Cable semiconductor metal electroplating equipment and use method thereof

Abstract

The invention relates to the technical field of cable semiconductor electroplating, and discloses cable semiconductor metal electroplating equipment and a using method thereof.The cable semiconductor metal electroplating equipment comprises an electroplating tank, an electroplating protection layer is fixedly installed in the electroplating tank, an electroplating layer is fixedly installed in the electroplating protection layer, and an anode plate is fixedly installed on one side in the electroplating layer. According to the invention, the electrolyte is movably placed through the electroplated layer, then the cathode plate and the electrolyte are fused to form the metal deposition layer, and then the anode plate and the electrolyte are fused to promote the electrolytic reaction; then, the rotating output end of the electroplating stirring motor is used for driving the stirring paddle to rotate and stir, so that the electrolyte in the electroplating protection layer enables internal metal ions to be uniformly distributed, and then the rectifier is used for providing a stable direct-current power supply so as to carry out high-quality electroplating, so that large-area wrapping electroplating operation can be carried out on a cable semiconductor; therefore, the metal electroplating effect on the cable semiconductor is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of cable semiconductor electroplating, and in particular to a cable semiconductor metal electroplating device and a use method thereof. Background Art

[0002] Conductors are materials with electrical conductivity between that of insulators and conductors. Their electrical conductivity is easily controlled and can be used as a component material for information processing. From the perspective of science and technology or economic development, semiconductors are very important. The core units of many electronic products, such as computers, mobile phones, and digital recorders, use the changes in the electrical conductivity of semiconductors to process information. Common semiconductor materials include silicon, germanium, gallium arsenide, etc. Electroplating is the process of plating a thin layer of other metals or alloys on certain metal surfaces using the principle of electrolysis. It is a process of using electrolysis to attach a layer of metal film to the surface of metal or other material parts to prevent metal oxidation (such as rust) and improve wear resistance, conductivity, reflectivity, and corrosion resistance (sulfuric acid). Copper, etc.) and enhance the aesthetics, thereby reducing the efficiency of cable semiconductor electroplating. For this purpose, a cable semiconductor metal electroplating device and a method of using the same are proposed. However, in the process of realizing the present invention, the inventors found that at least the following problems in the prior art have not been solved: 1. It is inconvenient to perform large-area and comprehensive electroplating on cable semiconductors, thereby reducing the electroplating effect on cable semiconductors; 2. It is inconvenient to perform automated electroplating on cables, and workers are required to manually electroplate cable semiconductors, thereby reducing the electroplating efficiency of cable semiconductors; 3. It is inconvenient to monitor and control the cable semiconductor electroplating process in real time, thereby reducing the product quality of cable semiconductor electroplating and the reliability of electroplating. For this reason, the present invention designs a cable semiconductor metal electroplating device and a method of using the same. Summary of the invention

[0003] The purpose of the present invention is to solve the shortcomings existing in the prior art, such as: it is inconvenient to carry out large-area full-wrap electroplating on the cable semiconductor, thereby reducing the electroplating effect of the cable semiconductor, and it is inconvenient to carry out automated electroplating operations on the cable, requiring staff to manually electroplate the cable semiconductor, thereby reducing the electroplating efficiency of the cable semiconductor, and it is inconvenient to monitor and control the cable semiconductor electroplating process in real time, thereby reducing the product quality of the cable semiconductor electroplating and the reliability of the electroplating. To this end, the present invention designs a cable semiconductor metal electroplating device and a method of using the same.

[0004] In order to achieve the above-mentioned purpose, the present invention adopts the following technical scheme: a cable semiconductor metal electroplating equipment, comprising an electroplating tank, a plating protective layer is fixedly installed inside the electroplating tank, a plating layer is fixedly installed inside the electroplating protective layer, an anode plate is fixedly installed on one side of the electroplating layer, and a cathode plate is fixedly installed on the other side of the electroplating layer. The surface of the electroplating tank is penetrated by an electroplating stirring motor, one end of the rotating end of the electroplating stirring motor is fixedly installed with a stirring paddle, one side of the electroplating stirring motor is penetrated by an electroplating drainage pipe, the external thread of the electroplating drainage pipe is threadedly installed with an electroplating drainage cover, a rectifier is fixedly installed on one side of the electroplating tank, and an equipment waterproof plate is fixedly installed on the top of the rectifier;

[0005] Both sides of the electroplating tank tank are fixedly installed with transport support frames, the top of the transport support frame is fixedly installed with a transport support top plate, the bottom of the transport support top plate is fixedly installed with an electric slide rail, the bottom of the moving end of the electric slide rail is fixedly installed with an electric telescopic rod, and the bottom of the telescopic end of the electric telescopic rod is fixedly installed with an electric clamp;

[0006] A monitoring board is fixedly installed on one side of the electric telescopic rod, a monitoring camera is fixedly installed on the bottom of the monitoring board, an infrared camera is fixedly installed on one side of the monitoring camera, a fill light is fixedly installed on one side of the infrared camera, and a monitoring glass cover is fixedly installed on the bottom of the fill light.

