An automatic flipping and rounding device and method for microjet laser

Abstract

The present invention relates to an automatic flipping and rounding device and method for micro-jet laser, belonging to the field of laser processing technology, the device comprises: a flipping drive mechanism, a fixing mechanism, a receiving mechanism and a control module, the fixing mechanism clamps the crystal to be processed, the flipping drive mechanism drives the flipping, the receiving mechanism receives the crystal to be processed, and at the same time, the flipping drive mechanism and the receiving mechanism are both controlled by the control module. When the micro-jet laser is used to round a thicker crystal to be processed, the first processing surface and the second processing surface of the crystal to be processed are processed respectively by automatic flipping, and the depth of single-sided cutting is only half of that of the traditional method, which effectively reduces the processing time, improves the processing efficiency, and ensures the processing quality.

Description

Technical Field

[0001] The invention belongs to the technical field of laser processing, and in particular relates to an automatic flipping and rounding device and method for micro-jet laser. Background Art

[0002] With the rapid development of the manufacturing and aviation industries, the requirements for the processing quality of ultra-hard and brittle materials are becoming increasingly higher, which puts higher requirements on processing technology. Microjet laser processing technology uses a water jet to guide the laser beam to cut the workpiece to be processed. Due to the different refractive indices of water and air, when the laser beam irradiates the interface between water and air at a certain angle, if the incident angle of the laser beam is less than its critical angle of total reflection, the laser beam will be totally reflected and will not be transmitted, so that the laser energy is confined in the pure water column and propagates along the direction of the pure water column. The pure water column carrying the laser beam reaches the surface of the workpiece to be processed and removes the material by laser burning. At the same time, the pure water column also plays a role in removing impurities on the surface of the workpiece to be processed and cooling the processing area.

[0003] Silicon carbide wafers are typical ultra-brittle and hard materials. With the maturity of packaging technology, the use of microjet laser processing technology to cut silicon carbide wafers can significantly improve processing quality and reduce production costs. However, there are also some problems in the microjet laser cutting process. For example, when cutting wafers with larger diameters or thicknesses, as the cutting depth increases, the laser transmission efficiency is increasingly affected by the high-pressure water column, resulting in limited cutting efficiency and cutting depth, and even affecting processing quality. Therefore, there is a need for a device and method that can improve the efficiency of microjet laser cutting. Summary of the invention

[0004] In order to solve the above problems existing in the prior art, the present invention provides an automatic flipping and rounding device and method for micro-jet laser. The technical problem to be solved by the present invention is achieved by the following technical solutions:

[0005] The present invention provides an automatic flipping and rounding device for micro-jet laser, comprising: a flipping drive mechanism, a fixing mechanism, a receiving mechanism and a control module; wherein the fixing mechanism clamps the circumferential surface of the crystal to be processed; the rotation output end of the flipping drive mechanism is connected to the fixing mechanism, and drives the fixing mechanism to flip; the receiving mechanism comprises: a rodless cylinder and a lifting mechanism; wherein the rodless cylinder is arranged below the fixing mechanism in the horizontal direction, the lifting mechanism is slidably connected to the rodless cylinder, and the lifting mechanism is lifted and lowered in the vertical direction to receive the crystal to be processed; the control module controls the connection between the flipping drive mechanism and the receiving mechanism respectively, and is used to control the operation of the flipping drive mechanism and the receiving mechanism respectively.

[0006] In one embodiment of the present invention, an automatic flipping and rounding device for micro-jet laser also includes: a structural support, the structural support includes: a structural support, a self-lubricating sleeve and a motor support; wherein the motor support is arranged on one side of the structural support, and the self-lubricating sleeve is arranged on the other side of the structural support away from the motor support; the rodless cylinder is arranged on the structural support along the horizontal direction.

[0007] In one embodiment of the present invention, a flipping drive mechanism includes: a motor, a step spindle, a mounting ring and an auxiliary rotating shaft; wherein the motor is fixedly connected to a motor bracket, the output shaft of the motor is coaxially connected to the step spindle, and the step spindle is connected to the first side of the mounting ring as the rotating output end of the flipping drive mechanism; the auxiliary rotating shaft is respectively connected to the self-lubricating sleeve and the second side of the mounting ring; the auxiliary rotating shaft is coaxially arranged with the step spindle.

[0008] In one embodiment of the present invention, the flipping drive mechanism also includes: a flexible coupling, a threaded connecting shaft, an outer sleeve locking nut, an inner sleeve locking nut, an inner sleeve, an outer sleeve and an angular contact bearing group; wherein the flexible coupling coaxial sleeve is arranged outside the connection position between the first end of the threaded connecting shaft and the output shaft of the motor, and the second end of the threaded connecting shaft is threadedly connected to the step main shaft; the outer sleeve locking nut is threadedly connected to the structural bracket, the inner sleeve locking nut is threadedly connected to the step main shaft, and the outer sleeve locking nut and the inner sleeve locking nut are respectively abutted against the end faces of the angular contact bearing group; the angular contact bearing group includes two angular contact bearings, the two angular contact bearings are both sleeved on the step main shaft, and the inner sleeve and the outer sleeve are arranged between the two angular contact bearings.

[0009] In one embodiment of the present invention, the structural support also includes: a first limit block and a second limit block; the first limit block and the second limit block are respectively slidably connected to the structural support and fixed by bolts; a limit platform is provided at one end of the step main shaft, and the limit platform contacts the first limit block or the second limit block to limit the rotation of the step main shaft.

