Resin feeding device for chip substrate packaging

Abstract

The invention belongs to the technical field of semiconductor packaging, and provides a resin feeding device for chip substrate packaging, which mainly comprises a cleaning assembly, a film pasting assembly, a resin dusting assembly, a transfer table, a first tray carrying assembly and a second tray carrying assembly which are arranged on a second mounting platform, and is characterized in that the cleaning assembly is used for cleaning a resin tray; the film pasting assembly is used for film pasting of a resin tray, the resin dusting assembly is used for laying of resin, and the transfer table is used for transferring and waiting of the resin tray with the laid resin. The overturning box is rotationally arranged, the discharging opening of the overturning box is matched with the width of the chip substrate, the film pasting platform can move between the film pasting assembly and the resin powder scattering assembly, and the moving direction is consistent with the length direction of the chip substrate. Through movement of the film pasting platform and rotation of the overturning box, linear and uniform powder scattering is achieved, one-time powder scattering forming is achieved, the uniformity of the powder scattering thickness is guaranteed, and the powder scattering efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor chip substrate packaging, and in particular to a resin feeding device for chip substrate packaging. Background Art

[0002] As time goes by, semiconductor technology continues to advance, and more complex semiconductor devices such as integrated circuits and large-scale integrated circuits have gradually been developed. The development of these technologies has greatly promoted the progress of computers, communications, medical treatment and other fields, making our lives more convenient and efficient.

[0003] The existing traditional packaging device is to heat and inject large particles into the mold cavity, which will cause residual resin and waste. In addition, the pressure and resin flow generated by injection molding will cause damage and deviation of chip leads or solder joints. At the same time, the existing powder spreading technology uses reciprocating vibration to spread powder in an interlaced manner. The vibration laying leads to uneven resin distribution. At the same time, the reciprocating and interlaced laying method reduces the efficiency of providing resin, making the entire packaging efficiency take longer. Summary of the invention

[0004] The present invention provides a resin supply device for chip substrate packaging, which solves the safety and precision problems caused by the need for manual loading assistance of traditional packaging equipment in the above technical background, as well as the complex and low efficiency process of transmitting chip substrates and resin to a press.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0006] A resin feeding device for chip substrate packaging, comprising:

[0007] Second installation platform;

[0008] A cleaning assembly, disposed on the second mounting platform, the cleaning assembly being used for cleaning the recycled resin tray;

[0009] A film pasting assembly is arranged on the second mounting platform, wherein the film pasting assembly is provided with a film pasting platform that can move back and forth linearly along the second mounting platform, and the film pasting platform is used for vacuum pasting of the cleaned resin tray;

[0010] A resin powder sprinkling assembly, comprising a powder sprinkling base and a flip box arranged on the powder sprinkling base, wherein the powder sprinkling base is arranged on the second mounting platform for translation and can translate relative to the second mounting platform, and the flip box is rotatably arranged on the powder sprinkling base, and the powder sprinkling base can translate relative to the second mounting platform;

[0011] The unloading port of the flip box matches the width of the chip substrate, the moving direction of the film-sticking platform is consistent with the length direction of the chip substrate, the film-sticking platform can be moved to the bottom of the flip box, and the film-sticking platform is directly opposite to the unloading port of the flip box;

[0012] A transfer table, which can be raised and lowered on the second mounting platform, and is used for transfer waiting of the resin tray after laying the resin;

[0013] A first pallet transport assembly is movably disposed on the second mounting platform, and the first pallet transport assembly is used to transport the cleaned resin pallet to the film laminating platform;

[0014] The second pallet transporting assembly is movably arranged on the second mounting platform, and the second pallet transporting assembly is used to transport the resin pallet after the resin is laid to the transfer table.

[0015] In some embodiments, the cleaning component includes a cleaning base, a cleaning support and a cleaning airbag. The cleaning base is raised and lowered relative to the second mounting platform. The cleaning support is fixed under the cleaning base. The cleaning airbag is fixed between the cleaning support and the cleaning base. The cleaning airbag is foldable and compressible. A plurality of cleaning holes are arranged on the cleaning airbag. The positions of the plurality of cleaning holes correspond to the edges of the inner frame of the resin tray.

[0016] In some embodiments, a cleaning cylinder is disposed on the cleaning support, a cleaning base plate is disposed at the free end of the cleaning cylinder, the cleaning base plate matches the size of the cleaning air bag, and the cleaning base plate is connected to the lower end of the cleaning air bag.

[0017] In some embodiments, the cleaning airbag is provided with a plurality of first recovery holes and a second recovery hole, wherein the plurality of first recovery holes are arranged close to one side of the resin tray, and the second recovery holes are arranged close to the cleaning support, and both the first recovery holes and the second recovery holes are connected to the cleaning airbag.

[0018] In some embodiments, the resin powder sprinkling assembly also includes a flipping assembly, which includes a flipping motor, a flipping transmission member and a flipping shaft, wherein the flipping motor is arranged on the powder sprinkling base, the flipping shaft is rotatably arranged on the powder sprinkling base, the flipping box is fixedly arranged on the flipping shaft, and the output end of the flipping motor is transmission-connected to the flipping shaft through the flipping transmission member.

[0019] In some embodiments, a flip notch is provided on the powder sprinkling base, the length of the flip notch is greater than the rotation radius of the flip box, and the flip box is rotatably arranged at the flip notch.

