A fully automatic chip desoldering equipment

Abstract

This invention relates to the field of electronic manufacturing technology, specifically to a fully automated chip desoldering equipment. The equipment includes a worktable, a chip loading mechanism mounted on the worktable, and a chip loading mechanism comprising a vibratory feeder, a chip conveying assembly, and a positioning assembly. The vibratory feeder is connected to a horizontal conveying trough via a guide groove. The horizontal conveying trough is fixed to the top of the vibrator and supported by a support plate, ultimately delivering the chip to the positioning trough for positioning. A heating mechanism is located on the worktable and includes a heating body, a solder ball collection box for collecting waste solder, and a desoldering fixture with multiple chip slots. Furthermore, a desoldering robotic arm is mounted on the chip loading mechanism and the heating mechanism. The robotic arm comprises an X-axis movement mechanism and a Z-axis movement mechanism, and its end is equipped with a suction nozzle assembly and a desoldering mechanism. This equipment automates the entire chip desoldering process from loading to desoldering, significantly improving production efficiency and quality, and is suitable for the desoldering process in large-scale integrated circuit manufacturing.

Description

Technical Field

[0001] This invention relates to the field of electronic manufacturing technology, and more specifically to a fully automated chip desoldering equipment. Background Technology

[0002] With the development of technology, all industries are moving towards automation and intelligence. Computers and other intelligent devices are widely used. These intelligent devices have various integrated circuit boards. During the production process of these boards, defective products are inevitable, or the boards may malfunction after a period of use. This is likely due to problems with the circuitry on the integrated circuit board. Many circuit components on the board are intact, thus requiring them to be removed for reuse. For example, Chinese utility model patent CN211802782U discloses an air knife desoldering machine, including a material fixing mechanism for placing materials, a heating mechanism arranged above the material fixing mechanism, hot air desoldering mechanisms arranged at both ends of the material fixing mechanism, and a solder dross collection box. The heating mechanism heats the materials on the material fixing mechanism to melt the solder, and the hot air desoldering mechanism blows the melted solder dross into the solder dross collection box.

[0003] The aforementioned air knife desoldering machine, due to the large air force of the air knife, may not be able to blow the desoldered solder into the predetermined recycling device, thus causing a certain degree of waste. Summary of the Invention

[0004] To address the aforementioned technical problems in existing technologies, this invention provides a fully automated chip desoldering device.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] A fully automatic chip desoldering device is characterized in that it includes a worktable, a chip feeding mechanism on the worktable, the chip feeding mechanism including a vibratory feeder, a chip conveying assembly and a positioning assembly, the vibratory feeder being connected to the positioning assembly through the chip conveying assembly, the positioning assembly including a first positioning block on the worktable and a second positioning block perpendicular to the first positioning block, a positioning groove being provided at the top of the second positioning block, the chip conveying assembly including a vertical vibrator and a horizontal conveying trough, the vertical vibrator being disposed on the first positioning block, the horizontal conveying trough being disposed on the top of the vertical vibrator, a support plate for supporting the horizontal conveying trough being provided at the top of the vertical vibrator, one end of the horizontal conveying trough being connected to the positioning groove and the other end being connected to the vibratory feeder, the vibratory feeder being provided with a guide groove communicating with the horizontal conveying trough;

[0007] A heating mechanism is also provided on the workbench. The heating mechanism includes a heating body, a solder ball storage box set on the side wall of the heating body, and a solder removal fixture embedded in the top surface of the heating body along the width direction. The top surface of the solder removal fixture is provided with multiple chip slots.

[0008] Above the chip feeding mechanism and heating mechanism, there is also a desoldering robotic arm. The desoldering robotic arm includes an X-axis moving mechanism and a Z-axis moving mechanism that is slidably connected to the X-axis moving mechanism. The Z-axis moving mechanism is connected to a suction nozzle assembly, and the suction nozzle assembly is also connected to a desoldering mechanism.

[0009] Preferably, the X-axis moving mechanism includes a first gantry mounted on the worktable, an X-axis drive slide rail mounted on the top of the first gantry, and an X-axis slider slidably mounted on the X-axis slide rail.

[0010] The Z-axis moving mechanism includes a first connecting plate, a Z-axis drive slide rail, and a Z-axis slider. The X-axis slider is connected to one side of the first connecting plate. The Z-axis drive slide rail is located on the opposite side of the first connecting plate and the X-axis slider. The Z-axis slider is slidably connected to the Z-axis drive slide rail.