[0007] Preferably, a liquid mounting rack is fixedly installed on the inner surface of the electroplating tank, an electrolyte flow tube is fixedly installed on the surface of the liquid mounting rack, an electrolyte inlet tube is penetrated through one end of the electrolyte flow tube, an electrolyte discharge pipe is penetrated through the bottom of the electrolyte flow tube, a water washing tank is fixedly installed on one side of the electroplating tank, and a pre-washing tank is fixedly installed on the other side of the electroplating tank.

[0008] Preferably, a pre-wash drain pipe is installed through the surface of the pre-wash tank, a pre-wash drain cover is installed on the external thread of the pre-wash drain pipe, a pre-wash circulating water pump is fixedly installed at the bottom end of the pre-wash tank, and a pre-wash installation back plate is fixedly installed at both ends of the pre-wash tank.

[0009] Preferably, pre-wash mounting frames are fixedly installed between the pre-wash mounting back plates, pre-wash water pipes are fixedly installed between the pre-wash mounting frames, high-pressure nozzles are installed through the pre-wash water pipes, and pre-wash bottom connecting pipes are installed through the bottoms of the pre-wash water pipes.

[0010] Preferably, an observation glass is installed through the surface of the water washing tank, a water washing drain pipe is installed through one side of the observation glass, a water washing drain cover is installed on the external thread of the water washing drain pipe, a bottom plate is fixedly installed at the bottom of the water washing tank, and a drying tank is fixedly installed on one side of the water washing tank.

[0011] Preferably, a drying drain pipe is installed through the surface of the drying box tank, a drying drain cover is installed on the external thread of the drying drain pipe, and drying installation plates are fixedly installed at both ends of the drying box tank.

[0012] Preferably, intelligent heating plates are fixedly installed between the drying installation plates, fan mounting frames are fixedly installed between the intelligent heating plates, exhaust fans are installed through the inside of the fan mounting frames, and grilles are fixedly installed inside the exhaust outlets of the exhaust fans.

[0013] Preferably, an anti-skid pad is fixedly mounted on the bottom of the base plate, and a control base is fixedly mounted on the surface of the base plate.

[0014] Preferably, a control panel is fixedly installed on the top of the control base, a control computer is fixedly installed on the top of the control panel, a power socket is fixedly installed on one side of the control computer, a control button is fixedly installed on the top of the power socket, and a control waterproof plate is fixedly installed on one end of the control computer.

[0015] A method for using a cable semiconductor metal electroplating device comprises the following steps:

[0016] S1. Use the control computer to program the electrical equipment automatically, then use the power socket to provide power to the electrical equipment, then use the control button to open and close the electrical equipment, then use the control waterproof plate to make the control equipment waterproof, then use the transport support frame to support the transport support top plate, then use the moving end of the electric slide rail to drive the electric telescopic rod to move left and right, then use the telescopic end of the electric telescopic rod to drive the electric clamp to move up and down, then use the electric clamp to clamp the cable semiconductor that needs to be electroplated up and down and move left and right, then use the monitoring board to install the monitoring equipment, then use the monitoring camera to observe the electroplating process in real time, then use the infrared camera to perform infrared detection on the electroplating process, then use the fill light to fill the monitoring process, and then use the monitoring glass cover to transparently protect the monitoring equipment;

[0017] S2. Pre-wash water is introduced through the pre-wash tank to pre-wash the cable semiconductor, and then the water source is discharged through the pre-wash drain pipe, and then the pre-wash drain pipe is movably closed by the pre-wash drain cover, and then the bottom of the pre-wash bottom connecting pipe and the drainage end of the pre-wash circulating water pump are connected through and through, and then the cable semiconductor is sprayed with a high-pressure nozzle, and then the electrolyte is externally introduced through the electrolyte introduction pipe, and then the electrolyte is flowed through the electrolyte flow pipe, and then the electrolyte is introduced into the electroplating tank through the electrolyte discharge pipe, and then the electroplating tank made of steel is used for electroplating, and then the electroplating protective layer made of steel is used for protection, and then Then, the electroplating layer is used to make the electrolyte active, and then the cathode plate and the electrolyte are fused to reduce the metal ions on the cathode surface to form a metal deposition layer. Then, the anode plate and the electrolyte are fused to promote the electrolytic reaction, and the metal ions are released through the electrolytic reaction. These metal ions are then reduced on the cathode surface to form a metal deposition layer. Then, the rotating output end of the electroplating stirring motor is used to drive the stirring paddle to rotate and stir the electrolyte in the electroplating protective layer to evenly distribute the internal metal ions. Then, the equipment waterproof plate is used to protect the rectifier, and then the rectifier is used to convert the AC power supply into a DC power supply to supply the electrolytic cell and electrodes in the electroplating process.

