Granular resin composition suitable for compression molding packaging and preparation method thereof

Abstract

The invention discloses a granular resin composition suitable for compression molding packaging and a preparation method thereof.According to the resin composition, due to the fact that a dispersing system of a special structure and a multi-dispersing-agent combination matching technology are used, and a specific preparation technology is matched, the obtained granular resin composition has better ash content uniformity, the particle size is smaller, and the particle size is smaller. According to the present invention, the packaging body surface and the internal filler and other substances are uniformly distributed without aggregation, and other properties do not significantly change, such that the packaging body can be suitable for large-area ultra-thin compression molding packaging, such as mold array packaging (MAP), fan-out wafer level (FOWLP) and fan-out panel level (FOPLP) packaging, and has excellent compression packaging molding appearance and excellent comprehensive performance.

Description

Technical Field

[0001] The invention relates to a preparation method and application of a granular resin composition suitable for compression molding packaging, belonging to the field of electronic packaging materials, in particular to the field of epoxy molding materials for electronic packaging. Background Art

[0002] Plastic encapsulation is a packaging process that covers chips or devices with molding compounds for protection. Through plastic encapsulation, the chips, devices and connecting lines that were originally exposed to the outside world are protected by the external plastic encapsulation body, avoiding the invasion of the external environment (especially the humid environment) on the semiconductor devices and avoiding product failure.

[0003] According to the different molding principles, semiconductor plastic packaging is mainly divided into two types: injection molding plastic packaging and compression molding plastic packaging. Transfer molding uses solid cake-shaped resin (epoxy molding compound, EMC), which is an early molding method. In this method, the solid EMC is heated and melted into a gel state, and then a certain pressure is forced to flow through multiple narrow paths. In recent years, with the progress of miniaturization of electronic equipment, semiconductor products are increasingly required to be thinner and smaller. In addition, semiconductors require high performance while miniaturization. The semiconductor mounting structure obtained by stacking semiconductor bare chips vertically is also being continuously applied. Therefore, as the chip becomes smaller and smaller, the layers become more and more, and the bonding structure becomes more and more complex, the epoxy resin cannot be evenly spread in the traditional molding process, resulting in incomplete molding or increased gaps (or pores).

[0004] Compression molding is a new method that can overcome the limitations of transfer molding. In compression molding, sheet (SMC), granular (GMC) and liquid molding compound (LMC) are generally used. Among these three molding compounds, GMC has improved its performance with the advancement and development of technology. Due to its low price and other characteristics, it has gradually begun to erode the market of liquid molding compounds and gradually become the most widely used material in compression molding process.

[0005] However, since the granular plastic encapsulation material is mainly used in the compression molding process to place the GMC in the mold cavity in advance in the form of uniform powder, and then the carrier board with the chip is immersed in it after preheating to become liquid, compared with traditional transfer molding, this method does not require the gate and runner required for injection molding, the resin utilization rate is almost 100%, and there is almost no resin flow. At the same time, this type of packaging is mainly used in ultra-thin packaging, such as wafer-level (WLP) and panel-level (PLP) packaging, so the plastic encapsulation material is required to have extremely high distribution and dispersion uniformity. Any subtle distribution and dispersion defects, such as filler agglomeration, will be magnified under the thin packaging pressing process due to the lack of gate obstruction and flow shear dispersion. It will expand from a small white spot to a surface, thereby forming a large white spot on the surface and inside of the plastic encapsulation body (similar to Figure 3 Similar), affecting the yield. Summary of the invention

[0006] The technical problem to be solved by the present invention is to provide a granular resin composition suitable for compression molding packaging in view of the above-mentioned deficiencies of the prior art, wherein the granular resin composition achieves effective dispersion of the filler by using a variety of dispersants.

[0007] Another object of the present invention is to provide a method for preparing the above-mentioned granular resin composition for compression molding packaging.

[0008] In order to solve the above technical problems, the technical solution adopted by the present invention is: a granular resin composition suitable for compression molding packaging, composed of the following components in parts by weight:

[0009]

[0010] The total weight of all the above components is 100 parts.

[0011] The inorganic filler may be a material commonly used in a resin composition for semiconductor encapsulation, and preferably silicon dioxide from the viewpoint of excellent versatility;

[0012] The inorganic filler has no particular limitation on its shape, but is preferably spherical in shape to maintain good fluidity;

[0013] The maximum particle size (cut point) of the inorganic filler is not particularly limited and can be selected according to the requirements of specific application scenarios.

