Wire-free and adapter-board-free 2U server

Abstract

The embodiment of the invention discloses a wire-free and adapter-board-free 2U server, which comprises a case, at least one node and a hard disk module, the node and the hard disk module are arranged in the case, the node comprises a mainboard, the mainboard is provided with a connector, the hard disk module comprises a hard disk backboard, the hard disk backboard is provided with a plug, and the plug is connected with the hard disk backboard. The connector is connected with the plug in an inserted mode so that the mainboard can be in communication connection with the hard disk module. Compared with the prior art, the nodes and the hard disk backboard are in direct butt joint, an adapter plate and a cable are not needed, and the manufacturing cost is greatly saved.

Description

Technical Field

[0001] The present invention relates to the technical field of servers, and in particular to a 2U server without wires or adapter boards. Background Art

[0002] The mainboard on the rear node of the current 2U server with 2 nodes on the market cannot be directly connected to the hard disk backplane. It is necessary to connect the adapter board first, and then connect the adapter board and the hard disk backplane through cables. This method not only requires an intermediate adapter board and adapter board fixings, but also requires additional cables, which greatly increases the manufacturing cost. Summary of the invention

[0003] The purpose of the present invention is to provide a 2U server without wires or adapter boards, aiming to solve the problem of high manufacturing cost of the existing rear-mounted 2-node 2U server.

[0004] In order to solve the above technical problems, the purpose of the present invention is achieved through the following technical solutions:

[0005] The present invention provides a 2U server without wires or adapter boards, comprising a chassis, at least one node and a hard disk module, wherein the node and the hard disk module are arranged in the chassis, the node comprises a mainboard, the mainboard is provided with a connector, the hard disk module comprises a hard disk backplane, the hard disk backplane is provided with a plug, the connector is plug-connected with the plug, so that the mainboard and the hard disk module are connected in communication.

[0006] Preferably, the hard disk backplane is provided with guide pins, and the guide pins are at the same height as the connector.

[0007] Preferably, the hard disk backplane is vertically arranged with respect to the mainboard, and after the connector is plugged and connected with the plug, the hard disk backplane abuts against the mainboard.

[0008] Preferably, the node is slidably arranged on the chassis, the node is placed in the chassis, and after the connector is connected to the plug, the node is fixed to the chassis.

[0009] Preferably, the hard disk module also includes a hard disk frame and a hard disk. The hard disk backplane is provided with a plurality of hard disk slots on the side facing the hard disk frame. The hard disk backplane is also provided with fixing screws. After the hard disk is plugged into the hard disk slot, the fixing screws are fixedly connected to the hard disk frame to ensure that the hard disk backplane is firmly connected to the hard disk frame.

[0010] Preferably, the node further comprises a CPU, a DIMM memory component and a liquid cooling component, wherein the DIMM memory component is arranged on both sides of the CPU, and the liquid cooling component is a plurality of liquid cooling tubes, and the liquid cooling tubes are arranged between the CPU and the DIMM memory component.

[0011] Preferably, the number of the nodes is two, and the nodes are divided into an upper node and a lower node. Both the upper node and the lower node are provided with a fan assembly, and the fan assembly is located between the hard disk backplane and the CPU.

[0012] Preferably, the chassis height is 2U, the upper node and the lower node are respectively arranged at the 1U height position and the 2U height position of the chassis, and the heights of the fan assemblies in the upper node and the lower node are both 40 mm.

[0013] Preferably, a detachable dust cover is provided on the side wall or the top of the chassis, and the dust cover is used to prevent dust and debris from entering the interior of the chassis to keep the internal environment of the chassis clean.

[0014] Preferably, the chassis is also provided with an intelligent management module, which monitors the environmental parameters inside the chassis in real time through built-in sensors, the environmental parameters including but not limited to temperature, humidity and voltage, and automatically adjusts the working state of the server according to preset thresholds, and triggers alarms or takes protective measures under abnormal circumstances.

[0015] The beneficial effects of the present invention compared with the prior art are:

[0016] (1) The present invention provides a connector on the mainboard and a plug on the hard disk backplane, and connects the connector and the plug to directly connect the mainboard to the hard disk backplane, thereby eliminating the need for traditional wires and adapter plates. Compared with the prior art, the present invention greatly saves manufacturing costs by directly connecting the node to the hard disk backplane without the need for adapter plates and cables.

