Circuit board automatic control copper deposition processing device
By designing an automated controlled copper deposition treatment device, using the combined structure of the rotating seat and the clamp, the problem of difficulty in gas discharge in the small pore size is solved, the full contact between chemical reagents and the pore wall is achieved, and the copper deposition efficiency is improved, so as to avoid The occurrence of adverse exposure situations.
Patent Information
- Application Number
- CN202411346396.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-25
- Publication Date
- 2024-12-13
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
When handling circuit boards, the pore sizes of existing copper depositing production equipment vary, resulting in gases that cannot be discharged in the small pore size, affecting copper deposition, and thus leading to poor contact.
An automated copper depositing treatment device for circuit boards is designed, using a combined structure of a rotating seat and a clamp placing device. By rotating and vibrating the gas in the discharge hole, the chemical reagents are fully contacted with the hole wall and copper deposition is realized.
Effectively discharge gases in small pore sizes, ensure that chemical reagents are in full contact with the pore wall, improve copper deposition efficiency, and reduce contact poor conditions in later use.
Smart Images
Figure CN119121202A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of circuit board production, and in particular to an automatic control copper deposition processing device for a circuit board. Background Art
[0002] Copper plating, also known as chemical copper plating, is also called through-hole plating. Its function is to use chemical formaldehyde in a strong alkaline environment of potassium permanganate to electroplate a layer of copper on the hole wall of the drilled non-conductive double-sided board or multi-layer board based on the principle of chemical copper ion oxidation-reduction reaction, so that the originally non-conductive hole has conductivity, so as to facilitate the smooth electroplating of thicker copper for the subsequent panel surface plating and pattern plating.
[0003] Current copper deposition production equipment usually uses an immersion method when processing circuit boards to deposit chemical copper on the hole walls of the circuit boards. However, the hole sizes on the circuit boards vary, and some smaller hole sizes contain gas, forming bubbles in the immersion liquid that cannot be discharged, resulting in the inability to complete the deposition of chemical copper on the hole walls within the specified time, which can easily lead to poor contact of the circuit boards in later use. Summary of the invention
[0004] In view of the above problems, it is necessary to provide a circuit board automatic control copper deposition processing device to solve the existing technical problems.
[0005] In order to solve the problems of the prior art, the technical solution adopted by the present invention is: A circuit board automatic control copper deposition processing device comprises a copper deposition pool and a rotating seat coaxially installed in the copper deposition pool, a rotating driver for driving the rotating seat to rotate is arranged at the bottom of the copper deposition pool, a plurality of placement clamps for clamping the circuit board are installed on the rotating seat, a horizontal shaft rod is arranged on the placement clamp, the shaft rod is inserted into a shaft sleeve arranged on the rotating seat and extends to the inside of the rotating seat, two fixed blocks are arranged on the side of the placement clamp away from the rotating seat, a slot is arranged between the fixed blocks, and the circuit board is inserted in the slot; the shaft sleeve extends radially along the rotating seat, a movable seat is coaxially installed in the rotating seat, and the movable seat moves along the axis in the rotating seat to drive the placement clamp to rotate around the axis of the shaft rod to change the placement angle of the circuit board clamped by the placement clamp.
[0006] Preferably, a semicircular groove is provided at one end of the shaft rod located inside the rotating seat, and when the top of the movable seat fits the horizontal plane of the semicircular groove from bottom to top, the slot for placing the clamp remains vertical; a side strip is provided at one end of the shaft rod located inside the rotating seat, and the side strip is perpendicular to the horizontal plane of the semicircular groove, and a positioning plate is provided on the inner wall of the rotating seat on one side of the sleeve, and when the side strip fits the positioning plate, the slot for placing the clamp remains horizontal, and vertical plates with the same number as the number of clamps are provided on the top of the movable seat, and a horizontal lower pressure plate is provided on the top of the vertical plate, and the lower pressure plate presses the upper side of the side strip from top to bottom so that the side strip fits the positioning plate.
[0007] Preferably, a plurality of mounting plates are provided on the inner wall of the rotating seat, each mounting plate is located on the side of one of the shaft sleeves away from the positioning plate, and a first spring is provided on the side of the mounting plate facing the positioning plate. When the side strip is in a vertical state, it is in contact with the end of the first spring away from the mounting plate, and the elastic force of the first spring causes the side strip to flip toward the side of the positioning plate.
