A double-layer vacuum hot pressing forming equipment with adjustable parallelism

Abstract

The present invention provides a double-layer vacuum hot pressing molding device with adjustable parallelism, comprising a frame, the frame comprising a base and a guide column, an upper fixed mounting seat fixedly mounted on the upper end of the guide column, a middle lifting mounting seat and a lower lifting mounting seat both slidably mounted on the guide column, a middle ejector mechanism mounted on the middle lifting mounting seat, and capable of lifting up a wafer carried on the middle lifting mounting seat, a lower ejector mechanism mounted on the lower lifting mounting seat, and capable of lifting up a wafer carried on the lower lifting mounting seat, and also comprising a parallelism adjustment mechanism, the parallelism adjustment mechanism comprising a middle parallelism adjustment mechanism for adjusting the parallelism of the middle lifting mounting seat and a lower parallelism adjustment mechanism for adjusting the parallelism of the lower lifting mounting seat. The present invention can adjust the parallelism of the middle lifting mounting seat and the parallelism of the lower lifting mounting seat, and the cost is low.

Description

Technical Field

[0001] The invention relates to the technical field of electronic circuit protection, and in particular to a double-layer vacuum hot pressing molding device with adjustable parallelism. Background Art

[0002] Vacuum hot pressing molding equipment is an irreplaceable electronic circuit protection material molding equipment in the electronics industry. It is widely used in many fields such as semiconductor device packaging, optoelectronic device packaging, and various printed circuit board (PCB) manufacturing and the molding of their protective materials.

[0003] In recent years, in the field of wafer packaging, some foreign companies have made some useful explorations on the use of vacuum hot pressing equipment and processes to coat semiconductor patterned wafers (reference patents: KR1020170019610, KR1020140009578, etc.); in addition, in the field of thin PCB (Thin PCB) production, some foreign companies have also tried to use vacuum hot pressing equipment and processes to obtain the protective film used in the packaging production process of thin PCB (Thin PCB).

[0004] With the continuous expansion of the application scope of vacuum hot pressing forming equipment and processes in the above two fields, some double-layer vacuum hot pressing forming equipment (such as patents CN201710852076, CN201721820850, CN201921598762, CN202122661314, CN202223134171, CN202323381830, TW99201749U, etc.) have also appeared in China. They are mainly composed of a frame, an upper template, a middle template, a lower template, a vacuum system, a molding mold heating plate, a hydraulic control system and an electronic control system. Among them, a first molding area is formed between the upper template and the middle template for laminating the upper electronic circuit, and a second molding area is formed between the middle template and the lower template for laminating the lower electronic circuit.

[0005] If the existing vacuum hot pressing molding equipment with a double-layer hot pressing molding structure operates in a high temperature or high pressure environment for a long time, it will be affected by repeated operation, temperature, etc., and the parallelism of the template will change over time. The change in the parallelism of the template will cause the molded electronic components to be processed into defective products, thereby causing huge economic losses.

[0006] For example, in the technical solutions such as Korean patents KR1020170019610 and KR1020140009578, a servo motor is used to drive a reducer with a large reduction ratio to rotate, thereby driving a nut engaged with a threaded load-bearing rod to rotate to adjust the length of the load-bearing rod, thereby adjusting the parallelism of the template. However, this method is limited by the pitch of the engaged thread, and the connection strength and adjustment accuracy of the load-bearing rod cannot be achieved at the same time, resulting in a poor adjustment effect. Moreover, this method is costly and is applied to vacuum hot pressing molding equipment with a single-layer hot pressing molding structure, with low production efficiency and large footprint, and its actual application will be greatly limited.

[0007] Therefore, developing a double-layer hot pressing molding structure, low cost and vacuum hot pressing molding equipment with adjustable template parallelism is an urgent problem to be solved at this stage. Summary of the invention

[0008] In response to the technical problems raised above, a double-layer vacuum hot pressing forming device with adjustable parallelism is provided.

[0009] The technical means adopted by the present invention are as follows:

[0010] A double-layer vacuum hot pressing molding equipment with adjustable parallelism comprises: a frame; the frame comprises a base and a guide column mounted on the base, the guide column is provided with a plurality of guide columns and its axis is perpendicular to the horizontal plane; an upper fixed mounting seat; the upper fixed mounting seat is fixedly mounted on the upper end of the guide column; a middle lifting mounting seat; the middle lifting mounting seat is mounted on the guide column and can be moved along the axis direction of the guide column, the middle lifting mounting seat is located directly below the upper fixed mounting seat and can carry a wafer; a lower lifting mounting seat; the lower lifting mounting seat is mounted on the guide column and can be moved along the axis direction of the guide column, the lower lifting mounting seat is located directly below the middle lifting mounting seat and can carry Wafer carrier; middle-layer ejector mechanism; the middle-layer ejector mechanism is installed on the middle-layer lifting mount, and can lift the wafer carried on the middle-layer lifting mount; lower-layer ejector mechanism; the lower-layer ejector mechanism is installed on the lower-layer lifting mount, and can lift the wafer carried on the lower-layer lifting mount; parallelism adjustment mechanism; the parallelism adjustment mechanism includes a middle-layer parallelism adjustment mechanism for adjusting the parallelism of the middle-layer lifting mount and a lower-layer parallelism adjustment mechanism for adjusting the parallelism of the lower-layer lifting mount, the middle-layer lifting mount is installed on the guide column through the middle-layer parallelism adjustment mechanism, and the lower-layer lifting mount is installed on the guide column through the lower-layer parallelism adjustment mechanism.

[0011] Furthermore, the middle-layer parallelism adjustment mechanism includes a middle-layer guide sleeve and a middle-layer adjusting sleeve; the middle-layer guide sleeve is fixedly mounted on the middle-layer lifting mounting seat and is sleeved outside the guide column, a middle-layer guide spiral surface is provided on one end face of the middle-layer guide sleeve, the middle-layer adjustment sleeve is sleeved outside the guide column and can rotate around the axis of the guide column, a middle-layer adjustment spiral surface is provided on one end face of the middle-layer adjustment sleeve, and the middle-layer guide spiral surface is fitted with the middle-layer adjustment spiral surface; the lower-layer parallelism adjustment mechanism includes a lower-layer guide sleeve and a lower-layer adjusting sleeve; the lower-layer guide sleeve is fixedly mounted on the lower-layer lifting mounting seat and is sleeved outside the guide column, a lower-layer guide spiral surface is provided on one end face of the lower-layer guide sleeve, the lower-layer adjustment sleeve is sleeved outside the guide column and can rotate around the axis of the guide column, a lower-layer adjustment spiral surface is provided on one end face of the lower-layer adjustment sleeve, and the lower-layer guide spiral surface is fitted with the lower-layer adjustment spiral surface.

[0012] Furthermore, a middle-layer scale is arranged on the outer wall of the middle-layer guide sleeve along its circumferential direction, and a middle-layer pointer matching the middle-layer scale is fixedly installed on the middle-layer adjustment sleeve; a lower-layer scale is arranged on the outer wall of the lower-layer guide sleeve along its circumferential direction, and a lower-layer pointer matching the lower-layer scale is fixedly installed on the lower-layer adjustment sleeve.

[0013] Furthermore, the middle-layer ejector mechanism includes a middle-layer active ejector mechanism; the middle-layer active ejector mechanism includes a middle-layer motor, a middle-layer active nut shaft, a middle-layer active anti-rotation guide column, a middle-layer active sliding screw and a middle-layer active ejector; the middle-layer motor is installed on the middle-layer lifting mounting seat, the middle-layer active nut shaft is installed in the middle-layer lifting mounting seat and can rotate around its axis driven by the middle-layer motor, and the middle-layer active anti-rotation guide column is fixedly installed on the middle-layer lifting mounting seat and coaxially installed in the middle-layer active nut shaft The middle-layer active sliding screw is coaxially provided with a middle-layer active anti-rotation guide column channel, the outer wall of the middle-layer active sliding screw is threadedly matched with the inner wall of the middle-layer active nut shaft, the side wall of the middle-layer active anti-rotation guide column channel is in contact with the side wall of the middle-layer active anti-rotation guide column, the middle-layer active sliding screw can move along the axial direction of the middle-layer active anti-rotation guide column, the middle-layer active ejector pin is coaxially installed on the middle-layer active sliding screw and can move the wafer carried on the middle-layer lifting mounting seat under the drive of the middle-layer active sliding screw The lower ejector mechanism includes a lower active ejector mechanism; the lower active ejector mechanism includes a lower motor, a lower active nut shaft, a lower active anti-rotation guide column, a lower active sliding screw and a lower active ejector; the lower motor is mounted on a lower lifting mounting seat, the lower active nut shaft is mounted in the lower lifting mounting seat and can rotate around its axis driven by the lower motor, the lower active anti-rotation guide column is fixedly mounted on the lower lifting mounting seat and coaxially mounted in the lower active nut shaft, the A lower active anti-rotation guide column channel is coaxially opened in the lower active sliding screw, the outer wall of the lower active sliding screw is threadedly matched with the inner wall of the lower active nut shaft, the side wall of the lower active anti-rotation guide column channel is in contact with the side wall of the lower active anti-rotation guide column, the lower active sliding screw can move along the axial direction of the lower active anti-rotation guide column, the lower active ejector pin is coaxially installed on the lower active sliding screw and can lift the wafer carried on the lower lifting mount under the drive of the lower active sliding screw.

