Inductor, circuit board integrated inductor, charging equipment and electronic equipment

Abstract

The invention provides an inductor, a circuit board integrated inductor, charging equipment and electronic equipment. The inductor comprises a magnetic core, the magnetic core is provided with a plurality of first through holes and a plurality of second through holes, the first through holes are sequentially arranged at intervals in the first direction, the second through holes are sequentially arranged at intervals in the first direction, and the first through holes and the second through holes are arranged at intervals in the second direction; when the thickness of the magnetic core is 0.3 mm to 0.5 mm, the range of collapse pressure F is larger than or equal to 200 N, and the first direction intersects with the second direction; the coil sequentially and alternately penetrates through the first through hole and the second through hole and is wound on the magnetic core, and the coil and the magnetic core are arranged in an insulated mode. According to the inductor provided by the embodiment of the invention, under the condition of a certain size, the proportion of the magnetic core can be increased, so that the inductor has relatively high inductance value and relatively high collapse pressure.

Description

Technical Field

[0001] The present application relates to the field of electronics, and in particular to an inductor, a circuit board integrated inductor, a charging device and an electronic device. Background Art

[0002] An inductor is composed of a coil and a magnetic part. When an alternating current passes through the coil, an alternating magnetic flux is generated inside and around the coil, which has the function of storing and releasing energy. In electronic circuits, inductance has a limited effect on alternating current. It can form a high-pass filter or a low-pass filter, a phase shift circuit, and a resonant circuit with a resistor or a capacitor, so it is widely used in various instruments and equipment. However, the proportion of magnetic materials in existing inductors is relatively small, which limits the increase in the inductance of the inductor. Summary of the invention

[0003] In view of the above problems, an embodiment of the present application provides an inductor which can increase the proportion of the magnetic core under a certain size, thereby having a higher inductance and a higher breakdown pressure.

[0004] In a first aspect, an embodiment of the present application provides an inductor, comprising:

[0005] A magnetic core, the magnetic core having a plurality of first through holes and a plurality of second through holes, the plurality of first through holes being arranged in sequence and spaced apart along a first direction, the plurality of second through holes being arranged in sequence and spaced apart along the first direction, the first through holes and the second through holes being arranged in sequence and spaced apart along the second direction, the range of collapse pressure F of the magnetic core when the thickness is 0.3 mm to 0.5 mm is F ≥ 200 N, wherein the first direction intersects with the second direction; and

[0006] The coil is alternately inserted into the first through hole and the second through hole in sequence and wound around the magnetic core. The coil is insulated from the magnetic core.

[0007] In a second aspect, an embodiment of the present application provides a circuit board integrated inductor, which includes:

[0008] Circuit boards; and

[0009] The inductor described in the first aspect of the present application is carried on the circuit board.

[0010] In a third aspect, an embodiment of the present application provides a charging device, comprising:

[0011] The inductor according to the first aspect or the circuit board integrated inductor according to the second aspect; and

[0012] A first processor is electrically connected to the circuit board integrated inductor or the coil in the inductor, and is used to control the magnitude and direction of the current flowing through the coil.

[0013] In a fourth aspect, an embodiment of the present application provides an electronic device, comprising:

[0014] Display screen;

[0015] The inductor according to the first aspect or the circuit board integrated inductor according to the second aspect; and

[0016] The second processor is electrically connected to the circuit board integrated inductor or the coil in the inductor, and the second processor is used to control the magnitude and direction of the current flowing through the coil. The second processor is also electrically connected to the display screen to control the display screen to display.

[0017] The inductor of the embodiment of the present application includes a magnetic core and a coil, and the magnetic core has a plurality of first through holes and a plurality of second through holes; the coil is alternately inserted into the first through hole and the second through hole in sequence, and is wound around the magnetic core, and the coil is insulated from the magnetic core. In this way, not only the magnetic core is set between the first through hole and the second through hole, but also there is a magnetic core between at least the adjacent first through holes and the adjacent second through holes, so that when the size of the inductor is constant, the proportion of the magnetic core in the inductor can be better improved (i.e., it has a higher area utilization rate), the magnetic energy storage capacity of the inductor is increased, and more magnetic energy can be stored, thereby increasing the inductance of the inductor. In addition, the coil is wound around the magnetic core, presenting a solenoid structure, and there is a magnetic core inside the coil, which makes the inductor have the advantages of higher saturation current, less magnetic leakage, and can effectively utilize the uniaxial anisotropy of the magnetic core. Furthermore, the collapse pressure F of the magnetic core when the thickness is 0.3 mm to 0.5 mm is in the range of F ≥ 200N, so that the inductor has higher mechanical properties such as anti-fragmentation, is not easy to break during assembly and use, and has a longer service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 Schematic diagram of the structure of an inductor according to an embodiment of the present application.

[0020] Figure 2 Schematic diagram of an exploded structure of an inductor according to an embodiment of the present application.

[0021] Figure 3 It is a schematic structural diagram of a magnetic core according to an embodiment of the present application.

[0022] Figure 4 It is a schematic structural diagram of a magnetic core according to another embodiment of the present application.

[0023] Figure 5 It is a schematic diagram of the structure of a coil according to an embodiment of the present application.

[0024] Figure 6 1 is a schematic diagram of a top perspective structure of an inductor according to an embodiment of the present application.

[0025] Figure 7 Schematic diagram of the structure of an inductor according to another embodiment of the present application.

[0026] Figure 8 Schematic diagram of the structure of an inductor according to another embodiment of the present application.

[0027] Fig. 9 The inductor of one embodiment of the present application is Figure 8 Schematic diagram of the cross-sectional structure in the PP direction.

[0028] Fig.10 The inductor of another embodiment of the present application is Figure 8 Schematic diagram of the cross-sectional structure in the PP direction.

[0029] Fig.11 It is a schematic flow chart of a method for preparing a circuit board integrated inductor according to an embodiment of the present application.

[0030] Fig.12 It is a structural schematic diagram of the preparation process of a circuit board integrated inductor according to an embodiment of the present application.

[0031] Fig.13 It is a schematic flow chart of a method for preparing a magnetic core according to an embodiment of the present application.

[0032] Fig.14 It is a schematic diagram of the structure of the inductor of comparative example 1 of the present application.

[0033] Fig.15 It is a grayscale diagram of the magnetic density distribution of the inductor of Example 1 of the present application along its extension plane.

[0034] Fig.16 It is a grayscale diagram of the magnetic density distribution of the inductor of Example 2 of the present application along its extension plane.

[0035] Fig.17 It is a grayscale diagram of the magnetic density distribution of the inductor of comparative example 1 of the present application along its extension plane.

[0036] Fig.18It is a schematic diagram of the structure of a circuit board integrated inductor according to an embodiment of the present application.

[0037] Fig.19 The circuit board integrated inductor of an embodiment of the present application is Fig.18 Sectional view along the QQ direction.

[0038] Fig. 20 It is a schematic diagram of the structure of a charging device according to an embodiment of the present application.

[0039] Fig.21 It is a circuit block diagram of a charging device according to an embodiment of the present application.

[0040] Fig. 22 It is a schematic diagram of the structure of an electronic device according to an embodiment of the present application.

[0041] Fig.23 It is a schematic diagram of a partial exploded structure of an electronic device according to an embodiment of the present application.

[0042] Fig.24 It is a circuit block diagram of an electronic device according to an embodiment of the present application.

[0043] Description of reference numerals:

[0044] 100-inductor, 10-magnetic core, 11-first through hole, 12-second through hole, 13-first surface, 14-second surface, 15-third surface, 16-fourth surface, 17-magnetic film sublayer, 18-insulating sublayer, 19-bonding sublayer, 30-coil, 31-first wire, 32-second wire, 33-first electrical connection, 34-second electrical connection, 50-first insulating member, 51-first through hole, 70-second insulating member, 71-second through hole Perforation, 211'-first conductive layer, 213-first substrate layer, 217-second substrate layer, 219'-second conductive layer, 200-circuit board integrated inductor, 210-circuit board, 211-first circuit layer, 215-support layer, 219-second circuit layer, 400-charging device, 410-first processor, 430-housing, 500-electronic device, 510-display screen, 520-housing, 530-second processor, 550-memory. DETAILED DESCRIPTION

[0045] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0046] The terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally includes steps or units that are not listed, or optionally includes other steps or units inherent to these processes, methods, products or devices.

[0047] The technical solutions in the embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0048] It should be noted that, for the convenience of explanation, in the embodiments of the present application, the same figure marks represent the same components, and for the sake of brevity, detailed descriptions of the same components are omitted in different embodiments.

[0049] An inductor is composed of a coil and a magnetic part. When an alternating current passes through the coil, an alternating magnetic flux is generated inside and around the coil, which has the function of storing and releasing energy. In electronic circuits, inductance acts on the alternating current. It can form a high-pass filter or a low-pass filter, a phase shift circuit and a resonant circuit with a resistor or a capacitor, so it is widely used in various instruments and equipment.

[0050] In the inductor with a solenoid structure, the via connection structure of the solenoid coil winding is located in the external area on both sides of the magnetic film, and in order to avoid short circuit between the via connection and the magnetic film, the via will maintain a certain safety distance from the edge of the magnetic film. As a result, there will be more space on both sides of the magnetic film without magnetic material occupying it. Especially when the device size is small, the area occupied by the safety distance will account for a higher proportion, and the proportion of the magnetic core material in the total volume of the device will be lower, which limits the increase in the inductance.

[0051] Figure 1 FIG. 1 is a schematic structural diagram of an inductor 100 according to an embodiment of the present application. Figure 2 FIG. 1 is a schematic diagram of an exploded structure of an inductor 100 according to an embodiment of the present application.

[0052] See also Figure 1 and Figure 2 The present invention provides an inductor 100, which includes a magnetic core 10 and a coil 30. The magnetic core 10 has a plurality of first through holes 11 and a plurality of second through holes 12. The plurality of first through holes 11 are arranged along a first direction (such as Figure 2 The plurality of second through holes 12 are sequentially arranged in a spaced relationship along the first direction, and the first through holes 11 and the second through holes 12 are sequentially arranged in a spaced relationship along the second direction (as shown by the arrow X in the middle). Figure 2The coils 30 are arranged at intervals (as shown by the middle arrow Y), and the collapse pressure F of the magnetic core 10 when the thickness is 0.3mm to 0.5mm ranges from F≥200N, wherein the first direction intersects with the second direction; the coils 30 are alternately inserted into the first through holes 11 and the second through holes 12 in turn, and are wound around the magnetic core 10, and the coils 30 are insulated from the magnetic core 10.

[0053] The coil 30 is alternately passed through the first through hole 11 and the second through hole 12 in sequence and is wound around the magnetic core 10. It can be understood that the coil 30 can first pass through the first through hole 11, go around the magnetic core 10 to reach the second through hole 12, pass through the second through hole 12, and then go around another first through hole 11 and another second through hole 12 along the magnetic core 10. This cycle is repeated and wound between the first through hole 11 and the second through hole 12 until the number of turns of the coil 30 meets the preset number.

[0054] It is understandable that the magnetic core 10 is not only located inside the coil 30 (i.e., the central part of the coil 30), but part of the magnetic core 10 is also located between the vias of the coil 30, or outside the coil 30 (i.e., the magnetic core 10 is beyond the position covered by the coil 30).

