Bonding device and bonding method

Abstract

The invention relates to a bonding apparatus and a bonding method. The joining apparatus includes: a stage configured to fix a first electrical component; a pressing unit configured to press the conductive adhesive film and the second electrical component onto the first electrical component; a driver configured to control movement of the pressing unit in a first direction; and a plurality of sensors located at different positions on the stage and configured to sense a change in capacitance with the pressing unit, in which the pressing unit includes a flat metal material in a first region facing the plurality of sensors.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2018-0149841 filed in the Korean Intellectual Property Office on November 28, 2018, the entire contents of which are incorporated herein by reference. Technical Field

[0003] Embodiments of the present invention relate to a bonding apparatus and a bonding method. Background Art

[0004] Typically, an electrical device (eg, an electronic device) includes a plurality of electrical components.

[0005] Electric devices such as portable phones, laptop computers, and televisions generally include a display panel configured to display an image, a main wiring substrate, and a flexible wiring substrate.

[0006] When two electrical components are electrically connected to each other, they may be electrically connected by bonding of the pad units. The process for electrically connecting the pad units of the two electrical components to each other may include a process of aligning and bonding the pad units of the two electrical components to each other (hereinafter, referred to as a bonding process). Summary of the invention

[0007] Exemplary embodiments of the present invention provide a bonding apparatus and a bonding method having a structure capable of reducing defects during a bonding process (eg, capable of reducing a defect rate occurring during a bonding process).

[0008] A bonding device according to an exemplary embodiment of the present invention includes: a table configured to fix a first electrical component; a pressing unit configured to press a conductive adhesive film and a second electrical component onto the first electrical component; a driver configured to control movement of the pressing unit along a first direction; and a plurality of sensors located at different positions on the table and configured to sense changes in capacitance with the pressing unit, wherein the pressing unit includes a flat metal material in a first area facing the plurality of sensors.

[0009] In addition, the pressing unit may include: a pressing head connected to the driver; a pressing tip configured to press the conductive adhesive film and the second electrical component when the pressing head moves toward the stage along the first direction; and a heat source extending from the pressing head and configured to transfer heat to the conductive adhesive film and the second electrical component when the pressing head moves toward the stage along the first direction.

[0010] Additionally, the plurality of sensors may be configured to sense a change in capacitance when the pressing head moves along the first direction.

[0011] Furthermore, the pressing head may include: a body coupled to the driver, the first area being located on the body; and a connecting portion extending between the body and the pressing tip, wherein a cross-sectional area of ​​the connecting portion decreases as a distance from the body increases.

[0012] Furthermore, the connecting portion may extend from the body in a second region, the second region being different from the first region.

[0013] Additionally, the heat source may surround at least a portion of the body at at least one side of the body.

[0014] Furthermore, a cross-sectional area of ​​the body in the first region may be smaller than a cross-sectional area of ​​the body in the second region.

[0015] Furthermore, the capacitance may vary in response to a change in the distance between each of the plurality of sensors and the pressing unit.

[0016] Furthermore, in a balanced state of the pressing unit, when the pressing unit presses, a change in capacitance sensed in each of the plurality of sensors may be the same.

[0017] A bonding method according to an exemplary embodiment of the present invention includes: fixing a first electrical component on a stage; attaching a conductive adhesive film to the first electrical component; arranging a second electrical component on the conductive adhesive film; arranging a dummy film on the second electrical component; pressing the conductive adhesive film, the second electrical component and the dummy film by driving a pressing unit; and removing the dummy film, wherein a first side of the dummy film in contact with the second electrical component is adhesive.

[0018] Additionally, the first side of the dummy film may be configured to remove particles that flow onto the second electrical component.

[0019] Furthermore, a plurality of sensors may be positioned at different positions on the stage, and pressing the conductive adhesive film, the second electrical component, and the dummy film by driving the pressing unit may include sensing a change in capacitance between each of the plurality of sensors and the pressing unit.

[0020] In addition, the bonding method may further include controlling a balanced state of the pressing unit based on a result of sensing a change in capacitance between each of the plurality of sensors and the pressing unit.

[0021] Furthermore, the capacitance may vary in response to a change in the distance between each of the plurality of sensors and the pressing unit.

[0022] Furthermore, in a balanced state of the pressing unit, when the pressing unit presses, a change in capacitance sensed in each of the plurality of sensors may be the same.

[0023] The bonding apparatus and the bonding method according to the exemplary embodiment of the present invention may reduce a defect rate caused by mechanical defects or particles of a pressing unit during a bonding process. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a plan view of an electric device according to an exemplary embodiment of the present invention.

[0025] Figure 2 It is along Figure 1 A cross-sectional view taken along line II'.

[0026] Figure 3 is a side view of a second electric component according to an exemplary embodiment of the present invention.

[0027] Figure 4 is a plan view of a second electric component according to an exemplary embodiment of the present invention.

[0028] Figure 5 yes Figure 1 1 is a plan view of the separated pad units of the two electrical components shown in FIG.

[0029] Figure 6 yes Figure 1 FIG. 1 is a plan view of a combined pad unit of two electrical components shown in FIG.

[0030] Figure 7 is a schematic diagram of the structure of a bonding device according to an exemplary embodiment of the present invention.