[0010] In one embodiment of the present invention, the mounting ring is annular, and mounting ears are symmetrically arranged on the first side and the second side of the mounting ring, and the two mounting ears are respectively connected to the step main shaft and the auxiliary rotating shaft.

[0011] In one embodiment of the present invention, a fixing mechanism comprises: a liner ring and a hanging ear; wherein, a plurality of strip holes are provided on the mounting ring, the liner ring is provided on the mounting ring, and the liner ring is adjustably connected to the mounting ring through the plurality of strip holes; a plurality of hanging ears are evenly arranged along the circumferential direction, and each hanging ear comprises: a clamping portion and a fixing portion connected to each other; the clamping portion is arc-shaped, and the circumferential surface of the crystal to be processed is clamped between the clamping portions of the plurality of hanging ears; the fixing portion is provided with a plurality of connecting holes at intervals along the radial direction of the liner ring, and the fixing portion is connected to the liner ring through some of the connecting holes.

[0012] In one embodiment of the present invention, the receiving mechanism further includes: a transfer plate and a spring plunger; the transfer plate is arranged on the lifting mechanism, and a plurality of spring plungers are evenly arranged on the transfer plate.

[0013] In one embodiment of the present invention, the receiving mechanism also includes: a pressure sensor, which is arranged between the lifting mechanism and the adapter plate, and the two ends of the pressure sensor are respectively threadedly connected to the lifting mechanism and the adapter plate; the pressure sensor is used to obtain the pressure value of the crystal to be processed, and the control module is used to control the lifting mechanism to lift and lower according to the pressure value of the crystal to be processed and control the lifting mechanism to slide along the rodless cylinder.

[0014] The present invention also provides an automatic flipping and rounding method for micro-jet laser, comprising:

[0015] S1: Fix the crystal to be processed on the fixing mechanism and calibrate the microjet laser;

[0016] S2: Move the receiving mechanism to the preparation position, lower the lifting mechanism to the lowest position, and correct and calibrate the output shaft of the motor;

[0017] S3: Setting the processing time of the microjet laser, starting the microjet laser to perform rounding processing on the first processing surface of the crystal to be processed, and turning off the microjet laser after the processing time is reached; wherein the processing time is the time required to complete the rounding processing of the first processing surface by the microjet laser;

[0018] S4: driving the crystal to be processed to turn over by a motor, setting a receiving pressure value, moving the receiving mechanism to the receiving station, raising the lifting mechanism to a high position to support the crystal to be processed, and continuously raising the lifting mechanism until the supporting force of the crystal to be processed reaches the receiving pressure value;

[0019] S5: starting the microjet laser to perform rounding on the second processing surface of the crystal to be processed until the rounding of the second processing surface is completed;

[0020] S6: Turn off the microjet laser and remove the processed crystal.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] The automatic flipping and rounding device for micro-jet laser provided by the present invention, when using micro-jet laser to round a crystal to be processed, clamps the crystal to be processed by a fixing mechanism, and drives the flipping by a flipping drive mechanism, thereby realizing double-sided rounding cutting, and the depth of single-sided cutting is only half of that of the traditional method, thereby solving the problem of a sharp decrease in processing efficiency caused by an increase in processing depth of micro-jet laser, improving processing efficiency and ensuring processing quality.

[0023] The receiving mechanism of the present invention receives the crystal to be processed during the rounding process to avoid damage to the crystal to be processed due to detachment from the clamp. The receiving mechanism is provided with a rodless cylinder and a lifting mechanism, and can switch between the preparation station and the receiving station, thereby avoiding interference between the receiving mechanism and the crystal to be processed. At the same time, the flipping drive mechanism and the receiving mechanism are both controlled by the control module, realizing automatic flipping and improving processing efficiency.

[0024] The receiving mechanism of the present invention contacts the receiving surface of the crystal to be processed through a spring plunger. Since the receiving surface of the crystal to be processed is not always horizontal, the spring plunger realizes adaptive adjustment of the receiving, thereby improving the stability of the receiving. The pressure value of the crystal to be processed is also obtained through a pressure sensor. When the flipping process is completed, the crystal to be processed is released from the clamping of the fixing mechanism, resulting in a numerical jump in the pressure value, thereby realizing automatic feedback.

[0025] The automatic flipping and rounding method for microjet laser provided by the present invention can process the first processing surface and the second processing surface of the crystal to be processed respectively by automatically flipping when the crystal to be processed is rounded by the microjet laser, thereby effectively reducing the processing time and improving the processing efficiency.

[0026] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the following specifically cites a preferred embodiment and describes it in detail with the accompanying drawings as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a structural front view of an automatic flipping and rounding device for micro-jet laser provided by an embodiment of the present invention;

[0028] Figure 2 It is a structural side view of an automatic flipping and rounding device for micro-jet laser provided in an embodiment of the present invention;

[0029] Figure 3 The embodiment of the present invention provides Figure 2 Structural cross-sectional view along the A axis;

[0030] Figure 4 It is a top view of the structure of the automatic flipping and rounding device for micro jet laser provided in an embodiment of the present invention;

[0031] Figure 5 is a schematic structural diagram of a step spindle provided by an embodiment of the present invention;

[0032] Figure 6 is a schematic structural diagram of a mounting ring provided in an embodiment of the present invention;

[0033] Figure 7 is a schematic structural diagram of an auxiliary rotating shaft provided in an embodiment of the present invention;

[0034] Figure 8 is a structural schematic diagram of a fixing mechanism provided by an embodiment of the present invention;

[0035] Fig. 9 is a schematic structural diagram of a liner ring provided in an embodiment of the present invention;

[0036] Fig.10 Schematic diagram of the working station of the automatic flipping and rounding device for micro-jet laser provided in an embodiment of the present invention;

[0037] Fig.11 It is a flow chart of the automatic flipping and rounding method for micro-jet laser provided in an embodiment of the present invention.

