is 2T~4T.

5. The electroplating device according to claim 1, characterized in that: The second coil is wound and extends along the first direction; and / or The second coil is located between the anode and the cathode; and / or The distance between the second coil and the cathode is smaller than the distance between the second coil and the anode; and / or The distance between the first coil and the bottom of the electroplating tank is the same as the distance between the second coil and the bottom of the electroplating tank.

6. The electroplating device according to claim 5, characterized in that: The electroplating device further includes a third power supply, and the second coil is connected to the third power supply; wherein, The voltage output by the third power supply is a first pulse voltage, the first pulse voltage is 250V~260V, and the frequency of the first pulse voltage is 2Hz~4Hz; the first pulse voltage is a first cycle intermittent pulse voltage, the single operation time of the first cycle intermittent pulse voltage is 6s~8s, and the interval time between two adjacent operations is 2s~3s; and / or The intensity of the second magnetic field is less than that of the first magnetic field; the intensity of the second magnetic field is 0.2T~0.3T.

7. The electroplating device according to claim 1, characterized in that: The electroplating device further includes a fourth power supply, and the third coil is connected to the fourth power supply; wherein, The voltage output by the fourth power supply is a second pulse voltage, the second pulse voltage is 220V~240V, and the frequency of the second pulse voltage is 3Hz~5Hz; the second pulse voltage is a second cyclic intermittent pulse voltage, the single operation time of the second cyclic intermittent pulse voltage is 2s~3s, and the interval time between two adjacent operations is 6s~8s; and / or The strength of the third magnetic field is less than the strength of the first magnetic field; the strength of the third magnetic field is 0.4T~0.5T; and / or The third coil is wound and extends along the second direction.

8. An electroplating method, characterized in that: The electroplating method is carried out using the electroplating device according to any one of claims 1 to 7, comprising the following steps: Providing an electroplating solution, wherein the electroplating solution includes a metal salt and graphene, and placing the electroplating solution in an electroplating tank; Providing a workpiece to be plated and a first coil, a second coil and a third coil, immersing the workpiece to be plated as a cathode and an anode, the first coil, the second coil and the third coil in the electroplating solution, wherein the anode and the cathode are arranged opposite to each other along a first direction, and the third coil is arranged on a side of the cathode close to the bottom of the electroplating tank; Powering the anode and the cathode, and powering the first coil, the second coil, and the third coil to form a plating layer on the surface of the workpiece to be plated; When the first coil is energized, the direction of the generated first magnetic field is parallel to the first direction; when the second coil is energized, the direction of the generated second magnetic field is parallel to the first direction; when the third coil is energized, the generated third magnetic field at least partially covers the cathode, and the direction of the third magnetic field is parallel to the second direction, and the second direction is perpendicular to the first direction.

9. The electroplating method according to claim 8, characterized in that: The energizing the second coil comprises intermittently energizing the second coil; and / or The energizing the third coil comprises intermittently energizing the third coil; and / or The second coil and the third coil are not energized at the same time.

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