Vacuum coating protection process of immersed liquid cooling power supply and application of vacuum coating protection process

Abstract

The invention belongs to the technical field of power supplies, and discloses a vacuum coating protection process of an immersed liquid cooling power supply and application of the vacuum coating protection process. Before vacuum coating of the power supply, a shell needs to be detached for surface cleaning, solvent cleaning, dry ice cleaning and manual cleaning can be adopted as cleaning modes, and after cleaning, the power supply needs to be baked to ensure that a cleaning agent is completely volatilized; open type components comprise various connector terminals, AC sockets, golden fingers and other components with exposed PINs and capable of making contact with the outside, shielding protection needs to be conducted on the open type components before vacuum coating, a protective film layer is deposited on a power source after pretreatment is completed through the vacuum coating technology, the film layer can be made of poly-p-xylylene, silicon nitride and the like, and the vacuum coating technology is adopted for vacuum coating. Plasma chemical vapor deposition (PECVD) is adopted in the coating process, the thickness of a film layer is 5-30 microns, multiple times of deposition can be achieved, and the thickness is increased. The beneficial effects of the invention are that the insulation performance and the waterproof, oil-proof and anti-corrosion capabilities of the body are enhanced, and the reliability of the power supply in an immersed liquid cooling environment is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of power supply, and in particular to a vacuum coating protection process of an immersion liquid-cooled power supply and application thereof. Background Art

[0002] Liquid cooling technology is to directly immerse electronic equipment in coolant. The electronic components in the equipment, such as inductors, capacitors, power devices, relays, etc., will directly contact the coolant, thereby playing the role of heat dissipation, insulation, and arc extinguishing. As the power density of the power supply increases, the layout of the internal components of the power supply becomes more and more compact. The traditional liquid cooling application protection process can no longer meet the demand. At the same time, the rubber materials used in the capacitors, casings, wires, etc. used in a large number of power supplies are also incompatible with most coolants. If the protection process is not in place, compatibility problems are very likely to occur, resulting in failure of the power supply. Therefore, it is urgent to find a new process to solve this problem.

[0003] In the prior art, the layout of the internal components of the power supply is tight, and conventional protection has blind spots. In long-term immersion liquid cooling applications, insulation failure is prone to occur. In addition, the rubber and plastic materials used in large quantities inside the power supply are prone to compatibility issues with the coolant if they are not properly protected, resulting in corrosion failure of the materials and electronic components.

[0004] Therefore, it is necessary to provide a vacuum coating protection process for an immersion liquid-cooled power supply to enhance the insulation and waterproof, oil-proof and corrosion-resistant capabilities of the power supply, and improve the reliability of the power supply in an immersion liquid-cooled environment. Summary of the invention

[0005] The invention discloses a vacuum coating protection process for an immersion liquid-cooled power supply, which is used for immersion liquid-cooled electronic products and can effectively solve the technical problems involved in the background technology.

[0006] To achieve the above object, the technical solution of the present invention is:

[0007] A vacuum coating protection process for an immersion liquid-cooled power supply comprises the following steps:

[0008] S1. Clean the surface of the power supply;

[0009] S2. Shield and protect open components;

[0010] S3. Vacuum coating is performed on the power supply, and the film thickness is 5um to 30um.

[0011] The present invention proposes a new protection process, which deposits a thin film on the entire power supply by vacuum coating, wherein the thin film layer covers the body and pads of all components inside the power supply except the outer shell, and the power supply components include PCB, various surface mount components and chips, capacitors, magnetic devices, relays, etc., and the pads include the pads of surface mount components and the pads of plug-in components. Through this coating process, the reliability problem of the power supply in immersion liquid cooling can be effectively improved.

[0012] As a preferred improvement of the present invention: the thickness of the film layer is 10um to 20um.

[0013] As a preferred improvement of the present invention: in step S1, the cleaning method includes but is not limited to one or more of solvent cleaning, dry ice cleaning and manual cleaning.

[0014] As a preferred improvement of the present invention: in the step S1, a special cleaning agent or plate washing water or alcohol is used for solvent cleaning.

[0015] As a preferred improvement of the present invention: in the step S1, the surface of the power supply is cleaned and then baked, the baking temperature is 50-60° C., and the baking time is 2-4 hours.

[0016] As a preferred improvement of the present invention: in step S2, the open components include components whose PIN pins are exposed and in contact with the outside.

[0017] As a preferred improvement of the present invention: the open components include but are not limited to connector terminals, AC sockets and gold fingers.

[0018] As a preferred improvement of the present invention: in the step S2, the shielding protection is filled with one or more of hot melt adhesive, UV blue adhesive, solder resist adhesive, and silica gel, or is sealed with masking tape or high temperature adhesive.

