Design method of capacitive planarized fully fused silica micro-gyroscope

Abstract

The present invention relates to a design method for a capacitive planarized fully fused quartz structure micro-gyroscope. The structure of the micro-gyroscope is designed, including: determining the configuration of the micro-gyroscope, including a substrate and a structural layer, the structural layer being a planar structure; a groove is opened on one side of the substrate, and a boss is arranged at the center of the groove; on the structural layer, a central anchor point, a support beam, a resonant ring, a fixed electrode and a peripheral anchor point area are integrally formed from the center to the outside in sequence; a structural side wall with a high steepness and a capacitor gap with a high aspect ratio are provided between the resonant ring and the fixed electrode; when the substrate and the structural layer are assembled and combined, they are fixed by the boss and the central anchor point, and the periphery of the groove and the peripheral anchor point area; the support beam and the resonant ring are suspended on the groove; after the assembly is completed, a conductive film layer is deposited by an atomic layer deposition method, and then the conductive film layer is divided to form an effective capacitor. The design method proposed by the present invention can improve the overall performance of the micro-gyroscope and can realize wafer-level batch processing.

Description

Technical Field

[0001] The invention relates to the field of micro-electromechanical technology, and in particular to a design method for a capacitive planarized fully fused quartz structure micro-gyroscope. Background Art

[0002] A gyroscope is a sensor used to measure the angle or angular velocity of a moving carrier relative to inertial space, and is an important component of an inertial navigation system. MEMS (Micro Electro-Mechanical Systems) gyroscopes began to appear in the 1980s. Compared with optical gyroscopes and traditional mechanical rotor gyroscopes, MEMS gyroscopes have the characteristics of small size, low power consumption, mass production, and easy integration, and have a wide range of application prospects.

[0003] Relying on the relatively mature semiconductor industry foundation, silicon was selected as the material for preparing micro-electromechanical gyroscopes in the early days. However, due to the constraints of single-crystal silicon materials such as anisotropy, easy impurity defects, and large thermoelastic damping, it is difficult to meet the requirements of the future development of micro-electromechanical gyroscopes. Therefore, high-quality fused quartz materials are the ideal choice for making micro-gyroscopes.

[0004] The research results of micro-hemispherical gyroscope based on fused quartz material have verified the significant effect of the new material in improving the accuracy of the gyroscope. However, the processing technology of the micro-hemispherical structure is not compatible with the traditional planar MEMS process, and it is difficult to achieve wafer-level manufacturing like existing MEMS gyroscope products. Summary of the invention

[0005] Based on this, it is necessary to provide a capacitive planar fully fused quartz structure micro-gyroscope design method that can be planarized and effectively improve the accuracy of the micro-gyroscope in order to address the above technical problems.

[0006] A capacitive planarized fully fused quartz structure micro-gyroscope design method is provided, wherein the structure of the micro-gyroscope is designed, and the design method comprises: determining the configuration of the micro-gyroscope, including a substrate and a structural layer, wherein the structural layer is a planar structure;

[0007] A groove is provided on one side of the substrate, and a boss is provided at the center of the groove;

[0008] On the structural layer, a central anchor point, a support beam, a resonant ring, a fixed electrode and a peripheral anchor point area are arranged in sequence from the center to the outside; the central anchor point, the support beam, the resonant ring, the fixed electrode and the peripheral anchor point area are integrally formed; there is a structural sidewall with a high steepness and a capacitor gap with a high aspect ratio between the resonant ring and the fixed electrode;

[0009] When the substrate and the structural layer are assembled, they are fixed by the boss and the central anchor point, the periphery of the groove and the peripheral anchor point area; the support beam and the resonant ring are suspended on the groove;

[0010] After the assembly is completed, a conductive film layer is deposited on the resonant ring, the support beam and the fixed electrode by an atomic layer deposition method, and then the conductive film layer is divided to form an effective capacitor.