[0038] Icons: 1-structural support; 101-structural support; 102-self-lubricating sleeve; 103-first limit block; 104-motor support; 105-second limit block; 2-flipping drive mechanism; 201-motor; 202-flexible coupling; 203-threaded connecting shaft; 204-outer sleeve locking nut; 205-inner sleeve locking nut; 206-inner sleeve; 207-outer sleeve; 208-angular contact bearing group; 209-step spindle; 2091-limiting platform; 210-mounting ring; 2101-mounting ear; 211-auxiliary rotating shaft; 3-fixing mechanism; 301-bushing ring; 302-hanging ear; 4-supporting mechanism; 401-rodless cylinder; 402-lifting mechanism; 403-pressure sensor; 404-adapter plate; 405-spring plunger; 5-control module; 10-crystal to be processed. DETAILED DESCRIPTION

[0039] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined purpose of the invention, the following is a detailed description of an automatic flipping and rounding device and method for micro-jet laser proposed in accordance with the present invention, in combination with the accompanying drawings and specific implementation methods.

[0040] The above and other technical contents, features and effects of the present invention are clearly presented in the following detailed description of the specific implementation modes in conjunction with the accompanying drawings. Through the description of the specific implementation modes, the technical means and effects adopted by the present invention to achieve the predetermined purpose can be more deeply and specifically understood. However, the attached drawings are only for reference and explanation purposes and are not used to limit the technical solutions of the present invention.

[0041] Embodiment 1

[0042] like Figures 1 to 3As shown, the present invention provides an automatic flipping and rounding device for micro-jet laser, comprising: a flipping drive mechanism 2, a fixing mechanism 3, a receiving mechanism 4 and a control module 5; wherein the fixing mechanism 3 clamps the circumferential surface of the crystal 10 to be processed; the rotation output end of the flipping drive mechanism 2 is connected to the fixing mechanism 3, and drives the fixing mechanism 3 to flip; the receiving mechanism 4 comprises: a rodless cylinder 401 and a lifting mechanism 402; wherein the rodless cylinder 401 is arranged below the fixing mechanism 3 in the horizontal direction, and the lifting mechanism 402 is slidably connected to the rodless cylinder 401, and the lifting mechanism 402 is lifted and lowered in the vertical direction to receive the crystal 10 to be processed; the control module 5, which controls the connection between the flipping drive mechanism 2 and the receiving mechanism 4 respectively, is used to control the operation of the flipping drive mechanism 2 and the receiving mechanism 4 respectively.

[0043] The principle is that the crystal 10 to be processed is clamped on the fixing mechanism 3, and the fixing mechanism 3 performs a flipping motion with the rotating output end of the flip driving mechanism 2, so that the first processing surface and the second processing surface of the crystal 10 to be processed are respectively rounded by the microjet laser; wherein the first processing surface and the second processing surface of the crystal 10 to be processed are arranged opposite to each other, and after the rounding processing is performed by the microjet laser, the rounding processing gaps on the first processing surface and the second processing surface can be matched. The lifting mechanism 402 is used to receive the crystal 10 to be processed. After the processing of the second processing surface is completed, since the crystal 10 to be processed falls off from the fixing mechanism 3, the lifting mechanism 402 plays the role of receiving the fallen crystal 10 to be processed, so as to avoid collision damage caused by free fall of the crystal 10 to be processed. The control module 5 can control the rotation of the output end of the flipping drive mechanism 2, and can also control the lifting mechanism 402 to slide along the rodless cylinder 401 to approach or move away from the crystal 10 to be processed, and control the lifting mechanism 402 to lift and lower in the vertical direction, thereby improving the degree of automation of the rounding process and realizing the automated control of flipping and receiving.

[0044] In this embodiment, if Figure 3 As shown, the automatic flipping and rounding device for micro-jet laser also includes: a structural support 1, the structural support 1 includes: a structural support 101, a self-lubricating sleeve 102 and a motor support 104; wherein the motor support 104 is arranged on one side of the structural support 101, and the self-lubricating sleeve 102 is arranged on the other side of the structural support 101 away from the motor support 104; the rodless cylinder 401 is arranged on the structural support 1 along the horizontal direction.

[0045] Exemplarily, a plurality of slots are provided at the bottom of the structural bracket 101, and the structural bracket 101 is connected to the machine tool worktable through the plurality of slots; an output shaft mounting hole is provided on one side of the structural bracket 101, and a sleeve mounting hole is provided on the other opposite side of the structural bracket 101, and the self-lubricating sleeve 102 has a small interference fit with the sleeve mounting hole and is fastened by screws; a mounting groove for connecting the rodless cylinder 401 and the lifting mechanism 402 is also provided in the middle of the structural bracket 101 to ensure that the lifting mechanism 402 can be installed and moved into place.