[0018] S3. Clean the cable semiconductors after electroplating by introducing clean water through the washing tank, and then observe the water level inside the washing tank with an observation glass, and then use the washing drain pipe to discharge the water source after cleaning the board, and then use the washing drain cover to flexibly close the washing drain pipe, and then use the drying drain pipe to drain the dried water stains in the drying tank, and then use the drying drain cover to flexibly close the drying drain pipe, and then use the intelligent heating plate to heat the temperature inside the drying tank, and then use the fan mounting bracket to install the exhaust fan, and then use the exhaust end of the exhaust fan to draw in the warm air of the intelligent heating plate, and then use the exhaust end of the exhaust fan to discharge the hot air to dry and heat the cable semiconductors after electroplating, and then use the grille to fix it inside the exhaust end of the exhaust fan.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] 1. The present invention uses a steel-made electroplating tank for electroplating, and then uses a steel-made electroplating protective layer for protection, and then uses the electroplating layer to place the electrolyte in a movable manner, and then uses the cathode plate and the electrolyte to fuse so that the metal ions are reduced on the cathode surface to form a metal deposition layer, and then uses the anode plate and the electrolyte to fuse to promote the electrolytic reaction, and releases metal ions through the electrolytic reaction. These metal ions are then reduced on the cathode surface to form a metal deposition layer, and then uses the rotating output end of the electroplating stirring motor to drive the stirring paddle to rotate and stir so that the electrolyte in the electroplating protective layer makes the internal metal ions evenly distributed, and then uses the equipment waterproof plate to protect the rectifier, and then uses the rectifier to convert the AC power supply into a DC power supply to supply the electrolytic cell and the electrode in the electroplating process, keep the direction of the current consistent, and provide a stable DC power supply for high-quality electroplating, which can perform large-area wrapping electroplating operations on cable semiconductors, thereby improving the effect of metal electroplating on cable semiconductors.

[0021] 2. The present invention supports the transport support top plate by means of a transport support frame, and then uses the moving end of the electric slide rail to drive the electric telescopic rod to move left and right, and then uses the telescopic end of the electric telescopic rod to drive the electric clamp to move up and down, and then uses the electric clamp to clamp the cable semiconductor that needs to be electroplated and move it up and down and left and right. The cable can be electroplated automatically without the need for workers to perform manual electroplating left and right, thereby improving the efficiency of cable semiconductor electroplating.

[0022] 3. The present invention installs the monitoring equipment through the monitoring board, and then uses the monitoring camera to observe the electroplating process in real time, then uses the infrared camera to perform infrared detection on the electroplating process, and then uses the fill light to fill the monitoring process, and then uses the monitoring glass cover to transparently protect the monitoring equipment. It can monitor and observe the cable semiconductor electroplating process in real time, so that the staff can control and observe the process in real time, and intervene in time when an accident occurs in the electroplating process, thereby improving the reliability of cable semiconductor electroplating. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A three-dimensional diagram of a cable semiconductor metal electroplating device proposed by the present invention;

[0024] Figure 2 This is a schematic structural diagram of a cable semiconductor metal electroplating device proposed by the present invention;

[0025] Figure 3 A schematic diagram of the partial structure of an electroplating tank of a cable semiconductor metal electroplating equipment proposed by the present invention;

[0026] Figure 4A partial stereoscopic view of a transport support frame of a cable semiconductor metal electroplating device proposed by the present invention;

[0027] Figure 5 A schematic diagram of the partial structure of a monitoring board of a cable semiconductor metal electroplating device proposed by the present invention;

[0028] Figure 6 A partial three-dimensional diagram of a pre-washing installation back plate of a cable semiconductor metal electroplating device proposed by the present invention;

[0029] Figure 7 A partial three-dimensional diagram of a liquid installation frame of a cable semiconductor metal electroplating device proposed by the present invention;

[0030] Figure 8 A partial stereoscopic diagram of a drying installation plate of a cable semiconductor metal electroplating device proposed by the present invention;

[0031] Fig. 9 A partial stereoscopic diagram of a control base of a cable semiconductor metal electroplating device proposed by the present invention;

[0032] Fig.10 A partial stereoscopic view of a water washing tank of a cable semiconductor metal electroplating equipment proposed by the present invention.