[0019] As a preferred improvement of the present invention: in step S3, the film material includes but is not limited to polyparaxylene and / or silicon nitride.

[0020] As a preferred improvement of the present invention: in step S3, the vacuum coating is carried out by plasma enhanced chemical vapor deposition, physical vapor deposition or atomic layer deposition.

[0021] The protection process is used for processing power supplies that are immersed in a coolant for a long time, and the coolant includes one or more of fluorinated liquid, mineral oil, and synthetic oil.

[0022] The beneficial effects of the present invention are as follows:

[0023] 1. An overall protection solution for power supply products in immersion liquid cooling product applications, using polymer nanomaterials to coat the entire power supply product without dead angles, to achieve pressure-resistant, waterproof, oil-proof, and anti-corrosion coating protection, and to resist the damage of oil, water, acid, alkali, salt spray, mold and various corrosive gas parts;

[0024] 2. This protective material is coated using PECVD (plasma enhanced chemical vapor deposition), PVD (physical vapor deposition), ALD (atomic layer deposition) and other technologies according to product characteristics;

[0025] 3. This solution realizes the long-term stable operation of power supply products in an immersion liquid cooling environment, and can be operated in batches, with low protection cost and compatible with liquid cooling media such as mineral oil, synthetic oil, fluorinated liquid, etc. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work, among which:

[0027] Figure 1 A schematic diagram of a vacuum coating protection process for an immersion liquid-cooled power supply according to the present invention;

[0028] Figure 2 This is a schematic diagram of the power supply structure. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present invention will be described clearly and completely below in combination with the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0031] In addition, in the present invention, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0032] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0033] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in the field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0034] See also Figure 1 As shown, the present invention provides a vacuum coating protection process for an immersion liquid-cooled power supply, comprising the following steps:

[0035] S1. Clean the surface of the power supply;

[0036] S2. Shield and protect open components;

[0037] S3. Vacuum coating is performed on the power supply, and the film thickness is 5um to 30um.

[0038] As an embodiment, the thickness of the film layer is 10um to 20um. In the step S1, the cleaning method includes but is not limited to one or more of solvent cleaning, dry ice cleaning and manual cleaning. In the step S1, a special cleaning agent or board washing water or alcohol is used for solvent cleaning. In the step S1, the power supply is baked after surface cleaning, the baking temperature is 50 to 60°C, and the baking time is 2 to 4 hours. In the step S2, the open components include devices with exposed PIN pins and in contact with the outside. The open components include but are not limited to connector terminals, AC sockets and gold fingers. In the step S2, the shielding protection uses one or more of hot melt glue, UV blue glue, solder mask glue, and silica gel to fill the glue, or uses masking tape or high-temperature glue to seal the glue. In the step S3, the film material includes but is not limited to polyparaxylene and / or silicon nitride. In the step S3, the vacuum coating adopts plasma enhanced chemical vapor deposition or physical vapor deposition or atomic layer deposition, and the coolant includes one or more of fluorinated liquid, mineral oil, and synthetic oil.

[0039] Embodiment 1

[0040] 1. Power cleaning and baking

[0041] Before vacuum coating, the power supply needs to remove the outer shell for surface cleaning. The cleaning methods can be solvent cleaning, dry ice cleaning, or manual cleaning. Solvent cleaning can use special cleaning agents, board cleaning water, or alcohol.

[0042] After cleaning, the power supply needs to be baked to ensure that the cleaning agent is completely volatilized. The baking temperature is 50-60°C and the baking time is 2-4 hours.

[0043] 2. Shielding protection of open components

[0044] Open components include various connector terminals, AC sockets, gold fingers and other devices with exposed PIN pins and that will come into contact with the outside. Shielding materials can be filled with hot melt adhesive, UV blue adhesive, solder mask adhesive, silicone and other adhesives, or they can be sealed with adhesive tape, including masking tape, high-temperature tape, etc., and can be removed after vacuum coating.

[0045] 3. Vacuum coating

[0046] After the pre-treatment, the power supply adopts vacuum coating process to deposit protective film layer. The film material can be polyparaxylene, silicon nitride, etc. The coating process adopts plasma chemical vapor deposition (PECVD). The film thickness is 5um to 30um and can be deposited multiple times to increase the thickness.

