A semiconductor electric heating plate with uniform temperature control

Abstract

The present invention relates to the field of semiconductor electric heating technology, and specifically to a semiconductor electric heating plate with uniform temperature control, comprising: a heating plate body, and a delivery pipe and a return pipe fixed on both sides of the heating plate body, a piston cylinder being fixed in the heating plate body; a rotating rod rotatably mounted in the piston cylinder, a temperature control rotating mechanism connected to the rotating rod being arranged in the piston cylinder; a limit plate slidably mounted on the rotating rod and connected to the temperature control rotating mechanism, an elastic regulating mechanism connected to the limit plate being arranged on the rotating rod; a conduction regulating mechanism being arranged in the heating plate body and connected to the limit plate, a cooling pipe connected to the return pipe being connected to the conduction regulating mechanism, a trigger component connected to the conduction regulating mechanism being arranged on the rotating rod, and the present application can automatically cool and power off the heating plate according to the temperature change in the heating plate body to ensure safety in use.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor electric heating, in particular to a semiconductor electric heating plate with uniform temperature control. Background Art

[0002] The working principle of the semiconductor heating plate mainly relies on the thermal sensitivity of the semiconductor material, and the temperature is monitored and controlled by the change of the resistance value of the temperature sensitive element.

[0003] The core component of the semiconductor heating plate is a temperature-sensitive element made of semiconductor material, usually a thermistor or a thermistor current limiter. When the external temperature changes, the resistance value of these temperature-sensitive elements will change accordingly. By detecting the resistance value of the temperature-sensitive element, the semiconductor heating plate can determine the current temperature.

[0004] During the heating process, if the current or product is abnormal, it may cause overheating, which may directly damage the equipment. Therefore, cooling and power-off are required. However, the existing cooling usually starts when the temperature exceeds the safety value and stops cooling after the temperature drops to the safety value. This causes the semiconductor to be repeatedly cooled and heated, and the semiconductor may deform or crack. Summary of the invention

[0005] The object of the present invention is to provide a semiconductor electric heating plate with uniform temperature control to solve the problems raised in the above background technology.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A semiconductor electric heating plate with uniform temperature control, comprising:

[0008] A heating plate body, and a delivery pipe and a return pipe fixedly mounted on both sides of the heating plate body, wherein a piston cylinder is fixed in the heating plate body;

[0009] Also includes:

[0010] A rotating rod is rotatably mounted in the piston cylinder, wherein a temperature-controlled rotating mechanism connected to the rotating rod is disposed in the piston cylinder, and the temperature-controlled rotating mechanism can drive the rotating rod to rotate when the pressure in the piston cylinder changes;

[0011] A limit plate is slidably mounted on the rotating rod and connected to the temperature control rotating mechanism, the rotating rod is provided with an elastic regulating mechanism connected to the limit plate, and the elastic regulating mechanism can adjust the supporting force of the limit plate when the rotating rod rotates;

[0012] A conduction and regulation mechanism is arranged in the heating plate body and connected to the limit plate. The conduction and regulation mechanism is connected to a cooling pipe connected to the return pipe. The rotating rod is provided with a trigger component connected to the conduction and regulation mechanism. The limit plate can drive the trigger component to move and adjust the conduction state of the cooling pipe through the conduction and regulation mechanism.

[0013] As a further solution of the present invention: the temperature control rotating mechanism includes a guide column fixedly installed in the piston cylinder and symmetrically arranged, the guide column is slidably connected to the limit plate, a piston disk slidably connected to the rotating rod is slidably installed on the guide column, the piston disk is slidably and sealingly connected to the piston cylinder, and a guide assembly connected to the piston disk is provided on the rotating rod.

[0014] As a further solution of the present invention: the guide assembly includes a guide groove opened on the circumferential outer wall of the rotating rod, a first limit block slidingly engaged with the guide groove is fixed to the inner wall of the piston disc, and a first spring abutting against the piston disc is sleeved on the rotating rod.

[0015] As a further solution of the present invention: the elastic regulating mechanism includes a first spiral groove and a second spiral groove provided on the rotating rod, and the rotating rod is provided with a driven component connected to the guide column.

