Ultrasonic quantitative cleaning process for smooth surface of quartz substrate

Abstract

The invention discloses an ultrasonic quantitative cleaning process for a smooth surface of a quartz substrate, relates to the technical field of quartz substrate cleaning, and aims to solve the problems that the cleaning process of the quartz substrate is inconvenient and the cleaning effect is poor. In the medium-frequency band analysis, the composition of the cleaning solution is optimized and the cleaning efficiency is improved through a fine solution ratio and a step-by-step adding mode, the advantages of a low-frequency band and a medium-frequency band are combined by combining a cleaning scheme, primary cleaning is performed firstly to remove most dirt, and then secondary cleaning is performed; then fine cleaning is conducted to deeply remove residues in tiny gaps, the efficient cleaning effect is achieved, through strict finished product detection, unqualified products can be found and treated in time in the production process, the unqualified products are prevented from flowing into follow-up procedures or markets, the production cost and the quality loss are reduced, a cleaning scheme is made again according to the comparison difference value, and the cleaning efficiency is improved. The maximization of the cleaning effect is ensured, the cleaning accuracy and efficiency can be remarkably improved, and meanwhile substrate damage caused by improper cleaning is reduced.

Description

Technical Field

[0001] The invention relates to the technical field of quartz substrate cleaning, in particular to an ultrasonic quantitative cleaning process for a smooth surface of a quartz substrate. Background Art

[0002] Quartz substrate cleaning refers to the process of using specific methods and techniques to remove contaminants and impurities attached to the surface of the quartz substrate.

[0003] The patent application with announcement number CN105127142B discloses an ultrasonic cleaning method for ultra-smooth surface fused quartz optical substrate for laser thin film components. The method mainly obtains the minimum ultrasonic power and the best ultrasonic time for effectively removing micron-sized particles at a low frequency of 80KHz ultrasonic frequency by spin-coating a substrate with 1μm~3μm artificial silicon oxide balls before formal ultrasonic cleaning; obtains the best ratio of ammonia water, hydrogen peroxide and pure water at a medium frequency of 400KHz ultrasonic frequency by spin-coating a substrate with 0.3μm~1μm artificial silicon oxide balls, and obtains the best ultrasonic time by combining an atomic force microscope; after obtaining the optimal ultrasonic cleaning parameters by combining the above two aspects, the ultra-smooth fused quartz optical substrate is subjected to ultrasonic fine cleaning. Although the above patent application solves the problem of quartz substrate cleaning, the following problems still exist in actual operation: 1. No targeted ultrasonic quantitative cleaning plan was formulated based on the characteristics of the quartz substrate, resulting in poor cleaning efficiency of the quartz substrate.

[0004] 2. Before the quartz substrate was ultrasonically cleaned, the equipment involved was not further inspected, and the cleaning process was not recorded in a timely manner during ultrasonic cleaning, resulting in poor cleaning fluency of the quartz substrate and the inability to trace the cleaning data.

[0005] 3. The quartz substrate that has been cleaned by ultrasonic quantitative cleaning is not subjected to final finished product inspection, and the cleaning plan is not optimized and improved based on the final finished product inspection results, resulting in the cleaning plan being inflexible. Summary of the invention

[0006] The purpose of the present invention is to provide an ultrasonic quantitative cleaning process for the smooth surface of a quartz substrate. In the mid-frequency band analysis, the composition of the cleaning solution is optimized and the cleaning efficiency is improved through fine solution ratio and gradual addition. The fusion cleaning scheme combines the advantages of the low-frequency band and the mid-frequency band. Preliminary cleaning is first performed to remove most of the dirt, and then fine cleaning is performed to deeply remove the residues in the tiny gaps, thereby achieving an efficient cleaning effect. Through strict finished product testing, unqualified products can be discovered and processed in time during the production process to prevent them from flowing into subsequent processes or the market, thereby reducing production costs and quality losses. The cleaning scheme is reformulated based on the comparison difference to ensure the maximization of the cleaning effect, which can significantly improve the accuracy and efficiency of cleaning, while reducing the damage to the substrate caused by improper cleaning, thereby solving the problems in the prior art.

[0007] To achieve the above object, the present invention provides the following technical solutions: An ultrasonic quantitative cleaning process for a smooth surface of a quartz substrate comprises the following steps: S1: Material selection: Before the quartz substrate is subjected to ultrasonic quantitative cleaning, the quartz material is first selected, and after the selection is completed, the quartz substrate is tested, and after the test is completed, the quartz substrate to be cleaned is obtained; S2: Cleaning scheme design: Analyze the characteristics of the quartz substrate to be cleaned, formulate an ultrasonic quantitative cleaning scheme based on the confirmed characteristics, and obtain a standard cleaning scheme after the formulation is completed; S3: Cleaning equipment testing: Confirm the equipment involved in the standard cleaning plan, perform functional testing on each equipment, and prepare for cleaning the quartz substrate after all functional tests are qualified; S4: Cleaning implementation: Cleaning the quartz substrate to be cleaned according to a standard cleaning scheme, and recording the cleaning process of the quartz substrate to be cleaned in real time, and obtaining cleaning process data after real-time recording; S5: Quartz substrate inspection: inspect the quartz substrate after ultrasonic quantitative cleaning, and mark the inspection result as quartz substrate inspection data; S6: Detection data adjustment and evaluation: Analyze the quartz substrate detection data, perform cleaning adjustments based on the analysis results, evaluate the analysis results, and finally transmit the cleaning adjustment data and evaluation data to the display terminal for display.

[0008] Preferably, the quartz material is selected in S1, and after the selection is completed, the quartz substrate is tested, including: Select materials with SiO2 content higher than 99.5% as quartz materials for quartz substrates. After the quartz materials are confirmed, test the purchased quartz substrates. Testing includes appearance inspection, purity inspection, size inspection, shape inspection, surface roughness inspection, optical property inspection and chemical stability inspection; Among them, appearance inspection is to check the defects on the surface of quartz substrate, including cracks, bubbles and stains; purity inspection is to detect SiO2 content and impurities using Fourier transform infrared spectroscopy; size inspection and shape inspection are to use microscope and projector to detect whether the size and shape of quartz substrate meet the preset specifications; surface roughness inspection is to use atomic force microscope to detect the roughness of quartz substrate surface; optical performance inspection is to detect the transmittance and refractive index of quartz substrate; chemical stability inspection is to detect the corrosion resistance and chemical stability of quartz substrate; After the appearance inspection, purity inspection, size inspection, shape inspection, surface roughness inspection, optical property inspection and chemical stability inspection are completed and qualified, each quartz substrate will be uniquely coded and labeled, and the quartz substrate to be cleaned will be obtained after the unique coding and labeling.

