Direct heating type throttle valve device for flange and baffle
By installing heating components on the baffle and flange and using temperature sensors and heating control components, local temperature differences are solved, uniform heating of the baffle and flange is achieved, particle accumulation is reduced, and the throttle valve device is ensured. Working normally.
Patent Information
- Application Number
- CN202411437540.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-01-08
- Filing Date
- 2024-10-15
- Publication Date
- 2024-12-10
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The prior art has local temperature differences when heating the baffle and flange, resulting in uneven thermal expansion and particle accumulation, affecting the function of the throttle valve device.
The heating parts are installed on the baffle and the flange respectively, and the heating range of the heating parts is adjusted according to the temperature state through the temperature sensor and the heating control parts to ensure uniform heating of the baffle and the flange.
The temperature difference between the heating area and the non-heating area is improved, the uniform heating state of the baffle and flange is achieved, the particle accumulation is reduced, and the normal function of the throttle valve device is ensured.
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Figure CN119103365A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a technology capable of directly and uniformly heating a baffle plate and a flange in a throttle valve device.
[0002] More specifically, the present invention relates to a technology of installing a heating component corresponding to the cross-sectional shape of the baffle on the surface of the baffle, and installing a heating component corresponding to the cross-sectional shape of the flange on the surface of the flange, and then adjusting the temperatures of the respective heating components accordingly based on the temperature states of the baffle and the flange, thereby uniformly controlling the temperatures of the baffle and the flange as a whole.
[0003] In particular, even for a baffle that performs an in-situ rotation operation, after an additional heating component is installed on the baffle, the temperature of the baffle can be uniformly controlled according to the current temperature of the baffle. Background Art
[0004] Usually, the semiconductor process chamber will discharge the remaining waste gas through an external exhaust port after the process is completed. At this time, the exhaust pipe connecting the semiconductor process chamber and the exhaust port is subjected to fluid pressure due to the flow of the waste gas.
[0005] At this time, in order to enable the semiconductor process chamber to operate smoothly, it is necessary to adjust the pressure in the exhaust pipe, and one method can be achieved by adjusting the exhaust gas discharge pressure of the exhaust pipe.
[0006] For this purpose, a disc-shaped rotating plate, namely a baffle, is usually provided at a predetermined position of the exhaust duct. The baffle is rotated in place to change the channel diameter of the exhaust duct, thereby adjusting the fluid pressure in the exhaust duct.
[0007] However, the waste gas remaining after the process in the semiconductor process chamber is completed contains a large amount of particles. In a high temperature environment, these particles can flow smoothly to the exhaust end with the movement of the waste gas, but in a low temperature environment, they are easy to adhere to the inner wall of the exhaust pipe or the edge of the baffle arranged near the inner wall.
[0008] In order to solve this problem, a heating jacket is usually provided on the outer surface of the exhaust duct to keep the exhaust duct at a high temperature, thereby preventing particles from adhering to the inner wall of the exhaust duct and the edge of the baffle.
[0009] However, as time goes by, the problem of particulate accumulation on the baffle and the exhaust duct around it continues to occur, so a flange heating technology for preventing particulate accumulation on the baffle and the flange surrounding the baffle is also disclosed.
[0010] However, uniformly heating the baffle and flange is not a simple technology in itself. Even if the flange is heated, there will be local differentiation between the area heated directly and the area heated based on conduction, and serious local temperature deviation will occur. Based on this, thermal expansion will also be uneven, resulting in the problem of not being able to correctly realize the function of the throttle valve device.
[0011] In particular, when the baffle cannot be directly heated, particulates continue to accumulate in a portion near the edge of the baffle, which becomes a problem that needs to be urgently solved in the field of throttle valve devices. Summary of the invention
[0012]
Technical issues
[0013] The present invention is proposed in view of the above-mentioned problems. The purpose of the present invention is to provide a direct heating type throttle valve device for a flange and a baffle, by respectively arranging heating components on the baffle and the flange, thereby improving the deformation of the device caused by the temperature difference between the heating area and the non-heating area.
[0014] In addition, an object of the present invention is to provide a direct heating type throttle valve device for a flange and a baffle, which can independently control the temperatures of a heating member provided on the baffle and a heating member provided on the flange.