[0046] Preferably, the motor bracket 104 is provided with a plurality of strip grooves, each of which is provided with at least two screws, and the motor bracket 104 is fixed to the structural bracket 101 by fine-tuning the screws in each strip groove. A strip opening is also provided on one side of the motor bracket 104, and the strip opening is connected to the through hole for installing the motor 201, and a pre-tightening screw is provided perpendicular to the strip opening, and the strip opening can be tightened by the pre-tightening screw. When assembling the motor bracket 104 and the motor 201, first pre-tighten the plurality of screws connecting the structural bracket 101, then pre-tighten the pre-tightening screws connecting the strip opening, and finally fine-tune the positions of the plurality of screws and then tighten them respectively, so as to ensure that the output shaft of the motor 201 is coaxial with the step spindle 209 at the initial stage of assembly.

[0047] In an optional embodiment, if Figure 3 As shown, the flipping drive mechanism 2 includes: a motor 201, a step spindle 209, a mounting ring 210 and an auxiliary rotating shaft 211; wherein the motor 201 is fixedly connected to the motor bracket 104, the output shaft of the motor 201 is coaxially connected to the step spindle 209, and the step spindle 209, as the rotating output end of the flipping drive mechanism 2, is connected to the first side of the mounting ring 210; the auxiliary rotating shaft 211 is respectively connected to the self-lubricating sleeve 102 and the second side of the mounting ring 210; and the auxiliary rotating shaft 211 is coaxially arranged with the step spindle 209.

[0048] Further, such as Figure 3As shown, the flipping drive mechanism 2 also includes: a flexible coupling 202, a threaded connecting shaft 203, an outer sleeve locking nut 204, an inner sleeve locking nut 205, an inner sleeve 206, an outer sleeve 207 and an angular contact bearing group 208; wherein, the flexible coupling 202 is coaxially sleeved outside the connection position between the first end of the threaded connecting shaft 203 and the output shaft of the motor 201, and the second end of the threaded connecting shaft 203 is threadedly connected to the step main shaft 209; the outer sleeve locking nut 204 is threadedly connected to the structural bracket 101, the inner sleeve locking nut 205 is threadedly connected to the step main shaft 209, and the outer sleeve locking nut 204 and the inner sleeve locking nut 205 are respectively abutted on the end surface of the angular contact bearing group 208; the angular contact bearing group 208 includes two angular contact bearings, both of which are sleeved on the step main shaft 209, and the inner sleeve 206 and the outer sleeve 207 are respectively arranged between the two angular contact bearings.

[0049] Preferably, the wide end faces of the two angular contact bearings are arranged opposite to each other.

[0050] Exemplarily, the step spindle 209 is inserted into the output shaft mounting hole of the structural support 101, and the two ends of the flexible coupling 202 respectively clamp the first end of the threaded connection shaft 203 and the output shaft of the motor 201, and the second end of the threaded connection shaft 203 is threadedly connected to the step spindle 209 and locked by a radial set screw to ensure that the threaded connection shaft 203 and the step spindle 209 are coaxial and rotate synchronously; two angular contact bearings are sleeved on the step spindle 209, and the outer sleeve locking nut 204 is screwed with the output shaft mounting hole of the structural support 101 to press the outer ring of the angular contact bearing, and then press the outer sleeve 207 and the outer ring of the other angular contact bearing in turn and finally press it on the bottom step of the output shaft mounting hole. The inner sleeve locking nut 205 is screwed with the step spindle 209, and then presses the inner ring of the angular contact bearing, the inner sleeve 206 and the inner ring of the other angular contact bearing in turn and finally presses it on the bottom step of the step spindle 209.

[0051] Preferably, the inner sleeve 206 is provided with an elastic structure along the axial direction, and the elastic structure ensures that the steel balls of the two angular contact bearings are pressed against the arc surfaces of their respective bearing outer rings, thereby locking the step main shaft 209 along the axial direction.

[0052] In an optional embodiment, if Figure 3 , Figure 4 and Figure 6 As shown, the mounting ring 210 is ring-shaped, and mounting ears 2101 are symmetrically arranged on the first side and the second side of the mounting ring 210 . The two mounting ears 2101 are respectively connected to the step main shaft 209 and the auxiliary rotating shaft 211 .

[0053] In an optional embodiment, if Figure 5 , Figure 6 and Figure 7 As shown, both the step spindle 209 and the auxiliary rotating shaft 211 are provided with mounting grooves, and two mounting ears 2101 are respectively arranged in the mounting grooves of the step spindle 209 and the auxiliary rotating shaft 211, and are fixed and locked by positioning pins, so that the rotational torque of the output shaft of the motor 201 can be transmitted to the step spindle 209, and then transmitted to the mounting ring 210 by the step spindle 209, and drive the crystal 10 to be processed to turn over.

[0054] In an optional embodiment, if Figure 1 , Figure 3 , Figure 4 and Figure 5 As shown, the structural support 1 also includes: a first limit block 103 and a second limit block 105; the first limit block 103 and the second limit block 105 are respectively slidably connected to the structural support 101 and fixed by bolts; a limit platform 2091 is set at one end of the step main shaft 209, and the limit platform 2091 contacts the first limit block 103 or the second limit block 105 to limit the rotation of the step main shaft 209.

