Simulation assembly method and system for shell and PCB design and terminal

Through the simulated assembly method of the housing and PCB design of the smart lock, the structural mismatch and unreasonable assembly caused by independent design are solved, manufacturing efficiency is improved and costs is reduced, and the design reliability and stability are ensured.

CN119129127APending Publication Date: 2024-12-13SHENZHEN KAADAS INTELLIGENT TECH CO LTD
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Patent Information

Application Number
CN202411098220.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-08-12
Publication Date
2024-12-13

AI Technical Summary

Technical Problem

The shell structural design and PCB design of the smart lock are independently carried out, resulting in structural mismatch and unreasonable assembly. The existing simulated assembly technology only focuses on assembly and wiring, neglects production manufacturability, resulting in low manufacturing efficiency.

Method used

By obtaining 3D files of the shell and PCB for simulation stacking, routing simulation and production evaluation, adjusting the design to meet production manufacturability requirements, and outputting the optimized 3D model to guide production and manufacturing.

Benefits of technology

It improves the manufacturing production efficiency of smart locks, reduces production costs, ensures the reliability and stability of the design, and solves the problems of structural mismatch and unreasonable assembly.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a simulation assembly method and system for shell and PCB design and a terminal. The method comprises the steps of obtaining a shell three-dimensional file of a shell and a PCB three-dimensional file of a PCB; performing simulation assembly on the shell three-dimensional file and the PCB three-dimensional file to obtain a simulation assembly file; performing routing simulation according to the simulation assembly file to obtain a routing assembly file; analyzing the simulation assembly file and the wiring assembly file to obtain analysis information; and adjusting the shell three-dimensional file and the PCB three-dimensional file according to the analysis information, and outputting a target shell three-dimensional file and a target PCB three-dimensional file. According to the method, the shell output by the 3D file and the PCB are subjected to simulation stacking, routing simulation is performed on the basis of simulation assembly, and the PCB file and the 3D model of the intelligent lock shell are output after evaluation for guiding production and manufacturing, so that the manufacturing and production efficiency is improved.
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Description

Technical Field

[0001] The present application relates to the technical field of smart lock design, and in particular to a simulation assembly method, system and terminal for shell and PCB design. Background Art

[0002] With the development of technology, smart locks have gradually become an important device to replace traditional locks in homes and offices due to their convenience and security. The shell structure design and PCB design of smart locks are key parts, which directly affect the performance and user experience of the product. In the design and development stage, the shell structure and PCB design of smart locks need to be fully considered and optimized to ensure product reliability and production efficiency.

[0003] Since the shell structure design and PCB design are carried out independently, this may lead to the inability to fully consider each other's needs during the design process, resulting in structural mismatch and unreasonable assembly; existing analog assembly technology often only focuses on assembly and routing issues, while ignoring production manufacturability issues, which may increase production costs and reduce production efficiency.

[0004] Therefore, the prior art still needs to be improved and developed. Summary of the invention

[0005] The main purpose of the present application is to provide a method, system and terminal for simulating assembly of a housing and PCB design, aiming to solve the problem in the prior art that housing design and PCB design are performed independently, and the simulated assembly after design only focuses on assembly and routing, resulting in low manufacturing efficiency.

[0006] A first aspect of an embodiment of the present application provides a simulation assembly method for a shell and a PCB design, and the simulation assembly method for a shell and a PCB design comprises the following steps: obtaining a shell three-dimensional file of the shell and a PCB three-dimensional file of the PCB; performing simulation assembly of the shell three-dimensional file and the PCB three-dimensional file to obtain a simulation assembly file; performing routing simulation according to the simulation assembly file to obtain a routing assembly file; analyzing the simulation assembly file and the routing assembly file to obtain analysis information; adjusting the shell three-dimensional file and the PCB three-dimensional file according to the analysis information, and outputting a target shell three-dimensional file and a target PCB three-dimensional file.

[0007] Optionally, in one embodiment of the present application, obtaining the shell three-dimensional file of the shell and the PCB three-dimensional file of the PCB specifically includes: obtaining a designed internal structure diagram of the shell, and obtaining the shell three-dimensional file according to the internal structure diagram; outputting a PCB board block diagram according to the internal structure diagram, and obtaining the PCB three-dimensional file according to the PCB board block diagram.

[0008] Optionally, in one embodiment of the present application, the simulated assembly file includes a product construction preview view and an assembly model diagram; the simulated assembly of the shell three-dimensional file and the PCB three-dimensional file to obtain the simulated assembly file specifically includes: using design software to stack the shell three-dimensional file and the PCB three-dimensional file to obtain a transition file; assembling the shell and the PCB in the transition file to obtain a product construction preview view and an assembly model diagram.

