Liquid phase forming ceramic-modified filler composite infrared illuminant and preparation method thereof

Abstract

The invention belongs to the technical field of infrared illuminants, and particularly discloses a liquid phase forming ceramic-modified filler composite infrared illuminant and a preparation method thereof.The structure of the liquid phase forming ceramic-modified filler composite infrared illuminant sequentially comprises a substrate, a transition layer and a functional layer from bottom to top; the transition layer is prepared by doping a high-temperature insulating material with precursor polymer ceramic through high-temperature pyrolysis and curing, and the functional layer is prepared by mixing the precursor polymer ceramic with modified filler through high-temperature pyrolysis and curing. The liquid-phase forming ceramic has excellent high-temperature performance, has a flexible processing technology and can be compatible with an MEMS technology, and the performance of the material can be regulated and controlled by modifying filler doping, so that the high-temperature stability of the infrared luminophor is improved, the design period is shortened, the preparation cost is reduced, and the spectral efficiency of the luminophor is improved.

Description

Technical Field

[0001] The invention belongs to the technical field of infrared luminescent bodies, and in particular relates to a liquid-phase formed ceramic-modified filler composite infrared luminescent body and a preparation method thereof. Background Art

[0002] Infrared luminescent bodies have the advantages of high radiation intensity, good stability and fast response speed, and are widely used in imaging, energy application, sensing and biomedicine. However, in applications, infrared luminescent bodies show problems such as high energy consumption, large volume and low thermal efficiency. To address the above problems, it is particularly important to develop sensors with higher spectral efficiency and faster modulation frequency. The usual optimization method is to use MEMS technology to design some high-emissivity surfaces to improve the spectral efficiency at a given wavelength. This can be achieved by designing tiny structures, applying different coatings, etc., but the above methods have a long R&D cycle and high design and preparation costs. Therefore, it is very necessary to design a new infrared luminescent body with high thermal efficiency, adjustable performance and low R&D and preparation costs. In addition, the operating temperature of infrared luminescent bodies is usually as high as 1000K. In high-temperature environments, infrared luminescent bodies will experience problems such as signal attenuation and poor high-temperature stability. Therefore, there are also requirements for the temperature resistance of sensitive materials of new infrared luminescent bodies.

[0003] Precursor ceramics (PDCs) are sintered into porcelain through liquid phase, which is more flexible in preparation. They can be prepared through screen printing, Weisenberg direct writing, 3D printing, spraying, laser ablation, nanoimprinting and other processes. They can realize in-situ preparation of large-format, high-curvature substrates, and directly prepare the device at the required position for integrated packaging, so as to achieve stable and reliable installation of the device, and are compatible with MEMS technology, realizing the complementary advantages between the two. PDCs can be artificially designed to purposefully introduce some rare earth elements or other special materials, which are evenly distributed in a stable ceramic matrix, thereby giving it excellent performance. By adding specific rare earth elements or other additives, PDCs can adjust the chemical properties of ceramic materials (electrical conductivity, thermal conductivity, etc.). In addition, microstructures with high emissivity surfaces can be prepared through processes such as 3D printing and laser ablation, thereby improving emission efficiency, controlling performance, and reducing R&D costs and preparation cycles. In addition, the prepared ceramics exhibit excellent high-temperature properties, such as corrosion resistance, oxidation resistance, thermal shock resistance, and high-temperature stability. The oxides and nitrides produced by annealing the precursor ceramics at high temperatures themselves have excellent high-temperature resistance. In applications, the oxides and nitrides produced by annealing will be used to wrap modified doped fillers to improve the overall high-temperature resistance. They can survive above 1800K and are suitable for high-temperature applications.

[0004] In summary, PDCs have excellent high-temperature performance, flexible processing technology that is compatible with MEMS technology, and can regulate the performance of materials by doping to improve the high-temperature stability of infrared light emitters, shorten the design cycle, reduce preparation costs, and improve the spectral efficiency of light emitters. However, there are currently no reports on the use of PDCs technology to prepare infrared light emitters. Summary of the invention

[0005] The purpose of the present invention is to overcome the defects of the prior art and provide a liquid-phase formed ceramic-modified filler composite infrared light-emitting body and a preparation method thereof. By using PDCs as a high-temperature adhesive for high-temperature material modification and composite design, combined with other thermal conductive and radiation materials, the construction and application of efficient and uniform infrared light-emitting bodies in high-temperature environments can be achieved, and the problems of thermal efficiency, adjustable performance and service life of infrared light-emitting bodies in existing high-temperature environments can be solved.