[0014] The coupling agent can be a coupling agent commonly used in the art, preferably a silane coupling agent, mainly used as a surface modifier of an inorganic filler, and the physicochemical properties of the inorganic filler surface are changed by the mechanism of chemical reaction or chemical adsorption, and the dispersibility of the filler in the resin is improved, and the compatibility of the inorganic filler and the resin interface is increased, and then the mechanical properties, chemical properties and electrical properties of the resin composition are improved. Aminosilanes such as epoxy silane, mercaptosilane, and phenylaminosilane can be cited. From the viewpoint of improving the adhesion of the sealing material to the metal parts, the coupling agent is preferably selected from one or more of phenylaminopropyl trimethoxysilane, 3-glycidyl ether oxypropyl trimethoxysilane and 3-mercaptopropyl trimethoxysilane.

[0015] The epoxy resin can be a commonly used epoxy resin in the art. From the viewpoint of suppressing the warping of the cured product of the resin composition and balancing the properties such as filling property, heat resistance and moisture resistance, it preferably contains one or more selected from triphenylmethane epoxy resin, biphenyl aralkyl epoxy resin, biphenyl epoxy resin and dicyclopentadiene phenolic epoxy resin.

[0016] The curing agent is a phenolic resin curing agent, which is selected from any phenolic resin commonly used in the art, and can be linear phenolic resin (PN), phenol aralkyl phenolic resin (Xylok phenolic resin), polyaromatic phenolic resin (MAR phenolic resin) and multifunctional phenolic resin (MFN phenolic resin). These phenolic resins can be used alone or in combination of two or more according to specific circumstances, without special limitation.

[0017] The curing accelerator is a substance that can promote the reaction between epoxy resin and phenolic resin, and is not particularly limited. From the viewpoint of reactivity, operability and storage stability, the curing accelerator is preferably a thermal latent accelerator, which can be one or a mixture of several of a tetrasubstituted phosphonium compound, an adduct of a phosphorus compound and a quinone compound, an adduct of a phosphorus compound and a silane compound, etc.

[0018] The stress modifier can be silicone oil or silicone rubber particles commonly used in the art, without special limitation. Its main function is to reduce the stress of the plastic package, improve the warping deformation of the plastic package, improve the toughness of the plastic package, and prevent the generation of cracks in the plastic package. When using a stress modifier, only one type can be used, or two or more types can be used in combination.

[0019] The type I dispersant is a specific compound having a structure shown in Formula 1, and its chemical name is ethoxyaluminum diisopropyl:

[0020]

[0021] The type II dispersant is a high molecular weight copolymer containing filler affinity groups, and specifically, one or a mixture of two of KMT-398 (Foshan Koning New Materials), DISPERBYK-2200 (BYK Chemicals), etc. can be selected.

[0022] The flame retardant may be a commonly used flame retardant in the art, and its function is to improve the flame resistance of epoxy resin. Its type may be phosphate, cyclophosphazene, metal hydroxide such as aluminum hydroxide, etc., and one may be used alone or in combination, without particular limitation.

[0023] The lubricant is selected from a wax system that is incompatible with the resin system. Its function is to be released during the resin mixing process to form an extremely thin wax layer between the material and the equipment, thereby improving the operability of the extrusion production process of the resin composition of the present invention, while improving the smoothness of the resin composition melt and the mesh of the granulation screen, improving the granulability of the resin composition of the present invention, improving the uniformity of the particle size and the surface smoothness, and then improving the yield and yield of the product. From this point of view, oxidized polyethylene wax, amide wax, etc. are preferred, and one of them can be used, or more than two can be used in combination.

[0024] The colorant is mainly used to distinguish / identify different types of devices and cover the design of the packaging unit and prevent light transmission. It can be a dye, pigment, carbon black, etc., which is selected according to the requirements of the use scenario without special limitation. The colorant used in the composition of the present invention is specifically preferably carbon black.

[0025] The ion capture agent is not particularly limited, and any ion capture agent known or commonly used in the art can be used, mainly from the viewpoint of improving the ion migration resistance, moisture resistance and high temperature storage characteristics of semiconductor components such as ICs. As the ion capture agent, hydrotalcites, hydrous oxides of elements such as magnesium, aluminum, titanium, zirconium, and bismuth can be selected, and these ion capture agents can be used alone or in combination of two or more.

