Mechanical device for transmitting silicon wafers

Abstract

The invention relates to the technical field of silicon wafer production, and discloses a mechanical device for conveying silicon wafers, which comprises a bottom box, a conveying frame and a conveying belt, the conveying frame is positioned above the bottom box, a telescopic rotating column which is upwards led out is rotatably arranged in the bottom box, and the upper end of the telescopic rotating column is fixedly connected with the bottom of the conveying frame; a rotating driving mechanism connected with the telescopic rotating column is arranged in the bottom box; the conveying belt is arranged in the conveying frame in a transmission mode, an air blowing box is fixedly arranged on one side of the conveying frame, an air suction box is fixedly arranged on the other side of the conveying frame, and first mounting bases are fixedly arranged on the two sides of the top of the conveying frame. According to the mechanical device for conveying the silicon wafers, the silicon wafers are conveyed and processed in a conveying belt mode, the efficiency is high, the conveying direction of the conveying belt can be adjusted, the silicon wafers can be conveyed to processing stations in different directions, in addition, a structure for blowing air to remove impurities and dust on the surfaces of the silicon wafers is arranged, the processing quality of the silicon wafers is guaranteed, and the use quality of products is improved.

Description

Technical Field

[0001] The invention relates to the technical field of silicon wafer production, and in particular to a mechanical device for transmitting silicon wafers. Background Art

[0002] Currently in the semiconductor industry, because silicon wafers are very expensive and the process manufacturing has very high requirements for mechanical particles on the surface of silicon wafers, the handling of silicon wafers requires not only high stability but also high cleanliness. Since silicon wafers need to be repeatedly transferred between various process equipment at high speed, accurately, cleanly and absolutely safely during production, a high-efficiency and high-stability transfer device is required to complete this task.

[0003] Among them, the disclosure (announcement) number: CN109192687B discloses a mechanical device for transmitting silicon wafers, which includes an X-axis driving mechanism, a Z-axis driving mechanism, a Z-axis rotation driving mechanism, two sets of independent Y-axis driving mechanisms, a first hand fork, a second hand fork and a correction device, wherein the X-axis driving mechanism is equipped with a Z-axis driving mechanism, the Z-axis driving mechanism is equipped with a Z-axis rotation driving mechanism, the Z-axis rotation driving mechanism is equipped with two sets of independent Y-axis driving mechanisms, the two sets of independent Y-axis driving mechanisms are respectively used to drive the first hand fork and the second hand fork to perform horizontal telescopic movements, and the correction device is installed on the housing of the Z-axis driving mechanism.

[0004] In the above scheme, a device for transmitting silicon wafers is proposed, and the silicon wafers are transported by a distance in the X-axis direction. However, if the transmission route is long, the transmission efficiency in the X-axis direction is not high, resulting in reduced production efficiency. Moreover, sometimes the transmission route of silicon wafer processing needs to be changed, which will cause the transmission position of the silicon wafer to change. The above scheme cannot adjust the transmission route of the silicon wafer at will. In addition, due to the pollution of the production environment, impurities or dust will be attached to the surface of the silicon wafer. If the transmission process is directly performed, the processing quality of the silicon wafer will be reduced, thereby affecting the use effect of the silicon wafer in the later stage. For this reason, a mechanical device for transmitting silicon wafers is proposed. Summary of the invention

[0005] 1. Technical issues to be resolved In view of the shortcomings of the prior art, the present invention provides a mechanical device for transmitting silicon wafers, which adopts a conveyor belt to transport silicon wafers for processing. It is not only highly efficient, but also the transmission direction of the conveyor belt can be adjusted so that the silicon wafers can be transmitted to processing stations in different directions. In addition, it has a structure for blowing air to remove impurities and dust on the surface of the silicon wafer, which ensures the processing quality of the silicon wafer, improves the quality of product use, and solves the problems raised by the background technology.

