Connector structure and preparation method

Abstract

The invention provides a connector structure and a preparation method, and relates to the technical field of circuit connection. The structure comprises a circuit board and at least one cable, the circuit board comprises a lamination assembly and a bonding pad assembly, the lamination assembly comprises at least two functional layers and at least one prepreg, the prepreg is arranged between the two functional layers, and the bonding pad assembly is arranged on the functional layers and electrically connected with a wiring structure of the functional layers; the cable is provided with a crimping part, the crimping part is arranged on the bonding pad assembly, the crimping part and the bonding pad assembly are both clamped between the functional layer and the prepreg, the functional layer opposite to the crimping part is provided with an avoiding part, and the avoiding part and the crimping part are correspondingly arranged. Due to the fact that the structure of the surface layer welding cable is not uniform, the impedance of the welding position is not consistent, the crimping part and the bonding pad assembly are arranged between the functional layer and the prepreg, and the cable is prevented from being directly welded to the surface layer. The pressing prepreg enables the pressing part and the bonding pad assembly to be uniformly pressed, so that the impedance is consistent, and the quality and the stability of signals are improved.

Description

Technical Field

[0001] The present application relates to the technical field of circuit connection, and in particular to a connector structure and a preparation method thereof. Background Art

[0002] Inside the server, high-speed cables are used to connect various components inside the server, such as processors, storage devices, network interfaces, expansion cards, etc., and the data lines inside the high-speed cables are used to achieve fast data transmission and communication. The main component of the high-speed cable is the data line, which is used to transmit data signals. Both ends of the high-speed cable are usually equipped with connectors for connecting various components inside the server. The connectors can be plug-in cards, which are circuit boards containing circuit structures.

[0003] In the prior art, when the cable and the plug-in card are connected and fixed, the surface welding technology is often used, that is, solder is applied to the surface of the plug-in card, and heat is applied to the interface between the plug-in card and the cable to melt the solder at high temperature, so that the connection between the cable and the plug-in card is fixed. In order to further strengthen the connection, glue fixing is performed, that is, after the welding is completed, a layer of special glue is applied to the connection.

[0004] However, the surface welding impedance is relatively large, and the solder and adhesive are easily unevenly distributed, which makes the impedance of the cable uneven, affecting the quality and stability of the signal. Summary of the invention

[0005] The present application provides a connector structure and a preparation method to solve the technical problem that the impedance of the surface welded cable is large, and the solder and adhesive are easily unevenly distributed, resulting in uneven impedance of the cable and affecting the quality and stability of the signal.

[0006] In a first aspect, the present application provides a connector structure, comprising: a circuit board and at least one cable; the circuit board comprises a stacking assembly and a pad assembly, the stacking assembly comprises at least two functional layers and at least one semi-cured sheet, the semi-cured sheet is arranged between the two functional layers, and the pad assembly is arranged on the functional layer and electrically connected to the routing structure of the functional layer; the end of the cable has a crimping portion, the crimping portion and the pad assembly are both sandwiched between the functional layer and the semi-cured sheet, the crimping portion is arranged on the pad assembly, and an avoidance portion is provided on the functional layer opposite to the crimping portion, and the avoidance portion is arranged corresponding to the crimping portion.

[0007] In some possible implementations, in the connector structure provided by the embodiments of the present application, the two functional layers include a core board group and at least one copper layer; or the two functional layers include two core board groups.

[0008] In some possible implementations, in the connector structure provided by the embodiments of the present application, the core board group includes at least two core boards, and a prepreg is disposed between the two core boards.

[0009] In some possible implementations, the connector structure provided by the embodiments of the present application, the crimping portion includes at least two first electrical connection portions and at least two second electrical connection portions, the first electrical connection portion is electrically connected to the signal line of the cable, and the second electrical connection portion is electrically connected to the ground line of the cable; the pad assembly includes at least two signal pads and at least two grounding pads, each grounding pad is relatively arranged on both sides of at least two signal pads, the first electrical connection portion is correspondingly connected to the signal pad, the second electrical connection portion is correspondingly connected to the ground pad, and the signal pad corresponds to the avoidance portion.

