Buffer device for continuous production process

Abstract

A buffer device according to the present invention comprises: a transfer unit that transfers an object to be transferred in order to perform a next process after a predetermined work step has passed; a buffer unit for lowering the temperature by placing the object to be transferred discharged from the transfer unit for a predetermined time; and a transport unit which is disposed on a transport path on which the transport unit transports the transport object to the buffer unit, transports the transport object accommodated in the buffer unit through the transport path, and transports the transport object to the buffer unit after the transport object is placed on the buffer unit for a preset time. The conveying unit conveys the object to be conveyed again and discharges the object to the conveying path.

Description

Technical Field

[0001] The present invention relates to a buffer device for a continuous production process, and more particularly, to a buffer device for a continuous production process, wherein after a transfer object that has been continuously transferred after completing a first process is accommodated in an additional buffer unit for a specified time, it can be discharged again by transfer to execute a second process. Background Art

[0002] Recently, with the development and production of various electronic devices such as semiconductors, displays, mobile phones, and cameras, the demand for such items has been gradually increasing, and therefore the production volume has also increased dramatically. In addition, with the increase in production volume, production quality has gradually become one of the important factors, and in response to this, devices for judging defects have been developed.

[0003] In particular, when foreign matter such as dust adheres to the surface of a lens used for a camera, the image captured by the transmitted light of the lens module may become darker or a shadow of the foreign matter may be produced as the amount of transmitted light decreases due to the foreign matter.

[0004] Therefore, the lens manufacturing process must include the work of cleaning the lens attachment surface, which is usually achieved by blowing air or cleaning fluid.

[0005] In this case, not only the cleaning object needs to be cleaned, but also, in many cases, it needs to be discharged in a state of increased temperature after cleaning through a drying process and then be carried out to the next step.

[0006] However, when the object is transferred to the next process under such a temperature rise state, not only will it be difficult to perform the process normally, but also the problem of reduced reliability will occur due to an increase in product defect rate.

[0007] In addition, if an error or failure occurs in part of the continuous production process, the entire production process will be interrupted.

[0008] In order to solve this problem, it is currently necessary to develop a technology that can realize continuous production in a continuous production process. Summary of the invention

[0009] In order to solve the existing problems of continuous process equipment, the purpose of the present invention is to provide a buffer device for a continuous production process. After the transfer object transferred through the continuous process is accommodated for a specified time by an additional buffer unit, the transfer object can be cooled by transferring it again to prevent accidental deformation of the product. Even if errors or failures occur in some processes, continuous production can be achieved by only solving the problems in some processes without interrupting the entire production process.

[0010] In order to achieve the above-mentioned purpose, a buffer device according to one embodiment of the present invention includes: a transfer unit, which transfers the transfer object in order to perform the next process after a preset operation step; a buffer unit, which lowers the temperature of the transfer object discharged from the transfer unit by placing it for a prescribed time; and a conveying unit, which is arranged on a transfer path for transferring the transfer object through the transfer unit, and is used to convey the transfer object to the buffer unit, transfer the transfer object accommodated in the buffer unit through the transfer path, and after placing the transfer object in the buffer unit for a preset time, the conveying unit conveys the transfer object again and discharges it to the transfer path.

[0011] Furthermore, the buffer unit is divided into a plurality of areas and each area is provided with a placement portion, so that the continuously transferred transfer objects can be independently accommodated in preset positions in the plurality of placement portions.

[0012] Furthermore, when placing the transfer objects on the placement section, the conveying unit may place a plurality of the transfer objects on the placement section in sequence, and when discharging the transfer objects from the placement section, the conveying unit may discharge the plurality of transfer objects in sequence in the order of the longest time they have been placed on the placement section.

[0013] Furthermore, the buffer unit may be a multi-layer structure, and at least one of the placement portions may be provided in each layer.

[0014] Furthermore, the placement portion may be a plate made of a heat-conducting metal material, and the object to be transferred may be placed on an upper surface thereof and cooled.

[0015] Furthermore, the buffer unit may further include a cooling portion, the cooling portion being in contact with at least a portion of the placement portion and configured to cool the transfer object.

[0016] Furthermore, the cooling portion is pin-shaped, and at least one cooling portion is protrudingly formed on the lower surface of the placement portion, and can be used to cool the heat transferred from the placement portion.

