A method for printing gradient of lattice structure based on node cross section

Abstract

This specification discloses a method for printing a dot matrix structure gradient based on a node section. The method comprises: obtaining a dot matrix structure model of a target printed object, decomposing the dot matrix structure model into a node section area and a main body area; slicing the node section area and the main body area respectively according to different slice thicknesses to obtain slice data, wherein the slice thickness corresponding to the slice in the node section area is less than the slice thickness corresponding to the slice in the main body area; inputting the slice data into a 3D printing device, and printing slice models of different areas in sequence from bottom to top to complete the gradient forming of the dot matrix. This solution realizes the printing of the dot matrix structure through node section gradient forming, which effectively increases the strength of the dot matrix structure.

Description

Technical Field

[0001] The present invention relates to the field of additive manufacturing, and in particular to a method for printing a gradient lattice structure based on a node cross section. Background Art

[0002] At present, lightweight design of materials is a constant design goal for high-end mechanical parts such as spacecraft, and the lattice structure based on additive manufacturing provides a solution for the lightweighting of spacecraft. The complex working conditions of aircraft have strict requirements on material performance, requiring it to be able to function reliably in a variety of service environments. Therefore, the strengthening and toughening of lightweight lattice structures has become an important research topic.

[0003] However, in the 3D printed lattice structure, due to factors such as the sudden change in cross-sectional dimensions at the pillar nodes, sharp corners, and pillar structures, stress concentration will occur at the pillar nodes, causing these areas to easily crack during the stress process, thereby causing the lattice structure to fail.

[0004] Therefore, how to enhance the strength of the dot matrix structure and further ensure the safety and stability of the printed matter is an urgent problem to be solved. Summary of the invention

[0005] This specification provides a dot matrix structure gradient printing method based on node cross-sections to partially solve the above-mentioned problems existing in the prior art.

[0006] This manual adopts the following technical solutions:

[0007] This specification provides a method for printing a gradient lattice structure based on a node cross section, including:

[0008] receiving a print request for a target print product;

[0009] According to the printing request, a dot matrix structure model of the target printed object is obtained, and the dot matrix structure model is decomposed into a plurality of node cross-sectional areas and a main body area, wherein the node cross-sectional area is used to characterize the area where the pillar nodes in the dot matrix structure are located, and the stress value borne by the node cross-sectional area is higher than that of the main body area;

[0010] Slicing the node cross-sectional area and the main body area respectively according to different slice thicknesses to obtain slice data, wherein the slice thickness corresponding to the slice in the node cross-sectional area is smaller than the slice thickness corresponding to the slice in the main body area;

[0011] The slice data is input into a 3D printing device, so that each slice layer is printed in sequence according to the slice thickness corresponding to each slice layer through the 3D printing device in a bottom-up order to obtain the target printed object.

[0012] Optionally, for each node cross-sectional area, the thickness of the node cross-sectional area is twice the diameter of the lattice pillars in the lattice structure model.

[0013] Optionally, the slice data is input into a 3D printing device, so that each layer of slices is printed in sequence according to the slice thickness corresponding to each layer of slices by the 3D printing device in a bottom-up order, specifically including:

[0014] The slice data is input into a 3D printing device so that each slice layer is printed in sequence by the 3D printing device in a bottom-up order according to the printing parameters corresponding to the node cross-section area, the printing parameters corresponding to the main body area, and the slice thickness corresponding to each slice layer.

[0015] Optionally, the printing parameters corresponding to the node cross-sectional area and the printing parameters corresponding to the main body area include: laser power, scanning spacing, scanning speed, printing material powder layer thickness and protective gas type;

[0016] The laser power corresponding to the node cross-sectional area is lower than the laser power corresponding to the main body area, and the scanning interval corresponding to the node cross-sectional area is smaller than the scanning interval corresponding to the main body area.

[0017] Optionally, the node cross-sectional area and the main body area are printed and formed using the same printing material powder; and / or

[0018] The node cross-sectional area and the main body area are printed and formed using a single-component printing material powder.

[0019] Optionally, the printing material powder used in the node cross-sectional area and the main body area includes metal powder having a face-centered cubic unit cell crystal structure.

[0020] Optionally, the printing material powder is an aluminum-magnesium-scandium-zirconium alloy, wherein the ratio of magnesium element in the aluminum-magnesium-scandium-zirconium alloy is 4.4-4.6%, the ratio of scandium element is 0.65-0.68%, the ratio of zirconium element is 0.38-0.42%, the ratio of iron element is 0-0.06%, the ratio of oxygen element is 0-0.1%, and the remaining elements are aluminum element.