[0033] In the figure: 1, bottom plate; 101, anti-skid mat; 2, pre-wash tank; 201, pre-wash drain pipe; 202, pre-wash drain cover; 203, pre-wash circulating water pump; 3, electroplating tank; 301, electroplating drain pipe; 302, electroplating drain cover; 303, electroplating stirring motor; 304, stirring paddle; 305, electroplating protective layer; 306, electroplating layer; 307, anode plate; 308, cathode plate; 309, rectifier; 310, equipment waterproof board; 4, water washing tank; 401, observation glass; 402, water washing drain pipe; 403, water washing drain cover; 5, drying tank; 501, drying drain pipe; 502, drying drain cover; 6, control base; 601, control board; 602, control waterproof board; 603, control computer; 604, control board; 605, control board; 606, control board; 607, control board; 608, control board; 609, control computer; 610, control board; 611, control board; 612, control board; 613, control board; 614, control board; 615, control board; 616, control board; 617, control board; 618, control board; 619, control board; 620, control board; 621, control board; 622, control board; 623, control board; 624, control board; 625, control board; 626, control board; 627, control board; 628, control board; 629, control board; 630, control board; 631, control board; 632, control board; 633, control board; 634, control board; 635 04. Control button; 605. Power socket; 7. Pre-wash installation back plate; 701. Pre-wash installation frame; 702. Pre-wash water pipe; 703. Pre-wash bottom connecting pipe; 704. High-pressure nozzle; 8. Liquid installation frame; 801. Electrolyte flow pipe; 802. Electrolyte introduction pipe; 803. Electrolyte discharge pipe; 9. Drying installation plate; 901. Intelligent heating plate; 902. Fan installation frame; 903. Exhaust fan; 904. Grille; 10. Transport support frame; 1001. Transport support top plate; 1002. Electric slide rail; 1003. Electric telescopic rod; 1004. Electric gripper; 11. Monitoring board; 1101. Monitoring glass cover; 1102. Monitoring camera; 1103. Infrared camera; 1104. Fill light. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] like Figure 1-Figure 10 As shown, the present invention provides a cable semiconductor metal electroplating equipment and a method of using the same, including an electroplating tank 3, an electroplating protective layer 305 is fixedly installed inside the electroplating tank 3, an electroplating layer 306 is fixedly installed inside the electroplating protective layer 305, an anode plate 307 is fixedly installed on one side of the electroplating layer 306, and a cathode plate 308 is fixedly installed on the other side of the electroplating layer 306, an electroplating stirring motor 303 is installed through the surface of the electroplating tank 3, a stirring paddle 304 is fixedly installed at one end of the rotating end of the electroplating stirring motor 303, an electroplating drainage pipe 301 is installed through one side of the electroplating stirring motor 303, an electroplating drainage cover 302 is installed on the external thread of the electroplating drainage pipe 301, a rectifier 309 is fixedly installed on one side of the electroplating tank 3, and an equipment waterproof plate 310 is fixedly installed on the top of the rectifier 309;

[0036] Both sides of the electroplating tank 3 are fixedly installed with a transport support frame 10, a transport support top plate 1001 is fixedly installed on the top of the transport support frame 10, an electric slide rail 1002 is fixedly installed on the bottom of the transport support top plate 1001, an electric telescopic rod 1003 is fixedly installed on the bottom of the moving end of the electric slide rail 1002, and an electric clamp 1004 is fixedly installed on the bottom of the telescopic end of the electric telescopic rod 1003;

[0037] A monitoring board 11 is fixedly installed on one side of the electric telescopic rod 1003, a monitoring camera 1102 is fixedly installed on the bottom of the monitoring board 11, an infrared camera 1103 is fixedly installed on one side of the monitoring camera 1102, a fill light 1104 is fixedly installed on one side of the infrared camera 1103, and a monitoring glass cover 1101 is fixedly installed on the bottom of the fill light 1104.