[0055] It can also be understood that the coil 30 is not only wound around the magnetic core 10, but also partially penetrates the magnetic core 10. On average, each turn of the coil 30 passes through the magnetic core 10 twice.

[0056] Optionally, the coil 30 may be, but is not limited to, a solenoid type coil 30. The material of the coil 30 may be, but is not limited to, copper.

[0057] Optionally, the number of turns of the coil 30 may be, but is not limited to, 0.5 turns to 20 turns. For example, the number of turns of the coil 30 may be, but is not limited to, 0.5 turns, 1 turn, 2 turns, 3 turns, 4 turns, 5 turns, 8 turns, 10 turns, 12 turns, 14 turns, 16 turns, 18 turns, 20 turns, etc. The more turns the coil 30 has, the greater the inductance of the inductor 100 when other conditions remain unchanged. Therefore, the number of turns of the coil 30 can be designed according to the application scenario, the required inductance, etc., and is not specifically limited in this application.

[0058] In a specific embodiment, the first direction is perpendicular to the second direction. In other embodiments, the first direction may also be inclined to the second direction, for example, greater than or equal to 60°.

[0059] Optionally, the collapse pressure F of the magnetic core 10 when the thickness is 0.3mm to 0.5mm may be 200N≤F≤1000N. Optionally, the collapse pressure F of the magnetic core 10 when the thickness is 0.3mm may be 200N≤F≤1000N. Optionally again, the collapse pressure F of the magnetic core 10 when the thickness is 0.4mm may be 200N≤F≤1000N. Optionally again, the collapse pressure F of the magnetic core 10 when the thickness is 0.5mm may be 300N≤F≤1000N. Specifically, the collapse pressure of the magnetic core 10 when the thickness is 0.3mm to 0.5mm may be, but is not limited to, 200N, 250N, 300N, 350N, 400N, 450N, 500N, 600N, 700N, 800N, 900N, 1000N, etc. The greater the collapse pressure of the magnetic core 10 , the better the mechanical properties of the magnetic core 10 , the better the mechanical properties of the inductor 100 , and the less likely it is to break during use or assembly.

[0060] The term "collapse pressure" in this application refers to the pressure when the magnetic core 10 is pressed down, and the pressure gradually increases until the pressure suddenly changes, and the test is stopped. The pressure when the pressure suddenly changes is called the collapse pressure. It can also be understood that the "collapse pressure" refers to the maximum pressure that the magnetic core 10 can withstand when it breaks.

[0061] The inductor 100 of the embodiment of the present application includes a magnetic core 10 and a coil 30. The magnetic core 10 has a plurality of first through holes 11 and a plurality of second through holes 12. The coil 30 is alternately inserted through the first through holes 11 and the second through holes 12 in sequence and wound around the magnetic core 10. The coil 30 is insulated from the magnetic core 10. In this way, the magnetic core 10 is not only arranged between the first through hole 11 and the second through hole 12, but also at least between adjacent first through holes 11 and adjacent second through holes 12. Therefore, when the size of the inductor 100 is constant, the proportion of the magnetic core 10 in the inductor 100 can be better improved (i.e., it has a higher area utilization rate), the magnetic energy storage capacity of the inductor 100 is increased, more magnetic energy can be stored, and thus the inductance of the inductor 100 can be improved. In addition, the coil 30 is wound around the magnetic core 10 to form a solenoid structure, and the magnetic core 10 is inside the coil 30, which makes the inductor 100 have advantages such as higher saturation current, less magnetic leakage, and can effectively utilize the uniaxial anisotropy of the magnetic core 10. Furthermore, the collapse pressure F of the magnetic core 10 when the thickness is 0.3mm to 0.5mm is in the range of F≥200N, so that the inductor 100 has higher mechanical properties such as anti-fragmentation, is not easy to be fractured during assembly and use, and has a longer service life.

[0062] Figure 3 is a schematic diagram of the structure of a magnetic core 10 according to an embodiment of the present application. Figure 3In some embodiments, the magnetic core 10 includes a first surface 13 and a second surface 14 disposed opposite to each other, the first through hole 11 penetrates the first surface 13 and the second surface 14 respectively, and the second through hole 12 penetrates the first surface 13 and the second surface 14 respectively; the magnetic core 10 also includes a third surface 15 and a fourth surface 16 disposed opposite to each other along the second direction, the third surface 15 connects the first surface 13 and the second surface 14 respectively, the fourth surface 16 connects the first surface 13 and the second surface 14 respectively, the first through hole 11 is disposed closer to the third surface 15 than the second through hole 12, and the first through hole 11 also penetrates the third surface 15; the second through hole 12 is disposed closer to the fourth surface 16 than the first through hole 11, and the second through hole 12 also penetrates the fourth surface 16. It can be understood that in this embodiment, the spacing between the first through hole 11 and the third surface 15 is 0, and the spacing between the second through hole 12 and the fourth surface 16 is 0. In this embodiment, by making the first through hole 11 penetrate the third surface 15 and the second through hole 12 penetrate the fourth surface 16, the coil 30 and the magnetic core 10 can cover the entire area of ​​the inductor 100 as much as possible, thereby maximizing the volume ratio of the magnetic core 10 in the inductor 100, storing more magnetic energy, and thereby maximizing the inductance of the inductor 100 when the size of the inductor 100 is constant.

[0063] It can be understood that the first surface 13 and the second surface 14 are arranged opposite to each other along the thickness direction of the magnetic core 10 .

[0064] Figure 4 FIG. 1 is a schematic diagram of the structure of a magnetic core 10 according to another embodiment of the present invention. Figure 4 In other embodiments, the magnetic core 10 includes a first surface 13 and a second surface 14 disposed opposite to each other, the first through hole 11 penetrates the first surface 13 and the second surface 14 respectively, and the second through hole 12 penetrates the first surface 13 and the second surface 14 respectively; the magnetic core 10 also includes a third surface 15 and a fourth surface 16 disposed opposite to each other along the second direction, the third surface 15 connects the first surface 13 and the second surface 14 respectively, the fourth surface 16 connects the first surface 13 and the second surface 14 respectively, the first through hole 11 is disposed closer to the third surface 15 than the second through hole 12, and the first through hole 11 and the third surface 15 are spaced apart, and the second through hole 12 is disposed closer to the fourth surface 16 than the first through hole 11, and the second through hole 12 and the fourth surface 16 are spaced apart.

[0065] It is understandable that the first through hole 11 does not penetrate the third surface 15, and the second through hole 12 does not penetrate the fourth surface 16. It is also understandable that the first through hole 11 is at a certain distance from the third surface 15, and the second through hole 12 is at a certain distance from the fourth surface 16.

[0066] Compared with the solution in which the first through hole 11 penetrates the third surface 15 and the second through hole 12 penetrates the fourth surface 16 (i.e. Figure 3 In this embodiment ( Figure 4 In the case of a certain size of the inductor 100 and the volume of the magnetic core 10, since there are more magnetic materials (i.e., more materials constituting the magnetic core 10) around the first through hole 11 and the second through hole 12, the magnetic core 10 in the vicinity of the first through hole 11 and the second through hole 12 is more likely to form a complete closed magnetic loop, thereby having a better magnetic flux density, so that the inductor 100 has a higher inductance. In addition, compared with Figure 3 The plan, in Figure 4 In the solution, the distance between the first through hole 11 and the second through hole 12 is reduced, and the total length of the coil 30 with the same number of turns is shortened, thereby reducing the direct current resistance (DCR) of the inductor 100.

[0067] Optionally, the range of the spacing w1 between the first through hole 11 and the third surface 15 is: 0≤w1≤0.6mm. In other words, the range of the width of the portion of the magnetic core 10 located between the first through hole 11 and the third surface 15 is 0≤w1≤0.6mm. In other words, the range of the spacing w1 between the first through hole 11 and the edge of the magnetic core 10 away from the second through hole 12 is: 0≤w1≤0.6mm. Further, the range of the spacing w1 between the first through hole 11 and the third surface 15 is: 0.05mm≤w1≤0.6mm. Specifically, the spacing w1 between the first through hole 11 and the third surface 15 can be, but is not limited to, 0, 0.05mm, 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, etc. If the distance w1 between the first through hole 11 and the third surface 15 is too large, the magnetic flux density of the portion of the magnetic core 10 close to the edge (i.e., the edge away from the first through hole 11) will be very low, and this portion of the magnetic core 10 will not be able to fully play the role of storing magnetic energy, which will also reduce the inductance of the inductor 100.

[0068] Optionally, the range of the spacing w2 between the second through hole 12 and the fourth surface 16 is: 0≤w2≤0.6mm. In other words, the range of the width of the portion of the magnetic core 10 located between the second through hole 12 and the fourth surface 16 is 0≤w2≤0.6mm. In other words, the range of the spacing w2 between the second through hole 12 and the edge of the magnetic core 10 away from the first through hole 11 is: 0≤w2≤0.6mm. Further, the range of the spacing w2 between the second through hole 12 and the fourth surface 16 is: 0.05mm≤w2≤0.6mm. Specifically, the spacing w2 between the second through hole 12 and the fourth surface 16 can be, but is not limited to, 0, 0.05mm, 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, etc. If the distance w2 between the second through hole 12 and the fourth surface 16 is too large, the magnetic flux density of the portion of the magnetic core 10 close to the edge (i.e., the edge away from the second through hole 12) will be very low, and this portion of the magnetic core 10 will not be able to fully play the role of storing magnetic energy, which will also reduce the inductance of the inductor 100.

[0069] Figure 5 30 is a schematic diagram of the structure of the coil 30 according to an embodiment of the present application. Figure 5 Optionally, the coil 30 includes a plurality of first wires 31, a plurality of second wires 32, a plurality of first electrical connectors 33 and a plurality of second electrical connectors 34, the first wires 31, the first electrical connectors 33, the second wires 32 and the second electrical connectors 34 are alternately connected in series in sequence; the plurality of first wires 31 are arranged in sequence on the first surface 13 at intervals along the first direction, the plurality of second wires 32 are arranged in sequence on the second surface 14 at intervals along the first direction, each first electrical connector 33 is passed through a first through hole 11 and the first electrical connector 33 corresponds to the first through hole 11 one by one, and each second electrical connector 34 is passed through a second through hole 12 and the second electrical connector 34 corresponds to the second through hole 12 one by one.

[0070] It can be understood that the coil 30 is cyclically wound with the first wire 31, the first electrical connector 33, the second wire 32 and the second electrical connector 34 as the minimum loop unit. It can also be understood that each turn of the coil 30 includes the first wire 31, the first electrical connector 33, the second wire 32 and the second electrical connector 34.

[0071] Optionally, the plurality of first conductive wires 31 are arranged parallel to each other, and the plurality of second conductive wires 32 are arranged parallel to each other. The first conductive wires 31 and the second conductive wires 32 may be arranged parallel to each other, or may be arranged at an acute angle (eg, less than or equal to 30°).

[0072] In this embodiment, a plurality of first conductive wires 31 are arranged on the first surface 13, a plurality of second conductive wires 32 are arranged on the second surface 14, and a first electrical connector 33 and a second electrical connector 34 are respectively passed through the magnetic core 10. In this way, no matter how many turns the coil 30 has, it is only necessary to set a conductive layer on the opposite sides of the magnetic core 10. After processes such as exposure, development, etching, stripping, and deposition of conductive materials (such as copper plating), the preparation of the coil 30 can be achieved, which can better simplify the process of preparing the coil 30 and make the inductor 100 thinner and lighter.