[0020] In some embodiments, the resin powder spreading assembly further includes a resin box, a resin transmission assembly, a resin metering unit, and a weighing device, wherein the resin metering unit is communicatively connected to the resin box to control the release of the resin;

[0021] The resin transfer component includes a resin pipeline, an augers rotatably arranged in the resin pipeline, and a spiral motor arranged at one end of the resin pipeline, the output end of the spiral electrode is connected to the augers, the resin box is arranged on the powder sprinkling base and communicated with the resin pipeline, the resin pipeline is arranged on the weighing device, the weighing device is arranged on the powder sprinkling base, and a spray port is arranged at the other end of the resin pipeline, and the spray port corresponds to the position of the flip box.

[0022] In some embodiments, the second pallet transport assembly includes a transport substrate and a pallet transport clamp mechanism, the transport substrate can be horizontally movably arranged on the second mounting platform, and the pallet transport clamp mechanism can be lifted and lowered and arranged below the transport substrate;

[0023] The pallet handling clamp mechanism comprises a second upper base, a second lower base, a second main clamp mechanism and a second auxiliary clamp mechanism, the second upper base is movably connected to the conveying base plate, the second upper base is connected to the second lower base, the second main clamp mechanism comprises two second main clamp links arranged parallel to each other, the second main clamp links are movably arranged on the second lower base, and both ends of the second main clamp links are provided with second main clamps that can be opened and closed;

[0024] The second secondary clamping mechanism comprises two secondary movable seats arranged relative to the second lower base, and the secondary movable seats are provided with a first main clamping block capable of being raised and lowered and a second secondary clamping block arranged in a fixed manner;

[0025] The first main clamping block can be lifted and lowered relative to the first auxiliary clamping block, thereby realizing the opening and closing of the first main clamping block and the first auxiliary clamping block;

[0026] The two auxiliary movable seats can move away from or towards each other, thereby driving the second auxiliary clamping block to open and close.

[0027] In some embodiments, the first pallet handling assembly includes a film substrate and a first film clamping mechanism, the film substrate is movably disposed on the second mounting platform, the first film clamping mechanism is movably disposed on the film substrate and can be raised and lowered relative to the film substrate, wherein the first film clamping mechanism has the same structure as the second main clamping mechanism.

[0028] In some embodiments, it also includes two parallel first conveying brackets and two parallel second conveying brackets arranged on the second mounting platform, the two ends of the film-laminating substrate are movably arranged on the first conveying brackets, and the two ends of the conveying substrate are movably arranged on the second conveying brackets, wherein the first conveying bracket and the second conveying bracket are relatively parallel, and the film-laminating substrate and the conveying substrate are both set at a preset distance from the second mounting platform.

[0029] Compared with the prior art, the present invention has the following beneficial effects:

[0030] The present invention realizes the recycling of resin pallets by arranging a cleaning component, a film sticking component, a resin powder sprinkling component and a transfer table, and realizes the real automatic resin supply by arranging a first pallet conveying component and a second pallet conveying component to convey the cleaned resin pallet and the pallet for laying resin. At the same time, by rotating the flip box, the feed opening of the flip box is consistent with the width of the chip substrate, combined with the horizontal movement of the film sticking platform along the length direction of the chip substrate, the resin is formed once during the laying process and laid in a straight line, so that the resin is evenly laid and the resin laying efficiency is improved.

[0031] Additional aspects and advantages of the present application will be partially given in the following description, which will become apparent from the following description, or will be understood through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a three-dimensional schematic diagram of a resin feeding device for chip substrate packaging of the present invention;

[0033] Figure 2 for Figure 1 A three-dimensional schematic diagram of a resin loading mechanism added in the middle;

[0034] Figure 3 A three-dimensional diagram of a first conveying assembly and a second conveying assembly of the present invention;

[0035] Figure 4 is a first stereoscopic view of the cleaning assembly of the present invention;

[0036] Figure 5 is a second stereoscopic view of the cleaning assembly of the present invention;

[0037] Figure 6 is a cross-sectional view of a cleaning assembly of the present invention;

[0038] Figure 7 It is a first stereoscopic view of the film sticking assembly of the present invention;

[0039] Figure 8 is a second stereoscopic view of the film sticking assembly of the present invention;

[0040] Fig. 9 is a schematic diagram of the resin box and the resin transmission mechanism of the present invention;

[0041] Fig.10 It is a schematic diagram of the three-dimensional structure of the resin powder sprinkling component of the present invention;

[0042] Fig.11 A schematic diagram of the three-dimensional structure of the flip box of the resin powder sprinkling assembly of the present invention;

[0043] Fig.12 A cross-sectional view of a flip box of a resin powder sprinkling assembly of the present invention;

[0044] Fig.13 A schematic diagram of the resin laying of the present invention;

[0045] Fig.14 It is a schematic diagram of the three-dimensional structure of the transfer station of the present invention;

[0046] Fig.15 An exploded view of a pallet handling clamp mechanism of a second pallet handling assembly of the present invention;

[0047] Fig.16 is a schematic diagram of a second embodiment of a pallet handling clamp mechanism of a second pallet handling assembly of the present invention;

[0048] Fig.17 It is an exploded view of the second main clamping mechanism of the pallet handling clamping mechanism of the present invention. DETAILED DESCRIPTION

[0049] The present application is further described in detail below in conjunction with specific drawings. In the description of this embodiment, unless otherwise specified, the terms "left", "right", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the present application must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present application.