[0006] (II) Technical solution To achieve the above-mentioned purpose, the present invention provides the following technical solutions: A mechanical device for transmitting silicon wafers, comprising a bottom box, a transmission frame and a transmission belt, wherein the transmission frame is located above the bottom box, and a telescopic rotating column extending upward is rotatably provided inside the bottom box, and the upper end of the telescopic rotating column is fixedly connected to the bottom of the transmission frame, and a rotating driving mechanism connected to the telescopic rotating column is provided inside the bottom box; the transmission belt transmission is arranged inside the transmission frame, a blowing box is fixedly provided on one side of the transmission frame, and a suction box is fixedly provided on the other side of the transmission frame, first mounting seats are fixedly provided on both sides of the top of the transmission frame, first cylinders are fixedly provided on the side walls of the two first mounting seats, and blowing plates and suction plates are fixedly provided at the ends of the piston rods of the two first cylinders, respectively, and the blowing plates and suction plates are respectively connected to the blowing boxes and suction boxes through air ducts; a second mounting seat is fixedly provided at the upper end of the tail of the transmission frame, a second cylinder is fixedly provided on the side wall of the second mounting seat, and a push plate is fixedly provided at the end of the piston rod of the second cylinder, and a notch is provided on one side of the transmission frame and at a position corresponding to the position of the push plate, and a discharge plate is fixedly provided at the notch.

[0007] Preferably, the rotary drive mechanism includes a third cylinder, a rack and a gear, a rotating shaft is fixedly provided at the lower end of the telescopic rotating column, and the lower end of the rotating shaft is rotatably connected to the bottom inner wall of the bottom box, the gear is fixedly set on the shaft wall of the rotating shaft, the third cylinder is fixedly set on the inner side wall of the bottom box, the piston rod end of the third cylinder is fixedly connected to the rack, and the rack is meshing with the gear.

[0008] Preferably, a controller is fixedly provided on the inner wall of the bottom box, and the first cylinder, the second cylinder and the third cylinder are all electrically connected to the controller.

[0009] Preferably, an inlet fan is fixedly provided at the bottom of the blowing box, an outlet fan is fixedly provided at the bottom of the suction box, a filter is fixedly provided at an inclination inside the suction box, a vibration motor is fixedly installed at the bottom of the filter, a slag removal port is provided on the side wall of the suction box and on the side where the filter is inclined downward, and a cover is provided on the internal thread of the slag removal port.

[0010] Preferably, one end of the air duct extends to the interior of the air suction box and is fixedly provided with an air distribution pipe, a tube wall of the air distribution pipe is provided with a plurality of evenly distributed air distribution holes, and the air distribution pipe is located above the filter screen.

[0011] Preferably, the telescopic rotating column includes a lower column and an upper column, the lower column is plugged into the upper column, the lower end of the lower column is fixedly connected to the rotating shaft, the upper end of the upper column is fixedly connected to the transmission frame, and the connection between the lower column and the upper column is provided with bolts and nuts that cooperate with each other.

[0012] Preferably, an angle pointer is fixedly provided on the column wall of the lower column, and an angle dial is fixedly embedded on the top of the bottom box, and the angle pointer and the angle dial are arranged in corresponding positions.

[0013] Preferably, a mounting groove is provided on the surface of the discharge plate, an infrared sensor is fixedly installed inside the mounting groove, and a transparent glass cover for blocking the infrared sensor is fixedly provided at the opening of the mounting groove, and the infrared sensor is electrically connected to the controller.

[0014] Preferably, mounting rings are fixedly provided on both sides of the bottom box, and the bottom box is fixedly mounted on the ground or the equipment body through the mounting rings.

[0015] (III) Beneficial effects Compared with the prior art, the present invention provides a mechanical device for transferring silicon wafers, which has the following beneficial effects: 1. The mechanical device for transporting silicon wafers is provided with a transport frame and a transport belt. When the transport belt rotates inside the transport frame, the silicon wafers can be transported quickly over a long distance. At the same time, through the rotary drive mechanism arranged inside the bottom box, the rotary drive mechanism can drive the telescopic rotary column to rotate, so that the transport frame and the transport belt are rotated at an angle, so that the silicon wafers on the surface of the transport belt can be transported in multiple directions, so that the silicon wafers can be transported to processing stations in different directions, thereby improving the transportation efficiency.

[0016] 2. The mechanical device for transmitting silicon wafers includes a blowing box, a suction box, a first cylinder, a blowing plate and a suction plate arranged on a transmission rack. During the transmission of the silicon wafers on the surface of the conveyor belt, the silicon wafers pass through the blowing plates and suction plates on both sides. The inside of the blowing box can blow gas into the inside of the blowing plate, so that the gas is blown toward the surface of the silicon wafer, thereby blowing away impurities or dust on the surface of the silicon wafer. At the same time, the suction box can generate negative pressure on the suction plate, so that the blown gas is sucked into the inside of the suction box.