[0011] The nozzle assembly includes a second connecting plate mounted on the Z-axis slider and a nozzle rod passing through the second connecting plate. The nozzle assembly also includes a CCD camera, which is mounted on the opposite side of the support plate connected to the Z-axis slider.

[0012] Preferably, the desoldering mechanism includes a first mounting plate and a brush assembly slidably mounted on the first mounting plate. The first mounting plate is connected to the side wall of a second connecting plate. A first slide rail and a first slider are arranged longitudinally on the first mounting plate. The brush assembly is connected to the first slider. The brush assembly includes an integrally formed U-shaped plate and a desoldering brush. The U-shaped plate includes a top plate, a bottom plate, and a side plate. The side plate is connected to the first slider. The desoldering brush includes a rod and a brush head. The brush head is located at the bottom of the rod and is detachably connected to the rod. The rod passes through the top plate and the bottom plate. A raised ring is provided on the rod. The raised ring is located above the bottom plate. A spring is also sleeved on the rod. The top surface of the spring abuts against the bottom surface of the bottom plate, and the bottom surface of the spring abuts against the top surface of the raised ring.

[0013] Preferably, the desoldering mechanism further includes a cylinder assembly, which includes a cylinder support frame mounted on a first mounting plate, a mini cylinder mounted on the cylinder support frame, and a connecting block connected to the bottom of the mini cylinder. The connecting block connects the sidewalls of the top plate and the bottom plate.

[0014] Preferably, the worktable is also provided with a chip cleaning arm, which includes an X′ axis moving mechanism, a Z′ axis moving mechanism and a cleaning mechanism. The X′ axis moving mechanism is slidably connected to the Z′ axis moving mechanism, and the cleaning mechanism is slidably connected to the Z′ axis moving mechanism.

[0015] The X′ axis moving mechanism includes a second gantry, an X′ axis drive slide rail mounted on the second gantry, and an X′ axis slider slidably connected to the X′ axis drive slide rail. The Z′ axis moving mechanism includes a third connecting plate, a Z′ axis drive slide rail, and a Z′ axis slider. One side of the third connecting plate is connected to the X′ slider, and the opposite side of the third connecting plate connected to the X′ slider is connected to the Z′ axis drive slide rail. The Z′ axis slider is slidably connected to the Z′ axis drive slide rail.

[0016] Preferably, the cleaning mechanism includes a second mounting plate connected to the Z′ axis slider and a cleaning assembly mounted on the bottom of the second mounting plate. The cleaning assembly includes a Y-axis drive slide rail, a cleaning plate disposed at the bottom of the Y-axis drive slide rail, and an alcohol nozzle, a roller assembly, and a blower disposed at the bottom of the cleaning plate.

[0017] Preferably, the roller assembly includes an active roller and a driven roller, with a dust-free wiping cloth wound between the active roller and the driven roller, and a protective cover provided above the active roller.

[0018] Preferably, the workbench is also provided with a chip transfer mechanism, which includes a support frame and a sliding component inside the support frame. The sliding component includes a second slide rail, a second slider and a ball screw. The sliding component also includes a slide plate, which is set on top of the second slider and the ball nut. One end of the slide plate is provided with a push plate perpendicular to the slide plate.

[0019] Preferably, the chip transfer mechanism further includes an empty disk loading mechanism and a full disk unloading mechanism. The empty disk loading mechanism includes two pairs of parallel empty disk guide columns arranged on the support frame. Each empty disk guide column has a first guide groove. The empty disk loading mechanism also includes a first lifting machine arranged at the bottom of the support frame. The first lifting rod of the first lifting machine is arranged inside the support frame. The empty disk loading mechanism also includes a push rod cylinder. A pair of push rod cylinders are arranged opposite to each other on the support frame.

[0020] Preferably, the full-pan unloading mechanism includes two pairs of parallel full-pan guide columns arranged on the support frame. Each full-pan guide column has a second guide groove. The bottom of the full-pan guide column is also provided with a stop block, which is rotatably connected to the full-pan guide column. The top of the stop block is provided with a stop post, and the bottom of the stop block is inclined. The full-pan unloading mechanism also includes a second elevator arranged at the bottom of the support frame. The second lifting rod of the second elevator is arranged inside the support frame.