[0073] Figure 6 1 is a schematic diagram of a top perspective structure of an inductor 100 according to an embodiment of the present application.

[0074] Please also see Figure 6 Optionally, the spacing s1 between the first electrical connector 33 and the magnetic core 10 is in the range of 0.05 mm ≤ s1 ≤ 0.3 mm. In other words, the spacing s1 between the outer peripheral side wall of the first electrical connector 33 and the inner peripheral side wall of the first through hole 11 is in the range of 0.05 mm ≤ s1 ≤ 0.3 mm. Specifically, the spacing s1 between the first electrical connector 33 and the magnetic core 10 may be, but is not limited to, 0.05 mm, 0.08 mm, 0.1 mm, 0.12 mm, 0.15 mm, 0.18 mm, 0.2 mm, 0.23 mm, 0.25 mm, 0.28 mm, 0.3 mm, etc. If the distance between the first electrical connector 33 and the magnetic core 10 is too small, a short circuit may easily occur between the first electrical connector 33 and the magnetic core 10, affecting the normal operation of the inductor 100; if the distance between the first electrical connector 33 and the magnetic core 10 is too large, the volume ratio of the magnetic core 10 is reduced, the magnetic energy storage capacity of the magnetic core 10 is reduced, and thus the inductance of the inductor 100 is reduced. When the distance s1 between the first electrical connector 33 and the magnetic core 10 is 0.05 mm to 0.3 mm, not only can a suitable safety distance be provided between the first electrical connector 33 and the magnetic core 10 to avoid contact short circuit, but also the magnetic core 10 of the inductor 100 can have a higher volume ratio.

[0075] Optionally, the range of the spacing s2 between the second electrical connector 34 and the magnetic core 10 is: 0.05mm≤s2≤0.3mm. In other words, the range of the spacing s2 between the outer peripheral side wall of the second electrical connector 34 and the inner peripheral side wall of the second through hole 12 is: 0.05mm≤s2≤0.3mm. Specifically, the spacing s2 between the second electrical connector 34 and the magnetic core 10 can be, but is not limited to, 0.05mm, 0.08mm, 0.1mm, 0.12mm, 0.15mm, 0.18mm, 0.2mm, 0.23mm, 0.25mm, 0.28mm, 0.3mm, etc. If the spacing between the second electrical connector 34 and the magnetic core 10 is too small, a short circuit may easily occur between the second electrical connector 34 and the magnetic core 10, affecting the normal operation of the inductor 100; if the spacing between the second electrical connector 34 and the magnetic core 10 is too large, the volume ratio of the magnetic core 10 is reduced, the magnetic energy storage capacity of the magnetic core 10 is reduced, and thus the inductance of the inductor 100 is reduced. When the spacing s2 between the second electrical connector 34 and the magnetic core 10 is 0.05 mm to 0.3 mm, not only can a suitable safety distance be provided between the second electrical connector 34 and the magnetic core 10 to avoid contact short circuit, but also the magnetic core 10 of the inductor 100 can have a higher volume ratio.

[0076] Optionally, the inductor 100 further includes a first insulating member 50 and a second insulating member 70, wherein the first insulating member 50 is disposed in the first through hole 11, and has a first through hole 51, and the first through hole 51 is used to penetrate the first electrical connector 33; the second insulating member 70 is disposed in the second through hole 12, and has a second through hole 71, and the second through hole 71 is used to penetrate the second electrical connector 34.

[0077] In this embodiment, by providing the first insulating member 50 and the second insulating member 70 , the first electrical connector 33 and the second electrical connector 34 can be better insulated from the magnetic core 10 , thereby better avoiding a short circuit connection between the first electrical connector 33 and the second electrical connector 34 and the magnetic core 10 .

[0078] Optionally, the wall thickness of the first insulating member 50 is in the range of 0.05mm≤L1≤0.3mm; specifically, the wall thickness of the first insulating member 50 may be, but is not limited to, 0.05mm, 0.08mm, 0.1mm, 0.12mm, 0.15mm, 0.18mm, 0.2mm, 0.23mm, 0.25mm, 0.28mm, 0.3mm, etc. If the wall thickness of the first insulating member 50 is too small, the first electrical connector 33 and the magnetic core 10 are prone to short circuit, affecting the normal operation of the inductor 100; if the wall thickness of the first insulating member 50 is too large, the volume ratio of the magnetic core 10 is reduced, the magnetic energy storage capacity of the magnetic core 10 is reduced, and thus the inductance of the inductor 100 is reduced. When the wall thickness of the first insulating member 50 is 0.05 mm to 0.3 mm, not only can a suitable safety distance be maintained between the first electrical connector 33 and the magnetic core 10 to avoid contact short circuit, but also the magnetic core 10 of the inductor 100 can have a higher volume share.

[0079] Optionally, the wall thickness of the second insulating member 70 is in the range of 0.05mm≤L2≤0.3mm; specifically, the wall thickness of the second insulating member 70 may be, but is not limited to, 0.05mm, 0.08mm, 0.1mm, 0.12mm, 0.15mm, 0.18mm, 0.2mm, 0.23mm, 0.25mm, 0.28mm, 0.3mm, etc. If the wall thickness of the second insulating member 70 is too small, the second electrical connector 34 and the magnetic core 10 are prone to short circuit, affecting the normal operation of the inductor 100; if the wall thickness of the second insulating member 70 is too large, the volume ratio of the magnetic core 10 is reduced, the magnetic energy storage capacity of the magnetic core 10 is reduced, and thus the inductance of the inductor 100 is reduced. When the wall thickness of the second insulating member 70 is 0.05 mm to 0.3 mm, not only can a suitable safety distance be provided between the second electrical connector 34 and the magnetic core 10 to avoid contact short circuit, but also the magnetic core 10 of the inductor 100 can have a higher volume share.

[0080] Alternatively, the first insulating member 50 is an annular structure, the outer peripheral side wall of the first insulating member 50 is arranged in contact with the inner peripheral side wall of the first through hole 11, and the inner peripheral side wall of the first insulating member 50 is arranged in contact with the outer peripheral side wall of the first electrical connector 33. Similarly, the second insulating member 70 is an annular structure, the outer peripheral side wall of the second insulating member 70 is arranged in contact with the inner peripheral side wall of the second through hole 12, and the inner peripheral side wall of the second insulating member 70 is arranged in contact with the outer peripheral side wall of the second electrical connector 34.

[0081] In some embodiments, the material of the first insulating member 50 may be, but is not limited to, epoxy resin. The material of the second insulating member 70 may be, but is not limited to, epoxy resin. Both the first insulating member 50 and the second insulating member 70 may be formed by curing liquid epoxy resin.

[0082] In other embodiments, optionally, the first insulating member 50 includes first magnetic particles and a first insulating resin, the first magnetic particles are dispersed in the first insulating resin, and the mass fraction of the first magnetic particles in the first insulating member 50 ranges from 80% to 95%. In this embodiment, the soft magnetic composite material formed by the first magnetic particles and the first insulating resin is used as the first insulating member 50, so that the inductance of the inductor 100 can be improved.

[0083] Optionally, the mass fraction of the first magnetic particles in the first insulating member 50 may be, but is not limited to, 80%, 82%, 84%, 86%, 88%, 90%, 92%, 94%, 95%, etc. If the mass fraction of the first magnetic particles in the first insulating member 50 is too low, the relative magnetic permeability of the first insulating member 50 is too low, and the improvement of the inductance of the inductor 100 is limited. If the mass fraction of the first magnetic particles in the first insulating member 50 is too high, the content of the first insulating resin is too low, the brittleness of the first insulating member 50 is increased, and the mechanical properties of the first insulating member 50 are reduced.

[0084] Optionally, the range of the median particle size D1 of the first magnetic particles is: 1μm≤D1≤10μm; specifically, the median particle size D1 of the first magnetic particles may be, but is not limited to, 1μm, 2μm, 3μm, 4μm, 5μm, 6μm, 7μm, 8μm, 9μm, 10μm, etc. When the first magnetic particles are small, the eddy current is limited to a very small range. As the first magnetic particles increase, the area for the eddy current to flow becomes larger, thereby increasing the eddy current loss. However, when the average particle size of the first magnetic particles is too small, not only the cost of the first magnetic particles is increased, but also the relative magnetic permeability of the magnetic core 10 is too low, thereby losing its use value; when the average particle size of the first magnetic particles is too large, the eddy current loss increases, which is not conducive to the performance of the inductor 100. When the average particle size of the first magnetic particles is between 1μm and 10μm, the magnetic core 10 can have a more suitable relative magnetic permeability and a smaller eddy current loss.

[0085] The median particle size refers to the particle size at which the cumulative particle size distribution percentage of a sample reaches 50%.

[0086] Optionally, the first insulating member 50 is made of a soft magnetic composite material.

[0087] Optionally, the material of the first magnetic particles includes at least one of soft magnetic materials such as magnetic metal and magnetic alloy.

[0088] Optionally, the magnetic metal includes at least one of iron, cobalt, and nickel; the magnetic alloy includes at least one of iron-based crystalline alloy, iron-based amorphous alloy, and cobalt-based amorphous alloy; the iron-based crystalline alloy includes at least one of FeNi alloy, FeCo alloy, FeAl alloy, FeSiAl alloy, FeNiMo alloy, FeC alloy, etc.; the iron-based amorphous alloy includes at least one of FeSiB alloy, FeB alloy, FeNiPB alloy, FeNiMoB alloy, etc.; the cobalt-based amorphous alloy includes at least one of CoFeSiB alloy, CoFeCrSiB alloy, CoNiFeSiB alloy, etc.

[0089] Optionally, the material of the first insulating resin may be, but is not limited to, epoxy resin.

[0090] Optionally, the relative magnetic permeability μr1 of the first insulating member 50 is in the range of 5≤μr1≤50. Specifically, the relative magnetic permeability μr1 of the first insulating member 50 may be, but is not limited to, 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, etc. If the relative magnetic permeability of the first insulating member 50 is too small, the improvement of the inductance of the inductor 100 is limited; if the relative magnetic permeability of the first insulating member 50 is too high, it means that the particle size of the first magnetic particles is large or the mass fraction of the first magnetic particles is high, which will increase the difficulty of filling the first insulating member 50. When filling the first insulating member 50, pores are likely to exist, and the presence of pores will also reduce the inductance of the inductor 100.

[0091] Optionally, the second insulating member 70 includes second magnetic particles and a second insulating resin, the second magnetic particles are dispersed in the second insulating resin, and the mass fraction of the second magnetic particles in the second insulating member 70 ranges from 80% to 95%. In this embodiment, the soft magnetic composite material formed by the second magnetic particles and the second insulating resin is used as the second insulating member 70, so that the inductance of the inductor 100 can be increased.

[0092] Optionally, the mass fraction of the second magnetic particles in the second insulating member 70 may be, but is not limited to, 80%, 82%, 84%, 86%, 88%, 90%, 92%, 94%, 95%, etc. If the mass fraction of the second magnetic particles in the second insulating member 70 is too low, the relative magnetic permeability of the second insulating member 70 is too low, and the improvement of the inductance of the inductor 100 is limited. If the mass fraction of the second magnetic particles in the second insulating member 70 is too high, the content of the second insulating resin is too low, the brittleness of the second insulating member 70 is increased, and the mechanical properties of the second insulating member 70 are reduced.