[0014] Furthermore, the middle-layer ejector mechanism also includes a middle-layer driving gear, a middle-layer transmission gear and a middle-layer driven ejector mechanism installed on the middle-layer lifting mounting seat; the middle-layer driving gear is coaxially installed on the middle-layer driving nut shaft and can rotate around its axis under the drive of the middle-layer driving nut shaft, and the middle-layer driven ejector mechanism includes a middle-layer driven gear, a middle-layer driven nut shaft, a middle-layer driven anti-rotation guide column, a middle-layer driven sliding screw and a middle-layer driven ejector; the middle-layer transmission gear is meshed with the middle-layer driving gear, the middle-layer driven gear is meshed with the middle-layer transmission gear and is coaxially installed on the middle-layer driven nut shaft, the middle-layer driven nut shaft is installed in the middle-layer lifting mounting seat and can rotate around its axis. The middle-layer driven anti-rotation guide column rotates around its axis under the drive of the driven gear, and the middle-layer driven anti-rotation guide column is fixedly mounted on the middle-layer lifting mounting seat and coaxially mounted in the middle-layer driven nut shaft; a middle-layer driven anti-rotation guide column channel is coaxially opened in the middle-layer driven sliding screw, and the outer wall of the middle-layer driven sliding screw is threadedly matched with the inner wall of the middle-layer driven nut shaft, and the side wall of the middle-layer driven anti-rotation guide column channel is in contact with the side wall of the middle-layer driven anti-rotation guide column; the middle-layer driven sliding screw can move along the axial direction of the middle-layer driven anti-rotation guide column, and the middle-layer driven ejector pin is coaxially mounted on the middle-layer driven sliding screw and can move the wafer carried on the middle-layer lifting mounting seat under the drive of the middle-layer driven sliding screw. The lower ejector mechanism also includes a lower driving gear, a lower transmission gear and a lower driven ejector mechanism installed on the lower lifting mounting seat; the lower driving gear is coaxially installed on the lower driving nut shaft and can rotate around its axis under the drive of the lower driving nut shaft, and the lower driven ejector mechanism includes a lower driven gear, a lower driven nut shaft, a lower driven anti-rotation guide column, a lower driven sliding screw and a lower driven ejector; the lower transmission gear is meshed with the lower driving gear, the lower driven gear is meshed with the lower transmission gear and is coaxially installed on the lower driven nut shaft, the lower driven nut shaft is installed in the lower lifting mounting seat and can rotate around its axis under the drive of the lower driving nut shaft The lower driven anti-rotation guide column is coaxially arranged on the lower driven sliding screw and is provided with a lower driven anti-rotation guide column channel coaxially therein. The outer wall of the lower driven sliding screw is threadedly matched with the inner wall of the lower driven nut shaft. The side wall of the lower driven anti-rotation guide column channel is fitted with the side wall of the lower driven anti-rotation guide column. The lower driven sliding screw can move along the axial direction of the lower driven anti-rotation guide column. The lower driven ejector pin is coaxially arranged on the lower driven sliding screw and can lift the wafer carried on the lower lifting mount under the drive of the lower driven sliding screw.

[0015] Furthermore, it also includes an upper hot pressing molding mold; the upper hot pressing molding mold includes an upper hot pressing molding upper template and an upper hot pressing molding lower template, the upper hot pressing molding upper template is installed on the bottom surface of the upper fixed mounting seat, the upper hot pressing molding lower template is installed on the top surface of the middle lifting mounting seat, the upper hot pressing molding lower template is located directly below the upper hot pressing molding upper template, and the middle lifting mounting seat carries the wafer through the upper hot pressing molding lower template; an upper vacuum sealing ring that can accommodate the wafer is arranged between the upper hot pressing molding upper template and the upper hot pressing molding lower template, the two end surfaces of the upper vacuum sealing ring can be respectively fitted with the bottom surface of the upper hot pressing molding upper template and the top surface of the upper hot pressing molding lower template, an upper vacuum channel is opened in the upper hot pressing molding lower template, one end of the upper vacuum channel is connected to the upper vacuum sealing ring, and the other end of the upper vacuum channel is connected to an upper vacuum pump.

[0016] Furthermore, it also includes a lower hot pressing molding mold; the lower hot pressing molding mold includes a lower hot pressing molding upper template and a lower hot pressing molding lower template, the lower hot pressing molding upper template is installed on the bottom surface of the middle-level lifting mounting seat, the lower hot pressing molding lower template is installed on the top surface of the lower lifting mounting seat, the lower hot pressing molding lower template is located directly below the lower hot pressing molding upper template, and the lower lifting mounting seat carries the wafer through the lower hot pressing molding lower template; a lower vacuum sealing ring that can accommodate the wafer is arranged between the lower hot pressing molding upper template and the lower hot pressing molding lower template, the two end surfaces of the lower vacuum sealing ring can be respectively fitted with the bottom surface of the lower hot pressing molding upper template and the top surface of the lower hot pressing molding lower template, a lower vacuum channel is opened in the lower hot pressing molding lower template, one end of the lower vacuum channel is connected to the lower vacuum sealing ring, and the other end of the lower vacuum channel is connected to a lower vacuum pump.

[0017] Furthermore, it also includes a double-layer single-arm transport mechanism; the double-layer single-arm transport mechanism includes a manipulator mounting base plate, a cylinder, a linear motion module and a double-layer single-arm transport manipulator; the fixed end of the cylinder is mounted on the manipulator mounting base plate, the telescopic end of the cylinder is mounted on the guide rail of the linear motion module, and the double-layer single-arm transport manipulator is mounted on the slider of the linear motion module, the telescopic direction of the cylinder is perpendicular to the horizontal plane, and the length direction of the linear motion module is parallel to the horizontal plane, and the double-layer single-arm transport manipulator is provided with an upper vacuum adsorption gripper and a lower vacuum adsorption gripper, and the upper vacuum adsorption gripper and the lower vacuum adsorption gripper can be moved simultaneously to between the upper hot pressing forming upper template and the upper hot pressing forming lower template and between the lower hot pressing forming upper template and the lower hot pressing forming lower template under the drive of the cylinder and the linear motion module.

[0018] Compared with the prior art, the present invention has the following advantages:

[0019] 1. In the present invention, when the parallelism of the middle-layer lifting mount changes, the parallelism of the middle-layer lifting mount can be adjusted by adjusting the middle-layer parallelism adjustment mechanism, so that the parallelism of the middle-layer lifting mount meets the production requirements. Similarly, when the parallelism of the lower-layer lifting mount changes, the parallelism of the lower-layer lifting mount can be adjusted by adjusting the lower-layer parallelism adjustment mechanism, so that the parallelism of the lower-layer lifting mount meets the production requirements, thereby avoiding the electronic components molded by the present invention being processed into defective products due to the change of the parallelism of the middle-layer lifting mount or the parallelism of the lower-layer lifting mount, thereby avoiding economic losses. At the same time, the present invention is a double-layer hot pressing molding structure, which also has the advantages of high production efficiency and small footprint.

[0020] 2. In the present invention, when the parallelism of the middle-layer lifting mount changes, the middle-layer adjusting sleeve is rotated to make the middle-layer adjusting spiral surface rotate around the axis of the guide column. The middle-layer guide spiral surface that fits the middle-layer adjusting spiral surface is located on the middle-layer guiding sleeve, which is fixedly mounted on the middle-layer lifting mount and cannot rotate around the axis of the guide column. Therefore, the middle-layer guiding sleeve will be tilted at a certain angle, thereby driving the middle-layer lifting mount to be tilted at a certain angle, so as to adjust the parallelism of the middle-layer lifting mount. Similarly, when the parallelism of the lower-layer lifting mount changes, the lower-layer adjusting sleeve is rotated. , so that the lower adjusting spiral surface rotates around the axis of the guide column. The lower guide sleeve where the lower guide spiral surface that fits the lower adjusting spiral surface is located is fixedly mounted on the lower lifting mounting seat and cannot rotate around the axis of the guide column. Therefore, the lower guide sleeve will tilt at a certain angle, thereby driving the lower lifting mounting seat to tilt at a certain angle, so as to adjust the parallelism of the lower lifting mounting seat. The middle-layer parallelism adjustment mechanism and the lower-layer parallelism adjustment mechanism in the present invention can adjust the parallelism of the middle-layer lifting mounting seat and the parallelism of the lower lifting mounting seat respectively, and the cost is relatively low.

[0021] 3. In the present invention, when the middle-level adjusting sleeve rotates, the middle-level pointer will rotate around the axis of the guide column driven by the middle-level adjusting sleeve, and the parallelism of the middle-level lifting mounting seat is measured by the scale line of the middle-level scale pointed by the middle-level pointer; similarly, when the lower-level adjusting sleeve rotates, the lower-level pointer will rotate around the axis of the guide column driven by the lower-level adjusting sleeve, and the parallelism of the lower-level lifting mounting seat is measured by the scale line of the lower-level scale pointed by the lower-level pointer.

[0022] 4. In the present invention, the operation of the middle-layer motor drives the rotation of the middle-layer active nut shaft, and the middle-layer active sliding screw threadedly engaged in the middle-layer active nut shaft cannot rotate around its axis under the action of the middle-layer active anti-rotation guide column. Therefore, the middle-layer active sliding screw will move along the axial direction of the middle-layer active anti-rotation guide column, thereby driving the middle-layer active ejector pin to penetrate the upper hot pressing molding lower template and eject the wafer on the upper hot pressing molding lower template; similarly, the operation of the lower-layer motor drives the rotation of the lower-layer active nut shaft, and the lower-layer active sliding screw threadedly engaged in the lower-layer active nut shaft cannot rotate around its axis under the action of the lower active anti-rotation guide column. Therefore, the lower-layer active sliding screw will move along the axial direction of the lower active anti-rotation guide column, thereby driving the lower-layer active ejector pin to penetrate the lower hot pressing molding lower template and then eject the wafer on the lower hot pressing molding lower template.