[0015] In addition, the present invention aims to provide a direct heating type throttle valve device for a flange and a baffle, which can uniformly maintain the temperatures of the baffle and the flange respectively by a heating component provided on the baffle and a heating component provided on the flange.
[0016]
Technical solution
[0017] In order to achieve the above-mentioned purpose, the direct heating type throttle valve device for flanges and baffles provided by the present invention may include: a flange component 110, which is a hollow ring, and is used to be connected to the exhaust duct of the semiconductor process chamber; a baffle component 120, which is inserted into the inner side of the flange component with its own outer contour edge close to the inner wall of the flange component, and changes the distance between its own outer contour edge and the inner wall of the flange component by rotating in situ, so as to adjust the space of the exhaust gas movement path in the exhaust duct; a flange heating component 130, which forms a thin laminate on the outer surface of the flange component corresponding to the cross-sectional shape of the flange component to achieve uniform heating of the flange component body; a baffle heating component 130, which is used to heat the flange component body in a uniform manner ... Component 140, which forms a thin stack on the baffle component corresponding to the cross-sectional shape of the baffle component to achieve uniform heating of the baffle component body; a flange temperature sensor component 150, which is arranged close to the flange heating component and is used to sense the temperature of the flange component; a baffle temperature sensor component 160, which is arranged close to the baffle heating component and is used to sense the temperature of the baffle component; and a heating control component 170, which is connected to the flange heating component and the baffle heating component via a cable, and adjusts the heating range of the flange heating component and the baffle heating component based on the temperature data provided by the flange temperature sensor component and the baffle temperature sensor component.
[0018] In addition, the baffle component 120 includes: a baffle body component 121, which is disc-shaped and supports the baffle heating component in a state where the baffle heating component is installed on one side of its body; a rotating shaft component 122, which passes through the outside of the flange component to the inside of the flange component and is connected to the baffle body component, and drives the baffle body component to rotate together by rotating in situ; and a baffle cover component 123, which is used to cover one side of the baffle body component on which the baffle heating component is installed.
[0019] In addition, the flange heating component 130 may include: a first flange heating component 131 disposed on one side of the flange component; and a second flange heating component 132 disposed on the other side of the flange component.
[0020] At this time, the flange component 110 may include: a flange body component 111, which is a hollow ring and respectively supports a first flange heating component arranged on one side of its own body and a second flange heating component arranged on the other side of its own body; a first flange cover component 112, which is used to cover one side of the flange body component on which the first flange heating component is arranged; and a second flange cover component 113, which is used to cover the other side of the flange body component on which the second flange heating component is arranged.
[0021] In addition, the thickness of the baffle heating member 140 may be formed within a range of 0.1 to 0.3 mm.
[0022] In addition, the thicknesses of the first flange heating part 131 and the second flange heating part 132 may be formed in the range of 0.1 to 0.3 mm, respectively.
[0023] In addition, the baffle temperature sensor member 160 may be disposed on the outer surface of the baffle cover member.
[0024] At this time, the baffle member 120 may further include: a sensor fixing block 124 fixed on the baffle cover member in the form of covering the baffle temperature sensor member arranged on the outer surface of the baffle cover member, thereby fixing the baffle temperature sensor member on the baffle cover member.
[0025]
Beneficial Effects
[0026] The present invention is equipped with a flange heating component, a baffle heating component, a flange temperature sensor component, a baffle temperature sensor component, and a heating control component, which can not only improve the deformation of the device caused by the temperature difference between the heating area and the non-heating area, but also can uniformly control the temperature of the entire area by sensing the temperature of each part.
[0027] Furthermore, the present invention forms the flange heating member in accordance with the cross-sectional shape of the flange member and forms the baffle heating member in accordance with the cross-sectional shape of the baffle member, thereby making it possible to keep the entire area of the device in a uniformly heated state.
[0028] In addition, the present invention can minimize the influence on the in-situ rotation movement of the baffle member by controlling the thickness of the baffle heating member to be in the range of 0.1 to 0.3 mm. BRIEF DESCRIPTION OF THE DRAWINGS
[0029] Figure 1 It is an overall structural diagram of a direct heating type throttle valve device for flanges and baffles provided by the present invention.
[0030] Figure 2 yes Figure 1 An exploded view of part of the structure without the control box components.
[0031] Figure 3 yes Figure 1 A cross-sectional view of the drive box component and the flange component without the control box component.