[0021] The beneficial effects of this invention are:

[0022] 1. The fully automatic chip desoldering equipment provided by this invention integrates automatic chip feeding, heating, desoldering and other processes into one, which greatly improves production efficiency, reduces manual operation and lowers production costs.

[0023] 2. During the chip loading process, the vibratory feeder, chip conveying assembly, and positioning assembly work together to ensure that each chip is accurately placed in its designated position. Simultaneously, because the desoldering mechanism is embedded in the heating mechanism, the heating body ensures that the desoldering fixture is heated evenly during the heating process, thereby improving the quality of desoldering.

[0024] 3. The desoldering fixture is equipped with multiple chip slots, which allows the desoldering robot arm to desolder multiple chips at once, improving the working efficiency of the desoldering robot arm. In addition, the heating body and the solder ball storage box are detachably connected, which facilitates timely replacement of the solder ball storage box. Attached Figure Description

[0025] Figure 1 This is a perspective view of a fully automated chip desoldering device in the embodiment.

[0026] Figure 2 This is a perspective view of a fully automated chip desoldering device according to an embodiment.

[0027] Figure 3 This is a perspective view of the chip loading mechanism in the embodiment.

[0028] Figure 4 for Figure 3 Enlarged view of a portion of point A in the middle.

[0029] Figure 5 This is a perspective view of the desoldering robotic arm in the embodiment.

[0030] Figure 6 This is a perspective view of the desoldering robotic arm in the embodiment from another angle.

[0031] Figure 7 This is an exploded view of the tin removal mechanism in the embodiment.

[0032] Figure 8 This is a perspective view of the chip cleaning arm in the embodiment.

[0033] Figure 9 for Figure 8 A magnified view of a section at point B.

[0034] Figure 10 This is a perspective view of the chip transmission mechanism in the embodiment.

[0035] Figure 11 This is a perspective view of the empty tray loading mechanism and the full tray unloading mechanism in the embodiment.

[0036] Attached label: 1, workbench;

[0037] 2. Chip feeding mechanism; 201. Vibratory feeder; 202. Guide groove; 203. Chip conveying assembly; 204. Horizontal conveying groove; 205. Vertical vibrator; 206. Support plate; 207. Positioning assembly; 208. First positioning block; 209. Second positioning block; 210. Positioning groove; 211. Heating mechanism; 212. Heating body; 213. Solder ball storage box; 214. Solder removal fixture; 215. Chip slot;

[0038] 3. Desoldering robotic arm; 301. X-axis moving mechanism; 302. First gantry frame; 303. X-axis drive slide rail; 304. X-axis slider; 305. Z-axis moving mechanism; 306. First connecting plate; 307. Z-axis drive slide rail; 308. Z-axis slider; 309. Nozzle assembly; 310. Second connecting plate; 311. Nozzle rod; 312. CCD camera; 313. Desoldering mechanism; 14. First mounting plate; 315. First slide rail; 316. First slider; 317. Brush assembly; 318. U-shaped plate; 319. Top plate; 320. Bottom plate; 321. Side plate; 322. Desoldering brush; 323. Rod; 324. Raised ring; 325. Spring; 326. Brush head; 327. Cylinder assembly; 328. Cylinder support frame; 329. Mini cylinder; 330. Connecting block;

[0039] 4. Chip cleaning arm; 401. X′ axis moving mechanism; 402. Second gantry; 403. X′ axis drive slide rail; 404. X′ axis slider; 405. Z′ axis moving mechanism; 406. Third connecting plate; 407. Z′ axis drive slide rail; 408. Z′ axis slider; 409. Cleaning mechanism; 410. Second mounting plate; 411. Cleaning assembly; 412. Y-axis drive slide rail; 413. Alcohol nozzle; 414. Roller assembly; 415. Driven roller; 416. Driven roller; 417. Dust-free wiping cloth; 418. Protective cover; 419. Blower; 420. Cleaning plate;

[0040] 5. Chip transmission mechanism; 501. Support frame; 502. Sliding component; 503. Second slide rail; 504. Second slider; 505. Ball bearing nut; 506. Lead screw; 507. Slide plate; 508. Push plate; 509. Empty tray loading mechanism; 510. Empty tray guide post; 511. First guide groove; 512. First elevator; 513. First lifting rod; 514. Push rod cylinder; 515. Full tray unloading mechanism; 516. Full tray guide post; 517. Second guide groove; 518. Stop block; 519. Stop post; 520. Second elevator; 521. Second lifting rod. Detailed Implementation