[0023] 5. In the present invention, when the middle layer active nut shaft rotates, the middle layer active gear rotates under the drive of the middle layer active nut shaft, the middle layer transmission gear meshing with the middle layer active gear rotates, and then the middle layer driven gear meshing with the middle layer transmission gear rotates, and the middle layer driven nut shaft rotates under the drive of the middle layer driven gear, and the middle layer driven sliding screw threaded in the middle layer driven nut shaft cannot rotate around its axis under the action of the middle layer driven anti-rotation guide column, so the middle layer driven sliding screw will move along the axis direction of the middle layer driven anti-rotation guide column, thereby driving the middle layer driven ejector pin to penetrate the upper hot pressing molding lower template and eject the wafer on the upper hot pressing molding lower template; similarly, when the lower layer active nut shaft rotates, the lower layer active nut shaft rotates, and the lower layer driven gear meshing with the middle layer driven gear rotates. The driven gear rotates under the drive of the lower active nut shaft, the lower transmission gear meshing with the lower active gear rotates, and then the lower driven gear meshing with the lower transmission gear rotates, and the lower driven nut shaft rotates under the drive of the lower driven gear, and the lower driven sliding screw threaded in the lower driven nut shaft cannot rotate around its axis under the action of the lower driven anti-rotation guide column, so the lower driven sliding screw will move along the axial direction of the lower driven anti-rotation guide column, thereby driving the lower driven ejector pin to penetrate the lower hot pressing molding lower template and eject the wafer on the lower hot pressing molding lower template. It can be seen that the middle driven ejector pin mechanism and the lower driven ejector pin mechanism in the present invention can work without motor drive.

[0024] 6. In the present invention, when the upper vacuum sealing ring, the bottom surface of the upper hot pressing molding upper template and the top surface of the upper hot pressing molding lower template form a closed cavity, the upper vacuum pump works to evacuate the upper vacuum sealing ring to a vacuum state through the upper vacuum channel, and the wafer in the upper vacuum sealing ring can be firmly adsorbed on the upper hot pressing molding lower template, and at the same time, the protective material on the wafer can also be firmly adsorbed on the wafer; similarly, when the lower vacuum sealing ring, the bottom surface of the lower hot pressing molding upper template and the top surface of the lower hot pressing molding lower template form a closed cavity, the lower vacuum pump works to evacuate the lower vacuum sealing ring to a vacuum state through the lower vacuum channel, and the wafer in the lower vacuum sealing ring can be firmly adsorbed on the lower hot pressing molding lower template, and at the same time, the protective material on the wafer can also be firmly adsorbed on the wafer.

[0025] 7. In the present invention, after the upper vacuum adsorption gripper and the lower vacuum adsorption gripper on the double-layer single-arm handling robot grab a wafer respectively, they are moved simultaneously to between the upper hot pressing molding upper template and the upper hot pressing molding lower template and between the lower hot pressing molding upper template and the lower hot pressing molding lower template respectively under the drive of the cylinder and the linear motion module, and the upper and lower wafers are placed on the upper hot pressing molding lower template and the lower hot pressing molding lower template respectively for subsequent lamination operations; after the lamination is completed, the upper and lower wafers can be removed from the upper hot pressing molding lower template and the lower hot pressing molding lower template respectively by using the upper vacuum adsorption gripper and the lower vacuum adsorption gripper. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0027] Figure 1 The overall structure diagram of a double-layer vacuum hot pressing molding device with adjustable parallelism provided in Example 1 of the present invention;

[0028] Figure 2 A rear view of a double-layer vacuum hot pressing forming device with adjustable parallelism provided in Example 1 of the present invention;

[0029] Figure 3 for Figure 2 AA section view;

[0030] Figure 4 for Figure 3 A partial enlarged view of point D in the middle;

[0031] Figure 5 for Figure 2 BB section diagram;

[0032] Figure 6 for Figure 5 A partial enlarged view of point E in the middle;

[0033] Figure 7 This is an overall structural diagram of the middle layer parallelism adjustment mechanism of Example 1 of the present invention;

[0034] Figure 8 It is a top exploded view of the middle layer parallelism adjustment mechanism of Example 1 of the present invention;

[0035] Fig. 9 This is a bottom exploded view of the middle layer parallelism adjustment mechanism of Example 1 of the present invention;

[0036] Fig.10 This is an overall structural diagram of the lower layer parallelism adjustment mechanism of Example 1 of the present invention;

[0037] Fig.11 It is a top exploded view of the lower layer parallelism adjustment mechanism of Example 1 of the present invention;

[0038] Fig.12 This is a bottom exploded view of the lower layer parallelism adjustment mechanism of Example 1 of the present invention;

[0039] Fig.13 It is an exploded view of the middle-layer ejector mechanism and the middle-layer lifting mounting seat of Example 1 of the present invention;

[0040] Fig.14 It is an exploded view of the lower ejector mechanism and the lower lifting mounting seat of Example 1 of the present invention;

[0041] Fig.15 An exploded view of an upper hot pressing molding die and an upper vacuum sealing ring of Example 1 of the present invention;

[0042] Fig.16 An exploded view of a lower hot pressing molding die and a lower vacuum sealing ring of Example 1 of the present invention;

[0043] Fig.17 This is an overall structural diagram of a double-layer single-arm transport mechanism according to Embodiment 1 of the present invention;

[0044] In the figure: 1-upper fixed mounting seat; 2-safety grating; 3-guide column; 4-middle parallelism adjustment mechanism; 5-middle lifting mounting seat; 6-lower parallelism adjustment mechanism; 7-lower lifting mounting seat; 8-electric cylinder mounting plate; 9-base; 10-shockproof horizontal adjustment pad; 11-electric cylinder; 12-lower hot pressing mold; 13-lower mold elbow pressure plate; 14-lower ejector mechanism; 15-upper mold elbow pressure plate; 16-upper hot pressing mold; 17-middle ejector mechanism; 18-ball screw module; 19-upper installation transition plate; 20-nut gland; 21-double-layer single-arm handling mechanism; 22-lower upper mold fixed pressure plate; 23-upper upper mold fixed pressure plate; 24-upper mold fastener; 25 - lower mold fastener; 26- length adjustment nut of the coring column; 27- fixing nut at the lower end of the coring column; 28- center thrust transition plate; 29- large bolt; 30- large washer; 31- electric cylinder guide column; 32- upper mold heating rod; 33- upper thermal resistor sensor; 34- upper push spring; 35- upper guide column screw; 36- upper sealing inner ring; 37- upper sealing outer ring; 38- upper vacuum sealing ring; 39- lower mold heating rod; 40- lower thermal resistor sensor; 41- lower push spring; 42- lower guide column screw; 43- lower sealing inner ring; 44- lower sealing outer ring; 45- lower vacuum sealing ring; 46- wafer; 401- middle adjustment sleeve; 402- middle guide sleeve; 40 3-middle scale; 404-middle pointer; 405-middle retaining ring; 406-semicircular middle pointer mounting sleeve; 407-middle pointer mounting sleeve connecting plate; 408-middle oil-free sliding bushing; 409-middle guide spiral surface; 410-middle adjustment spiral surface; 501-middle lifting mounting seat body; 502-middle lifting mounting seat end cover; 601-lower adjustment sleeve; 602-lower guide sleeve; 603-lower scale; 604-lower pointer; 605-lower retaining ring; 606-semicircular lower pointer mounting sleeve; 607-lower pointer mounting sleeve connecting plate; 608-lower oil-free sliding bushing; 609-lower guide spiral surface; 610-lower adjustment spiral surface; 701-lower lifting mounting seat Main body; 702-end cover of lower lifting mounting seat; 1101-push rod shaft; 1102-mounting flange; 1103-electric cylinder body; 1104-electric cylinder control motor; 1105-motor reducer; 1106-transmission box; 1201-lower hot pressing forming upper template; 1202-lower hot pressing forming lower template; 1401-lower active ejector pin; 1402-lower large bevel gear; 1403-lower active nut shaft; 1404-lower transmission shaft; 1405-lower motor; 1406-lower active gear; 1407-lower active anti-rotation guide column; 1408-lower active sliding screw; 1409-lower transmission gear; 1410-lower driven nut shaft; 1411-lower driven sliding screw;1412-lower layer driven anti-rotation guide column; 1413-lower layer driven gear; 1414-lower layer driven ejector pin; 1415-lower layer small bevel gear; 1601-upper layer hot pressing forming upper template; 1602-upper layer hot pressing forming lower template; 1701-middle layer active ejector pin; 1702-middle layer large bevel gear; 1703-middle layer active nut shaft; 1704-middle layer transmission shaft; 1705-middle layer motor; 1706-middle layer active gear; 1707-middle layer active anti-rotation guide column; 1708-middle layer Active sliding screw; 1709-middle layer transmission gear; 1710-middle layer driven nut shaft; 1711-middle layer driven sliding screw; 1712-middle layer driven anti-rotation guide column; 1713-middle layer driven gear; 1714-middle layer driven ejector pin; 1715-middle layer small bevel gear; 2101-manipulator mounting base plate; 2102-cylinder; 2103-linear moving module; 2104-double-layer single-arm handling manipulator; 2105-upper layer vacuum adsorption gripper; 2106-lower layer vacuum adsorption gripper. ; DETAILED DESCRIPTION

[0045] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0046] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0047] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit exemplary embodiments according to the present invention. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprising" and / or "including" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0048] Unless otherwise specifically stated, the relative arrangement of the parts and steps described in these embodiments, the numerical expressions and numerical values ​​do not limit the scope of the present invention. At the same time, it should be clear that, for ease of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship. The technology, methods and equipment known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be regarded as part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0049] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention: the directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0050] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below their position devices or structures". Thus, the exemplary term "above" may include both "above" and "below". The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0051] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the present invention.

[0052] Embodiment 1:

[0053] like Figures 1 to 4 As shown, a double-layer vacuum hot pressing molding equipment with adjustable parallelism is characterized in that it includes: a frame; the frame includes a base 9 and a guide column 3 installed on the base 9, and the guide column 3 is provided with a plurality of guide columns and its axis is perpendicular to the horizontal plane; an upper fixed mounting seat 1; the upper fixed mounting seat 1 is fixedly installed on the upper end of the guide column 3; a middle lifting mounting seat 5; the middle lifting mounting seat 5 is installed on the guide column 3 and can be moved along the axis direction of the guide column 3, the middle lifting mounting seat 5 is located directly below the upper fixed mounting seat 1 and can carry a wafer 46; a lower lifting mounting seat 7; the lower lifting mounting seat 7 is installed on the guide column 3 and can be moved along the axis direction of the guide column 3, the lower lifting mounting seat 7 is located directly below the middle lifting mounting seat 5 and can Carrying wafer 46; middle-layer ejector mechanism 17; the middle-layer ejector mechanism 17 is installed on the middle-layer lifting mount 5, and can lift the wafer 46 carried on the middle-layer lifting mount 5; lower-layer ejector mechanism 14; the lower-layer ejector mechanism 14 is installed on the lower-layer lifting mount 7, and can lift the wafer 46 carried on the lower-layer lifting mount 7; parallelism adjustment mechanism; the parallelism adjustment mechanism includes a middle-layer parallelism adjustment mechanism 4 for adjusting the parallelism of the middle-layer lifting mount 5 and a lower-layer parallelism adjustment mechanism 6 for adjusting the parallelism of the lower-layer lifting mount 7, the middle-layer lifting mount 5 is installed on the guide column 3 through the middle-layer parallelism adjustment mechanism 4, and the lower-layer lifting mount 7 is installed on the guide column 3 through the lower-layer parallelism adjustment mechanism 6.