[0055] The principle is that a limit platform 2091 is provided on the side of one end of the step main shaft 209. When the step main shaft 209 rotates, it will be limited by one of the limit blocks. When the step main shaft 209 rotates in the opposite direction to the position of the other limit block, it will also be limited. The rotation at the position between the two limit blocks will not be affected. It can be understood that when the over-flipping or under-flipping is caused by electrical failure, the mechanical limit can provide limit protection, thereby improving the reliability of the device.

[0056] In an optional embodiment, if Figure 4 , Figure 6 , Figure 8 and Fig. 9 As shown, the fixing mechanism 3 includes: a liner ring 301 and a hanging ear 302; wherein, a plurality of bar holes are provided on the mounting ring 210, the liner ring 301 is provided on the mounting ring 210, and the liner ring 301 is adjustably connected to the mounting ring 210 through the plurality of bar holes; a plurality of hanging ears 302 are evenly arranged along the circumferential direction, for example, four hanging ears 302 are evenly arranged along the circumferential direction, and each hanging ear 302 includes: a clamping portion and a fixing portion connected to each other; the clamping portion is arc-shaped, and the circumferential surface of the crystal 10 to be processed is clamped between the clamping portions of the plurality of hanging ears 302; the fixing portion is provided with a plurality of connecting holes at intervals along the radial direction of the liner ring 301, and the fixing portion is connected to the liner ring 301 through some of the connecting holes.

[0057] Exemplarily, the crystal 10 to be processed is located in the central area of ​​the backing ring 301, and adhesive is applied to the clamping parts of the four hanging ears 302 respectively, and the crystal 10 to be processed is bonded to the four hanging ears 302 respectively. After the crystal 10 to be processed is firmly bonded, the backing ring 301 and the crystal 10 to be processed are placed on the mounting ring 210 as a whole. A plurality of strip holes are arranged at intervals on the mounting ring 210, and the plurality of strip holes are bolt through holes. The backing ring 301 and the mounting ring 210 are connected as a whole by bolts passing through the connection holes on the backing ring 301 and the corresponding strip holes.

[0058] It is worth noting that the circumferential surface of the crystal 10 to be processed is clamped between the arc surfaces of the clamping parts of several lugs 302. The connection position of the lugs 302 on the liner ring 301 is adjusted through the connecting holes on the fixing parts, which can adapt to the diameter size of the crystal 10 to be processed, thereby improving the applicability of the fixing mechanism 3.

[0059] In addition, since there are crystalline phases in the crystal 10 to be processed, it is necessary to align the crystalline phases during the rounding process. Therefore, the operator will mark a reference cross line on the crystal 10 to be processed. When the crystal 10 to be processed is connected to the liner ring 301, it is necessary to first align the connecting hole on the liner ring 301 with the reference cross line. When connecting the mounting ring 210 and the liner ring 301, the installation angle of the liner ring 301 can also be adjusted by rotation through the several bar holes on the mounting ring 210, and then locked by bolts and nuts respectively, thereby further improving the applicability of the fixing mechanism 3 and ensuring the assembly accuracy and processing quality.

[0060] In an optional embodiment, if Figure 3 As shown, the receiving mechanism 4 further includes: a transfer plate 404 and a spring plunger 405 ; the transfer plate 404 is arranged on the lifting mechanism 402 , and a plurality of spring plungers 405 are evenly arranged on the transfer plate 404 .

[0061] In an optional embodiment, if Figure 3 As shown, the receiving mechanism 4 also includes: a pressure sensor 403, which is arranged between the lifting mechanism 402 and the adapter plate 404, and the two ends of the pressure sensor 403 are respectively threadedly connected to the lifting mechanism 402 and the adapter plate 404; the pressure sensor 403 is used to obtain the pressure value of the crystal 10 to be processed, and the control module 5 is used to control the lifting and lowering of the lifting mechanism 402 according to the pressure value of the crystal 10 to be processed and control the lifting mechanism 402 to slide along the rodless cylinder 401.

[0062] Exemplarily, the lifting mechanism 402 has a built-in lifting motor, which drives its lifting platform to perform lifting movements. The pressure sensor 403 is vertically arranged on the lifting platform of the lifting mechanism 402 and rises and falls with the lifting platform. The pressure sensor 403 is tightened with the lifting platform through threads and sealant is applied in the thread gap.

[0063] like Figure 3 and Fig.10 As shown, the working principle of the receiving mechanism 4 is that when the lifting mechanism 402 is in the receiving station, it is located below the crystal 10 to be processed, and the rodless cylinder 401 drives the lifting mechanism 402 to slide between the preparation station and the receiving station to switch positions, and the distance between the preparation station and the receiving station is Greater than the maximum rotation radius of the fixing mechanism 3 . The lifting platform of the lifting mechanism 402 can be lifted and lowered in the vertical direction. After one processing surface of the crystal 10 to be processed is processed, the crystal 10 to be processed is turned over, and the rodless cylinder 401 drives the lifting mechanism 402 to slide from the preparation station to the receiving station; as the lifting platform of the lifting mechanism 402 is lifted, several spring plungers 405 all contact the processing surface of the crystal 10 to be processed, and the lifting platform of the lifting mechanism 402 continues to lift until the pressure value of the pressure sensor 403 reaches the set value, that is, a reliable supporting force is achieved, which can ensure the stable support. After the support is stable, the lifting mechanism 402 stops moving and locks the position, and during the rounding process of the second processing surface of the crystal 10 to be processed, the pressure value of the pressure sensor 403 remains constant.