[0017] Furthermore, the cooling part receives additional cooling water from the outside to cool the placement part in a contact manner.

[0018] In order to solve the above-mentioned problems, the present invention has the following effects.

[0019] When the object to be transferred is transferred to the second process as the next process after passing through the first process such as the cleaning process or the drying process, the object to be transferred is delivered after being accommodated for a specified time by an additional buffer unit. Therefore, even if a problem occurs in the second process, the working speed and method of the first process can be adjusted to prevent the entire process from having problems.

[0020] Furthermore, even if the object to be transferred is transferred in a state of increased temperature in the first step, it can be placed in the buffer unit for a predetermined time and cooled before being transferred to the second step, thereby preventing defects from occurring and stably executing the second step.

[0021] The effects of the present invention are not limited to the above effects, and a person skilled in the art can clearly understand other effects not mentioned through the description of the scope of protection claimed in the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A diagram schematically showing the structure of a buffer device according to an embodiment of the present invention.

[0023] Figure 2 To briefly show Figure 1 Figure 2 is a diagram of the internal structure of the buffer device.

[0024] Figure 3 To briefly show Figure 1 Diagram of the internal structure of the buffer unit in the buffer device.

[0025] Figure 4 To show Figure 1 A state diagram of a transport unit placing a transfer object on a buffer unit in a buffer device.

[0026] Figure 5 To show Figure 4 A state diagram of a conveying unit in a buffer device discharging a transfer object from the buffer unit.

[0027] Figure 6 To show Figure 1 A diagram of the structure of the cooling part in the buffer unit.

[0028] Description of Reference Numerals

[0029] 100: Transfer unit

[0030] 110: Transfer roller

[0031] 120: Rotation axis

[0032] 200: Buffer unit

[0033] 210: Appearance

[0034] 220: Placement Department

[0035] 230: Cooling unit

[0036] 300: Handling unit

[0037] 310: Fixed support part

[0038] 320: Mobile Department

[0039] 330: Clamping part

[0040] 10: First process device

[0041] 20: Second process device

[0042] P: Transfer object DETAILED DESCRIPTION

[0043] Hereinafter, a preferred embodiment of the shock absorbing device of the present invention having the above-mentioned structure will be described with reference to the accompanying drawings. However, this does not mean that the present invention is limited to a specific embodiment, but is only used to further clarify the present embodiment.

[0044] Furthermore, in describing the present embodiment, the same structures are given the same names and the same reference numerals, and thus additional description thereof will be omitted.

[0045] First, refer to Figures 1 to 5 , the brief structure and operation of the buffer device of an embodiment of the present invention are described.

[0046] Figure 1 FIG. 1 is a diagram briefly showing the structure of a buffer device according to an embodiment of the present invention. Figure 2 To briefly show Figure 1 Figure 1 shows the internal structure of the buffer device. Figure 3 To briefly show Figure 1 Diagram of the internal structure of the buffer unit in the buffer device.

[0047] and, Figure 4 To show Figure 1 A state diagram of a transfer object being placed by a transport unit in a buffer device. Figure 5 To show Figure 4 A state diagram of a conveying unit in a buffer device discharging a transfer object from the buffer unit.

[0048] The buffer device of the present invention is a device that performs temporary storage and buffering functions and is independently provided on a path for transferring the transfer object P to the second process after the first process. The buffer device generally includes a transfer unit 100 , a buffer unit 200 and a conveying unit 300 .

[0049] The transfer unit 100 is disposed between a first process device 10 for performing the first process and a second process device 20 for performing the second process, and is used to transfer the transfer object P and place the transfer object P along at least one extending portion.

[0050] In this case, the transfer unit 100 may be formed by extending a module or by continuously arranging a plurality of modules, and the transfer object P may be arranged on the upper surface. Also, the transfer unit 100 may be formed by a plurality of rollers or a conveyor belt to transfer the transfer object P.

[0051] In this embodiment, the first process device 10 may be a drying device, which can dry the transfer object P after washing it. In addition, the transfer unit 100 may be formed by extending the one module, connected to the first process device 10 on one side and connected to the second process device 20 on the other side, for transferring the transfer object P.

[0052] Of course, although not shown in the figure, the transfer unit 100 may be composed of a plurality of modules, and the modules may be separated based on the conveying unit 300 and operate independently.