[0031] FIG. 8A to FIG. 8F is used Figure 7 Schematic diagram of the process of joining electrical components using the joining device shown in FIG.

[0032] 9A to 9C is a schematic diagram of a structure of a pressing unit according to an exemplary embodiment of the present invention.

[0033] FIG. 10A to FIG. 10C is a schematic diagram of a structure of a pressing unit according to an exemplary embodiment of the present invention.

[0034] FIG. 11A to FIG. 11C is a schematic diagram of a structure of a pressing unit according to an exemplary embodiment of the present invention.

[0035] Figure 12 to Figure 14 is a graph illustrating a method of determining a balance state of a pressing unit using sensor measurement according to various exemplary embodiments of the present invention. DETAILED DESCRIPTION

[0036] Hereinafter, exemplary embodiments will be described in more detail with reference to the accompanying drawings. However, the present invention can be implemented in a variety of different forms and should not be construed as being limited only to the embodiments shown herein. More specifically, these embodiments are provided as examples so that the present disclosure will be comprehensive and complete, and will fully convey the aspects and features of the present invention to those skilled in the art. Therefore, processes, elements and techniques that are unnecessary for a person of ordinary skill in the art to fully understand the aspects and features of the present invention may not be described or may not be shown in the accompanying drawings. Unless otherwise stated, in all drawings and written descriptions, the same reference numerals refer to the same elements, and therefore, their descriptions may not be repeated. In the accompanying drawings, for clarity, the relative sizes of elements, layers and regions may be exaggerated.

[0037] It will be understood that although the terms "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms are used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Therefore, without departing from the spirit and scope of the present invention, the first element, first component, first region, first layer or first section described below may be referred to as the second element, second component, second region, second layer or second section.

[0038] For ease of description, spatially relative terms such as "below", "below", "lower", "under", "above", "upper", etc. may be used herein to describe the relationship of an element or feature to another element (or elements) or feature (or features) as shown in the figures. It should be understood that in addition to the orientation depicted in the figures, the spatially relative terms are intended to include different orientations of the device in use or operation. For example, if the device in the drawings is turned over, the elements described as being "below" or "below" or "under" other elements or features will then be oriented "above" the other elements or features. Therefore, the exemplary terms "below" and "under" can include both above and below orientations. The device can be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein should be interpreted accordingly.

[0039] It will be understood that when an element or layer is referred to as being "on," "connected to," or "coupled to" another element or layer, it can be directly on, directly connected to, or directly coupled to the other element or layer, or there may be one or more intervening elements or layers. Additionally, it will be understood that when an element or layer is referred to as being "between" two elements or layers, it can be the only element or layer between the two elements or layers, or there may also be one or more intervening elements or layers.

[0040] The term used herein is for the purpose of describing a specific embodiment, and is not intended to limit the present invention. As used herein, the singular form "a" and "an" are intended to also include plural forms, unless the context clearly states otherwise. It will be further understood that when used in this specification, the terms "comprises", "comprising", "includes" and "including" specify the existence of the features, integral bodies, steps, operations, elements and / or parts set forth, but do not exclude the existence or addition of one or more other features, integral bodies, steps, operations, elements, parts and / or their combinations. As used herein, the term "and / or" includes any and all combinations of one or more of the related listed items. When a statement such as "at least one of ... " is located after the list of elements, it modifies the elements of the entire list rather than the individual elements in the list.

[0041] As used herein, the terms "substantially", "approximately" and similar terms are used as approximate terms rather than as terms of degree, and are intended to allow for inherent deviations in measurements or calculations that will be recognized by those of ordinary skill in the art. In addition, the "may" used in describing embodiments of the present invention represents "one or more embodiments of the present invention". In addition, alternative language (such as, "or") used for each listed corresponding item in describing embodiments of the present invention represents "one or more embodiments of the present invention". As used herein, the terms "use", "using" and "used" may be understood as synonymous with the terms "utilize", "utilizing" and "utilized", respectively. In addition, the term "exemplary" is intended to represent an example or diagram.

[0042] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present invention belongs. It should also be understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and / or this specification, and should not be interpreted in an idealized or overly formal sense unless explicitly defined as such herein.

[0043] Figure 1 is a plan view showing an electric device according to an exemplary embodiment of the present invention, and Figure 2 It is along Figure 1 A cross-sectional view taken along line II'. Figure 3 is a side view of a second electrical component according to an exemplary embodiment of the present invention, and Figure 4 is a plan view of a second electric component according to an exemplary embodiment of the present invention.

[0044] refer to Figure 1 and Figure 2 , an electrical device 100 according to an exemplary embodiment of the present invention includes a first electrical component 110, a second electrical component 120, and a third electrical component 130. The first electrical component 110, the second electrical component 120, and the third electrical component 130 are electrically connected to each other. In an exemplary embodiment of the present invention, the first electrical component 110 may be an electro-optical panel, the second electrical component 120 may be a connection wiring substrate, and the third electrical component 130 may be a main circuit board. According to an exemplary embodiment of the present invention, the electrical device 100 may include three second electrical components 120, but the present invention is not limited thereto and may include any suitable number of second electrical components 120. For example, depending on the purpose or size of the electrical device 100, the electrical device 100 may include one second electrical component 120, two second electrical components 120, or three or more second electrical components 120.