[0021] This specification provides a dot matrix structure gradient printing device based on node cross-section, including:

[0022] A receiving module, used for receiving a print request for a target print object;

[0023] A decomposition module, used for obtaining a dot matrix structure model of the target printed object according to the printing request, and decomposing the dot matrix structure model into a plurality of node cross-sectional areas and a main body area, wherein the node cross-sectional area is used to characterize the area where the pillar node in the dot matrix structure is located, and the stress value borne by the node cross-sectional area is higher than that of the main body area;

[0024] A slicing module, used to slice the node cross-sectional area and the main body area respectively according to different slice thicknesses to obtain slice data, wherein the slice thickness corresponding to the slice in the node cross-sectional area is smaller than the slice thickness corresponding to the slice in the main body area;

[0025] The printing module is used to input the slice data into a 3D printing device, so that the slices in different areas are printed in sequence from bottom to top according to the slice data, so as to complete the gradient forming of the dot matrix and obtain the target printed object.

[0026] The present specification provides a computer-readable storage medium, wherein the storage medium stores a computer program, and when the computer program is executed by a processor, the above-mentioned node-section-based lattice structure gradient printing method is implemented.

[0027] The present specification provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the above-mentioned node-section-based dot matrix structure gradient printing method when executing the program.

[0028] At least one of the above technical solutions adopted in this specification can achieve the following beneficial effects:

[0029] In the node cross-section based lattice structure gradient printing method provided in this specification, a lattice structure model of a target printed object is obtained, and the lattice structure model is decomposed into a plurality of node cross-section regions and a main body region, wherein the node cross-section region is used to characterize the region where the pillar node in the lattice structure is located, and the stress value borne by the node cross-section region is higher than that of the main body region; the node cross-section region and the main body region are sliced ​​according to different slice thicknesses, respectively, to obtain slice data, wherein the slice thickness corresponding to the slice in the node cross-section region is less than the slice thickness corresponding to the slice in the main body region; the slice data is input into a 3D printing device, so that each layer of slices is printed in sequence according to the slice thickness corresponding to each layer of slices in a bottom-up order through the 3D printing device. This scheme realizes the printing of the lattice structure through node cross-section gradient forming, which effectively increases the strength of the lattice structure.

[0030] It can be seen from the above method that in the process of printing the target printed object, this scheme can divide the printed object into a node cross-section area with concentrated stress and a main body area with dispersed stress, and slice different areas with different thicknesses, so as to realize the printing of high-strength lattice structure through node cross-section gradient forming. Since the thickness of the slices in the node cross-section area is lower than that in the main body area, and with low laser power and small scanning spacing, it is possible to achieve finer equiaxed crystal induction in the pillar node area than in the main body area, thereby increasing the proportion of grain boundaries, further enhancing the tolerance of dislocation accumulation in the node area during lattice failure, delaying the generation of cracks in the node area, and thus meeting the strength control requirements of the printed object, extending the service life, and enhancing reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The drawings described herein are used to provide a further understanding of this specification and constitute a part of this specification. The illustrative embodiments and descriptions of this specification are used to explain this specification and do not constitute an improper limitation on this specification. In the drawings:

[0032] Figure 1 A schematic flow chart of a method for printing a gradient lattice structure based on a node cross section provided in this specification;

[0033] Figure 2 A schematic diagram of the area division of a lattice structure model provided in this specification;

[0034] Figure 3 This is a schematic diagram of a slice printing method provided in this manual;

[0035] Figure 4 A reference figure for a conventional printing method provided in this specification;

[0036] Figure 5 A schematic diagram comparing the microstructure of a lattice node region obtained by a conventional printing method and a gradient printing method of the present application provided in this specification;

[0037] Figure 6 A grain size distribution statistical graph obtained by using a conventional printing method and a gradient printing method of the present application provided in this specification;

[0038] Figure 7 A schematic diagram comparing average grain diameters obtained by a conventional printing method and a gradient printing method of the present application provided in this specification;

[0039] Figure 8 A schematic diagram comparing stress-strain curves of a quasi-static compression process of a dot matrix obtained by a conventional printing method and a gradient printing method of the present application provided in this specification;

[0040] Fig. 9 A schematic diagram comparing dot matrix deformation obtained by using a conventional printing method and a gradient printing method of the present application provided in this specification;

[0041] Fig.10 A schematic diagram of a gradient printing device based on a node cross section provided in this specification;

[0042] Fig.11 A method provided in this specification corresponding to Figure 1 Schematic diagram of electronic equipment. DETAILED DESCRIPTION

[0043] In order to make the purpose, technical solutions and advantages of this specification more clear, the technical solutions of this specification will be clearly and completely described below in combination with the specific embodiments of this specification and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of this specification, not all of them. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this specification.