[0009] Preferably, the characteristic analysis of the quartz substrate to be cleaned is performed in S2, and an ultrasonic quantitative cleaning scheme is formulated according to the confirmed characteristics, including: According to the detection result of the quartz substrate in the quartz substrate to be cleaned, the detection result is subjected to characteristic analysis; Before feature analysis, the size of the silicon oxide spheres coated on the quartz substrate was confirmed; The quartz substrate coated with silicon oxide beads with a size of 1 μm-3 μm is marked as low-frequency analysis; The quartz substrate coated with silicon oxide beads with a size of 0.3 μm-1 μm is marked as mid-frequency analysis; The low-frequency and mid-frequency analysis of quartz substrates includes physical, chemical and acoustic properties analysis; Among them, the physical property analysis is surface morphology and adhesion; the chemical property analysis is pollutant type and cleaning agent selection; the acoustic property analysis is sound wave propagation and cavitation effect.

[0010] Preferably, the method of performing characteristic analysis of the quartz substrate according to the quartz substrate to be cleaned in S2 and formulating an ultrasonic quantitative cleaning scheme according to the confirmed characteristics further includes: Formulate a plan for ultrasonic quantitative cleaning of the quartz substrate analyzed in the low frequency band; The ultrasonic quantitative cleaning scheme for quartz substrates analyzed in the low frequency band is as follows: S2011: Preparation of experimental equipment, including 80KHz ultrasonic cleaning tank, Leica microscope, clean pure water system, power meter and timer; S2012: placing the quartz substrate into an 80KHz ultrasonic cleaning tank, with the ultrasonic time preset to 3 minutes, 6 minutes, 9 minutes and 12 minutes, for a total of four times; S2013: setting the ultrasonic output power of the 80KHz ultrasonic cleaning tank, wherein the initial ultrasonic output power is 100%, and the power is reduced by 10% each time the experiment is performed until the power is reduced to 10%, and each group of power settings is repeated at least 3 times; S2014: confirming the cleaning effect of the quartz substrate at different powers, and taking the ultrasonic output power at which the final cleaning efficiency reaches more than 95% and the surface of the quartz substrate is not damaged as the optimal power of the final ultrasonic cleaning solution; S2015: performing actual ultrasonic quantitative cleaning on the quartz substrate to be cleaned according to the optimal power, and summarizing the cleaning data of the actual ultrasonic quantitative cleaning.

[0011] Preferably, the method of performing characteristic analysis of the quartz substrate according to the quartz substrate to be cleaned in S2 and formulating an ultrasonic quantitative cleaning scheme according to the confirmed characteristics further includes: Formulate a plan for ultrasonic quantitative cleaning of the quartz substrate analyzed in the mid-frequency band; The ultrasonic quantitative cleaning scheme for the quartz substrate analyzed in the mid-frequency band is as follows: S2021: Experimental equipment preparation, including 400 kHz ultrasonic cleaning tank, ultrasonic cleaning generator, timer, solution container, pipette, magnetic stirrer and atomic force microscope; S2022: Place the quartz substrate in a 400 kHz ultrasonic cleaning tank, the ultrasonic time is 3 minutes, and the ultrasonic power is full power; S2023: mixing a solution, wherein the solution includes hydrogen peroxide, ammonia water and pure water, wherein the hydrogen peroxide is a 30%-35% hydrogen peroxide solution; the ammonia water is a 25%-28% ammonia water solution; and the pure water is high-purity deionized water or distilled water; S2024: add pure water to the 400 kHz ultrasonic cleaning tank, gradually add hydrogen peroxide after the pure water is added, and then gradually add ammonia water, and record the amount of solution added each time; S2025: After each addition of ammonia water, ultrasonic cleaning is performed for 3 minutes. After the ultrasonic cleaning is completed, the cleaning efficiency is evaluated using an atomic force microscope, and the solution ratio with a final cleaning effect of more than 95% is taken as the optimal ratio; S2026: Performing actual ultrasonic quantitative cleaning on the quartz substrate to be cleaned according to the optimal ratio, and summarizing the cleaning data of the actual ultrasonic quantitative cleaning.

[0012] Preferably, the method of performing characteristic analysis of the quartz substrate according to the quartz substrate to be cleaned in S2 and formulating an ultrasonic quantitative cleaning scheme according to the confirmed characteristics further includes: Formulate a cleaning plan by integrating the ultrasonic quantitative cleaning plan for the quartz substrate analyzed in the mid-frequency band and the ultrasonic quantitative cleaning plan for the quartz substrate analyzed in the low-frequency band; The fusion cleaning scheme is as follows: S2031: Prepare 80KHz and 400 kHz ultrasonic cleaning tanks, Leica microscope, atomic force microscope, clean pure water system, power meter, timer, solution container, pipette, magnetic stirrer; S2032: firstly put the quartz substrate into an 80KHz ultrasonic cleaning tank for preliminary cleaning, the ultrasonic time is preset to 3 minutes, the power is set to 100%, and after the preliminary cleaning, the quartz substrate is rinsed with pure water; S2033: placing the quartz substrate in a 400 kHz ultrasonic cleaning tank for fine cleaning, with the ultrasonic time preset to 3 minutes and the power set to full power, and adding the solution prepared according to step S2023 into the 400 kHz ultrasonic cleaning tank; S2034: Use an atomic force microscope to evaluate the cleaning efficiency of the quartz substrate that has been ultrasonically cleaned in S2033. When the cleaning efficiency reaches more than 95%, a final ultrasonic quantitative cleaning plan for the quartz substrate is formulated, and a standard cleaning plan is obtained after the formulation is completed.

[0013] Preferably, the equipment involved in the standard cleaning scheme is confirmed in S3, and each equipment is subjected to functional testing, including: The equipment involved includes an 80KHz ultrasonic cleaning tank, a 400 kHz ultrasonic cleaning tank, a Leica microscope, an atomic force microscope, a clean pure water system, an ultrasonic cleaning generator, a power meter, a timer, a solution container, a pipette, and a magnetic stirrer; Among them, the 80KHz ultrasonic cleaning tank and the 400 kHz ultrasonic cleaning tank are tested for frequency, power, temperature control and integrity; the ultrasonic cleaning generator is tested for stability and power adjustment; the timer is tested for accuracy; the solution container and pipette are tested for sealing and accuracy; the magnetic stirrer is tested for stirring effect; the Leica microscope and atomic force microscope are tested for imaging clarity and calibration; the clean pure water system is tested for water quality; the power meter is tested for readings; After each device has been inspected and qualified, the quartz substrate is prepared for cleaning.