[0045] like Figure 1 As shown in , the first electrical component 110 (hereinafter, also referred to as a display panel or an electro-optical panel) may be a display panel 110 configured to display an image by applying a driving signal to a plurality of pixels PX. The plurality of pixels PX may be arranged in a matrix form in a first direction DR1 and a second direction DR2 perpendicular to each other. In an exemplary embodiment of the present invention, each of the pixels PX may display one of red, green, and blue. However, the present invention is not limited thereto. For example, the pixel PX may display one of white, cyan, and magenta. The pixel PX may be defined as a display portion of the display panel 110.

[0046] The display panel 110 may be one of a liquid crystal display panel, an organic light emitting display panel, and an electrowetting display panel according to the type of the pixel PX. Hereinafter, for convenience of description, the display panel 110 is described as an organic light emitting display panel, but the present invention is not limited thereto.

[0047] In a plan view, the display panel 110 may be divided into a display area DA in which a plurality of pixels PX are disposed, a non-display area BA surrounding the display area DA, and a mounting area MA to which the second electrical component 120 is coupled. In an exemplary embodiment of the present invention, the non-display area BA and the mounting area MA may not be distinguished (e.g., the non-display area BA and the mounting area MA may have substantially the same characteristics). In some embodiments, the non-display area BA may be omitted, or the mounting area MA may be a part of the non-display area BA.

[0048] like Figure 2As shown in , the display panel 110 may include a base substrate SUB, a first layer DP-CL (e.g., a circuit layer), a second layer DP-OLED (e.g., an organic light emitting element layer), and a thin film encapsulation layer TFE. The base substrate SUB may include a first layer SUB1 and a second layer SUB2. The first layer SUB1 may correspond to a display area DA and a non-display area BA, and the second layer SUB2 may correspond to a mounting area MA. In another exemplary embodiment of the present invention, the non-display area BA may include a mounting area MA. In some embodiments, the first layer SUB1 may correspond to the display area DA, and the second layer SUB2 may correspond to the non-display area BA. The base substrate SUB may include a plastic substrate (such as polyimide), a glass substrate, and / or a metal substrate.

[0049] A black matrix configured to block light may be provided in the non-display area BA. A gate driving circuit for supplying gate signals to the plurality of pixels PX may be provided in the non-display area BA. In an exemplary embodiment of the present invention, a data driving circuit may also be provided in the non-display area BA. A pad unit for receiving a signal supplied from the second electrical component 120 may be provided in the mounting area MA.

[0050] like Figure 1 and Figure 2 As shown in FIG. 1 , the second electrical component 120 includes a flexible wiring substrate 122 and a driving integrated circuit (IC) 125. The driving IC 125 may be, for example, a data driving circuit, a scan driving circuit, or the like.

[0051] The driving IC 125 may include at least one driving chip. The driving IC 125 is electrically connected to the wires of the flexible wiring substrate 122. The driving IC 125 and the flexible wiring substrate 122 may be connected (eg, electrically connected) by a conductive adhesive film 140.

[0052] When the second electrical component 120 includes the driver IC 125, the pad unit of the display panel 110 may include a data pad electrode electrically connected to the data line and a control signal pad electrode electrically connected to the control signal line. The data line may be connected to the pixel PX, and the control signal line may be connected to the gate driving circuit. In an exemplary embodiment of the present invention, the second electrical component 120 may have a chip-on-film structure, but the second electrical component 120 is not limited thereto.

[0053] refer to Figure 3 and Figure 4, the second electrical component 120 is described in more detail. The flexible wiring substrate 122 includes a base film, a plurality of pads CPD, IPD-120 and OPD-120 located on the base film, and a plurality of lines SL-120. The plurality of pads CPD, IPD-120 and OPD-120 and the plurality of lines SL-120 are disposed on the base film. The base film may include, for example, polyimide.

[0054] The plurality of pads CPD, IPD-120, and OPD-120 may include a connection pad CPD connected to a connection terminal of the driving IC 125, an input pad IPD-120 connected to the third electrical component 130, and an output pad OPD-120 connected to the display panel 110. The input pad IPD-120 is defined as an input pad unit IPP-120 disposed on one side (e.g., a first side or a first end) of the flexible wiring substrate 122, and the output pad OPD-120 is defined as an output pad unit OPP-120 disposed on an opposite side (e.g., a second side or a second end) of the flexible wiring substrate 122. In an exemplary embodiment of the present invention, the connection pads CPD are aligned to overlap both sides of the driving IC 125, but according to other embodiments of the present invention, the connection pads CPD may be randomly arranged corresponding to the connection terminals of the driving IC 125.

[0055] In an exemplary embodiment of the present invention, Figure 4 As shown in , the input pad unit IPP-120 and the output pad unit OPP-120 may include a pad row. The pad row includes a plurality of pads arranged in the first direction DR1 (arranged along the first direction DR1). In an exemplary embodiment of the present invention, each of the input pad unit IPP-120 and the output pad unit OPP-120 may include a plurality of pad rows.