[0011] The above-mentioned capacitive planarized fully fused quartz structure micro-gyroscope design method adopts a planar structure design for the structural layer, and the overall manufacturing process is simpler; the central anchor point, support beam, resonant ring, fixed electrode and peripheral anchor point area are integrally formed in a way that reduces the connection points and potential weaknesses between components, reduces stress concentration, improves the accuracy and consistency of the entire micro-gyroscope, and can also reduce production difficulty and cost; designing a high-steepness structural sidewall and a high-aspect ratio capacitor gap between the resonant ring and the fixed electrode can better improve the sensitivity of the capacitor, ensure the detection accuracy of the capacitance change, and improve the detection sensitivity and response speed of the micro-gyroscope; in addition, the conductive film layer is deposited on the resonant ring, support beam and fixed electrode by atomic layer deposition, which can ensure the thickness uniformity and consistency of the capacitor layer, improve the accuracy of capacitance detection and the overall performance of the micro-gyroscope; then the deposited conductive film layer is segmented to help form a high-quality capacitor layer. The design method proposed by the present invention has the advantages of batch production and low cost, can realize wafer-level batch production, and has a large application prospect. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0013] Figure 1 is an axonometric diagram of a gyroscope in one embodiment;

[0014] Figure 2 is a cross-sectional view of a gyroscope in one embodiment;

[0015] Figure 3 An axonometric diagram of the connection between the resonant ring and the central anchor point in one embodiment;

[0016] Figure 4 An axonometric view of a first fixed electrode design in one embodiment;

[0017] Figure 5 An axonometric view of a second fixed electrode design in one embodiment;

[0018] Figure 6 is an axonometric view of a substrate in one embodiment;

[0019] Figure 7 A schematic diagram of a gyroscope processing and assembly process in one embodiment;

[0020] Figure 8 A schematic diagram of a fused silica wafer containing a plurality of gyroscopes in one embodiment.

[0021] Description of reference numerals:

[0022] Substrate 1, groove 11, boss 12, groove periphery 13, structural layer 2, central anchor point 21, support beam 22, resonant ring 23, fixed electrode 24, separation groove 241, conductive film layer 25, capacitor gap 26, peripheral anchor point area 27, structural layer disc 31, substrate layer disc 32.

[0023] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0026] In addition, in the present invention, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0027] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, a physical connection, or a wireless communication connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0028] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in the field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0029] The following will describe the implementation of the present invention in detail with reference to the accompanying drawings in the embodiment diagram of the present invention.

[0030] Example 1

[0031] The present embodiment discloses a design method for a capacitive planarized fully fused quartz structure micro-gyroscope, which mainly designs the structure of the micro-gyroscope. First, the structural layer 2 adopts a planar structural design, and the overall manufacturing process is simpler; then, the central anchor point 21, the support beam 22, the resonant ring 23, the fixed electrode 24 and the peripheral anchor point area 27 are processed in an integrated manner, which reduces the connection points and potential weaknesses between the components, reduces stress concentration, improves the accuracy and consistency of the entire micro-gyroscope, and can also reduce the difficulty and cost of production; a high-steepness structural side wall and a high-aspect-ratio capacitor gap are designed between the resonant ring 23 and the fixed electrode 24, which can better improve the sensitivity of the capacitor, ensure the detection accuracy of the capacitance change, and improve the detection sensitivity and response speed of the micro-gyroscope; finally, an atomic layer deposition method is used to deposit a conductive film layer on the resonant ring 23, the support beam 22 and the fixed electrode 24, which can ensure the thickness uniformity and consistency of the capacitor layer, improve the accuracy of capacitance detection and the overall performance of the micro-gyroscope; then the deposited conductive film layer is segmented, which helps to form a high-quality capacitor layer. The design method proposed in the present invention has the advantages of mass production, low cost and high precision, can realize wafer-level mass production, and has great application prospects.

[0032] The capacitive planarized fully fused quartz structure micro-gyroscope design method provided in this embodiment mainly designs the structure of the micro-gyroscope, referring to Figures 1 to 6, which is a structural design of one of the micro-gyroscopes provided in this embodiment. First, the configuration of the micro-gyroscope is determined. The micro-gyroscope includes a substrate 1 and a structural layer 2, and the structural layer 2 is a planar structure. A groove 11 is opened on one side of the substrate 1, and a boss 12 is arranged at the center of the groove 11. On the structural layer 2, a central anchor point 21, a support beam 22, a resonant ring 23, a fixed electrode 24 and a peripheral anchor point area 27 are arranged in sequence from the center to the outside; the central anchor point 21, the support beam 22, the resonant ring 23, the fixed electrode 24 and the peripheral anchor point area 27 are integrally formed; a structural side wall with a high steepness and a capacitor gap 26 with a high aspect ratio are provided between the resonant ring 23 and the fixed electrode 24. When the substrate 1 and the structural layer 2 are assembled and combined, they are fixed by the boss 12 and the central anchor point 21, and the groove periphery 13 and the peripheral anchor point area 27; the support beam 22 and the resonant ring 23 are suspended on the groove 11; after the assembly is completed, the conductive film layer 25 is deposited on the resonant ring 23, the support beam 22 and the fixed electrode 24 by atomic layer deposition, and then the conductive film layer 25 is divided to form an effective capacitor.