[0010] In some possible implementations, in the connector structure provided by the embodiment of the present application, the signal pad includes a welding portion and a buffer portion, the first electrical connection portion is correspondingly arranged on the welding portion, one end of the buffer portion is connected to the welding portion, and the other end is connected to the routing structure.

[0011] In some possible implementations, the connector structure provided in the embodiment of the present application has a buffer portion having a length of 28 mil-32 mil, a welding portion having a width of 11 mil-13 mil, a welding portion having a length of 52 mil-56 mil, and a first electrical connection portion having a width of 5 mil-7 mil.

[0012] In some possible implementations, in the connector structure provided in the embodiments of the present application, the width of the buffer portion toward one end of the crimping portion is greater than the width of the buffer portion toward one end of the routing structure.

[0013] In some possible implementations, in the connector structure provided by the embodiments of the present application, the width of the welding portion is greater than or equal to the width of the first electrical connection portion, and the length of the welding portion is greater than or equal to the length of the first electrical connection portion.

[0014] In some possible implementations, in the connector structure provided by the embodiments of the present application, a tin layer is provided between the crimping portion and the pad assembly.

[0015] In the second aspect, an embodiment of the present application also provides a method for preparing a connector structure, which is used to prepare the connector structure in any of the above embodiments, and the method includes: placing a functional layer on a laminating device, arranging a welding assembly on the functional layer, and placing a crimping portion on the welding assembly; placing a semi-cured sheet on the functional layer to cover the welding assembly and the crimping portion, and placing another functional layer having a avoidance portion on the semi-cured sheet, the avoidance portion being opposite to the crimping portion; and the laminating device performs lamination to connect the functional layer, the crimping portion and the welding assembly through the semi-cured sheet.

[0016] The connector structure and preparation method provided by the present application are provided by a circuit board and at least one cable; the circuit board includes a laminated assembly and a pad assembly, the laminated assembly includes at least two functional layers and at least one prepreg, the prepreg is arranged between the two functional layers, the pad assembly is arranged on the functional layer and is electrically connected to the routing structure of the functional layer; the end of the cable has a crimping portion, the crimping portion and the pad assembly are both sandwiched between the functional layer and the prepreg, the crimping portion is arranged on the pad assembly, and the functional layer opposite to the crimping portion has an avoidance portion, and the avoidance portion is arranged corresponding to the crimping portion. The pad assembly provides a connection basis for the crimping portion, the crimping portion and the pad assembly are both sandwiched between the functional layer and the prepreg, forming a laminated structure of the functional layer, the pad assembly, the crimping portion, the prepreg and the functional layer arranged in sequence, and the crimping portion is arranged in the inner layer of the laminated structure to avoid direct welding on the surface of the circuit board. Since the surface welding cable is prone to uneven structure, it will cause inconsistent impedance at the welding point. Through pressing, the prepreg makes the crimping portion and the pad assembly uniformly crimped, so that the impedance is consistent, thereby improving the quality and stability of signal transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0018] Figure 1 A schematic diagram of a simulation structure of a connector structure provided in an embodiment of the present application;

[0019] Figure 2 It is a schematic diagram of the simulation structure of the existing connector structure;

[0020] Figure 3 A schematic diagram of the structure of the pad assembly and the crimping portion in the connector structure provided in an embodiment of the present application;

[0021] Figure 4 for Figure 3 A structural schematic diagram of the middle pad assembly and the crimping portion from another perspective;

[0022] Figure 5 A schematic structural diagram of an avoidance portion in a connector structure provided in an embodiment of the present application;

[0023] Figure 6 for Figure 3 A schematic diagram of the structure of the middle buffer;

[0024] Figure 7 It is a schematic diagram of the structure of a multi-layer circuit board;

[0025] Figure 8 A flowchart of a method for connecting a high-speed cable and a circuit board provided in an embodiment of the present application.