[0038] When the device is working, the electroplating tank 3 made of steel is used for electroplating, and then the electroplating protective layer 305 made of steel is used for protection. Then the electroplating layer 306 is used to place the electrolyte in a movable manner, and then the cathode plate 308 and the electrolyte are fused to reduce the metal ions on the cathode surface to form a metal deposition layer, and then the anode plate 307 and the electrolyte are fused to promote the electrolytic reaction, and the metal ions are released through the electrolytic reaction. These metal ions are then reduced on the cathode surface to form a metal deposition layer, and then the rotating output end of the electroplating stirring motor 303 is used to drive the stirring paddle 30 4 Rotate and stir to make the electrolyte in the electroplating protective layer 305 evenly distribute the internal metal ions, then use the equipment waterproof plate 310 to protect the rectifier 309, and then use the rectifier 309 to convert the AC power supply into a DC power supply to supply the electrolytic cell and electrodes in the electroplating process, keep the direction of the current consistent, and provide a stable DC power supply for high-quality electroplating. It can carry out large-area wrapping electroplating operations on cable semiconductors, thereby improving the effect of metal electroplating on cable semiconductors. The anode plate 307 plays the role of providing electrons in the electroplating tank. The anode is usually made of insoluble materials, such as titanium. The substrate is coated with a precious metal oxide coating with high electrochemical catalytic performance. These coatings contain valve metal oxides with high stability. The function of the anode is to promote the electrolytic reaction. Metal ions are released through the electrolytic reaction. These metal ions are then reduced on the cathode surface to form a metal deposition layer. In the electroplating process, the cathode plate 308 usually refers to the surface of the metal to be plated, that is, the object that needs to be covered with a layer of other metals or alloys. The function of the cathode is to accept electrons so that the metal ions are reduced on the cathode surface to form a metal deposition layer. In the electroplating process, the position and design of the cathode are very important for obtaining a uniform coating. It is crucial because the current density at different positions will be different, affecting the quality of the final coating. The rectifier 309 is based on the rectification effect of semiconductor materials. The AC power supply is converted into the required DC power supply through the internal rectification device. During the electroplating process, the current output by the rectifier 309 is controlled. The size and stability of the current ensure the uniformity and quality stability of the coating during the electroplating process. The rectifier 309 is usually equipped with a precise current regulating device and a feedback system. The current is accurately controlled according to actual needs to meet the electroplating requirements of different products. The rectifier 309 is electrically connected to the control computer 603 through wires.

[0039] The transport support top plate 1001 is supported by the transport support frame 10, and then the moving end of the electric slide rail 1002 is used to drive the electric telescopic rod 1003 to move left and right, and then the telescopic end of the electric telescopic rod 1003 is used to drive the electric clamp 1004 to move up and down, and then the electric clamp 1004 is used to clamp the cable semiconductor that needs to be electroplated to move up and down and left and right, which can automatically electroplate the cable, and does not require the staff to perform manual electroplating left and right, thereby improving the efficiency of cable semiconductor electroplating. The electric clamp 1004 is mainly based on motor drive, The transmission mechanism, the clamping jaws and other core components work together. When the motor receives the control signal, it starts to rotate, and the transmission mechanism converts the rotational motion into the linear motion of the clamping jaws, thereby realizing the opening and closing of the clamping jaws. The opening and closing degree of the clamping jaws is precisely adjusted by controlling the rotation angle and speed of the motor to meet the clamping requirements of different workpieces. The electric slide rail 1002 is electrically connected to the control computer 603 through a wire, the electric telescopic rod 1003 is electrically connected to the control computer 603 through a wire, and the electric clamping jaw 1004 is electrically connected to the control computer 603 through a wire;

[0040] The monitoring equipment is installed through the monitoring board 11, and then the monitoring camera 1102 is used to observe the electroplating process in real time, and then the infrared camera 1103 is used to perform infrared detection on the electroplating process, and then the fill light 1104 is used to fill the monitoring process, and then the monitoring glass cover 1101 is used to transparently protect the monitoring equipment, so that the cable semiconductor electroplating process can be monitored and observed in real time, so that it is convenient for the staff to control and observe the process in real time, and intervene in time when an accident occurs in the electroplating process, thereby improving the reliability of the cable semiconductor electroplating. The infrared camera 1103 captures images by capturing infrared light, and its working principle is mainly based on the photoelectric effect and thermal imaging principle. The monitoring camera 1102 is electrically connected to the control computer 603 through a wire, the infrared camera 1103 is electrically connected to the control computer 603 through a wire, and the fill light 1104 is electrically connected to the control computer 603 through a wire;

[0041] Among them, the surface inside the electroplating tank 3 is fixedly installed with a liquid mounting frame 8, the surface of the liquid mounting frame 8 is fixedly installed with an electrolyte flow pipe 801, one end of the electrolyte flow pipe 801 is penetrated with an electrolyte introduction pipe 802, and the bottom of the electrolyte flow pipe 801 is penetrated with an electrolyte discharge pipe 803, one side of the electroplating tank 3 is fixedly installed with a water washing tank 4, and the other side of the electroplating tank 3 is fixedly installed with a pre-washing tank 2;