[0016] As a further solution of the present invention: the driven assembly includes a first movable plate and a second movable plate which are slidably mounted on the guide column and slidably connected to the rotating rod, a second limit block which is slidably engaged with the first spiral groove is fixed to the inner wall of the first movable plate, a third limit block which is slidably engaged with the second spiral groove is fixed to the inner wall of the second movable plate, and an elastic structure connected to the first movable plate and the second movable plate is provided on the rotating rod.

[0017] As a further solution of the present invention: the elastic structure includes a second spring and a third spring respectively mounted on the rotating rod, the two ends of the second spring respectively abut against the first movable plate and the limiting plate, and the two ends of the third spring respectively abut against the second movable plate and the limiting plate.

[0018] As a further solution of the present invention: the conduction and regulation mechanism includes a first annular groove, a first transverse groove, a second annular groove, and a second transverse groove formed on the rotating rod, and the first annular groove, the first transverse groove, the second annular groove, and the second transverse groove are connected to each other in sequence from beginning to end; a fourth limiting block is fixed to the inner wall of the limiting plate, which is slidably engaged with the first annular groove, the first transverse groove, the second annular groove, and the second transverse groove; a follower assembly connected to the limiting plate is provided in the heating plate body.

[0019] As a further solution of the present invention: the follower assembly includes a support rod fixedly mounted on the limit plate, a push rod is fixed to the end of the support rod, and a blocking structure connected to the push rod is arranged in the heating plate body.

[0020] As a further solution of the present invention: the sealing structure includes a hollow tube fixedly installed in the heating plate body, the hollow tube is connected to the delivery pipe and the cooling pipe, a sealing disk is slidingly and sealingly connected in the hollow tube, and the sealing disk is fixedly connected to the push rod.

[0021] As a further solution of the present invention: the trigger assembly includes a moving contact fixedly mounted on the limit plate, a rotating plate is rotatably mounted on the end of the rotating rod, the rotating plate is slidably connected to the support rod, and a static contact that abuts against the moving contact is fixed on the rotating plate.

[0022] Compared with the prior art, the beneficial effect of the present invention is as follows: the present application can automatically cool the heating plate body when the temperature exceeds the safety value according to the temperature change in the heating plate body, so as to avoid electrical failure caused by overheating, resulting in damage to the equipment or malfunction. When the temperature in the heating plate body changes, the temperature control rotating mechanism moves. When the temperature exceeds the safety value, the rotating rod will rotate to control the movement of the limit plate through the elastic control mechanism. The limit plate will drive the trigger component and the conduction control mechanism to move. Under the action of the trigger component, the heating plate body is powered off in time. Under the action of the conduction control mechanism, the delivery pipe and the cooling pipe are connected, so as to cool the heating plate body by delivering coolant.

[0023] Through the cooperation of the temperature, rotating rod and limit plate, real-time monitoring of the temperature and control of the circulation of the coolant can be achieved, which has the effect of precise control, ensuring that there will be no equipment damage and performance degradation caused by excessive temperature in the heating plate body. When the temperature in the heating plate body drops to room temperature, the coolant is controlled to stop circulating, so that the cooling process will not be stopped immediately when the temperature in the heating plate body drops to a safe value, so as to prevent the heating plate body from working abnormally, resulting in repeated temperature increases and decreases, which may cause the semiconductor material to be repeatedly cooled and cracked or deformed.

[0024] By monitoring the temperature, the heating plate body is powered off, and when the temperature inside the heating plate body drops to a safe range, the power is automatically connected, which can ensure the safe use of the heating plate body and realize automatic power-on and power-off processing, thereby achieving the effect of taking into account both safety and convenience of use. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1A schematic structural diagram of an embodiment of a semiconductor electric heating plate for uniform temperature control.

[0026] Figure 2 A schematic structural diagram of another angle of an embodiment of a semiconductor electric heating plate for uniform temperature control.

[0027] Figure 3 A schematic diagram of the half-section structure of a heating disk body in one embodiment of a semiconductor electric heating disk with uniform temperature control.