[0044] The technical solutions provided by the embodiments of this specification are described in detail below in conjunction with the accompanying drawings.

[0045] Figure 1 The flowchart of a gradient printing method based on a node section provided in this specification includes the following steps:

[0046] S101: receiving a print request for a target print object;

[0047] S102: According to the printing request, a dot matrix structure model of the target printed object is obtained, and the dot matrix structure model is decomposed into a plurality of node cross-sectional areas and a main body area, wherein the node cross-sectional area is used to characterize the area where the pillar nodes in the dot matrix structure are located, and the stress value borne by the node cross-sectional area is higher than that of the main body area.

[0048] Additive Manufacturing (AM) technology is a technology that uses materials to gradually accumulate to manufacture solid parts. In this technology, lattice structure, as a new type of structural design, has been widely used.

[0049] Among them, the lattice structure, also known as the lattice structure or space lattice, is a system composed of intersecting nodes and pillars or shells, and has the characteristics of periodic arrangement. In additive manufacturing technology, the lattice structure is usually prepared by selective laser melting (SLM), electron beam melting (EBM) and other manufacturing technologies. These structures have the functional characteristics of lightweight, high specific stiffness / strength, excellent damping and shock absorption performance, buffering and energy absorption characteristics, as well as sound absorption and noise reduction, heat insulation, and magnetic isolation.

[0050] In order to enhance the bearing capacity of the support nodes of the lattice structure, this specification provides a gradient printing method based on the node cross section, which realizes the printing of high-strength lattice structure through the gradient forming of the node cross section, and further improves the strength of the printed object.

[0051] In this specification, the execution entity for implementing a lattice structure gradient printing method based on node cross-sections can be a terminal device such as a desktop computer, a laptop computer, a tablet computer, etc. connected to a 3D printing device, or a client installed on these terminal devices. Of course, it can also be the 3D printing device itself. For the sake of ease of description, the following will only take the terminal device as an example of the execution entity to illustrate a lattice structure gradient printing method based on node cross-sections provided in this specification.

[0052] The terminal device may receive a print request for a target print object sent by a user. After receiving the print request, the terminal device may further obtain a dot matrix structure model of the target print object that is pre-built and uploaded.

[0053] In this specification, the target printed object can be an engineering component or an integral object. After obtaining the dot matrix structure model of the target printed object, the terminal device can further decompose the dot matrix structure model into a number of node cross-sectional areas and main body areas, thereby modeling the node cross-sectional areas and main body areas respectively. For ease of understanding, this specification provides a schematic diagram of the area division of the dot matrix structure model, such as Figure 2 shown.

[0054] Figure 2 A schematic diagram of the area division of a lattice structure model provided in this specification.

[0055] in, Figure 2 (Left) is the dot matrix structure model corresponding to the target print object, with a size of 25mm×25mm×25mm. Figure 2 (Right) is a structural unit of the lattice structure model of the target structural part. The node section area is used to characterize the area where the pillar node in the lattice structure is located. The main area is the area other than the node section area. Figure 2It can be seen that the node cross-sectional area is the node area that connects different main areas and is the key path for load transfer in the lattice structure. In addition, the cross-sectional dimensions of the node cross-sectional area change, which causes a larger stress concentration and strain gradient to be generated in this area in practical applications, resulting in the stress value borne by the node cross-sectional area being higher than the stress value borne by the main area.

[0056] In this specification, for each node cross-sectional area, the thickness of the node cross-sectional area may be twice the diameter of the lattice pillar where the cross-sectional area is located, that is, if the pillar diameter of the lattice is d and the thickness of the node cross-sectional area is H, then H=2d is satisfied.

[0057] In practical applications, there are many ways to determine the node cross-sectional area. Among them, the terminal device can use simulation software to simulate the force of the lattice structure model of the target structural member, and use the area where the stress value of the lattice structure model pillar exceeds the preset stress threshold as the node cross-sectional area. The preset area threshold can be set according to actual conditions, and this manual does not make specific restrictions on this.

[0058] In addition, the terminal device can also calculate the change value of the area of ​​the pillars of the lattice structure model, and use the area where the area change value exceeds the preset area threshold as the node interface area. The preset area change threshold can be set according to actual conditions, and this manual does not make specific restrictions on this.