[0006] In order to achieve the above objectives, one of the technical solutions of the present invention is: a liquid-phase formed ceramic-modified filler composite infrared luminescent body, the structure of which includes a substrate, a transition layer and a functional layer from bottom to top; the transition layer is made of high-temperature insulating material doped with a precursor polymer ceramic and obtained by high-temperature pyrolysis and curing, and the functional layer is made of a precursor polymer ceramic mixed with a modified filler and obtained by high-temperature pyrolysis and curing.

[0007] In a preferred embodiment of the present invention, the substrate is a metal substrate or an insulating substrate.

[0008] Further preferably, the metal substrate includes but is not limited to one of nickel-based alloy, stainless steel, iron, and aluminum, and the insulating substrate includes but is not limited to one of aluminum oxide, aluminum nitride, and polyimide.

[0009] In a preferred embodiment of the present invention, the high temperature insulating material includes but is not limited to ZrO 2 、Al 2 O 3 、SiO 2 , BN, YBa 2 Cu 3 O 7 One of them.

[0010] In a preferred embodiment of the present invention, the modified filler includes but is not limited to conductive materials, N-type semiconductor materials, P-type semiconductor materials, amphoteric semiconductor materials and Al 2 O 3 , one of YSZ.

[0011] Further preferably, the conductive material includes but is not limited to RuO 2 、ZrO 2 、Ag、AgPd、TiB2 , Pt, the N-type semiconductor material includes but is not limited to V 2 O 5 、TiO 2 , WO 3 SnO 2 、 2 O 5 、BaTiO 3 、PbCrO 4 , ZnO, ZnF 2 , Fe 2 O 3 、In 2 O 3 The P-type semiconductor material includes but is not limited to Cr 2 O 3 、MnO、Ag 2 O, CoO, Pr 2 O 3 、CuI、Te、Sb 2 S 3 , Hg 2 O、MoO 2 , ITO, amphoteric semiconductor materials include but are not limited to SiC, UO 2 、PbTe、Ge、Si、Co 3 O 4 、TiS 2 , Mn 3 O 4 、PbSe。

[0012] Further preferably, the modified filler is slurry or powder particles, wherein the particle size of the powder particles is between 50 nm and 50 μm.

[0013] In a preferred embodiment of the present invention, the adhesion strength between the substrate and the transition layer, and between the transition layer and the functional layer is greater than 5 MPa.

[0014] In a preferred embodiment of the present invention, the thickness of the transition layer is 10-2000 μm, and the thickness of the functional layer is 20-100 μm.

[0015] In order to achieve the above purpose, the second technical solution of the present invention is: a method for preparing a liquid-phase formed ceramic-modified filler composite infrared luminous body, comprising the following steps:

[0016] (1) Cleaning the substrate: After ultrasonic cleaning, the substrate is cleaned with a plasma cleaner, and then cleaned with alcohol and dried;

[0017] (2) preparing transition layer slurry and functional layer slurry: mixing the precursor polymer ceramic slurry and the high temperature insulating material powder in proportion, stirring and ultrasonically mixing to obtain a bubble-free high temperature insulating precursor liquid, i.e., transition layer slurry; mixing the precursor polymer ceramic slurry and the modified filler powder in proportion, stirring and ultrasonically mixing to obtain a bubble-free high temperature precursor liquid, i.e., functional layer slurry;

[0018] (3) preparing a transition layer: coating the transition layer slurry prepared in step (2) on the substrate, performing a curing pretreatment, then performing a heat treatment in air, and then cooling the substrate to room temperature to form a transition layer;

[0019] (4) preparing a functional layer: coating the functional layer slurry prepared in step (2) on the transition layer prepared in step (3), and then performing a curing pretreatment; then performing a heat treatment in air, and then cooling to room temperature to form a functional layer;

[0020] (5) High-temperature reliable lead interconnection: Make high-temperature solder joints, weld wires, and achieve energy output and temperature control of the functional layer by changing the input voltage.

[0021] In a preferred embodiment of the present invention, in step (2), the amount of high temperature insulating material powder added to the precursor polymer ceramic slurry and the amount of modified filler powder added to the precursor polymer ceramic slurry are both 5-90wt%.