[0054] Specifically, an electric cylinder mounting plate 8 is installed on the top surface of the base 9, and the guide column 3 is a Corinthian column and four of them are provided. The lower end of the guide column 3 is installed on the electric cylinder mounting plate 8 through the Corinthian column lower end fixing nut 27, and the upper end of the guide column 3 is installed on the upper fixed mounting seat 1 through the Corinthian column length adjustment nut 26. It also includes a nut cover 20 and an upper mounting transition plate 19 respectively installed on the upper and lower surfaces of the upper fixed mounting seat 1, which are used to press the Corinthian column length adjustment nut 26 onto the upper fixed mounting seat 1.

[0055] In this embodiment, Figures 7 to 12As shown, the middle-layer parallelism adjustment mechanism 4 includes a middle-layer guide sleeve 402 and a middle-layer adjustment sleeve 401; the middle-layer guide sleeve 402 is fixedly mounted on the middle-layer lifting mounting seat 5 and is sleeved outside the guide column 3, and a middle-layer guide spiral surface 409 is arranged on one end surface of the middle-layer guide sleeve 402, and the middle-layer adjustment sleeve 401 is sleeved outside the guide column 3 and can rotate around the axis of the guide column 3, and a middle-layer adjustment spiral surface 410 is arranged on one end surface of the middle-layer adjustment sleeve 401, and the middle-layer guide spiral surface 409 is in contact with the middle-layer adjustment spiral surface 410. The lower layer parallelism adjustment mechanism 6 includes a lower layer guide sleeve 602 and a lower layer adjustment sleeve 601; the lower layer guide sleeve 602 is fixedly mounted on the lower layer lifting mounting seat 7 and is sleeved outside the guide column 3, and a lower layer guide spiral surface 609 is arranged on one end face of the lower layer guide sleeve 602, and the lower layer adjustment sleeve 601 is sleeved outside the guide column 3 and can rotate around the axis of the guide column 3, and a lower layer adjustment spiral surface 610 is arranged on one end face of the lower layer adjustment sleeve 601, and the lower layer guide spiral surface 609 is in contact with the lower layer adjustment spiral surface 610.

[0056] Specifically, the middle-layer parallelism adjustment mechanism 4 also includes a middle-layer oil-free sliding bushing 408, the middle-layer guide sleeve 402 and the middle-layer adjustment sleeve 401 are both sleeved outside the middle-layer oil-free sliding bushing 408, and both ends of the middle-layer oil-free sliding bushing 408 are provided with middle-layer retaining rings 405, and the middle-layer retaining rings 405 at both ends of the middle-layer oil-free sliding bushing 408 are respectively installed in the middle-layer guide sleeve 402 and the middle-layer adjustment sleeve 401, which can prevent the middle-layer oil-free sliding bushing 408 from sliding relative to the middle-layer guide sleeve 402 and the middle-layer adjustment sleeve 401. The lower parallelism adjustment mechanism 6 also includes a lower oil-free sliding bushing 608, and the lower guide sleeve 602 and the lower adjustment sleeve 601 are both sleeved outside the lower oil-free sliding bushing 608. Both ends of the lower oil-free sliding bushing 608 are provided with lower retaining rings 605. The lower retaining rings 605 at both ends of the lower oil-free sliding bushing 608 are respectively installed in the lower guide sleeve 602 and the lower adjustment sleeve 601, which can prevent the lower oil-free sliding bushing 608 from sliding relative to the lower guide sleeve 602 and the lower adjustment sleeve 601.

[0057] When the parallelism of the middle-layer lifting mount 5 changes, the middle-layer adjusting sleeve 401 is rotated to make the middle-layer adjusting spiral surface 410 rotate around the axis of the guide column 3. The middle-layer guiding sleeve 402, where the middle-layer guiding spiral surface 409 that fits the middle-layer adjusting spiral surface 410 is located, is fixedly mounted on the middle-layer lifting mount 5 and cannot rotate around the axis of the guide column 3. Therefore, the middle-layer guiding sleeve 402 will tilt at a certain angle, thereby driving the middle-layer lifting mount 5 to tilt at a certain angle, so as to adjust the parallelism of the middle-layer lifting mount 5. Similarly, when the parallelism of the lower-layer lifting mount 7 changes, the lower-layer adjusting sleeve 601 is rotated to make the middle-layer adjusting spiral surface 410 rotate around the axis of the guide column 3. The lower adjusting spiral surface 610 rotates around the axis of the guide column 3. The lower guiding sleeve 602 where the lower guiding spiral surface 609 which is in contact with the lower adjusting spiral surface 610 is located is fixedly mounted on the lower lifting mounting seat 7 and cannot rotate around the axis of the guide column 3. Therefore, the lower guiding sleeve 602 will be tilted at a certain angle, thereby driving the lower lifting mounting seat 7 to be tilted at a certain angle, so as to adjust the parallelism of the lower lifting mounting seat 7. The middle-layer parallelism adjustment mechanism 4 and the lower-layer parallelism adjustment mechanism 6 in this embodiment can respectively adjust the parallelism of the middle-layer lifting mounting seat 5 and the parallelism of the lower-layer lifting mounting seat 7, and the cost is relatively low.

[0058] In this embodiment, Figures 7 to 12 As shown, a middle-layer scale 403 is arranged on the outer wall of the middle-layer guide sleeve 402 along its circumferential direction, and a middle-layer pointer 404 matching the middle-layer scale 403 is fixedly installed on the middle-layer adjustment sleeve 401 for measuring the parallelism of the middle-layer lifting mounting seat 5; a lower-layer scale 603 is arranged on the outer wall of the lower-layer guide sleeve 602 along its circumferential direction, and a lower-layer pointer 604 matching the lower-layer scale 603 is fixedly installed on the lower-layer adjustment sleeve 601 for measuring the parallelism of the lower-layer lifting mounting seat 7.

[0059] Specifically, the middle-layer adjustment sleeve 401 is connected to the circular middle-layer pointer 404 mounting sleeve through the middle-layer pointer mounting sleeve connecting plate 407, the circular middle-layer pointer 404 mounting sleeve is composed of two semicircular middle-layer pointer mounting sleeves 406, and the middle-layer pointer 404 is installed on the circular middle-layer pointer 404 mounting sleeve; the lower-layer adjustment sleeve 601 is connected to the circular lower-layer pointer 604 mounting sleeve through the lower-layer pointer mounting sleeve connecting plate 607, the circular lower-layer pointer 604 mounting sleeve is composed of two semicircular lower-layer pointer mounting sleeves 606, and the lower-layer pointer 604 is installed on the circular lower-layer pointer 604 mounting sleeve.

[0060] Except for the middle-layer guide sleeve 402 and the retaining ring, the other parts of the middle-layer parallelism adjustment mechanism 4 are assembled and fixedly connected to each other to form a rigid whole. The circular middle-layer pointer 404 in this rigid whole is installed and clamped in the middle groove on the middle-layer guide sleeve 402, and this rigid whole can only rotate relative to the middle-layer guide sleeve 402 and cannot be separated; except for the lower-layer guide sleeve 602 and the retaining ring, the other parts of the lower-layer parallelism adjustment mechanism 6 are assembled and fixedly connected to each other to form a rigid whole. The circular lower-layer pointer 604 in this rigid whole is installed and clamped in the middle groove on the lower-layer guide sleeve 602, and this rigid whole can only rotate relative to the lower-layer guide sleeve 602 and cannot be separated.

[0061] In this embodiment, Fig.13 and Fig.14As shown, the middle-layer ejector mechanism 17 includes a middle-layer active ejector mechanism; the middle-layer active ejector mechanism includes a middle-layer motor 1705, a middle-layer active nut shaft 1703, a middle-layer active anti-rotation guide column 1707, a middle-layer active sliding screw 1708 and a middle-layer active ejector 1701; the middle-layer motor 1705 is installed on the middle-layer lifting mounting seat 5, the middle-layer active nut shaft 1703 is installed in the middle-layer lifting mounting seat 5 and can rotate around its axis driven by the middle-layer motor 1705, the middle-layer active anti-rotation guide column 1707 is fixedly installed on the middle-layer lifting mounting seat 5 and is coaxially installed on the middle-layer active nut shaft 1703 A middle-layer active anti-rotation guide column channel is coaxially opened in the middle-layer active sliding screw 1708, the outer wall of the middle-layer active sliding screw 1708 is threadedly matched with the inner wall of the middle-layer active nut shaft 1703, the side wall of the middle-layer active anti-rotation guide column channel is in contact with the side wall of the middle-layer active anti-rotation guide column 1707, the middle-layer active sliding screw 1708 can move along the axial direction of the middle-layer active anti-rotation guide column 1707, the middle-layer active ejector pin 1701 is coaxially mounted on the middle-layer active sliding screw 1708 and can eject the wafer 46 carried on the middle-layer lifting mount 5 under the drive of the middle-layer active sliding screw 1708 The lower ejector mechanism 14 includes a lower active ejector mechanism; the lower active ejector mechanism includes a lower motor 1405, a lower active nut shaft 1403, a lower active anti-rotation guide column 1407, a lower active sliding screw 1408 and a lower active ejector 1401; the lower motor 1405 is installed on the lower lifting mounting seat 7, the lower active nut shaft 1403 is installed in the lower lifting mounting seat 7 and can rotate around its axis driven by the lower motor 1405, the lower active anti-rotation guide column 1407 is fixedly installed on the lower lifting mounting seat 7 and coaxially installed in the lower active nut shaft 1403 A lower active anti-rotation guide column channel is coaxially opened in the lower active sliding screw 1408, the outer wall of the lower active sliding screw 1408 is threadedly matched with the inner wall of the lower active nut shaft 1403, the side wall of the lower active anti-rotation guide column channel is in contact with the side wall of the lower active anti-rotation guide column 1407, the lower active sliding screw 1408 can move along the axial direction of the lower active anti-rotation guide column 1407, the lower active ejector pin 1401 is coaxially installed on the lower active sliding screw 1408 and can lift the wafer 46 carried on the lower lifting mount 7 under the drive of the lower active sliding screw 1408.