[0026] The present invention provides a granular resin composition suitable for compression molding packaging, and the preparation method is as follows: 1) a type I dispersant is prepared into a solution with a mass fraction of 20% by butanone; 2) a formula amount of inorganic filler, an ion capture agent, an inorganic flame retardant and a colorant are added to a high-speed mixer, and a formula amount of coupling agent and a butanone solution of the type I dispersant are sequentially added to the mixer through a spray nozzle under stirring; 3) the obtained mixture is taken out from the mixer, and an aging treatment is performed at room temperature for 1 day, so that the coupling agent and the type I dispersant are bonded to the surface of the inorganic filler; 4) after the aging treatment, the coarse particles are removed through a 100um sieve to obtain an inorganic mixture subjected to surface coupling and dispersion treatment; 5) the type II dispersant and the epoxy resin are pre-melted and mixed, and then crushed to obtain powder particles of the resin mixture 1; 6) a curing agent, a curing accelerator, a stress modifier and a lubricant are pre-melted and mixed, and the mixture is pulverized to obtain powder particles of the resin mixture 1; After melt mixing, the powder particles of resin mixture 2 are obtained by crushing; 7) the inorganic mixture obtained in step 4), the powder particles of resin mixture 1 obtained in step 5) and the powder particles of resin mixture 2 obtained in step 6 are added to a high-speed mixer for further mixing; 8) the mixture obtained in step 7 is melt-kneaded by a twin-screw extruder; 9) the melt-kneaded material obtained from the extruder port is thrown out from a sieve aperture of a specific size by centrifugal force while hot, and cooled to obtain granular particles of a certain diameter and length; 10) the particles obtained in step 9) are further sorted by a rotary granulator to reduce the size and distribution of the particles; 11) the particles obtained in step 10) are further sieved by a vibration sieving machine to remove large-size particles and small-size particles outside the specification requirements, so as to obtain a granular resin composition suitable for compression molding and packaging with good particle size and particle size distribution.

[0027] The theoretical basis of the present invention is: 1. The dispersant of formula 1 has the property of chemically bonding on the surface of inorganic matter and forming an organic film, which can significantly improve the dispersion of inorganic fillers and inorganic matter such as carbon black in organic media such as resins. At the same time, the dispersion of inorganic fillers in the resin matrix can be further improved by using a dispersant of type II high molecular weight copolymer containing filler affinity groups such as carboxyl groups; 2) by fully aging the filler surface after treatment, the dispersant can be more evenly bonded to the surface of the inorganic filler, thereby enhancing the dispersion of the inorganic filler in the organic matrix; 3) by sieving the aged filler, some fine powder hardened agglomerates formed in the system due to the surface treatment can be effectively removed, thereby reducing the risk of aggregation of inorganic fillers in the final resin composition product. The above achieves the technical purpose of the present invention.

[0028] Compared with the prior art, the present invention has significant technical advantages and beneficial effects. Since the present invention uses a dispersion system with a special structure and a combination of multiple dispersants, coupled with a specific preparation process, the obtained granular resin composition has better ash uniformity and can be suitable for large-area ultra-thin compression molding packaging, such as mold array packaging (MAP), fan-out wafer level (FOWLP) and fan-out panel level (FOPLP) packaging. The materials on the surface of the package and the internal filler are evenly distributed without aggregation, so the wiring formed in the subsequent process can be correctly formed on the package, and the yield rate of semiconductor packaged products is excellent. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 This is an optical electron microscope photograph of the surface of the plastic-encapsulated molded body of the resin composition of Example 1 of the present application observed after grinding;

[0030] Figure 2 This is an optical electron microscope photograph of the surface of the plastic-encapsulated molded body of the resin composition in Comparative Example 1 of the present application observed after grinding;

[0031] Figure 3 This is an optical electron microscope photograph of the surface of the plastic-encapsulated molded body of the resin composition in Comparative Example 2 of the present application observed after grinding. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the specific implementation modes of the present invention are further explained below in conjunction with specific embodiments. The embodiments are intended to further describe the present invention, and the present invention is not limited to the embodiments.

[0033] The components used in the examples and comparative examples are shown below:

[0034] (Inorganic filler)

[0035] Inorganic filler 1: spherical fused silica, Jiangsu Lianrui New Materials Co., Ltd., NQ1165E, maximum particle size 53 μm, average particle size (D50) 19 μm;

[0036] Inorganic filler 2: spherical fused silica, Jiangsu Lianrui New Materials Co., Ltd., NQ1060H, maximum particle size 20 μm, average particle size (D50) 6.8 μm.