[0014] Preferably, the quartz substrate to be cleaned is cleaned according to the standard cleaning scheme in S4, and the cleaning process of the quartz substrate to be cleaned is recorded in real time, including: When cleaning the quartz substrate to be cleaned, the cleaning time of each quartz substrate to be cleaned is recorded, and the parameters of each stage of the cleaning process as well as the solution ratio, addition order and amount are recorded, and the parameters include ultrasonic frequency, power, cleaning time and solution temperature; At the same time, the changes in the cleaning process are recorded by camera or direct observation, including bubble generation and solution color change; After the ultrasonic quantitative cleaning is completed, the cleaning end time of each quartz substrate to be cleaned is recorded, and a preliminary appearance inspection is performed on each quartz substrate to be cleaned, and the appearance inspection is for residual contaminants; Finally, the cleaning process data is obtained.

[0015] Preferably, the inspection after the quartz substrate that has been cleaned by ultrasonic quantitative cleaning in S5 includes: Conduct finished product inspection on the quartz substrate to be cleaned after ultrasonic quantitative cleaning according to the standard cleaning scheme; Finished product testing includes appearance inspection, roughness inspection, purity inspection, size inspection, shape inspection, optical performance inspection and chemical stability inspection; After the finished product inspection is completed, the quartz substrate inspection data is obtained.

[0016] Preferably, the quartz substrate detection data is analyzed in S6, cleaning adjustment is performed according to the analysis result, and the analysis result is evaluated, and finally the cleaning adjustment data and the evaluation data are transmitted to the display terminal for display, including: Compare and analyze the test data of the quartz substrate before ultrasonic quantitative cleaning with the test data of the quartz substrate; The cleaning efficiency is evaluated based on the comparison results. The cleaning efficiency evaluation is divided into meeting the requirements, basically meeting the requirements, and not meeting the requirements. According to the cleaning efficiency evaluation results, the attributes are matched and adjusted, the unsatisfied attributes are confirmed, and the cleaning plan is re-formulated according to the comparison difference, where the attributes are the items to be tested; Finally, the cleaning efficiency evaluation data, attribute correspondence and adjustment data are transmitted to the display terminal in the form of charts for display.

[0017] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention provides an ultrasonic quantitative cleaning process for the smooth surface of a quartz substrate. In the mid-frequency band analysis, the composition of the cleaning solution is optimized and the cleaning efficiency is improved through fine solution ratio and gradual addition. The fusion cleaning scheme combines the advantages of the low-frequency band and the mid-frequency band. A preliminary cleaning is performed first to remove most of the dirt, and then a fine cleaning is performed to deeply remove the residues in the tiny gaps, thereby achieving an efficient cleaning effect.

[0018] 2. The ultrasonic quantitative cleaning process for the smooth surface of a quartz substrate provided by the present invention ensures that all equipment is in good working condition through comprehensive equipment function confirmation and detection, reduces downtime caused by equipment failure, and improves production efficiency. By recording in detail the cleaning time of each quartz substrate to be cleaned, as well as key parameters such as ultrasonic frequency, power, cleaning time and solution temperature, the high controllability of the cleaning process can be ensured.

[0019] 3. The ultrasonic quantitative cleaning process for the smooth surface of a quartz substrate provided by the present invention can timely detect and deal with unqualified products in the production process through strict finished product inspection, avoiding their flow into subsequent processes or the market, thereby reducing production costs and quality losses. The cleaning plan can be reformulated based on the comparison difference to ensure the maximization of the cleaning effect, which can significantly improve the accuracy and efficiency of cleaning and reduce substrate damage caused by improper cleaning. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the ultrasonic quantitative cleaning steps of the smooth surface of the quartz substrate of the present invention; Figure 2 The figure is a schematic diagram of the ultrasonic quantitative cleaning process of the smooth surface of a quartz substrate of the present invention. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] In order to solve the problem that the existing technology does not formulate a targeted ultrasonic quantitative cleaning solution based on the characteristics of the quartz substrate, resulting in poor cleaning efficiency of the quartz substrate, please refer to Figure 1 and Figure 2 , this embodiment provides the following technical solutions: An ultrasonic quantitative cleaning process for a smooth surface of a quartz substrate comprises the following steps: S1: Material selection: Before the quartz substrate is subjected to ultrasonic quantitative cleaning, the quartz material is first selected, and after the selection is completed, the quartz substrate is tested, and after the test is completed, the quartz substrate to be cleaned is obtained; Among them, the quartz substrate that has been strictly screened and tested has a more uniform and stable surface property, which is conducive to the implementation of the ultrasonic cleaning process; S2: Cleaning scheme design: Analyze the characteristics of the quartz substrate to be cleaned, formulate an ultrasonic quantitative cleaning scheme based on the confirmed characteristics, and obtain a standard cleaning scheme after the formulation is completed; Among them, through comprehensive characteristic analysis and precise cleaning strategy, it can be ensured that the quartz substrate maintains its original physical and chemical properties during the cleaning process; S3: Cleaning equipment testing: Confirm the equipment involved in the standard cleaning plan, perform functional testing on each equipment, and prepare for cleaning the quartz substrate after all functional tests are qualified; Among them, through comprehensive equipment function confirmation and testing, we ensure that all equipment is in good working condition and reduce downtime caused by equipment failure; S4: Cleaning implementation: Cleaning the quartz substrate to be cleaned according to a standard cleaning scheme, and recording the cleaning process of the quartz substrate to be cleaned in real time, and obtaining cleaning process data after real-time recording; Among them, by recording the changes in the cleaning process through cameras or direct observation, the dynamics of the cleaning process can be monitored in real time, and potential problems can be discovered and solved in time; S5: Quartz substrate inspection: inspect the quartz substrate after ultrasonic quantitative cleaning, and mark the inspection result as quartz substrate inspection data; Among them, through strict finished product testing, unqualified products can be discovered and handled in time during the production process; S6: Detection data adjustment and evaluation: Analyze the quartz substrate detection data, perform cleaning adjustment according to the analysis results, evaluate the analysis results, and finally transmit the cleaning adjustment data and evaluation data to the display terminal for display; Among them, reformulating the cleaning plan based on the comparison difference to ensure the maximization of the cleaning effect can significantly improve the accuracy and efficiency of cleaning.