[0022] In a preferred embodiment of the present invention, in step (3), the curing pretreatment temperature is 200-400°C, the insulation time is 30-100min, the heat treatment process is a heating rate of 4-12°C / min, a temperature of 800-1200°C, a insulation time of 10-120min, and a cooling rate of 4-12°C / min.

[0023] In a preferred embodiment of the present invention, in step (4), the curing pretreatment temperature is 200-400°C, the insulation time is 30-100min, the heat treatment process is a heating rate of 3-12°C / min, a temperature of 600-1500°C, a insulation time of 40-120min, and a cooling rate of 3-12°C / min.

[0024] In a preferred embodiment of the present invention, the coating method in steps (3) and (4) includes but is not limited to one of direct writing, scraping, screen printing, electrospray printing, etc.

[0025] Compared with the prior art, the present invention has the following beneficial effects:

[0026] 1. The infrared light-emitting body of the present invention has excellent performance: the precursor ceramic has excellent stability at high temperature and can maintain good adhesion performance, making it suitable for working environments under high temperature conditions and can survive above 2000°C; the conductive filler is mixed with the precursor ceramic to enhance the high temperature resistance of the material, making it more suitable for application in the field of infrared light-emitting bodies and improving the temperature tolerance of the overall equipment; in addition, by changing the type and proportion of the doping material, the performance of the infrared light-emitting body can be precisely controlled to meet different process, application and environmental requirements.

[0027] 2. The infrared luminescent body of the present invention has excellent performance control capability: the precursor ceramic can be doped with different thermally conductive and electrically conductive materials to control its thermal conductivity, resistivity and hardness. According to different usage scenarios, it can be controlled by doping and various preparation process designs to achieve efficient radiation in high temperature environments.

[0028] 3. The infrared luminescent body of the present invention has excellent processing performance: the prefabricated slurries of the transition layer and the functional layer are both made of precursor ceramics doped with modified fillers and stirred and mixed to become liquid slurries, which can be prepared by various processes such as Weissenberg direct writing, 3D printing, screen printing, scraping, photolithography and laser etching, etc., which are compatible with MEMS technology, can be used in various occasions and can be attached to the surface of various objects to achieve in-situ preparation.

[0029] 4. The present invention has a self-protection function and an integrated packaging design: the precursor ceramic can produce oxides and nitrides at high temperatures to wrap and protect the modified filler, thereby achieving self-protection; and in the preparation process, due to the excellent processing properties of the precursor ceramic, the infrared light-emitting body can be directly prepared on the surface of the required device, and an adhesion force greater than 5Mpa can be guaranteed, thereby achieving the packaging and fixation of the radiation material to ensure its stability and reliability in a high-temperature environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 The present invention is a liquid-phase formed ceramic-modified filler composite infrared luminous body film layer structure, which includes a substrate, a transition layer and a functional layer from bottom to top;

[0031] Among them, 1-substrate, 2-transition layer, 21-high temperature insulation material, 22-precursor polymer ceramic, 3-functional layer, 31-modified filler, 32-precursor polymer ceramic;

[0032] Figure 2 The preparation process of the liquid-phase formed ceramic-modified filler composite infrared luminous body film structure prepared in Example 1 of the present invention, wherein the transition layer is prepared on the substrate by screen printing, and the sensitive layer is prepared on the transition layer by a process based on Weissenberg direct writing;

[0033] Figure 3 This is a physical picture of the temperature change of a polymer precursor ceramic-modified filler infrared luminescent body prepared in Example 1 of the present invention when powered on. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is described in more detail below with reference to the accompanying drawings and specific embodiments, but the protection scope of the present invention is not limited to these embodiments.

[0035] A liquid-phase formed ceramic-modified filler composite infrared luminescent body, the structure of which comprises a substrate, a transition layer and a functional layer from bottom to top; the transition layer is made of a high-temperature insulating material doped with a precursor polymer ceramic and obtained by high-temperature pyrolysis and curing, and the functional layer is made of a precursor polymer ceramic mixed with a modified filler and obtained by high-temperature pyrolysis and curing.

[0036] The substrate is a metal substrate or an insulating substrate.

[0037] The metal substrate includes but is not limited to one of nickel-based alloy, stainless steel, iron, and aluminum, and the insulating substrate includes but is not limited to one of aluminum oxide, aluminum nitride, and polyimide.

[0038] The high temperature insulating material includes but is not limited to ZrO 2 、Al 2 O 3 、SiO 2 , BN, YBa 2 Cu 3 O 7 One of them.