[0009] Optionally, in one embodiment of the present application, the routing assembly file includes a routing view and a routing model diagram; the routing simulation is performed according to the simulation assembly file to obtain the routing assembly file, specifically including: determining the shape position of each component in the shell and the PCB according to the assembly model diagram; based on the shape position, evaluating the spatial height of the interface device inserted into the PCB; when the spatial height meets the preset requirements, using engineering software to perform routing assembly on the shell and the PCB to obtain a routing view and a routing model diagram.

[0010] Optionally, in one embodiment of the present application, the analysis information includes assembly difficulty and assembly efficiency; the simulation assembly file and the routing assembly file are analyzed to obtain the analysis information, specifically: according to the routing view, the routing model diagram, the routing view and the routing model diagram, the assembly method of the shell and the PCB is evaluated to obtain the assembly difficulty and assembly efficiency.

[0011] Optionally, in one embodiment of the present application, adjusting the shell three-dimensional file and the PCB three-dimensional file according to the analysis information to output a target shell three-dimensional file and a target PCB three-dimensional file specifically includes: adjusting the layout mode of the routing model diagram according to the analysis information to obtain adjusted analysis information; wherein the layout mode includes the structural design of the shell three-dimensional file, the PCB layout and routing scheme of the PCB three-dimensional file; if the adjusted analysis information meets preset requirements, the adjusted shell three-dimensional file is used as the target shell three-dimensional file, and the adjusted PCB three-dimensional file is used as the target PCB three-dimensional file.

[0012] Optionally, in an embodiment of the present application, the shell three-dimensional file and the PCB three-dimensional file are adjusted according to the analysis information, and a target shell three-dimensional file and a target PCB three-dimensional file are outputted, and then the method further includes: performing reliability testing on the target shell three-dimensional file and the target PCB three-dimensional file to obtain reliability results, and performing stability analysis on the target shell three-dimensional file and the target PCB three-dimensional file to obtain stability results;

[0013] If both the reliability result and the stability result meet the expected standards, it is determined that the simulated assembly evaluation of the housing and the PCB is completed.

[0014] The second aspect of the embodiment of the present application further provides a simulation assembly system of a housing and a PCB design, wherein the simulation assembly system of a housing and a PCB design comprises:

[0015] A 3D file output module, used to obtain a shell 3D file of the shell and a PCB 3D file of the PCB;

[0016] A simulation assembly module, used for performing simulation assembly on the housing three-dimensional file and the PCB three-dimensional file to obtain a simulation assembly file;

[0017] A routing simulation module, used for performing routing simulation according to the simulation assembly file to obtain a routing assembly file;

[0018] A production evaluation module, used for analyzing the simulation assembly file and the routing assembly file to obtain analysis information;

[0019] The design model output module is used to adjust the shell three-dimensional file and the PCB three-dimensional file according to the analysis information, and output a target shell three-dimensional file and a target PCB three-dimensional file.

[0020] The third aspect of an embodiment of the present application also provides a terminal, wherein the terminal includes: a memory, a processor, and a simulation assembly program of a shell and a PCB design stored in the memory and executable on the processor, wherein the simulation assembly program of the shell and the PCB design implements the steps of the simulation assembly method of the shell and the PCB design as described above when executed by the processor.

[0021] The fourth aspect of the embodiment of the present application also provides a computer-readable storage medium, wherein the computer-readable storage medium stores a simulation assembly program of a shell and a PCB design, and when the simulation assembly program of the shell and the PCB design is executed by a processor, the steps of the simulation assembly method of the shell and the PCB design as described above are implemented.

[0022] Beneficial effect: The present application provides a simulation assembly method, system and terminal for shell and PCB design. In the method, the shell and PCB output by 3D file are simulated and stacked, routing simulation is performed on the basis of simulated assembly, and after evaluation, the PCB file and the 3D model of the smart lock shell are output for guiding production, thereby improving manufacturing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 It is a flow chart of a preferred embodiment of the simulation assembly method of the housing and PCB design of the present application;

[0025] Figure 2 It is a schematic diagram of the 3D output process of the PCB design file in a preferred embodiment of the simulation assembly method of the housing and PCB design of the present application;

[0026] Figure 3 It is a structural schematic diagram of simulated assembly in a preferred embodiment of the simulated assembly method of the housing and PCB design of the present application;

[0027] Figure 4 It is a structural schematic diagram of routing simulation in a preferred embodiment of the simulation assembly method of the housing and PCB design of the present application;

[0028] Figure 5 It is a structural schematic diagram of a preferred embodiment of the simulation assembly system of the housing and PCB design of the present application;

[0029] Figure 6 This is a schematic diagram of the structure of a preferred embodiment of the terminal of the present application.