[0008] Preferably, the movable seat is provided with ejectors of the same number as the clamps, and the ejectors extend vertically upward; the straight-line distance between the positioning plate and the axis of the sleeve is greater than the radius of the sleeve, and the ejectors are located between the positioning plate and the shaft rod.
[0009] Preferably, a spline shaft is coaxially arranged at the bottom of the movable seat, and a spline sleeve is arranged at the bottom of the rotating seat, in which the spline shaft is inserted; a transmission wheel is coaxially installed at one end of the bottom of the rotating seat located outside the copper sinking pool, and a synchronous belt is sleeved on the transmission wheel, and the other end of the synchronous belt is sleeved on a driving wheel fixedly installed at the working end of the rotating driver.
[0010] Preferably, a linear drive is fixedly installed at the bottom of the copper sinking pool, and the working end of the linear drive is arranged vertically downward; a swivel is coaxially arranged on the spline shaft of the movable seat, and a horizontal base plate is rotatably installed on the swivel, and the working end of the linear drive is fixedly connected to the base plate; a plurality of vertical guide rods are arranged under the copper sinking pool, and the base plate is slidably installed on the guide rods.
[0011] Preferably, mounting holes are provided on opposite sides of the two fixed blocks where the clamps are placed, and the mounting hole openings of the two fixed blocks are arranged opposite to each other; a clamping block and a spring are provided in the mounting hole, and the clamping block is slidably installed in the mounting hole, and the spring elastically connects the inner wall of the mounting hole and the clamping block, and the elastic force of the spring causes the clamping block to move toward the slot.
[0012] Preferably, chamfers are provided on the upper and lower sides of the two clamping blocks.
[0013] Compared with the prior art, the present invention has the following beneficial effects: First, a plurality of placement clamps are rotatably mounted on the rotating seat in the present invention, and the circuit board is inserted into the slots of the placement clamps. In the first working state, the circuit board rotates in a vertical state in the copper sink tank following the rotating seat, so that the chemical reagent can flow in the holes of the circuit board, discharge the gas in the small-diameter holes, and make the chemical reagent fully contact with the hole wall.
[0014] Secondly, the movement of the movable seat in the rotating seat in the present invention causes the placement clamp to rotate around the axis of the shaft rod. The placement clamp can be rotated until the slot is horizontal, thereby driving the circuit board inserted in the slot to rotate to a horizontal state. After the gas in the hole is discharged, the circuit board can be immersed in the chemical reagent in a horizontal state for a period of time until the copper plating treatment is completed.
[0015] Thirdly, the movable seat in the present invention keeps the placement clamp in the first working state by cooperating with the semicircular groove of the shaft rod, and the side strips on the shaft rod cooperate with the lower pressure plate on the movable seat and the positioning plate in the rotating seat to keep the placement clamp in the second working state. When the movable seat moves down to disengage from the semicircular groove and the lower pressure plate has not moved down to fit the side strips, the placement clamp can freely rotate at a certain angle around the axis of the shaft rod when the rotating seat rotates, thereby bringing vibration to the gas in the hole and causing it to be discharged from the hole, thereby discharging the gas in the hole that cannot be discharged in the first working state. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a stereoscopic diagram of a circuit board automatic control copper deposition processing device in a first working state; Figure 2 It is a side view of a circuit board automatic control copper deposition processing device in a first working state; Figure 3 yes Figure 2 Cross-sectional view at AA of FIG. Figure 4 It is a three-dimensional structural exploded diagram of a circuit board automatic control copper deposition processing device; Figure 5 yes Figure 4 A partial enlarged view of point B; Figure 6 yes Figure 4 A partial enlarged view of point C; Figure 7 It is a stereoscopic diagram of a circuit board automatic control copper deposition processing device in a second working state; Figure 8 It is a main view of a circuit board automatic control copper deposition processing device in the second working state; Fig. 9 yes Figure 8 Cross-sectional view at DD of FIG. Fig.10 yes Fig. 9 A partial enlarged view of point E.