[0050] In one embodiment, Figure 1 As shown, a resin feeding device for chip substrate packaging provided by the present invention mainly includes a second mounting platform 102, a cleaning component 601, a film sticking component 602, a resin powder spreading component 603, a transfer table 604, a first pallet conveying component 605 and a second pallet conveying component 606;

[0051] The cleaning assembly 601 is mainly used for cleaning the dirty resin tray 40344, and is arranged near one side of the third guide rail 1025. Figure 2As shown, a movable resin loading mechanism 800 is provided on the third guide rail 1025, and the resin loading mechanism 800 is used to transport the resin tray 40344 covered with resin from the transfer table 604 to the next process, and after the resin is transported, the dirty resin tray 40344 is transported to the cleaning assembly 601 for cleaning, so that the dirty resin tray 40344 can be reused;

[0052] The film laminating assembly 602 is arranged close to the cleaning assembly 601, and is mainly used for vacuum laminating. A film is laid on the bottom of the resin tray 40344. After the film is laid, the resin tray 40344 with the film is transferred to the bottom of the resin powder spreading assembly 603 for powder spreading. The resin powder spreading assembly 603 is mainly used for spreading resin powder, so that the resin powder is evenly spread on the film of the resin tray 40344.

[0053] The transfer table 604 is mainly used for temporary transfer and placement of the resin tray 40344 covered with resin, so that the tray transport mechanism 8031 ​​can grab it.

[0054] In this embodiment, the resin tray 40344 moves in a straight line between the cleaning component 601 and the film sticking component 602, and its movement trajectory is perpendicular to the third guide rail 1025. The resin tray 40344 moves in a straight line between the transfer table 604 and the resin powder sprinkling component 603, and its movement trajectory is perpendicular to the third guide rail 1025. The movement trajectory of the resin tray 40344 between the film sticking component 602 and the resin powder sprinkling component 603 is straight and parallel to the third guide rail 1025, wherein the resin powder sprinkling component 603 and the transfer table 604 are arranged close to one side of the press unit 500. Among them, a first pallet conveying assembly 605 that is movably arranged relative to the second installation platform is arranged between the cleaning assembly 601 and the film sticking assembly 602, and is used to convey the cleaned resin pallet to the film sticking platform, and a second pallet conveying assembly 606 that can move relative to the second installation platform is arranged between the resin powder sprinkling assembly 603 and the transfer table 604, and is used to convey the resin pallet 40344 after the resin is laid to the transfer table 604, so as to wait for the resin loading mechanism 800 to grab the resin pallet 40344 loaded with resin and enter the next process.

[0055] Specifically, Figure 4-Figure 6As shown, the cleaning assembly 601 includes a cleaning base 6011 that can be lifted and lowered relative to the second mounting platform 102, that is, a first lifting cylinder 60111 is arranged on the second mounting platform 102, and the free end of the first lifting cylinder 60111 is fixedly connected to the bottom of the cleaning base 6011, and a plurality of first cleaning guide shafts 6015 are arranged between the cleaning base 6011 and the second mounting platform 102, which are used to support the lifting of the cleaning base 6011, and a cleaning installation position for placing the resin tray 40344 is arranged on the cleaning base 6011, and a plurality of cleaning fixing rods 6015 are arranged below the cleaning base 6011. 22 is connected to a cleaning support 6011, wherein a cleaning cylinder 60121 is provided on the cleaning support 6011, a cleaning base plate 60123 is provided at the free end of the cleaning cylinder 60121, a foldable cleaning air bag 6014 is provided on the cleaning base plate 60123, the cleaning base plate 60123 matches the size of the cleaning air bag 6014 to fully compress the cleaning air bag 6014; a plurality of cleaning holes are provided on the cleaning air bag 6014, the cleaning holes are aligned with the inner frame edge of the resin tray, and the free end of the cleaning cylinder 60121 is repeatedly raised and lowered to compress the cleaning air bag 6014 to clean the resin tray 40344;

[0056] Furthermore, the cleaning airbag 6014 is provided with a first recovery hole 60141 and a second recovery hole 60142 which are connected to the cleaning airbag 6014. The first recovery hole 60141 is provided on the upper side of the cleaning airbag 6014 close to the resin tray 40344, and the second recovery hole 60142 is provided on the side of the cleaning airbag 6014 close to the cleaning support 6012, for recovering residual particulate matter. In this embodiment, there are two cleaning installation positions, so that two resin trays 40344 can be cleaned at the same time. In this embodiment, a negative pressure mechanism, such as a vacuum pump or a vacuum cleaner or the like, can be provided on the second recovery hole to provide negative pressure to absorb the residue recovery of the resin tray.

[0057] like Figure 7-Figure 8As shown, the film sticking assembly 602 includes a first reel 6028, a support roller 60281, two parallel film sticking brackets 6025, and a film sticking beam 6025. The film sticking brackets 6025 are set at a certain distance from the second mounting platform 102. The film sticking beam 6026 is slidably set on the two parallel film sticking brackets 6025. A film pressing mechanism is set at one end of the film sticking bracket 6025 close to the first reel 6028. The film pressing mechanism includes a film pressing base 6024, a lower pressing module 60244 fixedly set on the film pressing base 6024, and an upper film pressing block 60241 which can be raised and lowered relative to the film pressing base 6024. The film can be movably passed between the upper film pressing block 60241 and the lower pressing module 60244. When the upper pressing module 60241 and the lower pressing module 60244 are closed, the film is fixed. The lifting and lowering of the upper pressing module 60241 is controlled by the film pressing cylinder 60242. The upper pressing module 60241 is arranged at the free end of the film pressing cylinder 60242. The film pressing cylinder 60242 is fixedly arranged on the film pressing base 6024. Two parallel film pressing guide shafts 60243 are also arranged on the upper pressing module 60241 to further provide stable support for the lifting and lowering movement of the upper pressing module 60241. One end of the film pressing guide shaft 60243 is fixedly connected to the upper pressing module 60241, and the other end thereof is movably penetrated into the film pressing base 6024. The installation direction of the film pressing guide shaft 60243 is consistent with the telescopic direction of the free end of the film pressing cylinder 60241.