[0033] In the specific implementation process, the substrate 1 and the structural layer 2 are first selected. The substrate 1 and the structural layer 2 have the same shape and size, but the difference is that the substrate 1 is a thicker planar structure to facilitate the opening of grooves; the structural layer 2 is a thinner planar structure to facilitate etching. Both the substrate 1 and the structural layer 2 are made of fused quartz material, which can ensure the deformation consistency of each structure and avoid the mismatch of thermal expansion coefficients, which is helpful to improve the quality factor and performance accuracy of the micro gyroscope and improve the performance level of the gyroscope.

[0034] See also Figure 3 , is a schematic diagram of the connection between the resonant ring 23 and the central anchor point 21, the central anchor point 21 is circular, the resonant ring 23 is an annular structure spaced apart on the central anchor point 21, and the resonant ring 23 and the central anchor point 21 are connected by a support beam 22. The support beam 22 adopts a honeycomb topology support beam, which can effectively reduce the radial stiffness of the resonant ring, thereby reducing the required maximum driving voltage. At the same time, the combined design of the central anchor point 21, the honeycomb topology support beam and the resonant ring 23 can ensure the normal stiffness, suppress the out-of-plane modal component of the gyroscope, reduce energy dissipation, and improve the overall performance level. It is worth noting that the shapes of the central anchor point 21 and the resonant ring 23 can also be set according to needs, and are not limited to the shapes shown in this embodiment.

[0035] See also Figure 4 , is the design of the fixed electrode 24. The fixed electrode 24 is arranged at intervals along the annular direction on the periphery of the resonant ring 23, and one end of the side wall is adjacent to the resonant ring 23, forming a high steepness structural side wall and a high aspect ratio capacitor gap 26 between the resonant ring 23; the other end of the side wall is close to the peripheral anchor point area 27. It is worth noting that the fixed electrode 24 can be as follows Figure 4As shown, the peripheral anchor point area 27 is in a semi-connected state, and each fixed electrode 24 is separated by a separation groove 241. Compared with the capacitor gap, the separation groove has a larger width, which can avoid the limitation of a larger laser spot diameter and realize the scanning and segmentation of the conductive film layer by the femtosecond laser; the shape of the separation groove 241 can be designed according to the situation, and this embodiment adopts a "T"-shaped groove. It can also be as shown in FIG. Figure 5 As shown, each fixed electrode 24 is completely separated by splitting. Such a design can avoid the problem that the side conductive film layer cannot be completely separated due to process factors.

[0036] It is worth mentioning that Figure 4 and Figure 5 The fixed electrode 24 structures shown are all formed integrally with other structures on the structural layer 2 . Figure 4 The fixed electrode 24 structure shown is formed by directly using a laser-assisted wet etching method to integrally form a central anchor point 21, a support beam 22, a resonant ring 23, a fixed electrode 24 and a peripheral anchor point area 27 on the structural layer 2. Figure 5 The fixed electrode 24 structure shown is obtained by integrally forming a central anchor point 21, a support beam 22, a resonant ring 23, a fixed electrode 24 and a peripheral anchor point area 27 on the structural layer 2 using a laser-assisted wet etching method, and then cutting the fixed electrode 24 using an invisible cutting technology to completely separate each fixed electrode 24, thereby realizing the independent distribution of multiple fixed electrodes.