[0053] On the other hand, referring to the drawings, the transfer unit 100 of this embodiment includes a plurality of transfer rollers 110 arranged continuously along the length direction, and the transfer object P is moved by rotating the transfer rollers 110 with the transfer object P placed thereon.

[0054] In this case, the transfer unit 100 forms two tracks along the width direction and can transfer the two transfer objects P at the same time. Therefore, the position of the transport unit 300 can be adjusted along the width direction in order to transfer the transfer objects P.

[0055] Specifically, as shown in the figure, the transfer unit 100 is provided with a plurality of transfer rollers 110 along the length direction, each of the transfer rollers 110 has the same rotation axis, and a plurality of the transfer rollers 110 are spaced apart along the width direction. As shown in the figure, the plurality of transfer rollers 110 can be spaced apart from a rotation axis 120, and each two of them form a pair and transfer the transfer object P.

[0056] Furthermore, as shown in the figure, after the transfer unit 100 places the two transfer objects P along the width direction, a part of the transfer unit 100 may be moved along the width direction when the two transfer objects P are moved simultaneously.

[0057] In this case, if Figure 5 As shown, at least a portion of the transfer unit 100 is moved in the width direction, thereby causing the rotation shaft 120 itself to move.

[0058] That is, when the transfer unit 100 simultaneously transfers two or more transfer objects P along the width direction, a portion of the transfer unit 100 itself adjusts its position along the width direction, thereby allowing the transport unit to clamp the transfer objects P one by one and accommodate them in the buffer unit 200.

[0059] Of course, differently from this, when the transfer objects P are transferred one by one along the length direction, the transfer unit 100 does not need to adjust the position along the width direction.

[0060] As described above, the transfer unit 100 is extended and disposed between the first process device 10 and the second process device 20 to transfer the transfer object P that has completed the first process.

[0061] Next, the buffer unit 200 includes a placement unit 220 as a structure for temporarily storing the transfer object P transferred by the transfer unit 100 before being delivered to the second process device 20 , and is disposed adjacent to the transfer unit 100 and has a predetermined area.

[0062] Specifically, the buffer unit 200 includes at least one placement portion 220 and is arranged in a horizontal direction or a vertical direction for placing the transfer object P. In this case, if the transfer object P is placed in the placement portion 220, it is cooled to a normal temperature state after being placed for a predetermined time.

[0063] In the present invention, the buffer unit 200 generally includes: a placement portion 220 for placing the transfer object P; and a cooling portion 230 connected to the placement portion 220 for cooling the placement portion 220 or the transfer object P.

[0064] The placement portion 220 is in a plate shape and is made of a heat-conducting metal material, and the transfer object P is placed on the upper surface and cooled. In this case, the transfer object P may be in contact with the entire upper surface or a portion of the upper surface of the placement portion 220 .

[0065] Furthermore, the cooling unit 230 is directly connected to the placement unit 220 or is disposed at an adjacent position, and can discharge the heat conducted by the transfer object P by cooling the placement unit 220. Figure 6 The specific structure of the cooling unit 230 will be described.

[0066] In the present embodiment, the buffer unit 200 is divided into a plurality of areas, each of which is provided with a placement portion 220 , so that the continuously transferred objects P are independently accommodated at preset positions in the plurality of placement portions 220 .

[0067] As shown in the figure, the buffer unit 200 further includes an outer shape portion 210 constituting an outer shape, and the outer shape portion 210 is divided into a plurality of layers, and at least one placement portion 220 is disposed in each layer.

[0068] In this case, each of the placement units 220 has a virtual designated order, and the transfer objects P are placed or the placed transfer objects P are discharged from the placement units 220 according to the designated order.

[0069] In the present embodiment, the placing sections 220 are assigned virtual numbers in order from the top to the bottom, and the transfer objects P are discharged in order from the placing section 220 where the transfer object P was first placed. Furthermore, a new transfer object P is placed again in the empty placing section 220 where the transfer object P was first discharged.

[0070] By repeatedly performing such a process, the transfer object P can be discharged after being placed in the buffer unit 200 for a predetermined period of time.

[0071] As described above, in the buffer unit 200 of the present invention, the plurality of placement sections 220 may be continuously arranged in a vertical direction or a horizontal direction, so that the transfer object P may be discharged after being placed in the placement section 220 for a predetermined time.