[0032] Figure 4 yes Figure 1 A cutaway view of the middle flange component and a top view of the cutaway view omitting the second flange cover component.
[0033] Figure 5 is from Figure 2 An enlarged view of the flange component after cutting out.
[0034] Figure 6 yes Figure 1 A cutaway view of the middle baffle component and a view of the state after the baffle cover component and the sensor fixing block are omitted from the cutaway view.
[0035] Figure 7 is from Figure 2 An enlarged view of a section of the baffle assembly.
[0036] [Description of Reference Numerals]
[0037] 10: Drive box components 20: Control box components
[0038] 110: Flange component 111: Flange body component
[0039] 112: First flange cover component 113: Second flange cover component
[0040] 120: Baffle component 121: Baffle body component
[0041] 122: Rotating shaft component 123: Baffle cover component
[0042] 124: Sensor fixing block 130: Flange heating component
[0043] 131: First flange heating component 131a: PI body component
[0044] 131b: Pattern part 131c: Conductor part
[0045] 132: Second flange heating component 132a: PI body component
[0046] 132b: pattern part 132c: conductor part
[0047] 140: Baffle heating component 150, 150': Flange temperature sensor component
[0048] 160: Baffle temperature sensor component 170: Heating control component DETAILED DESCRIPTION
[0049] The present invention will be described in detail below with reference to the accompanying drawings.
[0050] Figure 1 This is the overall structure diagram of the direct heating type throttle valve device for flange and baffle provided by the present invention. Figure 2 yes Figure 1 The exploded view of the structure without the control box. Figure 3 yes Figure 1 A cross-sectional view of the drive box component and the flange component without the control box component.
[0051] Reference Figures 1 to 3The direct heating type throttle valve device for flange and baffle provided by the present invention may include a flange component 110, a baffle component 120, a flange heating component 130, a baffle heating component 140, a flange temperature sensor component 150, a baffle temperature sensor component 160 and a heating control component 170.
[0052] Reference Figures 1 to 3 The flange component 110 is in a hollow ring shape to achieve connection with the exhaust pipe of the semiconductor process chamber.
[0053] The flange member 110 has a structure in which one side and the other side of the edge of the flange member 110 are joined to the cut exhaust duct when the flange member 110 is sandwiched between the cut exhaust duct, so that the passage of the exhaust duct communicates with the hollow portion of the flange member 110 .
[0054] Among them, the baffle component 120 is inserted into the inner side of the flange component 110 with its outer contour edge close to the inner wall of the flange component 110, and changes the distance between its own outer contour edge and the inner wall of the flange component 110 by rotating in situ, thereby adjusting the space of the exhaust gas movement path inside the exhaust pipe.
[0055] That is, the baffle member 120 is disposed in the hollow portion of the flange member 110 and opens or closes the passage of the exhaust duct while rotating in place, thereby adjusting the pressure in the exhaust duct.
[0056] Among them, the distance between the edge of the baffle component 120 and the inner wall of the flange component 110 is very narrow. Therefore, if impurities and foreign matter are accumulated on the outer contour edge of the baffle component 120 or if foreign matter is accumulated on the inner wall of the flange component 110, problems will occur in the baffle component 120 rotating in place inside the flange component 110.
[0057] In order to prevent the problem of foreign matter accumulation, the technology of heating the periphery of the flange component 110 becomes a very important issue. The present invention arranges independent heating components on the flange component 110 and the baffle component 120 in a unique pattern and controls them.
[0058] First, refer to Figure 2 and Figure 3 The flange heating component 130 may form a thin laminate on the outer surface of the flange component 110 corresponding to the cross-sectional shape of the flange component 110 to achieve uniform heating of the body of the flange component 110 .
[0059] Reference Figure 2 The baffle heating member 140 may be formed as a thin laminate on the baffle member 120 corresponding to the cross-sectional shape of the baffle member 120 to achieve uniform heating of the baffle member 120 body.
[0060] The flange heating component 130 and the baffle heating component 140 may be formed of polyimide (PI) film material and have electrical insulation properties. The specific description of each heating component will be repeated below.
[0061] like Figure 2 As shown, the flange temperature sensor components 150 , 150 ′ may be provided with at least one and arranged close to the flange heating component 130 for sensing the temperature of the flange component 110 .