[0047] The principle of CVD technology (chemical vapor deposition technology) is mainly to use gaseous raw materials to form a solid film on the surface of the substrate through chemical reactions. This process involves introducing gaseous raw materials into the reaction chamber. Under specific conditions, these gaseous raw materials undergo chemical reactions to generate solid substances and deposit on the surface of the substrate. The reason why the CVD method is widely used is that the prepared film can be tightly attached to the substrate and has almost no dependence on the geometric shape of the substrate. By changing the gas composition or deposition conditions (such as temperature, air pressure, etc.), the chemical or physical properties of the film can be changed, and the thickness is also easy to control. CVD technology includes a variety of specific methods, such as: MOCVD (metal organic chemical vapor deposition) technology, which uses metal organic compounds as reaction precursors to form a thin film on the substrate through thermal decomposition reactions. PCVD (plasma chemical vapor deposition) uses low-temperature plasma generated by gas glow discharge to enhance the chemical activity of the reactants and promote chemical reactions between gases, thereby depositing high-quality coatings at lower temperatures. Photo-CVD (photochemical vapor deposition) introduces light energy into the chemical vapor deposition system, and forms a thin film at a relatively low temperature through gas phase photolysis of the reactant molecules, surface photolysis, photosensitization reaction, and substrate surface heating. In addition, CVD technology also includes chemical vapor doping, which is a process of doping impurity elements into the film through the gas phase while chemical vapor deposition of the film. This technology is used to appropriately dope a certain amount of impurities to achieve the purpose of modification. For example, semiconductor films can become n-type and p-type semiconductors after doping with donor elements or acceptor elements. The doping amount is usually very low, ranging from ten to the negative ninth power to ten to the negative eighth power. By controlling the reaction conditions and selecting appropriate reaction precursors and doping elements, CVD technology can prepare thin film materials with specific properties and functions on the substrate, which has a better protective effect.

[0048] The vacuum coating process provided by the present invention can cover the electronic components on the PCBA in all directions and without dead angles, providing more comprehensive protection. The whole machine protection process of the power supply under immersion liquid cooling application is simplified, and mass production can be achieved. The coating material has good environmental resistance and high reliability, and can effectively improve the service life of PCBA electronic products in harsh environments such as immersion liquid cooling. This process has little effect on the heat dissipation performance of PCBA, and will not cause overheating of electronic products due to protection.

[0049] Although the embodiments of the present invention have been disclosed as above, they are not limited to the applications listed in the specification and the embodiments. They can be fully applied to various fields suitable for the present invention. For those familiar with the art, additional modifications can be easily implemented. Therefore, without departing from the general concept defined by the claims and the scope of equivalents, the present invention is not limited to the specific details and the illustrations shown and described herein.

Claims

1. A vacuum coating protection process for an immersion liquid-cooled power supply, characterized in that: The following steps are involved: S1. Clean the surface of the power supply; S2. Shield and protect open components; S3. Vacuum coating is performed on the power supply, and the film thickness is 5um to 30um.

2. The vacuum coating protection process for an immersion liquid-cooled power supply according to claim 1, characterized in that: The film layer thickness is 10um to 20um.

3. The vacuum coating protection process for an immersion liquid-cooled power supply according to claim 1, characterized in that: In step S1, the cleaning method includes but is not limited to one or more of solvent cleaning, dry ice cleaning and manual cleaning.

4. The vacuum coating protection process for an immersion liquid-cooled power supply according to claim 3, characterized in that: In step S1, a special cleaning agent or plate-cleaning water or alcohol is used for solvent cleaning.

5. The vacuum coating protection process for an immersion liquid-cooled power supply according to claim 1, characterized in that: In the step S1, the power source is surface cleaned and then baked at a temperature of 50 to 60° C. for 2 to 4 hours.

6. The vacuum coating protection process for an immersion liquid-cooled power supply according to claim 1, characterized in that: In step S2, the open components include components with exposed PIN pins and in contact with the outside, including but not limited to connector terminals, AC sockets and gold fingers.

7. The vacuum coating protection process for an immersion liquid-cooled power supply according to claim 1, characterized in that: In the step S2, the shielding protection is filled with one or more of hot melt adhesive, UV blue adhesive, solder resist adhesive, and silica gel, or is sealed with masking tape or high temperature adhesive.

8. The vacuum coating protection process for an immersion liquid-cooled power supply according to claim 1, characterized in that: In step S3, the film material includes but is not limited to polyparaxylene and / or silicon nitride.

9. The vacuum coating protection process for an immersion liquid-cooled power supply according to claim 1, characterized in that: In step S3, the vacuum coating is performed by plasma enhanced chemical vapor deposition, physical vapor deposition or atomic layer deposition.

10. The application of the vacuum coating protection process of an immersion liquid-cooled power supply according to claim 1, characterized in that: The protection process is used for processing power supplies that are immersed in a coolant for a long time, and the coolant includes one or more of fluorinated liquid, mineral oil, and synthetic oil.

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