[0017] The numbers in the figure are: 1, copper sink; 11, rotary drive; 111, driving wheel; 12, linear drive; 13, guide rod; 2, rotating seat; 21, bushing; 211, positioning plate; 212, mounting plate; 213, first spring; 22, spline sleeve; 23, transmission wheel; 231, synchronous belt; 3, placement clamp; 31, shaft; 311, semicircular groove; 312, side strip; 32, fixing block; 321, mounting hole; 322, clamping block; 323, spring; 33, slot; 4, movable seat; 41, vertical plate; 411, lower pressure plate; 42, ejector pin; 43, spline shaft; 431, swivel; 44, bottom plate. DETAILED DESCRIPTION
[0018] In order to further understand the features, technical means, specific objectives and functions of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.
[0019] Reference Figures 1 to 10 : A circuit board automatic control copper deposition processing device comprises a copper deposition pool 1 and a rotating seat 2 coaxially installed in the copper deposition pool 1. A rotating driver 11 for driving the rotating seat 2 to rotate is arranged at the bottom of the copper deposition pool 1. A plurality of placement clamps 3 for clamping the circuit board are installed on the rotating seat 2. The placement clamps 3 are provided with a horizontal shaft 31. The shaft 31 is inserted into a shaft sleeve 21 arranged on the rotating seat 2 and extends to the inside of the rotating seat 2. Two fixed blocks 32 are arranged on the side of the placement clamp 3 away from the rotating seat 2. A slot 33 is provided between the fixed blocks 32, and the circuit board is inserted in the slot 33; the shaft sleeve 21 extends radially along the rotating seat 2, and a movable seat 4 is coaxially installed in the rotating seat 2. The movable seat 4 moves along the axis in the rotating seat 2 to drive the placement clamp 3 to rotate around the axis of the shaft 31 to change the placement angle of the circuit board clamped by the placement clamp 3.
[0020] When the circuit board automatic control copper plating treatment device in the present application is in use, the chemical reagents required for copper plating treatment are added to the copper plating pool 1, and the staff can insert several circuit boards that need to be copper plating treated into the slots 33 of the placement clamp 3 one by one. The placement clamp 3 is inserted into the sleeve 21 on the side of the rotating seat 2 through the shaft rod 31. In the non-working state, the slot 33 of the placement clamp 3 remains in a vertical state, which is convenient for installing the circuit board. The holes on the circuit board inserted in the slot 33 remain horizontal. After all the circuit boards are inserted into the placement clamp 3, the rotating driver 11 at the bottom of the copper plating pool 1 starts to drive the rotating seat 2 to rotate around its own axis. The processing device in this embodiment has multiple working states. In the first working state, the circuit board rotates in a vertical state in the copper plating pool 1, so that the chemical reagent can flow in the holes of the circuit board, discharge the gas existing in the small-diameter holes, and make the chemical reagent fully contact with the hole wall. The rotating drive in this embodiment The device 11 can be a servo motor. After the rotating seat 2 drives the placement clamp 3 to rotate for a period of time, the processing device in this embodiment can enter the second working state. In the second working state, the movement of the movable seat 4 in the rotating seat 2 causes the placement clamp 3 to rotate around the axis of the shaft 31. The placement clamp 3 rotates until the slot 33 is horizontal, thereby driving the circuit board inserted in the slot 33 to rotate to a horizontal state. The circuit board can be immersed in the chemical reagent in a horizontal state for a period of time after the gas in the exhaust hole is exhausted until the copper plating treatment is completed. The movable seat 4 moves in the rotating seat 2 to rotate the placement clamp 3 to the first working state, which is convenient for the staff to remove the circuit board from the placement clamp 3 and process the subsequent circuit boards. The copper plating processing device in this embodiment can perform copper plating treatment on multiple circuit boards at one time, which improves the processing efficiency. The placement clamps 3 are distributed at equal angles around the rotating seat 2 to ensure that the spacing between the placement clamps 3 will not affect the rotation of the placement clamps 3.