[0064] It is easy to understand that after the crystal 10 to be processed is turned over and rounded, it is disengaged from the fixing mechanism 3 and falls naturally. After falling onto the spring plunger 405, the pressure value of the pressure sensor 403 jumps. At this time, the control module 5 can obtain the information of the pressure value jump, thereby sending a feedback signal to the main control system of the processing machine to shut down the microjet laser and remind the equipment operator that the processing is completed.

[0065] It can be understood that the automatic flipping and rounding device for micro-jet laser of this embodiment can be implemented as an integral module and added to the existing equipment through modification; it can also be integrally embedded when the equipment is designed and developed.

[0066] The automatic flipping and rounding device for microjet laser of the present invention, when using microjet laser to round a crystal to be processed, clamps the crystal to be processed by a fixing mechanism, and drives the flipping by a flipping drive mechanism, thereby realizing double-sided rounding cutting, and the depth of single-sided cutting is only half of that of the traditional method, thereby solving the problem of a sharp decrease in processing efficiency caused by an increase in processing depth of microjet laser, improving processing efficiency and ensuring processing quality.

[0067] The receiving mechanism of the present invention receives the crystal to be processed during the rounding process to avoid damage to the crystal to be processed due to detachment from the clamp. The receiving mechanism is provided with a rodless cylinder and a lifting mechanism, and can switch between the preparation station and the receiving station, thereby avoiding interference between the receiving mechanism and the crystal to be processed. At the same time, the flipping drive mechanism and the receiving mechanism are both controlled by the control module, realizing automatic flipping and improving processing efficiency.

[0068] The receiving mechanism of the present invention contacts the receiving surface of the crystal to be processed through a spring plunger. Since the receiving surface of the crystal to be processed is not always horizontal, the spring plunger realizes adaptive adjustment of the receiving, thereby improving the stability of the receiving. The pressure value of the crystal to be processed is also obtained through a pressure sensor. When the flipping process is completed, the crystal to be processed is released from the clamping of the fixing mechanism, resulting in a numerical jump in the pressure value, thereby realizing automatic feedback.

[0069] Embodiment 2

[0070] like Fig.11 As shown, this embodiment also provides an automatic flipping and rounding method for micro-jet laser, comprising:

[0071] S1: Fix the crystal to be processed on the fixing mechanism and calibrate the microjet laser.

[0072] Exemplarily, fixing the crystal to be processed on the fixing mechanism includes: placing the crystal to be processed together with the backing ring on the operating platform, and a layer of film can be pre-laid on the operating platform to avoid contamination; placing the crystal to be processed in the central area of ​​the backing ring, adjusting the connection holes of the four hanging ears to adapt to the diameter of the crystal to be processed, applying adhesive on the clamping parts of the four hanging ears respectively, and bonding the crystal to be processed to the four hanging ears respectively. After the crystal to be processed is firmly bonded, the backing ring is placed on the mounting ring, and the mounting angle of the backing ring is adjusted by rotating through a plurality of bar holes on the mounting ring, and is locked by bolts and nuts respectively, thereby completing the fixed clamping of the crystal to be processed and the fixing mechanism.

[0073] In an optional embodiment, calibrating the microjet laser comprises the steps of:

[0074] S1.1: Calibrate the verticality of the optical head of the microjet laser, determine the processing origin of the microjet laser and set the process parameters of the microjet laser.

[0075] Exemplarily, a calibration block is fixed on a structural support so that the calibration block is parallel to the processing direction of the rounding process performed by the microjet laser, a slit is cut on the calibration block by the microjet laser, and a water jet is brought as close to the calibration plate as possible at any position of the cutting, but without causing the water jet to be damaged due to the obstruction of the calibration block. The optical head of the microjet laser is raised or lowered, and the water jet is continuously observed to see if damage occurs. If damage occurs, the optical head of the microjet laser is adjusted in the opposite direction of the approach direction to achieve calibration of the verticality of the optical head of the microjet laser.

[0076] S1.2: Determine the position of the nozzle of the calibrated microjet laser optical head on the workbench of the machine tool as the processing origin of the microjet laser;

[0077] S1.3: Set the process parameters of the microjet laser.

[0078] In an optional embodiment, the process parameters of the microjet laser include: using a green nanosecond pulse laser with a wavelength of 532nm, a nozzle diameter range of 50 to 80μm, a distance between the nozzle and the processing surface of the crystal to be processed of 8 to 10mm, a water pressure of 300bar, a cutting speed of 500 to 1000mm / min, a gas flow rate of not less than 0.06L / min, and an average power density of not less than 18MW / cm after microjet laser coupling. 2 Preferably, the nozzle diameter can be 50 μm, and the average coupling power density at the microjet laser processing position and after the nozzle is raised by 10 mm is not less than 18 MW / cm 2 The distance between the microjet laser and the processing position of the crystal surface to be processed can be 8 mm, helium is selected as the protective gas, and the flow rate of helium can be 0.06 L / min.

[0079] Furthermore, after calibrating the microjet laser, the visual camera of the processing machine tool needs to be calibrated according to the processing origin of the microjet laser to obtain the relative origin of the visual camera; the visual camera calibration includes: parallelism calibration and relative position calibration.

[0080] S2: Move the receiving mechanism to the preparation position, lower the lifting mechanism to the lowest position, and calibrate and calibrate the output shaft of the motor.