[0030] Description of reference numerals:

[0031] 10. Simulation assembly system for shell and PCB design; 100. 3D file output module; 200. Simulation assembly module; 300. Routing simulation module; 400. Production evaluation module; 500. Design model output module. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical scheme and effect of the present application clearer and more specific, the technical scheme in the embodiments of the present application will be described clearly and completely in combination with the drawings in the embodiments of the present application. The described embodiments are only possible technical implementations of the present application, not all possible implementations. Based on the embodiments in the present application, those skilled in the art can completely combine the embodiments of the present application to obtain other embodiments without creative work, and these embodiments are also within the scope of protection of the present application.

[0033] In the related art, the shell structure design and PCB design of the smart lock are usually carried out independently. The shell structure design mainly considers the appearance and practicality of the product, while the PCB design mainly considers the layout and function realization of the circuit. After the design is completed, the design results of these two parts will be stacked in the form of 3D files to simulate product assembly for subsequent assembly and testing. Since the shell structure design and PCB design are carried out independently, it may lead to that the two cannot fully consider each other's needs during the design process, resulting in structural mismatch and unreasonable assembly. The existing simulation assembly technology often only focuses on assembly and routing issues, but ignores the problem of production manufacturability, which may increase production costs and reduce production efficiency.

[0034] It should be noted that the shell structure design and PCB design of the smart lock are usually carried out independently. The shell structure design mainly considers the appearance and practicality of the product, while the PCB design mainly considers the layout of the circuit and the realization of functions. After the design is completed, the design results of these two parts will be stacked in the form of 3D files to simulate product assembly for subsequent assembly and testing. The embodiment of the present application can achieve the mutual coordination of the shell structure design and the PCB design, avoid the problems of structural mismatch and unreasonable assembly caused by independent design, and at the same time, consider the manufacturability of production, improve production efficiency and reduce costs.

[0035] The following describes the simulation assembly method, system and terminal of the shell and PCB design of the embodiment of the present application with reference to the accompanying drawings. In view of the problem that the shell design and PCB design in the above-mentioned related art are carried out independently, and the simulation assembly after design only focuses on assembly and routing, which leads to low generation efficiency, the present application provides a simulation assembly method for shell and PCB design, in which the shell and PCB output by 3D file are simulated and stacked, routing simulation is performed on the basis of simulated assembly, and the PCB file and the 3D model of the smart lock shell are output after evaluation to guide production and manufacturing, thereby improving manufacturing efficiency. As a result, the technical problem that the shell design and PCB design in the related art are carried out independently, and the simulation assembly after design only focuses on assembly and routing, which leads to low generation efficiency, is solved.

[0036] In the embodiment of the present application, in the design stage: the structure needs to output the PCB board frame diagram first, the layout engineer imports the schematic diagram according to the board frame diagram, performs layout and routing, and then outputs the PCB 3D diagram, and the structural engineer integrates the shell structure design and PCB design of the smart lock.

[0037] The technical solution of the present application is described in detail with specific embodiments below. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described in detail in some embodiments.

[0038] The simulation assembly method of the housing and PCB design described in the preferred embodiment of the present application is as follows: Figure 1 As shown, the simulation assembly method of the housing and the PCB design includes the following steps:

[0039] In step S101, a three-dimensional file of the shell and a three-dimensional file of the PCB are obtained.

[0040] In a possible implementation, a designed internal structure diagram of the shell is obtained, and a three-dimensional file of the shell is obtained according to the internal structure diagram; a PCB board diagram is output according to the internal structure diagram, and a three-dimensional PCB file is obtained according to the PCB board diagram.

[0041] Specifically, Figure 2 As shown in the figure, in the design stage of the smart lock, the PCB board block diagram is output to provide a basic framework and reference for the subsequent layout and routing work. The board block diagram defines the key structural parameters of the PCB board, such as the size, mounting holes, and connector positions. These parameters are essential to ensure that the circuit design can correctly fit the physical space of the smart lock. According to the board block diagram, the schematic diagram is imported for layout and routing. In this process, the electronic components defined in the schematic diagram and the connection relationship between them are converted into a specific PCB layout design. It is necessary to comprehensively consider the functional performance requirements of the circuit, signal integrity, power distribution, thermal management and other factors to determine the optimal layout and connection path of the components. After completing the layout and routing, the PCB 3D diagram is output. Then the shell structure design and PCB design of the smart lock are integrated, which means matching and coordinating the PCB 3D diagram with the shell structure design of the smart lock to ensure that the two can cooperate with each other during the design process. This integrated design is demonstrated by simulating the stacking using design software, such as Cadence and Creo 8.0. In this way, structural engineers can intuitively evaluate the compatibility between the shell design and the PCB layout, and promptly discover and solve potential structural mismatches and unreasonable assembly problems.