[0028] Figure 4 A schematic diagram of the connection relationship between a partial conduction control mechanism, a trigger component, and an elastic control mechanism in an embodiment of a semiconductor electric heating plate with uniform temperature control.

[0029] Figure 5 A schematic structural diagram of a partial conduction control mechanism, a trigger component, an elastic control mechanism, and a partial temperature control rotating mechanism in an embodiment of a semiconductor electric heating plate with uniform temperature control.

[0030] Figure 6 A schematic diagram of the connection relationship between a trigger component, an elastic regulating mechanism, and a rotating rod in an embodiment of a semiconductor electric heating plate with uniform temperature control.

[0031] Figure 7 for Figure 6 A schematic diagram of the enlarged structure at point A in the middle.

[0032] Figure 8 A schematic diagram of a partially half-section structure of an embodiment of a semiconductor electric heating plate with uniform temperature control.

[0033] Fig. 9 Schematic diagram of the exploded structure of the elastic regulating mechanism, the partially conductive regulating mechanism and the rotating rod in one embodiment of a semiconductor electric heating plate with uniform temperature control.

[0034] Fig.10 for Fig. 9 A magnified schematic diagram of the structure at point B in the middle.

[0035] In the figure: 1. heating plate body; 2. conveying pipe; 3. hollow pipe; 4. cooling pipe; 5. reflux pipe; 6. piston cylinder; 7. rotating rod; 701. first straight groove; 702. first inclined groove; 703. second straight groove; 704. second inclined groove; 8. piston plate; 9. first limit block; 10. guide column; 11. first spring; 12. first spiral groove; 13. second spiral groove; 14. first annular groove; 15. first transverse groove; 16. second annular groove; 17. second transverse groove; 18. first movable plate; 19. second limit block; 20. second spring; 21. second movable plate; 22. third limit block; 23. third spring; 24. limit plate; 25. fourth limit block; 26. rotating plate; 27. support rod; 28. push rod; 29. ​​sealing plate; 30. moving contact; 31. static contact. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] In addition, when an element in the present invention is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only embodiment.

[0038] See also Figure 1-Figure 10 In an embodiment of the present invention, a semiconductor electric heating plate with uniform temperature control comprises:

[0039] A heating plate body 1, and a delivery pipe 2 and a return pipe 5 fixedly mounted on both sides of the heating plate body 1, and a piston cylinder 6 is fixed inside the heating plate body 1;

[0040] Among them, the semiconductor heating plate mainly relies on the thermal properties of semiconductor materials, and monitors and controls the temperature through the change of the resistance value of the temperature sensitive element. When the semiconductor heating plate is working, due to the hard and brittle properties of semiconductor materials, overheating may cause the material to crack or deform, thereby affecting the efficiency and service life of the heating plate. In addition, overheating may also cause electrical failures, such as circuit short circuit or overload, which may further cause equipment damage or malfunction. Therefore, it is necessary to cool the inside of the semiconductor heating plate when heating is abnormal. The delivery pipe 2 is used to deliver the coolant, and the reflux pipe 5 is used to pump the coolant after absorbing heat back into the delivery pipe 2 to ensure that the coolant can be recycled. ‌

[0041] Also includes:

[0042] See also Figure 1-Figure 6 , Figure 8 , Fig. 9 , a rotating rod 7 is rotatably installed in the piston cylinder 6, and a temperature-controlled rotating mechanism connected to the rotating rod 7 is provided in the piston cylinder 6. The temperature-controlled rotating mechanism can drive the rotating rod 7 to rotate when the pressure in the piston cylinder 6 changes. The temperature-controlled rotating mechanism includes a guide column 10 fixedly installed in the piston cylinder 6 and symmetrically arranged, and the guide column 10 is slidably connected to the limit plate 24. A piston disk 8 slidably connected to the rotating rod 7 is slidably installed on the guide column 10, and the piston disk 8 is slidably and sealedly connected to the piston cylinder 6. A guide assembly connected to the piston disk 8 is provided on the rotating rod 7, wherein the guide assembly includes a guide groove opened on the outer wall of the circumference of the rotating rod 7, and a first limit block 9 slidably engaged with the guide groove is fixed on the inner wall of the piston disk 8, and a first spring 11 abutting against the piston disk 8 is sleeved on the rotating rod 7.