[0026] Description of reference numerals:

[0027] 100-cable;

[0028] 110 - crimping portion; 111 - first electrical connection portion; 112 - second electrical connection portion;

[0029] 120-Signal line;

[0030] 130- ground wire;

[0031] 140-protective layer;

[0032] 200-Laminate assembly;

[0033] 210-core board group; 211-wiring structure;

[0034] 220-copper layer; 221-avoidance portion;

[0035] 230-prepreg;

[0036] 300-pad assembly;

[0037] 310-signal pad; 311-welding portion; 312-buffer portion;

[0038] 320 - Ground pad.

[0039] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0040] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0041] In general, terms should be understood, at least in part, by the context in which they are used. For example, the term "one or more" as used herein may be used to describe any feature, structure, or characteristic in a singular sense, or may be used to describe a combination of features, structures, or characteristics in a plural sense, depending, at least in part, on the context. Similarly, terms such as "a," "an," or "the" may also be understood to convey singular usage or to convey plural usage, depending, at least in part, on the context.

[0042] Inside the server, high-speed cables are used to connect various components inside the server, such as processors, storage devices, network interfaces, expansion cards, etc., and the data lines inside the high-speed cables are used to achieve fast data transmission and communication. The main component of the high-speed cable is the data line, which is used to transmit data signals. Both ends of the high-speed cable are usually equipped with connectors for connecting various components inside the server. The connectors can be plug-in cards, which are circuit boards containing circuit structures.

[0043] In the prior art, when the cable and the plug-in card are connected and fixed, the surface welding technology is often used, that is, solder is applied to the surface of the plug-in card, and heat is applied to the interface between the plug-in card and the cable to melt the solder at high temperature, so that the connection between the cable and the plug-in card is fixed. In order to further strengthen the connection, glue fixing is performed, that is, after the welding is completed, a layer of special glue is applied to the connection, such as Figure 2 However, soldering on the surface makes the cable impedance larger, and the solder and glue are easily unevenly distributed, making the cable impedance uneven, affecting the quality and stability of the signal.

[0044] For example, the coating thickness of the adhesive may vary due to construction techniques or uneven material distribution, which may cause inconsistent impedance of the cable. Similarly, there may be inconsistencies in the solder paste used in the welding process, which in turn affects the impedance consistency of the cable. Impedance consistency is critical to the electrical performance of the cable. Inconsistent impedance may cause reflections, attenuation or distortion in signal transmission, thus affecting the quality and stability of the signal. Especially in high-frequency or high-speed data transmission applications, impedance inconsistency may significantly degrade system performance.

[0045] In view of this, an embodiment of the present application provides a connector structure and a preparation method, including: a circuit board and at least one cable; the circuit board includes a stacking assembly and a pad assembly, the stacking assembly includes at least two functional layers and at least one semi-cured sheet, the semi-cured sheet is arranged between the two functional layers, and the pad assembly is arranged on the functional layer and electrically connected to the routing structure of the functional layer; the end of the cable has a crimping portion, the crimping portion and the pad assembly are both clamped between the functional layer and the semi-cured sheet, the crimping portion is arranged on the pad assembly, and an avoidance portion is provided on the functional layer opposite to the crimping portion, and the avoidance portion is arranged corresponding to the crimping portion. The pad assembly provides a connection basis for the crimping part, and the crimping part and the pad assembly are both sandwiched between the functional layer and the semi-cured sheet to form a laminated structure of the functional layer, the pad assembly, the crimping part, the semi-cured sheet and the functional layer arranged in sequence. The crimping part is arranged in the inner layer of the laminated structure to avoid direct welding on the surface of the circuit board. Since the surface welding cable is prone to structural unevenness, it will cause inconsistent impedance at the welding point. Through pressing, the semi-cured sheet makes the crimping part and the pad assembly evenly crimped, so that the impedance is consistent, thereby improving the quality and stability of signal transmission.

[0046] The following specific embodiments are used to describe in detail the technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described in detail in some embodiments. Figure 1 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 The connector structure and preparation method of the present application are described with reference to specific embodiments.