[0081] Exemplarily, the output shaft of the motor is corrected by the visual camera of the processing machine so that the output shaft of the motor is parallel to any horizontal motion axis of the processing machine. Then, the height value of the upper plane of the mounting ring is measured by the probe of the processing machine, and the height values ​​of the upper plane of the mounting ring are made consistent by rotating the output shaft of the motor, thereby completing the leveling of the upper plane of the mounting ring. At this time, the output shaft of the motor is calibrated to the 0° position through the control module. Similarly, the output shaft of the motor is rotated 180°, and the lower plane of the mounting ring is leveled, and the output shaft of the motor is calibrated to the 180° position through the control module. Repeat several times until the upper and lower planes of the mounting ring are parallel to the motion plane of the processing machine after flipping.

[0082] Furthermore, after repeated verifications to ensure that the calibration of the motor output shaft is correct, the mechanical limit is installed, the motor output shaft is rotated from 0° to -0.5°, the first limit block is slid, the upper end surface of the first limit block is closely attached to the lower plane of the step spindle limit platform, and the first limit block is locked to the structural bracket by screws. Similarly, the motor output shaft is reversely rotated from 0° to 180°, and then further rotated to 180.5°, the second limit block is slid, the upper end surface of the second limit block is closely attached to the upper plane of the step spindle limit platform, and the second limit block is locked to the structural bracket by screws.

[0083] It should be noted that in order to avoid interference and collision between the receiving mechanism and the crystal to be processed, the receiving mechanism is always in the preparation position when the rounding process is not performed. At the same time, the lifting mechanism of the receiving mechanism is lowered to a low position to ensure that the fixing mechanism and the crystal to be processed do not contact the lifting mechanism when they are flipped over.

[0084] S3: Setting the processing time of the microjet laser, starting the microjet laser to perform rounding processing on the first processing surface of the crystal to be processed, and turning off the microjet laser after the processing time is reached; wherein the processing time is the time required to complete the rounding processing of the first processing surface by the microjet laser;

[0085] S4: driving the crystal to be processed to turn over by a motor, setting a receiving pressure value, moving the receiving mechanism to the receiving station, raising the lifting mechanism to a high position to support the crystal to be processed, and continuously raising the lifting mechanism until the supporting force of the crystal to be processed reaches the receiving pressure value;

[0086] S5: Start the microjet laser to perform rounding on the second processing surface of the crystal to be processed until the rounding of the second processing surface is completed.

[0087] It should be noted that, according to the processing requirements of the crystal to be processed, the processing time can be set for the microjet laser, and when the working time of the microjet laser reaches the processing time, the rounding processing of the first processing surface of the crystal to be processed is completed; the control module turns off the microjet laser after obtaining that the working time of the microjet laser has reached the processing time, and the control module then controls the output shaft of the motor to rotate to drive the crystal to be processed to turn over; finally, the receiving mechanism is controlled to move from the preparation station to the receiving station, and the lifting mechanism is raised to a high position, and the lifting platform of the lifting mechanism continues to rise until the supporting force of the crystal to be processed reaches the receiving pressure value, and the lifting platform stops moving and locks the position.

[0088] It is worth noting that reaching the acceptance pressure value not only ensures the stable and reliable acceptance of the crystal to be processed, but also can obtain the change of pressure value through the pressure sensor after completing the rounding process of the second processing surface of the crystal to be processed, and obtain the information of the pressure value jump through the control module, thereby sending a feedback signal to the main control system of the processing machine tool to shut down the microjet laser.

[0089] S6: Turn off the microjet laser and remove the processed crystal.

[0090] The automatic flipping and rounding method for microjet laser of the present invention can process the first processing surface and the second processing surface of the crystal to be processed respectively by automatically flipping when the crystal to be processed is rounded by the microjet laser, thereby effectively reducing the processing time and improving the processing efficiency.

[0091] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. Moreover, the term "include", "comprise" or any other variant is intended to cover non-exclusive inclusion, so that the article or device including a series of elements includes not only those elements, but also other elements that are not explicitly listed. In the absence of more restrictions, the elements defined by the sentence "including one..." do not exclude the existence of other identical elements in the article or device including the elements. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The orientation or position relationship indicated by "up", "down", "left", "right", etc. is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention.

[0092] The above contents are further detailed descriptions of the present invention in combination with specific preferred embodiments, and it cannot be determined that the specific implementation of the present invention is limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as falling within the protection scope of the present invention.