[0017] (2) The present invention uses a 40mm high fan assembly placed inside the node. When a single node is used, the fan inside the node only dissipates heat for the node. Compared with the prior art that uses 80mm & 60mm high fans to dissipate heat for both upper and lower nodes, this solution places the fan inside the node, and the fan only dissipates heat for the node, which can reduce product energy consumption. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.

[0019] Figure 1 A schematic structural diagram of a 2U server without wires or adapter plates provided in an embodiment of the present invention without a dust cover;

[0020] Figure 2 A structural schematic diagram of a hard disk module perspective of a 2U server without wires or adapter boards provided in an embodiment of the present invention;

[0021] Figure 3 A schematic diagram of the structure of a 2U server without wires or adapter boards provided in an embodiment of the present invention, with the upper node mainboard removed;

[0022] Figure 4 A schematic diagram of the overall structure of a 2U server without wires or adapter boards provided in an embodiment of the present invention;

[0023] Figure 5 A schematic structural diagram of a 2U server without wires or adapter boards provided in an embodiment of the present invention, without a hard disk module.

[0024] Reference numerals:

[0025] 1. Chassis; 11. Hard disk module; 111. Hard disk frame; 112. Hard disk slot; 113. Hard disk backplane; 1131. Plug; 1132. Guide pin; 1133. Fixing screw; 2. Upper node; 21. Motherboard; 211. Connector; 22. CPU; 23. DIMM memory assembly; 24. Fan assembly; 25. Liquid cooling assembly; 251. Liquid cooling pipe; 26. BBU module; 27. Expansion card module; 28. Power supply module; 3. Lower node; 4. Dust cover. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] It should be understood that when used in this specification and the appended claims, the terms "include" and "comprises" indicate the presence of described features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.

[0028] It should also be understood that the terms used in this specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. As used in the specification of the present invention and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.

[0029] It should be further understood that the term "and / or" used in the present description and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0030] See also Figures 1 to 5 A specific embodiment of the present invention discloses a 2U server without wires or adapter boards, including a chassis 1, at least one node and a hard disk module 11. The node and the hard disk module 11 are arranged in the chassis 1. The node includes a mainboard 21. The mainboard 21 is provided with a connector 211. The hard disk module 11 includes a hard disk backplane 113. The hard disk backplane 113 is provided with a plug 1131. The connector 211 is plugged and connected with the plug 1131 to enable the mainboard 21 to communicate with the hard disk module 11.

[0031] Specifically, the motherboard 21 is directly connected to the hard disk backplane 113 by using the connector 211, eliminating the traditional wires and adapter plates. This design can not only simplify the internal structure and wiring complexity of the server and reduce manufacturing costs, but also improve the heat dissipation efficiency of the fan in the chassis 1, improve assembly convenience, and increase aesthetics.

[0032] In this embodiment, the node is composed of various functional modules in the server and the mainboard 21. The modular design of the node allows users to easily upgrade and expand the server. For example, when it is necessary to increase computing resources or storage capacity, it is possible to simply add new nodes or replace nodes with higher performance without large-scale transformation of the entire server.

[0033] like Figure 3 As shown, a plurality of guide pins 1132 are disposed on the hard disk backplane 113 , and the guide pins 1132 are at the same height as the connector 211 .

[0034] Specifically, in this embodiment, a plurality of guide pin 1132 holes are pre-processed on the hard disk backplane 113, and the guide pins 1132 cooperate with the guide pin 1132 holes. The positions and number of the guide pin 1132 holes are determined according to the layout and fixing requirements of the hard disk module 11, and the guide pins 1132 are made of high-strength, corrosion-resistant materials, such as stainless steel or aluminum alloy, to ensure their stability and durability. During the installation of the node, the guide pins 1132 not only play a positioning role, but also set the height of the guide pins 1132 to be consistent with the height of the connector 211, so that after the node is installed, due to the limiting effect of the guide pins 1132, the connection between the connector 211 and the plug 1131 is stable and not easy to loosen, thereby reducing the risk of damage to the connector 211 or the plug 1131.

[0035] like Figure 1As shown, the hard disk backplane 113 is vertically arranged with respect to the main board 21 , and after the connector 211 and the plug 1131 are plugged and connected, the hard disk backplane 113 abuts against the main board 21 .

[0036] Specifically, the vertical arrangement of the hard disk backplane 113 and the mainboard 21 maximizes the space utilization inside the server, which helps to reduce the overall size or increase the accommodation space for other components.

[0037] like Figure 1 As shown, the node is slidably arranged in the chassis 1 , the node is placed in the chassis 1 , and after the connector 211 is connected to the plug 1131 , the node is fixed to the chassis 1 .