[0047] In a first aspect, the present application provides a connector structure, comprising: a circuit board and at least one cable 100; the circuit board comprises a stacking assembly 200 and a pad assembly 300, the stacking assembly 200 comprises at least two functional layers and at least one semi-cured sheet 230, the semi-cured sheet 230 is arranged between the two functional layers, the pad assembly 300 is arranged on the functional layer and is electrically connected to the routing structure 211 of the functional layer; the end of the cable 100 has a crimping portion 110, the crimping portion 110 and the pad assembly 300 are both sandwiched between the functional layer and the semi-cured sheet 230, the crimping portion 110 is arranged on the pad assembly 300, and an avoidance portion 221 is provided on the functional layer opposite to the crimping portion 110, and the avoidance portion 221 is arranged corresponding to the crimping portion 110.

[0048] Specifically, the stack assembly 200 includes two functional layers and a prepreg 230, and the prepreg 230 is arranged between the two functional layers to connect the two functional layers. It is understandable that the prepreg 230 is used to make the interlayer bonding. A pad assembly 300 is arranged on one of the functional layers, for example, one end of the pad assembly 300 is flush with the edge of the functional layer. The pad assembly 300 is used to connect the crimping portion 110 at the end of the high-speed cable 100. The crimping portion 110 and the pad assembly 300 are both sandwiched between the functional layer and the prepreg 230, and the prepreg 230 fixes the crimping portion 110 and the pad assembly 300 on the functional layer, and another functional layer is covered on the functional layer to form a sandwich structure of the functional layer, the pad assembly 300, the crimping portion 110, the prepreg 230 and the functional layer, so that the crimping portion 110 is located between the sandwich layers.

[0049] For example, the functional layer provided with the crimping portion 110 and the pad assembly 300 is a core board, and another functional layer opposite to the core board may be a core board or a copper layer 220. Alternatively, the functional layer provided with the crimping portion 110 and the pad assembly 300 is a core board group 210, and another functional layer opposite to the core board group 210 may be a core board, a copper layer 220, or a core board group 210.

[0050] In some embodiments, the connector structure can be formed into a multi-layer structure according to actual conditions. For example, the prepreg 230 is laid on the side of the two functional layers away from the crimping part 110, and the copper layer 220 or the core board 210 is laid on the side of the prepreg 230 away from the crimping part 110, and then the pressing device is pressed, and the above steps are repeated until the multi-layer structure of the connector structure is achieved.

[0051] In order to facilitate the control of impedance, a relief portion 221 may be provided on the functional layer opposite to the crimping portion 110, and the relief portion 221 corresponds to the crimping portion 110. The impedance may be adjusted by changing the area of ​​the relief portion 221. For example, the area of ​​the relief portion 221 may be adjusted according to the simulation software to obtain a target impedance value, and the area of ​​the relief portion 221 corresponding to the target impedance value is the preparation area of ​​the relief portion 221. For example, the relief portion 221 is rectangular, the length of the relief portion 221 is 68 mil, and the width of the relief portion 221 is 50 mil.

[0052] It should be noted that when the cable 100 is welded on the surface of the connector structure, the impedance fluctuation is large, while when the cable is crimped on the inner layer of the connector structure, the impedance fluctuation is small.

[0053] The connector structure in the embodiment of the present application provides a connection basis for the crimping part 110 through the pad assembly 300. The crimping part 110 and the pad assembly 300 are both sandwiched between the functional layer and the semi-cured sheet 230 to form a sandwich structure of the functional layer, the pad assembly 300, the crimping part 110, the semi-cured sheet 230 and the functional layer arranged in sequence. The crimping part 110 is arranged in the inner layer of the sandwich structure to reduce impedance mismatch and avoid direct welding on the surface layer of the sandwich structure. Through pressing, the semi-cured sheet 230 makes the crimping part 110 and the pad assembly 300 evenly crimped, the crimping part 110 and the pad assembly 300 are evenly stressed, and the material covering their surfaces is even, so that the impedance is consistent, the connection is reliable, and the quality and stability of signal transmission are improved.

[0054] In some possible implementations, in the connector structure provided by the embodiments of the present application, the two functional layers include a core board group 210 and at least one copper layer 220 ; or the two functional layers include two core board groups 210 .