[0062] Specifically, the middle-layer active ejector mechanism is provided with two, one end of the middle-layer transmission shaft 1704 is coaxially mounted on the output shaft of the middle-layer motor 1705, the other end of the middle-layer transmission shaft 1704 is coaxially mounted with a middle-layer small bevel gear 1715, the middle-layer active nut shaft 1703 is coaxially mounted with a middle-layer large bevel gear 1702, the middle-layer large bevel gear 1702 is meshed with the middle-layer small bevel gear 1715, so the middle-layer motor 1705 can drive the middle-layer active nut shaft 1703 to rotate Rotate; the lower active ejector mechanism is provided with two, one end of the lower transmission shaft 1404 is coaxially mounted on the output shaft of the lower motor 1405, the other end of the lower transmission shaft 1404 is coaxially mounted with a lower small bevel gear 1415, the lower active nut shaft 1403 is coaxially mounted with a lower large bevel gear 1402, the lower large bevel gear 1402 is meshed with the lower small bevel gear 1415, therefore, the lower motor 1405 can drive the lower active nut shaft 1403 to rotate.

[0063] In this embodiment, Fig.13 and Fig.14As shown, the middle-layer ejector mechanism 17 also includes a middle-layer driving gear 1706, a middle-layer transmission gear 1709 and a middle-layer driven ejector mechanism installed on the middle-layer lifting mounting seat 5; the middle-layer driving gear 1706 is coaxially installed on the middle-layer driving nut shaft 1703 and can rotate around its axis under the drive of the middle-layer driving nut shaft 1703, and the middle-layer driven ejector mechanism includes a middle-layer driven gear 1713, a middle-layer driven nut shaft 1710, a middle-layer driven anti-rotation guide column 1712, a middle-layer driven sliding screw 1711 and a middle-layer driven ejector 1714; The middle-layer transmission gear 1709 is meshed with the middle-layer driving gear 1706, the middle-layer driven gear 1713 is meshed with the middle-layer transmission gear 1709 and is coaxially installed on the middle-layer driven nut shaft 1710, the middle-layer driven nut shaft 1710 is installed in the middle-layer lifting mounting seat 5 and can rotate around its axis driven by the middle-layer driven gear 1713, the middle-layer driven anti-rotation guide column 1712 is fixedly installed on the middle-layer lifting mounting seat 5 and coaxially installed in the middle-layer driven nut shaft 1710, and the middle-layer driven sliding screw 1711 is coaxially provided with The middle-layer driven anti-rotation guide column channel, the outer wall of the middle-layer driven sliding screw 1711 is threadedly matched with the inner wall of the middle-layer driven nut shaft 1710, the side wall of the middle-layer driven anti-rotation guide column channel is in contact with the side wall of the middle-layer driven anti-rotation guide column 1712, the middle-layer driven sliding screw 1711 can move along the axial direction of the middle-layer driven anti-rotation guide column 1712, the middle-layer driven ejector pin 1714 is coaxially mounted on the middle-layer driven sliding screw 1711 and can move the wafer 46 carried on the middle-layer lifting mounting seat 5 under the drive of the middle-layer driven sliding screw 1711 The lower ejector mechanism 14 further comprises a lower driving gear 1406, a lower transmission gear 1409 and a lower driven ejector mechanism mounted on the lower lifting mounting seat 7; the lower driving gear 1406 is coaxially mounted on the lower driving nut shaft 1403 and can rotate around its axis driven by the lower driving nut shaft 1403, and the lower driven ejector mechanism comprises a lower driven gear 1413, a lower driven nut shaft 1410, a lower driven anti-rotation guide column 1412, a lower driven sliding screw 1411 and a lower driven ejector 1414;The lower transmission gear 1409 is meshed with the lower driving gear 1406, the lower driven gear 1413 is meshed with the lower transmission gear 1409 and is coaxially installed on the lower driven nut shaft 1410, the lower driven nut shaft 1410 is installed in the lower lifting mounting seat 7 and can rotate around its axis driven by the lower driven gear 1413, the lower driven anti-rotation guide column 1412 is fixedly installed on the lower lifting mounting seat 7 and coaxially installed in the lower driven nut shaft 1410, and the lower driven sliding screw 1411 is coaxially provided with a lower The lower driven anti-rotation guide column channel is provided, the outer side wall of the lower driven sliding screw 1411 is threadedly matched with the inner side wall of the lower driven nut shaft 1410, the side wall of the lower driven anti-rotation guide column channel is fitted with the side wall of the lower driven anti-rotation guide column 1412, the lower driven sliding screw 1411 can move along the axial direction of the lower driven anti-rotation guide column 1412, the lower driven ejector pin 1414 is coaxially mounted on the lower driven sliding screw 1411 and can lift the wafer 46 carried on the lower lifting mount 7 under the drive of the lower driven sliding screw 1411. ;

[0064] Specifically, two of the middle-layer driven ejector pin mechanisms and two of the lower-layer driven ejector pin mechanisms are provided; the two middle-layer active ejector pin mechanisms and the two middle-layer driven ejector pin mechanisms are evenly distributed along the circumferential direction of the middle-layer transmission gear 1709, and the two middle-layer active ejector pin mechanisms cooperate with the two middle-layer driven ejector pin mechanisms to smoothly eject the wafer 46; the two lower-layer active ejector pin mechanisms and the two lower-layer driven ejector pin mechanisms are evenly distributed along the circumferential direction of the lower-layer transmission gear 1409, and the two lower-layer active ejector pin mechanisms cooperate with the two lower-layer driven ejector pin mechanisms to smoothly eject the wafer 46.

[0065] In addition, the middle-layer lifting mounting seat 5 includes a middle-layer lifting mounting seat body 501 and a middle-layer lifting mounting seat end cover 502, a middle-layer ejector mounting groove is provided on the bottom surface of the middle-layer lifting mounting seat 5, the middle-layer lifting mounting seat end cover 502 can be detachably covered at the opening of the middle-layer ejector mounting groove, and the middle-layer ejector mechanism 17 is installed in the middle-layer ejector mounting groove; the lower-layer lifting mounting seat 7 includes a lower-layer lifting mounting seat body 701 and a lower-layer lifting mounting seat end cover 702, a lower-layer ejector mounting groove is provided on the bottom surface of the lower-layer lifting mounting seat 7, the lower-layer lifting mounting seat end cover 702 can be detachably covered at the opening of the lower-layer ejector mounting groove, and the lower-layer ejector mechanism 14 is installed in the lower-layer ejector mounting groove.

[0066] In this embodiment, Fig.15 and Fig.16As shown, it also includes an upper hot pressing forming mold 16; the upper hot pressing forming mold 16 includes an upper hot pressing forming upper template 1601 and an upper hot pressing forming lower template 1602, the upper hot pressing forming upper template 1601 is installed on the bottom surface of the upper fixed mounting seat 1, the upper hot pressing forming lower template 1602 is installed on the top surface of the middle lifting mounting seat 5, the upper hot pressing forming lower template 1602 is located directly below the upper hot pressing forming upper template 1601, and the middle lifting mounting seat 5 is supported by the upper hot pressing forming lower template 1602. The wafer 46 is loaded; an upper vacuum sealing ring 38 for accommodating the wafer 46 is arranged between the upper hot pressing molding upper template 1601 and the upper hot pressing molding lower template 1602, and the two end surfaces of the upper vacuum sealing ring 38 can be respectively attached to the bottom surface of the upper hot pressing molding upper template 1601 and the top surface of the upper hot pressing molding lower template 1602, and an upper vacuum channel is opened in the upper hot pressing molding lower template 1602, one end of the upper vacuum channel is connected to the upper vacuum sealing ring 38, and the other end of the upper vacuum channel is connected to the upper vacuum The pump further comprises a lower hot pressing forming mold 12; the lower hot pressing forming mold 12 comprises a lower hot pressing forming upper template 1201 and a lower hot pressing forming lower template 1202, the lower hot pressing forming upper template 1201 is mounted on the bottom surface of the middle lifting mounting seat 5, the lower hot pressing forming lower template 1202 is mounted on the top surface of the lower lifting mounting seat 7, the lower hot pressing forming lower template 1202 is located directly below the lower hot pressing forming upper template 1201, and the lower lifting mounting seat 7 carries the crystal through the lower hot pressing forming lower template 1202. circle 46; a lower vacuum sealing ring 45 for accommodating the wafer 46 is arranged between the lower hot pressing molding upper template 1201 and the lower hot pressing molding lower template 1202, and the two end surfaces of the lower vacuum sealing ring 45 can be respectively attached to the bottom surface of the lower hot pressing molding upper template 1201 and the top surface of the lower hot pressing molding lower template 1202, and a lower vacuum channel is opened in the lower hot pressing molding lower template 1202, one end of the lower vacuum channel is connected to the lower vacuum sealing ring 45, and the other end of the lower vacuum channel is connected to a lower vacuum pump.