[0056] Some of the lines SL-120 connect the connection pads CPD to the input pads IPD-120, and some of the lines SL-120 (e.g., other lines) connect the connection pads CPD to the output pads OPD-120. In some embodiments, the lines SL-120 may directly connect some of the input pads IPD-120 (e.g., input pads) to some of the output pads OPD-120 (e.g., output pads).

[0057] The flexible wiring substrate 122 may further include a solder resist layer disposed on the base film to cover the plurality of lines SL-120. The solder resist layer may further cover the periphery of the plurality of pads CPD, IPD-120, and OPD-120, and may expose at least a portion of each of the plurality of pads CPD, IPD-120, and OPD-120. Openings corresponding to the plurality of pads CPD, IPD-120, and OPD-120 may be formed in the solder resist layer.

[0058] Furthermore, the flexible wiring substrate 122 may include a first alignment mark AM2 and a second alignment mark AM20 used in a bonding process further described below. Figure 4 Four of the first alignment marks AM2 spaced apart from the pads CPD, IPD-120, and OPD-120, and four of the second alignment marks AM20 connected to the input pads IPD-120 and the output pads OPD-120 (e.g., located on or extending from the input pads IPD-120 and the output pads OPD-120) are shown. According to an embodiment, at least one of the first alignment mark AM2 and the second alignment mark AM20 may be omitted.

[0059] In an exemplary embodiment of the present invention, the exposed surfaces of the input pads IPD-120 and the output pads OPD-120 are defined as the connection surface CS of the flexible wiring substrate 122, and the surface facing away from the connection surface CS (or opposite to the connection surface CS) is defined as the non-connection surface NCS. Figure 3 As shown in FIG. 1 , the driving IC 125 may be located on the connection surface CS, but the present invention is not limited thereto, and for example, the driving IC 125 may be disposed on the non-connection surface NCS.

[0060] Refer again Figure 1 to Figure 2 The third electrical component 130 is configured to provide image data, control signals, and power supply voltage to the display panel 110 or the driving IC 125. The third electrical component 130 is a wiring substrate different from the flexible wiring substrate 122, and may include active elements and passive elements. The third electrical component 130 may be a flexible wiring substrate including a pad unit connected to the flexible wiring substrate 122 or a rigid wiring substrate.

[0061] refer to Figures 1 to 4 , the output pad unit OPP-120 of the flexible wiring substrate 122 and the pad unit of the display panel 110 may be electrically connected to each other through the conductive adhesive film 140. The input pad unit IPP-120 of the flexible wiring substrate 122 and the pad unit of the third electrical component 130 may also be electrically connected through the conductive adhesive film 140. The conductive adhesive film 140 may be an anisotropic conductive film (ACF). In an exemplary embodiment of the present invention, when the conductive adhesive film 140 is placed, a solder bump may be used.

[0062] The pad unit of the display panel 110 may include pads corresponding to the output pads OPD-120 of the flexible wiring substrate 122. Also, the pad unit of the third electrical component 130 may include pads corresponding to the input pads IPD-120 of the flexible wiring substrate 122.

[0063] Hereinafter, the electrical connection structure (or configuration) of the first electrical component 110, the second electrical component 120, and the third electrical component 130 is described in more detail with reference to the pad unit of the display panel 110 and the output pad unit OPP-120 of the flexible wiring substrate 122. The electrical connection structure between the second electrical component 120 and the third electrical component 130 may correspond to the electrical connection structure between the pad unit of the display panel 110 and the output pad unit OPP-120 of the flexible wiring substrate 122 described below. In addition, the electrical device 100 according to the exemplary embodiment of the present invention may include the first electrical component 110, the second electrical component 120, and the third electrical component 130, but the electrical device 100 according to the exemplary embodiment of the present invention may, for example, omit one of the first electrical component 110 and the third electrical component 130.

[0064] Figure 5 It is shown Figure 1 1 is a plan view of the separated pad units of the two electrical components shown in FIG. Figure 6 It is shown Figure 1 FIG. 1 is a plan view of a combined pad unit of two electrical components shown in FIG.

[0065] like Figure 5 As shown in , the display panel 110 includes an input pad unit IPP-110 corresponding to the output pad unit OPP-120 of the flexible wiring substrate 122. The input pad unit IPP-110 includes input pads IPD-110 corresponding to the output pads OPD-120 of the flexible wiring substrate 122. In an exemplary embodiment of the present invention, the input pads IPD-110 and the output pads OPD-120 are shown to have a 1:1 correspondence, but the present invention is not limited thereto. In another exemplary embodiment of the present invention, for example, the input pad unit IPP-110 and the output pad unit OPP-120 may include pads of different numbers from each other and pad rows of different numbers from each other.

[0066] The display panel 110 may include third and fourth alignment marks AM1 and AM10 respectively corresponding to the first and second alignment marks AM2 and AM20 of the flexible wiring substrate 122. One of the third and fourth alignment marks AM1 and AM10 may be omitted.