[0059] Of course, the terminal device can also identify the areas where intersections occur in the pillars of the lattice structure model, the areas where the angles change significantly, or the connection areas of the pillars, and use these areas as node cross-sectional areas.

[0060] S103: Slicing the node cross-sectional area and the main body area respectively according to different slice thicknesses to obtain slice data, wherein the slice thickness corresponding to the slice in the node cross-sectional area is smaller than the slice thickness corresponding to the slice in the main body area.

[0061] The terminal device can slice the node cross-section area and the main body area respectively according to different slice thicknesses to obtain slice data.

[0062] Specifically, since the stress on the node cross-section area is relatively concentrated, a smaller slice thickness can be set for the node cross-section area, and low laser power and a smaller scanning interval can be used to induce the growth of grains in the pillar node area, and uniform and fine equiaxed crystals can be obtained to increase the proportion of grain boundaries. In addition, in order to ensure printing efficiency and reduce printing costs, the main area maintains the original slice thickness unchanged, so the slice thickness corresponding to the slice in the node cross-section area is smaller than the slice thickness corresponding to the slice in the main area.

[0063] In an embodiment provided in the present specification, the slice layer thickness of the node cross-section area can be less than or equal to 30 μm, and the slice layer thickness of the main body area can be greater than or equal to 50 μm and does not exceed the penetration depth of the sintered material powder by the 3D printing device at the maximum laser power parameters.

[0064] S104: Inputting the slice data into a 3D printing device, so that the 3D printing device can print slices in different areas in sequence from bottom to top according to the slice data to complete the gradient forming of the dot matrix and obtain the target printed object.

[0065] After obtaining the slice data, the terminal device can input it into the 3D printing device, and the 3D printing device can print each slice layer in sequence from bottom to top according to the slice thickness corresponding to each slice layer, so as to obtain the target printed object.

[0066] Among them, for each layer of slice, the 3D printing device can spread powder by a scraper according to the slice layer thickness corresponding to the slice, and then use a laser to sinter the printing material powder to form a preset pattern to form a printing layer corresponding to the slice.

[0067] In practical applications, each slice can be printed in sequence through the L-PBF process. For ease of understanding, this manual provides a schematic diagram of the slice printing method, such as Figure 3 shown.

[0068] Figure 3 This is a schematic diagram of a slice printing method provided in this manual.

[0069] For any printing layer N, the printing material powder of the layer is laid on the operating table in the 3D printing device, and then sintered into a preset pattern by laser. Then, the printing material powder of the N+1th layer is provided on the top of the N layer, and sintered into a preset pattern by laser. The above printing operation is repeated until the printing of the dot matrix node cross-section area and the main body area is completed, forming a complete dot matrix structure of the target printed object.

[0070] Furthermore, in the process of printing each printing layer, the terminal device can respectively determine the printing parameters corresponding to the node cross-sectional area and the printing parameters corresponding to the main body area, and then print each slice layer in sequence according to the printing parameters corresponding to the node cross-sectional area, the printing parameters corresponding to the main body area and the slice thickness corresponding to each slice layer.

[0071] Among them, the printing parameters corresponding to the node cross-sectional area and the printing parameters corresponding to the main body area include: laser power, scanning spacing, scanning speed, printing material powder layer thickness and protective gas type. The laser power corresponding to the node cross-sectional area is lower than the laser power corresponding to the main body area, and the scanning spacing corresponding to the node cross-sectional area is smaller than the scanning spacing corresponding to the main body area, thereby improving the structural strength of the node cross-sectional area while ensuring the original printing efficiency and printing cost of the main body area.

[0072] In addition, for each slice layer, the thickness of the printed material powder layer corresponding to the slice layer is equal to the slice thickness corresponding to the slice layer (that is, the slice layer thickness corresponding to the area where the slice layer is located).

[0073] In one embodiment provided in this specification, the printing parameters corresponding to the cross-sectional area of ​​the lattice node may be: laser power 220W, scanning spacing 60μm, scanning speed 1000mm / s, printing material powder layer thickness 25μm, and protective gas argon;

[0074] The printing parameters corresponding to the main area of ​​the dot matrix can be: laser power 380W, scanning spacing 120μm, scanning speed 1000mm / s, printing material powder layer thickness 55μm, and protective gas is argon.

[0075] It should be pointed out that although the present solution divides the node cross-sectional area and the main body area before printing, the node cross-sectional area and the main body area in the dot matrix structure of the target printed object actually printed are a tightly integrated whole, and there is no dividing line between different areas.