[0093] Optionally, the range of the median particle size D2 of the second magnetic particles is: 1μm≤D2≤10μm; specifically, the median particle size D2 of the second magnetic particles can be, but is not limited to, 1μm, 2μm, 3μm, 4μm, 5μm, 6μm, 7μm, 8μm, 9μm, 10μm, etc. When the second magnetic particles are small, the eddy current is limited to a very small range. As the second magnetic particles increase, the area for the eddy current to flow becomes larger, thereby increasing the eddy current loss. However, when the average particle size of the second magnetic particles is too small, not only the cost of the second magnetic particles is increased, but also the relative magnetic permeability of the magnetic core 10 is too low, thereby losing its use value; when the average particle size of the second magnetic particles is too large, the eddy current loss increases, which is not conducive to the performance of the inductor 100. When the average particle size of the second magnetic particles is between 1μm and 10μm, the magnetic core 10 can have a more suitable relative magnetic permeability and a smaller eddy current loss.

[0094] Optionally, the second insulating member 70 is made of a soft magnetic composite material.

[0095] Optionally, the material of the second magnetic particles includes at least one of soft magnetic materials such as magnetic metal and magnetic alloy.

[0096] Optionally, the magnetic metal includes at least one of iron, cobalt, and nickel; the magnetic alloy includes at least one of iron-based crystalline alloy, iron-based amorphous alloy, and cobalt-based amorphous alloy; the iron-based crystalline alloy includes at least one of FeNi alloy, FeCo alloy, FeAl alloy, FeSiAl alloy, FeNiMo alloy, FeC alloy, etc.; the iron-based amorphous alloy includes at least one of FeSiB alloy, FeB alloy, FeNiPB alloy, FeNiMoB alloy, etc.; the cobalt-based amorphous alloy includes at least one of CoFeSiB alloy, CoFeCrSiB alloy, CoNiFeSiB alloy, etc.

[0097] Optionally, the material of the second insulating resin may be, but is not limited to, epoxy resin.

[0098] Optionally, the relative magnetic permeability μr2 of the second insulating member 70 is in the range of 5≤μr2≤50. Specifically, the relative magnetic permeability μr2 of the second insulating member 70 may be, but is not limited to, 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, etc. If the relative magnetic permeability of the second insulating member 70 is too small, the improvement of the inductance of the inductor 100 is limited; if the relative magnetic permeability of the second insulating member 70 is too high, it means that the particle size of the second magnetic particles is large or the mass fraction of the second magnetic particles is high, which will increase the difficulty of filling the second insulating member 70. When filling the second insulating member 70, pores are likely to exist, and the presence of pores will also reduce the inductance of the inductor 100.

[0099] Optionally, the range of the diameter d1 of the first electrical connector 33 is: 0.02mm≤d1≤0.5mm. Specifically, the diameter of the first electrical connector 33 may be, but is not limited to, 0.02mm, 0.05mm, 0.08mm, 0.1mm, 0.15mm, 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm, 0.5mm, etc. If the diameter of the first electrical connector 33 is too small, the resistance of the coil 30 is increased. If the diameter of the first electrical connector 33 is too large, the first through hole 11 needs to be set larger to keep a safe distance from the magnetic core 10, thereby reducing the proportion of the magnetic core 10.

[0100] Optionally, the diameter d2 of the second electrical connector 34 is in the range of 0.02 mm ≤ d2 ≤ 0.5 mm. Specifically, the diameter of the second electrical connector 34 may be, but is not limited to, 0.02 mm, 0.05 mm, 0.08 mm, 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm, 0.3 mm, 0.35 mm, 0.4 mm, 0.45 mm, 0.5 mm, etc. If the diameter of the second electrical connector 34 is too small, the resistance of the coil 30 is increased. If the diameter of the second electrical connector 34 is too large, the second through hole 12 needs to be set larger to keep a safe distance from the magnetic core 10, thereby reducing the proportion of the magnetic core 10.

[0101] Optionally, the diameter of the first through hole 11 ranges from 0.12 mm to 1.1 mm; the diameter of the second through hole 12 ranges from 0.12 mm to 1.1 mm; the diameter of the first through hole 51 ranges from 0.02 mm to 0.5 mm; the diameter of the second through hole 71 ranges from 0.02 mm to 0.5 mm.

[0102] In a specific embodiment, the first through hole 11 is filled with liquid epoxy resin, and after curing, a resin part is formed, a hole is punched on the resin part, and a conductive material (such as copper plating) is deposited to form the first electrical connector 33, so that the magnetic core 10, the first insulating part 50, and the first electrical connector 33 are connected as a whole. Similarly, the second through hole 12 is filled with liquid epoxy resin, and after curing, a resin part is formed, a hole is punched on the resin part, and a conductive material (such as copper plating) is deposited to form the second electrical connector 34, so that the magnetic core 10, the second insulating part 70, and the second electrical connector 34 are connected as a whole.

[0103] Figure 7 FIG. 1 is a schematic structural diagram of an inductor 100 according to another embodiment of the present application. Figure 8 FIG. 1 is a schematic structural diagram of an inductor 100 according to another embodiment of the present application. Fig. 9 The inductor 100 of one embodiment of the present application is Figure 8 Schematic diagram of the cross-sectional structure in the PP direction.

[0104] See also Figures 7 to 9 In some embodiments, the magnetic core 10 includes N magnetic film sublayers 17 and at least N-1 insulating sublayers 18, the magnetic film sublayers 17 and the insulating sublayers 18 are alternately stacked in sequence, and the third direction intersects with the first direction and the second direction, wherein N≥2 and is a positive integer.

[0105] In a specific embodiment, the third direction is perpendicular to the first direction and perpendicular to the second direction. Optionally, the third direction is a thickness direction of the magnetic core 10 .

[0106] It can be understood that the first through hole 11 and the second through hole 12 both penetrate the magnetic core 10 along the stacking direction of the magnetic film sublayer 17 and the insulating sublayer 18. In other words, the first through hole 11 penetrates each magnetic film sublayer 17 and each insulating sublayer 18, and the second through hole 12 penetrates each magnetic film sublayer 17 and each insulating sublayer 18.

[0107] When the magnetic core 10 has only one magnetic film layer, a large eddy current effect will be generated in the thickness direction of the magnetic core 10. In this embodiment, each magnetic film sublayer 17 is made thinner, and an insulating sublayer 18 is provided between any two adjacent magnetic film sublayers 17. The insulating sublayer 18 can prevent the eddy current in the magnetic film sublayer 17 from being conducted in the thickness direction of the magnetic core 10, thereby reducing the eddy current loss of the entire magnetic core 10 in the thickness direction, thereby reducing the eddy current loss of the entire inductor 100, and improving the efficiency of the inductor 100. Under the condition of the same thickness, compared with the solution with only one magnetic film layer, at least two magnetic film sublayers 17 are sequentially insulated, which can reduce 75% of the eddy current loss in the cross section of the magnetic core 10.

[0108] Optionally, the number of magnetic film sublayers 17 in the magnetic core 10 can be 2 to 100 layers. Further, the number of magnetic film sublayers 17 in the magnetic core 10 can be 2 to 30 layers. Specifically, the number of magnetic film sublayers 17 in the magnetic core 10 can be, but not limited to, 2 layers, 3 layers, 5 layers, 8 layers, 10 layers, 20 layers, 30 layers, 40 layers, 50 layers, 60 layers, 70 layers, 80 layers, 90 layers, 100 layers, etc. The number of layers of the magnetic film sublayer 17 depends on the requirements of the inductance, saturation current, etc. of the final inductor 100. The more layers of the magnetic film sublayer 17, the greater the inductance of the inductor 100 and the greater the saturation current.

[0109] Optionally, the thickness h1 of each magnetic film sublayer 17 is in the range of 0.5μm≤h1≤10μm; in other words, along the stacking direction of the magnetic film sublayer 17 and the insulating sublayer 18, the thickness of each magnetic film sublayer 17 is in the range of 0.5μm to 10μm. Specifically, the thickness h1 of each magnetic film sublayer 17 can be, but is not limited to, 0.5μm, 0.8μm, 1μm, 1.5μm, 2μm, 3μm, 4μm, 5μm, 6μm, 7μm, 8μm, 9μm, 10μm, etc. When the thickness of the magnetic film sublayer 17 is too small, the proportion of the magnetic film sublayer 17 in the total thickness of the magnetic core 10 is too small, which is not conducive to improving the inductance of the inductor 100. In addition, if the magnetic film sublayer 17 with the same total thickness is to be achieved, more layers are required, which increases the complexity of the process and the production cost. When the thickness of the magnetic film sub-layer 17 is too large, this increases the eddy current loss within the single-layer magnetic film sub-layer 17 and increases the difficulty of depositing the magnetic film sub-layer 17 .

[0110] Optionally, the total thickness h of the N-layer magnetic film sublayer 17 in the magnetic core 10 is in the range of 5μm≤h≤500μm. Further, the total thickness h of the N-layer magnetic film sublayer 17 in the magnetic core 10 is in the range of 50μm≤h≤500μm. Specifically, the total thickness h of the N-layer magnetic film sublayer 17 in the magnetic core 10 can be, but not limited to, 5μm, 8μm, 10μm, 20μm, 30μm, 50μm, 80μm, 100μm, 150μm, 200μm, 250μm, 300μm, 350μm, 400μm, 450μm, 500μm, etc. The total thickness of the N magnetic film sublayers 17 in the magnetic core 10 is too small, and the proportion of the magnetic film sublayers 17 in the total thickness of the magnetic core 10 is too small, which is not conducive to improving the inductance of the inductor 100. The total thickness of the N magnetic film sublayers 17 in the magnetic core 10 is too large, which increases the process difficulty and cost of the magnetic core 10.

[0111] Optionally, the soft magnetic material has high relative magnetic permeability, low remanence, low coercive force, low magnetic resistance, small hysteresis loss, and is easy to be magnetized. In some embodiments, the material of the magnetic film sublayer 17 includes at least one of soft magnetic materials such as magnetic metals and magnetic alloys. Optionally, the magnetic metal includes at least one of iron, cobalt, and nickel; the magnetic alloy includes at least one of iron-based crystalline alloys, iron-based amorphous alloys, and cobalt-based amorphous alloys; the iron-based crystalline alloy includes at least one of FeNi alloys, FeCo alloys, FeAl alloys, FeSiAl alloys, FeNiMo alloys, and FeC alloys; the iron-based amorphous alloy includes at least one of FeSiB alloys, FeB alloys, FeNiPB alloys, and FeNiMoB alloys; the cobalt-based amorphous alloy includes at least one of CoFeSiB alloys, CoFeCrSiB alloys, and CoNiFeSiB alloys.