[0037] It can be understood that the highly steep structural sidewalls and the high aspect ratio capacitor gap 26 between the resonant ring 23 and the fixed electrode 24 can help increase the capacitance change and reduce the parasitic effects in the electric field; and the one-piece molding manufacturing method can reduce dimensional errors caused by separate processing and then assembly, ensure that the capacitance characteristics of each component remain consistent, enhance the mechanical stability of the microstructure, and help improve the consistency of the device and the yield of mass production.

[0038] See also Figure 6 The substrate 1 is a planar structure with a certain thickness. A groove 11 with a boss 12 in the center is opened on one side of the plane of the substrate 1. The shape of the groove 11 is adapted to the resonant ring 23, so as to accommodate the suspension of the resonant ring 23. During assembly, the substrate 1 is coaxially stacked with the formed structural layer 2, the central anchor point 21 is coaxially fixed on the boss 12, and the peripheral area of ​​the central anchor point 21 is suspended on the groove 11, the support beam 22 and the resonant ring 23 are completely suspended on the groove 11, the fixed electrode 24 is suspended on the groove 11 near the resonant ring 23, and the peripheral anchor area 27 is coaxially fixed away from the resonant ring 23. In this way, the resonant ring can be moved, and the film layer on the lower surface of the fixed electrode 24 is easy to split.

[0039] Since the fused quartz material itself is not conductive, it is necessary to deposit a conductive film layer 25 on the surface of the resonant ring 23, the support beam 22 and the fixed electrode 24. The gyroscope made by the present invention has a highly steep structural sidewall and a capacitor gap with a high aspect ratio. It is difficult to produce a conductive film layer with excellent effect by conventional deposition methods. The present invention deposits the conductive film layer 25 by atomic layer deposition, and multiple cycles of gas molecules containing film elements are chemically reacted on the surface of fused quartz to deposit atoms layer by layer to achieve the growth of the film layer. The atomic layer deposition method has good step coverage ability and can form a film layer of uniform thickness on the outer surface of the structure. At the same time, since the gas molecules are pervasive, the film layer deposition can also be achieved for the sidewall of the capacitor gap with a high aspect ratio, and the uniformity of the film layer thickness is good, which further ensures the accuracy level of the micro gyroscope designed by the present invention. The material of the conductive film layer 25 can be oxide, nitride or metal, and further, aluminum zinc oxide (AZO) or indium tin oxide (ITO) or titanium nitride (TiN) or platinum (Pt) can be used.

[0040] In addition, in order to drive the resonant ring 23 in a certain direction, the conductive area of ​​the structural layer 2 needs to be divided to form a plurality of independent fixed electrodes 24 with electrical disconnection distributed circumferentially, thereby forming an effective capacitor with the resonant ring 23. The conductive area division is achieved by femtosecond laser cutting, such as Figure 2 As shown, the cut portion includes the upper and lower surfaces of the connection between the suspended fixed electrode 24 and the peripheral anchor area 27 and the conductive film layers of the two side walls. Specifically, when the conductive film layer is a transparent film layer such as zinc aluminum oxide (AZO), indium tin oxide (ITO) or titanium nitride (TiN), the film layer on the lower side of the suspended fixed electrode 24 can be cut from the upper surface of the micro-gyroscope by changing the position of the laser focus on the Z axis; when the conductive film layer is an opaque film layer such as platinum (Pt), the film layer can be cut from the lower surface of the micro-gyroscope by using the optical transmission characteristics of the fused quartz material from the substrate 1 side to the lower surface of the suspended fixed electrode 24.

[0041] In addition, when the fixed electrode 24 is Figure 5 In the structure shown in FIG. 1 , the conductive film layers of the upper and lower surfaces and the two side walls of the connection between the fixed electrode 24 and the peripheral anchor area 27 are cut by combining the surface film layer segmentation and the invisible cutting method. Specifically, after the conductive film layer 25 is deposited on the surfaces of the resonant ring 23, the support beam 22 and the fixed electrode 24 by the atomic layer deposition method, the conductive area is first divided by the surface film layer segmentation method, and then the invisible cutting method is used to completely separate each fixed electrode 24 from the peripheral anchor area 27, so as to realize the independent distribution of multiple fixed electrodes 24 and form an effective capacitor.