[0076] In existing methods, three-dimensional printing of composite material lattices is often achieved by adding reinforcing phase particles, multi-material gradient molding, etc., in order to enhance the deformation resistance of the lattice node area and achieve the regulation of the strength of the printed object. However, the difference in thermal expansion coefficients of different materials leads to stress concentration at the material interface, which is very easy to breed cracks and greatly affects the life of the parts. At the same time, multi-material molding has higher requirements for processing equipment, complex processes, and high processing difficulty, which limits the application of this technology in reality. In addition, the metal raw materials of multi-material molding are difficult to recycle and reuse, and cannot meet the sustainability requirements of green manufacturing.

[0077] Based on this, in an embodiment provided in this specification, the dot matrix node cross-sectional area and the dot matrix main body area are printed and formed using the same printing material powder. That is, the dot matrix node cross-sectional area and the dot matrix main body area are printed using the same printing material powder.

[0078] In another embodiment provided in this specification, the dot matrix node cross-sectional area and the dot matrix main body area are printed and formed using a single-component printing material powder, that is, the printing material powder used in the dot matrix node cross-sectional area and the dot matrix main body area is not a composite material.

[0079] The printing material powder used in the node cross-section area and the main body area includes metal powder having a face-centered cubic unit cell crystal structure.

[0080] In one embodiment provided in the present specification, the metal powder of the face-centered cubic unit cell may be an aluminum-magnesium-scandium-zirconium (AlMgScZr) alloy powder. In the printing material powder, the components and proportions contained therein may be: magnesium (Mg) element: 4.4-4.6%, scandium (Sc) element: 0.65-0.68%, zirconium (Zr) element: 0.38-0.42%, iron (Fe) element: 0-0.06%, oxygen (O) element: 0-0.1%, and the remaining elements are aluminum (Al) elements.

[0081] by Figure 2 For example, experiments were conducted using aluminum magnesium scandium zirconium as the printing material powder, so that the printing process parameters were set to the above-mentioned preset process parameters, the lattice cell size was set to 5 mm, the number of cells in each direction was set to 5, and the node section gradient forming method of the scheme was used for printing experiments to obtain a 25 mm × 25 mm × 25 mm lattice structure.

[0082] In addition, the present invention also provides a reference diagram of a conventional 3D printing method as a reference pattern, such as Figure 4 shown.

[0083] Figure 4 A reference figure of a conventional printing method provided in this specification.

[0084] from Figure 4 It can be seen that in the existing conventional printing scheme, each slice layer adopts a uniform slice thickness, and each slice layer adopts a uniform printing parameter for printing.

[0085] Furthermore, this specification provides a schematic diagram comparing the microstructure of the dot matrix node region obtained by a conventional printing method and the gradient printing method of this application, such as Figure 5 shown.

[0086] Figure 5 This is a schematic diagram comparing the microstructure of the lattice node area obtained by a conventional printing method and the gradient printing method of the present application provided in this specification.

[0087] in, Figure 5(Left) is a microstructure diagram obtained by conducting an experiment using a lattice sample based on node cross-section gradient forming disclosed in this application; Figure 5 (Right) is the microstructure diagram of the control sample obtained by the conventional printing method; it can be seen that compared with the conventional 3D printing method, the node section gradient forming method described in this scheme can significantly change the morphology of the grains and promote the transformation of columnar crystals to equiaxed crystals.

[0088] This specification also provides a grain size distribution statistical diagram obtained by using a conventional printing method and the gradient printing method of this application (such as Figure 6 ) and a schematic diagram comparing the average grain diameters obtained by using a conventional printing method and the gradient printing method of the present application (as shown in Figure 7 as shown).

[0089] Figure 6 This is a grain size distribution statistical graph obtained by using a conventional printing method and the gradient printing method of the present application provided in this specification.

[0090] Figure 7 This is a schematic diagram comparing the average grain diameters obtained by a conventional printing method and the gradient printing method of the present application provided in this specification.

[0091] in, Figure 6 (Left) is a statistical diagram of grain size distribution obtained by using the node cross-section-based gradient printing method of this application. Figure 6 (Right) is a statistical diagram of grain size distribution obtained by conventional printing method. Figure 6 and Figure 7 It can be seen that through the gradient printing method based on the node section of this scheme, the proportion of columnar crystals inside the sample can be reduced from 16% to 5%, and the average grain diameter can be reduced from 5.67μm to 2.82μm.

[0092] In addition, in order to further illustrate the effect of the present application on improving the structural strength, this specification also provides a schematic diagram comparing the stress-strain curve of the lattice quasi-static compression process obtained by the conventional printing method and the gradient printing method of the present application, and a schematic diagram comparing the lattice deformation obtained by the conventional printing method and the gradient printing method of the present application, as shown respectively. Figure 8 and Fig. 9 shown.