[0112] Compared with iron-based crystalline alloys and iron-based amorphous alloys, cobalt-based amorphous alloys have higher relative magnetic permeability. Therefore, when the magnetic core 10 requires a higher relative magnetic permeability, the magnetic film sublayer 17 can use at least one of the cobalt-based amorphous alloys. Compared with cobalt-based amorphous alloys, iron-based crystalline alloys and iron-based amorphous alloys have higher saturation magnetic properties. When the magnetic core 10 requires higher saturation magnetic properties, the magnetic film sublayer 17 can use at least one of the iron-based crystalline alloys and iron-based amorphous alloys. Compared with iron-based crystalline alloys, iron-based amorphous alloys and cobalt-based amorphous alloys have lower coercivity. When the magnetic core 10 requires lower coercivity, the magnetic film sublayer 17 can use iron-based amorphous alloys and cobalt-based amorphous alloys. Coercive force refers to the fact that after a magnetic material is saturated magnetized, its magnetic induction intensity B does not return to zero when the external magnetic field returns to zero. Only when a magnetic field of a certain magnitude is added in the opposite direction of the original magnetizing field can the magnetic induction intensity return to zero. This magnetic field is called the coercive magnetic field, also known as coercive force.

[0113] Optionally, the relative magnetic permeability of the magnetic film sublayer 17 is 100≤μr3≤1000. Further, the relative magnetic permeability of the magnetic film sublayer 17 is 200≤μr3≤800. Still further, the relative magnetic permeability of the magnetic film sublayer 17 is 300≤μr3≤500. Specifically, the relative magnetic permeability of the magnetic film sublayer 17 may be, but is not limited to, 100, 150, 200, 250, 300, 350, 400, 450, 500, 600, 700, 800, 900, 1000, etc. If the relative magnetic permeability of the magnetic film sublayer 17 is too low, the effective relative magnetic permeability of the obtained magnetic core 10 is too low, so that the inductance of the inductor 100 is too low; if the relative magnetic permeability of the magnetic film sublayer 17 is too high, the requirements on the material are too harsh, which increases the cost of the material or even cannot be achieved.

[0114] Optionally, in other words, along the stacking direction of the magnetic film sublayer 17 and the insulating sublayer 18, the thickness h2 of the insulating sublayer 18 is in the range of 10μm≤h2≤60μm; specifically, the thickness h2 of each insulating sublayer 18 can be, but is not limited to, 10μm, 15μm, 20μm, 25μm, 30μm, 35μm, 40μm, 45μm, 50μm, 55μm, 60μm, etc. If the thickness of the insulating sublayer 18 is too small, the mechanical properties are low (i.e., the mechanical properties are limited), which is not conducive to the deposition of the magnetic film sublayer 17. If the thickness of the insulating sublayer 18 is too large, the thickness of the magnetic core 10 will be increased, which is not conducive to the ultra-thinness of the inductor 100.

[0115] Optionally, the insulating sublayer 18 includes at least one of a polyimide film (PI film) and a glass fiber / epoxy resin composite board (Prepreg). The polyimide film has good flexibility and can be better applied to a flexible circuit board. The glass fiber / epoxy resin composite board has good rigidity and is more suitable for application to a printed circuit board.

[0116] Fig.10 The inductor 100 of another embodiment of the present application is Figure 8 Schematic diagram of the cross-sectional structure in the PP direction.

[0117] See also Fig.10 In some embodiments, the magnetic core 10 further includes at least N layers of bonding sublayers 19, and the insulating sublayer 18, the magnetic film sublayer 17 and the bonding sublayer 19 are alternately stacked in sequence. When preparing the magnetic core 10, the magnetic film sublayer 17 is first deposited on the insulating sublayer 18 by electroplating or other methods, and then multiple insulating sublayers 18 with magnetic film sublayers 17 deposited thereon are bonded by the bonding sublayer 19 to form a magnetic core 10 having multiple insulating sublayers 18, multiple magnetic film sublayers 17 and multiple bonding sublayers 19 alternately stacked in sequence. Multiple insulating sublayers 18 with magnetic film sublayers 17 can be bonded by the bonding sublayer 19 to form a magnetic core 10 with an integrated structure. By stacking multiple insulating sublayers 18 / magnetic film sublayers 17 using the bonding sublayer 19, the assembly process of the magnetic core 10 can be simplified, so that each insulating sublayer 18 / magnetic film sublayer 17 can be assembled together more firmly.

[0118] Specifically, the number of bonding sublayers 19 can be one or more layers, such as one layer, two layers, three layers, four layers, five layers, etc. The number of bonding sublayers 19 can be determined according to the number of magnetic film sublayers 17 included in the magnetic core 10, and this application does not make any specific limitations.

[0119] Optionally, the adhesive sublayer 19 may be, but is not limited to, a pure film.

[0120] Optionally, the pure film includes at least one of acrylic resin and epoxy resin. Acrylic resin has high bonding strength, good ductility and flexibility, and is therefore more suitable for use in flexible circuits, but has poor electrical properties and can cause copper migration under high temperature conditions; epoxy resin has good bonding and electrical properties, and good corrosion resistance, and therefore, its various properties are relatively balanced and good.

[0121] Optionally, along the stacking direction of the insulating sublayer 18, the magnetic film sublayer 17 and the bonding sublayer 19, the thickness h3 of each bonding sublayer 19 is in the range of 10μm≤h3≤30μm. Specifically, the thickness h3 of each bonding sublayer 19 can be, but not limited to, 10μm, 12μm, 14μm, 16μm, 18μm, 20μm, 22μm, 24μm, 26μm, 28μm, 30μm, etc. If the thickness of the bonding sublayer 19 is too thin, the bonding performance is insufficient, which affects the firmness of the bonding of the magnetic film sublayer 17. In addition, if the bonding sublayer 19 is too thin, the mechanical properties are limited and it is difficult to prepare in terms of process. If the thickness of the bonding sublayer 19 is too large, the thickness of the magnetic core 10 is increased, which is not conducive to the thinness of the inductor 100.

[0122] In other embodiments, the adhesive sublayer 19 may also be formed by using a liquid adhesive, forming a film by coating, spin coating, scraping, etc., and then heating and curing.

[0123] In other embodiments, the magnetic core 10 may also be at least one of a metal magnetic powder core, a ferrite, etc., which are entirely formed of magnetic materials.

[0124] Fig.11 1 is a schematic diagram of a process for preparing a circuit board integrated inductor 200 according to an embodiment of the present application. Fig.12 It is a structural schematic diagram of the preparation process of the circuit board integrated inductor 200 according to an embodiment of the present application.

[0125] See also Fig.11 and Fig.12 The present application also provides a method for preparing an inductor 100, which includes:

[0126] S301, providing a magnetic core 10, the magnetic core 10 having a plurality of first through holes 11 and a plurality of second through holes 12, the plurality of first through holes 11 are sequentially arranged at intervals along a first direction, the plurality of second through holes 12 are sequentially arranged at intervals along the first direction, the first through holes 11 and the second through holes 12 are sequentially arranged at intervals along the second direction, wherein the first direction intersects the second direction;

[0127] Fig.13 FIG. 1 is a schematic diagram of a method for preparing a magnetic core 10 according to an embodiment of the present application. Fig.13 Optionally, providing the magnetic core 10 includes:

[0128] S3011, providing an insulating sublayer 18;

[0129] For a detailed description of the insulating sublayer 18 , please refer to the description of the corresponding part of the above embodiment, which will not be repeated here.

[0130] S3012, forming a magnetic film sublayer 17 on the insulating sublayer 18 to obtain a stacked insulating sublayer 18 / magnetic film sublayer 17;

[0131] Optionally, the magnetic film sublayer 17 is deposited on the surface of the insulating sublayer 18 by electroplating or the like. For a detailed description of the magnetic film sublayer 17, please refer to the description of the corresponding part of the above embodiment, which will not be repeated here.

[0132] In other embodiments, the cathode roller process may also be used to prepare a self-supporting magnetic film sublayer 17 without using the insulating sublayer 18 as a supporting substrate.

[0133] S3013, stacking a plurality of insulating sublayers 18 / magnetic film sublayers 17, and bonding them with an adhesive sublayer 19, to obtain insulating sublayers 18 / magnetic film sublayers 17 / adhesive sublayers 19 that are alternately stacked in sequence; and

[0134] Optionally, the prepared insulating sublayer 18 / magnetic film sublayer 17 is hot-pressed and bonded together through the bonding sublayer 19 to obtain the alternately stacked insulating sublayer 18 / magnetic film sublayer 17 / bonding sublayer 19. For a detailed description of the bonding sublayer 19, please refer to the description of the corresponding part of the above embodiment, which will not be repeated here.

[0135] S3014 , punching a plurality of first through holes 11 and a plurality of second through holes 12 on the insulating sublayer 18 / magnetic film sublayer 17 / adhesive sublayer 19 stacked alternately in sequence to obtain a magnetic core 10 .

[0136] Optionally, only one magnetic core 10 may be prepared each time, or multiple magnetic cores 10 may be prepared simultaneously. When multiple magnetic cores 10 need to be prepared simultaneously, a large-sized insulating sublayer 18 / magnetic film sublayer 17 / adhesive sublayer 19 may be prepared in an alternating manner, and multiple first through holes 11 and multiple second through holes 12 may be punched at positions corresponding to multiple first through holes 11 and multiple second through holes 12 of each magnetic core 10 by laser or mechanical punching.

[0137] For descriptions of other aspects of the magnetic core 10 , please refer to the descriptions of the corresponding parts of the above embodiments, which will not be repeated here.

[0138] S302, forming a first insulating member 50 in the plurality of first through holes 11 of the magnetic core 10, and forming a second insulating member 70 in the plurality of second through holes 12 of the magnetic core 10;

[0139] Optionally, liquid epoxy resin is injected into the first through holes 11 of the magnetic core 10 and heated and cured to form the first insulating member 50. Liquid epoxy resin is injected into the second through holes 12 of the magnetic core 10 and heated and cured to form the second insulating member 70.

[0140] S303, providing a first substrate layer 213 / first conductive layer 211' stacked and a second substrate layer 217 / second conductive layer 219' stacked;

[0141] Optionally, the first substrate layer 213 / first conductive layer 211' may be, but not limited to, a single-sided copper-clad laminate, and the second substrate layer 217 / second conductive layer 219' may be, but not limited to, a single-sided copper-clad laminate. Optionally, the first substrate layer 213 may be, but not limited to, a polyimide film (PI film) or a glass fiber / epoxy resin composite board (Prepreg board). The second substrate layer 217 may be, but not limited to, a polyimide film (PI film) or a glass fiber / epoxy resin composite board (Prepreg board). The first conductive layer 211' may be, but not limited to, a copper layer, and the second conductive layer 219' may be, but not limited to, a copper layer.

[0142] S304, stacking the first substrate layer 213 / first conductive layer 211' and the second substrate layer 217 / second conductive layer 219' on opposite sides of the magnetic core 10 having the first insulating member 50 and the second insulating member 70, respectively, and making the first conductive layer 211' and the second conductive layer 219' both away from the magnetic core 10 and cover the magnetic core 10, the first insulating member 50 and the second insulating member 70;

[0143] Optionally, the first substrate layer 213 / first conductive layer 211 ′, the second substrate layer 217 / second conductive layer 219 ′, and the magnetic core 10 having the first insulating member 50 and the second insulating member 70 are stacked in sequence and pressed together.

[0144] S305 , etching the first conductive layer 211 ′ and the second conductive layer 219 ′, and depositing conductive material through holes on the first insulating member 50 and the second insulating member 70 to form the coil 30 .