[0067] Specifically, the upper hot pressing forming upper template 1601 is installed on the bottom surface of the upper installation transition plate 19 through the upper upper mold fixing pressure plate 23, and the lower hot pressing forming upper template 1201 is installed on the bottom surface of the upper installation transition plate 19 through the lower upper mold fixing pressure plate 22; the upper hot pressing forming lower template 1602 is installed on the top surface of the middle lifting mounting seat 5 through the upper mold elbow pressure plate 15, and the lower hot pressing forming lower template 1202 is installed on the top surface of the lower lifting mounting seat 7 through the lower mold elbow pressure plate 13; the upper hot pressing forming lower template 1602 is fixed to the upper hot pressing forming upper template 1601 through the upper mold fastener 24, and the lower hot pressing forming lower template 1202 is fixed to the lower hot pressing forming lower template 1202 through the lower mold fastener 25.

[0068] Specifically, one end of a plurality of upper guide column screws 35 are fixedly installed on the upper end surface of the upper vacuum sealing ring 38 along its circumferential direction, and the other end of the upper guide column screw 35 is slidably installed on the upper hot pressing molding upper template 1601 through the dynamic sealing ring of the upper guide column screw 35, and the upper guide column screw 35 is provided with an upper pushing spring 34, and an upper sealing inner ring 36 and an upper sealing outer ring 37 are installed on the lower end surface of the upper vacuum sealing ring 38; one end of a plurality of lower guide column screws 42 are fixedly installed on the upper end surface of the lower vacuum sealing ring 45 along its circumferential direction, and the other end of the lower guide column screw 42 is slidably installed on the lower hot pressing molding upper template 1201 through the dynamic sealing ring of the lower guide column screw 42, and the lower guide column screw 42 is provided with a lower pushing spring 41, and a lower sealing inner ring 43 and a lower sealing outer ring 44 are installed on the lower end surface of the lower vacuum sealing ring 45.

[0069] In addition, a plurality of upper positioning guide sleeves are evenly distributed along the circumferential direction and installed on the top surface of the upper hot pressing forming lower template 1602; a plurality of upper positioning guide columns are evenly distributed along the circumferential direction and installed on the bottom surface of the upper hot pressing forming upper template 1601, the number of the upper positioning guide sleeves is consistent with the number of the upper positioning guide columns and they correspond one to one, and the upper positioning guide sleeves can be sleeved over the corresponding upper positioning guide columns; a plurality of lower positioning guide sleeves are evenly distributed along the circumferential direction and installed on the top surface of the lower hot pressing forming lower template 1202; a plurality of lower positioning guide columns are evenly distributed along the circumferential direction and installed on the bottom surface of the lower hot pressing forming upper template 1201, the number of the lower positioning guide sleeves is consistent with the number of the lower positioning guide columns and they correspond one to one, and the lower positioning guide sleeves can be sleeved over the corresponding lower positioning guide columns.

[0070] In this embodiment, when the mold locking action is performed, the upper hot pressing molding lower template 1602 and the lower hot pressing molding lower template 1202 are both moved upward. First, the upper positioning guide sleeve and the lower positioning guide sleeve are respectively sleeved on the upper positioning guide column and the lower positioning guide column to play a positioning and guiding role. Then, the top surface of the upper hot pressing molding lower template 1602 and the top surface of the lower hot pressing molding lower template 1202 are respectively in contact with the bottom surface of the upper vacuum sealing ring and the bottom surface of the lower vacuum sealing ring. At this time, the upper vacuum A wafer 46 coated with a protective material (coated colloid material) is installed in the sealing ring and the lower vacuum sealing ring. The upper sealing inner ring 36 and the upper sealing outer ring 37 on the upper vacuum sealing ring and the lower sealing inner ring 43 and the lower sealing outer ring 44 on the lower vacuum sealing ring are deformed to play a sealing role. Finally, the upper vacuum pump and the lower vacuum pump respectively evacuate the upper vacuum sealing ring 38 and the lower vacuum sealing ring 45 to vacuum through the upper vacuum channel and the lower vacuum channel.

[0071] In this embodiment, Fig.15 and Fig.16 As shown, the upper hot pressing forming mold 16 is equipped with an upper heating mechanism that can heat the upper hot pressing forming mold 16, and the lower hot pressing forming mold 12 is equipped with a lower heating mechanism that can heat the lower hot pressing forming mold 12; it also includes an upper temperature control unit that can control the temperature of the upper hot pressing forming mold 16 and a lower temperature control unit that can control the temperature of the lower hot pressing forming mold 12.

[0072] Specifically, the upper layer heating mechanism includes an upper layer mold heating rod 32, the upper layer temperature control unit includes an upper layer thermal resistor sensor 33, and the upper layer hot pressing forming upper template 1601 and the upper layer hot pressing forming lower template 1602 are both installed with the upper layer mold heating rod 32 and the upper layer thermal resistor sensor 33; the lower layer heating mechanism includes a lower layer mold heating rod 39, the lower layer temperature control unit includes a lower layer thermal resistor sensor 40, and the lower layer hot pressing forming upper template 1201 and the lower layer hot pressing forming lower template 1202 are both installed with the lower layer mold heating rod 39 and the lower layer thermal resistor sensor 40.

[0073] In this embodiment, the upper hot pressing mold 16 and the lower hot pressing mold 12 are heated by the upper heating mechanism and the lower heating mechanism respectively, and then the temperature of the upper hot pressing mold 16 and the temperature of the lower hot pressing mold 12 are heated to the hot pressing setting temperature and maintained for a period of time by the upper temperature control unit and the lower temperature control unit respectively, and finally two wafers 46 coated with protective material (coated colloid material) are placed in the upper hot pressing mold 16 and the lower hot pressing mold 12 respectively, and the clamping action is performed.

[0074] In this embodiment, Figure 1 , Figure 4 and Figure 5 As shown, it also includes a driving mechanism, which includes a middle-layer driving mechanism and a lower-layer driving mechanism; the middle-layer driving mechanism includes a ball screw module 18, the screw in the ball screw module 18 is fixedly mounted on the upper-layer fixed mounting seat 1 and its axis is perpendicular to the horizontal plane, and the ball in the ball screw module 18 is fixedly mounted on the middle-layer lifting mounting seat 5; the lower-layer driving mechanism includes an electric cylinder 11, the mounting flange 1102 on the electric cylinder 11 is fixedly mounted on the base 9, and the push rod shaft 1101 on the electric cylinder 11 is fixedly mounted on the lower-layer lifting mounting seat 7.

[0075] Specifically, the electric cylinder 11 is a large electric cylinder 11 with a motor retractable installation, which is mainly composed of an electric cylinder body 1103, a mounting flange 1102, a push rod shaft 1101, an electric cylinder control motor 1104, a motor reducer 1105 and a transmission box 1106. The electric cylinder 11 transmits power to the screw installed in the electric cylinder body 1103 through the transmission box 1106. The rotation of the screw drives the push rod shaft 1101 to perform telescopic movement.

[0076] Furthermore, the electric cylinder 11 is fixed to the electric cylinder mounting plate 8 by means of a mounting flange 1102, the push rod shaft 1101 is fixed to the central thrust transition plate 28 by means of a large bolt 29, the central thrust transition plate 28 is fixed to the central force-bearing area of ​​the lower lifting mounting seat 7, a large washer 30 is arranged between the central thrust transition plate 28 and the push rod shaft 1101, so that the thrust of the push rod shaft 1101 can be transmitted to the central force-bearing area of ​​the lower lifting mounting seat 7; in order to improve the thrust straightness accuracy of the central thrust transition plate 28, an electric cylinder guide column 31 is arranged outside the electric cylinder body 1103, and central thrust transition plate guide columns are also installed at the four corners of the central thrust transition plate 28, and a central thrust transition plate guide sleeve is installed at the corresponding position on the electric cylinder mounting plate 8, the central thrust transition plate guide sleeve can be sleeved on the central thrust transition plate guide column, so as to achieve the required thrust straightness accuracy.

[0077] Specifically, there are four ball screw modules 18, which are respectively installed on the four corners of the upper fixed mounting seat 1. The ball screw module 18 is composed of a module control motor, a motor mounting seat fixed on the upper mounting transition plate 19, a coupling, a ball screw fixed bearing seat, a ball screw, a ball fixed on the middle lifting mounting seat 5 and driving it to move up and down, and a mechanical limit ring fixed on the end of the ball screw shaft.

[0078] In this embodiment, when the mold locking action is performed, the middle-layer lifting mounting seat 5 and the lower-layer lifting mounting seat 7 are both in the maximum open state. First, the ball screw module 18 is controlled to move the middle-layer lifting mounting seat 5 to the vacuum start position of the upper hot pressing forming mold 16 and stop. At the same time as the middle-layer lifting mounting seat 5 moves, the electric cylinder 11 is controlled to move the lower-layer lifting mounting seat 7 to the vacuum start position of the lower hot pressing forming mold 12 and stop; then the vacuum is started in the upper hot pressing forming mold 16 and the lower hot pressing forming mold 12 at the same time, and the thrust value of the electric cylinder 11 is set to The value is set to be about 50% to 80% of the total weight of the middle-layer lifting mounting seat 5 and the upper-layer hot-pressing forming mold 16 plus the ultimate static thrust that the four ball screw modules 18 can withstand, and the lower-layer lifting mounting seat 7 is pushed to rise rapidly, so that the lower-layer hot-pressing forming mold 12 is partially pre-locked. When the electric cylinder 11 reaches the set thrust value, the electric cylinder 11 stops and locks, and the torque of the module control motor of the ball screw module 18 is released to zero. At this time, the electric cylinder 11 is started again and its thrust value is set to the molding thrust value required for hot-pressing molding, and the lower lifting mounting seat 7 is pushed to rise rapidly, so that the lower-layer hot-pressing forming mold 12 is partially pre-locked. When the electric cylinder 11 reaches the set thrust value, the electric cylinder 11 stops and locks, and the torque of the module control motor of the ball screw module 18 is released to zero. At this time, the electric cylinder 11 is started again and its thrust value is set to the molding thrust value required for hot-pressing molding. The upper and lower hot pressing molds 16 and the lower and upper hot pressing molds 12 are locked at the same time. At this time, the electric cylinder 11 stops and maintains the specified hot pressing molding time. After the hot pressing molded product is completely hardened, the present embodiment starts to perform the mold opening action, restarts the module control motor of the ball screw module 18 to pull the middle and lower lifting mount 5, so that the upper and lower hot pressing molds 16 are kept in a completely locked state, and controls the electric cylinder control motor 1104 to rotate in the opposite direction, so that the lower and upper lifting mounts 16 and the lower hot pressing molds 12 are locked at the same time. The seat 7 moves downward, and the lower hot pressing mold 12 changes from a completely locked state to an open state. After opening to a certain extent, the module control motor that controls the ball screw module 18 rotates in the opposite direction, so that the middle-level lifting mounting seat 5 moves downward, and the upper hot pressing mold 16 also changes from a completely locked state to an open state. When the upper hot pressing mold 16 and the lower hot pressing mold 12 are both opened to the maximum state, the module control motor of the ball screw module 18 and the electric cylinder control motor 1104 of the electric cylinder 11 stop working, and a working cycle is completed.