[0017] 3. The mechanical device for transporting silicon wafers is equipped with a second cylinder, a push plate and a discharge plate. When the silicon wafer is transported to the end of the conveyor belt, the second cylinder extends, and the extension of the second cylinder drives the push plate to move, so that the silicon wafer moves to the surface of the placement plate for mechanical grasping and processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram of the structure of a mechanical device for transferring silicon wafers proposed by the present invention; Figure 2 for Figure 1 Schematic diagram of the structure inside the midsole box; Figure 3 for Figure 1 Schematic diagram of the structure inside the middle blowing box; Figure 4 for Figure 1 Schematic diagram of the structure inside the middle suction air box; Figure 5 for Figure 1 Top view of the middle unloading plate.

[0019] In the figure: 1. bottom box; 2. transmission frame; 3. transmission belt; 4. telescopic rotating column; 5. blowing box; 6. suction box; 7. first mounting seat; 8. first cylinder; 9. blowing plate; 10. suction plate; 11. second mounting seat; 12. second cylinder; 13. pushing plate; 14. unloading plate; 15. third cylinder; 16. rack; 17. gear; 18. rotating shaft; 19. controller; 20. inlet fan; 21. outlet fan; 22. filter; 23. vibration motor; 24. cover; 25. air distribution pipe; 26. air distribution hole; 27. lower column; 28. upper column; 29. ​​bolt; 30. nut; 31. angle pointer; 32. angle dial; 33. mounting slot; 34. infrared sensor; 35. transparent glass cover; 36. mounting ring. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] See also Figure 1A mechanical device for transmitting silicon wafers includes a bottom box 1, a transmission frame 2 and a transmission belt 3. Both sides of the bottom box 1 are fixedly provided with mounting rings 36, and mounting bolts can be inserted into the mounting rings 36. The bottom box 1 is fixedly installed on the ground or the main body of the equipment through the mounting rings 36. The transmission frame 2 is located above the bottom box 1. The bottom box 1 is internally provided with a telescopic rotating column 4 extending upward, and the upper end of the telescopic rotating column 4 is fixedly connected to the bottom of the transmission frame 2. The bottom box 1 is provided with a rotating driving mechanism connected with the telescopic rotating column 4. The transmission belt 3 is arranged inside the transmission frame 2 for transmission. When the belt 3 rotates inside the transmission rack, the silicon wafers can be quickly transported over a long distance. At the same time, through the rotation drive mechanism arranged inside the bottom box 1, the rotation drive mechanism can drive the telescopic rotation column 4 to rotate, so that the transmission rack 2 and the transmission belt 3 can rotate at an angle, so that the silicon wafers on the surface of the transmission belt 3 can be transported in multiple directions, so that the silicon wafers can be transported to processing stations in different directions, thereby improving the transportation efficiency; a blowing box 5 is fixedly provided on one side of the transmission rack 2, and a suction box 6 is fixedly provided on the other side of the transmission rack 2. Both sides of the top of the transmission rack 2 are fixedly provided with a first mounting seat 7, and the two The side walls of the first mounting seats 7 are fixed with first cylinders 8, and the piston rod ends of the two first cylinders 8 are fixed with blowing plates 9 and suction plates 10 respectively. The blowing plates 9 and suction plates 10 are respectively connected to the blowing box 5 and suction box 6 through air ducts. During the transmission of the silicon wafer on the surface of the conveyor belt 3, the silicon wafer passes through the blowing plates 9 and suction plates 10 on both sides. The inside of the blowing box 5 can blow gas into the inside of the blowing plate 9, so that the gas is blown to the surface of the silicon wafer, so as to blow away impurities or dust on the surface of the silicon wafer. At the same time, the suction box 6 can make the suction plate 10 produce negative pressure, so that the blown gas is sucked into the interior of the suction box 6; a second mounting seat 11 is fixedly provided at the upper end of the tail of the transmission frame 2, and a second cylinder 12 is fixedly provided on the side wall of the second mounting seat 11, and a push plate 13 is fixedly provided at the end of the piston rod of the second cylinder 12. A notch is provided on one side of the transmission frame 2 at a position corresponding to the position of the push plate 13, and a discharge plate 14 is fixedly provided at the notch. When the silicon wafer is transported to the end of the conveyor belt 3, the second cylinder 12 is extended, and the extension of the second cylinder 12 drives the push plate 13 to move, so that the silicon wafer moves to the surface of the placement plate 14 for mechanical grasping and processing.