[0041] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0042] like Figures 1 to 11 As shown, this embodiment provides a fully automatic chip desoldering device, including a workbench 1. A chip feeding mechanism 2 is provided on the workbench 1. The chip feeding mechanism 2 includes a vibratory feeder 201, a chip conveying assembly 203, and a positioning assembly 207. The vibratory feeder 201 is connected to the positioning assembly 207 through the chip conveying assembly 203. The positioning assembly 207 includes a first positioning block 208 and a second positioning block 209 perpendicular to the first positioning block 208, and a positioning groove 210 is provided on the top of the second positioning block 209.

[0043] The chip delivery assembly 203 includes a vertical vibrator 205 mounted on a first positioning block 208 and a horizontal delivery trough 204 mounted on top of the vertical vibrator 205. A support plate 206 is also mounted on top of the vertical vibrator 205 to support the horizontal delivery trough 204. One end of the horizontal delivery trough 204 is connected to a positioning trough 210, and the other end is connected to a vibrating disk 201. The top of the vibrating disk 201 is also provided with a guide groove 202 communicating with the horizontal delivery trough 204. In use, when chip loading is required, the vibrating disk 201 begins to generate high-frequency vibration. The chip in the vibrating disk 201 rises along a spiral track within the vibrating disk 201 and moves to the horizontal delivery trough 204 via the guide groove 202. Once the chip has moved into the horizontal delivery trough 204, the vertical vibrator 205 is energized, causing the horizontal delivery trough 204 to vibrate, thus allowing the chip to continue moving until it reaches the positioning trough 210.

[0044] Furthermore, the workbench 1 is also equipped with a desoldering robotic arm 3 and a heating mechanism 211. The heating mechanism 211 is used to heat the chip, making it easier for the desoldering robotic arm 3 to remove solder balls from the chip more quickly. The heating mechanism 211 includes a heating body 212, a solder ball collection box 213, and a desoldering fixture 214. The solder ball collection box 213 is located on the left side wall of the heating body 212 (for attachment). Figure 4The heating body 212 is detachably connected to the heating main body 212. A T-shaped groove along the width of the heating body 212 is provided on its top. A desoldering fixture 214 is embedded in the heating body 212 through the T-shaped groove. The heating body 212 heats the desoldering fixture 214. Several chip slots 215 are also provided on the top surface of the desoldering fixture 214. By providing multiple chip slots 215 on the desoldering fixture 214, the desoldering mechanism 313 can desolder multiple chips at once, improving its working efficiency. When a chip is placed in a chip slot 215, the surface of the chip is flush with the surface of the desoldering fixture 214, and the solder balls on the chip are higher than the surface of the desoldering fixture 214, facilitating the desoldering mechanism 313 to remove the solder balls from the chip.

[0045] The desoldering robotic arm 3 is positioned above the heating mechanism 211 and the chip loading mechanism 2. The desoldering robotic arm 3 is used to transport the chip from the positioning slot 210 to the chip slot 215 and then remove the solder. The desoldering robotic arm 3 includes an X-axis moving mechanism 301, a Z-axis moving mechanism 305, a nozzle assembly 309, and a desoldering mechanism 313. The X-axis moving mechanism 301 is slidably connected to the Z-axis moving mechanism 305, the nozzle assembly 309 is slidably connected to the Z-axis moving mechanism 305, and the desoldering mechanism 313 is fixedly connected to the nozzle assembly 309. The X-axis moving mechanism 301 includes a first gantry 302, an X-axis drive slide rail 303 mounted on top of the first gantry 302, and an X-axis slider 304 slidably mounted on the X-axis drive slide rail 303. The Z-axis moving mechanism 305 includes a first connecting plate 306, a Z-axis drive slide rail 307, and a Z-axis slider 308. One side of the first connecting plate 306 is connected to the X-axis slider 304. The Z-axis drive slide rail 307 is located on the opposite side of the first connecting plate 306 and the X-axis slider 304. The Z-axis slider 308 is slidably connected to the Z-axis drive slide rail 307. (The text also mentions a nozzle assembly.) 309 includes a second connecting plate 310 mounted on the Z-axis slider 308 and a suction rod 311 passing through the second connecting plate 310. The suction rod 311 is used to transport the chip from the positioning groove 210 to the chip groove 215. The suction assembly 309 also includes a CCD camera 312, which is mounted on the opposite side of the support plate 206 connected to the Z-axis slider 308. The CCD camera 312 can identify the chip in the positioning groove 210, so that the suction rod 311 can accurately pick up the chip in the positioning groove 210 and transport it to the chip groove 215.