[0021] In order to solve the problem of how to change the rotation angle of the placement clamp 3 by moving the movable seat 4 in the rotating seat 2, the following features are specifically set: A semicircular groove 311 is provided at one end of the shaft 31 located inside the rotating seat 2 (such as Figure 6 As shown in FIG. 1 ), when the top of the movable seat 4 is in contact with the horizontal surface of the semicircular groove 311 from bottom to top (as shown in FIG. 1 ), Figure 5As shown in the figure, the slot 33 for placing the clamp 3 remains vertical; a side strip 312 is provided at one end of the shaft rod 31 located inside the rotating seat 2, and the side strip 312 is perpendicular to the horizontal plane of the semicircular groove 311; a positioning plate 211 is provided on the inner wall of the rotating seat 2 located on one side of the sleeve 21; when the side strip 312 fits the positioning plate 211, the slot 33 for placing the clamp 3 remains horizontal; the top of the movable seat 4 is provided with vertical plates 41 having the same number as the number of clamps 3; a horizontal lower pressing plate 411 is provided on the top of the vertical plates 41; the lower pressing plate 411 presses the upper side of the side strip 312 from top to bottom so that the side strip 312 fits the positioning plate 211.
[0022] The shaft 31 of the placement clamp 3 in this embodiment is provided with a semicircular groove 311 at one end of the rotating seat 2. When the movable seat 4 moves up to the point where the horizontal surface of the top of the movable seat 4 fits into the semicircular groove 311 of the shaft 31, the horizontal surface of the semicircular groove 311 is limited by the movable seat 4, so that the placement clamp 3 cannot rotate around the axis of the shaft 31. At this time, the slot 33 of the placement clamp 3 remains vertical, so that the placement clamp 3 is in the first working state, which is convenient for installing the circuit board. When the movable seat 4 moves downward inside the rotating seat 2, the surface of the movable seat 4 is separated from the semicircular groove 311 of the shaft rod 31, and the clamp 3 can be freely rotated around the axis of the shaft rod 31. The shaft rod 31 is provided with a side strip 312, and the side strip 312 is perpendicular to the plane of the semicircular groove 311. Therefore, when the shaft rod 31 is rotated until the side strip 312 fits the positioning plate 211 on the inner wall of the rotating seat 2, the shaft rod 31 rotates ninety degrees around the axis, and the slot 33 for placing the clamp 3 is turned from a vertical state to a vertical state. The movable seat 4 is changed to a horizontal state, so that the circuit board clamped by the placement clamp 3 remains horizontal in the copper sink 1. In order to keep the side strips 312 in contact with the positioning plate 211, a vertical plate 41 is provided on the movable seat 4. When the movable seat 4 moves down, the lower pressing plate 411 on the top of the vertical plate 41 moves down, and the lower pressing plate 411 presses the upper side of the side strips 312 from top to bottom, so as to keep the side strips 312 in contact with the positioning plate 211, and further keep the circuit board in a stable horizontal state in the copper sink 1. When the movable seat 4 moves up, the lower pressing plate 411 first releases the side strips 312, so as to ensure that the placement clamp 3 can be rotated when the surface of the movable seat 4 contacts the semicircular cut groove 311 of the shaft 31, and the placement state of the circuit board is adjusted.
[0023] In order to solve the problem of how to ensure that the rotation direction of the placement clamp 3 can make the side strip 312 contact the positioning plate 211, the following features are specifically set: A plurality of mounting plates 212 are arranged on the inner wall of the rotating seat 2, and each mounting plate 212 is respectively located on a side of one of the shaft sleeves 21 away from the positioning plate 211. A first spring 213 is arranged on the side of the mounting plate 212 facing the positioning plate 211. When the side strip 312 is in a vertical state, it is in contact with an end of the first spring 213 away from the mounting plate 212, and the elastic force of the first spring 213 causes the side strip 312 to flip toward the side of the positioning plate 211.
[0024] When the cam 212 is in the upright position, the first spring 213 is pressed against the first spring 213 and the second spring 213 is pressed against the first spring 213. When the cam 212 is in the upright position, the first spring 213 is pressed against the first spring 213 and the second spring 213 is pressed against the first spring 213. When the cam 212 is in the upright position, the first spring 213 is pressed against the first spring 213 and the second spring 213 is pressed against the first spring 213. 312 is pressed from top to bottom to ensure that the side strip 312 is in contact with the positioning plate 211, so that the circuit board clamped by the placement clamp 3 remains in a horizontal state; when the movable seat 4 moves down to disengage from the semicircular groove 311, and the lower pressure plate 411 has not moved down to the state of being in contact with the side strip 312, the copper plating processing device of this embodiment is in the third working state, that is, the placement clamp 3 can freely rotate around the axis of the shaft rod 31 at a certain angle when the rotating seat 2 rotates, and the circuit board is flipped under the flow thrust of the chemical reagent, and the placement clamp 3 rotates in the opposite direction when the side strip 312 contacts the first spring 213 or the positioning plate 211, thereby bringing vibration to the gas in the hole and causing it to be discharged from the hole, thereby discharging the gas in the hole that cannot be discharged in the first working state.