[0058] Furthermore, if Figure 8 As shown, the first reel 6028 is slidably arranged so that the tension of the film can be adjusted. The support roller 60281 can be arranged as a movable structure to adjust the tension of the film. In this embodiment, the rotation of the first reel 6028 is driven by a motor, thereby reducing the tension during the film transportation process to prevent the film from being broken or torn.

[0059] Furthermore, a film cutting knife 60215 is provided on the film sticking assembly 602. The film cutting knife 60215 can move in a direction perpendicular to the film conveying direction to cut the film. Specifically, a film cutting screw 60211 and a film cutting guide rail 60213 which are axially parallel to each other are arranged on the film pressing base 6024, and the film cutting screw 60211 and the film cutting guide rail 60213 are arranged horizontally relative to the second mounting platform 102, a film cutting nut 60212 is arranged on the film cutting screw 60211, and a film cutting slider 60214 is arranged on the film cutting guide rail 60213, wherein the film cutting slider 60214 and the film cutting nut 60212 are connected by a fifth connecting block, and the film cutting knife is arranged on the fifth connecting block 602151, and the film cutting motor 6021 is arranged on the second mounting platform 102, and the output end of the film cutting motor 6021 is connected to one end of the film cutting screw 60211 for power connection. In this embodiment, power transmission is realized by means of synchronous wheels and synchronous belts. Optionally, it can also be a gear meshing method, or the output shaft of the film cutting motor 6021 is directly connected to the film cutting screw 60211 for power connection through a coupling.

[0060] Furthermore, a preset film cutting distance is set between the film cutting knife 60215 and the upper pressing module 60241 in the film moving direction, so that a preset length can be left after the film is cut, so that the film clamping block of the film beam 6026 can clamp the film for the next round of film laying.

[0061] Further, refer again to Figure 7, parallel film sticking rails 60251 are respectively arranged on two parallel film sticking brackets 6025, the film sticking rails 60251 are arranged horizontally, at least one film sticking slider 602511 is respectively arranged on the two film sticking rails 60251, a film sticking crossbeam 6026 is connected with the film sticking slider 602511, and the film sticking crossbeam 6026 is perpendicular to the two film sticking brackets 6025, a film sticking driving wheel 6022 and a film sticking driven wheel 6023 are arranged at both ends of the film sticking bracket 6025, and a film sticking synchronous belt 60221 is wound around for power connection, and part of the film sticking crossbeam 6025 is fixed to the film sticking synchronous belt 60221; further, in order to avoid a large span of the film sticking crossbeam 6026, uneven power, and a stuck response during movement, the film sticking driving wheel 6022, the film sticking driven wheel 6023 and the film sticking synchronous belt 60221 are fixed to the film sticking synchronous belt 60221. Belt 60221 is simultaneously arranged on two film sticking brackets 6025, and a film sticking shaft 6027 is arranged between the two film sticking driving wheels 6022 for fixed connection. The film sticking shaft 6027 is rotatably arranged on the film sticking bracket 6025, and the two ends of the film sticking beam 6026 are respectively connected with the two film sticking synchronous belts 60221. In this embodiment, in order to facilitate the installation of the film sticking motor 60272 and occupy less installation space, the film sticking motor 60272 is arranged on the second installation platform 102, and a first driven transmission pulley 60271 is arranged on the film sticking shaft 6027, and a first driving transmission pulley 60273 is arranged on the output shaft of the film sticking motor 60272. The first driven synchronous pulley 60271 and the first driving transmission pulley 60273 are connected in power through the first transmission synchronous belt 60274. Optionally, in this embodiment, the film sticking motor 60272 can also be directly connected to the film sticking shaft through a coupling, or the power transmission between the film sticking motor 60272 and the film sticking shaft 6027 can be achieved through gear meshing.

[0062] Furthermore, in order to ensure the automation of film laminating, a film clamping group is arranged on the film laminating beam 6026, and the film clamping group includes a film clamping cylinder 60261, a main film clamping module 60262 and an auxiliary film clamping block 60263. The fixed end of the film clamping cylinder 60261 is arranged on the film laminating beam 6026, and the free end of the film clamping cylinder 60261 is connected to the main film clamping block 60262 to drive the main film clamping block 60262 to move up and down, thereby realizing the clamping and movement of the film with a preset length left at the film pressing mechanism. In this embodiment, the up and down lifting direction is the vertical direction to the second mounting platform 102; the width of the main film block 60262 and the auxiliary film block 60263 is greater than the width of the film, so that the film can be completely clamped between the main film block 60262 and the auxiliary film block 60263. In this embodiment, the clamping part of the main film block 60262 is an L-shaped structure, so that the film with a preset length left by the film cutting knife 60215 can be clamped.

[0063] In one embodiment, Figure 3 As shown, two first conveying brackets 6058 are arranged on the second mounting platform 102, and a first conveying assembly is arranged on the first conveying brackets 6058. The two first conveying brackets 6058 are arranged at a certain distance from the second mounting platform 102. The first conveying assembly includes a first pallet conveying guide rail 6056 arranged on one of the first conveying brackets 6058, a first pallet conveying slider 6057 arranged on the first pallet conveying guide rail 6056, and a first pallet conveying motor 6054, a first pallet conveying screw rod and a first pallet conveying nut arranged on the other first conveying bracket 6058. A first pallet conveying mounting block 6055 is arranged on the first pallet conveying nut. The axis of the first pallet conveying screw rod is parallel to the axis of the first pallet conveying guide rail 6056. The first pallet conveying motor 6054 is fixedly arranged on the first conveying bracket 6058. The first pallet conveying screw rod is rotatably arranged on the first conveying bracket 6058 through a bearing, and the first pallet conveying nut is sleeved on the first pallet conveying screw rod through threaded cooperation.