[0079] In this embodiment, Fig.17As shown, it also includes a double-layer single-arm transport mechanism 21; the double-layer single-arm transport mechanism 21 includes a manipulator mounting base plate 2101, a cylinder 2102, a linear motion module 2103 and a double-layer single-arm transport manipulator 2104; the manipulator mounting base plate 2101 is equipped with a fixed end of the cylinder 2102, the telescopic end of the cylinder 2102 is installed on the guide rail of the linear motion module 2103, the double-layer single-arm transport manipulator 2104 is installed on the slider of the linear motion module 2103, and the telescopic direction of the cylinder 2102 is perpendicular to the horizontal plane The length direction of the linear moving module 2103 is parallel to the horizontal plane, and the double-layer single-arm handling robot 2104 is provided with an upper vacuum adsorption gripper 2105 and a lower vacuum adsorption gripper 2106. The upper vacuum adsorption gripper 2105 and the lower vacuum adsorption gripper 2106 can be moved simultaneously to between the upper hot pressing forming upper template 1601 and the upper hot pressing forming lower template 1602 and between the lower hot pressing forming upper template 1201 and the lower hot pressing forming lower template 1202 respectively driven by the cylinder 2102 and the linear moving module 2103.

[0080] Specifically, two cylinders 2102 are vertically installed on the robot mounting base 2101, and the telescopic ends of the two cylinders 2102 are fixed together with the guide rails of the linear motion module 2103 to form a rigid whole. The guide rails of the linear motion module 2103 and the telescopic ends of the two cylinders 2102 rise and fall synchronously, and a double-layer single-arm handling robot 2104 is installed on the slider of the linear motion module 2103. The upper vacuum adsorption gripper 2105 and the lower vacuum adsorption gripper 2106 on the double-layer single-arm handling robot 2104 are used to grab the wafer 46.

[0081] The upper vacuum suction gripper 2105 and the lower vacuum suction gripper 2106 grab two wafers 46 coated with protective materials (film-coated colloid materials) respectively, start the suction gripper vacuum pump to make the upper vacuum suction gripper 2105 and the lower vacuum suction gripper 2106 generate vacuum, adsorb and fix the wafers 46, and move the two wafers 46 to the middle ejector mechanism 17 and the lower ejector mechanism 14 respectively by operating the cylinder 2102 and the linear motion module 2103. After the wafers 46 are placed, the cylinder 2102 and the linear motion module 2103 are operated again to extract the upper vacuum suction gripper 2105 and the lower vacuum suction gripper 2106, and wait for the completion of this embodiment. The wafer 46 is hot pressed and laminated and molded, and the upper hot pressing molding mold 16 and the lower hot pressing molding mold 12 are both in the mold opening state. After the mold is opened, the middle ejector mechanism 17 and the lower ejector mechanism 14 eject the wafer 46. At this time, by operating the cylinder 2102 and the linear motion module 2103, the upper vacuum adsorption gripper 2105 and the lower vacuum adsorption gripper 2106 are respectively moved to the bottom of the two wafers 46 at the same time, and the adsorption gripper vacuum pump is started to make the upper vacuum adsorption gripper 2105 and the lower vacuum adsorption gripper 2106 generate vacuum, adsorb and fix the two wafers 46, so as to take out the wafer 46 after the mold is opened. The above process is the complete process of loading and unloading the wafer 46.

[0082] In addition, for the safety of equipment operation, a safety grating 2 is installed on one side of the embodiment, and the other sides are sealed with a safety net to avoid safety accidents of equipment or personnel during equipment commissioning or operation.

[0083] In this embodiment, a plurality of shockproof level adjustment feet 10 are evenly distributed and installed on the bottom surface of the base 9 .

[0084] Electronic rulers are installed between the middle-level lifting mount 5 and the upper-level installation transition plate 19 and between the lower-level lifting mount 7 and the upper-level installation transition plate 19. The two sets of electronic rulers feed back the minimum non-collision distance between the middle-level lifting mount 5 and the lower-level lifting mount 7 to the control system, so that the control system can control the electric cylinder control motor 1104 and the module control motor to always keep the middle-level lifting mount 5 and the lower-level lifting mount 7 from colliding.

[0085] The rest of this embodiment is the same as that of Embodiment 1. Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the above embodiments, a person skilled in the art should understand that the technical solutions described in the above embodiments can still be modified, or some or all of the technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A double-layer vacuum hot pressing forming equipment with adjustable parallelism, characterized in that: include: A frame; the frame comprises a base (9) and a guide column (3) mounted on the base (9), wherein a plurality of guide columns (3) are provided and the axes of the guide columns (3) are perpendicular to the horizontal plane; An upper fixed mounting seat (1); the upper fixed mounting seat (1) is fixedly mounted on the upper end of the guide column (3); A middle-layer lifting mount (5); the middle-layer lifting mount (5) is mounted on the guide column (3) and can move along the axis direction of the guide column (3); the middle-layer lifting mount (5) is located directly below the upper-layer fixed mount (1) and can carry a wafer (46); A lower lifting mount (7); the lower lifting mount (7) is mounted on the guide column (3) and can move along the axis of the guide column (3); the lower lifting mount (7) is located directly below the middle lifting mount (5) and can carry a wafer (46); A middle-layer ejector pin mechanism (17); the middle-layer ejector pin mechanism (17) is mounted on the middle-layer lifting mounting seat (5) and can lift up the wafer (46) carried on the middle-layer lifting mounting seat (5); A lower layer ejector pin mechanism (14); the lower layer ejector pin mechanism (14) is mounted on the lower layer lifting mounting seat (7) and can lift up the wafer (46) carried on the lower layer lifting mounting seat (7); A parallelism adjustment mechanism; the parallelism adjustment mechanism comprises a middle-layer parallelism adjustment mechanism (4) for adjusting the parallelism of the middle-layer lifting mounting seat (5) and a lower-layer parallelism adjustment mechanism (6) for adjusting the parallelism of the lower-layer lifting mounting seat (7); the middle-layer lifting mounting seat (5) is mounted on the guide column (3) via the middle-layer parallelism adjustment mechanism (4), and the lower-layer lifting mounting seat (7) is mounted on the guide column (3) via the lower-layer parallelism adjustment mechanism (6); The middle layer parallelism adjustment mechanism (4) comprises a middle layer guide sleeve (402) and a middle layer adjustment sleeve (401); the middle layer guide sleeve (402) is fixedly mounted on the middle layer lifting mounting seat (5) and sleeved outside the guide column (3); a middle layer guide spiral surface (409) is provided on one end surface of the middle layer guide sleeve (402); the middle layer adjustment sleeve (401) is sleeved outside the guide column (3) and can rotate around the axis of the guide column (3); a middle layer adjustment spiral surface (410) is provided on one end surface of the middle layer adjustment sleeve (401); the middle layer guide spiral surface (409) is in contact with the middle layer adjustment spiral surface (410); The lower layer parallelism adjustment mechanism (6) comprises a lower layer guide sleeve (602) and a lower layer adjustment sleeve (601); the lower layer guide sleeve (602) is fixedly mounted on the lower layer lifting mounting seat (7) and sleeved outside the guide column (3); a lower layer guide spiral surface (609) is provided on one end surface of the lower layer guide sleeve (602); the lower layer adjustment sleeve (601) is sleeved outside the guide column (3) and can rotate around the axis of the guide column (3); a lower layer adjustment spiral surface (610) is provided on one end surface of the lower layer adjustment sleeve (601); the lower layer guide spiral surface (609) is in contact with the lower layer adjustment spiral surface (610).

2. The double-layer vacuum hot pressing forming equipment with adjustable parallelism according to claim 1, characterized in that: A middle-layer scale (403) is provided on the outer wall of the middle-layer guide sleeve (402) along its circumferential direction, and a middle-layer pointer (404) matching the middle-layer scale (403) is fixedly mounted on the middle-layer adjustment sleeve (401); A lower scale (603) is provided on the outer side wall of the lower guide sleeve (602) along its circumferential direction, and a lower pointer (604) matching the lower scale (603) is fixedly mounted on the lower adjustment sleeve (601).

