Material processing method and system for three-dimensional model

Abstract

The invention provides a material processing method and system for a three-dimensional model. The method comprises the following steps: acquiring a material of the three-dimensional model; identifying whether the material is a multi-dimensional material; and if the material is a multi-dimensional material, configuring the labels of a plurality of sub-materials with the same chartlet in the sub-materials of the material as the same label. According to the method, the multi-dimensional materials are processed in an automatic mode, batch processing and management of the sub-materials are achieved, the use efficiency of the materials is improved, and the manufacturing time and cost of the three-dimensional model are reduced.

Description

Technical Field

[0001] The present disclosure belongs to the field of computers, and more specifically, to a material processing method and system for a three-dimensional model. Background Art

[0002] 3D modeling is an important part of the computer digitalization field, which includes modeling, materials, textures, rendering and other aspects. Among them, material naming and merging is one of the most tedious and error-prone links in the production process. In the traditional production method, it is usually necessary to manually name each material and merge materials with the same texture, which is not only time-consuming and laborious, but also prone to improper naming or forgetting to merge, resulting in low production efficiency. Summary of the invention

[0003] The present disclosure provides a material processing method and system for a three-dimensional model, as well as an electronic device and a computer-readable storage medium, to at least solve the problems in the above-mentioned related technologies, or may not solve any of the above-mentioned problems.

[0004] According to a first aspect of an embodiment of the present disclosure, a material processing method for a three-dimensional model is provided, and the method may include: acquiring the material of the three-dimensional model; identifying whether the material is a multidimensional material; if the material is a multidimensional material, configuring the labels of multiple sub-materials with the same map in the sub-materials of the material to be the same label.

[0005] Optionally, the label may include a material name or a material identifier.

[0006] Optionally, the method may further include: if the material is not a multi-dimensional material, configuring a label of the material in a predetermined configuration manner.

[0007] Optionally, configuring the label of the material in a predetermined configuration manner may include: naming the material using a custom prefix and a custom suffix of the material name.

[0008] According to a second aspect of an embodiment of the present disclosure, a material processing system for a three-dimensional model is provided, and the system may include: a material acquisition module, configured to acquire the material of the three-dimensional model; a material identification module, configured to identify whether the material is a multidimensional material; and a material configuration module, configured to configure the labels of multiple sub-materials with the same map in the sub-materials of the material to the same label if the material is a multidimensional material.

[0009] According to a third aspect of an embodiment of the present disclosure, an electronic device is provided, which may include: at least one processor; at least one memory storing computer-executable instructions, wherein the computer-executable instructions, when executed by at least one of the processors, prompt at least one of the processors to execute a material processing method for the three-dimensional model.

[0010] According to a fourth aspect of an embodiment of the present disclosure, a computer-readable storage medium storing instructions is provided, wherein when the instructions are executed by at least one processor, the at least one processor is prompted to execute a material processing method for the three-dimensional model.

[0011] According to an embodiment of the present disclosure, by identifying whether the material of a three-dimensional model is a multi-dimensional material and configuring the labels of multiple sub-materials with the same map in the sub-materials of the material as the same label, batch processing and management of sub-materials can be achieved, thereby improving the utilization efficiency of the material and reducing the production time and cost of the three-dimensional model.

[0012] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 is an example flow chart showing a material processing method of a three-dimensional model according to an example embodiment of the present disclosure;

[0014] Figure 2 is a diagram showing a material label before and after being processed by a material processing method of a three-dimensional model according to an exemplary embodiment of the present disclosure;

[0015] Figure 3 is a schematic block diagram showing a material processing system 300 for a three-dimensional model according to an example embodiment of the present disclosure; and

[0016] Figure 4 is a schematic block diagram illustrating an electronic device 400 according to an example embodiment of the present disclosure. DETAILED DESCRIPTION

[0017] In order to enable ordinary persons in the art to better understand the technical solutions of the present disclosure, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings.

[0018] It should be noted that the terms "first", "second", etc. in the specification and claims of the present disclosure and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present disclosure described herein can be implemented in an order other than those illustrated or described herein. The implementation methods described in the following examples do not represent all implementation methods consistent with the present disclosure. Instead, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the attached claims.

[0019] It should be noted that “at least one of the several items” appearing in the present disclosure refers to three types of parallel situations: “any one of the several items”, “a combination of any multiple of the several items”, and “all of the several items”. For example, “including at least one of A and B” includes the following three parallel situations: (1) including A; (2) including B; (3) including A and B. Another example is “executing at least one of step one and step two”, which means the following three parallel situations: (1) executing step one; (2) executing step two; (3) executing step one and step two. “A and / or B” and “A and / or B” appearing in the present disclosure refer to the following three parallel situations: only A; only B; both A and B.

[0020] Figure 1 is an example flow chart showing a material processing method of a three-dimensional model according to an example embodiment of the present disclosure.

[0021] In step 110, the material of the three-dimensional model may be obtained. For example, in order to obtain the material information used in the three-dimensional model for further processing, generally speaking, this step can be achieved by directly scanning the model or importing the model file. Scanning the model requires the use of specific software and tools to scan the model, and importing the model file requires the use of specific three-dimensional modeling software to open the model file and extract the material information.

[0022] In step 120, it is possible to identify whether the material is a multi-dimensional material. The purpose of this step is to classify the materials in the three-dimensional model and distinguish between single-dimensional materials and multi-dimensional materials. Generally, a multi-dimensional material refers to a material containing multiple sub-materials, each of which may contain different textures and properties.