[0039] In a preferred embodiment of the present invention, the modified filler includes but is not limited to conductive materials, N-type semiconductor materials, P-type semiconductor materials, amphoteric semiconductor materials and Al 2 O 3 , one of YSZ.

[0040] The conductive material includes but is not limited to RuO 2 、ZrO 2 、Ag、AgPd、TiB 2 , Pt, the N-type semiconductor material includes but is not limited to V 2 O 5 、TiO 2 , WO 3 SnO 2 、 2 O 5 、BaTiO 3 、PbCrO 4 , ZnO, ZnF 2 , Fe2 O 3 、In 2 O 3 The P-type semiconductor material includes but is not limited to Cr 2 O 3 、MnO、Ag 2 O, CoO, Pr 2 O 3 、CuI、Te、Sb 2 S 3 , Hg 2 O、MoO 2 , ITO, amphoteric semiconductor materials include but are not limited to SiC, UO 2 、PbTe、Ge、Si、Co 3 O 4 、TiS 2 , Mn 3 O 4 、PbSe。

[0041] The modified filler is slurry or powder particles, wherein the particle size of the powder particles is between 50nm and 50μm.

[0042] The adhesion strength between the substrate and the transition layer, and between the transition layer and the functional layer is greater than 5 MPa.

[0043] The thickness of the transition layer is 10-2000 μm, and the thickness of the functional layer is 20-100 μm.

[0044] A method for preparing a liquid-phase formed ceramic-modified filler composite infrared luminous body comprises the following steps:

[0045] (1) Cleaning the substrate: After ultrasonic cleaning, the substrate is cleaned with a plasma cleaner, and then cleaned with alcohol and dried;

[0046] (2) preparing transition layer slurry and functional layer slurry: mixing the precursor polymer ceramic slurry and the high temperature insulating material powder in proportion, stirring and ultrasonically mixing to obtain a bubble-free high temperature insulating precursor liquid, i.e., transition layer slurry; mixing the precursor polymer ceramic slurry and the modified filler powder in proportion, stirring and ultrasonically mixing to obtain a bubble-free high temperature precursor liquid, i.e., functional layer slurry;

[0047] (3) preparing a transition layer: coating the transition layer slurry prepared in step (2) on the substrate, performing a curing heat treatment, then performing a heat treatment in air, and then cooling to room temperature to form a transition layer;

[0048] (4) preparing a functional layer: coating the functional layer slurry prepared in step (2) on the transition layer prepared in step (3), and then performing a curing pretreatment; then performing a heat treatment in air, and then cooling to room temperature to form a functional layer;

[0049] (5) High-temperature reliable lead interconnection: Make high-temperature solder joints, weld wires, and achieve energy output and temperature control of the functional layer by changing the input voltage.

[0050] In the step (2), the amount of the high temperature insulating material powder added to the precursor polymer ceramic slurry and the amount of the modified filler powder added to the precursor polymer ceramic slurry are both 5-90wt%.

[0051] In the step (3), the curing pretreatment temperature is 200-400°C, the insulation time is 30-100min, the heat treatment process is a heating rate of 4-12°C / min, a temperature of 800-1200°C, a insulation time of 10-120min, and a cooling rate of 4-12°C / min.

[0052] In the step (4), the curing pretreatment temperature is 200-400°C, the insulation time is 30-100min, the heat treatment process is a heating rate of 3-12°C / min, a temperature of 600-1500°C, a insulation time of 40-120min, and a cooling rate of 3-12°C / min.

[0053] The coating method in steps (3) and (4) includes but is not limited to direct writing, scraping, screen printing, electrospray printing, etc.

[0054] Example 1

[0055] A liquid-phase formed ceramic-modified filler composite infrared luminous body, the film structure of which is as follows Figure 1 As shown, the thickness of the transition layer is 50 μm, the thickness of the functional layer is 20 μm, and the infrared luminescent body is prepared by the following method:

[0056] (1) The nickel-based alloy substrate is ultrasonically cleaned with acetone for 10 minutes, then cleaned with a plasma cleaner, then cleaned with alcohol, and then taken out and dried with nitrogen;

[0057] (2) Precursor polymer ceramic slurry PSN 2 , high temperature insulation material Al 2 O 3 The powder (particle size 1 μm) was mixed in a mass ratio of 1:2, and after magnetic stirring and ultrasound, a uniformly mixed high-temperature insulating precursor liquid without bubbles, namely the transition layer slurry, was obtained; the precursor polymer ceramic slurry PSN 2, modified filler conductive powder Pt (particle size 100 nm) are mixed in a mass ratio of 1:1.5, and after magnetic stirring and ultrasound, a uniformly mixed high-temperature precursor liquid without bubbles is obtained, namely, the functional layer slurry;