[0043] In detail, the piston plate 8 divides the piston cylinder 6 into two spaces, the space on the side facing the return pipe 5 is a closed setting, and the space on the side facing the delivery pipe 2 is a conducting space. The closed space is filled with expansion gas, and the expansion coefficient of the expansion gas is greater than the expansion coefficient of air. Therefore, when the temperature in the piston cylinder 6 changes, the expansion gas will expand or contract accordingly to change the air pressure in the piston cylinder 6. The guide groove can be divided into four sections, namely the first straight groove 701, the first inclined groove 702, the second straight groove 703, and the second inclined groove 704. The first straight groove 701, the first inclined groove 702, the second straight groove 703, and the second inclined groove 704 are connected to each other in sequence. In the initial state, the heating plate body 1 is not When the heating plate body 1 is working, the temperature inside it is consistent with the room temperature, and the first spring 11 is in a compressed state, so that the piston disc 8 is located at the end of the stroke toward the side of the return pipe 5, so that the first limit block 9 is located at the connection position of the first straight groove 701 and the second inclined groove 704. When the heating plate body 1 is working, the temperature inside it will gradually increase, and the heat will be conducted to the piston cylinder 6, causing the expanding gas in the piston cylinder 6 to expand. At this time, the pressure in the enclosed space in the piston cylinder 6 will increase, thereby driving the piston disc 8 to move in the direction away from the return pipe 5 and move along the length direction of the guide column 10, so that the first limit block 9 moves along the length direction of the first straight groove 701, and the piston disc 8 will also compress the first spring 11.

[0044] Preferably, if the temperature in the heating plate body 1 is within a normal range, the first limit block 9 will always be located in the first straight groove 701. If the temperature in the heating plate body 1 is abnormal and higher than the safety value, the first limit block 9 will move to the first inclined groove 702, so that the rotating rod 7 rotates, and the rotating rod 7 also drives the elastic regulating mechanism to move. When the first limit block 9 moves to the position where the first inclined groove 702 and the second straight groove 703 are connected, the rotating rod 7 rotates to the maximum angle, and under the action of the elastic regulating mechanism, the movement of the conduction regulating mechanism is controlled by the limit plate 24, so that the delivery pipe 2 and the cooling pipe 4 are connected. When the coolant flows in the cooling pipe 4, it will react with the heat energy in the heating plate body 1. Heat exchange is performed to cool the heating plate body 1. Through the changes in the expanded gas in the sealed space, the temperature in the piston cylinder 6 can be monitored in real time, thereby avoiding the need for other monitoring equipment such as sensors. It is also necessary to analyze the collected data, and there may be problems with delayed monitoring. Moreover, since the heating plate body 1 is heated, excessively high temperature will also affect the sensitivity of the sensor. Therefore, the present application can avoid such situations. At the same time, when the temperature exceeds the safety value, the rotation of the rotating rod 7 can be automatically controlled to adjust the conduction state of the cooling tube 4, so as to timely cool the heating plate body 1 and ensure the safe use and stable operation of the heating plate body 1.

[0045] See also Figure 3-Figure 10, a limit plate 24 is slidably mounted on the rotating rod 7 and connected to the temperature control rotating mechanism, the rotating rod 7 is provided with an elastic regulating mechanism connected to the limit plate 24, the elastic regulating mechanism can adjust the supporting force of the limit plate 24 when the rotating rod 7 rotates, the elastic regulating mechanism includes a first spiral groove 12 and a second spiral groove 13 provided on the rotating rod 7, the rotating rod 7 is provided with a driven component connected to the guide column 10, wherein the driven component includes a first movable plate 18 and a second movable plate 21 slidably mounted on the guide column 10 and slidably connected to the rotating rod 7, the first A second limit block 19 is fixed to the inner wall of the movable plate 18 and is slidably engaged with the first spiral groove 12. A third limit block 22 is fixed to the inner wall of the second movable plate 21 and is slidably engaged with the second spiral groove 13. An elastic structure connected to the first movable plate 18 and the second movable plate 21 is provided on the rotating rod 7. The elastic structure mentioned above includes a second spring 20 and a third spring 23 respectively sleeved on the rotating rod 7. The two ends of the second spring 20 are respectively abutted against the first movable plate 18 and the limit plate 24, and the two ends of the third spring 23 are respectively abutted against the second movable plate 21 and the limit plate 24.