[0093] Figure 8 This is a schematic diagram for comparing stress-strain curves of a quasi-static compression process of a dot matrix obtained by a conventional printing method and a gradient printing method of the present application provided in this specification.

[0094] Fig. 9This is a schematic diagram comparing dot matrix deformation obtained by using a conventional printing method and the gradient printing method of the present application provided in this specification.

[0095] from Figure 8 and Fig. 9 It can be seen that the printing method of the present application to achieve a high-strength lattice structure through node cross-section gradient forming effectively enhances the lattice's ability to resist deformation at the nodes under compressive loads, delays the buckling of the lattice struts and the generation of cracks and fractures, and improves the strength of the aluminum-magnesium-scandium-zirconium lattice by more than 50%.

[0096] It can be seen from the above method that the printing method for realizing high-strength lattice structure through node cross-section gradient forming provided by the present invention is used to print the lattice structure, and a smaller slice thickness is set in the node cross-section area. At the same time, with low laser power and a smaller scanning interval, a finer equiaxed crystal induction can be achieved in the pillar node area compared to the main area, thereby increasing the proportion of grain boundaries, further enhancing the tolerance of dislocation accumulation in the node area during lattice failure, delaying the generation of cracks in the node area, and thus meeting the strength control requirements of the printed object, extending the service life, and enhancing reliability.

[0097] The above is one or more implementations of the present specification of the gradient printing method based on the node cross section. Based on the same idea, the present specification also provides a corresponding gradient printing device based on the node cross section, such as Fig.10 shown.

[0098] Fig.10 A schematic diagram of a gradient printing device based on a node section provided in this specification includes:

[0099] The receiving module 1001 is used to receive a print request for a target print object;

[0100] A decomposition module 1002 is used to obtain a dot matrix structure model of the target printed object according to the printing request, and decompose the dot matrix structure model into a plurality of node cross-sectional areas and a main body area, wherein the node cross-sectional area is used to characterize the area where the pillar node in the dot matrix structure is located, and the stress value borne by the node cross-sectional area is higher than that of the main body area;

[0101] A slicing module 1003 is used to slice the node cross-sectional area and the main body area respectively according to different slice thicknesses to obtain slice data, wherein the slice thickness corresponding to the slice in the node cross-sectional area is smaller than the slice thickness corresponding to the slice in the main body area;

[0102] The printing module 1004 is used to input the slice data into a 3D printing device, so that the 3D printing device can print slices in different areas in sequence from bottom to top according to the slice data to complete the gradient forming of the dot matrix and obtain the target printed object.

[0103] Optionally, for each node cross-sectional area, the thickness of the node cross-sectional area is twice the diameter of the lattice pillar where the cross-sectional area is located.

[0104] Optionally, the printing module 1004 is specifically used to input the slice data into a 3D printing device, so that each layer of slices is printed in sequence through the 3D printing device in a bottom-up order according to the printing parameters corresponding to the node cross-sectional area, the printing parameters corresponding to the main area, and the slice thickness corresponding to each layer of slices.

[0105] Optionally, the printing parameters corresponding to the node cross-sectional area and the printing parameters corresponding to the main body area include: laser power, scanning spacing, scanning speed, printing material powder layer thickness and protective gas type; wherein, the laser power corresponding to the node cross-sectional area is lower than the laser power corresponding to the main body area, and the scanning spacing corresponding to the node cross-sectional area is smaller than the scanning spacing corresponding to the main body area.

[0106] Optionally, the node cross-sectional area and the main body area are printed and formed using the same printing material powder; and / or

[0107] The node cross-sectional area and the main body area are printed and formed using a single-component printing material powder.

[0108] Optionally, the printing material powder used in the node cross-sectional area and the main body area includes metal powder having a face-centered cubic unit cell crystal structure.

[0109] Optionally, the printing material powder is an aluminum-magnesium-scandium-zirconium alloy, wherein the ratio of magnesium element in the aluminum-magnesium-scandium-zirconium alloy is 4.4-4.6%, the ratio of scandium element is 0.65-0.68%, the ratio of zirconium element is 0.38-0.42%, the ratio of iron element is 0-0.06%, the ratio of oxygen element is 0-0.1%, and the remaining elements are aluminum element.

[0110] This specification also provides a computer-readable storage medium, which stores a computer program, which can be used to execute the above Figure 1 A gradient printing method based on node cross-section is provided.