[0145] Optionally, the first conductive layer 211' is exposed, developed, etched, and filmed to obtain a plurality of first conductive wires 31; the second conductive layer 219' is exposed, developed, etched, and filmed to obtain a plurality of second conductive wires 32 arranged at intervals. Vias are made at positions corresponding to the first insulating member 50 and the second insulating member 70 on the stacked first conductive layer 211' / first substrate layer 213 / magnetic core 10+first insulating member 50+second insulating member 70 / second substrate layer 217 / second conductive layer 219', and conductive materials (such as copper) are deposited in the vias to form the first electrical connector 33 and the second electrical connector 34, so that the first conductive wire 31, the first electrical connector 33, the second conductive wire 32, and the second electrical connector 34 are connected in series in sequence to form the coil 30.

[0146] It should be noted that when a plurality of inductors 100 are prepared simultaneously (ie, the board prepared through S301 to S305 includes a plurality of inductors 100 ), it is only necessary to cut the board prepared through S301 to S305 to obtain independent inductors 100 .

[0147] The preparation method of the inductor 100 of this embodiment can be used to prepare a plurality of inductors 100 on a board at the same time. After the preparation is completed, the inductors 100 are cut by laser cutting or die cutting to form individual inductors 100. In addition, the preparation of the inductor 100 of the present application can also be formed in the process of manufacturing a circuit board, and the coil 30 is prepared by using a copper clad laminate forming a circuit board (that is, the first substrate layer 213 / the first conductive layer 211' and the second substrate layer 217 / the second conductive layer 219' are copper clad laminates), thereby preparing an inductor 100 embedded in a circuit board (that is, a circuit board integrated inductor).

[0148] The inductor 100 prepared by the preparation method of the inductor 100 of the embodiment of the present application comprises a magnetic core 10 and a coil 30. The magnetic core 10 has a plurality of first through holes 11 and a plurality of second through holes 12. The coil 30 is alternately arranged in the first through holes 11 and the second through holes 12 in sequence and wound around the magnetic core 10. The coil 30 is insulated from the magnetic core 10. In this way, the magnetic core 10 is not only arranged between the first through hole 11 and the second through hole 12, but also at least between the adjacent first through holes 11 and the adjacent second through holes 12. Therefore, when the size of the inductor 100 is constant, the proportion of the magnetic core 10 in the inductor 100 can be better improved (i.e., it has a higher area utilization rate), the magnetic energy storage capacity of the inductor 100 is increased, and more magnetic energy can be stored, thereby improving the inductance of the inductor 100. In addition, the coil 30 is wound around the magnetic core 10 to form a solenoid structure, and the magnetic core 10 is inside the coil 30, which makes the inductor 100 have advantages such as higher saturation current, less magnetic leakage, and can effectively utilize the uniaxial anisotropy of the magnetic core 10. Furthermore, the collapse pressure F of the magnetic core 10 when the thickness is 0.3mm to 0.5mm is in the range of F≥200N, so that the inductor 100 has higher mechanical properties such as anti-fragmentation, is not easy to be fractured during assembly and use, and has a longer service life.

[0149] The inductor 100 of the embodiment of the present application is further described below by way of specific embodiments.

[0150] Example 1

[0151] The inductor 100 of the present embodiment includes a magnetic core 10 and a coil 30. The magnetic core 10 has a plurality of first through holes 11 and a plurality of second through holes 12. The plurality of first through holes 11 are sequentially arranged at intervals along a first direction. The plurality of second through holes 12 are sequentially arranged at intervals along the first direction. The first through holes 11 and the second through holes 12 are sequentially arranged at intervals along the second direction. The first direction intersects with the second direction. The inductor 100 further includes a first insulating member 50 and a second insulating member 70. The first insulating member 50 is disposed in the first through hole 11 and has a first through hole 51. The second insulating member 70 is disposed in the second through hole 12 and has a second through hole 71.

[0152] The coil 30 is alternately inserted into the first through hole 51 and the second through hole 71 in sequence and wound around the magnetic core 10 . The coil 30 and the magnetic core 10 are insulated from each other.

[0153] The first through hole 11 of this embodiment respectively penetrates the first surface 13, the second surface 14 and the third surface 15 (i.e., the spacing between the first through hole 11 and the third surface 15 is 0, or w1=0), and the second through hole 12 respectively penetrates the first surface 13, the second surface 14 and the fourth surface 16 (i.e., the spacing between the second through hole 12 and the fourth surface 16 is 0, or w2=0). The spacing between the first through hole 11 and the second through hole 12 is 2.6 mm.

[0154] The size of the inductor 100 of this embodiment is: 1.95mm×2.95mm×0.35mm. The size of the magnetic core 10 is: 1.95mm×2.95mm. The magnetic core 10 includes an insulating sublayer 18, a magnetic film sublayer 17 and a bonding sublayer 19 which are alternately stacked in sequence. The number of layers of the magnetic film sublayer 17 is 6 layers, and the thickness of each magnetic film sublayer 17 is 6μm. The material of the magnetic film sublayer 17 is FeNi soft magnetic alloy, and the relative magnetic permeability of the magnetic film sublayer 17 is 230 and the electrical conductivity is 2353KS / m; the insulating sublayer 18 is a polyimide layer (PI), and the thickness of the insulating sublayer 18 is 12μm. The bonding sublayer 19 is an epoxy resin layer, and the thickness of the bonding sublayer 19 is 15μm. The coil 30 has 3.5 turns, and the line width of the coil 30 is 350μm, the line thickness is 60μm, and the line spacing is 120μm. The first insulating member 50 and the second insulating member 70 are both epoxy resin. Figure 7 shown.

[0155] Example 2

[0156] The inductor 100 of the present embodiment includes a magnetic core 10 and a coil 30. The magnetic core 10 has a plurality of first through holes 11 and a plurality of second through holes 12. The plurality of first through holes 11 are sequentially arranged at intervals along a first direction. The plurality of second through holes 12 are sequentially arranged at intervals along the first direction. The first through holes 11 and the second through holes 12 are sequentially arranged at intervals along the second direction. The first direction intersects with the second direction. The inductor 100 further includes a first insulating member 50 and a second insulating member 70. The first insulating member 50 is disposed in the first through hole 11 and has a first through hole 51. The second insulating member 70 is disposed in the second through hole 12 and has a second through hole 71.

[0157] The coil 30 is alternately inserted into the first through hole 51 and the second through hole 71 in sequence and wound around the magnetic core 10 . The coil 30 and the magnetic core 10 are insulated from each other.

[0158] In this embodiment, the first through hole 11 passes through the first surface 13 and the second surface 14 respectively, and the distance between the first through hole 11 and the third surface 15 is 0.225 mm (i.e., w1=0.225 mm). The second through hole 12 passes through the first surface 13 and the second surface 14 respectively, and the distance between the second through hole 12 and the fourth surface 16 is 0.225 mm (i.e., w2=0.225 mm). The distance between the first through hole 11 and the second through hole 12 is 2.15 mm.

[0159] The size of the inductor 100 of this embodiment is: 1.95mm×2.95mm×0.35mm. The size of the magnetic core 10 is: 1.95mm×2.95mm. The magnetic core 10 includes an insulating sublayer 18, a magnetic film sublayer 17 and a bonding sublayer 19 which are alternately stacked in sequence. The number of layers of the magnetic film sublayer 17 is 6 layers, and the thickness of each magnetic film sublayer 17 is 6μm. The material of the magnetic film sublayer 17 is FeNi soft magnetic alloy, and the relative magnetic permeability of the magnetic film sublayer 17 is 230 and the electrical conductivity is 2353KS / m; the insulating sublayer 18 is a polyimide layer (PI), and the thickness of the insulating sublayer 18 is 12μm. The bonding sublayer 19 is an epoxy resin layer, and the thickness of the bonding sublayer 19 is 15μm. The coil 30 has 3.5 turns, and the line width of the coil 30 is 350μm, the line thickness is 60μm, and the line spacing is 120μm. The first insulating member 50 and the second insulating member 70 are both epoxy resin. Figure 8 shown.

[0160] Comparative Example 1

[0161] The inductor 100 of the comparative example includes a magnetic core 10 and a coil 30 . The coil 30 is disposed around the outer circumference of the magnetic core 10 .

[0162] The size of the inductor 100 of this comparative example is: 1.95mm×2.95mm×0.35mm. The size of the magnetic core 10 is: 1.95mm×1.95mm. The magnetic core 10 includes an insulating sublayer 18, a magnetic film sublayer 17 and a bonding sublayer 19 which are alternately stacked in sequence. The number of layers of the magnetic film sublayer 17 is 6 layers, and the thickness of each magnetic film sublayer 17 is 6μm. The material of the magnetic film sublayer 17 is FeNi soft magnetic alloy, and the relative magnetic permeability of the magnetic film sublayer 17 is 230 and the electrical conductivity is 2353KS / m; the insulating sublayer 18 is a polyimide layer (PI), and the thickness of the insulating sublayer 18 is 12μm. The bonding sublayer 19 is an epoxy resin layer, and the thickness of the bonding sublayer 19 is 15μm. The coil 30 has 3.5 turns, and the line width of the coil 30 is 350μm, the line thickness is 60μm, and the line spacing is 120μm. The structural diagram of the inductor 100 of this comparative example is as follows Fig.14 shown. Fig.14 It is a schematic structural diagram of the inductor 100 of comparative example 1 of the present application.

[0163] The inductance and DC resistance of Example 1, Example 2 and Comparative Example 1 were measured using GB / T 8554-1998, and the test results are shown in Table 1. The magnetic flux density distribution of Example 1, Example 2 and Comparative Example 1 was simulated using Ansys Maxwell software. The magnetic flux density distribution cloud diagram of the inductor 100 of Example 1 along its extension plane is shown in Fig.15 As shown, the magnetic flux density distribution cloud diagram of the inductor 100 of Example 2 along its extension plane is as follows Fig.16 As shown, the magnetic flux density distribution cloud diagram of the inductor 100 of comparative example 1 along its extension plane is as follows Fig.17 shown.

[0164] Table 1 Parameter information of each embodiment and comparative example

[0165] Example Example 1 Example 2 Comparative Example 1 w1 / w2(mm) 0 0.225 / Core 10 Size 1.95mm×2.95mm 1.95mm×2.95mm 1.95mm×1.95mm Inductance L(nH) 43.4 47.1 33.9 DCR(mΩ) 16.8 14.2 16.8

[0166] It can be seen from Table 1 that, when the size of the inductor 100 is the same, Example 1 using the solution of the present application has a larger magnetic core 10 size, so that Example 1 has a higher inductance than Comparative Example 1 (the inductance is increased by nearly 30%), while keeping the DC resistance (DCR) unchanged.

[0167] Depend on Fig.15 and Fig.17It can be seen from the magnetic density distribution cloud diagram that in Example 1, in addition to the magnetic core 10 in the middle of the coil 30 that can store magnetic energy, the magnetic core 10 outside the coil 30 can also store magnetic energy, so that the magnetic core 10 can store more magnetic energy, so that the inductor 100 has a higher inductance. In Comparative Example 1, only the magnetic core 10 in the middle of the coil 30 can store magnetic energy, and the magnetic core 10 outside the coil 30 cannot store magnetic energy, so that the inductor 100 has a lower inductance.