[0067] like Figure 6As shown in , the output pads OPD-120 of the flexible wiring substrate 122 and the input pads IPD-110 of the display panel 110 are electrically connected to each other. The output pad unit OPP-120 and the input pad unit IPP-110 are aligned using the third alignment mark AM1 and the fourth alignment mark AM10 and the first alignment mark AM2 and the second alignment mark AM20 of the flexible wiring substrate 122, and alignment correction may be performed in the second direction DR2 (along the second direction DR2). Then, the output pads OPD-120 and the input pads IPD-110 may be bonded using a bonding device (e.g., a tool) with the conductive adhesive film 140 therebetween.

[0068] Hereinafter, the structure of a bonding device for bonding the second electrical component 120 and the third electrical component 130 on the display panel 110 according to an exemplary embodiment of the present invention is described in more detail.

[0069] Figure 7 is a schematic diagram showing the structure of a joining device 2 according to an exemplary embodiment of the present invention.

[0070] refer to Figure 7 The bonding device 2 according to the exemplary embodiment of the present invention includes a stage 210, a pressing unit 220 and a driver 230, wherein the display panel 110 is disposed and fixed at the stage 210, and the pressing unit 220 is used to utilize the second electrical component 120 (see, for example Figures 1 to 6 ) and the conductive adhesive film 140 (see, for example, Figures 1 to 6 ) presses the second electrical component 120 onto the display panel 110, and the driver 230 is used to drive the pressing unit 220.

[0071] For example, the stage 210 may fix the display panel 110 by a vacuum suction method or a mechanical coupling method.

[0072] The pressing unit 220 includes a pressing head 221, a heat source 223 is provided on the pressing head 221, and a pressing tip 222 is attached to one side (e.g., the first side) of the pressing head 221 and presses the conductive adhesive film 140 and the second electrical component 120 onto the display panel 110 with the conductive adhesive film 140 located between the second electrical component 120 and the display panel 110. The heat source 223 may be fixed to the pressing head 221, for example, using a screw or the like. The heat generated from the heat source 223 may be applied to the conductive adhesive film 140 through the pressing head 221 and the pressing tip 222, so that the conductive particles inside the conductive adhesive film 140 have fluidity (e.g., change to a fluid state). Accordingly, bonding using the conductive adhesive film 140 may be more easily performed.

[0073] The driver 230 may control the driving of the pressing unit 220. For example, the driver 230 may control the driving of the pressing unit 220 so that the pressing unit 220 presses the object (e.g., the second electrical component 120) with a load (e.g., a predetermined load) for a certain amount of time (e.g., a predetermined amount of time). For this purpose, the driver 230 may control the up and down movement (e.g., movement along the third direction DR3 and the negative third direction DR3) of the pressing unit 220 including a lifting structure composed of a cylinder or a motor.

[0074] In various exemplary embodiments of the present invention, the engaging device 2 may further include a plurality of sensors 241 and 242. When the pressing unit 220 moves up and down, the sensors 241 and 242 may sense a change in capacitance between the sensors 241 and 242 and the pressing unit 220. For example, the sensors 241 and 242 may sense a change in capacitance between the upper surfaces of the sensors 241 and 242 and the lower surface of the pressing head 221.

[0075] In this exemplary embodiment, the sensors 241 and 242 may have a flat upper surface facing the pressing unit 220, and may be formed of a metal material. Similarly, the pressing head 221 may have at least one flat area facing the sensors 241 and 242 at its lower surface, and the pressing head 221 may be formed of a metal material. The metal material may be aluminum, stainless steel, etc., but is not limited thereto, and any suitable metal material may be used.

[0076] When the distance between the upper surface of each of the sensors 241 and 242 and the lower surface of the pressing head 221 changes as the pressing unit 220 moves up and down, the capacitance between each of the sensors 241 and 242 and the pressing head 221 is given by Equation 1.

[0077] Equation 1

[0078]

[0079] Here, ΔC is a change in capacitance, ε is a capacitance coefficient, A is an area of ​​a surface of each of the sensors 241 and 242 facing the pressing unit 220, and Δh is a change in distance between each of the sensors 241 and 242 and the pressing head 221 depending on the up and down movement of the pressing unit 220.

[0080] For example, when the pressing unit 220 moves downward toward the stage 210 to press the second electrical component 120 onto the display panel 110, the capacitance measured at the sensors 241 and 242 may increase. Conversely, when the pressing unit 220 completes the pressing process and moves away from the stage 210, the capacitance measured at the sensors 241 and 242 may decrease.

[0081] When the lower surface of the pressing head 221 is parallel to the upper surface of the stage 210, during the pressing process, the change in capacitance measured at each of the sensors 241 and 242 may be substantially the same within an error range (e.g., a predetermined error range). However, when the lower surface of the pressing head 221 is not parallel to the upper surface of the stage 210, during the pressing process, the change in capacitance measured at each of the sensors 241 and 242 is different from each other and may deviate from the error range.

[0082] The lower surface of the pressing head 221 and the upper surface of the stage 210 may not be parallel to each other due to mechanical defects of the pressing unit 220 or degradation or deformation of the pressing unit 220 due to long-term or repeated use. Thus, when the second electrical component 120 is pressed against the display panel 110 using the pressing unit 220, the load of the pressing tip 222 may be concentrated at (or on) a specific portion of the display panel 110, thereby causing damage to the display panel 110 and / or poor bonding.