[0111] This manual also provides Fig.11 The one shown corresponds to Figure 1 A schematic diagram of the electronic device. Fig.11 As mentioned above, at the hardware level, the electronic device includes a processor, an internal bus, a network interface, a memory, and a non-volatile memory, and may also include other hardware required for the business. The processor reads the corresponding computer program from the non-volatile memory into the memory and then runs it to achieve the above Figure 1 The gradient printing method based on node cross-section. Of course, in addition to the software implementation, this specification does not exclude other implementations, such as logic devices or a combination of software and hardware, etc., that is, the execution subject of the following processing flow is not limited to each logic unit, but can also be hardware or logic devices.

[0112] For the improvement of a technology, it can be clearly distinguished whether it is a hardware improvement (for example, improvement of the circuit structure of diodes, transistors, switches, etc.) or a software improvement (improvement of the method flow). However, with the development of technology, many improvements of the method flow today can be regarded as direct improvements of the hardware circuit structure. Designers almost always obtain the corresponding hardware circuit structure by programming the improved method flow into the hardware circuit. Therefore, it cannot be said that the improvement of a method flow cannot be implemented with a hardware entity module. For example, a programmable logic device (PLD) (such as a field programmable gate array (FPGA)) is such an integrated circuit whose logical function is determined by the user's programming of the device. Designers can "integrate" a digital system on a PLD by programming themselves, without having to ask chip manufacturers to design and make dedicated integrated circuit chips. Moreover, nowadays, instead of manually making integrated circuit chips, this kind of programming is mostly implemented by "logic compiler" software, which is similar to the software compiler used when developing and writing programs, and the original code before compilation must also be written in a specific programming language, which is called hardware description language (HDL). There is not only one kind of HDL, but many kinds, such as ABEL (Advanced Boolean Expression Language), AHDL (Altera Hardware Description Language), Confluence, CUPL (Cornell University Programming Language), HDCal, JHDL (Java Hardware Description Language), Lava, Lola, MyHDL, PALASM, RHDL (Ruby Hardware Description Language), etc. The most commonly used ones are VHDL (Very-High-Speed ​​Integrated Circuit Hardware Description Language) and Verilog. Those skilled in the art should also know that it is only necessary to program the method flow slightly in the above-mentioned hardware description languages ​​and program it into the integrated circuit, and then it is easy to obtain the hardware circuit that implements the logic method flow.

[0113] The controller may be implemented in any suitable manner, for example, the controller may take the form of a microprocessor or processor and a computer-readable medium storing a computer-readable program code (e.g., software or firmware) executable by the (micro)processor, a logic gate, a switch, an application-specific integrated circuit (ASIC), a programmable logic controller, and an embedded microcontroller, examples of which include but are not limited to the following microcontrollers: ARC 625D, Atmel AT91SAM, Microchip PIC18F26K20, and Silicone Labs C8051F320, and the memory controller may also be implemented as part of the control logic of the memory. It is also known to those skilled in the art that, in addition to implementing the controller in a purely computer-readable program code manner, the controller may be implemented in the form of a logic gate, a switch, an application-specific integrated circuit, a programmable logic controller, and an embedded microcontroller by logically programming the method steps. Therefore, such a controller may be considered as a hardware component, and the devices for implementing various functions included therein may also be considered as structures within the hardware component. Or even, the devices for implementing various functions may be considered as both software modules for implementing the method and structures within the hardware component.

[0114] The systems, devices, modules or units described in the above embodiments may be implemented by computer chips or entities, or by products with certain functions. A typical implementation device is a computer. Specifically, the computer may be, for example, a personal computer, a laptop computer, a cellular phone, a camera phone, a smart phone, a personal digital assistant, a media player, a navigation device, an email device, a game console, a tablet computer, a wearable device, or a combination of any of these devices.

[0115] For the convenience of description, the above device is described by dividing it into various units according to its functions. Of course, when implementing this specification, the functions of each unit can be implemented in the same or multiple software and / or hardware.

[0116] Those skilled in the art will appreciate that the embodiments of this specification may be provided as methods, systems, or computer program products. Therefore, this specification may take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Moreover, this specification may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0117] This specification is described with reference to the flowcharts and / or block diagrams of the methods, devices (systems), and computer program products according to the embodiments of this specification. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0118] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0119] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process in the computer or other programmable device. Figure 1 A process or multiple processes and / or boxes Figure 1 A step that specifies a function in one or more boxes.

[0120] In a typical configuration, a computing device includes one or more processors (CPU), input / output interfaces, network interfaces, and memory.