[0168] From the test results of Example 1 and Example 2 in Table 1, it can be seen that when the spacing between the first through hole 11 and the second through hole 12 and the edge of the magnetic core 10 is increased from 0 to 0.225 mm, under the same size of the inductor 100 and the size of the magnetic core 10, Example 2 has a higher inductance and a lower DC resistance than Example 1. Fig.15 and Fig.16 It can be seen from the magnetic density distribution cloud diagram that compared with Example 1, more magnetic materials constituting the magnetic core 10 are distributed around the first through hole 11 (or the first electrical connector 33) and the second through hole 12 (or the second electrical connector 34) in Example 2, and the magnetic core 10 in the first through hole 11 and the second through hole 12 area is easier to form a complete closed magnetic circuit, so that Example 2 has a higher magnetic flux density and a higher inductance than Example 1.

[0169] Example 3

[0170] The inductor 100 of the present embodiment includes a magnetic core 10 and a coil 30. The magnetic core 10 has a plurality of first through holes 11 and a plurality of second through holes 12. The plurality of first through holes 11 are sequentially arranged at intervals along a first direction. The plurality of second through holes 12 are sequentially arranged at intervals along the first direction. The first through holes 11 and the second through holes 12 are sequentially arranged at intervals along the second direction. The first direction intersects with the second direction. The inductor 100 further includes a first insulating member 50 and a second insulating member 70. The first insulating member 50 is disposed in the first through hole 11 and has a first through hole 51. The second insulating member 70 is disposed in the second through hole 12 and has a second through hole 71.

[0171] The coil 30 is alternately inserted into the first through hole 51 and the second through hole 71 in sequence and wound around the magnetic core 10 . The coil 30 and the magnetic core 10 are insulated from each other.

[0172] In this embodiment, the first through hole 11 passes through the first surface 13 and the second surface 14 respectively, and the distance between the first through hole 11 and the third surface 15 is 0.225 mm (i.e., w1=0.225 mm). The second through hole 12 passes through the first surface 13 and the second surface 14 respectively, and the distance between the second through hole 12 and the fourth surface 16 is 0.225 mm (i.e., w2=0.225 mm). The distance between the first through hole 11 and the second through hole 12 is 2.15 mm.

[0173] The size of the inductor 100 of this embodiment is: 1.95mm×2.95mm×0.35mm. The size of the magnetic core 10 is: 1.95mm×2.95mm. The magnetic core 10 includes an insulating sublayer 18, a magnetic film sublayer 17 and a bonding sublayer 19 which are alternately stacked in sequence. The number of layers of the magnetic film sublayer 17 is 6 layers, and the thickness of each magnetic film sublayer 17 is 6μm. The material of the magnetic film sublayer 17 is FeNi soft magnetic alloy, and the relative magnetic permeability of the magnetic film sublayer 17 is 230 and the electrical conductivity is 2353KS / m; the insulating sublayer 18 is a polyimide layer (PI), and the thickness of the insulating sublayer 18 is 12μm. The bonding sublayer 19 is an epoxy resin layer, and the thickness of the bonding sublayer 19 is 15μm. The coil 30 has 3.5 turns, and the line width of the coil 30 is 350μm, the line thickness is 60μm, and the line spacing is 120μm. The first insulating member 50 and the second insulating member 70 both include FeNi soft magnetic alloy and epoxy resin. The relative magnetic permeability of the first insulating member 50 and the second insulating member 70 is 10.

[0174] The inductance and DC resistance of Example 3 were measured using GB / T 8554-1998. The test results are shown in Table 2 below.

[0175] Table 2 Parameter information of each embodiment 2 and embodiment 3

[0176] Example Example 2 Example 3 w1 / w2(mm) 0.225 0.225 Core 10 Size 1.95mm×2.95mm 1.95mm×2.95mm Inductance L(nH) 47.1 49.0 DCR(mΩ) 14.2 14.2

[0177] From the test results of Example 2 and Example 3 in Table 2, it can be seen that when the size of the inductor 100 is the same, the positions of the first through hole 11 and the second through hole 12 and other parameters are the same, compared with Example 2 in which only epoxy resin is filled, Example 3 fills both the first through hole 11 and the second through hole 12 with FeNi soft magnetic alloy and epoxy resin, and the obtained inductor 100 has a higher inductance (the inductance is increased by nearly 4%), and the DC resistance (DCR) remains unchanged.

[0178] Example 4

[0179] The inductor 100 of this embodiment includes a magnetic core 10 and a coil 30 . The coil 30 is disposed around the outer circumference of the magnetic core 10 .

[0180] The magnetic core 10 of this embodiment includes an insulating sublayer 18, a magnetic film sublayer 17 and a bonding sublayer 19 which are alternately stacked in sequence, wherein the number of layers of the magnetic film sublayer 17 is 8, the thickness of each magnetic film sublayer 17 is 6μm, the material of the magnetic film sublayer 17 is FeNi soft magnetic alloy, the relative magnetic permeability of the magnetic film sublayer 17 is 230, and the electrical conductivity is 2353KS / m; the number of layers of the insulating sublayer 18 is 8, the insulating sublayer 18 is a polyimide layer (PI), the thickness of the insulating sublayer 18 is 12.5μm, the number of layers of the bonding sublayer 19 is 9, the bonding sublayer 19 is an epoxy resin layer, and the thickness of the bonding sublayer 19 is 15μm.

[0181] The coil 30 of this embodiment has 3.5 turns, a line width of 350 μm, a line thickness of 60 μm, and a line spacing of 120 μm.

[0182] Comparative Example 2

[0183] The inductor 100 of the comparative example includes a magnetic core 10 and a coil 30 . The coil 30 is disposed around the outer circumference of the magnetic core 10 .

[0184] The magnetic core 10 of this comparative example includes an insulating sublayer 18, a magnetic film sublayer 17 and a bonding sublayer 19 which are alternately stacked in sequence, wherein the number of layers of the magnetic film sublayer 17 is 8, the thickness of each magnetic film sublayer 17 is 6μm, the material of the magnetic film sublayer 17 is a composite material of FeSiCr and epoxy resin, the mass fraction of FeSiCr in the magnetic film sublayer 17 is 97%, the particle size of FeSiCr is 3μm, and the relative magnetic permeability of the magnetic film sublayer 17 is 25; the number of layers of the insulating sublayer 18 is 8, the insulating sublayer 18 is a polyimide layer (PI), the thickness of the insulating sublayer 18 is 12.5μm, the number of layers of the bonding sublayer 19 is 9, the bonding sublayer 19 is an epoxy resin layer, and the thickness of the bonding sublayer 19 is 15μm.

[0185] The coil 30 of this comparative example has 3.5 turns, a line width of 350 μm, a line thickness of 60 μm, and a line spacing of 120 μm.

[0186] The size of the inductor 100 prepared in Example 4 and Comparative Example 2 is 1.4 mm×1.2 mm×0.4 mm, and a collapse pressure test is performed using a vertical push-pull force gauge.

[0187] Collapse pressure test method: Support the two sides of the inductor 100, suspend the middle part, and contact the inductor 100 with the pressure head to apply a certain pressure to the inductor 100, so that the inductor 100 begins to deform. Move the pressure head slowly from top to bottom, and the pressure gradually increases until the pressure suddenly changes. Stop the test, and take the force value (i.e. the maximum force value) when the pressure suddenly changes as the collapse pressure.

[0188] The inductor 100 of Example 4 has no sudden pressure change when the pressure reaches 200N, indicating that its collapse pressure is greater than 200N, and the collapse pressure of the inductor 100 of Comparative Example 2 is 25N. The test results show that the magnetic film sublayer 17 material (FeNi) of the present application used in Example 4 has a higher collapse pressure than the soft magnetic composite material (FeSiCr and epoxy resin composite material), so that the inductor 100 has higher mechanical properties such as anti-fragmentation, is not easy to break during assembly and use, and has a longer service life.

[0189] Fig.18 Schematic diagram of the structure of a circuit board integrated inductor 200 according to an embodiment of the present application.

[0190] See also Fig.18 The embodiment of the present application provides a circuit board integrated inductor 200 , which includes a circuit board 210 and the inductor 100 of the embodiment of the present application, and the inductor 100 is carried on the circuit board 210 .

[0191] For a detailed description of the inductor 100 , please refer to the description of the corresponding part of the above embodiment, which will not be repeated here.

[0192] The circuit board integrated inductor 200 of the embodiment of the present application includes an inductor 100, and the inductor 100 includes a magnetic core 10 and a coil 30. The magnetic core 10 has a plurality of first through holes 11 and a plurality of second through holes 12; the coil 30 is alternately arranged in the first through holes 11 and the second through holes 12 in sequence, and is wound around the magnetic core 10, and the coil 30 is insulated from the magnetic core 10. In this way, the magnetic core 10 is not only arranged between the first through hole 11 and the second through hole 12, but also at least between the adjacent first through holes 11 and the adjacent second through holes 12. Therefore, when the size of the inductor 100 is constant, the proportion of the magnetic core 10 in the inductor 100 can be better improved (i.e., it has a higher area utilization rate), the magnetic energy storage capacity of the inductor 100 is increased, and more magnetic energy can be stored, thereby improving the inductance of the inductor 100. In addition, the coil 30 is wound around the magnetic core 10 to form a solenoid structure, and the magnetic core 10 is inside the coil 30, which makes the inductor 100 have advantages such as higher saturation current, less magnetic leakage, and can effectively utilize the uniaxial anisotropy of the magnetic core 10. Furthermore, the collapse pressure F of the magnetic core 10 when the thickness is 0.3mm to 0.5mm is in the range of F≥200N, so that the inductor 100 has higher mechanical properties such as anti-fragmentation, is not easy to be fractured during assembly and use, and has a longer service life.

[0193] Optionally, the circuit board 210 may be, but is not limited to, a printed circuit board (PCB) or a flexible circuit board (FPC).

[0194] Fig.19The circuit board integrated inductor 200 of an embodiment of the present application is Fig.18 Section view in the QQ direction. Fig.19 Optionally, the inductor 100 is embedded in the circuit board 210, and the circuit board 210 includes a first circuit layer 211, a first substrate layer 213, a support layer 215, a second substrate layer 217 and a second circuit layer 219 which are stacked in sequence. The coil 30 is partially formed in the conductive layer used to prepare the first circuit layer 211 and the second circuit layer 219, and the magnetic core 10 is embedded in the support layer 215. It can be understood that the magnetic core 10 is located between the first substrate layer 213 and the second substrate layer 217. In this embodiment, the inductor 100 is embedded in the inside of the circuit board 210, which can make full use of the internal space of the circuit board 210, thereby reducing the overall thickness of the circuit board integrated inductor 200, which can better save the surface area of ​​the circuit board 210, improve the wiring and component capabilities of the circuit board 210, reduce the cumbersome mounting of the inductor 100, and greatly improve the packaging efficiency. In addition, the coil 30 of the inductor 100 is formed by the first circuit layer 211 and the second circuit layer 219 of the circuit board 210 in the process of the circuit board 210, and the embedding of the inductor 100 can be completed in the process of the circuit board 210, which greatly simplifies the preparation process of the inductor 100 and improves the production efficiency. In addition, the first circuit layer 211 and the second circuit layer 219 of the circuit board 210 are used to prepare the coil 30, so that the size of the inductor 100 can be better reduced, especially the thickness of the inductor 100 is greatly reduced, which is conducive to the miniaturization of the circuit board integrated inductor 200.