[0023] In S1, the quartz material is selected and after the selection is completed, the quartz substrate is tested, including: Select materials with SiO2 content higher than 99.5% as quartz materials for quartz substrates. After the quartz materials are confirmed, test the purchased quartz substrates. Testing includes appearance inspection, purity inspection, size inspection, shape inspection, surface roughness inspection, optical property inspection and chemical stability inspection; Among them, appearance inspection is to check the defects on the surface of quartz substrate, including cracks, bubbles and stains; purity inspection is to detect SiO2 content and impurities using Fourier transform infrared spectroscopy; size inspection and shape inspection are to use microscope and projector to detect whether the size and shape of quartz substrate meet the preset specifications; surface roughness inspection is to use atomic force microscope to detect the roughness of quartz substrate surface; optical performance inspection is to detect the transmittance and refractive index of quartz substrate; chemical stability inspection is to detect the corrosion resistance and chemical stability of quartz substrate; After the appearance inspection, purity inspection, size inspection, shape inspection, surface roughness inspection, optical property inspection and chemical stability inspection are completed and qualified, each quartz substrate will be uniquely coded and labeled, and the quartz substrate to be cleaned will be obtained after the unique coding and labeling.

[0024] Specifically, by strictly selecting quartz materials with SiO2 content higher than 99.5% as substrates, the high purity and excellent physical and chemical properties of the quartz substrates are ensured. This provides a solid foundation for the subsequent ultrasonic cleaning process, helps to reduce impurity contamination and chemical reactions that may occur during the cleaning process, and the implemented testing process covers multiple aspects such as appearance, purity, size, shape, surface roughness, optical properties and chemical stability, ensuring that the quartz substrates meet the use requirements in multiple dimensions. This comprehensive testing not only improves the quality of the quartz substrate, but also provides reliable data support for the subsequent cleaning process. High-precision instruments such as Fourier transform infrared spectroscopy, microscopes, projectors, and atomic force microscopes are used for testing, which improves the accuracy and reliability of the test. These technologies can accurately measure the various parameters of the quartz substrate, provide a scientific basis for the optimization of the cleaning process, and uniquely encode each quartz substrate for easy tracking and management in the subsequent production and quality control process. This coding method helps improve production efficiency and ensures that each quartz substrate is properly processed and recorded. Quartz substrates that have been strictly screened and tested have more uniform and stable surface properties, which is conducive to the implementation of ultrasonic cleaning processes. Ultrasonic cleaning can effectively remove dirt and impurities attached to the surface of quartz substrates using high-frequency vibrations, while high purity and uniform surface properties help improve cleaning effects and efficiency.

[0025] In S2, the characteristics of the quartz substrate to be cleaned are analyzed, and an ultrasonic quantitative cleaning plan is formulated based on the confirmed characteristics, including: According to the detection result of the quartz substrate in the quartz substrate to be cleaned, the detection result is subjected to characteristic analysis; Before feature analysis, the size of the silicon oxide spheres coated on the quartz substrate was confirmed; The quartz substrate coated with silicon oxide beads with a size of 1 μm-3 μm is marked as low-frequency analysis; The quartz substrate coated with silicon oxide beads with a size of 0.3 μm-1 μm is marked as mid-frequency analysis; The low-frequency and mid-frequency analysis of quartz substrates includes physical, chemical and acoustic properties analysis; Among them, the physical property analysis is surface morphology and adhesion; the chemical property analysis is pollutant type and cleaning agent selection; the acoustic property analysis is sound wave propagation and cavitation effect.

[0026] Specifically, by dividing the quartz substrate into low-frequency band and mid-frequency band analysis according to the size of the silicon oxide balls, a more precise cleaning strategy can be formulated for contaminants of different size ranges. This classification helps to better understand the interaction between contaminants and the substrate surface, thereby optimizing the cleaning effect. The mentioned physical property analysis (surface morphology and adhesion), chemical property analysis (contaminant type and cleaning agent selection) and acoustic property analysis (sound wave propagation and cavitation effect) provide comprehensive data support for the cleaning process. These analyses help to identify the nature of contaminants, select appropriate cleaning agents, and optimize ultrasonic cleaning parameters to ensure the pertinence and effectiveness of cleaning. By performing characteristic analysis on the quartz substrate, surface contaminants can be removed more effectively while reducing damage to the substrate. Accurate cleaning strategies can avoid damage to the substrate surface caused by excessive cleaning, and can also prevent contaminant residues caused by insufficient cleaning. Through comprehensive characteristic analysis and precise cleaning strategies, it can be ensured that the quartz substrate maintains its original physical and chemical properties during the cleaning process, thereby improving the reliability and stability of the product.

[0027] Formulate a plan for ultrasonic quantitative cleaning of the quartz substrate analyzed in the low frequency band; The ultrasonic quantitative cleaning scheme for quartz substrates analyzed in the low frequency band is as follows: S2011: Preparation of experimental equipment, including 80KHz ultrasonic cleaning tank, Leica microscope, clean pure water system, power meter and timer; S2012: placing the quartz substrate into an 80KHz ultrasonic cleaning tank, with the ultrasonic time preset to 3 minutes, 6 minutes, 9 minutes and 12 minutes, for a total of four times; S2013: setting the ultrasonic output power of the 80KHz ultrasonic cleaning tank, wherein the initial ultrasonic output power is 100%, and the power is reduced by 10% each time the experiment is performed until the power is reduced to 10%, and each group of power settings is repeated at least 3 times; S2014: confirming the cleaning effect of the quartz substrate at different powers, and taking the ultrasonic output power at which the final cleaning efficiency reaches more than 95% and the surface of the quartz substrate is not damaged as the optimal power of the final ultrasonic cleaning solution; S2015: performing actual ultrasonic quantitative cleaning on the quartz substrate to be cleaned according to the optimal power, and summarizing the cleaning data of the actual ultrasonic quantitative cleaning.

[0028] Specifically, by systematically setting different ultrasonic time and ultrasonic output power, the influence of these two key parameters on the cleaning effect can be fully explored. This systematic experimental design helps to ensure that the best cleaning conditions are found. It clearly states that the cleaning efficiency must reach more than 95%, and the quartz substrate surface must be free of damage, which provides a clear quantitative standard for the evaluation of the cleaning effect. This quantitative evaluation helps to ensure the consistency and reliability of the cleaning quality. By confirming the cleaning effect at different powers and finding the optimal power that can both ensure the cleaning efficiency and avoid damage to the quartz substrate surface, it can not only improve the cleaning efficiency, but also extend the service life of the quartz substrate. It is required to summarize the cleaning data of the actual ultrasonic quantitative cleaning, which helps to continuously improve and optimize the cleaning process. Through the analysis of the data, potential improvement points can be found to further improve the cleaning quality and efficiency. It is not only suitable for quartz substrates analyzed in the low-frequency band, but also can be appropriately adjusted for other types of substrates and cleaning requirements as needed. It has strong versatility and applicability, and can minimize unnecessary resource consumption while ensuring the cleaning quality.