[0046] The desoldering mechanism 313 includes a first mounting plate 314 and a brush assembly 317. The first mounting plate 314 is mounted on the side wall of the second connecting plate 310. The brush assembly 317 is slidably connected to the first mounting plate 314. Specifically, the first mounting plate 314 has a first slide rail 315 and a first slider 316 arranged longitudinally. The brush assembly 317 is connected to the first slider 316. The brush assembly 317 includes an integrally formed U-shaped plate 318 and a desoldering brush 322. The U-shaped plate 318 includes a top plate 319, a bottom plate 320 and a side plate 321. The side plate 321 of the U-shaped plate 318 is connected to the first slider 316. The desoldering brush 322 includes a rod 323 and a brush head 326. The brush head 326 is located at the bottom of the rod 323 and is detachably connected to the rod 323. The rod 323 passes through the top plate 319 and the bottom plate 320. A raised ring 324 is provided on the rod 323, which is located above the bottom plate 320. A spring 325 is also sleeved on the rod 323. The top surface of the spring 325 abuts against the bottom surface of the top plate 319, and the bottom surface of the spring 325 abuts against the top surface of the raised ring 324. By providing a spring 325 on the rod 323, it has a certain buffering function to prevent the brush head 326 from damaging the chip.

[0047] The desoldering mechanism 313 also includes a cylinder assembly 327, which includes a cylinder support frame 328, a mini cylinder 329, and a connecting block 330. The cylinder support frame 328 is mounted on the first mounting plate 314, the mini cylinder 329 is mounted on the cylinder frame, and the connecting block 330 is located below the mini cylinder 329 and connected to it. The connecting block 330 connects the top plate 319 and the side wall of the bottom plate 320, providing downward pressure to the brush assembly 317, making the working state of the brush assembly 317 more stable during operation.

[0048] Furthermore, the workbench 1 is also equipped with a chip cleaning arm 4, which is used to clean the chips after desoldering by the desoldering robotic arm 3. The chip cleaning arm 4 includes an X′ axis moving mechanism 401, a Z′ axis moving mechanism 405, and a cleaning mechanism 409. The X′ axis moving mechanism 401 is slidably connected to the Z′ axis moving mechanism 405, and the cleaning mechanism 409 is slidably connected to the Z′ axis moving mechanism 405. The X′ axis moving mechanism 401 includes a second gantry 402, an X′ axis drive slide rail 403, and a Z′ axis slider. The X′ axis drive slide rail 403 is located on the top of the second gantry 402, and the X′ axis slider 404 is slidably connected to the X′ axis drive slide rail 403. The Z′ axis moving mechanism 405 includes a third connecting plate 406, a Z′ axis drive slide rail 407, and a Z′ axis slider 408. One side of the third connecting plate 406 is connected to the X′ slider, and the opposite side of the third connecting plate 406 connected to the X′ slider is connected to the Z′ axis drive slide rail 407. The Z′ axis slider 408 is slidably connected to the Z′ axis drive slide rail 407. The cleaning mechanism 409 includes a second mounting plate 410 and a cleaning assembly 411. The second mounting plate 410 is connected to the Z′ axis slider 408. The cleaning assembly 411 is located at the bottom of the second mounting plate 410. The cleaning mechanism includes a Y-axis drive slide rail 412 and a cleaning plate 420. The Y-axis drive slide rail 412 is located at the bottom of the second mounting plate 410, and the cleaning plate 420 is located at the bottom of the Y-axis drive slide rail 412. From front to back, the bottom of the cleaning plate 420 is provided with an alcohol nozzle 413, a roller assembly 414, and a blower 419. The alcohol nozzle 413, the roller assembly 414, and the blower 419 work together to clean the desoldered chip. The roller assembly 414 includes a driving roller 415 and a driven roller 416. A lint-free wiping cloth 417 is wound between the active roller 415 and the driven roller 416. A protective cover 418 is also provided above the active roller 415. In use, after the desoldering robotic arm 3 removes the solder, it moves to one side. The cleaning component 411 in the chip cleaning arm 4 moves through the X, Y, and Z axes and reaches above the desoldering fixture 214. First, the alcohol nozzle 413 on the cleaning component 411 sprays out alcohol. Then, it actively rolls and wipes the chip surface with the lint-free cloth. When the active roller 415 rolls and wipes the chip, the protective cover 418 on the active roller 415 prevents the solder ball residue that has not been completely removed from the chip from splashing and contaminating the unused lint-free wiping cloth 417. Finally, the blower 419 dries the chip surface.