3. The double-layer vacuum hot pressing forming equipment with adjustable parallelism according to claim 1, characterized in that: The middle layer ejector mechanism (17) comprises a middle layer active ejector mechanism; The middle-layer active ejector mechanism comprises a middle-layer motor (1705), a middle-layer active nut shaft (1703), a middle-layer active anti-rotation guide column (1707), a middle-layer active sliding screw (1708) and a middle-layer active ejector (1701); the middle-layer motor (1705) is mounted on a middle-layer lifting mounting seat (5); the middle-layer active nut shaft (1703) is mounted in the middle-layer lifting mounting seat (5) and can rotate around its axis under the drive of the middle-layer motor (1705); the middle-layer active anti-rotation guide column (1707) is fixedly mounted on the middle-layer lifting mounting seat (5) and coaxially mounted in the middle-layer active nut shaft (1703); the middle-layer active sliding screw (1708) is fixedly mounted on the middle-layer lifting mounting seat (5) and coaxially mounted in the middle-layer active nut shaft (1703); the middle-layer active sliding screw (1708) is fixedly mounted on the middle-layer lifting mounting seat (5) and coaxially mounted in the middle-layer active nut shaft (1703); the middle-layer active sliding screw (1708) is fixedly mounted on the middle-layer lifting mounting seat (5) and coaxially mounted in the middle-layer active nut shaft (1703); the middle-layer active ) is coaxially provided with a middle-layer active anti-rotation guide column (1707) channel, the outer wall of the middle-layer active sliding screw (1708) is threadedly matched with the inner wall of the middle-layer active nut shaft (1703), the side wall of the middle-layer active anti-rotation guide column (1707) channel is in contact with the side wall of the middle-layer active anti-rotation guide column (1707), the middle-layer active sliding screw (1708) can move along the axis direction of the middle-layer active anti-rotation guide column (1707), the middle-layer active ejector pin (1701) is coaxially mounted on the middle-layer active sliding screw (1708) and can lift the wafer (46) carried on the middle-layer lifting mounting seat (5) under the drive of the middle-layer active sliding screw (1708); The lower layer ejector mechanism (14) comprises a lower layer active ejector mechanism; The lower active ejector mechanism comprises a lower motor (1405), a lower active nut shaft (1403), a lower active anti-rotation guide column (1407), a lower active sliding screw (1408) and a lower active ejector (1401); the lower motor (1405) is mounted on a lower lifting mounting seat (7); the lower active nut shaft (1403) is mounted in the lower lifting mounting seat (7) and can rotate around its axis under the drive of the lower motor (1405); the lower active anti-rotation guide column (1407) is fixedly mounted on the lower lifting mounting seat (7) and coaxially mounted in the lower active nut shaft (1403); the lower active sliding screw (1408) is ) is coaxially provided with a lower active anti-rotation guide column (1407) channel, the outer wall of the lower active sliding screw (1408) is threadedly matched with the inner wall of the lower active nut shaft (1403), the side wall of the lower active anti-rotation guide column (1407) channel is in contact with the side wall of the lower active anti-rotation guide column (1407), the lower active sliding screw (1408) can move along the axial direction of the lower active anti-rotation guide column (1407), the lower active ejector pin (1401) is coaxially mounted on the lower active sliding screw (1408) and can lift the wafer (46) carried on the lower lifting mount (7) under the drive of the lower active sliding screw (1408).

4. The double-layer vacuum hot pressing forming equipment with adjustable parallelism according to claim 3, characterized in that: The middle-layer ejector mechanism (17) further comprises a middle-layer driving gear (1706), a middle-layer transmission gear (1709) and a middle-layer driven ejector mechanism mounted on the middle-layer lifting mounting seat (5); the middle-layer driving gear (1706) is coaxially mounted on the middle-layer driving nut shaft (1703) and can rotate around its axis driven by the middle-layer driving nut shaft (1703); the middle-layer driven ejector mechanism comprises a middle-layer driven gear (1713), a middle-layer driven nut shaft (1709) and a middle-layer driven ejector mechanism. 710), a middle-layer driven anti-rotation guide column (1712), a middle-layer driven sliding screw (1711) and a middle-layer driven ejector pin (1714); the middle-layer transmission gear (1709) is meshed with the middle-layer driving gear (1706), the middle-layer driven gear (1713) is meshed with the middle-layer transmission gear (1709) and is coaxially mounted on the middle-layer driven nut shaft (1710), and the middle-layer driven nut shaft (1710) is mounted in the middle-layer lifting mounting seat (5) and can be The middle layer driven gear (1713) rotates around its axis, the middle layer driven anti-rotation guide column (1712) is fixedly mounted on the middle layer lifting mounting seat (5) and coaxially mounted in the middle layer driven nut shaft (1710), the middle layer driven sliding screw (1711) is coaxially provided with a middle layer driven anti-rotation guide column (1712) channel, the outer wall of the middle layer driven sliding screw (1711) is threadedly matched with the inner wall of the middle layer driven nut shaft (1710), The side wall of the middle-layer driven anti-rotation guide column (1712) channel is in contact with the side wall of the middle-layer driven anti-rotation guide column (1712); the middle-layer driven sliding screw (1711) can move along the axis of the middle-layer driven anti-rotation guide column (1712); the middle-layer driven ejector pin (1714) is coaxially mounted on the middle-layer driven sliding screw (1711) and can lift the wafer (46) carried on the middle-layer lifting mounting seat (5) under the drive of the middle-layer driven sliding screw (1711); The lower ejector mechanism (14) further comprises a lower driving gear (1406) mounted on the lower lifting mounting seat (7), a lower transmission gear (1409) and a lower driven ejector mechanism; the lower driving gear (1406) is coaxially mounted on the lower driving nut shaft (1403) and can rotate around its axis driven by the lower driving nut shaft (1403); the lower driven ejector mechanism comprises a lower driven gear (1413), a lower driven nut shaft (1414), and a lower driven ejector mechanism. 410), a lower driven anti-rotation guide column (1412), a lower driven sliding screw (1411) and a lower driven ejector pin (1414); the lower transmission gear (1409) is meshed with the lower driving gear (1406), the lower driven gear (1413) is meshed with the lower transmission gear (1409) and is coaxially mounted on the lower driven nut shaft (1410), the lower driven nut shaft (1410) is mounted in the lower lifting mounting seat (7) and can be The lower driven gear (1413) rotates around its axis, the lower driven anti-rotation guide column (1412) is fixedly mounted on the lower lifting mounting seat (7) and coaxially mounted in the lower driven nut shaft (1410), the lower driven sliding screw (1411) is coaxially provided with a lower driven anti-rotation guide column (1412) channel, the outer wall of the lower driven sliding screw (1411) is threadedly matched with the inner wall of the lower driven nut shaft (1410), The side wall of the channel of the lower driven anti-rotation guide column (1412) is in contact with the side wall of the lower driven anti-rotation guide column (1412); the lower driven sliding screw (1411) can move along the axis of the lower driven anti-rotation guide column (1412); the lower driven ejector pin (1414) is coaxially mounted on the lower driven sliding screw (1411) and can lift the wafer (46) carried on the lower lifting mount (7) under the drive of the lower driven sliding screw (1411).

5. The double-layer vacuum hot pressing forming equipment with adjustable parallelism according to claim 1, characterized in that: Also included is an upper hot pressing molding die (16); The upper hot pressing molding die (16) comprises an upper hot pressing molding upper template (1601) and an upper hot pressing molding lower template (1602), wherein the upper hot pressing molding upper template (1601) is mounted on the bottom surface of the upper fixed mounting seat (1), and the upper hot pressing molding lower template (1602) is mounted on the top surface of the middle lifting mounting seat (5), and the upper hot pressing molding lower template (1602) is located directly below the upper hot pressing molding upper template (1601), and the middle lifting mounting seat (5) carries the wafer (46) via the upper hot pressing molding lower template (1602); An upper vacuum sealing ring (38) capable of accommodating a wafer (46) is arranged between the upper hot pressing molding upper template (1601) and the upper hot pressing molding lower template (1602); the two end surfaces of the upper vacuum sealing ring (38) can respectively fit with the bottom surface of the upper hot pressing molding upper template (1601) and the top surface of the upper hot pressing molding lower template (1602); an upper vacuum channel is provided in the upper hot pressing molding lower template (1602); one end of the upper vacuum channel is connected to the upper vacuum sealing ring (38); and the other end of the upper vacuum channel is connected to an upper vacuum pump.

6. The double-layer vacuum hot pressing forming equipment with adjustable parallelism according to claim 1, characterized in that: Also included is a lower hot pressing molding die (12); The lower hot pressing forming mold (12) comprises a lower hot pressing forming upper template (1201) and a lower hot pressing forming lower template (1202); the lower hot pressing forming upper template (1201) is mounted on the bottom surface of the middle lifting mounting seat (5); the lower hot pressing forming lower template (1202) is mounted on the top surface of the lower lifting mounting seat (7); the lower hot pressing forming lower template (1202) is located directly below the lower hot pressing forming upper template (1201); and the lower lifting mounting seat (7) carries the wafer (46) via the lower hot pressing forming lower template (1202); A lower vacuum sealing ring (45) capable of accommodating a wafer (46) is arranged between the lower hot pressing molding upper template (1201) and the lower hot pressing molding lower template (1202); the two end surfaces of the lower vacuum sealing ring (45) can respectively fit with the bottom surface of the lower hot pressing molding upper template (1201) and the top surface of the lower hot pressing molding lower template (1202); a lower vacuum channel is provided in the lower hot pressing molding lower template (1202); one end of the lower vacuum channel is connected to the lower vacuum sealing ring (45); and the other end of the lower vacuum channel is connected to a lower vacuum pump.

7. The double-layer vacuum hot pressing forming equipment with adjustable parallelism according to claim 1, characterized in that: It also includes a double-layer single-arm transport mechanism (21); The double-layer single-arm transport mechanism (21) comprises a manipulator mounting base plate (2101), a cylinder (2102), a linear motion module (2103) and a double-layer single-arm transport manipulator (2104); the fixed end of the cylinder (2102) is mounted on the manipulator mounting base plate (2101), the telescopic end of the cylinder (2102) is mounted on the guide rail of the linear motion module (2103), the double-layer single-arm transport manipulator (2104) is mounted on the slider of the linear motion module (2103), the telescopic direction of the cylinder (2102) is perpendicular to the horizontal plane, and the linear motion module (2103) is arranged on the guide rail of the linear motion module (2103). The length direction of (2103) is parallel to the horizontal plane, and the double-layer single-arm handling robot (2104) is provided with an upper vacuum adsorption gripper (2105) and a lower vacuum adsorption gripper (2106). The upper vacuum adsorption gripper (2105) and the lower vacuum adsorption gripper (2106) can be driven by the cylinder (2102) and the linear moving module (2103) to move simultaneously to between the upper hot pressing forming upper template (1601) and the upper hot pressing forming lower template (1602) and between the lower hot pressing forming upper template (1201) and the lower hot pressing forming lower template (1202).

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