[0042] In step S102, the shell three-dimensional file and the PCB three-dimensional file are simulated assembled to obtain a simulated assembly file.

[0043] In a possible implementation, the simulation assembly file includes a product construction preview view and an assembly model diagram; the shell three-dimensional file and the PCB three-dimensional file are stacked using design software to obtain a transition file; the shell and the PCB are assembled in the transition file to obtain a product construction preview view and an assembly model diagram.

[0044] It is understood that after the design is completed, the integrated design results are output in the form of 3D files, and then stacked with the 3D files output after the PCB design is completed to simulate the assembly process. The simulated assembly is intended to ensure that the housing and PCB of the smart lock can be seamlessly matched during design and production, avoiding structural mismatches and assembly problems in later production.

[0045] For details, see Figure 3 , Design integration: Integrate the previously independently designed shell structure and PCB design together. By using advanced 3D modeling software such as Creo 8.0, combine the 3D model of the shell with the 3D model of the PCB, so that the structure of the internal PCB and the external shell can be seen in the same view at the same time, ensuring the perfect match between the two. Simulation stacking: Output the integrated design results in the form of a 3D file, and then stack it with the 3D file output after the PCB design is completed. Assembly process: By simulating the assembly process, you can preview the entire product construction process, including checking the location of each screw hole, confirming that all connectors can be properly docked, and ensuring that all components on the PCB have enough space to be installed. This process helps to optimize component layout and improve assembly efficiency.

[0046] That is to say, the embodiments of the present application not only improve the accuracy of the design, but also greatly reduce the demand for physical prototypes, saving development time and cost.

[0047] In step S103, routing simulation is performed according to the simulation assembly file to obtain a routing assembly file.

[0048] In a possible implementation, the routing assembly file includes a routing view and a routing model diagram; based on the assembly model diagram, the shape position of each component in the shell and the PCB is determined; based on the shape position, the spatial height of the interface device inserted into the PCB is evaluated; when the spatial height meets the preset requirements, the shell and the PCB are assembled using engineering software to obtain the routing view and the routing model diagram.

[0049] Specifically, see Figure 4, based on the simulated assembly, simulated factory assembly routing simulation is carried out. The routing simulation mainly focuses on the layout and path of the circuit wires and cables in the actual assembly. Based on the simulated assembly data: Before the routing simulation, the simulated assembly of the smart lock housing and PCB has been completed, which means that the position, size and shape of all components have been determined in the 3D model. The routing simulation is carried out on this basis, using the existing 3D assembly data to guide the layout of wires and cables. Determine the height space after the interface device is plugged in: In the routing simulation, it is first necessary to evaluate the height of the space occupied by the interface device (such as connectors, sockets, etc.) after it is inserted into the PCB. This step is to ensure that components such as connectors and sockets will not interfere with the housing or other components after assembly, while ensuring that there is enough space for wires and cables to be safely and reasonably laid out. Simulation of the wiring assembly process: Use professional electrical engineering software (such as Cadence) or 3D modeling software to simulate the entire wiring assembly process, including the direction of the wires from the starting point to the end point, the way the cables are fixed, and how to arrange the paths of the wires and cables through the channels or holes inside the shell. The purpose is to ensure that the wiring meets the needs of actual production and avoid extra work or material waste caused by improper wiring in the subsequent production process. Interference check: During the wiring simulation process, check whether the wiring interferes with the shell structure or other electronic components. Any interference may affect the assembly or function of the smart lock, so that these problems can be discovered and resolved in time to ensure the feasibility and safety of the wiring. Optimize the wiring plan: According to the simulation results, adjust the wiring path and optimize the length and layout of the wires and cables to improve assembly efficiency and reduce production costs.

[0050] In other words, the embodiments of the present application can ensure the practicality of the smart lock design and production efficiency, help improve product quality, and save a lot of time and cost in the pre-production stage.

[0051] In step S104, the simulation assembly file and the routing assembly file are analyzed to obtain analysis information.