[0029] Formulate a plan for ultrasonic quantitative cleaning of the quartz substrate analyzed in the mid-frequency band; The ultrasonic quantitative cleaning scheme for the quartz substrate analyzed in the mid-frequency band is as follows: S2021: Experimental equipment preparation, including 400 kHz ultrasonic cleaning tank, ultrasonic cleaning generator, timer, solution container, pipette, magnetic stirrer and atomic force microscope; S2022: Place the quartz substrate in a 400 kHz ultrasonic cleaning tank, the ultrasonic time is 3 minutes, and the ultrasonic power is full power; S2023: mixing a solution, wherein the solution includes hydrogen peroxide, ammonia water and pure water, wherein the hydrogen peroxide is a 30%-35% hydrogen peroxide solution; the ammonia water is a 25%-28% ammonia water solution; and the pure water is high-purity deionized water or distilled water; S2024: add pure water to the 400 kHz ultrasonic cleaning tank, gradually add hydrogen peroxide after the pure water is added, and then gradually add ammonia water, and record the amount of solution added each time; S2025: After each addition of ammonia water, ultrasonic cleaning is performed for 3 minutes. After the ultrasonic cleaning is completed, the cleaning efficiency is evaluated using an atomic force microscope, and the solution ratio with a final cleaning effect of more than 95% is taken as the optimal ratio; S2026: Performing actual ultrasonic quantitative cleaning on the quartz substrate to be cleaned according to the optimal ratio, and summarizing the cleaning data of the actual ultrasonic quantitative cleaning.

[0030] Specifically, a 400 kHz ultrasonic cleaning tank was used. The cavitation effect of ultrasonic waves of this frequency in the cleaning liquid is strong, which can effectively separate dirt from the surface of the quartz substrate and improve the cleaning efficiency. The cleaning time was set to 3 minutes, which ensured the high efficiency of the cleaning process and avoided the damage to the substrate caused by ultrasonic cleaning for too long. The magnetic stirrer ensured the uniform mixing of the cleaning liquid, which improved the consistency of the cleaning effect. The use of tools such as pipettes and timers can accurately control the ratio of the cleaning liquid and the cleaning time, making the cleaning process more controllable. By gradually adding hydrogen peroxide and ammonia water and recording the amount added each time, the optimal solution ratio can be systematically explored. Ultrasonic cleaning and cleaning efficiency evaluation were performed after each addition of ammonia water to ensure that the final solution ratio was optimal and could maximize the cleaning effect. Cleaning efficiency evaluation was performed using an atomic force microscope, which is a high-precision measurement method that can accurately reflect the surface changes before and after cleaning, thereby ensuring the accuracy of the cleaning quality. Each step has clear operating instructions and recording requirements, making the cleaning process repeatable.

[0031] Formulate a cleaning plan by integrating the ultrasonic quantitative cleaning plan for the quartz substrate analyzed in the mid-frequency band and the ultrasonic quantitative cleaning plan for the quartz substrate analyzed in the low-frequency band; The fusion cleaning scheme is as follows: S2031: Prepare 80KHz and 400 kHz ultrasonic cleaning tanks, Leica microscope, atomic force microscope, clean pure water system, power meter, timer, solution container, pipette, magnetic stirrer; S2032: firstly put the quartz substrate into an 80KHz ultrasonic cleaning tank for preliminary cleaning, the ultrasonic time is preset to 3 minutes, the power is set to 100%, and after the preliminary cleaning, the quartz substrate is rinsed with pure water; S2033: placing the quartz substrate in a 400 kHz ultrasonic cleaning tank for fine cleaning, with the ultrasonic time preset to 3 minutes and the power set to full power, and adding the solution prepared according to step S2023 into the 400 kHz ultrasonic cleaning tank; S2034: Use an atomic force microscope to evaluate the cleaning efficiency of the quartz substrate that has been ultrasonically cleaned in S2033. When the cleaning efficiency reaches more than 95%, a final ultrasonic quantitative cleaning plan for the quartz substrate is formulated, and a standard cleaning plan is obtained after the formulation is completed.

[0032] Specifically, the ultrasonic cleaning tank with two different frequencies of 80KHz and 400kHz is combined to achieve an organic combination of preliminary cleaning and fine cleaning. The 80KHz ultrasonic cleaning can effectively remove most of the dirt and impurities on the surface of the quartz substrate, while the 400kHz ultrasonic cleaning can more deeply clean tiny gaps and hard-to-reach areas, improving the overall cleaning efficiency. Through the evaluation of atomic force microscopy, the cleanliness of the surface of the quartz substrate after cleaning can be accurately measured to ensure that the cleaning efficiency reaches more than 95%. This high-precision evaluation method can ensure the consistency and reliability of the cleaning quality and meet the requirements of high-precision processes. The ultrasonic time, power and other parameters in the cleaning scheme can be preset and adjusted, making the cleaning process highly controllable. At the same time, the use of tools such as power meters and timers can accurately monitor and control the parameter changes during the cleaning process to ensure the stability and consistency of the cleaning effect, which can be adjusted and optimized according to different quartz substrate materials, pollution levels and cleaning requirements. For example, different cleaning needs can be met by changing parameters such as the ratio of the cleaning liquid, cleaning time and power. In the low-frequency band analysis, multiple experiments are carried out by changing the ultrasonic time and power to find the optimal cleaning power. This method ensures the stability and reliability of the cleaning effect. In the medium-frequency band analysis, the composition of the cleaning liquid is optimized and the cleaning efficiency is improved through fine solution ratios and gradual addition. The fusion cleaning solution combines the advantages of the low-frequency band and the medium-frequency band. Preliminary cleaning is performed first to remove most of the dirt, and then fine cleaning is performed to deeply remove residues in tiny gaps, thereby achieving efficient cleaning effects.

[0033] In order to solve the problem in the prior art that the equipment involved is not further tested before ultrasonic cleaning of the quartz substrate, and the cleaning process is not recorded in time during ultrasonic cleaning, which leads to the problem that the cleaning fluency of the quartz substrate is not high and the cleaning data cannot be traced, please refer to Figure 1 and Figure 2 , this embodiment provides the following technical solutions: Confirm the equipment involved in the standard cleaning plan in S3 and perform functional tests on each equipment, including: The equipment involved includes an 80KHz ultrasonic cleaning tank, a 400 kHz ultrasonic cleaning tank, a Leica microscope, an atomic force microscope, a clean pure water system, an ultrasonic cleaning generator, a power meter, a timer, a solution container, a pipette, and a magnetic stirrer; Among them, the 80KHz ultrasonic cleaning tank and the 400 kHz ultrasonic cleaning tank are tested for frequency, power, temperature control and integrity; the ultrasonic cleaning generator is tested for stability and power adjustment; the timer is tested for accuracy; the solution container and pipette are tested for sealing and accuracy; the magnetic stirrer is tested for stirring effect; the Leica microscope and atomic force microscope are tested for imaging clarity and calibration; the clean pure water system is tested for water quality; the power meter is tested for readings; After each device has been inspected and qualified, the quartz substrate is prepared for cleaning.