[0022] See also Figure 1-2The rotary drive mechanism includes a third cylinder 15, a rack 16 and a gear 17. A rotating shaft 18 is fixedly provided at the lower end of the telescopic rotating column 4, and the lower end of the rotating shaft 18 is rotatably connected to the bottom inner wall of the bottom box 1. The gear 17 is fixedly arranged on the shaft wall of the rotating shaft 18. The third cylinder 15 is fixedly arranged on the inner wall of the bottom box 1. The end of the piston rod of the third cylinder 15 is fixedly connected to the rack 16. The rack 16 is meshed with the gear 17. A controller 19 is fixedly arranged on the inner wall of the bottom box 1. The first cylinder 8, the second cylinder 12 and the third cylinder 15 are all electrically connected to the controller 19 to control the telescopic action of the third cylinder 15. The third cylinder 15 can drive the rack 16 to move left and right, so that the gear 17 can be forward and reversed, thereby enabling the telescopic rotating column 4 to be forward and reversed and adjust the transmission angle of the conveyor belt 3.

[0023] See also Figure 3-4 The bottom of the blowing box 5 is fixedly provided with an inlet fan 20, the bottom of the suction box 6 is fixedly provided with an outlet fan 21, the interior of the suction box 6 is fixedly provided with a filter screen 22, and the bottom of the filter screen 22 is fixedly provided with a vibration motor 23. The side wall of the suction box 6 is provided with a slag removal port on the side of the filter screen 22 that is tilted downward, and the internal thread of the slag removal port is provided with a cap 24. One end of the air duct extends to the interior of the suction box 6 and is fixedly provided with an air distribution pipe 25. The pipe wall of the air distribution pipe 25 is provided with a plurality of evenly distributed air distribution holes 26. The air distribution pipe 25 is located at the bottom of the suction box 6. Above the filter 22, when the inlet fan 20 is working, it can blow external gas into the interior of the blowing box 5, and then blow it out through the blowing plate 9. When the outlet fan 21 is working, it can generate negative pressure inside the suction box 6, so that the gas is sucked into the interior of the suction box 6 and filtered through the filter 22. The gas is discharged after filtering. When there are many impurities on the surface of the filter 22, the vibration motor 23 works to make the filter 22 vibrate, so that the impurities on the surface of the filter 22 can be vibrated to one side, and finally the cover 24 can be opened to discharge the impurities.

[0024] See also Figure 1-2 The telescopic rotating column 4 includes a lower column 27 and an upper column 28, the lower column 27 and the upper column 28 are plugged together, the lower end of the lower column 27 is fixedly connected to the rotating shaft 18, and the upper end of the upper column 28 is fixedly connected to the transmission frame 2. The connection between the lower column 27 and the upper column 28 is provided with a bolt 29 and a nut 30 that cooperate with each other. When it is necessary to adjust the use height of the transmission frame 2, the bolt 29 and the nut 30 are manually loosened by a wrench, and then the length of the upper column 28 inside the lower column 27 is adjusted, so that the use height of the transmission frame 2 can be adjusted, so that the transmission position of the silicon wafer is aligned with the work station of the processing equipment; the column wall of the lower column 27 is fixedly provided with an angle pointer 31, and the top of the bottom box 1 is fixedly embedded with an angle dial 32. The angle pointer 31 and the angle dial 32 are arranged in a corresponding position. During the rotation of the telescopic rotating column 4, the angle pointer 31 rotates on the angle dial 32. At this time, the rotation angle of the transmission frame 2 and the conveyor belt 3 can be known by observing the angle pointer 31.

[0025] See also Figure 1 and 5 A mounting groove 33 is provided on the surface of the discharge plate 14, an infrared sensor 34 is fixedly installed inside the mounting groove 33, and a transparent glass cover 35 for blocking the infrared sensor 34 is fixedly provided at the opening of the mounting groove 33. The infrared sensor 34 is electrically connected to the controller 19. When the silicon wafer moves to the surface of the discharge plate 14, a signal is detected by the infrared sensor 34 and sent to the controller 19, and then fed back to the control system of the processing equipment through the controller 19.

[0026] It should be noted that the term "comprises" or any other variation thereof is intended to cover non-exclusive inclusion, so that a process, method, article, or device that includes a series of elements includes not only those elements, but also includes other elements that are not explicitly listed, or also includes elements inherent to such process, method, article, or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the presence of other identical elements in the process, method, article, or device that includes the element.