[0064] like Figure 7 As shown, the film sticking assembly 602 also includes a film sticking platform 6029 movably arranged on the second mounting platform 102. The film sticking platform 6029 reciprocates between the film sticking assembly 602 and the resin powder sprinkling assembly 603, and moves the resin tray 40344 with the film stuck to the bottom of the resin powder sprinkling assembly 603 for uniform powder sprinkling.

[0065] Specifically, a rotating first movable screw and a fixed first movable guide rail are arranged on the second mounting platform 102, a portion lower than the first movable slider is arranged on the first movable guide rail, and the line of the first movable guide rail is parallel to the axis of the first movable screw. In this embodiment, the first movable screw is arranged directly above the first movable guide rail, and a first movable nut is arranged on the first movable screw, and the first movable nut is fixedly connected to the first movable slider. A first movable motor 60291 is arranged at one end of the first movable screw, and the first movable motor 60291 is arranged on the second mounting platform 102. The output end of the first movable motor 60291 is power-connected to one end of the first movable screw, and the first movable nut is driven to make reciprocating linear movements along the first movable screw through the forward and reverse rotation of the first movable motor 60291.

[0066] Furthermore, if Figure 7 As shown, a first mounting block 60292 is arranged on the first moving nut, a platform lifting cylinder 60293 is arranged on the first mounting block 60292, a film pasting platform 6029 is arranged at the free end of the platform lifting cylinder 60293, and a mounting position is arranged on the film pasting platform 6029 for placing the resin tray 40344;

[0067] Furthermore, a plurality of first adsorption holes are provided on the film sticking platform 6029, and the plurality of first adsorption holes are used for vacuum extraction. When the film is located on the film sticking platform, it can be fixed by vacuum adsorption through the first adsorption holes;

[0068] In this embodiment, the transmission combination of the first movable screw rod and the first movable nut can be replaced by a synchronous wheel and synchronous belt combination. When the stroke is short, it can also be replaced by the extension and retraction of the free end of the cylinder. It can be known that the reciprocating structure of the first mounting block 60292 in this embodiment is not limited by the present invention. The purpose is to drive the film sticking platform 6029 on the first mounting block 60292 to reciprocate between the film sticking assembly 602 and the powder spreading assembly 603.

[0069] In one embodiment, Figure 3 As shown, two second conveying brackets 6068 are arranged on the second mounting platform 102, and a certain distance is arranged between the second conveying bracket 6068 and the second mounting platform 102. In this embodiment, the second conveying bracket 6068 and the first conveying bracket 6058 are of the same height, and one of the second conveying brackets 6068 and one of the first conveying brackets 6058 are shared as a whole. A second conveying assembly is arranged on the second conveying bracket 6068. The second conveying assembly has the same structure and principle as the aforementioned first conveying assembly, and will not be elaborated herein.

[0070] like Fig.10 As shown, the resin powder sprinkling assembly 603 includes a powder sprinkling base 60310, a flip assembly and a flip box 60325. The powder sprinkling base 60310 is connected to the second conveying assembly and can move back and forth linearly on the second conveying bracket 6068. A through flipping slot 603101 is set on the powder sprinkling base 60310, and the flip box 60325 is rotatably set on the flipping slot 603101. The flip box 60325 is rotatably set on the powder sprinkling base 60310 through the flip assembly.

[0071] Specifically, the flip assembly includes a flip motor 60311, a flip transmission member and a flip shaft 60313. The flip motor 60311 is fixedly arranged on the powder sprinkling base 60310, and the output end of the flip motor 60311 is connected to the flip shaft 60313 through the flip transmission member.

[0072] Specifically, the flip transmission member includes a flip driving pulley, a flip driven pulley and a flip synchronous belt. The flip driving pulley is arranged on the output shaft of the flip motor 60311. The flip shaft 60313 is rotatably arranged on the powder spreading base 60310 through a bearing and is arranged along the edge of the flip notch 603101. The flip driven pulley is fixedly arranged at one end of the flip shaft 60313 and is located on one side with the flip driving pulley. The flip synchronous belt 60312 is wound around the flip driving pulley and the flip driven pulley to transmit power. In this embodiment, the size of the flip notch 603101 is larger than the size of the flip box 60325 to meet the flipping of the flip box 60325 at a certain angle. In this embodiment, the structure of the flip transmission member can be replaced by a method of meshing the driving gear and the driven gear, or the flip motor 60311 can be directly connected to the flip shaft 60313 through a coupling for power.

[0073] Furthermore, if Figure 11-Figure 12 As shown, the flip box 60325 includes a horizontal storage area 603254 and a discharge port 603253. The discharge port 603253 of the flip box 60325 matches the width of the chip substrate. The discharge port 603253 is connected to the horizontal storage area 603254. A plurality of spaced parallel partitions 603251 are arranged in the flip box 60325. The partitions 603251 are evenly distributed along the length direction of the flip box 60325 to separate the horizontal storage area 603254 into a plurality of storage troughs 603252, thereby evenly distributing the resin entering the flip box 60325 to avoid resin clumping and make the resin laying more uniform.

[0074] In one embodiment, Fig. 9 As shown, the resin supply mechanism 600 also includes a resin box 60321, a resin funnel 60322, a resin transmission component, a spray port 60324, and a weighing device 60326. The weighing device 60326 cooperates with the resin box 60321 to accurately weigh and release the resin. The lower discharge port of the resin box 60321 is directly opposite to the resin funnel 60322. The resin transmission component includes a resin pipeline 60323, a screw 60328 and a screw motor 60327. The screw motor 60327 is arranged at At one end of the resin pipe 60323, the spiral device 60328 is rotatably disposed in the resin pipe 60323, one end of which is connected to the output end of the spiral motor 60327, the resin funnel 60322 is connected to the resin pipe 60323, the spray port 60324 is disposed at one end of the resin pipe 60323 away from the spiral motor 60327, the position of the spray port 60324 corresponds to the position of the flip box 60325, and the outer side of the resin pipe 60323 is connected to the weighing device 60326 to weigh the resin. In this embodiment, the spiral device 60328 and the weighing device 60326 are existing mechanisms, and will not be elaborated on in detail.