[0052] In a possible implementation, the analysis information includes assembly difficulty and assembly efficiency; based on the routing view, the routing model diagram, the routing view and the routing model diagram, the assembly method of the shell and the PCB is evaluated to obtain the assembly difficulty and assembly efficiency.

[0053] It can be understood that the results of the simulated assembly and routing simulation are analyzed, and the assembly method, assembly difficulty, production efficiency and cost of the product are evaluated considering the manufacturability of production.

[0054] Specifically, analyze the simulation results of simulated assembly and routing: collect and analyze all relevant simulation data of assembly and routing, which provide detailed information on how the housing and PCB are combined, and how the wires and cables are laid out. Evaluate the assembly method of product design: Based on the simulation results, it will be evaluated whether the assembly method of the smart lock is suitable for the existing production line and process flow, which includes checking whether all components can be easily assembled together and whether special tools or fixtures are required to assist the assembly process. Evaluate the difficulty of assembly: Determine the difficulty of the assembly process, identify possible bottlenecks and complex links, and involve the evaluation of the manual assembly requirements of specific components, the complexity or precision requirements of the welding process, etc. Consideration of production efficiency: The time efficiency of the assembly process will be analyzed to find links that can improve production efficiency, including optimizing the assembly order of components, reducing unnecessary operation steps, or improving the procedures of automated equipment to speed up production. Cost evaluation: When evaluating material costs, labor costs, and expected scrap rates, costs can be effectively reduced by optimizing the design, such as reducing the number of parts, or improving the process to reduce the scrap rate.

[0055] In step S105, the shell three-dimensional file and the PCB three-dimensional file are adjusted according to the analysis information, and a target shell three-dimensional file and a target PCB three-dimensional file are output.

[0056] In a possible implementation, the layout mode of the routing model diagram is adjusted according to the analysis information to obtain adjusted analysis information; wherein the layout mode includes the structural design of the shell three-dimensional file, the PCB layout and routing scheme of the PCB three-dimensional file; if the adjusted analysis information meets the preset requirements, the adjusted shell three-dimensional file is used as the target shell three-dimensional file, and the adjusted PCB three-dimensional file is used as the target PCB three-dimensional file.

[0057] It can be understood that according to the results of the production manufacturability analysis, the design of the smart lock is fine-tuned and optimized, and finally a PCB file containing 3D electronic components and a 3D model of the smart lock are output to guide the actual production and manufacturing.

[0058] Specifically, summarize the results of the production manufacturability analysis: collect all data and feedback from the previous steps (including simulated assembly, routing simulation, and production manufacturability assessment), which includes identified design constraints, potential production problems, and recommended improvement measures. Fine-tuning and optimization of the design: Based on the information collected, necessary adjustments to the smart lock design will begin, involving changing the PCB layout to optimize component placement, adjusting the housing design to simplify the assembly process, or changing the routing scheme to reduce production costs and improve production efficiency. Detailed review and verification: After the design adjustment is completed, a detailed review is required again to ensure that all changes meet functional requirements and production standards, including conducting more simulation tests, or using rapid prototyping to verify the actual effect of the design. Update 3D PCB files and 3D models: Once the design passes the review, the 3D PCB files will be updated to ensure that it reflects all the latest design changes. The 3D models of the smart locks will also be updated to ensure that they are compatible with the latest PCB design.

[0059] In other words, the embodiments of the present application ensure that the fully optimized and verified design can be smoothly used in production and manufacturing, thereby meeting market demand and user expectations.

[0060] In one possible implementation, a reliability test is performed on the target shell three-dimensional file and the target PCB three-dimensional file to obtain a reliability result, and a stability analysis is performed on the target shell three-dimensional file and the target PCB three-dimensional file to obtain a stability result; if the reliability result and the stability result both meet the expected standards, it is determined that the simulated assembly evaluation of the shell and the PCB is completed.

[0061] Specifically, reliability testing: The optimized design needs to pass rigorous reliability testing to verify its performance in actual use, including durability testing, environmental adaptability testing, mechanical and electrical stability testing, etc. Stability analysis: In addition to reliability testing, the stability of the product also needs to be analyzed, which involves evaluating the performance consistency and failure rate of the product during long-term operation. Stability analysis can help identify potential design defects and provide a basis for further optimization. Feedback loop: The results of testing and analysis will be fed back to identify areas that need improvement, and the design will be iterated based on these feedbacks to further improve the reliability and stability of the product.