[0062] For this purpose, refer to Figure 2 and Figure 5 , the flange temperature sensor components 150, 150' are electrically connected to the cable, such as Figure 1 As shown, the cable can be connected to the control box component 20 via the drive box component 10 .
[0063] Among them, Figure 1 As shown, the drive box component 10 and the control box component 20 can be connected by a cable in a state of being separated from each other, and can also be formed into an integrated type by a box body component (not shown).
[0064] like Figure 2 As shown, the baffle temperature sensor member 160 may be disposed close to the baffle heating member 140 to sense the temperature of the baffle member 120 .
[0065] For this purpose, refer to Figure 2 and Figure 7 The baffle temperature sensor component 160 is electrically connected to a cable, which can be connected to the control box component 20 via the drive box component 10.
[0066] The heating control component 170 is preferably mounted on Figure 1 The control box component 20 can be connected to the drive box component 10 through a cable. Figure 2 The flange heating component 130, the baffle heating component 140, the flange temperature sensor components 150, 150', and the baffle temperature sensor component 160 are connected.
[0067] As a result, the heating control unit 170 adjusts the heating ranges of the flange heating unit 130 and the baffle heating unit 140 based on the temperature data provided by the flange temperature sensor unit 150 , 150 ′ and the baffle temperature sensor unit 160 .
[0068] Figure 4 yes Figure 1 A cutaway view of the middle flange component and a top view of the cutaway view omitting the second flange cover component, Figure 5 is from Figure 2 The enlarged view of the flange part is cut out. Figure 6 yes Figure 1A cutout of the middle baffle component and a state diagram after omitting the baffle cover component and the sensor fixing block from the cutout, Figure 7 is from Figure 2 An enlarged view of the baffle component section.
[0069] In addition, in order to directly heat the baffle member 120 and achieve uniform heating, as Figure 2 and Figure 7 As shown, the baffle member 120 may include a baffle body member 121 , a rotation shaft member 122 , and a baffle cover member 123 .
[0070] like Figure 2 and Figure 7 The baffle body part 121 is disc-shaped and is arranged to support the baffle heating component 140 when the baffle heating component 140 is placed on one surface of its own body.
[0071] Reference Figure 2 and Figure 3 The rotating shaft component 122 passes through the inside of the flange component 110 from the outside of the flange component 110 and is connected to the baffle body component 121. It rotates in place based on the driving force of the driving box component 10, thereby driving the baffle body component 121 to rotate together.
[0072] like Figure 2 and Figure 7 As shown, the baffle cover member 123 may cover one side of the baffle body member 121 where the baffle heating member 140 is disposed.
[0073] In addition, if Figure 2 and Figure 5 As shown, the flange heating component 130 may be equipped with a first flange heating component 131 disposed on one surface of the flange component 110 and a second flange heating component 132 disposed on the other surface of the flange component 110 .
[0074] Reference Figure 5 The first flange heating component 131 can be equipped with a PI body component 131a, a pattern component 131b and a wire component 131c.
[0075] like Figure 5 As shown, the PI main body component 131a is a hollow disc, and the pattern component 131b can form a closed circuit to conduct current when a pattern is formed on one side of the PI main body component 131a. After the wire component 131c conducts current at both ends of the pattern component 131b of the closed circuit, it is connected to the control box component 20 via the drive box component 10 in the form of a cable.
[0076] Reference Figure 5The second flange heating component 132 may also be equipped with a PI body component 132a, a pattern component 132b, and a wire component 132c.
[0077] like Figure 4 and Figure 5 As shown, the PI main body component 132a is a hollow disc, and the pattern component 132b can form a closed circuit to conduct current in a state where a pattern is formed on one side of the PI main body component 132a. After the wire component 132c conducts current at both ends of the pattern component 132b of the closed circuit, it is connected to the control box component 20 via the drive box component 10 in the form of a cable.
[0078] At this time, in order to form the first flange heating component 131 and the second flange heating component 132 , the flange component 110 may be equipped with a flange body component 111 , a first flange cover component 112 and a second flange cover component 113 .
[0079] like Figure 2 and Figure 5 As shown, the flange body component 111 is preferably hollow and annular, and can be configured to support a first flange heating component 131 disposed on one side of the body and a second flange heating component 132 disposed on the other side of the body.
[0080] like Figure 2 and Figure 5 As shown, the first flange cover component 112 may preferably be arranged to cover one side of the flange body component 111 on which the first flange heating component 131 is disposed.