Claims

1. An automatic flipping and rounding device for micro-jet laser, characterized in that: include: A structural support (1), a turning drive mechanism (2), a fixing mechanism (3), a receiving mechanism (4) and a control module (5); The fixing mechanism (3) clamps the circumferential surface of the crystal (10) to be processed; the rotation output end of the flipping driving mechanism (2) is connected to the fixing mechanism (3) and drives the fixing mechanism (3) to flip; The receiving mechanism (4) comprises: a rodless cylinder (401) and a lifting mechanism (402); wherein the rodless cylinder (401) is arranged below the fixing mechanism (3) in the horizontal direction, the lifting mechanism (402) is slidably connected to the rodless cylinder (401), and the lifting mechanism (402) is lifted and lowered in the vertical direction to receive the crystal (10) to be processed; The control module (5) is respectively connected to the flipping drive mechanism (2) and the receiving mechanism (4), and is used to respectively control the flipping drive mechanism (2) and the receiving mechanism (4) to work; The structural support (1) comprises: a structural support (101), a self-lubricating bushing (102) and a motor support (104); the motor support (104) is arranged on one side of the structural support (101), and the self-lubricating bushing (102) is arranged on the other side of the structural support (101) away from the motor support (104); the rodless cylinder (401) is arranged on the structural support (1) in a horizontal direction; The flipping drive mechanism (2) comprises: a motor (201), a step spindle (209), a mounting ring (210) and an auxiliary rotating shaft (211); the motor (201) is fixedly connected to the motor bracket (104); the output shaft of the motor (201) is coaxially connected to the step spindle (209); the step spindle (209) as the rotation output end of the flipping drive mechanism (2) is connected to the first side of the mounting ring (210); the auxiliary rotating shaft (211) is respectively connected to the self-lubricating sleeve (102) and the second side of the mounting ring (210); the auxiliary rotating shaft (211) is coaxially arranged with the step spindle (209); the mounting ring (210) is annular, and mounting ears (2101) are symmetrically arranged on the first side and the second side of the mounting ring (210); the two mounting ears (2101) are respectively connected to the step spindle (209) and the auxiliary rotating shaft (211); The fixing mechanism (3) comprises: a liner ring (301) and a hanging ear (302); The mounting ring (210) is provided with a plurality of strip holes, the backing ring (301) is provided on the mounting ring (210), and the backing ring (301) is adjustably connected to the mounting ring (210) through the plurality of strip holes; a plurality of the hanging ears (302) are evenly arranged along the circumferential direction, and each of the hanging ears (302) comprises: a clamping portion and a fixing portion connected to each other; the clamping portion is arc-shaped, and the circumferential surface of the crystal (10) to be processed is clamped between the clamping portions of the plurality of the hanging ears (302); the fixing portion is provided with a plurality of connection holes at intervals along the radial direction of the backing ring (301), and the fixing portion is connected to the backing ring (301) through some of the connection holes; The receiving mechanism (4) further comprises: an adapter plate (404), a spring plunger (405) and a pressure sensor (403); the adapter plate (404) is arranged on the lifting mechanism (402), and a plurality of spring plungers (405) are evenly arranged on the adapter plate (404); the pressure sensor (403) is arranged between the lifting mechanism (402) and the adapter plate (404), and two ends of the pressure sensor (403) are respectively threadedly connected to the lifting mechanism (402) and the adapter plate (404); the pressure sensor (403) is used to obtain the pressure value of the crystal to be processed (10), and the control module (5) is used to control the lifting and lowering of the lifting mechanism (402) according to the pressure value of the crystal to be processed (10) and control the lifting mechanism (402) to slide along the rodless cylinder (401).

2. The automatic flipping and rounding device for micro jet laser according to claim 1, characterized in that: The flipping drive mechanism (2) further comprises: a flexible coupling (202), a threaded connecting shaft (203), an outer shaft sleeve locking nut (204), an inner shaft sleeve locking nut (205), an inner shaft sleeve (206), an outer shaft sleeve (207) and an angular contact bearing group (208); The flexible coupling (202) is coaxially sleeved outside the connection position between the first end of the threaded connection shaft (203) and the output shaft of the motor (201), and the second end of the threaded connection shaft (203) is threadedly connected to the step main shaft (209); The outer sleeve locking nut (204) is threadedly connected to the structural bracket (101), the inner sleeve locking nut (205) is threadedly connected to the stepped main shaft (209), and the outer sleeve locking nut (204) and the inner sleeve locking nut (205) are respectively abutted against the end surface of the angular contact bearing group (208); The angular contact bearing group (208) comprises two angular contact bearings, both of which are sleeved on the step main shaft (209), and the inner sleeve (206) and the outer sleeve (207) are arranged between the two angular contact bearings.

3. The automatic flipping and rounding device for micro-jet laser according to claim 1, characterized in that: The structural support (1) further comprises: a first limiting block (103) and a second limiting block (105); the first limiting block (103) and the second limiting block (105) are respectively slidably connected to the structural support (101) and fixed by bolts; A limiting platform (2091) is provided at one end of the step main shaft (209), and the limiting platform (2091) contacts the first limiting block (103) or the second limiting block (105) to limit the rotation of the step main shaft (209).

4. A method for automatic flipping and rounding using micro-jet laser, characterized in that: Using the automatic flipping and rounding device for microjet laser as described in any one of claims 1 to 3, the method comprises: S1: Fix the crystal to be processed on the fixing mechanism and calibrate the microjet laser; S2: Move the receiving mechanism to the preparation position, lower the lifting mechanism to the lowest position, and correct and calibrate the output shaft of the motor; S3: Setting the processing time of the microjet laser, starting the microjet laser to perform rounding processing on the first processing surface of the crystal to be processed, and turning off the microjet laser after the processing time is reached; wherein the processing time is the time required for completing the rounding processing of the first processing surface by the microjet laser; S4: driving the crystal to be processed to turn over by the motor, setting a receiving pressure value, moving the receiving mechanism to a receiving station, raising the lifting mechanism to a high position to support the crystal to be processed, and continuously raising the lifting mechanism until the supporting force of the crystal to be processed reaches the receiving pressure value; S5: starting the microjet laser to perform rounding on the second processing surface of the crystal to be processed until the rounding of the second processing surface is completed; S6: Turn off the microjet laser and remove the processed crystal.

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