[0062] The following is a further description of the simulation assembly method of the above-mentioned housing and PCB design of the present application through a specific embodiment:

[0063] Step K1, design stage: The structure needs to output the PCB board frame diagram first. The Layout (printed circuit board layout design) engineer imports the schematic diagram according to the board frame diagram for layout and routing, and then outputs the PCB 3D diagram. The structural engineer integrates the shell structure design and PCB design of the smart lock so that the two can cooperate with each other during the design process to avoid structural mismatch and unreasonable assembly problems caused by independent design. This integrated design needs to be displayed through design software simulation stacking, such as Cadence (PCB circuit board design software), Creo 8.0, UG, Catia, Solidworks, etc.

[0064] Step K2, simulated assembly: After the design is completed, the integrated design results are output in the form of 3D files, and then stacked with the 3D files output after the PCB design is completed to simulate the assembly process. In this way, the overall structure and layout of the product can be intuitively seen, and assembly and routing problems can be discovered and solved in a timely manner.

[0065] Step K3, routing simulation: Based on the simulated assembly, simulate the routing simulation of the factory assembly. Provide timely analysis and feedback based on the height space after the interface device is plugged in and whether there are other interference problems during the routing assembly process.

[0066] Step K4, production manufacturability assessment: Analyze the results of simulated assembly and routing simulation, and consider the manufacturability of production to evaluate the product assembly method, assembly difficulty, production efficiency and cost. Consider factors such as the difficulty of purchasing components, the complexity of the assembly process and production cost, optimize the design of the smart lock, improve production efficiency and reduce costs.

[0067] Step K5, final output: fine-tune and optimize the design of the smart lock based on the results of the production manufacturability analysis. The final output includes the PCB files of the 3D electronic components and the 3D model of the smart lock, which is used to guide the actual production and manufacturing.

[0068] Step K6, project success rate assessment: During the product development phase, by optimizing the design, the reliability and stability of the product can be improved, thereby increasing the success rate of the project. This can not only save R&D time and costs, but also improve the market competitiveness of the product.

[0069] The embodiments of the present application can effectively solve the problems of structural mismatch and unreasonable assembly caused by independent design of the housing structure and PCB design of the smart lock through the above technical means. At the same time, it can also avoid the problem that the analog assembly technology only focuses on assembly and routing and ignores the problem of production manufacturability, and can also fully evaluate the project success rate in the product development stage. Compared with the existing technology, it pays more attention to the comprehensiveness of design and the efficiency of production, can better meet the problems generated in the design and development stage, and has high practical value and broad application prospects.

[0070] Next, a simulation assembly system of a housing and a PCB design proposed in an embodiment of the present application will be described with reference to the accompanying drawings.

[0071] Figure 5 It is a block diagram of a simulated assembly system of a housing and a PCB design according to an embodiment of the present application.

[0072] like Figure 5 As shown, the shell and PCB design simulation assembly system 10 includes: a 3D file output module 100, a simulation assembly module 200, a routing simulation module 300, a production evaluation module 400 and a design model output module 500.

[0073] Specifically, the 3D file output module 100 is used to obtain a shell three-dimensional file of the shell and a PCB three-dimensional file of the PCB;

[0074] A simulation assembly module 200 is used to simulate the assembly of the housing three-dimensional file and the PCB three-dimensional file to obtain a simulation assembly file;

[0075] A routing simulation module 300 is used to perform routing simulation according to the simulation assembly file to obtain a routing assembly file;

[0076] A production evaluation module 400 is used to analyze the simulation assembly file and the routing assembly file to obtain analysis information;

[0077] The design model output module 500 is used to adjust the shell three-dimensional file and the PCB three-dimensional file according to the analysis information, and output a target shell three-dimensional file and a target PCB three-dimensional file.

[0078] Figure 6 A schematic diagram of the structure of a terminal provided in an embodiment of the present application. The terminal may include:

[0079] A memory 501 , a processor 502 , and a computer program stored in the memory 501 and executable on the processor 502 .

[0080] When the processor 502 executes the program, the simulation assembly method of the housing and the PCB design provided in the above embodiment is implemented.

[0081] Furthermore, the terminal further includes:

[0082] The communication interface 503 is used for communication between the memory 501 and the processor 502 .

[0083] The memory 501 is used to store computer programs that can be executed on the processor 502 .

[0084] The memory 501 may include a high-speed RAM memory, and may also include a non-volatile memory (non-volatile memory), such as at least one disk memory.

[0085] If the memory 501, the processor 502 and the communication interface 503 are implemented independently, the communication interface 503, the memory 501 and the processor 502 can be connected to each other through a bus and communicate with each other. The bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component (PCI) bus or an Extended Industry Standard Architecture (EIS) bus. The bus can be divided into an address bus, a data bus, a control bus, etc. For ease of representation, Figure 6 Only one thick line is used in the diagram, but this does not mean that there is only one bus or only one type of bus.