[0049] Furthermore, a chip transfer mechanism 5 is also provided on the workbench 1. After the chip is desoldered and cleaned, the suction nozzle assembly 309 in the desoldering robotic arm 3 transports the chip to the chip transfer mechanism 5 for unloading via the suction nozzle rod 311. The chip transfer mechanism 5 includes a support frame 501, and a sliding assembly 502 is provided inside the support frame 501. The sliding assembly 502 includes a second slide rail 503, a second slider 504, a ball nut 505, and a lead screw 506. The second slider 504 is disposed on the second slide rail 503, and the ball nut 505 is sleeved on the lead screw. The sliding assembly 502 also includes a slide plate 507, which is disposed on the top of the second slider 504 and the ball nut 505 and is fixedly connected to the top of the second slider 504 and the ball nut 505. A push plate 508 perpendicular to the slide plate 507 is provided at one end of the slide plate 507. The push plate 508 is used to push the material tray supporting the slide plate 507.

[0050] An empty tray feeding mechanism 509 is also provided on the support frame 501. The empty tray feeding mechanism 509 includes two pairs of parallel empty tray guide columns 510 arranged on the support frame 501. Each empty tray guide column 510 has a first guide groove 511. The material trays are stacked in the first guide groove 511. The empty tray guide columns 510 are used to prevent the material trays from tilting or falling. The empty tray feeding mechanism 509 also includes a first elevator 512. The first elevator 512 is located at the bottom of the support frame 501. The first lifting rod 513 in the first elevator 512 is located inside the support frame 501. The first lifting rod 513 has a pair of material trays stacked in the empty tray feeding mechanism 509 for supporting the material trays. The empty tray feeding mechanism 509 also includes a push rod cylinder 514. A pair of push rod cylinders 514 are arranged opposite to each other on the support frame 501. The push rod cylinders 514 are used to press the material trays. In use, when the slide plate 507 moves directly below the empty tray loading mechanism 509, a pair of push rod cylinders 514 will first release the material tray that is being held in place. At this time, the first lifting mechanism 512 drives the first lifting rod 513 to move downward. After the lowest material tray is placed on the slide plate 507, the slide cylinder holds the remaining material tray in place. Finally, the slide plate 507 and the push plate 508 move the material tray to the other end of the support frame 501, and the suction rod 311 transports the chip onto the material tray.

[0051] A full-pan unloading mechanism 515 is also provided on the support frame 501, and the full-pan unloading mechanism 515 is located to the left of the empty-pan loading mechanism 509 (attached). Figure 10The full-disk unloading mechanism 515 includes two pairs of parallel full-disk guide columns 516 set on the support frame 501. The full-disk guide columns 516 prevent the material tray filled with chips from tilting or even falling. Each full-disk guide column 516 is provided with a second guide groove 517. The bottom of the full-disk guide column 516 is also provided with a stop block 518, which is rotatably connected to the full-disk guide column 516. The top of the stop block 518 is provided with a stop post 519, and the bottom of the stop block 518 is inclined. The full-disk unloading mechanism 515 also includes a second elevator 520 set at the bottom of the support frame 501. The second lifting rod 521 of the second elevator 520 is set inside the support frame 501. In use, after the suction nozzle rod 311 is filled with chips, the slide plate 507 will support the material tray filled with chips and move it to below the full tray unloading mechanism 515. At this time, the second lifting rod 521 in the second elevator 520 will drive the full tray to move upward. The full tray will contact the stop block 518 from below and lift the stop block 518. When the material tray separates from the stop block 518, the stop block 518 will return to its original position under the action of gravity. The stop block 518 will remain perpendicular to the second guide post on the left and right sides of the stop post 519. Then, the second elevator 520 will drive the second lifting rod 521 to move downward until the full tray is placed on the stop block 518. This process is repeated to stack the full trays on the stop block 518. When the full trays on the stop block 518 are stacked, they are manually removed and stacked again.