[0055] Specifically, the two functional layers include at least one core plate group 210 and at least one copper layer 220, that is, a prepreg 230 is arranged between the core plate group 210 and the copper layer 220. Exemplarily, the core plate group 210, the pad assembly 300, the crimping portion 110, the prepreg 230 and the copper layer 220 are arranged in sequence from bottom to top. The core plate group 210 includes at least one core plate.

[0056] In some embodiments, the two functional layers include at least two core board groups 210, that is, a semi-cured sheet 230 is arranged between the core board groups 210 and the core board groups 210. Exemplarily, the core board group 210, the pad assembly 300, the crimping portion 110, the semi-cured sheet 230 and the core board group 210 are arranged in sequence from bottom to top.

[0057] It should be noted that the two functional layers can be arranged in different ways, so as to design a reasonable stacking arrangement according to actual usage requirements, thereby optimizing the signal transmission path, reducing signal interference and reflection, and improving signal integrity.

[0058] In some possible implementations, in the connector structure provided by the embodiments of the present application, the core plate group 210 includes at least two core plates, and a prepreg 230 is disposed between the two core plates.

[0059] Specifically, the two functional layers include at least two core plate groups 210 , a prepreg 230 is disposed between the two core plate groups 210 , and the core plate group 210 includes at least two core plates, a prepreg is disposed between the two core plates.

[0060] For example, the laminate assembly 200 includes two functional layers, one functional layer includes at least one core plate group 210 and at least one copper layer 220, wherein the core plate group 210 includes one core plate. The other functional layer includes two core plate groups 210, wherein the core plate group 210 includes at least two core plates. That is, the laminate assembly 200 includes three core plates, and the crimping portion 110 is located between the two core plates, for example, the third core plate, the prepreg 230, the second core plate, the pad assembly 300, the crimping portion 110, the prepreg 230 and the first core plate are sequentially arranged from bottom to top. Alternatively, the third core plate, the pad assembly 300, the crimping portion 110, the prepreg 230, the second core plate, the prepreg 230 and the first core plate are sequentially arranged from bottom to top.

[0061] Of course, the third core plate and the first core plate can also be covered with a copper layer 220 on one side away from the crimping portion 110. For example, the prepreg 230, the third core plate, the prepreg 230, the second core plate, the pad assembly 300, the crimping portion 110, the prepreg 230, the first core plate, the prepreg 230 and the copper layer 220 are arranged in sequence from bottom to top. It should be noted that the upper and lower surfaces of the core plate form a signal reference surface, which is used to lay the routing structure 211. The first signal layer is the copper layer 220, the second ground layer is the upper surface of the first core plate, and the third ground layer is the lower surface of the first core plate. It should be noted that adding the prepreg 230 between the core plates to make the core plates bond to each other can also promote the effective conduction of heat, reduce local overheating, and thus improve the reliability of the circuit.

[0062] In some possible implementations, in the connector structure provided by the embodiments of the present application, the crimping portion 110 includes at least two first electrical connection portions 111 and at least two second electrical connection portions 112, the first electrical connection portion 111 is electrically connected to the signal line 120 of the cable 100, and the second electrical connection portion 112 is electrically connected to the ground line 130 of the cable 100; the pad assembly 300 includes at least two signal pads 310 and at least two grounding pads 320, each grounding pad 320 is relatively arranged on both sides of at least two signal pads 310, the first electrical connection portion 111 is correspondingly connected to the signal pad 310, the second electrical connection portion 112 is correspondingly connected to the grounding pad 320, and the signal pad 310 corresponds to the avoidance portion 221.

[0063] Specifically, the cable 100 includes a signal line 120 , a ground line 130 and a protective layer 140 wrapping the signal line 120 and the ground line 130 , the first electrical connection portion 111 is electrically connected to the signal line 120 of the cable 100 , and the second electrical connection portion 112 is electrically connected to the ground line 130 of the cable 100 .

[0064] For example, the first electrical connection portion 111 may be the end of the signal line 120, and the second electrical connection portion 112 may be the end of the ground line 130. It should be noted that the first electrical connection portion 111 and the second electrical connection portion 112 may be copper bars, and the first electrical connection portion 111 and the second electrical connection portion 112 may also be composed of a plurality of copper wires, which is not limited in the present application. It is understandable that the structure of the signal pad 310 may be consistent with or inconsistent with the structure of the ground pad 320, which is not limited in the present application embodiment.