[0086] Optionally, in a specific implementation, if the memory 501, the processor 502 and the communication interface 503 are integrated on a chip, the memory 501, the processor 502 and the communication interface 503 can communicate with each other through an internal interface.

[0087] The processor 502 may be a central processing unit (CPU), or an application specific integrated circuit (ASIC), or one or more integrated circuits configured to implement the embodiments of the present application.

[0088] This embodiment also provides a computer-readable storage medium on which a computer program is stored. When the program is executed by a processor, the simulation assembly method of the housing and the PCB design as described above is implemented.

[0089] One embodiment of the present application provides a computer program product, including a computer program, which, when executed by a processor, implements the present application Figure 1A simulation assembly method of a housing and a PCB design provided in any of the corresponding embodiments.

[0090] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or N embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0091] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, "N" means at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0092] Any process or method description in a flowchart or otherwise described herein may be understood to represent a module, fragment or portion of code comprising one or N executable instructions for implementing the steps of a custom logical function or process, and the scope of the preferred embodiments of the present application includes alternative implementations in which functions may not be performed in the order shown or discussed, including performing functions in a substantially simultaneous manner or in reverse order depending on the functions involved, which should be understood by technicians in the technical field to which the embodiments of the present application belong.

[0093] The logic and / or steps represented in the flowchart or otherwise described herein, for example, can be considered as an ordered list of executable instructions for implementing logical functions, and can be embodied in any computer-readable storage medium for use by an instruction execution system, device or apparatus (such as a computer-based system, a system including a processor, or other system that can fetch instructions from an instruction execution system, device or apparatus and execute instructions), or in combination with these instruction execution systems, devices or apparatuses. For the purposes of this specification, a "computer-readable storage medium" can be any device that can contain, store, communicate, propagate or transmit a program for use by an instruction execution system, device or apparatus, or in combination with these instruction execution systems, devices or apparatuses. More specific examples (non-exhaustive list) of computer-readable storage media include the following: an electrical connection with one or N wirings (electronic device), a portable computer disk box (magnetic device), a random access memory (RAM), a read-only memory (ROM), an erasable and programmable read-only memory (EPROM or flash memory), a fiber optic device, and a portable compact disk read-only memory (CDROM). In addition, the computer-readable storage medium may even be paper or other suitable medium on which the program is printed, since the program can be obtained electronically by optically scanning the paper or other medium and then editing, interpreting or processing in other suitable ways as necessary, and then storing it in a computer memory.

[0094] It should be understood that the various parts of the present application can be implemented by hardware, software, firmware or a combination thereof. In the above-mentioned embodiment, the N steps or methods can be implemented by software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented by hardware, as in another embodiment, it can be implemented by any one of the following technologies known in the art or their combination: a discrete logic circuit having a logic gate circuit for implementing a logic function for a data signal, a dedicated integrated circuit having a suitable combination of logic gate circuits, a programmable gate array (PGA), a field programmable gate array (FPGA), etc.

[0095] A person skilled in the art may understand that all or part of the steps in the method for implementing the above-mentioned embodiment may be completed by instructing related hardware through a program, and the program may be stored in a computer-readable storage medium, which, when executed, includes one or a combination of the steps of the method embodiment.

[0096] In addition, each functional unit in each embodiment of the present application may be integrated into a processing module, or each unit may exist physically separately, or two or more units may be integrated into one module. The above-mentioned integrated module may be implemented in the form of hardware or in the form of a software functional module. If the integrated module is implemented in the form of a software functional module and sold or used as an independent product, it may also be stored in a computer-readable storage medium.

[0097] The storage medium mentioned above may be a read-only memory, a magnetic disk or an optical disk, etc. Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limiting the present application. A person of ordinary skill in the art may change, modify, replace and modify the above embodiments within the scope of the present application.

[0098] It should be understood that the application of the present application is not limited to the above examples. For ordinary technicians in this field, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to this application.

[0099] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A simulation assembly method of a housing and a PCB design, characterized in that: The simulation assembly method of the housing and PCB design includes: Obtain a shell 3D file of the shell and a PCB 3D file of the PCB; Performing simulated assembly on the housing three-dimensional file and the PCB three-dimensional file to obtain a simulated assembly file; Perform routing simulation according to the simulation assembly file to obtain a routing assembly file; Analyze the simulation assembly file and the routing assembly file to obtain analysis information; The shell three-dimensional file and the PCB three-dimensional file are adjusted according to the analysis information, and a target shell three-dimensional file and a target PCB three-dimensional file are output.