[0052] In the description of this invention, it is obvious that the described embodiments are only a part of the embodiments of the invention, and not all of them. The components of the embodiments of the invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0053] Therefore, the above detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0054] In the description of this invention, it should be noted that the terms "middle," "upper," "lower," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this invention is in use. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention. In addition, the terms "first," "second," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0055] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "set," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection. They can refer to a mechanical connection or an electrical connection. They can refer to a direct connection or an indirect connection through an intermediate medium, or a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

Claims

1. A fully automatic chip desoldering device, characterized in that, The system includes a workbench (1), on which a chip feeding mechanism (2) is provided. The chip feeding mechanism (2) includes a vibratory feeder (201), a chip conveying assembly (203), and a positioning assembly (207). The vibratory feeder (201) is connected to the positioning assembly (207) through the chip conveying assembly (203). The positioning assembly (207) includes a first positioning block (208) disposed on the workbench (1) and a second positioning block (209) perpendicular to the first positioning block (208). A positioning groove (210) is provided at the top of the second positioning block (209). The chip conveying assembly (203) includes a vertical vibrator (205) and a horizontal conveying trough (204). The vertical vibrator (205) is disposed on the first positioning block (208), and the horizontal conveying trough (204) is disposed on the top of the vertical vibrator (205). A support plate (206) for supporting the horizontal conveying trough (204) is also provided on the top of the vertical vibrator (205). One end of the horizontal conveying trough (204) is... The positioning groove (210) is connected to the other end, and the vibratory feeder (201) is connected to the other end. The vibratory feeder (201) is provided with a guide groove (202) that communicates with the horizontal conveying groove (204). The worktable (1) is also provided with a heating mechanism (211). The heating mechanism (211) includes a heating body (212), a solder ball storage box (213) provided on the side wall of the heating body (212), and a solder removal fixture (214) embedded in the top surface of the heating body (212) along the width direction. The top surface of the desoldering fixture (214) is provided with multiple chip slots (215); a desoldering robot arm (3) is also provided above the chip loading mechanism (2) and the heating mechanism (211). The desoldering robot arm (3) includes an X-axis moving mechanism (301) and a Z-axis moving mechanism (305) slidably connected to the X-axis moving mechanism (301). The Z-axis moving mechanism (305) is connected to a nozzle assembly (309), and a desoldering mechanism (313) is also connected to the nozzle assembly (309).The desoldering mechanism (313) includes a first mounting plate (314) and a brush assembly (317) slidably mounted on the first mounting plate (314). The first mounting plate (314) is connected to the side wall of a second connecting plate (310). A first slide rail (315) and a first slider (316) are longitudinally arranged on the first mounting plate (314). The brush assembly (317) is connected to the first slider (316). The brush assembly (317) includes an integrally formed U-shaped plate (318) and a desoldering brush (322). The U-shaped plate (318) includes a top plate (319), a bottom plate (320), and a side plate (321). The side plate (321) is connected to... The first slider (316) and the desoldering brush (322) include a rod (323) and a brush head (326). The brush head (326) is located at the bottom of the rod (323) and is detachably connected to the rod (323). The rod (323) passes through the top plate (319) and the bottom plate (320). A raised ring (324) is provided on the rod (323). The raised ring (324) is located above the bottom plate (320). A spring (325) is also sleeved on the rod (323). The top surface of the spring (325) abuts against the bottom surface of the top plate (319), and the bottom surface of the spring (325) abuts against the top surface of the raised ring (324). The worktable (1) is also provided with The chip transfer mechanism (5) includes a support frame (501), a sliding component (502) inside the support frame (501), the sliding component (502) including a second slide rail (503), a second slider (504) and a ball screw (506), and the sliding component (502) also includes a slide plate (507), the slide plate (507) is set on the top of the second slider (504) and the ball nut (505), and one end of the slide plate (507) is provided with a push plate (508) perpendicular to the slide plate (507); the chip transfer mechanism (5) also includes an empty tray loading mechanism (509) and a full tray loading mechanism. The unloading mechanism (515) and the empty tray loading mechanism (509) include two pairs of parallel empty tray guide columns (510) arranged on the support frame (501). Each empty tray guide column (510) has a first guide groove (511). The empty tray loading mechanism (509) also includes a first elevator (512) arranged at the bottom of the support frame (501). The first lifting rod (513) of the first elevator (512) is arranged inside the support frame (501). The empty tray loading mechanism (509) also includes a push rod cylinder (514), and a pair of push rod cylinders (514) are arranged opposite to each other on the support frame (501).