[0065] It should be noted that the first electrical connection portion 111 and the signal line 120 are designed as one piece, and the second electrical connection portion 112 and the ground line 130 are designed as one piece, which ensures the consistency of the cable 100 and avoids the secondary bonding of the cable 100, so that the impedance is consistent during the connection of the cable 100 to the circuit board. The secondary bonding of the cable 100 means that the terminal of the cable 100 is first connected to the circuit board, and then the cable 100 is welded to the terminal.

[0066] In some possible implementations, in the connector structure provided in the embodiment of the present application, the signal pad 310 includes a welding portion 311 and a buffer portion 312, the first electrical connection portion 111 is correspondingly arranged on the welding portion 311, one end of the buffer portion 312 is connected to the welding portion 311, and the other end is connected to the routing structure 211.

[0067] Specifically, the buffer portion 312 is located between the soldering portion 311 and the wiring structure 211. The buffer portion 312 may be on the same level as the wiring structure 211, or may not be on the same level. By means of the gradual buffer portion, a buffer margin is reserved between the soldering portion 311 and the wiring structure 211 to reduce impedance mismatch.

[0068] It should be noted that the embodiment of the present application does not specifically limit the size of the buffer portion, the welding portion 311, and the first electrical connection portion 111, and can be designed according to actual needs. For example, the length of the buffer portion 312 is 28mil-32mil, the width of the welding portion 311 is 11mil-13mil, the length of the welding portion 311 is 52mil-56mil, and the width of the first electrical connection portion 111 is 5mil-7mil. For example, the length of the buffer portion 312 is 30mil, the width of the welding portion 311 is 12mil, the length of the welding portion 311 is 50mil, and the width of the first electrical connection portion 111 is 6mil. For example, Figure 6 In FIG. 2 , A represents the width of the routing structure 211 , B represents the length of the soldering portion 311 , and C represents the width of the soldering portion 311 .

[0069] In some other embodiments, in the connector structure provided by the embodiments of the present application, the width of the buffer portion 312 toward the crimping portion 110 is greater than the width of the buffer portion 312 toward the wiring structure 211. It should be noted that the top view of the buffer portion 312 is trapezoidal, and the gradual buffer portion is used to avoid direct crimping of the cable 100 and the wiring structure 211, reserve a buffer margin, and reduce impedance mismatch.

[0070] In some embodiments, in the connector structure provided by the embodiments of the present application, the width of the welding portion 311 is greater than or equal to the width of the first electrical connection portion 111 , and the length of the welding portion 311 is greater than or equal to the length of the first electrical connection portion 111 .

[0071] Specifically, a connection margin is provided around the welding portion 311, and even if the first electrical connection portion 111 is offset, the first electrical connection portion 111 is still provided on the welding portion 311. For example, when the width of the first electrical connection portion 111 is 6 mil, the width of the welding portion 311 is 12 mil. It is understandable that the larger size of the welding portion 311 provides additional error tolerance, allowing a certain error in positioning of the first electrical connection portion 111 without affecting the quality of welding. Since the welding portion 311 can cover more area, the welding process is simplified, making the welding operation easier and reducing welding failures caused by positioning difficulties.

[0072] In addition, in the connector structure provided by the embodiment of the present application, a tin layer is provided between the crimping portion 110 and the pad assembly 300 .

[0073] It should be noted that, in order to prevent the crimping portion 110 and the pad assembly 300 from being displaced during the pressing process, a tin layer is provided between the crimping portion 110 and the pad assembly 300 to pre-fix the crimping portion 110 on the pad assembly 300 .

[0074] In some embodiments, the embodiments of the present application further provide a method for preparing a connector structure, which is used to prepare the connector structure in any of the above embodiments, and the method includes: S100 placing a functional layer on a pressing device, setting a pad assembly 300 on the functional layer, and placing a crimping portion 110 on the pad assembly 300. Specifically, the pressing device has two upper and lower opposite steel plates, a functional layer is placed on one steel plate, the functional layer is located between the two opposite steel plates, the pad assembly 300 is set on the functional layer, and the crimping portion 110 is placed on the pad assembly 300.