[0121] The memory may include non-permanent storage in a computer-readable medium, random access memory (RAM) and / or non-volatile memory in the form of read-only memory (ROM) or flash RAM. The memory is an example of a computer-readable medium.

[0122] Computer readable media include permanent and non-permanent, removable and non-removable media that can be implemented by any method or technology to store information. Information can be computer readable instructions, data structures, program modules or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, compact disk read-only memory (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, magnetic tape disk storage or other magnetic storage devices or any other non-transmission media that can be used to store information that can be accessed by a computing device. As defined herein, computer readable media does not include temporary computer readable media (transitory media), such as modulated data signals and carrier waves.

[0123] It should also be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, commodity or device. In the absence of more restrictions, the elements defined by the sentence "comprises a ..." do not exclude the existence of other identical elements in the process, method, commodity or device including the elements.

[0124] It should be understood by those skilled in the art that the embodiments of this specification may be provided as methods, systems or computer program products. Therefore, this specification may take the form of a complete hardware embodiment, a complete software embodiment or an embodiment combining software and hardware. Moreover, this specification may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0125] This specification may be described in the general context of computer-executable instructions executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, etc. that perform specific tasks or implement specific abstract data types. This specification may also be practiced in distributed computing environments where tasks are performed by remote processing devices connected through a communication network. In a distributed computing environment, program modules may be located in local and remote computer storage media, including storage devices.

[0126] Each embodiment in this specification is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the system embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0127] The above description is only an embodiment of the present specification and is not intended to limit the present specification. For those skilled in the art, the present specification may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present specification shall be included in the scope of the claims of the present specification.

Claims

1. A method for printing gradient of lattice structure based on node cross section, characterized in that: include: receiving a print request for a target print product; According to the printing request, a dot matrix structure model of the target printed object is obtained, and the dot matrix structure model is decomposed into a plurality of node cross-sectional areas and a main body area, wherein the node cross-sectional area is used to characterize the area where the pillar nodes in the dot matrix structure are located, and the stress value borne by the node cross-sectional area is higher than that of the main body area; Slicing the node cross-sectional area and the main body area respectively according to different slice thicknesses to obtain slice data, wherein the slice thickness corresponding to the slice in the node cross-sectional area is smaller than the slice thickness corresponding to the slice in the main body area; The slicing data is input into a 3D printing device, so that the 3D printing device prints the slices in different areas in sequence from bottom to top according to the slicing data to complete the gradient forming of the dot matrix and obtain the target printed object, wherein the laser power when the node cross-sectional area is printed by the 3D printing device is lower than the laser power when the main body area is printed, and the scanning interval of the node cross-sectional area by the 3D printing device is smaller than the scanning interval of the main body area.

2. The method according to claim 1, characterized in that For each node cross-sectional area, the thickness of the node cross-sectional area is twice the diameter of the lattice pillar in the lattice structure model.

3. The method according to claim 1, characterized in that The slice data is input into a 3D printing device, so that each layer of slices is printed in sequence according to the slice thickness corresponding to each layer of slices by the 3D printing device in a bottom-up order, specifically including: The slice data is input into a 3D printing device so that each slice layer is printed in sequence by the 3D printing device in a bottom-up order according to the printing parameters corresponding to the node cross-section area, the printing parameters corresponding to the main body area, and the slice thickness corresponding to each slice layer.

4. The method according to claim 3, characterized in that The printing parameters corresponding to the node cross-sectional area and the printing parameters corresponding to the main body area include: laser power, scanning spacing, scanning speed, printing material powder layer thickness and protective gas type.

5. The method according to claim 1, characterized in that The node cross-sectional area and the main body area are printed and formed using the same printing material powder, wherein the printing material powder is a single-component printing material powder.

6. The method according to any one of claims 1 to 5, characterized in that The printing material powder used in the node cross-section area and the main body area includes metal powder having a face-centered cubic unit cell crystal structure.

7. The method according to claim 6, characterized in that The printing material powder is an aluminum-magnesium-scandium-zirconium alloy, wherein the ratio of magnesium element in the aluminum-magnesium-scandium-zirconium alloy is 4.4-4.6%, the ratio of scandium element is 0.65-0.68%, the ratio of zirconium element is 0.38-0.42%, the ratio of iron element is 0-0.06%, the ratio of oxygen element is 0-0.1%, and the remaining element is aluminum element.

8. A computer-readable storage medium, characterized in that: The storage medium stores a computer program, and when the computer program is executed by a processor, the method described in any one of claims 1 to 7 is implemented.

9. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the program, the method described in any one of claims 1 to 7 is implemented.

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