[0025] In order to solve the problem of how to ensure that the rotation direction of the placement clamp 3 can make the semicircular groove 311 fit the movable seat 4 when the movable seat 4 moves to the contact shaft 31, the following features are specifically set: The movable seat 4 is provided with the same number of ejector pins 42 as the number of the clamps 3, and the ejector pins 42 extend vertically upward; the straight-line distance between the positioning plate 211 and the axis of the sleeve 21 is greater than the radius of the sleeve 21, and the ejector pins 42 are located between the positioning plate 211 and the shaft rod 31.
[0026] When the movable seat 4 moves upward, the ejector pin 42 on the top of the movable seat 4 is respectively inserted into the gap between each positioning plate 211 and the shaft rod 31, and contacts and fits the side strip 312 on the positioning plate 211. Since the lower pressure plate 411 has released the pressure on the side strip 312 at this time, the side strip 312 is lifted up by the upward ejector pin 42 and rotates toward one side of the mounting plate 212. The rotation of the side strip 312 drives the horizontal plane of the semicircular groove 311 to change from a vertical state to an inclined state, and the position of the side close to the positioning plate 211 is lower. Therefore, in the subsequent upward movement of the movable seat 4, the lower side of the semicircular groove 311 contacts the upper surface of the movable seat 4, and the placement clamp 3 can be rotated until the horizontal plane of the semicircular groove 311 fits the upper surface of the movable seat 4, so that the equipment returns to the first working state, which is convenient for the subsequent installation of the circuit board.
[0027] In order to solve the problem of how the rotary driver 11 drives the rotating seat 2 and the movable seat 4 to rotate synchronously, the following features are specifically set: A spline shaft 43 is coaxially arranged at the bottom of the movable seat 4, and a spline sleeve 22 is arranged at the bottom of the rotating seat 2, and the spline shaft 43 is inserted into the spline sleeve 22; a transmission wheel 23 is coaxially installed at one end of the bottom of the rotating seat 2 located outside the copper sinking pool 1, and a synchronous belt 231 is sleeved on the transmission wheel 23, and the other end of the synchronous belt 231 is sleeved on the driving wheel 111 fixedly installed at the working end of the rotating driver 11.
[0028] The movable seat 4 in this embodiment is inserted into the spline sleeve 22 at the bottom of the rotating seat 2 through the spline shaft 43 at the bottom, so the movable seat 4 can not only move in the vertical direction, but also ensure that the movable seat 4 can rotate with the rotating seat 2 when it moves to any height, so as to ensure that the relative positions of the vertical plate 41 and the ejector pin 42 and the positioning plate 211 of the rotating seat 2 and the side strip 312 of the placement clamp 3 are fixed, and the movement of the movable seat 4 after rotation can still drive the placement clamp 3 to rotate. In this embodiment, the bottom of the rotating seat 2 is located below the copper sink 1, and the transmission wheel 23 at the bottom of the rotating seat 2 is connected to the driving wheel 111 on the working end of the rotating driver 11 through the synchronous belt 231, so the rotating driver 11 can drive the rotating seat 2 to rotate when it is started.
[0029] In order to solve the problem of how to make the movable seat 4 in the rotating state move in the vertical direction, the following features are specifically set: A linear drive 12 is fixedly installed at the bottom of the copper sinking pool 1, and the working end of the linear drive 12 is set vertically downward; the spline shaft 43 of the movable seat 4 is coaxially provided with a swivel 431, and a horizontal base plate 44 is rotatably installed on the swivel 431, and the working end of the linear drive 12 is fixedly connected to the base plate 44; a plurality of vertical guide rods 13 are arranged below the copper sinking pool 1, and the base plate 44 is slidably installed on the guide rods 13.