[0083] Accordingly, in an exemplary embodiment of the present invention, a plurality of sensors 241 and 242 provided at the stage 210 are used to measure changes in capacitance with the pressing unit 220, and the equilibrium state (e.g., tilt) of the pressing unit 220 is judged or determined by comparing the measured changes in capacitance, and the uniformity of the pressing load is ensured in the entire area of ​​the pressing unit 220 during pressing, or the possibility of applying an uneven pressing load is reduced.

[0084] The capacitance change sensed by the sensors 241 and 242 may be transmitted to an external controller or monitoring device, and may be used for balance calibration of the pressing unit 220. For example, the balance calibration of the pressing unit 220 may be performed by the driver 230.

[0085] In some embodiments, Figure 7 As shown in FIG. 2 , only two sensors 241 and 242 are provided, but the present invention is not limited thereto, and for example, three or more sensors may be provided. The sensors 241 and 242 may be provided at various suitable positions on the stage 210 (for example, at each edge or at each side).

[0086] In addition, if Figure 7 As shown in FIG. 2 , the sensors 241 and 242 may be provided as separate elements on the stage 210 , but the present invention is not limited thereto. For example, the sensors 241 and 242 may be installed in the stage 210 .

[0087] In another exemplary embodiment of the present invention, the sensors 241 and 242 may be integrated with the stage 210 at different positions on the stage 210. For example, the sensors 241 and 242 may be conductors disposed at corresponding positions of the stage 210.

[0088] FIG. 8A to FIG. 8F Shows the use of Figure 7 The process of joining electrical components by the joining device 2 shown in FIG.

[0089] First, refer to Fig. 8A , the display panel 110 is fixed on the stage 210 of the bonding device 2. For example, the display panel 110 may be fixed on the stage 210 by a vacuum suction method or a mechanical coupling method.

[0090] Next, refer to Figure 8B , the conductive adhesive film 140 is attached to the display panel 110 (or attached on the display panel 110). For example, when the conductive adhesive film 140 is transferred to the display panel 110 by a transfer device (e.g., a transfer tool) or the like, the pressing unit 220 is driven by the driver 230 to transfer heat and pressure to the conductive adhesive film 140. Then, the pressing unit 220 may be spaced apart from the conductive adhesive film 140, and the peeling film may be removed from the conductive adhesive film 140.

[0091] Next, refer to Figure 8C , aligning and pre-pressing the second electrical component 120 on the display panel 110 to which the conductive adhesive film 140 is attached. For example, when the second electrical component 120 is transferred to the display panel 110 by a transfer device, etc., the first alignment mark AM2, the second alignment mark AM20, the third alignment mark AM1, and the fourth alignment mark AM10 (see, for example, Figures 1 to 6 ) to align the display panel 110 and the second electrical component 120. Then, the pressing unit 220 is driven by the driver 230 to apply heat and pressure to the second electrical component 120 and the conductive adhesive film 140. Then, the pressing unit 220 may be spaced apart from the second electrical component 120.

[0092] refer to FIG. 8D to FIG. 8F , the main pressing process may be performed after the pre-pressing process. In various exemplary embodiments of the present invention, the dummy film 150 may be used in the main pressing process.

[0093] The dummy film 150 may be used as a buffer member during the pressing process. For this purpose, the dummy film 150 may be formed of an elastic material such as a urethane-based material and / or an acrylic-based material. For example, the dummy film 150 may be formed of a sponge foamed with a urethane-based material and / or an acrylic-based material. However, the material constituting the dummy film 150 is not limited to the above materials, and any suitable material may be used.

[0094] In addition, the dummy film 150 can be used to remove particles P that may flow into between the second electrical component 120 and the pressing unit 220 during the main pressing process. In this way, at least one side of the dummy film 150 may be sticky (e.g., may have stickiness). According to an exemplary embodiment, the stickiness of the dummy film 150 to the second electrical component 120 may be sufficiently small compared to the stickiness of attaching the second electrical component 120 to the display panel 110 using the conductive adhesive film 140 through the subsequent main pressing process. Accordingly, after the main pressing process, the dummy film 150 can be easily removed from the second electrical component 120.

[0095] In various exemplary embodiments of the present invention, Fig.8D As shown in FIG, the dummy film 150 is disposed on the pre-pressed second electrical component 120 by a transfer device, etc. However, in another exemplary embodiment, the dummy film 150 may be integrally provided to the pressing unit 220, for example, at the pressing tip 222.

[0096] Then, if Fig. 8E As shown in , the pressing unit 220 may be driven by the driver 230 to apply heat and pressure to the dummy film 150, the second electrical component 120, and the conductive adhesive film 140. The heat and pressure applied by the pressing unit 220 during the main pressing process may be greater than the heat and pressure applied by the pressing unit 220 during the pre-pressing process.

[0097] When the pressing unit 220 presses the dummy film 150 and the second electrical component 120, the particles P flowing onto the second electrical component 120 may be attached to the dummy film 150. Then, as shown in FIG. Fig.8F As shown in FIG. 1 , the pressing unit 220 may be spaced apart from the second electrical component 120, and the dummy film 150 may be removed from the second electrical component 120. The particles P attached to the dummy film 150 may be removed from the second electrical component 120 together with the dummy film 150.