[0037] (Coupling agent)

[0038] Coupling agent 1: N-phenylaminopropyltrimethoxysilane, Shandong Sike, CG-A1183;

[0039] Coupling agent 2: 3-glycidyloxypropyltrimethoxysilane, Shandong Sike, CG-O187;

[0040] Coupling agent 3: 3-mercaptopropyltrimethoxysilane, Shandong Sike, SG-S313.

[0041] (Epoxy resin)

[0042] Epoxy resin 1: triphenylmethane epoxy resin, Shandong Shengquan, trade name SQTN-333, epoxy equivalent: 174g / eq, softening point: 66°C;

[0043] Epoxy resin 2: biphenyl aralkyl type epoxy resin, Hunan Jiashengde, trade name BPNE3501L, epoxy equivalent: 280g / eq, softening point: 63℃;

[0044] Epoxy resin 3: biphenyl epoxy resin, Shandong Aimonte, trade name EMTE501, epoxy equivalent: 188g / eq, melting point: 104℃;

[0045] Epoxy resin 4: dicyclopentadiene phenolic epoxy resin, Japan DIC, trade name HP-7200, epoxy equivalent: 259 g / eq, softening point: 61°C.

[0046] (Curing agent)

[0047] Curing agent 1: linear phenolic resin (PN), Shandong Shengquan, trade name PF8011, hydroxyl equivalent: 106 g / eq, softening point: 83°C;

[0048] Curing agent 2: phenol aralkyl phenolic resin (Xylok phenolic resin), Meiwa Chemical, Japan, trade name MEH-7800SS, hydroxyl equivalent: 175 g / eq, softening point: 65°C;

[0049] Curing agent 3: aromatic phenolic resin (MAR phenolic), Meiwa Chemical, Japan, trade name MEH-7851SS, hydroxyl equivalent: 203 g / eq, softening point: 67°C;

[0050] Curing agent 4: multifunctional phenolic resin (MFN phenolic resin), Meiwa Chemical, Japan, trade name MEH-7500, hydroxyl equivalent: 97 g / eq, softening point: 110°C.

[0051] (Curing accelerator)

[0052] Curing accelerator 1: a tetrasubstituted phosphonium compound, the structural formula of which is as shown in Formula II;

[0053]

[0054] Curing accelerator 2: an adduct of a phosphorus compound and a quinone compound, with a structural formula as shown in Formula III;

[0055]

[0056] Curing accelerator 3: an adduct of a phosphorus compound and a silane compound, with a structural formula of Formula IV.

[0057]

[0058] (Stress Modifier)

[0059] Stress modifier 1: epoxy polyether modified silicone oil, Dow Corning, SF8421EG;

[0060] Stress modifier 2: epoxy modified polysiloxane powder, Dow Corning, AY42-119.

[0061] (Type I dispersant)

[0062] Type I dispersant 1: a specific compound having a structure shown in Formula 1, chemical name ethoxyaluminum diisopropyl, CAs No. 80481-35-2.

[0063] (Type II dispersant)

[0064] Type II dispersant 1: high molecular weight block polymer containing acidic groups, KMT-398, Foshan Ke Ning New Materials;

[0065] Type II dispersant 2: DISPERBYK-2200, BYK Chemical.

[0066] (Flame Retardant)

[0067] Flame retardant 1: triphenylphosphine TPPO, Guangzhou Xijia New Materials;

[0068] Flame retardant 2: polyphosphazene, Otsuka, Japan, SPB-100;

[0069] Flame retardant 3: aluminum hydroxide, Albemarle, 104LEO.

[0070] (Lubricant)

[0071] Lubricant 1: oxidized polyethylene wax, Licowax PED 191, Clariant;

[0072] Lubricant 2: erucamide, Alflow P-10, NOF Corporation.

[0073] (Colorant)

[0074] Carbon black: Japan Mitsubishi Chemical, 5# carbon black.

[0075] (Ion Scavenger)

[0076] Ion scavenger 1: cation scavenger, East Asia Synthetic, IXE-300;

[0077] Ion scavenger 2: anion scavenger, East Asia Synthetic, IXE-500;

[0078] Ion scavenger 3: pH adjuster, Kyowa Chemical, Japan, DHT-4A.