[0034] Specifically, the 80KHz ultrasonic cleaning tank and the 400 kHz ultrasonic cleaning tank are tested for frequency to ensure that the working frequency of the cleaning tank is accurate. According to different dirt and cleaning objects, the appropriate frequency is selected to achieve the best cleaning effect. Power detection ensures the cleaning intensity and meets different cleaning needs. The stability detection and power adjustment of the ultrasonic cleaning generator ensure that the generator can continuously and stably output ultrasonic energy, providing a stable ultrasonic source for the cleaning tank. The ultrasonic cleaning tank is tested for temperature control to ensure that the temperature is constant during the cleaning process and improve the cleaning efficiency and effect. The timer accuracy detection can ensure that the cleaning time is accurately controlled to avoid excessive or insufficient cleaning and improve the cleaning accuracy. The sealing and accuracy detection of the solution container and the pipette can ensure the accurate amount of the cleaning agent, prevent leakage, and improve the cleaning effect and safety. The stirring effect detection of the magnetic stirrer can ensure that the cleaning agent is mixed evenly and improve the cleaning effect. Through comprehensive equipment function confirmation and detection, it is ensured that all equipment is in good working condition, reduce downtime caused by equipment failure, and improve production efficiency. After the equipment is tested and qualified, cleaning preparation is carried out to ensure that the cleaning process is smooth and improve the cleaning efficiency and quality.

[0035] In S4, the quartz substrate to be cleaned is cleaned according to the standard cleaning scheme, and the cleaning process of the quartz substrate to be cleaned is recorded in real time, including: When cleaning the quartz substrate to be cleaned, the cleaning time of each quartz substrate to be cleaned is recorded, and the parameters of each stage of the cleaning process as well as the solution ratio, addition order and amount are recorded, and the parameters include ultrasonic frequency, power, cleaning time and solution temperature; At the same time, the changes in the cleaning process are recorded by camera or direct observation, including bubble generation and solution color change; After the ultrasonic quantitative cleaning is completed, the cleaning end time of each quartz substrate to be cleaned is recorded, and a preliminary appearance inspection is performed on each quartz substrate to be cleaned, and the appearance inspection is for residual contaminants; Finally, the cleaning process data is obtained.

[0036] Specifically, by recording in detail the cleaning time of each quartz substrate to be cleaned, as well as key parameters such as ultrasonic frequency, power, cleaning time and solution temperature, the cleaning process can be highly controllable. This precise control helps to achieve consistency and stability in the cleaning effect. Recording the solution ratio, addition order and amount at each stage of the cleaning process can ensure that the composition and concentration of the cleaning solution are always in the best state, thereby improving the cleaning effect. By recording changes in the cleaning process through a camera or direct observation, such as bubble generation and solution color changes, the dynamics of the cleaning process can be monitored in real time, and potential problems can be discovered and resolved in a timely manner. After the ultrasonic quantitative cleaning is completed, a preliminary appearance inspection is performed on each quartz substrate to be cleaned, which can promptly detect the residual contaminants and provide an important basis for subsequent processing. The data records of the entire cleaning process, including time, parameters, solution ratio, etc., provide rich basic data for subsequent data analysis and process optimization. Ultrasonic cleaning can complete the cleaning task in a shorter time, saving energy and time.

[0037] In order to solve the problem that the quartz substrates that have been cleaned by ultrasonic quantitative cleaning are not subjected to the final finished product inspection in the prior art, and the cleaning scheme is not optimized and improved according to the final finished product inspection results, which leads to the problem that the cleaning scheme is not flexible enough, please refer to Figure 1 and Figure 2 , this embodiment provides the following technical solutions: The quartz substrate that has been cleaned by ultrasonic quantitative cleaning in S5 is inspected after cleaning, including: Conduct finished product inspection on the quartz substrate to be cleaned after ultrasonic quantitative cleaning according to the standard cleaning scheme; Finished product testing includes appearance inspection, roughness inspection, purity inspection, size inspection, shape inspection, optical performance inspection and chemical stability inspection; After the finished product inspection is completed, the quartz substrate inspection data is obtained.

[0038] Specifically, by measuring the roughness of the quartz substrate surface, it can be determined whether the ultrasonic cleaning has caused excessive wear or scratches on the substrate surface, thereby ensuring that the cleaning process will not cause damage to the substrate surface. Ultrasonic cleaning can effectively remove impurities on the surface of the quartz substrate. Purity testing can verify whether the cleaned substrate has reached the required purity requirements, which is crucial to ensuring the quality and performance of the product. Chemical stability testing can be used to evaluate whether the cleaned quartz substrate still has good chemical stability, which is of great significance for the performance of the quartz substrate during subsequent processing and use. The testing scheme covers multiple aspects such as appearance, roughness, purity, size, shape, optical properties and chemical stability, and can comprehensively evaluate the quality of the cleaned quartz substrate. At the same time, these test items can usually be automated or completed quickly, thereby improving production efficiency. Through strict finished product testing, unqualified products can be discovered and processed in a timely manner during the production process to prevent them from flowing into subsequent processes or the market, thereby reducing production costs and quality losses.

[0039] Analyze the quartz substrate inspection data in S6, make cleaning adjustments based on the analysis results, evaluate the analysis results, and finally transmit the cleaning adjustment data and evaluation data to the display terminal for display, including: Compare and analyze the test data of the quartz substrate before ultrasonic quantitative cleaning with the test data of the quartz substrate; The cleaning efficiency is evaluated based on the comparison results. The cleaning efficiency evaluation is divided into meeting the requirements, basically meeting the requirements, and not meeting the requirements. According to the cleaning efficiency evaluation results, the attributes are matched and adjusted, the unsatisfied attributes are confirmed, and the cleaning plan is re-formulated according to the comparison difference, where the attributes are the items to be tested; Finally, the cleaning efficiency evaluation data, attribute correspondence and adjustment data are transmitted to the display terminal in the form of charts for display.