[0027] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A mechanical device for transferring silicon wafers, comprising a bottom box (1), a transfer frame (2) and a transfer belt (3), characterized in that: The transmission frame (2) is located above the bottom box (1); a telescopic rotating column (4) extending upward is rotatably provided inside the bottom box (1); the upper end of the telescopic rotating column (4) is fixedly connected to the bottom of the transmission frame (2); and a rotating drive mechanism connected to the telescopic rotating column (4) is provided inside the bottom box (1); The transmission belt (3) is arranged inside the transmission frame (2); a blowing box (5) is fixedly provided on one side of the transmission frame (2), and a suction box (6) is fixedly provided on the other side of the transmission frame (2); first mounting seats (7) are fixedly provided on both sides of the top of the transmission frame (2); first cylinders (8) are fixedly provided on the side walls of the two first mounting seats (7); blowing plates (9) and suction plates (10) are fixedly provided at the ends of the piston rods of the two first cylinders (8); the blowing plates (9) and suction plates (10) are respectively connected to the blowing box (5) and the suction box (6) through air ducts; A second mounting seat (11) is fixedly provided at the upper end of the rear portion of the transmission frame (2), a second cylinder (12) is fixedly provided on the side wall of the second mounting seat (11), a push plate (13) is fixedly provided at the end of the piston rod of the second cylinder (12), a notch is provided at one side of the transmission frame (2) at a position corresponding to the push plate (13), and a discharge plate (14) is fixedly provided at the notch.

2. A mechanical device for transferring silicon wafers according to claim 1, characterized in that: The rotary drive mechanism comprises a third cylinder (15), a rack (16) and a gear (17); a rotating shaft (18) is fixedly provided at the lower end of the telescopic rotating column (4); the lower end of the rotating shaft (18) is rotatably connected to the bottom inner wall of the bottom box (1); the gear (17) is fixedly arranged on the shaft wall of the rotating shaft (18); the third cylinder (15) is fixedly arranged on the inner wall of the bottom box (1); the end of the piston rod of the third cylinder (15) is fixedly connected to the rack (16); and the rack (16) is meshed with the gear (17).

3. A mechanical device for transferring silicon wafers according to claim 2, characterized in that: A controller (19) is fixedly provided on the inner side wall of the bottom box (1), and the first cylinder (8), the second cylinder (12) and the third cylinder (15) are all electrically connected to the controller (19).

4. A mechanical device for transferring silicon wafers according to claim 1, characterized in that: An inlet fan (20) is fixedly provided at the bottom of the blowing box (5), an outlet fan (21) is fixedly provided at the bottom of the suction box (6), a filter screen (22) is fixedly provided inside the suction box (6) at an angle, a vibration motor (23) is fixedly installed at the bottom of the filter screen (22), a slag removal opening is provided on the side wall of the suction box (6) and located on the side of the filter screen (22) that is tilted downward, and a cover head (24) is provided on the internal thread of the slag removal opening.

5. A mechanical device for transferring silicon wafers according to claim 4, characterized in that: One end of the air duct extends to the interior of the air suction box (6) and is fixedly provided with an air distribution pipe (25), the pipe wall of the air distribution pipe (25) being provided with a plurality of evenly distributed air distribution holes (26), and the air distribution pipe (25) being located above the filter screen (22).

6. A mechanical device for transferring silicon wafers according to claim 1, characterized in that: The telescopic rotating column (4) comprises a lower column (27) and an upper column (28), the lower column (27) and the upper column (28) being plug-fitted, the lower end of the lower column (27) being fixedly connected to the rotating shaft (18), the upper end of the upper column (28) being fixedly connected to the transmission frame (2), and the connection between the lower column (27) and the upper column (28) being provided with bolts (29) and nuts (30) that cooperate with each other.

7. A mechanical device for transferring silicon wafers according to claim 6, characterized in that: An angle pointer (31) is fixedly provided on the column wall of the lower column (27), and an angle dial (32) is fixedly embedded on the top of the bottom box (1), and the angle pointer (31) and the angle dial (32) are arranged in corresponding positions.

8. The mechanical device for transferring silicon wafers according to claim 3, characterized in that: The surface of the discharge plate (14) is provided with a mounting groove (33), an infrared sensor (34) is fixedly mounted inside the mounting groove (33), and a transparent glass cover (35) is fixedly mounted at the opening of the mounting groove (33) to block the infrared sensor (34), and the infrared sensor (34) is electrically connected to the controller (19).

9. The mechanical device for transferring silicon wafers according to claim 1, characterized in that: Both sides of the bottom box (1) are fixedly provided with mounting rings (36), and the bottom box (1) is fixedly mounted on the ground or on the equipment body via the mounting rings (36).

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