2. The method for simulating assembly of a housing and a PCB design according to claim 1, characterized in that: The obtaining of the shell three-dimensional file of the shell and the PCB three-dimensional file of the PCB specifically includes: Obtaining a designed internal structure diagram of the shell, and obtaining a three-dimensional file of the shell according to the internal structure diagram; A PCB block diagram is output according to the internal structure diagram, and a PCB three-dimensional file is obtained according to the PCB block diagram.

3. The method for simulating assembly of a housing and a PCB design according to claim 1, characterized in that: The simulation assembly file includes a product construction preview view and an assembly model diagram; The step of simulating the assembly of the shell three-dimensional file and the PCB three-dimensional file to obtain a simulated assembly file specifically includes: Using design software to stack the shell three-dimensional file and the PCB three-dimensional file to obtain a transition file; The housing and the PCB are assembled in the transition file to obtain a product construction preview view and an assembly model diagram.

4. The method for simulating assembly of a housing and a PCB design according to claim 3, characterized in that: The routing assembly file includes a routing view and a routing model diagram; The performing routing simulation according to the simulation assembly file to obtain the routing assembly file specifically includes: According to the assembly model diagram, determining the shape and position of each component in the housing and the PCB; According to the shape position, evaluating the spatial height of the interface device inserted into the PCB; When the space height meets the preset requirements, the housing and the PCB are assembled by routing using engineering software to obtain a routing view and a routing model diagram.

5. The method for simulating assembly of a housing and a PCB design according to claim 4, characterized in that: The analysis information includes assembly difficulty and assembly efficiency; The simulation assembly file and the routing assembly file are analyzed to obtain analysis information, specifically: According to the routing view, the routing model diagram, the routing view and the routing model diagram, the assembly method of the housing and the PCB is evaluated to obtain the assembly difficulty and assembly efficiency.

6. The method for simulating assembly of a housing and a PCB design according to claim 4, characterized in that: The adjusting the shell three-dimensional file and the PCB three-dimensional file according to the analysis information to output a target shell three-dimensional file and a target PCB three-dimensional file specifically includes: According to the analysis information, the layout mode of the routing model diagram is adjusted to obtain adjusted analysis information; wherein the layout mode includes the structural design of the shell three-dimensional file, the PCB layout and routing scheme of the PCB three-dimensional file; If the adjusted analysis information meets the preset requirements, the adjusted shell three-dimensional file is used as the target shell three-dimensional file, and the adjusted PCB three-dimensional file is used as the target PCB three-dimensional file.

7. The method for simulating assembly of a housing and a PCB design according to claim 1, characterized in that: The step of adjusting the shell three-dimensional file and the PCB three-dimensional file according to the analysis information, and outputting a target shell three-dimensional file and a target PCB three-dimensional file, further comprises: Performing reliability testing on the target shell three-dimensional file and the target PCB three-dimensional file to obtain reliability results, and performing stability analysis on the target shell three-dimensional file and the target PCB three-dimensional file to obtain stability results; If both the reliability result and the stability result meet the expected standards, it is determined that the simulated assembly evaluation of the housing and the PCB is completed.

8. A simulation assembly system for housing and PCB design, characterized in that: The simulation assembly system of the housing and PCB design includes: A 3D file output module, used to obtain a shell 3D file of the shell and a PCB 3D file of the PCB; A simulation assembly module, used for performing simulation assembly on the three-dimensional shell file and the three-dimensional PCB file to obtain a simulation assembly file; A routing simulation module, used for performing routing simulation according to the simulation assembly file to obtain a routing assembly file; A production evaluation module, used for analyzing the simulation assembly file and the routing assembly file to obtain analysis information; The design model output module is used to adjust the shell three-dimensional file and the PCB three-dimensional file according to the analysis information, and output a target shell three-dimensional file and a target PCB three-dimensional file.

9. A terminal, characterized in that: The terminal includes: a memory, a processor, and a simulation assembly program of a shell and a PCB design stored in the memory and executable on the processor. When the simulation assembly program of the shell and the PCB design is executed by the processor, the steps of the simulation assembly method of the shell and the PCB design as described in any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a simulation assembly program of a shell and a PCB design, and when the simulation assembly program of a shell and a PCB design is executed by a processor, the steps of the simulation assembly method of a shell and a PCB design as described in any one of claims 1 to 7 are implemented.

Citation Information

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