[0075] S200: Place a prepreg 230 on the functional layer to cover the pad assembly 300 and the crimping portion 110, and place another functional layer having an escape portion 221 on the prepreg 230, the escape portion 221 being opposite to the crimping portion 110. For a circular signal cable, the crimping portion 110 can be flattened by a pressing device, and the crimping portion 110 can be pressed by the upper and lower steel plates of the pressing device, so that the thickness and width of the crimping portion 110 are equal to the target thickness and target width, thereby increasing the contact area between the crimping portion 110 and the pad assembly 300. Place a prepreg 230 on the functional layer to cover the pad assembly 300 and the crimping portion 110, and place another functional layer having an escape portion 221 on the prepreg 230, the escape portion 221 being opposite to the crimping portion 110, thereby forming a structure of a steel plate, a functional layer, a pad assembly 300, a crimping portion 110, a prepreg 230, a functional layer, and a steel plate.

[0076] S300 The laminating device performs laminating to connect the functional layer, the crimping part 110 and the pad assembly 300 through the prepreg 230. When the laminating device performs laminating, the prepreg 230 is liquefied and solidified to connect the functional layer, the crimping part 110 and the pad assembly 300.

[0077] The preparation method in the embodiment of the present application integrates the connection between the crimping part 110 of the cable 100 and the circuit board into the crimping molding process of the circuit board. When preparing the laminated layers of the circuit board, the crimping equipment is used for crimping. The semi-cured sheet 230 connects the functional layer, the crimping part 110 and the pad assembly 300 to form the crimping of the cable 100 and the functional layer. In this process, the semi-cured sheet 230 evenly covers the surface of the crimping part 110, so that the crimping part 110 is evenly stressed, ensuring the impedance consistency of the crimping part 110, and improving the quality and consistency of signal transmission.

[0078] It should be noted that the area of ​​the avoidance portion 221 is related to the area of ​​the pad assembly 300. The presence or absence of the avoidance portion 221 affects the thickness of the prepreg 230. The relationship between the thickness of the prepreg 230 and the impedance is:

[0079]

[0080] Among them, Z0 is impedance, Er is relative dielectric constant, H is the thickness of the semi-cured sheet 230, W is the width of the pad assembly (300), and T is the preset pressing thickness. According to the simulation formula, when the impedance is equal to the preset impedance value, the area of ​​the avoidance portion 221 at this time is obtained and used as a parameter during preparation.

[0081] Exemplarily, first obtain the cable data, the length and width of the crimping portion 110 for pressing, and the cable data can be obtained from the manufacturer or designed according to the impedance requirements. The length and width of the pad assembly 300 are greater than or equal to the length and width of the crimping portion 110. Of course, additional weighted values ​​of length and width can be added to the pad assembly 300 for simulation. It should be noted that the size of the pad assembly 300 also affects the impedance value of the crimping position, and the additional weighted value can also be used as a variable for simulation. Through the crimping portion 110 information, the pad assembly 300 information and the stacking information, the model is modeled according to the above formula, with the signal pad 310 as the center, and the functional layers above and below are hollowed out to form an avoidance portion 221, and the area of ​​the avoidance portion 221 is scanned. According to the formula simulation, when the impedance is equal to the preset impedance value, the area of ​​the avoidance portion 221 and the thickness and number of layers of the semi-cured sheet are obtained at this time, and used as parameters during preparation.

[0082] The various embodiments or implementation methods in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can be referenced to each other.

[0083] It should be easily understood that “on,” “above,” and “over” in the present disclosure should be interpreted in the broadest manner, so that “on” not only means “directly on something,” but also includes the meaning of “on something” with intervening features or layers therebetween, and “above” or “over” not only includes the meaning of “above” or “over,” but also may include the meaning of “above” or “over something” with no intervening features or layers therebetween (i.e., directly on something).

[0084] In addition, spatially relative terms, such as "below," "below," "beneath," "above," "above," etc., may be used herein for ease of description to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation shown in the figures. The device may have other orientations (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein may likewise be interpreted accordingly.