[0075] Furthermore, in order to ensure accurate release of the resin, the resin powder spreading component 603 also includes a resin metering unit, which is mainly used to receive the data of the number and volume of chips on the chip substrate measured when the chip substrate is loaded, so as to accurately release the resin amount required for chip substrate packaging at one time, avoid resin waste or insufficient resin, and save materials. In this embodiment, the resin metering unit cooperates with the resin box to achieve accurate supply of resin weight.

[0076] In one embodiment, the present invention further provides a method for laying resin, and the specific process is as follows: the film-laying platform carrying the resin tray 43044 is moved to the bottom of the flip box 60325, and after the resin metering unit receives the data of the volume and number of the chip substrates measured by the measuring instrument 3064, the resin box 60321 and the weighing device 60326 cooperate, and the resin box 60321 releases a certain weight of resin, which falls into the resin pipe 60323 through the resin funnel 60322, and moves the resin to the spray port 60324 through the spiral device 60328, and the spray port transfers the resin to the flip box 60325;

[0077] In the initial position, the unloading port 603253 of the flip box 60325 is close to an inner side of the resin tray 40344, and the first moving motor 60291 drives the film sticking platform 6029 to move slowly and uniformly. At the same time, the flip motor 60311 drives the flip box 60325 to rotate, so that the flip box 60325 is slowly tilted, and the resin is evenly sprinkled from the unloading port 603253 of the flip box 60325 into the resin tray 40344 with the film, and is laid in a straight line. On the one hand, the resin is evenly laid, and on the other hand, combined with the flipping of the flip box 60325 and the uniform movement of the film sticking platform 6029, it is directly laid according to the width of the chip substrate, such as Fig.13 As shown, compared with the existing resin laying method, while ensuring uniform resin laying, there is no need to swing back and forth, thereby improving the resin laying efficiency.

[0078] In one embodiment, the second pallet handling assembly includes a conveying base plate 6063 and a pallet handling clamp mechanism, a preset spacing is provided between the conveying base plate 6063 and the second mounting platform 102, the conveying base plate 6063 can be horizontally moved and arranged on the second mounting platform 102, the pallet handling clamp mechanism can be lifted and arranged below the conveying base plate 6063; the pallet handling clamp mechanism 6061 can be lifted and arranged on the conveying base plate 6063. Specifically, a fifth lifting cylinder 6062 is provided on the conveying base plate 6063, and the free end of the fifth lifting cylinder 6062 is fixedly connected to the pallet handling clamp mechanism 6061.

[0079] like Fig.15As shown, the pallet handling clamp mechanism 4034 includes a second upper base 40341 ​​and a second lower base 40342 fixedly connected to each other from top to bottom, a preset distance is set between the second upper base 40341 ​​and the second lower base 40342, the second upper base 40341 ​​is movably connected to the conveying base plate 6063, and the pallet handling clamp mechanism 4034 also includes a second main clamp mechanism and a second auxiliary clamp mechanism, and its specific mechanism is as follows;

[0080] like Fig.17 As shown, the second main clamping mechanism includes four second main clamping jaws 403424, two second main clamping connecting rods 403423 arranged in parallel with each other, a main clamping cylinder 403433 with two opening and closing free ends, and the two free ends can move away from or towards each other at the same time to realize the opening and closing of the second main clamping jaws 303424; two main clamping push rods 403422, wherein the four second main clamping jaws 403424 are divided into two groups, each group is fixedly arranged at the two ends of the second main clamping connecting rod 403423, and the second main clamping jaws 403424 are connected to the resin The main clamping cylinder 403433 is fixed on the second lower base 40342, and the two main clamping push rods 403422 are respectively fixed on the two opening and closing free ends of the main clamping cylinder 403433. The two free ends of the main clamping cylinder 403433 move toward or away from each other, driving the four second main clamping jaws 403424 to open and close, thereby grabbing or putting down the resin tray 40344. In this embodiment, the second main clamping jaw 403424 is an L-shaped hook.

[0081] Furthermore, four second main guide rails 403426 are arranged on the second lower base 40342, and four corresponding second main sliders 403425 are arranged on the four second main guide rails 403426. The axial direction of the second main guide rails 403426 is consistent with the opening and closing direction of the free end of the main clamping cylinder 403433. The four second main sliders 403425 are respectively fixedly arranged at the two ends of the corresponding two main clamping connecting rods 403423, thereby supporting the second main clamping connecting rods 403423.

[0082] Alternatively, if Fig.16As shown, the second main clamping jaw 403424 can also be configured as a rotating structure, and two parallel second main clamping connecting rods 403434 are rotatably arranged on the second lower base 40342. Specifically, four rotating brackets 403435 are arranged on the second lower base 40342, and the second main clamping connecting rod 403434 is rotatably arranged on the four rotating brackets 403425 through bearings. A second main clamping rocker 403436 is arranged between the two free ends of the main clamping cylinder 403433 and the corresponding two second main clamping connecting rods 403434, and one end of the second main clamping rocker 403436 is fixedly connected to the second main clamping connecting rod 40344. The other end of the clamp rocker 403436 is movably connected to a free end of the main clamp cylinder 403433. For example, a first connecting rod with a first connecting notch of a long strip structure is provided, and one end of the first connecting rod is movably connected to a free end of the main clamp cylinder 403433. The end of the first connecting rod with the first connecting notch is arranged away from the second lower base 40342, so that the first connecting notch compensates for the movement of the first connecting rod in the vertical direction to avoid motion interference. The first connecting notch can be a rectangular structure or a U-shaped groove structure, so that the free end of the main clamp cylinder 403433 that can be opened and closed drives the second main clamp jaw 403424 to rotate. For example, when the two free ends of the main clamp cylinder 403433 are opened and separated, the second main clamp jaw 403424 is not engaged with the resin tray 40344. When the two free ends of the main clamp cylinder 403433 are closed and close, the second main clamp jaw 403424 cooperates and abuts with the clamping groove 403441 of the resin tray.