[0042] It should be noted that when the device is working, the electrolyte can be introduced externally through the electrolyte introduction pipe 802, and then the electrolyte can be made to flow through the electrolyte flow pipe 801, and then the electrolyte can be introduced into the electroplating tank 3 through the electrolyte discharge pipe 803, thereby improving the stability of the electrolyte introduction;

[0043] The surface of the pre-wash tank 2 is penetrated by a pre-wash drain pipe 201, the external thread of the pre-wash drain pipe 201 is threaded with a pre-wash drain cover 202, the bottom of the pre-wash tank 2 is fixedly installed with a pre-wash circulating water pump 203, and both ends of the pre-wash tank 2 are fixedly installed with a pre-wash installation back plate 7;

[0044] It should be noted that the pre-wash water is introduced through the pre-wash tank 2 to pre-wash the cable semiconductor, and then the water source is discharged through the pre-wash drain pipe 201, and then the pre-wash drain pipe 201 is movably closed by the pre-wash drain cover 202, thereby improving the effect of pre-washing the cable semiconductor;

[0045] Among them, pre-wash mounting frames 701 are fixedly installed between the pre-wash mounting back plates 7, pre-wash water pipes 702 are fixedly installed between the pre-wash mounting frames 701, high-pressure nozzles 704 are installed through the pre-wash water pipes 702, and pre-wash bottom connecting pipes 703 are installed through the bottoms of the pre-wash water pipes 702;

[0046] It should be noted that the bottom of the pre-wash bottom connecting pipe 703 and the drainage end of the pre-wash circulating water pump 203 are connected through, and then the cable semiconductor is sprayed with a high-pressure nozzle 704, thereby improving the pre-wash cleanliness of the cable semiconductor. The pre-wash circulating water pump 203 is electrically connected to the control computer 603 through a wire;

[0047] Among them, an observation glass 401 is installed through the surface of the water washing tank 4, a water washing drain pipe 402 is installed through one side of the observation glass 401, a water washing drain cover 403 is installed on the external thread of the water washing drain pipe 402, a bottom plate 1 is fixedly installed at the bottom of the water washing tank 4, and a drying tank 5 is fixedly installed on one side of the water washing tank 4;

[0048] It should be noted that clean water is introduced into the water washing tank 4 to clean the cable semiconductor after electroplating, and then the water level inside the water washing tank 4 is observed by using the observation glass 401, and then the water source after cleaning the board is discharged by using the water washing drain pipe 402, and then the water washing drain pipe 402 is movably closed by using the water washing drain cover 403, thereby improving the cleanliness of the cable after electroplating;

[0049] Among them, a drying drain pipe 501 is installed through the surface of the drying box tank 5, and a drying drain cover 502 is installed on the external thread of the drying drain pipe 501. Drying installation plates 9 are fixedly installed at both ends of the drying box tank 5.

[0050] It should be noted that the dried water stains in the drying box tank 5 are drained through the drying drain pipe 501, and then the drying drain pipe 501 is movably closed using the drying drain cover 502, thereby improving the effect of draining the dried water stains on the cable semiconductor.

[0051] Among them, intelligent heating plates 901 are fixedly installed between the drying installation plates 9, fan mounting frames 902 are fixedly installed between the intelligent heating plates 901, exhaust fans 903 are installed through the inside of the fan mounting frames 902, and grilles 904 are fixedly installed inside the exhaust outlets of the exhaust fans 903;

[0052] It should be noted that the temperature inside the drying box slot 5 is heated by the intelligent heating plate 901, and then the exhaust fan 903 is installed using the fan mounting frame 902, and then the warm air of the intelligent heating plate 901 is drawn in using the exhaust end of the exhaust fan 903, and then the hot air is discharged using the exhaust end of the exhaust fan 903 to dry and heat the cable semiconductors after electroplating, and then the grille 904 is fixedly installed inside the exhaust end of the exhaust fan 903, thereby improving the safety of exhaust, and being able to dry the cable semiconductors after electroplating, thereby improving the effect of electroplating, the intelligent heating plate 901 is electrically connected to the control computer 603 through wires, and the exhaust fan 903 is electrically connected to the control computer 603 through wires.

[0053] The bottom of the base plate 1 is fixedly mounted with an anti-skid pad 101 , and the surface of the base plate 1 is fixedly mounted with a control base 6 .

[0054] It should be noted that the device is supported by the base plate 1 and then the anti-skid pad 101 is used to make the device anti-skid, thereby improving the stability of the device.

[0055] Among them, a control board 601 is fixedly installed on the top of the control base 6, a control computer 603 is fixedly installed on the top of the control board 601, a power socket 605 is fixedly installed on one side of the control computer 603, a control button 604 is fixedly installed on the top of the power socket 605, and a control waterproof plate 602 is fixedly installed on one end of the control computer 603.