[0040] Specifically, by comparing and analyzing the detection data before ultrasonic quantitative cleaning with the original detection data of the quartz substrate, the area and degree that needs to be cleaned can be accurately identified, thereby avoiding unnecessary cleaning steps and waste of resources. The cleaning efficiency evaluation is divided into three levels: meeting the requirements, basically meeting the requirements, and not meeting the requirements. This clear classification helps to quickly identify the cleaning effect and ensure the efficient execution of the cleaning process. According to the cleaning efficiency evaluation results, the cleaning plan can be adjusted in a targeted manner. For attributes that do not meet the cleaning requirements, their specific problems can be further confirmed, and the cleaning plan can be re-formulated based on the comparison difference to ensure the maximization of the cleaning effect. This dynamic adjustment of the cleaning plan can significantly improve the accuracy and efficiency of cleaning, while reducing substrate damage caused by improper cleaning. Finally, the cleaning efficiency evaluation data, attribute correspondence and adjustment data are transmitted to the display terminal in the form of charts for display. This data visualization method makes the cleaning process more intuitive and transparent.

[0041] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0042] While the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that many changes, modifications, substitutions and variations can be made to the embodiments without departing from the principles and spirit of the invention.

Claims

1. A quartz substrate smooth surface ultrasonic quantitative cleaning process, It is characterized in that The steps include: S1: Material selection: Before the quartz substrate is subjected to ultrasonic quantitative cleaning, the quartz material is first selected, and after the selection is completed, the quartz substrate is tested, and after the test is completed, the quartz substrate to be cleaned is obtained; S2: Cleaning scheme design: Analyze the characteristics of the quartz substrate to be cleaned, formulate an ultrasonic quantitative cleaning scheme based on the confirmed characteristics, and obtain a standard cleaning scheme after the formulation is completed; S3: Cleaning equipment testing: Confirm the equipment involved in the standard cleaning plan, perform functional testing on each equipment, and prepare for cleaning the quartz substrate after all functional tests are qualified; S4: Cleaning implementation: Cleaning the quartz substrate to be cleaned according to a standard cleaning scheme, and recording the cleaning process of the quartz substrate to be cleaned in real time, and obtaining cleaning process data after real-time recording; S5: Quartz substrate inspection: inspect the quartz substrate after ultrasonic quantitative cleaning, and mark the inspection result as quartz substrate inspection data; S6: Detection data adjustment and evaluation: Analyze the quartz substrate detection data, perform cleaning adjustments based on the analysis results, evaluate the analysis results, and finally transmit the cleaning adjustment data and evaluation data to the display terminal for display.

2. The ultrasonic quantitative cleaning process for the smooth surface of a quartz substrate according to claim 1, It is characterized in that In S1, the quartz material is selected and after the selection is completed, the quartz substrate is tested, including: Select SiO 2 Materials with a content higher than 99.5% are used as quartz materials for quartz substrates. After the quartz materials are confirmed, the purchased quartz substrates are tested; Testing includes appearance inspection, purity inspection, size inspection, shape inspection, surface roughness inspection, optical property inspection and chemical stability inspection; Among them, the appearance inspection is to check the defects on the surface of the quartz substrate, including cracks, bubbles and stains; the purity inspection is to use Fourier transform infrared spectroscopy to detect SiO 2 Content and impurities; size detection and shape detection are to use microscope and projector to detect whether the size and shape of quartz substrate meet the preset specifications; surface roughness detection is to use atomic force microscope to detect the roughness of quartz substrate surface; optical performance detection is to detect the transmittance and refractive index of quartz substrate; chemical stability detection is to detect the corrosion resistance and chemical stability of quartz substrate; After the appearance inspection, purity inspection, size inspection, shape inspection, surface roughness inspection, optical property inspection and chemical stability inspection are completed and qualified, each quartz substrate will be uniquely coded and labeled, and the quartz substrate to be cleaned will be obtained after the unique coding and labeling.

3. The ultrasonic quantitative cleaning process for the smooth surface of a quartz substrate according to claim 2, It is characterized in that In S2, the characteristics of the quartz substrate to be cleaned are analyzed, and an ultrasonic quantitative cleaning plan is formulated based on the confirmed characteristics, including: According to the detection result of the quartz substrate in the quartz substrate to be cleaned, the detection result is subjected to feature analysis; Before feature analysis, the size of the silicon oxide spheres coated on the quartz substrate was confirmed; The quartz substrate coated with silicon oxide beads with a size of 1 μm-3 μm is marked as low-frequency analysis; The quartz substrate coated with silicon oxide beads with a size of 0.3 μm-1 μm is marked as mid-frequency analysis; The low-frequency and mid-frequency analysis of quartz substrates includes physical, chemical and acoustic properties analysis; Among them, the physical property analysis is surface morphology and adhesion; the chemical property analysis is pollutant type and cleaning agent selection; the acoustic property analysis is sound wave propagation and cavitation effect.

4. The ultrasonic quantitative cleaning process for the smooth surface of a quartz substrate according to claim 3, It is characterized in that In S2, the characteristics of the quartz substrate to be cleaned are analyzed, and an ultrasonic quantitative cleaning plan is formulated based on the confirmed characteristics, which also includes: Formulate a plan for ultrasonic quantitative cleaning of the quartz substrate analyzed in the low frequency band; The ultrasonic quantitative cleaning scheme for the quartz substrate analyzed in the low frequency band is as follows: S2011: Preparation of experimental equipment, including 80KHz ultrasonic cleaning tank, Leica microscope, clean pure water system, power meter and timer; S2012: placing the quartz substrate into an 80KHz ultrasonic cleaning tank, with the ultrasonic time preset to 3 minutes, 6 minutes, 9 minutes and 12 minutes, for a total of four times; S2013: setting the ultrasonic output power of the 80KHz ultrasonic cleaning tank, wherein the initial ultrasonic output power is 100%, and the power is reduced by 10% each time the experiment is performed until the power is reduced to 10%, and each group of power settings is repeated at least 3 times; S2014: confirming the cleaning effect of the quartz substrate at different powers, and taking the ultrasonic output power at which the final cleaning efficiency reaches more than 95% and the surface of the quartz substrate is not damaged as the optimal power of the final ultrasonic cleaning solution; S2015: performing actual ultrasonic quantitative cleaning on the quartz substrate to be cleaned according to the optimal power, and summarizing the cleaning data of the actual ultrasonic quantitative cleaning.

