Semiconductor wire welding machine and semiconductor packaging quality control method

Abstract

The invention provides a semiconductor welding wire machine and a semiconductor packaging quality control method, the semiconductor welding wire machine comprises a welding wire module, a dispensing module and a detection module, the welding wire module is used for welding wires for a semiconductor support and forming welding spots and wire arcs, the dispensing module is used for dispensing glue for the welding spots, and the detection module is used for detecting the welding spots. And the detection module is used for collecting image information of a welding wire arc, a welding spot and a glue spot and transmitting the image information to the upper computer for image analysis so as to judge the quality of a product. The three working procedures of wire welding, glue dispensing and welding spot and glue spot detection of the semiconductor support are all achieved on one wire welding machine, the quality of products produced by the wire welding machine can be comprehensively controlled in real time, the quality of the produced products is guaranteed, and the production cost is reduced.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor packaging, and in particular relates to a semiconductor wire bonding machine and a semiconductor packaging quality control method. Background Art

[0002] In the semiconductor packaging process, the wire bonding machine, as a special equipment for welding the inner leads of semiconductors, is the core equipment of the entire semiconductor packaging process. The quality of the inner lead welding directly determines the quality of the entire semiconductor device.

[0003] The existing wire bonding machines on the market can only realize the functions of wire bonding or wire bonding plus glue dispensing, and do not have the function of controlling the quality of wire bonding and glue dispensing. With the continuous increase in market competition, customers have put forward higher requirements on the quality of wire bonding and glue dispensing, and wire bonding machines are also facing greater challenges. Traditional wire bonding machines have been difficult to meet the increasingly stringent requirements.

[0004] Therefore, it is necessary to improve the traditional wire bonding machine to meet the increasingly higher requirements for the quality of semiconductor products. Summary of the invention

[0005] The object of the present invention is to provide a semiconductor wire bonding machine and a semiconductor packaging quality control method, which can control the quality of semiconductor bonding wires and glue dispensing in real time, ensure production quality, and improve product competitiveness.

[0006] The present invention is implemented as follows: a semiconductor wire bonding machine includes a wire bonding module, a glue dispensing module and a detection module. The wire bonding module is used to bond wires to semiconductor brackets and form welding points and wire arcs. The glue dispensing module is used to dispense glue to the welding points. The detection module is used to collect image information of welding wire arcs, welding points and glue points, and transmit the image information to a host computer for image analysis to determine the quality of the product.

[0007] Furthermore, the semiconductor wire bonding machine also includes a control module and an alarm module. The control module receives information fed back by a host computer. When the control module receives information that the current product does not meet the quality requirements, the control module controls the wire bonding module and the glue dispensing module to stop working; and controls the alarm module to send an alarm signal, and the alarm signal includes a sound and / or light signal.

[0008] Furthermore, the detection module includes a welding line detection module and a glue point detection module, the welding line detection module is used to collect image information of welding line arcs and welding points, and the glue point detection module is used to collect image information of glue points.

[0009] Furthermore, the detection module includes one or more sets of lenses and cameras.

[0010] Furthermore, the detection module also includes an adjustable pan-tilt, which includes a pan-tilt mounting plate, an X-direction adjusting bolt, an X-direction transmission block, an X-direction sliding group, an X-direction sliding table, a Y-direction adjusting bolt, a Y-direction sliding table and a Y-direction sliding group; the X-direction adjusting bolt is threadedly connected to the pan-tilt mounting plate, the X-direction transmission block is fixedly connected to the X-direction sliding table, the slide rail of the X-direction sliding group is fixedly connected to the pan-tilt mounting plate, the X-direction sliding table is fixedly connected to the slider of the X-direction sliding group, and the X-direction adjusting bolt is rotated so that its tail end can abut against the X-direction transmission block; the slide rail of the Y-direction sliding group is fixed on the X-direction sliding table, the Y-direction sliding table is fixed on the slider of the Y-direction sliding group, the Y-direction adjusting bolt is threadedly connected to the X-direction transmission block, and the Y-direction adjusting bolt is rotated so that its tail end can abut against the Y-direction sliding table; the detection module is mounted on the Y-direction sliding table.

[0011] Further, the dispensing module includes a dispensing bracket, a dispensing X-direction translation mechanism, a dispensing X-direction translation slide group, a dispensing X-direction translation slide, a dispensing Y-direction translation mechanism, a dispensing Y-direction translation slide group, a dispensing Y-direction translation slide, a dispensing head and a dispensing head driving mechanism;

[0012] The slide rails of the glue dispensing X-direction translation mechanism and the glue dispensing X-direction translation slide group are fixed on the glue dispensing bracket, the glue dispensing X-direction translation slide is fixedly connected to the slider of the glue dispensing X-direction translation slide group, the power output end of the glue dispensing X-direction translation mechanism is fixedly connected to the glue dispensing X-direction translation slide, the slide rails of the glue dispensing Y-direction translation mechanism and the glue dispensing Y-direction translation slide group are both fixed on the glue dispensing X-direction translation slide, and the glue dispensing Y-direction translation slide is fixedly connected to the slider of the glue dispensing Y-direction translation slide group and the power output end of the glue dispensing Y-direction translation mechanism;

[0013] The dispensing head driving mechanism includes a rotating motor, an eccentric shaft, a deep groove ball bearing, a vertical slide and a dispensing head mounting plate. The rotating motor is fixed on the dispensing Y-axis translation slide. The eccentric shaft is fixedly connected to the rotating shaft of the rotating motor. The deep groove ball bearing is installed at the end of the eccentric shaft. The deep groove ball bearing is embedded in the vertical slide. When the rotating motor rotates, it can drive the vertical slide to move up and down. The dispensing head mounting plate is fixed to the bottom end of the vertical slide. The dispensing head is installed on the dispensing head mounting plate.