[0046] It should be noted that the first inclined groove 702 and the second inclined groove 704 are also opened in a spiral shape, and the number of spiral turns is the same as that of the first spiral groove 12 and the second spiral groove 13. In the initial state, under the action of the first spring 11, the piston plate 8 is located at the end of the stroke toward the return pipe 5, so that the first limit block 9 is located at the connection position of the first straight groove 701 and the second inclined groove 704. At this time, the second limit block 19 is located at the end of the stroke of the first spiral groove 12 away from the piston cylinder 6, and the third limit block 22 is located at the end of the stroke of the second spiral groove 13 away from the piston cylinder 6, so that the elastic potential energy of the second spring 20 is greater than the elastic potential energy of the third spring 23. Under the action of the second spring 20 and the third spring 23, the limit plate 24 is subjected to a force moving in the direction away from the piston cylinder 6, so that the limit plate 24 is located at the end of the stroke on the side away from the piston cylinder 6. When the temperature in the heating plate body 1 rises and exceeds the safety value, the first limit block 9 will enter the first inclined groove 702, causing the rotating rod 7 to rotate, and the rotating rod 7 will The first spiral groove 12 and the second spiral groove 13 will be driven to move, so as to control the first movable plate 18 and the second movable plate 21 to move along the length direction of the guide column 10 through the second limit block 19 and the third limit block 22 respectively, and move toward the piston cylinder 6. At this time, the second spring 20 is elastically released, and the third spring 23 is compressed. The elastic potential energy of the third spring 23 will gradually exceed the elastic potential energy of the second spring 20, and the limit plate 24 will be subjected to the force moving toward the piston cylinder 6. When the rotating rod 7 rotates, under the action of the conduction regulating mechanism, it is ensured that the limit plate 24 will not rotate until the first limit block 9 moves to the connection position of the first inclined groove 702 and the second straight groove 703. The conduction regulating mechanism no longer restricts the movement of the limit plate 24. Under the action of the second spring 20 and the third spring 23, the limit plate 24 moves toward the piston cylinder 6. At this time, the limit plate 24 will control the movement of the trigger component, and control the conduction of the cooling pipe 4 through the conduction regulating mechanism, so as to cool the heating plate body 1 through the coolant.

[0047] Preferably, the rotation of the rotating rod 7 can be controlled by the change of temperature, and the rotation of the rotating rod 7 can adjust the compression amount of the second spring 20 and the third spring 23, thereby adjusting the position of the limit plate 24. The cooperation between the temperature, the rotating rod 7 and the limit plate 24 can realize real-time monitoring of the temperature and control the circulation of the coolant, which has the effect of precise control, ensuring that there will be no equipment damage and performance degradation due to excessive temperature in the heating plate body 1.

[0048] See also Figure 3-Figure 10, a conduction regulating mechanism is arranged in the heating plate body 1 and connected to the limit plate 24, the conduction regulating mechanism is connected to the cooling pipe 4 connected to the reflux pipe 5, the conduction regulating mechanism includes a first annular groove 14, a first transverse groove 15, a second annular groove 16, and a second transverse groove 17 provided on the rotating rod 7, the first annular groove 14, the first transverse groove 15, the second annular groove 16, and the second transverse groove 17 are connected to each other in sequence, and the inner wall of the limit plate 24 is fixed with a sliding groove connected to the first annular groove 14, the first transverse groove 15, the second annular groove 16, and the second transverse groove 17 The fourth limit block 25 is embedded, and a follower assembly connected to the limit plate 24 is arranged in the heating plate body 1, wherein the follower assembly includes a support rod 27 fixedly mounted on the limit plate 24, and a push rod 28 is fixed to the end of the support rod 27, and a blocking structure connected to the push rod 28 is arranged in the heating plate body 1, and the blocking structure mentioned above includes a hollow tube 3 fixedly mounted in the heating plate body 1, and the hollow tube 3 is connected with the delivery pipe 2 and the cooling pipe 4, and a sealing disk 29 is slidingly and sealingly connected in the hollow tube 3, and the sealing disk 29 is fixedly connected to the push rod 28.