[0195] Optionally, the first circuit layer 211 may be, but is not limited to, a copper circuit layer. The second circuit layer 219 may be, but is not limited to, a copper circuit layer.

[0196] Optionally, the first circuit layer 211 and the first conductive line 31 are arranged in the same layer, and the second circuit layer 219 and the second conductive line 32 are arranged in the same layer.

[0197] In some other embodiments, the inductor 100 may be manufactured first and then mounted on the surface of the circuit board 210 by surface mounting.

[0198] It can be understood that the circuit board integrated inductor 200 in this embodiment is merely a form of the circuit board integrated inductor 200 applied to the inductor 100, and should not be understood as a limitation on the circuit board integrated inductor 200 provided in the present application, nor should it be understood as a limitation on the inductor 100 provided in each embodiment of the present application.

[0199] Fig. 20 It is a structural diagram of a charging device 400 according to an embodiment of the present application. Fig.21 4 is a circuit block diagram of a charging device 400 according to an embodiment of the present application.

[0200] See also Fig. 20 and Fig.21 An embodiment of the present application provides a charging device 400, which includes an inductor 100 of the embodiment of the present application or a circuit board integrated inductor 200 of the embodiment of the present application, and a first processor 410. The first processor 410 is electrically connected to the circuit board integrated inductor 200 or the coil 30 in the inductor 100, and the first processor 410 is used to control the magnitude and direction of the current flowing through the coil 30.

[0201] For detailed descriptions of the inductor 100 and the circuit board integrated inductor 200 , please refer to the descriptions of the corresponding parts of the above embodiments, which will not be repeated here.

[0202] Optionally, the charging device 400 may be, but is not limited to, at least one of a power adapter (computer adapter, mobile phone adapter, etc.), a mobile phone charger, etc. The charging device 400 may charge electronic devices such as mobile phones, tablet computers, portable game consoles, e-readers, smart watches, smart bracelets, audio players, desktop computers, etc. It is understandable that the charging device 400 in this embodiment is only a form of the charging device 400 used by the inductor 100 or the circuit board integrated inductor 200, and should not be understood as a limitation on the charging device 400 provided in this application, nor should it be understood as a limitation on the inductor 100 or the circuit board integrated inductor 200 provided in each embodiment of this application.

[0203] Optionally, the first processor 410 includes one or more general-purpose processors, wherein the general-purpose processor can be any type of device capable of processing electronic instructions, including a central processing unit (CPU), a microprocessor, a microcontroller, a main processor, a controller, and an ASIC, etc. The first processor 410 is used to execute various types of digital storage instructions, such as software or firmware programs stored in a memory, which enables the computing device to provide a wide variety of services.

[0204] Optionally, the charging device 400 further includes a housing 430 , and the housing 430 is used to accommodate components of the charging device 400 such as the inductor 100 or the circuit board integrated inductor 200 , and the first processor 410 .

[0205] Fig. 22 It is a schematic structural diagram of an electronic device 500 according to an embodiment of the present application. Fig.23 It is a schematic diagram of a partial exploded structure of an electronic device 500 according to an embodiment of the present application. Fig.24 It is a circuit block diagram of an electronic device 500 according to an embodiment of the present application.

[0206] See also Figure 22 to Figure 24An embodiment of the present application provides an electronic device 500, which includes a display screen 510, an inductor 100 of an embodiment of the present application or a circuit board integrated inductor 200 of an embodiment of the present application, and a second processor 530. The second processor 530 is electrically connected to the coil 30 in the circuit board integrated inductor 200 or the inductor 100. The second processor 530 is used to control the magnitude and direction of the current flowing through the coil 30. The second processor 530 is also electrically connected to the display screen 510 to control the display screen 510 to display.

[0207] For a detailed description of the inductor 100 or the circuit board integrated inductor 200 , please refer to the description of the corresponding part of the above embodiment, which will not be repeated here.

[0208] The electronic device 500 of the embodiment of the present application may be, but is not limited to, a mobile phone, a tablet computer, a laptop computer, a desktop computer, a smart bracelet, a smart watch, an e-reader, a game console, and other portable electronic devices 500. It can be understood that the electronic device 500 in this embodiment is only a form of the electronic device 500 to which the inductor 100 or the circuit board integrated inductor 200 is applied, and should not be understood as a limitation on the electronic device 500 provided in the present application, nor should it be understood as a limitation on the inductor 100 or the circuit board integrated inductor 200 provided in each embodiment of the present application.

[0209] Optionally, the display screen 510 may be, but is not limited to, one or more of a liquid crystal display screen, a light emitting diode display screen (LED display screen), a micro light emitting diode display screen (Micro LED display screen), a sub-millimeter light emitting diode display screen (Mini LED display screen), an organic light emitting diode display screen (OLED display screen), etc.

[0210] Optionally, the second processor 530 includes one or more general-purpose processors, wherein the general-purpose processor can be any type of device capable of processing electronic instructions, including a central processing unit (CPU), a microprocessor, a microcontroller, a main processor, a controller, and an ASIC, etc. The second processor 530 is used to execute various types of digital storage instructions, such as software or firmware programs stored in the memory 550, which enables the computing device to provide a wide variety of services.

[0211] Optionally, the electronic device 500 of the present application further includes a memory 550. The memory 550 is electrically connected to the second processor 530 and is used to store program codes required for the second processor 530 to run, program codes required for controlling the display screen 510 and the inductor 100 or the circuit board integrated inductor 200, and display content of the display screen 510.

[0212] Optionally, the memory 550 may include a volatile memory (Volatile Memory), such as a random access memory (Random Access Memory, RAM); the memory 550 may also include a non-volatile memory (NVM), such as a read-only memory (Read-Only Memory, ROM), a flash memory (Flash Memory, FM), a hard disk drive (Hard Disk Drive, HDD) or a solid-state drive (SSD). The memory 550 may also include a combination of the above-mentioned types of memory.

[0213] Optionally, the electronic device 500 of the embodiment of the present application further includes a housing 520. The housing 520 and the display screen 510 enclose a receiving space for receiving components of the electronic device 500 such as the second processor 530, the memory 550, and the inductor 100 or the circuit board integrated inductor 200.

[0214] Mentioning "embodiment" and "implementation method" in this application means that the specific features, structures or characteristics described in conjunction with the embodiment may be included in at least one embodiment of the present application. The appearance of phrases in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments. In addition, it should also be understood that the features, structures or characteristics described in the various embodiments of the present application can be arbitrarily combined to form another embodiment that does not deviate from the spirit and scope of the technical solution of the present application, if there is no contradiction between them.

[0215] Finally, it should be noted that the above implementation modes are only used to illustrate the technical solution of the present application and are not intended to limit it. Although the present application has been described in detail with reference to the above preferred implementation modes, a person of ordinary skill in the art should understand that the technical solution of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present application.

Claims

1. An inductor, characterized in that: include: A magnetic core, wherein the magnetic core has a plurality of first through holes and a plurality of second through holes, wherein the plurality of first through holes are sequentially arranged at intervals along a first direction, wherein the plurality of second through holes are sequentially arranged at intervals along the first direction, wherein the first through holes and the second through holes are spaced apart along the second direction, wherein the collapse pressure F of the magnetic core when the thickness is 0.3 mm to 0.5 mm is in the range of F ≥ 200 N, wherein the first direction intersects with the second direction; as well as The coil is alternately inserted into the first through hole and the second through hole in sequence and wound around the magnetic core, and the coil is insulated from the magnetic core.

2. The inductor according to claim 1, characterized in that The magnetic core includes a first surface and a second surface arranged opposite to each other, the first through hole penetrates the first surface and the second surface respectively, and the second through hole penetrates the first surface and the second surface respectively; the magnetic core also includes a third surface and a fourth surface arranged opposite to each other along a second direction, the third surface connects the first surface and the second surface respectively, and the fourth surface connects the first surface and the second surface respectively, the first through hole is arranged closer to the third surface than the second through hole, the first through hole also penetrates the third surface or the first through hole and the third surface are arranged at intervals, the second through hole is arranged closer to the fourth surface than the first through hole, the second through hole also penetrates the fourth surface or the second through hole and the fourth surface are arranged at intervals.

3. The inductor according to claim 2, characterized in that The range of the distance w1 between the first through hole and the third surface is: 0≤w1≤0.6 mm; the range of the distance w2 between the second through hole and the fourth surface is: 0≤w2≤0.6 mm.

4. The inductor according to claim 2, characterized in that The coil includes a plurality of first conductive wires, a plurality of second conductive wires, a plurality of first electrical connectors, and a plurality of second electrical connectors, wherein the first conductive wires, the first electrical connectors, the second conductive wires, and the second electrical connectors are alternately connected in series in sequence; the plurality of first conductive wires are sequentially arranged on the first surface at intervals along a first direction, and the plurality of second conductive wires are sequentially arranged on the second surface at intervals along the first direction, each of the first electrical connectors is passed through the first through hole and corresponds to one of the first through holes in a one-to-one manner, and each of the second electrical connectors is passed through the second through hole and corresponds to one of the second through holes in a one-to-one manner.

5. The inductor according to claim 4, characterized in that The range of the distance s1 between the first electrical connector and the magnetic core is: 0.05 mm≤s1≤0.3 mm; the range of the distance s2 between the second electrical connector and the magnetic core is: 0.05 mm≤s2≤0.3 mm.

6. The inductor according to claim 4, characterized in that The inductor further comprises: A first insulating member, the first insulating member is disposed in the first through hole, the first insulating member has a first through hole, and the first through hole is used to penetrate the first electrical connector; and The second insulating member is disposed in the second through hole, and the second insulating member has a second through hole, and the second through hole is used for passing the second electrical connecting member.

7. The inductor according to claim 6, characterized in that The first insulating member includes first magnetic particles and a first insulating resin, the first magnetic particles are dispersed in the second insulating resin, and the mass fraction of the first magnetic particles in the first insulating member ranges from 80% to 95%; the second insulating member includes second magnetic particles and a second insulating resin, the second magnetic particles are dispersed in the second insulating resin, and the mass fraction of the second magnetic particles in the second insulating member ranges from 80% to 95%.

8. A circuit board integrated inductor, characterized in that: include: Circuit boards; as well as The inductor according to any one of claims 1 to 7, wherein the inductor is carried on the circuit board.

9. The circuit board integrated inductor according to claim 8, characterized in that: The inductor is embedded in the circuit board, and the circuit board includes a first circuit layer, a first substrate layer, a support layer, a second substrate layer and a second circuit layer stacked in sequence. The coil part is formed on a conductive layer used to prepare the first circuit layer and the second circuit layer, and the magnetic core is embedded in the support layer.

10. A charging device, characterized in that: include: The inductor according to any one of claims 1 to 7 or the circuit board integrated inductor according to claim 8 or 9; as well as A first processor is electrically connected to the circuit board integrated inductor or the coil in the inductor, and the first processor is used to control the magnitude and direction of the current flowing through the coil.

11. An electronic device, characterized in that: include: Display screen; The inductor according to any one of claims 1 to 7 or the circuit board integrated inductor according to claim 8 or 9; as well as The second processor is electrically connected to the circuit board integrated inductor or the coil in the inductor, and the second processor is used to control the magnitude and direction of the current flowing through the coil. The second processor is also electrically connected to the display screen to control the display screen to display.

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