[0098] In various exemplary embodiments of the present invention, the sensors 241 and 242 may measure changes in capacitance between the sensors 241 and 242 and the pressing unit 220 (e.g., between the stage 210 and the pressing unit 220) during the bonding process, respectively. Based on the measurement results of the changes in capacitance of the sensors 241 and 242, the balance state (e.g., tilt) of the pressing unit 220 may be measured. The measurement results (e.g., measurements) of the balance state of the pressing unit 220 may be transmitted (or transferred) to an external controller, a monitoring device, or a driver 230, and used for balance calibration of the pressing unit 220.

[0099] In an exemplary embodiment of the present invention, sensors 241 and 242 may be FIG. 8A to FIG. 8D During the process shown in FIG. , the control is in the off state and can be FIG. 8E to FIG. 8F . For example, sensors 241 and 242 may measure the change in capacitance between sensors 241 and 242 and pressing unit 220 only for the main pressing process when pressing unit 220 moves up and down. Accordingly, excessive power consumption and excessive collection of unnecessary capacitance change data may be avoided or mitigated.

[0100] 9A to 9C , FIG. 10A to FIG. 10C as well as FIG. 11A to FIG. 11C 2 is a schematic diagram illustrating a structure of a pressing unit according to various exemplary embodiments of the present invention.

[0101] first, Fig.9A 2 shows the structure of the pressing unit 220 according to the first exemplary embodiment of the present invention, Fig. 9B It is along Fig.9A A cross-sectional view taken along line a-a', and Fig. 9C It is along Fig.9A A cross-sectional view taken along line bb'.

[0102] refer to 9A to 9C The pressing unit 220 includes a pressing head 221, a pressing tip 222, and a heat source 223. The pressing head 221 may include a body 2211 and a connecting portion 2212. 9A to 9C As shown in , the body 2211 may be coupled to the heat source 223 and may have a square pillar shape.

[0103] The connection portion 2212 extends downward toward the stage 210 in at least one region of the body 2211. Accordingly, the connection portion 2212 is not formed in another region of the body 2211. Here, the other region may be, for example, both sides of the body 2211. As the connection portion 2212 becomes farther from the body 2211, the side width d of the connection portion 2212 may become narrower. For example, as the connection portion 2212 becomes farther from the body 2211, the cross-sectional area of ​​the connection portion 2212 becomes smaller.

[0104] The lower surface of another area to which the connection portion 2212 of the body 2211 does not extend (for example, the lower surfaces of both sides of the body 2211) may be flat. The flat lower surfaces of both sides of the body 2211 face the sensors 241 and 242 (see, for example, Figure 7 ), thereby allowing the change in capacitance to be correctly measured by sensors 241 and 242. In an exemplary embodiment of the present invention, when the body 2211 is formed of a material other than metal, electrodes including a metal material may be formed on the flat lower surfaces of both sides of the body 2211.

[0105] The pressing tip 222 extends downward from the connecting portion 2212. The pressing tip 222 may have a square column shape. However, the present invention is not limited thereto, and for example, the lower surface of the pressing tip 222 may have a shape and size corresponding to the pressing object. However, since the side width d of the connecting portion 2212 becomes narrower as the connecting portion 2212 extends farther from the main body 2211, the side width of the pressing tip 222 extending from the lower end of the connecting portion 2212 is narrower than the side width of the main body 2211 of the pressing head 221.

[0106] The heat source 223 may be configured to surround (eg, cover) at least one surface of the body 2211 of the pressing head 221. Figures 9A to 9C As shown in , the heat source 223 may be configured to surround at least a portion of the upper surface and the lower surface of the body 2211. In various exemplary embodiments of the present invention, the heat source 223 may be configured to surround only a portion of at least one side of the body 2211. In this exemplary embodiment of the present invention, the front length L1 of the heat source 223 may be shorter than the front length of the body 2211.

[0107] Fig. 10A shows a structure of a pressing unit 220 according to a second exemplary embodiment of the present invention, Fig. 10B It is along Fig. 10A A cross-sectional view taken along line c-c' of Fig. 10C It is along Fig. 10A A cross-sectional view taken along line d-d'.

[0108] refer to FIG. 10A to FIG. 10C , the heat source 223 ′ of the pressing unit 220 according to the second exemplary embodiment of the present invention has a ratio 9A to 9C As described above, the heat source 223' does not have to be configured to surround (e.g., cover) the entirety of at least one side of the body 2211, and it is sufficient to provide the heat source 223' in such a size and shape that the heat provided by the heat source 223' can be effectively transferred to the object to be pressed through the body 2211, the connecting portion 2212, and the pressing tip 222.

[0109] Fig.11A 2 shows a structure of a pressing unit 220 according to a third exemplary embodiment of the present invention, Fig. 11B It is along Fig.11A A cross-sectional view taken along line e-e', and Fig. 11C It is along Fig.11A A cross-sectional view taken along line f-f'.

[0110] refer to FIG. 11A to FIG. 11C, the pressing head 221' includes a main body 2211' and a connecting portion 2212. At both sides of the main body 2211' where the connecting portion 2212 is not formed, the main body 2211' has a height h2 located at a first region, which is smaller than a height h1 of a second region of the main body 2211'. For example, the cross-sectional area of ​​the main body 2211' is reduced in a region (e.g., the first region) where the connecting portion 2212 is not formed.