[0030] The copper sinking pool 1 in this embodiment is suspended by a plurality of guide rods 13 at the bottom, so as to facilitate the installation of the rotary drive 11 and the linear drive 12 at the bottom of the copper sinking pool 1. The linear drive 12 in this embodiment can be a cylinder or an electric push rod, etc. The swivel 431 arranged at the bottom of the spline shaft 43 of the movable seat 4 is rotatably installed on the base plate 44, and the base plate 44 is fixedly connected to the working end of the linear drive 12. The guide rod 13 is inserted on the base plate 44 to guide the moving path of the base plate 44. When the linear drive 12 drives the base plate 44 to move in the vertical direction, the swivel 431 can be driven to follow the movement, so that the movable seat 4 can be moved in the vertical direction. When the movable seat 4 rotates, it rotates on the base plate 44 through the swivel 431, so as to ensure that the movable seat 4 can also move in the rotating state.
[0031] In order to solve the problem of how to quickly install and remove the circuit board by placing the clamp 3, the following features are specifically set: A mounting hole 321 is provided on the opposite side of the two fixing blocks 32 for placing the clamp 3, and the openings of the mounting holes 321 of the two fixing blocks 32 are arranged opposite to each other; a clamping block 322 and a spring 323 are provided in the mounting hole 321, and the clamping block 322 is slidably installed in the mounting hole 321, and the spring 323 elastically connects the inner wall of the mounting hole 321 and the clamping block 322, and the elastic force of the spring 323 causes the clamping block 322 to move toward the slot 33.
[0032] Chamfers are provided on the upper and lower sides of the two clamping blocks 322 .
[0033] The clamping blocks 322 are installed on the fixed blocks 32 on both sides of the placement clamp 3 in this embodiment. The clamping blocks 322 clamp the circuit board inserted into the slot 33 under the elastic force of the springs 323. The upper and lower sides of the clamping blocks 322 are both provided with chamfers, which is convenient for the staff to install the circuit board through the chamfered position of the clamping blocks 322 so that the clamping blocks 322 can squeeze the springs 323 to facilitate the entry of the circuit board. The clamping blocks 322 in this embodiment have a certain thickness, so the clamping position of the circuit board can be adjusted to avoid the position where the holes are set on the circuit board. The circuit board that enters the slot 33 and is clamped by the clamping blocks 322 can rotate with the placement clamp 3.
[0034] Working principle: When in use, the chemical reagents required for copper deposition treatment are added to the copper deposition pool 1. The staff can insert several circuit boards that need to be copper deposited into the slots 33 of the placement clamp 3 one by one. In the non-working state, the slots 33 of the placement clamp 3 remain in a vertical state. After all the circuit boards are inserted into the placement clamp 3, the rotary driver 11 at the bottom of the copper deposition pool 1 starts to drive the rotating seat 2 to rotate around its own axis. The circuit board rotates in the copper deposition pool 1 in a vertical state, so that the chemical reagents can flow in the holes of the circuit board, and the gas in the small-diameter holes is discharged, so that the chemical reagents can be After fully contacting the hole wall, the rotating seat 2 drives the placement clamp 3 to rotate for a period of time, and the movement of the movable seat 4 in the rotating seat 2 causes the placement clamp 3 to rotate around the axis of the shaft 31, and the placement clamp 3 rotates until the slot 33 is horizontal, thereby driving the circuit board inserted in the slot 33 to rotate to a horizontal state. The circuit board can be immersed in the chemical reagent in a horizontal state for a period of time after the gas in the hole is discharged until the copper plating treatment is completed. The movable seat 4 moves in the rotating seat 2 to rotate the placement clamp 3 to the first working state, which is convenient for the staff to remove the circuit board from the placement clamp 3 and process the subsequent circuit board.
[0035] The above embodiments only express one or several implementation modes of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present invention. It should be pointed out that, for a person of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention patent shall be subject to the attached claims.
Claims
1. A circuit board automatic control copper deposition processing device, comprising a copper deposition pool (1), and a rotating seat (2) coaxially installed in the copper deposition pool (1), a rotating driver (11) for driving the rotating seat (2) to rotate is arranged at the bottom of the copper deposition pool (1), characterized in that: A plurality of placement clamps (3) for clamping the circuit board are mounted on the rotating seat (2), and a horizontal shaft (31) is arranged on the placement clamp (3). The shaft (31) is inserted into a shaft sleeve (21) arranged on the rotating seat (2) and extends into the interior of the rotating seat (2). Two fixing blocks (32) are arranged on a side of the placement clamp (3) away from the rotating seat (2), and a slot (33) is provided between the fixing blocks (32). The circuit board is inserted into the slot (33); The shaft sleeve (21) extends radially along the rotating seat (2), and a movable seat (4) is coaxially mounted inside the rotating seat (2). The movable seat (4) moves along the axis inside the rotating seat (2) to drive the placement clamp (3) to rotate around the axis of the shaft rod (31) to change the placement angle of the circuit board clamped by the placement clamp (3).