[0085] It should be noted that the phrases "one embodiment", "an embodiment", "an exemplary embodiment", "some embodiments", etc. mentioned in the specification indicate that the described embodiments may include certain features, structures or characteristics, but not every embodiment may include the certain features, structures or characteristics. In addition, such phrases do not necessarily refer to the same embodiment. In addition, when describing certain features, structures or characteristics in conjunction with an embodiment, it is within the knowledge of those skilled in the art to implement such features, structures or characteristics in conjunction with other embodiments, whether explicitly or not explicitly described.

[0086] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A connector structure, characterized in that: include: A circuit board and at least one cable (100); The circuit board comprises a laminate assembly (200) and a pad assembly (300), the laminate assembly (200) comprises at least two functional layers and at least one prepreg (230), the prepreg (230) is arranged between the two functional layers, and the pad assembly (300) is arranged on the functional layer and electrically connected to the wiring structure (211) of the functional layer; The end of the cable (100) has a crimping portion (110), the crimping portion (110) and the pad assembly (300) are both sandwiched between the functional layer and the prepreg (230), the crimping portion (110) is arranged on the pad assembly (300), and the functional layer opposite to the crimping portion (110) has an avoidance portion (221), and the avoidance portion (221) is arranged corresponding to the crimping portion (110).

2. The connector structure according to claim 1, characterized in that: The two functional layers include a core plate group (210) and at least one copper layer (220); or the two functional layers include two core plate groups (210).

3. The connector structure according to claim 2, characterized in that: The core plate group (210) includes at least two core plates, and the prepreg (230) is arranged between the two core plates.

4. The connector structure according to claim 1, characterized in that: The crimping portion (110) comprises at least two first electrical connection portions (111) and at least two second electrical connection portions (112), the first electrical connection portions (111) being electrically connected to a signal line (120) of the cable (100), and the second electrical connection portions (112) being electrically connected to a ground line (130) of the cable (100); The pad assembly (300) comprises at least two signal pads (310) and at least two ground pads (320), each of the ground pads (320) being arranged relatively on both sides of the at least two signal pads (310), the first electrical connection portion (111) being correspondingly connected to the signal pad (310), the second electrical connection portion (112) being correspondingly connected to the ground pad (320), and the signal pad (310) corresponding to the avoidance portion (221).

5. The connector structure according to claim 4, characterized in that: The signal pad (310) comprises a welding portion (311) and a buffer portion (312); the first electrical connection portion (111) is correspondingly arranged on the welding portion (311); one end of the buffer portion (312) is connected to the welding portion (311), and the other end is connected to the routing structure (211).

6. The connector structure according to claim 5, characterized in that: The length of the buffer portion (312) is 28 mil-32 mil, the width of the welding portion (311) is 11 mil-13 mil, the length of the welding portion (311) is 52 mil-56 mil, and the width of the first electrical connection portion (111) is 5 mil-7 mil.

7. The connector structure according to claim 5, characterized in that: The width of the buffer portion (312) at one end facing the crimping portion (110) is greater than the width of the buffer portion (312) at one end facing the wiring structure (211).

8. The connector structure according to claim 5, characterized in that: The width of the welding portion (311) is greater than or equal to the width of the first electrical connection portion (111), and the length of the welding portion (311) is greater than or equal to the length of the first electrical connection portion (111).

9. The connector structure according to any one of claims 1 to 8, characterized in that: A tin layer is provided between the crimping portion (110) and the pad assembly (300).

10. A method for preparing a connector structure, characterized in that: For preparing the connector structure according to any one of claims 1 to 9, the method comprises: Placing a functional layer on the pressing device, arranging a welding assembly (300) on the functional layer, and placing the pressing portion (110) on the welding assembly (300); The prepreg (230) is placed on the functional layer to cover the welding assembly (300) and the crimping portion (110), and another functional layer having a relief portion (221) is placed on the prepreg (230), wherein the relief portion (221) is opposite to the crimping portion (110); The lamination device performs lamination to connect the functional layer, the crimping portion (110) and the welding assembly (300) through the prepreg (230).

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