[0042] The substrate 1, the resonant ring 23 and the structural layer 2 are made of the same fused quartz material, in order to avoid residual stress caused by mismatch of thermal expansion coefficients, reduce energy loss in the vibration process, and improve the quality factor of the resonant ring 23. When the two are fixed, they are connected by a combination of direct bonding and laser welding, which can ensure the connection strength and avoid the introduction of additional media. Specifically, first, the two discs where the structural layer 2 and the substrate 1 are located are tightly attached by direct bonding to meet the weld gap requirements of laser welding. There is no need to press again during welding, which ensures the uniformity of the gap and is conducive to improving the flatness of the disc. Then, the femtosecond laser welding method is used to weld the joint surfaces of the structural layer 2 and the substrate 1 into one in the specified area, so that it has a higher connection strength and no additional connection medium is required.

[0043] In one embodiment, the design method of the capacitive planarized fully fused quartz structure micro-gyroscope provided by the present invention also includes a preparation method, referring to Figure 7 , the preparation method comprises the following steps:

[0044] Step 301, taking a fused quartz disc as a structural layer, and using laser to irradiate the contours of the resonant ring, fixed electrode, support beam and central anchor point on the structural layer.

[0045] Step 302, take another thicker fused quartz disc as a substrate, and make a circular groove with a boss in the center of a specific size by wet etching, laser surface cutting or mechanical milling.

[0046] Step 303, align and fit the structural layer in step 301 with the substrate of the annular groove in step 302, and fix the two discs by bonding and laser welding to form an assembly; the fixed area is the lower surface of the central anchor area and the upper surface of the boss in the center of the groove, as well as the peripheral anchor area and the periphery of the groove; the fixed structure is placed in a hydrofluoric acid solution for wet etching to form a resonant ring, a fixed electrode, a honeycomb topology support beam, a central anchor point and a capacitor gap.

[0047] Step 304 , using atomic layer deposition to deposit a conductive film layer on all outer surfaces and gaps of the assembly in step 303 .

[0048] Step 305, using laser to sequentially irradiate the connection part between the fixed electrode and its peripheral anchor point area, completely cutting the upper and lower surfaces of the two parts and the conductive film layer of the side wall, so that the electrodes are electrically disconnected, forming the driving electrode and the detection electrode, and completing the production of the capacitive fused quartz micro gyroscope.

[0049] Furthermore, multiple capacitive fused quartz micro-gyroscopes can be prepared through the structure layer wafer 31 and the substrate layer wafer 32 to achieve wafer-level batch production. Figure 8 When mass production is realized, the steps are the same as those for a single capacitive fused quartz micro-gyroscope, except that: in step 301, multiple resonant rings, fixed electrodes, support beams and central anchor points are irradiated with lasers on the structure layer disc 31 at the same time; in step 302, multiple annular groove substrates with central bosses are opened on the substrate layer disc 32. The remaining preparation steps are the same and will not be described in detail here. After completing step 305, the fused quartz disc assembly is cut according to the outer contour of the gyroscope to obtain multiple capacitive fused quartz micro-gyroscopes.

[0050] Although this embodiment Figure 1 The steps in the process are shown in sequence as indicated by the arrows, but the steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified in this document, there is no strict order restriction for the execution of the steps, and the steps can be executed in other orders. Figure 1 At least part of the steps may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily executed at the same time, but can be executed at different times. The execution order of these sub-steps or stages is not necessarily sequential, but can be executed in turn or alternately with other steps or at least part of the sub-steps or stages of other steps.

[0051] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0052] The above-mentioned embodiments only express several implementation modes of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the invention. It should be pointed out that, for a person of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the attached claims.

Claims

1. A design method for a capacitive planarized fully fused quartz micro-gyroscope, characterized in that: The structure of the micro-gyroscope is designed, and the design method includes: determining the configuration of the micro-gyroscope, including a substrate and a structural layer, wherein the structural layer is a planar structure; A groove is provided on one side of the substrate, and a boss is provided at the center of the groove; On the structural layer, a central anchor point, a support beam, a resonant ring, a fixed electrode and a peripheral anchor point area are arranged in sequence from the center to the outside; the central anchor point, the support beam, the resonant ring, the fixed electrode and the peripheral anchor point area are integrally formed; there is a structural sidewall with a high steepness and a capacitor gap with a high aspect ratio between the resonant ring and the fixed electrode; When the substrate and the structural layer are assembled, they are fixed by the boss and the central anchor point, the periphery of the groove and the peripheral anchor point area; the support beam and the resonant ring are suspended on the groove; After the assembly is completed, a conductive film layer is deposited on the resonant ring, the support beam and the fixed electrode by an atomic layer deposition method, and then the conductive film layer is divided to form an effective capacitor; The substrate and the structural layer are made of fused quartz material.