[0049] Further, in the initial state, since the elastic potential energy of the second spring 20 is greater than the elastic potential energy of the third spring 23, the limit plate 24 has a tendency to move in the direction away from the piston cylinder 6, so that the fourth limit block 25 is located at the connection position of the first annular groove 14 and the second transverse groove 17. Under the action of the limit plate 24, the push rod 28 and the sealing plate 29 are controlled by the support rod 27 to be located at the end of the stroke in the direction of the delivery pipe 2. Under the action of the sealing plate 29, the delivery pipe 2 and the cooling pipe 4 are in a blocked state. When the temperature in the heating plate body 1 is too high and greater than the safety value, the first limit block 9 will move along the length direction of the first inclined groove 702, so that the rotating rod 7 rotates a certain angle, so that the fourth limit block 25 enters the first annular groove 14. Under the action of the fourth limit block 25 and the first annular groove 14, the position of the limit plate 24 will not change. When the rotating rod 7 rotates, it will also pass through the first spiral groove 12 and the second spiral groove 1 The second limiting block 19 and the third limiting block 22 are controlled to move, so that the first movable plate 18 and the second movable plate 21 move toward the direction of the piston cylinder 6. At this time, the second spring 20 is elastically released, and the third spring 23 is compressed, so that the elastic potential energy of the third spring 23 exceeds the elastic potential energy of the second spring 20. When the first limiting block 9 moves to the connecting position of the second straight groove 703 and the first inclined groove 702, the fourth limiting block 25 just moves to the connecting position of the first annular groove 14 and the first transverse groove 15. At this time, the limiting plate 24 can move freely, and the third spring 23 is elastically released, so that the limiting plate 24 moves toward the direction of the piston cylinder 6, and drives the fourth limiting block 25 to move along the length direction of the first transverse groove 15 until the fourth limiting block 25 moves to the connecting position of the first transverse groove 15 and the second annular groove 16. Since the elastic potential energy of the third spring 23 is still greater than the elastic potential energy of the second spring 20 at this time, it is ensured that the position of the limiting plate 24 does not change.

[0050] Preferably, when the limit plate 24 moves, it will also drive the support rod 27 to move, thereby controlling the sealing plate 29 to move in a direction away from the delivery pipe 2 through the push rod 28, so that the delivery pipe 2 and the cooling pipe 4 are connected. At this time, the coolant in the delivery pipe 2 will be delivered to the cooling pipe 4 to cool the heating plate body 1. As the temperature gradually drops, the expanded gas gradually contracts, so that the pressure in the closed space gradually decreases. At this time, the first spring 11 is elastically released and drives the piston plate 8 to move toward the initial position. The piston plate 8 will also drive the first limit block 9 to move along the length direction of the second straight groove 703. Under the action of the first limit block 9 and the second straight groove 703, the rotating rod 7 is in a locked state. When the first limit block 9 disengages from the second straight groove 703 and enters the second inclined groove 704, the rotating rod 7 rotates again and rotates toward the initial angle, thereby controlling the fourth limit block 25 to enter the second annular groove 16 to ensure that the limit The position of the positioning plate 24 will not change, and the rotating rod 7 will also drive the first spiral groove 12 and the second spiral groove 13 to move, so that the first movable plate 18 and the second movable plate 21 move in the direction away from the piston cylinder 6, so that the elastic potential energy of the second spring 20 is again greater than the elastic potential energy of the third spring 23. When the temperature inside the heating plate body 1 returns to room temperature, the first limit block 9 moves to the connection position of the second inclined groove 704 and the first straight groove 701, the rotating rod 7 rotates to the initial angle, and the fourth limit block 25 moves to the connection position of the second annular groove 16 and the second transverse groove 17. The second spring 20 is elastically released and drives the limit plate 24 to move toward the initial position until the fourth limit block 25 moves to the connection position of the second transverse groove 17 and the first annular groove 14. The limit plate 24 will control the movement of the support rod 27, and control the sealing plate 29 to fit with the inner wall of the heating plate body 1 again through the push rod 28 to seal the delivery pipe 2 and the cooling pipe 4.