[0079] (Preparation of Granular Resin Composition)

[0080] (Examples 1-5, Comparative Example 2)

[0081] The raw materials shown in Table 1 are prepared into a granular resin composition for compression molding encapsulation in the following manner: 1) Type I dispersant is prepared into a 20% mass fraction solution with butanone; 2) The formulated amount of inorganic filler, ion scavenger, inorganic flame retardant and colorant are added to a high-speed mixer, and the formulated amount of coupling agent and butanone solution of Type I dispersant are sequentially added to the mixer through a spray nozzle under stirring; 3) The obtained mixture is taken out from the mixer and aged at room temperature for 1 day so that the coupling agent and Type I dispersant are bonded to the surface of the inorganic filler; 4) After the aging treatment, the coarse particles are removed through a 100um sieve to obtain an inorganic mixture with surface coupling and dispersion treatment; 5) Type II dispersant and epoxy resin are pre-melted and mixed, and then crushed to obtain powder particles of resin mixture 1; 6) The curing agent, curing accelerator, stress modifier and lubricant are pre-mixed and mixed. After melt mixing, the powder particles of resin mixture 2 are obtained by crushing; 7) the inorganic mixture obtained in step 4), the powder particles of resin mixture 1 obtained in step 5) and the powder particles of resin mixture 2 obtained in step 6 are added to a high-speed mixer for further mixing; 8) the mixture obtained in step 7 is melt-kneaded by a twin-screw extruder; 9) the melt-kneaded material obtained from the extruder port is thrown out from a sieve aperture of a specific size by centrifugal force while hot, and cooled to obtain granular particles of a certain diameter and length; 10) the particles obtained in step 9) are further sorted by a rotary granulator to reduce the size and distribution of the particles; 11) the particles obtained in step 10) are further sieved by a vibration sieving machine to remove large-size particles and small-size particles outside the specification requirements, so as to obtain a granular resin composition suitable for compression molding and packaging with good particle size and particle size distribution.

[0082] (Comparative Example 1, Comparative Example 3)

[0083] The raw materials shown in Table 1 are prepared into a granular resin composition for compression molding encapsulation in the following manner: 1) Inorganic filler, inorganic flame retardant, ion scavenger and colorant are first added into a high-speed mixer, and the coupling agent in the formula is sequentially added into the mixer through a spray nozzle under stirring; 2) Type I and II dispersants are pre-melted and mixed with epoxy resin, and then crushed to obtain resin mixture 1 powder particles; 3) Curing agent, curing accelerator, stress modifier and lubricant are pre-melted and mixed, and then crushed to obtain resin mixture 2 powder particles; 4) The inorganic mixture obtained in step 1), the resin mixture 1 powder particles obtained in step 2) and the resin mixture obtained in step 3 are mixed ... The powder particles of compound 2 are added to a high-speed mixer for further mixing; 5) the mixture obtained in step 4 is melt-kneaded by a twin-screw extruder; 6) the melt-kneaded material obtained from the extruder port is thrown out from a sieve aperture of a specific size by centrifugal force while hot, and cooled to obtain granular particles of a certain diameter and length; 7) the particles obtained in step 6) are further sorted by a rotary granulator to reduce the size and distribution of the particles; 8) the particles obtained in step 7) are further sieved by a vibrating sieving machine to remove large-size particles and small-size particles outside the specification requirements, so as to obtain a granular resin composition suitable for compression molding and packaging with good particle size and particle size distribution.

[0084] The obtained granular resin composition for compression molding encapsulation was evaluated for the following items. The test results are shown in Table 1.

[0085] (evaluate)

[0086] (Gel time), (high viscosity), (glass transition temperature Tg), (thermal expansion coefficient before glass transition temperature CTE1), (thermal expansion coefficient after glass transition temperature CTE2), (flexural strength), (flexural modulus), (molding shrinkage) are tested and evaluated in accordance with the "National Standard of the People's Republic of China GB / T 40564-2021 Test Method for Epoxy Molding Materials for Electronic Packaging".

[0087] (Observation of the polished surface of the package)

[0088] The obtained granular resin composition was molded into a package with an area of ​​316mm*306mm and a thickness of 0.2mm on a stainless steel plate with an area of ​​324mm*320mm and a thickness of 0.2mm using a compression molding device for PLP / WLP molding process (manufactured by TOWA, model PMC1080) at a molding temperature of 160°C, a molding pressure of 4Mpa, and a molding time of 300 seconds. After the package was peeled off from the stainless steel plate, it was coarsely ground with 600-mesh sandpaper and then finely ground with 1500-mesh sandpaper on a grinder to a grinding thickness of 50-100 microns, and then the ground surface of the package was observed under an electron optical microscope (Keyence, VHX-7000 ultra-high precision digital microscope) at a magnification of 100 times.