[0038] Specifically, in this embodiment, slide rails are provided on both sides of the chassis 1. During the server assembly process, after the functional modules on the node are installed, the node is inserted into the chassis 1 along the slide rails from the rear end of the chassis 1. When the node slides to a predetermined position, the connector 211 and the plug 1131 on the hard disk backplane 113 are automatically or semi-automatically aligned and attempt to dock. During the docking process, the guide pins 1132 on the hard disk backplane 113 can also assist the connector 211 to accurately insert the plug 1131. In this way, not only can the installation process be simplified, but also the accuracy of the installation is improved, and the risk of mis-insertion is reduced.

[0039] like Figure 2 and Figure 3 As shown, the hard disk module 11 also includes a hard disk frame 111 and a hard disk (not shown in the figure), and a hard disk backplane 113 is provided with a plurality of hard disk slots 112 on the side facing the hard disk frame 111. The hard disk backplane 113 is also provided with fixing screws 1133. After the hard disk is plugged into the hard disk slot 112, the fixing screws 1133 are fixedly connected to the hard disk frame 111, so that the hard disk backplane 113 is firmly connected to the hard disk module 11.

[0040] Specifically, the hard disk module 11 is plugged into the hard disk backplane 113 through the hard disk slot 112, and is fastened to the hard disk backplane 113 through the fixing screws 1133. This design not only simplifies the installation process of the hard disk, but also improves the connection strength and stability between the hard disk module 11 and the hard disk backplane 113, thereby ensuring the overall performance and reliability of the server.

[0041] like Figure 1 and Figure 5 As shown, the node also includes a CPU 22 and a DIMM memory component 23 . The DIMM memory component 23 is arranged on both sides of the CPU 22 . The liquid cooling component 25 is a plurality of liquid cooling tubes 251 . The liquid cooling tubes 251 are arranged between the CPU 22 and the DIMM memory component 23 .

[0042] Specifically, the CPU 22 and the DIMM memory assembly 23 adopt liquid cooling, which can improve the heat dissipation efficiency of the CPU 22 & DIMM, and improve the computing power and performance of the product.

[0043] like Figure 1 and Figure 4 As shown, there are two nodes, and the nodes are divided into an upper node 2 and a lower node 3 . Both the upper node 2 and the lower node 3 are provided with a fan assembly 24 , and the fan assembly 24 is located between the hard disk backplane 113 and the CPU 22 .

[0044] Specifically, the node is an independent module, and its internal heat dissipation design is also modular. This design allows users to upgrade and expand the server more easily. When more hard disks need to be added or the heat dissipation performance needs to be improved, this can be achieved by replacing the fan assembly 24 with a stronger heat dissipation capability or adjusting the air duct design; the fan assembly 24 is located between the hard disk backplane 113 and the CPU 22, and can effectively provide cooling for these two components with higher heat generation, thereby improving the heat dissipation performance.

[0045] like Figure 1 As shown, the height of the chassis 1 is 2U, the upper node 2 and the lower node 3 are arranged at the 1U height position and the 2U height position of the chassis 1 respectively, and the height of the fan assembly 24 in the upper node 2 and the lower node 3 is 40 mm.

[0046] Specifically, in the server field, U (Unit) is a commonly used unit of measure used to indicate the height of a server chassis 1. A 1U server refers to a server with a height of 1 U (i.e., 1.75 inches or 4.445 centimeters). Usually in a 2U server, 80mm&60mm height fans are generally used to dissipate heat for both upper and lower nodes. If only one node is actually used, the heat dissipation of the fan is a waste, thereby increasing energy consumption. The two fan assemblies 24 in the upper and lower nodes 3 are both set to 40mm in height, that is, they are placed within the 1U height range. When a single node is used, the fan in the node only dissipates heat for the node. This method can not only reduce fan energy consumption, but also reduce noise.

[0047] like Figure 1 and Figure 5 As shown, the node also includes a BBU module 26, an expansion card module 27 and a power module 28. The expansion card module 27 is located on one side of the CPU 22 and the DIMM memory component 23, and the BBU module 26 and the power module 28 are located on both sides of the expansion card module 27 respectively.

[0048] like Figure 4 As shown, a detachable dust cover 4 is provided on the side wall or the top of the chassis 1 , and the dust cover 4 is used to prevent dust and debris from entering the interior of the chassis 1 to keep the interior environment of the chassis 1 clean.