[0051] Among them, the present application can limit the movement of the limit plate 24 and release the restriction on the limit plate 24, so as to achieve precise control of the circulation of the cooling liquid when the temperature exceeds the safety value, and control the cooling liquid to stop circulating after the temperature in the heating disk body 1 drops to room temperature, so as to achieve the cooling process not being stopped immediately when the temperature in the heating disk body 1 drops to the safety value, so as to prevent the heating disk body 1 from working abnormally and causing repeated increase and decrease in temperature, thereby causing the semiconductor material to be repeatedly cooled and cracked or deformed.

[0052] See also Figure 3-Figure 7A trigger assembly connected to the conduction regulating mechanism is provided on the rotating rod 7, the limit plate 24 can drive the trigger assembly to move, and adjust the conduction state of the cooling tube 4 through the conduction regulating mechanism, the trigger assembly includes a moving contact 30 fixedly mounted on the limit plate 24, a rotating plate 26 is rotatably mounted on the end of the rotating rod 7, the rotating plate 26 is slidably connected to the support rod 27, and a static contact 31 that contacts and cooperates with the moving contact 30 is fixed on the rotating plate 26.

[0053] Furthermore, the moving contact 30 and the static contact 31 are used to control the working state of the heating plate body 1. When the moving contact 30 and the static contact 31 are connected and the power is turned on, the heating plate body 1 will work and heat. In the initial state, the limit plate 24 is located at the end of the stroke away from the piston cylinder 6, so that the moving contact 30 and the static contact 31 are in a connected state. When heating treatment is required, the power switch can be turned on at this time to make the heating plate body 1 work. As the temperature rises and exceeds the safety value, the limit plate 24 will move toward the piston cylinder 6 and control the cooling pipe 4 and the delivery pipe 2 to be connected to cool the inside of the heating plate body 1. At the same time, the limit plate 24 will also drive the moving contact 30 to move away from the static contact 31, so that the heating plate body 1 stops working. When the temperature inside the heating plate body 1 drops to room temperature, the limit plate 24 moves again and controls the delivery pipe 2 and the cooling pipe 4 to be blocked. The limit plate 24 will also drive the moving contact 30 and the static contact 31 to be connected again.

[0054] Preferably, the movement of the limit plate 24 is controlled by the change in temperature to control the connection state of the moving contact 30 and the static contact 31, so that when the temperature exceeds the safety value, the heating plate body 1 can be powered off in time, and when the temperature inside the heating plate body 1 drops to a safe range, the power is automatically connected. In this process, the user is given enough time to disconnect the external power supply, which can ensure the safe use of the heating plate body 1 and realize automatic power-on and power-off processing, thereby achieving the effect of taking into account both safety and convenience of use.

[0055] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0056] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A semiconductor electric heating plate with uniform temperature control, comprising: A heating plate body (1), and a delivery pipe (2) and a return pipe (5) fixedly mounted on both sides of the heating plate body (1), wherein a piston cylinder (6) is fixed inside the heating plate body (1); It is characterized by further comprising: A rotating rod (7) is rotatably mounted in the piston cylinder (6); a temperature-controlled rotating mechanism connected to the rotating rod (7) is provided in the piston cylinder (6); the temperature-controlled rotating mechanism can drive the rotating rod (7) to rotate when the pressure in the piston cylinder (6) changes; a limit plate (24) slidably mounted on the rotating rod (7) and connected to the temperature control rotating mechanism; the rotating rod (7) is provided with an elastic regulating mechanism connected to the limit plate (24); the elastic regulating mechanism is capable of adjusting the supporting force on the limit plate (24) when the rotating rod (7) rotates; A conduction regulating mechanism is arranged in the heating plate body (1) and connected to the limit plate (24); the conduction regulating mechanism is connected to a cooling pipe (4) connected to the return pipe (5); the rotating rod (7) is provided with a trigger component connected to the conduction regulating mechanism; the limit plate (24) can drive the trigger component to move, and adjust the conduction state of the cooling pipe (4) through the conduction regulating mechanism.