[0056] It should be noted that the electrical equipment is automatically programmed and used by the control computer 603, and then the power socket 605 is used to provide power to the electrical equipment. The electrical equipment is then opened and closed by the control button 604, and then the control device is waterproofed by the control waterproof plate 602, thereby improving the stability of the operation of the electrical equipment. The control computer 603 is electrically connected to the control button 604 through a wire, the control button 604 is electrically connected to the power socket 605 through a wire, and the power socket 605 is electrically connected to an external power source through a wire.

[0057] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A cable semiconductor metal electroplating device, comprising an electroplating tank (3), characterized in that: The electroplating tank (3) is fixedly installed with an electroplating protective layer (305), the electroplating layer (306) is fixedly installed inside the electroplating protective layer (305), an anode plate (307) is fixedly installed on one side of the electroplating layer (306), and a cathode plate (308) is fixedly installed on the other side of the electroplating layer (306), the surface of the electroplating tank (3) is penetrated with an electroplating stirring motor (303), one end of the rotating end of the electroplating stirring motor (303) is fixedly installed with a stirring paddle (304), one side of the electroplating stirring motor (303) is penetrated with an electroplating drainage pipe (301), the external thread of the electroplating drainage pipe (301) is threadedly installed with an electroplating drainage cover (302), a rectifier (309) is fixedly installed on one side of the electroplating tank (3), and an equipment waterproof plate (310) is fixedly installed on the top of the rectifier (309); Both sides of the electroplating tank tank (3) are fixedly installed with a transport support frame (10), the top of the transport support frame (10) is fixedly installed with a transport support top plate (1001), the bottom of the transport support top plate (1001) is fixedly installed with an electric slide rail (1002), the bottom of the moving end of the electric slide rail (1002) is fixedly installed with an electric telescopic rod (1003), and the bottom of the telescopic end of the electric telescopic rod (1003) is fixedly installed with an electric clamp (1004); A monitoring board (11) is fixedly mounted on one side of the electric telescopic rod (1003), a monitoring camera (1102) is fixedly mounted on the bottom of the monitoring board (11), an infrared camera (1103) is fixedly mounted on one side of the monitoring camera (1102), a fill light (1104) is fixedly mounted on one side of the infrared camera (1103), and a monitoring glass cover (1101) is fixedly mounted on the bottom of the fill light (1104).

2. A cable semiconductor metal electroplating device according to claim 1, characterized in that: The inner surface of the electroplating tank (3) is fixedly installed with a liquid mounting frame (8), the surface of the liquid mounting frame (8) is fixedly installed with an electrolyte flow pipe (801), one end of the electrolyte flow pipe (801) is penetrated with an electrolyte inlet pipe (802), and the bottom of the electrolyte flow pipe (801) is penetrated with an electrolyte discharge pipe (803), one side of the electroplating tank (3) is fixedly installed with a water washing tank (4), and the other side of the electroplating tank (3) is fixedly installed with a pre-washing tank (2).

3. A cable semiconductor metal electroplating device according to claim 2, characterized in that: A pre-wash drain pipe (201) is installed through the surface of the pre-wash tank (2), and a pre-wash drain cover (202) is installed on the outer thread of the pre-wash drain pipe (201). A pre-wash circulating water pump (203) is fixedly installed at the bottom end of the pre-wash tank (2), and a pre-wash installation back plate (7) is fixedly installed at both ends of the pre-wash tank (2).

4. A cable semiconductor metal electroplating device according to claim 3, characterized in that: Pre-wash mounting frames (701) are fixedly installed between the pre-wash mounting back plates (7), pre-wash water pipes (702) are fixedly installed between the pre-wash mounting frames (701), high-pressure nozzles (704) are installed through the pre-wash water pipes (702), and pre-wash bottom connecting pipes (703) are installed through the bottoms of the pre-wash water pipes (702).

5. The cable semiconductor metal electroplating equipment according to claim 2, characterized in that: An observation glass (401) is installed through the surface of the water washing tank (4), a water washing drain pipe (402) is installed through one side of the observation glass (401), a water washing drain cover (403) is installed on the external thread of the water washing drain pipe (402), a bottom plate (1) is fixedly installed at the bottom of the water washing tank (4), and a drying tank (5) is fixedly installed on one side of the water washing tank (4).

6. The cable semiconductor metal electroplating equipment according to claim 5, characterized in that: A drying drain pipe (501) is installed through the surface of the drying box tank (5), and a drying drain cover (502) is installed on the external thread of the drying drain pipe (501). Drying installation plates (9) are fixedly installed at both ends of the drying box tank (5).