[0072] On the other hand, the conveying unit 300 performs a function of moving the transfer object P to the buffer unit 200 or discharging the transfer unit 100 from the buffer unit 200 .

[0073] Specifically, the transport unit 300 is disposed on a transport path for transporting the object P through the transport unit 100 , and is used to transport the object P to the buffer unit 200 , and transfer the object P accommodated in the buffer unit 200 through the transport path.

[0074] The transport unit 300 is disposed on one side or the upper part of the transfer unit 100 , and at least a part thereof moves in the horizontal direction and the vertical direction, so as to clamp the transfer object P and move it.

[0075] Specifically, when placing the transfer object P on the placement section 220, the conveying unit 300 sequentially places a plurality of the transfer objects P on the placement section 220, and when discharging the transfer objects P from the placement section 220, the conveying unit 300 sequentially discharges the plurality of transfer objects P in the order of the longest placement time in the placement section 220.

[0076] That is, as described above, after virtual numbers are assigned to the plurality of placement sections 220 , the transfer objects P are discharged in order starting from the placement section 220 where the transfer object P was first placed.

[0077] In this embodiment, the transport unit 300 generally includes a fixed support portion 310, a moving portion 320 and a clamping portion 330. The fixed support portion 310 is fixed to a setting surface, at least a portion of which is bent and horizontally arranged on the upper portion of the transfer unit 100. Moreover, the moving portion 320 is arranged at the bent portion and can be moved laterally through the fixed support portion 310.

[0078] In this case, as shown in the figure, the fixing support part 310 is L-shaped, and a part thereof may be bent. However, differently from this, it may also be formed in a straight line or a curved line.

[0079] The clamping part 330 is a structure for clamping the transfer object P, and generally has a clamp shape, and can be selectively adjusted to clamp the transfer object P. The clamping part 330 is in the form of an arm, and is provided with more than one, and the teeth between the buffer unit 200 and the transfer unit 100 can be adjusted by adjusting the position of the moving part 320 along the horizontal direction and the vertical direction.

[0080] As shown in the figure, the clamping portion 330 is in the form of a clamp, and can clamp the transfer object P in the form of a substrate along a vertical direction or a horizontal direction.

[0081] The moving portion 320 is used to connect the fixed support portion 310 and the clamping portion 330 , and to move in a partial section along the length direction of the fixed support portion 310 , or to adjust the position of the clamping portion 330 by adjusting the length.

[0082] As shown in the figure, the moving part 320 is formed to extend in the vertical direction and can be retracted in the length direction, and the clamping part 330 is fixed at the lower end. Moreover, the position of the clamping part 330 in the horizontal direction is adjusted by an additional motor along the length direction of the fixed support part 310, or the position of the clamping part 330 in the vertical direction is adjusted by retracting in the vertical direction.

[0083] Therefore, the moving unit 320 may adjust the position of the clamping unit 330 so that the clamping unit 330 can clamp the transfer object P between the transfer unit 100 and the buffer unit 200 .

[0084] As described above, the transport unit includes a clamping portion 330 for clamping the transfer object P. The transfer object P is accommodated in the buffer unit 200 or the accommodated transfer object P is discharged again to the transfer unit 100 by adjusting the position of the clamping portion 330 .

[0085] As described above, the buffer device of the present invention includes the transfer unit 100, the buffer unit 200 and the handling unit 300. When the transfer object P is transferred to the second process as the next process after passing through the first process such as the cleaning process or the drying process, the transfer object P is transferred after being accommodated for a specified time by the additional buffer unit 200. Therefore, even if a problem occurs in the second process, the problem of the entire process can be prevented by adjusting the working speed and method of the first process.

[0086] Next, refer to Figure 6 , the buffer unit 200 of the present invention further includes a cooling unit 230 .

[0087] Figure 6 To show Figure 1 The structure of the cooling unit 230 in the buffer unit 200 is shown in FIG.

[0088] As shown in the figure, the cooling unit 230 of the present invention is combined with the placement unit 220 as a structure for cooling the transfer object P. At least a part of the cooling unit 230 is in contact with the placement unit 220 and is made of a heat conductive material.

[0089] Specifically, the cooling unit 230 is in direct contact with the placement unit 220 capable of conducting heat, and exchanges heat transferred from the transfer object P with the outside, and can be cooled naturally by air or quickly cooled by additional cooling water.