2. A semiconductor electric heating plate with uniform temperature control according to claim 1, characterized in that: The temperature control rotating mechanism comprises a guide column (10) fixedly mounted in the piston cylinder (6) and symmetrically arranged, the guide column (10) being slidably connected to the limit plate (24), a piston disc (8) slidably connected to the rotating rod (7) being slidably mounted on the guide column (10), the piston disc (8) being slidably and sealingly connected to the piston cylinder (6), and a guide assembly connected to the piston disc (8) being arranged on the rotating rod (7).

3. A semiconductor electric heating plate with uniform temperature control according to claim 2, characterized in that: The guide assembly comprises a guide groove formed on the outer circumferential wall of the rotating rod (7); a first limit block (9) slidably engaged with the guide groove is fixed to the inner wall of the piston disc (8); and a first spring (11) abutting against the piston disc (8) is sleeved on the rotating rod (7).

4. A semiconductor electric heating plate with uniform temperature control according to claim 2, characterized in that: The elastic regulating mechanism comprises a first spiral groove (12) and a second spiral groove (13) formed on the rotating rod (7), and a driven component connected to the guide column (10) is provided on the rotating rod (7).

5. A semiconductor electric heating plate with uniform temperature control according to claim 4, characterized in that: The driven assembly comprises a first movable plate (18) and a second movable plate (21) which are slidably mounted on the guide column (10) and slidably connected to the rotating rod (7); a second limit block (19) slidably engaged with the first spiral groove (12) is fixed to the inner wall of the first movable plate (18); a third limit block (22) slidably engaged with the second spiral groove (13) is fixed to the inner wall of the second movable plate (21); and an elastic structure connected to the first movable plate (18) and the second movable plate (21) is provided on the rotating rod (7).

6. A semiconductor electric heating plate with uniform temperature control according to claim 5, characterized in that: The elastic structure comprises a second spring (20) and a third spring (23) respectively sleeved on the rotating rod (7), the two ends of the second spring (20) respectively abutting against the first movable plate (18) and the limiting plate (24), and the two ends of the third spring (23) respectively abutting against the second movable plate (21) and the limiting plate (24).

7. The semiconductor electric heating plate with uniform temperature control according to claim 1, characterized in that: The conduction control mechanism comprises a first annular groove (14), a first transverse groove (15), a second annular groove (16), and a second transverse groove (17) which are provided on the rotating rod (7); the first annular groove (14), the first transverse groove (15), the second annular groove (16), and the second transverse groove (17) are connected to each other in sequence from head to tail; a fourth limiting block (25) which is slidably engaged with the first annular groove (14), the first transverse groove (15), the second annular groove (16), and the second transverse groove (17) is fixed to the inner wall of the limiting plate (24); and a follower assembly connected to the limiting plate (24) is provided in the heating plate body (1).

8. The semiconductor electric heating plate with uniform temperature control according to claim 7, characterized in that: The follower assembly comprises a support rod (27) fixedly mounted on the limit plate (24), a push rod (28) being fixed to the end of the support rod (27), and a blocking structure connected to the push rod (28) is provided in the heating plate body (1).

9. A semiconductor electric heating plate with uniform temperature control according to claim 8, characterized in that: The blocking structure comprises a hollow tube (3) fixedly mounted in the heating disk body (1); the hollow tube (3) is connected to the delivery tube (2) and the cooling tube (4); a sealing disk (29) is slidably and sealingly connected in the hollow tube (3); and the sealing disk (29) is fixedly connected to the push rod (28).

10. The semiconductor electric heating plate with uniform temperature control according to claim 8, characterized in that: The trigger assembly comprises a moving contact (30) fixedly mounted on the limit plate (24); a rotating plate (26) is rotatably mounted on the end of the rotating rod (7); the rotating plate (26) is slidably connected to the support rod (27); and a stationary contact (31) is fixed on the rotating plate (26) and is in contact with the moving contact (30).

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