[0083] like Fig.15As shown, the second secondary clamping mechanism includes a secondary clamping cylinder 403421, on which two free ends capable of moving toward or away from each other are provided, a secondary moving seat 403428 is provided at the free end of the secondary clamping cylinder 403421, on which a first secondary clamping block 403431 is provided, and the first secondary clamping block 403431 can clamp and cover one side of the resin tray 40344, and on the secondary moving seat 403428, a first main clamping block 403430 capable of being raised and lowered is provided. The second lifting cylinder 403429 is provided on the movable seat 403428, and the free end of the second lifting cylinder 403429 is connected to the first main clamping block 403430. The first main clamping block 403430 is lifted and lowered to close and open with the first auxiliary clamping block 403431, and the film is clamped and fixed. Then, in combination with the auxiliary clamping cylinder 403421, the auxiliary movable seat 403428 is brought closer, so as to fix the edge of the film carrying the resin, so that the film is fixed relative to the resin tray 40344. In this embodiment, the auxiliary movable seat 403428, the first auxiliary clamping block 40341, the first main clamping block 40340, and the second lifting cylinder 403429 are all two groups, which are symmetrically arranged about the second upper base 40341, so as to clamp and fix the film at the edge of the resin tray 40344, so that the resin tray 40344 and the film keep moving synchronously.

[0084] Furthermore, a second auxiliary guide rail 403411 is provided on the second upper base 40341, and a second auxiliary slider 403432 is provided on the second auxiliary guide rail 403411. The second auxiliary slider 403432 is connected to the auxiliary movable seat 403428, thereby providing support for the auxiliary movable seat 403428, and the axial direction of the second auxiliary guide rail 403411 is consistent with the opening and closing movement direction of the free end of the auxiliary clamp cylinder 403421.

[0085] In this embodiment, Fig.15 As shown, the first auxiliary clamping block 403431 and the first main clamping block 403430 are located on two opposite sides of the resin tray 40344 , and the second main clamping jaw 403424 is located on the other two opposite sides of the resin tray 40344 .

[0086] In one embodiment, the first pallet transport assembly 605 includes a film substrate 6053 and a first film clamping mechanism 6051. The film substrate 6053 is movably disposed on the second mounting platform 102. The first film clamping mechanism 6051 is movably disposed on the film substrate 6053 and can be lifted and lowered relative to the film substrate 6053. Specifically, a preset spacing is provided between the film substrate 6053 and the second mounting platform 102. A fourth lifting cylinder 6052 is provided on the film substrate 6053. The first film clamping mechanism 6051 is connected to the free end of the fourth lifting cylinder 6052 to drive the first film clamping mechanism 6051 to be lifted and lowered relative to the second mounting platform 102. Among them, it should be pointed out that since the first film laminating jaw mechanism 6051 is used to transport the cleaned resin tray 40344 to the film laminating platform 6029, the first film laminating jaw mechanism 6051 does not need to consider the fixation of the film. Therefore, the structure and principle of the first film laminating jaw mechanism 6051 and the second main clamping mechanism of the aforementioned tray transporting jaw mechanism 6061 are exactly the same, and no further elaboration is made here.

[0087] In one embodiment, Fig.14 As shown, the transfer table 604 is a liftable structure, which is arranged below the pallet transporting clamp mechanism 6061. The transfer table 604 is provided with a mounting position, which is mainly used for storing the resin tray 40344 carrying the film and the resin, that is, the waiting area of ​​the resin tray 40344. Specifically, a sixth lifting cylinder 6041 is arranged on the second mounting platform 102, one end of the sixth lifting cylinder 6041 is fixed on the second mounting platform 102, and the free end of the sixth lifting cylinder 6041 is connected with the transfer platform 6042.

[0088] Furthermore, to ensure the smooth lifting structure of the transfer platform 604, a plurality of sixth guide shafts 6043 are arranged parallel to the free end of the sixth lifting cylinder 6041 between the transfer platform 6042 and the second installation platform 102. One end of the sixth guide shaft 6043 is fixedly connected to the bottom 6042 of the transfer platform, and the other end is movably inserted into the second installation platform 102 through a guide sleeve. In this embodiment, there are 4 sixth guide shafts, and optionally 3, 2, etc. It can be known that the number of the sixth guide shafts 6043 is not limited by the present invention.

[0089] The above is only a preferred embodiment of the present invention. It should be noted that a person skilled in the art can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications should also be considered as the protection scope of the present invention.