[0090] First, refer to Figure 6 In the portion (a), the cooling unit 230 is pin-shaped and has at least one protruding portion formed on the lower surface of the placement unit 220 to cool the heat transferred from the placement unit 220. In this case, the cooling unit 230 is composed of a plurality of pin shapes, and can discharge the heat transferred from the transfer object P by increasing the contact area with the air.

[0091] Moreover, refer to Figure 6 In the portion (b), the cooling portion 230 has a relatively small area compared to the size of the object P and is configured to be protruded, so it only contacts a partial area of ​​the object P.

[0092] As described above, when the cooling unit 230 contacts only a partial region of the object P and is supported at the bottom, in addition to the upper surface of the object P, a portion of the lower surface may be directly contacted with air and cooled.

[0093] That is, as shown in the figure, the cooling portion 230 has a relatively small area and is formed into a protruding structure, so as the area of ​​the object P directly contacting the air increases, the object P can be quickly cooled by the external inflow air.

[0094] On the other hand, refer to Figure 6 In part (c), unlike the two air-cooling types, the cooling unit 230 can also cool the transfer object P by additional cooling water. Specifically, the cooling unit 230 includes: an additional pipe connected to the placement unit 220; and a cooling fan connected to the pipe, and a structure is formed inside the pipe to circulate a heat transfer fluid that performs the cooling water function.

[0095] Also, as the heat transfer fluid circulates between the placement portion 220 and the cooling fan, heat transferred from the placement portion 220 may be discharged.

[0096] Through the above process, the transfer object P is placed on the placement portion 220 and cooled for a predetermined time in this state, thereby preventing the object P from being accidentally deformed or damaged due to high temperature during the second step.

[0097] In particular, in the case of this embodiment, the first step performs a drying process after the washing process of the transfer object P. Therefore, even if the temperature of the transfer object P rises, it can be cooled for a predetermined time by the buffer device of the present invention.

[0098] As described above, in the first process, when the transfer object P is transferred in a temperature-rising state, it can be placed in the buffer unit 200 for a specified time and cooled before being transferred to the second process. Therefore, the buffer device of the present invention can suppress the occurrence of defects and stably perform the second process.

[0099] Although the preferred embodiments of the present invention are described above, other embodiments can be used without departing from the main purpose or scope of the present invention in addition to the above embodiments. Therefore, the present embodiment is only an example and is not limited to a specific embodiment. Moreover, the present invention is not limited to the above description and can be changed within the scope of the invention and its equivalent scope.

Claims

1. A buffer device, characterized in that: include: A transfer unit is used to transfer the object to be transferred in order to proceed to the next process after a preset operation step; a buffer unit for lowering the temperature of the transfer object discharged from the transfer unit by leaving it for a predetermined time; as well as a transport unit, arranged on a transport path for transporting the transport object through the transport unit, for transporting the transport object to the buffer unit, and for transferring the transport object received by the buffer unit through the transport path; After the transfer object is placed in the buffer unit for a preset time, the transfer unit again transfers the transfer object and discharges it to the transfer path.

2. The buffer device according to claim 1, characterized in that: The buffer unit is divided into a plurality of areas and each area is provided with a placement portion, so that the continuously transferred transfer objects are independently accommodated in preset positions in the plurality of placement portions.

3. The buffer device according to claim 2, characterized in that: When placing the transfer object on the placement portion, the transport unit sequentially places a plurality of the transfer objects on the placement portion. When the transfer objects are discharged from the placement section, the conveying unit discharges the plurality of transfer objects in order of the longest time the objects have been placed on the placement section.

4. The buffer device according to claim 2, characterized in that: The buffer unit has a multi-layer structure, and at least one placement portion is provided in each layer.

5. The buffer device according to claim 1, characterized in that: The placement portion is a plate made of a heat-conducting metal material, and the object to be transferred is placed on the upper surface thereof and cooled.

6. The buffer device according to claim 5, characterized in that: The buffer unit further includes a cooling portion, which is in contact with at least a portion of the placement portion and is used to cool the transfer object.

7. The buffer device according to claim 6, characterized in that: The cooling portion is pin-shaped and is protrudingly formed at least one on the lower surface of the placement portion to cool heat transferred from the placement portion.

8. The buffer device according to claim 6, characterized in that: The cooling part receives additional cooling water from the outside to cool the placement part in a contact manner.

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