7. A cable semiconductor metal electroplating device according to claim 6, characterized in that: Intelligent heating plates (901) are fixedly installed between the drying installation plates (9), fan installation frames (902) are fixedly installed between the intelligent heating plates (901), exhaust fans (903) are installed through the interior of the fan installation frames (902), and grilles (904) are fixedly installed inside the exhaust ports of the exhaust fans (903).

8. The cable semiconductor metal electroplating equipment according to claim 5, characterized in that: An anti-slip pad (101) is fixedly mounted on the bottom of the base plate (1), and a control base (6) is fixedly mounted on the surface of the base plate (1).

9. The cable semiconductor metal electroplating equipment according to claim 8, characterized in that: A control panel (601) is fixedly mounted on the top of the control base (6), a control computer (603) is fixedly mounted on the top of the control panel (601), a power socket (605) is fixedly mounted on one side of the control computer (603), a control button (604) is fixedly mounted on the top of the power socket (605), and a control waterproof plate (602) is fixedly mounted on one end of the control computer (603).

10. A method for using a cable semiconductor metal electroplating device, based on the cable semiconductor metal electroplating device according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1. The electrical device is programmed and used automatically by the control computer (603), and then the power socket (605) is used to provide power to the electrical device. Then, the control button (604) is used to open and close the electrical device, and then the control waterproof plate (602) is used to make the control device waterproof. Then, the transport support frame (10) is used to support the transport support top plate (1001), and then the moving end of the electric slide rail (1002) is used to drive the electric telescopic rod (1003) to move left and right, and then the electric telescopic rod (1003) is used to The telescopic end drives the electric clamp (1004) to move up and down, and then the electric clamp (1004) is used to clamp the cable semiconductor to be electroplated and move it up and down and left and right. Then the monitoring device is installed using the monitoring board (11), and then the monitoring camera (1102) is used to observe the electroplating process in real time. Then the infrared camera (1103) is used to perform infrared detection on the electroplating process, and then the fill light (1104) is used to fill light for the monitoring process, and then the monitoring glass cover (1101) is used to transparently protect the monitoring device; S2, pre-wash water is introduced through the pre-wash tank (2) to pre-wash the cable semiconductor, and then the water source is discharged through the pre-wash drain pipe (201), and then the pre-wash drain pipe (201) is movably closed by the pre-wash drain cover (202), and then the bottom of the pre-wash bottom connecting pipe (703) and the drainage end of the pre-wash circulating water pump (203) are connected through and through, and then the cable semiconductor is sprayed with a high-pressure nozzle (704), and then the electrolyte is externally introduced through the electrolyte introduction pipe (802), and then the electrolyte is flowed through the electrolyte flow pipe (801), and then the electrolyte is introduced into the electroplating tank (3) through the electrolyte discharge pipe (803), and then the electroplating tank (3) made of steel is used for electroplating, and then the electroplating protective layer (305) made of steel is used. ) for protection, then using the electroplating layer (306) to place the electrolyte in a mobile manner, then using the cathode plate (308) and the electrolyte to fuse so that the metal ions are reduced on the cathode surface to form a metal deposition layer, then using the anode plate (307) and the electrolyte to fuse to promote the electrolytic reaction, releasing metal ions through the electrolytic reaction, and these metal ions are subsequently reduced on the cathode surface to form a metal deposition layer, then using the rotating output end of the electroplating stirring motor (303) to drive the stirring paddle (304) to rotate and stir so that the electrolyte in the electroplating protective layer (305) makes the internal metal ions evenly distributed, then using the equipment waterproof plate (310) to protect the rectifier (309), and then using the rectifier (309) to convert the AC power supply into a DC power supply to supply the electrolytic cell and electrodes in the electroplating process; S3, clean water is introduced into the washing tank (4) to clean the cable semiconductor after electroplating, and then the water level inside the washing tank (4) is observed by using the observation glass (401), and then the water source after cleaning the board is discharged by using the washing drain pipe (402), and then the washing drain cover (403) is used to movably close the washing drain pipe (402), and then the dried water stains in the drying tank (5) are discharged by using the drying drain pipe (501), and then the drying drain cover (502) is used to close the drying drain pipe (502). 01) is moved and closed, and then the temperature inside the drying box slot (5) is heated by using the intelligent heating plate (901), and then the exhaust fan (903) is installed by using the fan mounting frame (902), and then the warm air of the intelligent heating plate (901) is drawn into the exhaust fan (903) by using the exhaust end of the exhaust fan (903), and then the hot air is discharged by using the exhaust end of the exhaust fan (903) to dry and heat the cable semiconductor after electroplating, and then the grille (904) is fixedly installed inside the exhaust end of the exhaust fan (903).

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