[0081] like Figure 2 and Figure 5 As shown, the second flange cover component 113 may also be preferably arranged to cover the other surface of the flange body component 111 on which the second flange heating component 132 is arranged.
[0082] In addition, refer to Figure 7 The baffle heating member 140 is preferably formed of a polyimide (PI) material with a thickness ranging from 0.1 to 0.3 mm.
[0083] As a result, when the shutter member 120 rotates in place, the preset driving force pattern is not changed by the shutter heating member 140 .
[0084] Reference Figure 5 The thickness of the first flange heating component 131 and the second flange heating component 132 are also preferably formed in the range of 0.1 to 0.3 mm.
[0085] In addition, if Figure 2 and Figure 6 As shown, the baffle temperature sensor component 160 may be disposed on an outer surface of the baffle cover component 123 .
[0086] At this time, the baffle member 120 may have a sensor fixing block 124, such as Figures 1 to 3 As shown, the sensor fixing block 124 is fixed to the baffle cover member 123 in a state of covering the baffle temperature sensor member 160 arranged on the outer surface of the baffle cover member 123 , thereby fixing the baffle temperature sensor member 160 to the baffle cover member 123 .
Claims
1. A direct heating type throttle valve device for flanges and baffles, include: A flange component (110) is a hollow ring-shaped component used for being connected to an exhaust pipe of a semiconductor process chamber; A baffle member (120) is inserted into the inner side of the flange member with its outer contour edge close to the inner wall of the flange member, and changes the spacing between its outer contour edge and the inner wall of the flange member by rotating in situ, thereby adjusting the space of the exhaust gas movement path inside the exhaust pipe; A flange heating component (130) is formed with a thin layer on the outer surface of the flange component corresponding to the cross-sectional shape of the flange component, so as to achieve uniform heating of the flange component body; a baffle heating component (140) which forms a thin laminate on the baffle component corresponding to the cross-sectional shape of the baffle component to achieve uniform heating of the baffle component body; A flange temperature sensor component (150), which is arranged close to the flange heating component and is used to sense the temperature of the flange component; a baffle temperature sensor component (160), arranged close to the baffle heating component, for sensing the temperature of the baffle component; as well as a heating control component (170), which is connected to the flange heating component and the baffle heating component via a cable, and adjusts the heating range of the flange heating component and the baffle heating component based on the temperature data provided by the flange temperature sensor component and the baffle temperature sensor component, The flange heating component (130) comprises: A first flange heating component (131) disposed on one side of the flange component; and a second flange heating component (132) disposed on the other side of the flange component, The flange component (110) comprises: A flange body component (111) which is in a hollow ring shape and respectively supports the first flange heating component arranged on one side of the body and the second flange heating component arranged on the other side of the body; a first flange cover component (112), which is used to cover one side of the flange body component on which the first flange heating component is arranged; and The second flange cover component (113) is used to cover the other side of the flange body component on which the second flange heating component is arranged.
2. The direct heating type throttle valve device for flange and baffle as claimed in claim 1, It is characterized in that The baffle component (120) comprises: A baffle body component (121) is in the shape of a disc and supports the baffle heating component in a state where the baffle heating component is arranged on one surface of the baffle body; a rotating shaft component (122), which passes through the flange component from the outside to the inside and is connected to the baffle body component, and drives the baffle body component to rotate together by rotating in situ; and The baffle cover component (123) is used to cover one side of the baffle body component on which the baffle heating component is arranged.
3. The direct heating type throttle valve device for flange and baffle as claimed in claim 2, Features: The baffle heating member (140) is formed to have a thickness in the range of 0.1 to 0.3 mm.
4. The direct heating type throttle valve device for flange and baffle as claimed in claim 3, Features: The thickness of the first flange heating component (131) and the second flange heating component (132) are respectively formed in the range of 0.1 to 0.3 mm.
5. The direct heating type throttle valve device for flange and baffle as claimed in claim 4, Features: The baffle temperature sensor component (160) is arranged on the outer surface of the baffle cover component. The baffle component (120) further comprises: A sensor fixing block (124) is fixed on the baffle cover component in a form of covering the baffle temperature sensor component arranged on the outer surface of the baffle cover component, thereby fixing the baffle temperature sensor component on the baffle cover component.
Citation Information
Patent Citations
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