[0058] (3) The transition layer slurry was prepared on the nickel-based alloy substrate by screen printing process, and then cured at 400°C for 60 minutes. The sample after the curing pretreatment was annealed in air for porcelainization, wherein the heat treatment process was as follows: heating rate of 8°C / min, heating to 1100°C, keeping the temperature for 60 minutes, and then cooling to room temperature at 10°C / min, and the transition layer was prepared.

[0059] (4) The functional layer slurry prepared in step (2) is coated on the transition layer prepared in step (3) according to the designed pattern by using the Weissenberg direct writing process, and then pre-cured in air at 400°C for 1h, and then placed in a tubular furnace, heated at a rate of 7°C / min, heated to 1300°C and kept warm for 60min, and then cooled to room temperature at a rate of 7°C / min to achieve ceramicization of the functional layer, thereby completing the preparation of the functional layer.

[0060] (5) Making high-temperature solder joints, welding wires, and changing the input voltage to achieve energy output and temperature control of the functional layer, thereby obtaining a liquid-phase formed controllable ceramic-Pt composite infrared luminescent body.

[0061] like Figure 3 As shown in the figure, the temperature generated by the infrared light emitter under different voltages can be controlled by structural design and voltage regulation to achieve wavelength control.

[0062] Example 2

[0063] A liquid-phase formed ceramic-modified filler composite infrared luminous body, the film structure of which is as follows Figure 1 As shown, the thickness of the transition layer is 50 μm, the thickness of the functional layer is 20 μm, and the infrared luminescent body is prepared by the following method:

[0064] (1) The nickel-based alloy substrate was ultrasonically cleaned with acetone for 10 minutes, then cleaned with a plasma cleaner, and then cleaned with alcohol. After being taken out, it was blown dry with nitrogen.

[0065] (2) Precursor polymer ceramic slurry PSN 2 , high temperature insulation material Al 2 O 3 Powder (particle size 1 μm) and high temperature insulation material YSZ powder are mixed in a mass ratio of 4:3:3, and after magnetic stirring and ultrasound, a uniformly mixed high temperature insulation precursor liquid without bubbles, namely the transition layer slurry, is obtained; the precursor polymer ceramic solution PSN 2 , conductive silver paste, RuO 2The powders (particle size of 100 nm) are mixed in a mass ratio of 1:1:1.5, and after magnetic stirring and ultrasound, a uniformly mixed high-temperature precursor liquid without bubbles is obtained, which is the functional layer slurry;

[0066] (3) The transition layer slurry is prepared on the nickel-based alloy substrate by screen printing process, and then cured at 200°C for 30 minutes; the sample after the curing pretreatment is annealed in air for porcelainization, wherein the heat treatment process is: heating rate 5°C / min, heating to 1000°C, keeping the temperature for 60 minutes, and then cooling to room temperature at 10°C / min, and the transition layer is prepared;

[0067] (4) coating the functional layer slurry on the transition layer prepared in step (3) according to the designed pattern by using the Weissenberg direct writing process, and then pre-curing it in air at 400°C for 60 minutes, and then placing it in a tube furnace, heating it at a rate of 10°C / min, heating it to 800°C and keeping it for 60 minutes, and then cooling it to room temperature at a rate of 10°C / min to achieve ceramicization of the functional layer, thereby completing the preparation of the functional layer;

[0068] (5) Making high-temperature solder joints, welding wires, and changing the input voltage to achieve energy output and temperature control of the functional layer, thereby obtaining a liquid-phase formed controllable ceramic-Ag:RuO 2 Composite infrared illuminator.

[0069] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some or all of the technical features thereof may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A liquid-phase formed ceramic-modified filler composite infrared luminous body, characterized in that: The structure of the infrared luminescent body includes a substrate, a transition layer and a functional layer from bottom to top; the transition layer is made of high-temperature insulating material doped with a precursor polymer ceramic by high-temperature pyrolysis and curing, and the functional layer is made of a precursor polymer ceramic mixed with a modified filler by high-temperature pyrolysis and curing.

2. The liquid-phase formed ceramic-modified filler composite infrared luminous body according to claim 1, characterized in that: The substrate is a metal substrate or an insulating substrate.