[0089] From the comparison of the performance test results of the embodiments and the comparative examples in Table 1, it can be seen that the embodiments of the technical scheme of the present invention use a dispersion system with a special structure and a combination of multiple dispersants, and are equipped with a specific preparation process. The obtained granular resin composition has better ash uniformity, and the materials such as the surface and internal fillers of the package body are evenly distributed without aggregation, and other properties have no obvious changes. It can be suitable for large-area ultra-thin compression molding packaging, such as mold array packaging (MAP), fan-out wafer level (FOWLP) and fan-out panel level (FOPLP) packaging, and can correctly form wiring formed in subsequent processes on the package body. The yield of semiconductor packaged products is excellent, that is, the granular resin composition suitable for compression molding packaging prepared using the technical scheme of the present invention shows relatively excellent molding appearance and comprehensive performance, and fully achieves the technical purpose of the present invention.

[0090] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable those skilled in the art to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the protection scope of the present invention. Any equivalent transformation or modification made according to the spirit of the present invention should be included in the protection scope of the present invention.

[0091] Table 1: Formula composition and performance test evaluation results of Examples 1-5 and Comparative Examples 1-3

[0092]

Claims

1. A granular resin composition suitable for compression molding packaging, comprising the following components in parts by weight: composition: The total composition of all the above components is 100 parts; The type I dispersant is a specific compound having a structure shown in Formula 1, and its chemical name is ethoxyaluminum diisopropyl:

2. A granular resin composition suitable for compression molding packaging according to claim 1, Features The type II dispersant is a high molecular weight copolymer containing filler affinity groups.

3. A granular resin composition suitable for compression molding packaging according to claim 2, It is characterized in that The high molecular weight copolymer containing filler affinity groups is selected from the material with model KMT-398 produced by Foshan Corning New Materials Co., Ltd. and / or the material with model DISPERBYK-2200 produced by BYK Chemicals.

4. A granular resin composition suitable for compression molding packaging according to claim 1, Features The curing accelerator is a thermal latent curing accelerator.

5. A granular resin composition suitable for compression molding packaging according to claim 4, Features The thermal latent accelerator is an organic phosphine complex, specifically one or a mixture of tetrasubstituted phosphonium compounds, adducts of phosphorus compounds and quinone compounds, and adducts of phosphorus compounds and silane compounds.

6. A granular resin composition suitable for compression molding packaging according to claim 5, Features The organic phosphine complex is selected from one or a mixture of formula II, formula III, and formula IV:

7. A granular resin composition suitable for compression molding packaging according to claim 1, Features The lubricant is selected from a wax system that is incompatible with the resin system.

8. A granular resin composition suitable for compression molding packaging according to claim 7, It is characterized in that The lubricant is selected from one or more of oxidized polyethylene wax and amide wax.

9. A granular resin composition suitable for compression molding packaging according to claim 1, Features The preparation method thereof comprises the following steps: 1) preparing a type I dispersant with butanone into a solution with a mass fraction of 20%; 2) adding a formula amount of inorganic filler, ion capture agent, inorganic flame retardant and colorant into a high-speed mixer, and sequentially adding a formula amount of coupling agent and a butanone solution of type I dispersant into the mixer through a spray nozzle under stirring; 3) taking out the obtained mixture from the mixer, and performing an aging treatment at room temperature for 1 day, so that the coupling agent and type I dispersant are both bonded to the surface of the inorganic filler; 4) after the aging treatment, removing coarse particles through a 100um sieve, and obtaining an inorganic mixture subjected to surface coupling and dispersion treatment; 5) pre-melting and mixing type II dispersant and epoxy resin, and then crushing to obtain powder particles of resin mixture 1; 6) pre-melting and mixing a curing agent, a curing accelerator, a stress modifier and a lubricant, and then crushing. Obtaining powder particles of resin mixture 2; 7) adding the inorganic mixture obtained in step 4), the powder particles of resin mixture 1 obtained in step 5) and the powder particles of resin mixture 2 obtained in step 6 into a high-speed mixer for further mixing; 8) melt-kneading the mixture obtained in step 7 through a twin-screw extruder; 9) throwing the melt-kneaded material obtained from the extruder port out of a specific size of sieve aperture by centrifugal force while hot, cooling, and obtaining granular particles of a certain diameter and length; 10) further sorting the particles obtained in step 9) through a rotary granulator to reduce the size and distribution of the particles; 11) further sieving the particles obtained in step 10) through a vibrating sieving machine to remove large-size particles and small-size particles outside the specification requirements, and obtaining a granular resin composition suitable for compression molding and packaging with good particle size and particle size distribution.

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