[0111] Since the two sides of the body 2211' where the connection portion 2212 is not formed (for example, due to the first area of ​​the body 2211') are formed to provide a flat surface facing the sensors 241 and 242, the shape of the two sides of the body 2211' is not specifically limited as long as the lower surfaces of the two sides of the body 2211' are flat.

[0112] Therefore, the first area (e.g., both sides) of the body 2211' may be formed to have at least one of a height, a width, and an area smaller than the second area of ​​the body 2211'. Since the first area of ​​the body 2211' is formed smaller than the second area of ​​the body 2211', the engaging device may be smaller and lighter.

[0113] FIG. 11A to FIG. 11C The shapes of both sides of the main body 2211' shown in FIG. 2 are merely examples, and the present invention is not limited to FIG. 11A to FIG. 11C The embodiment shown in FIG.

[0114] Figure 12 to Figure 14 is a graph illustrating a method of determining a balance state of a pressing unit by using sensor measurement according to various exemplary embodiments of the present invention. Fig.12 is shown in Figure 7 is a graph showing changes in the distance between the sensors 241 and 242 and the pressing unit 220 (eg, the lower surface of the pressing head 221) based on changes in capacitance measured by the first sensor 241 and the second sensor 242 when the engaging device 2 shown in repeatedly performs the main pressing process. Fig.13 It is shown Fig.12 A graph of the enlarged area AA, and Fig.14 It is shown in Fig.12 2 is a graph of the difference between the capacitances measured by the first sensor 241 and the second sensor 242 in area AA.

[0115] When the lower surface of the pressing head 221 is parallel to the upper surface of the stage 210, during the pressing process, the change in capacitance measured at each of the sensors 241 and 242 may be substantially the same within an error range (e.g., a predetermined error range). Therefore, the change in the distance between the lower surface of the pressing head 221 and each of the sensors 241 and 242 determined from the change in the measured capacitance by Equation 1 may be the same as Figure 13 to Figure 14 is essentially the same as the graph shown on the left side of .

[0116] Here, the distance between each of the first sensor 241 and the second sensor 242 and the pressing head 221 may be different according to the difference in thickness of the sensor itself.

[0117] However, when the lower surface of the pressing head 221 is not parallel to the upper surface of the stage 210, during the pressing process, the change in capacitance measured at each of the sensors 241 and 242 may deviate from the error range and the capacitance of each may be different from each other. Fig.13 and Fig.14 As shown in the graph shown on the right side of , changes in the distance between the lower surface of the pressing head 221 and each of the sensors 241 and 242 determined from the change in the measured capacitance by Equation 1 may be different from each other.

[0118] As described above, in the present invention, at least two sensors provided at various points on the stage 210 are used to measure the change in capacitance between the stage 210 and the pressing unit 220. The present invention can indirectly determine the distance between the stage 210 and the pressing unit 220 at various points on the stage 210 from the measured change in capacitance, and thus, can determine the equilibrium state of the pressing unit 220.

[0119] Those skilled in the art of the present invention will understand that the present invention can be implemented in other specific forms without changing the technical concept or essential features. The exemplary embodiments should be understood only in a descriptive sense, not for the purpose of limitation. Therefore, the scope of the present invention is not limited by the detailed description of the present invention, but by the attached claims and their equivalents, and all differences within the scope should be understood to be included in the present invention.

Claims

1. Engagement device, include: a platform configured to secure a first electrical component; a pressing unit configured to press the conductive adhesive film and the second electrical component onto the first electrical component; a driver configured to control the movement of the pressing unit along a first direction; as well as a plurality of sensors located at different positions on the table and configured to sense changes in capacitance with the pressing unit, The pressing unit includes a flat metal material in a first area facing the plurality of sensors.

2. The bonding device according to claim 1, in, The pressing unit comprises: A pressing head connected to the driver; a pressing tip configured to press the conductive adhesive film and the second electrical component when the pressing head moves toward the stage along the first direction; and A heat source extends from the pressing head and is configured to transfer heat to the conductive adhesive film and the second electrical component when the pressing head moves toward the stage along the first direction.

3. The joining device according to claim 2, in, The plurality of sensors are configured to sense a change in the capacitance when the pressing head moves along the first direction.

4. The bonding device according to claim 2, in, The pressing head comprises: a body coupled to the driver, the first region being located on the body; and a connecting portion extending between the main body and the pressing tip, Wherein, the cross-sectional area of ​​the connecting portion decreases as the distance from the main body increases.

5. The joining device according to claim 4, in, The connecting portion extends from the body in a second region that is different from the first region.

6. The joining device according to claim 4, in, The heat source surrounds at least a portion of the body at at least one side of the body.

7. The joining device according to claim 5, in, A cross-sectional area of ​​the body in the first region is smaller than a cross-sectional area of ​​the body in the second region.

8. The bonding device according to claim 1, in, The capacitance changes in response to a change in a distance between each of the plurality of sensors and the pressing unit.

9. The joining device according to claim 8, in, In a balanced state of the pressing unit, when the pressing unit presses, a change in the capacitance sensed in each of the plurality of sensors is the same.

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