2. A circuit board automatic control copper deposition processing device according to claim 1, characterized in that: A semicircular groove (311) is provided at one end of the shaft (31) located inside the rotating seat (2), and when the top of the movable seat (4) is in contact with the horizontal plane of the semicircular groove (311) from bottom to top, the slot (33) for placing the clamp (3) remains vertical; A side strip (312) is provided at one end of the shaft rod (31) located inside the rotating seat (2), and the side strip (312) is perpendicular to the horizontal plane of the semicircular groove (311). A positioning plate (211) is provided on the inner wall of the rotating seat (2) and located on one side of the shaft sleeve (21). When the side strip (312) fits the positioning plate (211), the slot (33) for placing the clamp (3) remains horizontal. The top of the movable seat (4) is provided with vertical plates (41) of the same number as the number of clamps (3). A horizontal lower pressing plate (411) is provided on the top of the vertical plates (41). The lower pressing plate (411) presses the upper side of the side strip (312) from top to bottom so that the side strip (312) fits the positioning plate (211).
3. A circuit board automatic control copper deposition processing device according to claim 2, characterized in that: The inner wall of the rotating seat (2) is provided with a plurality of mounting plates (212), each mounting plate (212) being located on a side of one of the shaft sleeves (21) away from the positioning plate (211), and a first spring (213) is provided on a side of the mounting plate (212) facing the positioning plate (211), and when the side strip (312) is in a vertical state, it abuts against an end of the first spring (213) away from the mounting plate (212), and the elastic force of the first spring (213) causes the side strip (312) to flip toward the side of the positioning plate (211).
4. A circuit board automatic control copper deposition processing device according to claim 3, characterized in that: The upper side of the movable seat (4) is provided with ejector pins (42) having the same number as that of the clamps (3), and the ejector pins (42) extend vertically upward; The straight-line distance between the positioning plate (211) and the axis of the shaft sleeve (21) is greater than the radius of the shaft sleeve (21), and the ejector pin (42) is located between the positioning plate (211) and the shaft rod (31).
5. A circuit board automatic control copper deposition processing device according to claim 4, characterized in that: A spline shaft (43) is coaxially arranged at the bottom of the movable seat (4), a spline sleeve (22) is arranged at the bottom of the rotating seat (2), and the spline shaft (43) is inserted into the spline sleeve (22); A transmission wheel (23) is coaxially mounted on one end of the bottom of the rotating seat (2) located outside the copper sinking pool (1), a synchronous belt (231) is sleeved on the transmission wheel (23), and the other end of the synchronous belt (231) is sleeved on a driving wheel (111) fixedly mounted on the working end of the rotary driver (11).
6. The circuit board automatic control copper deposition processing device according to claim 5, characterized in that: A linear drive (12) is fixedly installed at the bottom of the copper precipitation pool (1), and a working end of the linear drive (12) is arranged vertically downward; A swivel (431) is coaxially arranged on the spline shaft (43) of the movable seat (4), a horizontal base plate (44) is rotatably mounted on the swivel (431), and a working end of the linear drive (12) is fixedly connected to the base plate (44); A plurality of vertical guide rods (13) are arranged below the copper sinking pool (1), and the bottom plate (44) is slidably mounted on the guide rods (13).
7. The circuit board automatic control copper deposition processing device according to claim 1, characterized in that: A mounting hole (321) is provided on one side opposite to the two fixing blocks (32) for placing the clamp (3), and the openings of the mounting holes (321) of the two fixing blocks (32) are arranged opposite to each other; A clamping block (322) and a spring (323) are provided in the mounting hole (321); the clamping block (322) is slidably mounted in the mounting hole (321); the spring (323) elastically connects the inner wall of the mounting hole (321) and the clamping block (322); and the elastic force of the spring (323) causes the clamping block (322) to move toward the slot (33).
8. The circuit board automatic control copper deposition processing device according to claim 7, characterized in that: Chamfers are provided on the upper and lower sides of the two clamping blocks (322).