3. The liquid-phase formed ceramic-modified filler composite infrared luminous body according to claim 2, characterized in that: The metal substrate includes but is not limited to one of nickel-based alloy, stainless steel, iron, and aluminum; the insulating substrate includes but is not limited to one of aluminum oxide, aluminum nitride, and polyimide.

4. The liquid-phase formed ceramic-modified filler composite infrared luminous body according to claim 1, characterized in that: The high temperature insulating material includes but is not limited to one of ZrO2, Al2O3, SiO2, BN, and YBa2Cu3O7, and the modified filler includes but is not limited to one of conductive material, N-type semiconductor material, P-type semiconductor material, amphoteric semiconductor material, and Al2O3 and YSZ.

5. The liquid-phase formed ceramic-modified filler infrared luminescent body according to claim 4, characterized in that: The conductive materials include but are not limited to RuO2, ZrO2, Ag, AgPd, TiB2, and Pt; the N-type semiconductor materials include but are not limited to V2O5, TiO2, WO3, SnO2, Ta2O5, BaTiO3, PbCrO4, ZnO, ZnF2, Fe2O3, and In2O3; the P-type semiconductor materials include but are not limited to Cr2O3, MnO, Ag2O, CoO, Pr2O3, CuI, Te, Sb2S3, Hg2O, MoO2, and ITO; and the amphoteric semiconductor materials include but are not limited to SiC, UO2, PbTe, Ge, Si, Co3O4, TiS2, Mn3O4, and PbSe.

6. The liquid-phase formed ceramic-modified filler composite infrared luminous body according to claim 1, characterized in that: The modified filler is slurry or powder particles, wherein the particle size of the powder particles is between 50nm and 50μm.

7. The liquid-phase formed ceramic-modified filler composite infrared luminous body according to claim 1, characterized in that: The thickness of the transition layer is 10-2000 μm, and the thickness of the functional layer is 20-100 μm.

8. A method for preparing a liquid-phase formed ceramic-modified filler composite infrared luminous body as claimed in any one of claims 1 to 7, characterized in that: The steps include: (1) Cleaning the substrate: After ultrasonic cleaning, the substrate is cleaned with a plasma cleaner, and then cleaned with alcohol and dried; (2) preparing transition layer slurry and functional layer slurry: mixing the precursor polymer ceramic slurry and the high temperature insulating material powder in proportion, stirring and ultrasonically mixing to obtain a bubble-free high temperature insulating precursor liquid, i.e., transition layer slurry; mixing the precursor polymer ceramic slurry and the modified filler powder in proportion, stirring and ultrasonically mixing to obtain a bubble-free high temperature precursor liquid, i.e., functional layer slurry; (3) preparing a transition layer: coating the transition layer slurry prepared in step (2) on a substrate, and then performing a curing pretreatment, wherein the curing pretreatment temperature is 200-400°C and the temperature is kept for 30-100 min; then performing a heat treatment in air, wherein the heat treatment process is a heating rate of 4-12°C / min, a temperature of 800-1200°C, and a heat preservation time of 10-120 min, and then cooling to room temperature at a cooling rate of 4-12°C / min to form a transition layer; (4) preparing a functional layer: coating the functional layer slurry prepared in step (2) on the transition layer prepared in step (3), and then performing a curing pretreatment, wherein the curing pretreatment temperature is 200-400°C and the temperature is kept for 30-100 min; then performing a heat treatment in air, wherein the heat treatment process is a heating rate of 3-12°C / min, a temperature of 600-1500°C, and a heat preservation time of 40-120 min, and then cooling to room temperature at a cooling rate of 3-12°C / min to form a functional layer; (5) High-temperature reliable lead interconnection: Make high-temperature solder joints, weld wires, and achieve energy output and temperature control of the functional layer by changing the input voltage.

9. The method for preparing the liquid-phase formed ceramic-modified filler composite infrared luminous body according to claim 8, characterized in that: In the step (2), the amount of the high temperature insulating material powder added to the precursor polymer ceramic slurry and the amount of the modified filler powder added to the precursor polymer ceramic slurry are both 5-90wt%.

10. The method for preparing the liquid-phase formed ceramic-modified filler composite gas detection infrared luminescent body according to claim 8, characterized in that: The coating method in steps (3) and (4) includes but is not limited to direct writing, scraping, screen printing, electrospray printing, etc.

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