[0023] In step 130, if the material is a multi-dimensional material, the tags of multiple sub-materials with the same map among the sub-materials of the material may be configured as the same tag. Figure 2is a diagram showing material labels before and after processing by a material processing method for a three-dimensional model according to an example embodiment of the present disclosure. The purpose of merging sub-materials in this step is to make sub-materials with the same texture have the same label, so as to facilitate batch processing and management. The sub-materials with the same texture can be found by comparing the texture of each sub-material, and then their labels can be configured to be the same. The label may include a material name or a material identifier. If the material is not a multi-dimensional material, the label of the material may be configured in a predetermined configuration manner. For example, the material may be named using a custom prefix and a custom suffix of the material name.

[0024] Figure 3 is a schematic block diagram showing a material processing system 300 for a three-dimensional model according to an example embodiment of the present disclosure.

[0025] The system 300 may include a material acquisition module 310, a material identification module 320, and a material configuration module 330. The system 300 may be installed in various electronic devices to parse data, or various modules in the system 300 may implement corresponding functions in a separate manner, or the system 300 may be distributed online or in the cloud for use by users.

[0026] The material acquisition module 310 may be configured to acquire the material of the three-dimensional model.

[0027] The material identification module 320 may be configured to identify whether the material is a multi-dimensional material.

[0028] The material configuration module 330 may be configured to configure the tags of multiple sub-materials having the same map among the sub-materials of the material to be the same tag if the material is a multi-dimensional material.

[0029] Various modules according to example embodiments of the present disclosure may be integrated into a single module that performs its functions, or at least one of the various modules may be divided into a plurality of smaller modules.

[0030] Figure 4 is a schematic block diagram illustrating an electronic device 400 according to an example embodiment of the present disclosure.

[0031] According to an exemplary embodiment of the present disclosure, an electronic device 400 may also be provided, and the electronic device 400 may include a processor 410 and a memory 420 storing computer executable instructions. When the computer executable instructions are executed by the processor 410, the processor 410 is prompted to execute the material processing method of the three-dimensional model according to the exemplary embodiment of the present disclosure.

[0032] According to an embodiment of the present disclosure, by identifying whether the material of a three-dimensional model is a multi-dimensional material and configuring the labels of multiple sub-materials with the same map in the sub-materials of the material as the same label, batch processing and management of sub-materials can be achieved, thereby improving the utilization efficiency of the material and reducing production time and cost.

[0033] According to an embodiment of the present disclosure, a computer-readable storage medium storing instructions may also be provided, wherein when the instructions are executed by at least one processor, the at least one processor is prompted to perform a method according to an exemplary embodiment of the present disclosure. Examples of computer-readable storage media here include: read-only memory (ROM), random access programmable read-only memory (PROM), electrically erasable programmable read-only memory (EEPROM), random access memory (RAM), dynamic random access memory (DRAM), static random access memory (SRAM), flash memory, non-volatile memory, CD-ROM, CD-R, CD+R, CD-RW, CD+RW, DVD-ROM, DVD-R, DVD+R, DVD-RW, DVD+RW, DVD-RAM, BD-ROM, BD-R, BD-R LTH, BD-RE, Blu-ray or optical disk storage, hard disk drive (HDD), solid state drive (SSD), card storage (such as, multimedia card, secure digital (SD) card or extreme digital (XD) card), magnetic tape, floppy disk, magneto-optical data storage device, optical data storage device, hard disk, solid state disk and any other device, any other device is configured to store computer programs and any associated data, data files and data structures in a non-transitory manner and provide the computer programs and any associated data, data files and data structures to a processor or computer so that the processor or computer can execute the computer program. The computer program in the above-mentioned computer-readable storage medium can be run in an environment deployed in a computer device such as a client, a host, an agent device, a server, etc. In addition, in one example, the computer program and any associated data, data files and data structures are distributed on a networked computer system, so that the computer program and any associated data, data files and data structures are stored, accessed and executed in a distributed manner by one or more processors or computers.

[0034] According to an embodiment of the present disclosure, a computer program product may also be provided. Instructions in the computer program product may be executed by at least one processor in an electronic device to perform the method according to the exemplary embodiment of the present disclosure.

[0035] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. This application is intended to cover any variations, uses or adaptations of the present disclosure, which follow the general principles of the present disclosure and include common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present disclosure are indicated by the claims.

[0036] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the claims.

Claims

1. Material processing methods for 3D models, including: Get the material of the 3D model; Identify whether the material is a multi-dimensional material; If the material is a multi-dimensional material, the tags of multiple sub-materials with the same map in the sub-materials of the material are configured to be the same tag.

2. The method of claim 1, wherein: The tag includes a material name or a material identifier.

3. The method of claim 1, further comprising: If the material is not a multi-dimensional material, the label of the material is configured according to a predetermined configuration method.

4. The method of claim 3, wherein: The step of configuring the material label in a predetermined configuration manner includes: Name said material using a custom prefix and a custom suffix to the material name.

5. Material processing system for 3D models, including: A material acquisition module, configured to acquire the material of the three-dimensional model; A material identification module, configured to identify whether the material is a multi-dimensional material; The material configuration module is configured to configure the labels of multiple sub-materials with the same map in the sub-materials of the material to be the same label if the material is a multi-dimensional material.

6. Electronic equipment, including: at least one processor; at least one memory storing computer executable instructions, Wherein, when the computer executable instructions are executed by at least one of the processors, the at least one processor is prompted to perform the method as claimed in any one of claims 1 to 4.

7. A computer-readable storage medium storing instructions, characterized in that: When the instructions are executed by at least one processor, the at least one processor is prompted to perform the method according to any one of claims 1 to 4.

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