2. The method for designing a capacitive planarized fully fused quartz micro-gyroscope according to claim 1, characterized in that: The support beam adopts a honeycomb topology support beam.

3. The method for designing a capacitive planarized fully fused quartz micro-gyroscope according to claim 2, characterized in that: The central anchor point, the support beam, the resonant ring, the fixed electrode and the peripheral anchor point area are integrally formed on the structural layer by a laser-assisted wet etching method.

4. The method for designing a capacitive planarized fully fused quartz micro-gyroscope according to any one of claims 1 to 3, characterized in that: The central anchor point is partially suspended on the boss, and the peripheral anchor point area is partially suspended on the periphery of the groove.

5. The method for designing a capacitive planarized fully fused quartz micro-gyroscope according to claim 4, characterized in that: When the substrate and the structural layer are assembled, the fixing method is a combination of direct bonding and laser welding.

6. The method for designing a capacitive planarized fully fused quartz micro-gyroscope according to any one of claims 1 to 3, characterized in that: After depositing a conductive film layer on the resonant ring, the support beam and the fixed electrode by an atomic layer deposition method, the conductive film layer is then divided to form an effective capacitor, including: Depositing a conductive film layer on the surfaces of the resonant ring, the support beam and the fixed electrode by atomic layer deposition; The conductive film layers of the upper and lower surfaces and two side walls of the connection between the fixed electrode and the peripheral anchor point area are cut so that the surface film layer of the fixed electrode forms a plurality of independent fixed electrodes, thereby forming an effective capacitor with the resonant ring.

7. The method for designing a capacitive planarized fully fused quartz micro-gyroscope according to any one of claims 1 to 3, characterized in that: Depositing a conductive film layer on the resonant ring, the support beam and the fixed electrode by an atomic layer deposition method, and then dividing the conductive film layer to form an effective capacitor, including: Depositing a conductive film layer on the surfaces of the resonant ring, the support beam and the fixed electrode by atomic layer deposition; The conductive film layers of the upper and lower surfaces and two side walls where the fixed electrode and the peripheral anchor area are connected are cut by combining surface film layer segmentation with invisible cutting, so that the surface film layer of the fixed electrode forms a plurality of independent fixed electrodes, thereby forming an effective capacitor with the resonant ring.

8. The method for designing a capacitive planarized fully fused quartz micro-gyroscope according to any one of claims 1 to 3, characterized in that: The conductive film layer is made of oxide, nitride or metal.

9. The method for designing a capacitive planarized fully fused quartz micro-gyroscope according to claim 1, characterized in that: Also included is a preparation method, the preparation method comprising the following steps: Step 301, taking a fused quartz disc as a structural layer, and using laser to irradiate the contours of the resonant ring, fixed electrode, support beam and central anchor point on the structural layer; Step 302, taking another thicker fused quartz disc as a substrate, and making a circular groove with a central boss of a specific size by wet etching or laser surface cutting or mechanical milling; Step 303, aligning and closely attaching the structural layer in step 301 and the substrate of the annular groove in step 302, fixing the two discs by bonding and laser welding to form an assembly; the fixed area is the lower surface of the central anchor point area and the upper surface of the boss at the center of the groove, as well as the peripheral anchor point area and the periphery of the groove; placing the fixed structure in a hydrofluoric acid solution for wet etching to form a resonant ring, a fixed electrode, a honeycomb topology support beam, a central anchor point and a capacitor gap; Step 304, using atomic layer deposition to deposit a conductive film layer on all outer surfaces and gaps of the assembly in step 303; Step 305, using laser to sequentially irradiate the connection part between the fixed electrode and its peripheral anchor point area, completely cutting the upper and lower surfaces of the two parts and the conductive film layer of the side wall, so that the electrodes are electrically disconnected, forming the driving electrode and the detection electrode, and completing the production of the capacitive fused quartz micro gyroscope.

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