2. The fully automatic chip desoldering equipment according to claim 1, characterized in that, The X-axis moving mechanism (301) includes a first gantry (302) mounted on the worktable (1), an X-axis drive slide rail (303) mounted on the top of the first gantry (302), and an X-axis slider (304) slidably mounted on the X-axis drive slide rail (303); the Z-axis moving mechanism (305) includes a first connecting plate (306), a Z-axis drive slide rail (307), and a Z-axis slider (308), with the X-axis slider (304) connected to one side of the first connecting plate (306), and the X-axis drive slide rail (307) mounted on the X-axis slide rail (308). On the opposite side of the first connecting plate (306) connected to the X-axis slider (304), the Z-axis slider (308) is slidably connected to the Z-axis drive slide rail (307); the nozzle assembly (309) includes a second connecting plate (310) mounted on the Z-axis slider (308) and a nozzle rod (311) passing through the second connecting plate (310). The nozzle assembly (309) also includes a CCD camera (312), which is mounted on the opposite side of the support plate (206) connected to the Z-axis slider (308).

3. The fully automatic chip desoldering equipment according to claim 2, characterized in that, The desoldering mechanism (313) also includes a cylinder assembly (327), which includes a cylinder support frame (328) mounted on a first mounting plate (314), a mini cylinder (329) mounted on the cylinder support frame (328), and a connecting block (330) connected to the bottom of the mini cylinder (329), the connecting block (330) connecting the top plate (319) and the side wall of the bottom plate (320).

4. The fully automatic chip desoldering equipment according to claim 1, characterized in that, The workbench (1) is also equipped with a chip cleaning arm (4), which includes an X' axis moving mechanism (401), a Z' axis moving mechanism (405) and a cleaning mechanism (409). The X' axis moving mechanism (401) and the Z' axis moving mechanism (405) are slidably connected, and the cleaning mechanism (409) and the Z' axis moving mechanism (405) are slidably connected. The X' axis moving mechanism (401) includes a second gantry (402), an X' axis drive slide rail (403) disposed on the second gantry (402), and an X' axis slider (404) slidably connected to the X' axis drive slide rail (403). The Z' axis moving mechanism (405) includes a third connecting plate (406), a Z' axis drive slide rail (407), and a Z' axis slider (408). One side of the third connecting plate (406) is connected to the X' slider, and the opposite side of the third connecting plate (406) connected to the X' slider is connected to the Z' axis drive slide rail (407). The Z' axis slider (408) is slidably connected to the Z' axis drive slide rail (407).

5. The fully automatic chip desoldering equipment according to claim 4, characterized in that, The cleaning mechanism (409) includes a second mounting plate (410) connected to the Z´ axis slider (408) and a cleaning assembly (411) mounted on the bottom of the second mounting plate (410). The cleaning assembly (411) includes a Y-axis drive slide rail (412) and a cleaning plate (420) disposed at the bottom of the Y-axis drive slide rail (412). The bottom of the cleaning plate (420) is provided with an alcohol nozzle (413), a roller assembly (414) and a blower (419).

6. The fully automatic chip desoldering equipment according to claim 5, characterized in that, The roller assembly (414) includes an active roller (415) and a driven roller (416), with a dust-free wiping cloth (417) wrapped between the active roller (415) and the driven roller (416), and a protective cover (418) provided above the active roller (415).

7. The fully automatic chip desoldering equipment according to claim 1, characterized in that, The full-pan unloading mechanism (515) includes two pairs of parallel full-pan guide columns (516) set on the support frame (501). Each full-pan guide column (516) is provided with a second guide groove (517). The bottom of the full-pan guide column (516) is also provided with a stop block (518). The stop block (518) is rotatably connected to the full-pan guide column (516). The top of the stop block (518) is provided with a stop column (519). The bottom of the stop block (518) is inclined. The full-pan unloading mechanism (515) also includes a second elevator (520) set at the bottom of the support frame (501). The second lifting rod (521) of the second elevator (520) is set inside the support frame (501).

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