[0049] Specifically, in this embodiment, the dust cover 4 is made of fine and breathable materials, such as metal mesh, nylon mesh or polyester fiber mesh, etc. These materials can effectively prevent dust and small debris from entering the interior of the chassis 1, and can also ensure good air circulation. At the edge of the opening on the side wall or top of the chassis 1, a mounting structure for fixing the dust cover 4 is designed. The mounting structure can be a card slot, a screw hole or a magnetic fixing device. When installing the dust cover 4, align the dust cover 4 with the opening on the side wall or top of the chassis 1, and fix the dust cover 4 on the chassis 1 according to the requirements of the mounting structure; when the dust cover 4 needs to be cleaned or replaced, it is disassembled according to the reverse steps. For the card slot type and screw hole type mounting structure, it is necessary to gently remove the dust cover 4 from the card slot or unscrew the screws; for the magnetic fixing device, the dust cover 4 can be directly removed from the chassis 1.

[0050] In a usable embodiment, the chassis 1 is also provided with an intelligent management module, which monitors the environmental parameters inside the chassis 1 in real time through built-in sensors. The environmental parameters include but are not limited to temperature, humidity and voltage, and automatically adjusts the working status of the server according to preset thresholds, and triggers alarms or takes protective measures under abnormal circumstances.

[0051] Specifically, the intelligent management module in the chassis 1 can realize real-time monitoring and intelligent management of the internal environmental parameters of the chassis 1, effectively improving the stability and safety of the equipment inside the chassis 1. At the same time, the module also has an abnormal alarm and protection mechanism, which can respond and take measures in an emergency in a timely manner to ensure the safe operation of the equipment.

[0052] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A 2U server without wires or adapter boards, characterized in that: It includes a chassis, at least one node and a hard disk module, wherein the node and the hard disk module are arranged in the chassis, the node includes a mainboard, the mainboard is provided with a connector, the hard disk module includes a hard disk backplane, the hard disk backplane is provided with a plug, and the connector is plug-connected with the plug to enable the mainboard and the hard disk module to communicate with each other.

2. A 2U server without wires or adapter boards according to claim 1, characterized in that: The hard disk backplane is provided with guide pins, and the guide pins are at the same height as the connector.

3. A 2U server without wires or adapter boards according to claim 1, characterized in that: The hard disk backplane is vertically arranged with respect to the mainboard. After the connector is plugged and connected with the plug, the hard disk backplane abuts against the mainboard.

4. A 2U server without wires or adapter boards according to claim 1, characterized in that: The node is slidably arranged on the chassis, the node is placed in the chassis, and after the connector is connected to the plug, the node is fixed to the chassis.

5. The 2U server without wires or adapter boards according to claim 1, characterized in that: The hard disk module also includes a hard disk frame and a hard disk. The hard disk backplane is provided with a plurality of hard disk slots on the side facing the hard disk frame. The hard disk backplane is also provided with fixing screws. After the hard disk is plugged into the hard disk slot, the fixing screws are fixedly connected to the hard disk frame to ensure that the hard disk backplane is firmly connected to the hard disk frame.

6. The 2U server without wires or adapter boards according to claim 1, characterized in that: The node further comprises a CPU, a DIMM memory component and a liquid cooling component. The DIMM memory component is arranged on both sides of the CPU. The liquid cooling component is a plurality of liquid cooling pipes, and the liquid cooling pipes are arranged between the CPU and the DIMM memory component.

7. A 2U server without wires or adapter boards according to claim 6, characterized in that: The number of the nodes is two, and the nodes are divided into an upper node and a lower node. The upper node and the lower node are both provided with a fan assembly, and the fan assembly is located between the hard disk backplane and the CPU.

8. The 2U server without wires or adapter boards according to claim 7, characterized in that: The height of the chassis is 2U, the upper node and the lower node are arranged at the 1U height position and the 2U height position of the chassis respectively, and the heights of the fan assemblies in the upper node and the lower node are both 40 mm.

9. The 2U server without wires or adapter boards according to claim 1, characterized in that: A detachable dust cover is provided on the side wall or the top of the chassis, and the dust cover is used to prevent dust and debris from entering the interior of the chassis to keep the interior environment of the chassis clean.

10. The 2U server without wires or adapter boards according to claim 1, characterized in that: The chassis is also provided with an intelligent management module, which monitors the environmental parameters inside the chassis in real time through built-in sensors, the environmental parameters including but not limited to temperature, humidity and voltage, and automatically adjusts the working state of the server according to preset thresholds, and triggers alarms or takes protective measures under abnormal circumstances.

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