Claims

1. A resin feeding device for chip substrate packaging, characterized in that: include: Second installation platform; A cleaning assembly, disposed on the second mounting platform, the cleaning assembly being used for cleaning the recycled resin tray; A film pasting assembly is arranged on the second mounting platform, wherein the film pasting assembly is provided with a film pasting platform that can move back and forth linearly along the second mounting platform, and the film pasting platform is used for vacuum pasting of the cleaned resin tray; A resin powder sprinkling assembly, comprising a powder sprinkling base and a flip box arranged on the powder sprinkling base, wherein the powder sprinkling base is arranged on the second mounting platform for translation and can translate relative to the second mounting platform, and the flip box is rotatably arranged on the powder sprinkling base, and the powder sprinkling base can translate relative to the second mounting platform; The unloading port of the flip box matches the width of the chip substrate, the moving direction of the film-sticking platform is consistent with the length direction of the chip substrate, the film-sticking platform can be moved to the bottom of the flip box, and the film-sticking platform is directly opposite to the unloading port of the flip box; A transfer table, which can be raised and lowered on the second mounting platform, and is used for transfer waiting of the resin tray after laying the resin; A first pallet transport assembly is movably disposed on the second mounting platform, and the first pallet transport assembly is used to transport the cleaned resin pallet to the film laminating platform; The second pallet transporting assembly is movably arranged on the second mounting platform, and the second pallet transporting assembly is used to transport the resin pallet after the resin is laid to the transfer table.

2. A resin feeding device for chip substrate packaging according to claim 1, characterized in that: The cleaning assembly includes a cleaning base, a cleaning support and a cleaning airbag. The cleaning base is raised and lowered relative to the second mounting platform. The cleaning support is fixed under the cleaning base. The cleaning airbag is fixed between the cleaning support and the cleaning base. The cleaning airbag can be folded and compressed. A plurality of cleaning holes are arranged on the cleaning airbag. The positions of the plurality of cleaning holes correspond to the edges of the inner frame of the resin tray.

3. A resin feeding device for chip substrate packaging according to claim 2, characterized in that: The cleaning support is provided with a cleaning cylinder, the free end of the cleaning cylinder is provided with a cleaning bottom plate, the size of the cleaning bottom plate matches the size of the cleaning air bag, and the cleaning bottom plate is connected to the lower end of the cleaning air bag.

4. A resin feeding device for chip substrate packaging according to claim 2, characterized in that: The cleaning airbag is provided with a plurality of first recovery holes and a second recovery hole. The plurality of first recovery holes are arranged close to one side of the resin tray, and the second recovery holes are arranged close to the cleaning support. Both the first recovery holes and the second recovery holes are connected to the cleaning airbag.

5. The resin feeding device for chip substrate packaging according to claim 1, characterized in that: The resin powder sprinkling assembly also includes a flip assembly, which includes a flip motor, a flip transmission member and a flip shaft. The flip motor is arranged on the powder sprinkling base, the flip shaft is rotatably arranged on the powder sprinkling base, the flip box is fixedly arranged on the flip shaft, and the output end of the flip motor is transmission-connected to the flip shaft through the flip transmission member.

6. A resin feeding device for chip substrate packaging according to claim 5, characterized in that: The powder sprinkling base is provided with a flip notch, the length of the flip notch is greater than the rotation radius of the flip box, and the flip box is rotatably arranged at the flip notch.

7. The resin feeding device for chip substrate packaging according to claim 5, characterized in that: The resin powder spreading assembly also includes a resin box, a resin transmission assembly, a resin metering unit and a weighing device, wherein the resin metering unit is in communication connection with the resin box to control the release of the resin; The resin transfer component includes a resin pipeline, an augers rotatably arranged in the resin pipeline, and a spiral motor arranged at one end of the resin pipeline, the output end of the spiral electrode is connected to the augers, the resin box is arranged on the powder sprinkling base and communicated with the resin pipeline, the resin pipeline is arranged on the weighing device, the weighing device is arranged on the powder sprinkling base, and a spray port is arranged at the other end of the resin pipeline, and the spray port corresponds to the position of the flip box.

8. The resin feeding device for chip substrate packaging according to claim 1, characterized in that: The second pallet transport assembly includes a transport substrate and a pallet transport clamp mechanism, the transport substrate can be horizontally movably arranged on the second mounting platform, and the pallet transport clamp mechanism can be lifted and lowered and arranged below the transport substrate; The pallet handling clamp mechanism comprises a second upper base, a second lower base, a second main clamp mechanism and a second auxiliary clamp mechanism, the second upper base is movably connected to the conveying base plate, the second upper base is connected to the second lower base, the second main clamp mechanism comprises two second main clamp links arranged parallel to each other, the second main clamp links are movably arranged on the second lower base, and both ends of the second main clamp links are provided with second main clamps that can be opened and closed; The second secondary clamping mechanism comprises two secondary movable seats arranged relative to the second lower base, and the secondary movable seats are provided with a first main clamping block capable of being raised and lowered and a second secondary clamping block arranged in a fixed manner; The first main clamping block can be lifted and lowered relative to the first auxiliary clamping block, thereby realizing the opening and closing of the first main clamping block and the first auxiliary clamping block; The two auxiliary movable seats can move away from or towards each other, thereby driving the second auxiliary clamping block to open and close.

9. The resin feeding device for chip substrate packaging according to claim 8, characterized in that: The first pallet handling assembly includes a film-sticking substrate and a first film-sticking clamping mechanism. The film-sticking substrate can be movably arranged on the second mounting platform. The first film-sticking clamping mechanism is movably arranged on the film-sticking substrate and can be raised and lowered relative to the film-sticking substrate. The first film-sticking clamping mechanism has the same structure as the second main clamping mechanism.

10. The resin feeding device for chip substrate packaging according to claim 9, characterized in that: It also includes two parallel first conveying brackets and two parallel second conveying brackets arranged on the second mounting platform, the two ends of the film-laminating substrate are movably arranged on the first conveying brackets, and the two ends of the conveying substrate are movably arranged on the second conveying brackets, wherein the first conveying bracket and the second conveying bracket are relatively parallel, and the film-laminating substrate and the conveying substrate are both set at a preset distance from the second mounting platform.

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