5. The ultrasonic quantitative cleaning process for the smooth surface of a quartz substrate according to claim 4, It is characterized in that In S2, the characteristics of the quartz substrate to be cleaned are analyzed, and an ultrasonic quantitative cleaning plan is formulated based on the confirmed characteristics, which also includes: Formulate a plan for ultrasonic quantitative cleaning of the quartz substrate analyzed in the mid-frequency band; The ultrasonic quantitative cleaning scheme for the quartz substrate analyzed in the mid-frequency band is as follows: S2021: Experimental equipment preparation, including 400 kHz ultrasonic cleaning tank, ultrasonic cleaning generator, timer, solution container, pipette, magnetic stirrer and atomic force microscope; S2022: Place the quartz substrate in a 400 kHz ultrasonic cleaning tank, the ultrasonic time is 3 minutes, and the ultrasonic power is full power; S2023: mixing a solution, wherein the solution includes hydrogen peroxide, ammonia water and pure water, wherein the hydrogen peroxide is a 30%-35% hydrogen peroxide solution; the ammonia water is a 25%-28% ammonia water solution; and the pure water is high-purity deionized water or distilled water; S2024: add pure water to the 400 kHz ultrasonic cleaning tank, gradually add hydrogen peroxide after the pure water is added, and then gradually add ammonia water, and record the amount of solution added each time; S2025: After each addition of ammonia water, ultrasonic cleaning is performed for 3 minutes. After the ultrasonic cleaning is completed, the cleaning efficiency is evaluated using an atomic force microscope, and the solution ratio with a final cleaning effect of more than 95% is taken as the optimal ratio; S2026: Performing actual ultrasonic quantitative cleaning on the quartz substrate to be cleaned according to the optimal ratio, and summarizing the cleaning data of the actual ultrasonic quantitative cleaning.

6. The ultrasonic quantitative cleaning process for the smooth surface of a quartz substrate according to claim 5, It is characterized in that In S2, the characteristics of the quartz substrate to be cleaned are analyzed, and an ultrasonic quantitative cleaning plan is formulated based on the confirmed characteristics, which also includes: Formulate a cleaning plan by integrating the ultrasonic quantitative cleaning plan for the quartz substrate analyzed in the mid-frequency band and the ultrasonic quantitative cleaning plan for the quartz substrate analyzed in the low-frequency band; The fusion cleaning scheme is as follows: S2031: Prepare 80KHz and 400 kHz ultrasonic cleaning tanks, Leica microscope, atomic force microscope, clean pure water system, power meter, timer, solution container, pipette, magnetic stirrer; S2032: firstly put the quartz substrate into an 80KHz ultrasonic cleaning tank for preliminary cleaning, the ultrasonic time is preset to 3 minutes, the power is set to 100%, and after the preliminary cleaning, the quartz substrate is rinsed with pure water; S2033: placing the quartz substrate in a 400 kHz ultrasonic cleaning tank for fine cleaning, with the ultrasonic time preset to 3 minutes and the power set to full power, and adding the solution prepared according to step S2023 into the 400 kHz ultrasonic cleaning tank; S2034: Use an atomic force microscope to evaluate the cleaning efficiency of the quartz substrate that has been ultrasonically cleaned in S2033. When the cleaning efficiency reaches more than 95%, a final ultrasonic quantitative cleaning plan for the quartz substrate is formulated, and a standard cleaning plan is obtained after the formulation is completed.

7. The ultrasonic quantitative cleaning process for the smooth surface of a quartz substrate according to claim 6, It is characterized in that Confirm the equipment involved in the standard cleaning plan in S3 and perform functional tests on each equipment, including: The equipment involved includes an 80KHz ultrasonic cleaning tank, a 400 kHz ultrasonic cleaning tank, a Leica microscope, an atomic force microscope, a clean pure water system, an ultrasonic cleaning generator, a power meter, a timer, a solution container, a pipette, and a magnetic stirrer; Among them, the 80KHz ultrasonic cleaning tank and the 400 kHz ultrasonic cleaning tank are tested for frequency, power, temperature control and integrity; the ultrasonic cleaning generator is tested for stability and power adjustment; the timer is tested for accuracy; the solution container and pipette are tested for sealing and accuracy; the magnetic stirrer is tested for stirring effect; the Leica microscope and atomic force microscope are tested for imaging clarity and calibration; the clean pure water system is tested for water quality; the power meter is tested for readings; After each device has been inspected and qualified, the quartz substrate is prepared for cleaning.

8. The ultrasonic quantitative cleaning process for the smooth surface of a quartz substrate according to claim 7, It is characterized in that In S4, the quartz substrate to be cleaned is cleaned according to the standard cleaning scheme, and the cleaning process of the quartz substrate to be cleaned is recorded in real time, including: When cleaning the quartz substrate to be cleaned, the cleaning time of each quartz substrate to be cleaned is recorded, and the parameters of each stage of the cleaning process as well as the solution ratio, addition order and amount are recorded, and the parameters include ultrasonic frequency, power, cleaning time and solution temperature; At the same time, the changes in the cleaning process are recorded by camera or direct observation, including bubble generation and solution color change; After the ultrasonic quantitative cleaning is completed, the cleaning end time of each quartz substrate to be cleaned is recorded, and a preliminary appearance inspection is performed on each quartz substrate to be cleaned, and the appearance inspection is for residual contaminants; Finally, the cleaning process data is obtained.

9. The ultrasonic quantitative cleaning process for the smooth surface of a quartz substrate according to claim 8, It is characterized in that The quartz substrate that has been cleaned by ultrasonic quantitative cleaning in S5 is inspected after cleaning, including: Conduct finished product inspection on the quartz substrate to be cleaned after ultrasonic quantitative cleaning according to the standard cleaning scheme; Finished product testing includes appearance inspection, roughness inspection, purity inspection, size inspection, shape inspection, optical performance inspection and chemical stability inspection; After the finished product inspection is completed, the quartz substrate inspection data is obtained.

10. The ultrasonic quantitative cleaning process for the smooth surface of a quartz substrate according to claim 9, It is characterized in that Analyze the quartz substrate inspection data in S6, make cleaning adjustments based on the analysis results, evaluate the analysis results, and finally transmit the cleaning adjustment data and evaluation data to the display terminal for display, including: Compare and analyze the test data of the quartz substrate before ultrasonic quantitative cleaning with the test data of the quartz substrate; The cleaning efficiency is evaluated based on the comparison results. The cleaning efficiency evaluation is divided into meeting the requirements, basically meeting the requirements, and not meeting the requirements. According to the cleaning efficiency evaluation results, the attributes are matched and adjusted, the unsatisfied attributes are confirmed, and the cleaning plan is re-formulated according to the comparison difference, where the attributes are the items to be tested; Finally, the cleaning efficiency evaluation data, attribute correspondence and adjustment data are transmitted to the display terminal in the form of charts for display.

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