[0014] To achieve the above-mentioned object of the invention, the present invention further provides a method for semiconductor packaging quality control, comprising:

[0015] The three processes of semiconductor bracket wire bonding, glue dispensing, and detection of welding points, wire arcs and glue points are all realized on one wire bonding machine.

[0016] Furthermore, the wire welding, glue dispensing and detection of the semiconductor bracket include the following steps:

[0017] The semiconductor bracket to be produced first passes through the wire welding module for wire welding, then passes through the glue dispensing module for glue dispensing, then passes through the wire welding detection module for wire welding quality inspection, and then passes through the glue dispensing detection module for glue point inspection; when the wire welding detection module and / or the glue dispensing detection module detects that there are welding wires, wire arcs or glue points that do not meet the quality requirements, the wire welding machine will immediately stop and alarm for real-time quality control.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] The present invention provides a semiconductor wire bonding machine and a semiconductor packaging quality control method, the semiconductor wire bonding machine includes a wire bonding module, a glue dispensing module and a detection module, the wire bonding module is used to bond wires to semiconductor brackets and form welding points and wire arcs, the glue dispensing module is used to dispense glue to welding points, and the detection module is used to collect image information of welding wire arcs, welding points and glue points, and transmit the image information to a host computer for image analysis to determine the quality of the product. The quality control method of the present invention realizes the three processes of welding wires, dispensing glue and detecting welding points, wire arcs and glue points of semiconductor brackets on a wire bonding machine, so that the quality of products produced by the wire bonding machine can be controlled in real time and comprehensively, ensuring the quality of the products produced and reducing the production cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a structural schematic diagram of a semiconductor wire bonding machine provided by an embodiment of the present invention;

[0021] Figure 2 is a schematic diagram of the structure of a dispensing module and a dispensing detection module provided by an embodiment of the present invention;

[0022] Figure 3 yes Figure 2 Schematic diagram of the exploded structure of the dispensing module and the dispensing detection module. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0024] Please see Figure 1 , shows a semiconductor wire bonding machine provided by the present embodiment, including a wire bonding module 1, a glue dispensing module 2 and a detection module, the wire bonding module 1 is used to bond wires to the semiconductor bracket 200 and form welding points and wire arcs, the glue dispensing module 2 is used to dispense glue to the welding points, and the detection module is used to collect image information of welding wire arcs, welding points and glue points, and transmit the image information to the host computer for image analysis to judge the quality of the product.

[0025] Furthermore, the semiconductor wire bonding machine of this embodiment further includes a control module and an alarm module. The control module receives information fed back by the host computer. When the control module receives information that the current product does not meet the quality requirements, the control module controls the wire bonding module and the dispensing module to stop working, and controls the alarm module to send an alarm signal. The alarm signal can be a sound signal or a light signal.

[0026] The inspection module includes one or more sets of lenses and cameras, which are used to take pictures of the welding wire or the bracket after glue dispensing, and then transmit them to the computer for image analysis; image analysis can quickly and in real time perform quality inspection on wire arcs, welding points and glue points.

[0027] According to the functions, the detection module includes a welding line detection module 3 and a glue point detection module 4. The welding line detection module 3 is used to collect image information of welding line arcs and welding points, and the glue point detection module 4 is used to collect image information of glue points.

[0028] For further information, see Figure 2 and Figure 3 , showing a combined structure of a dispensing module 2 and a dispensing detection module 4 provided in this embodiment, wherein the dispensing detection module 4 includes an adjusting pan-tilt table 5, and the adjusting pan-tilt table 5 includes a pan-tilt table mounting plate 51, an X-axis adjusting bolt 52, an X-axis transmission block 53, an X-axis sliding group 54, an X-axis sliding table 55, a Y-axis adjusting bolt 56, a Y-axis sliding table 57 and a Y-axis sliding group 58.

[0029] The X-direction adjusting bolt 52 is threadedly connected to the pan-tilt mounting plate 51, the X-direction transmission block 53 is fixedly connected to the X-direction slide 55, the slide rail of the X-direction slide group 54 is fixedly connected to the pan-tilt mounting plate 51, the X-direction slide 55 is fixedly connected to the slider of the X-direction slide group 54, and the X-direction adjusting bolt 52 is rotated so that its tail end can abut against the X-direction transmission block 53; the slide rail of the Y-direction slide group 57 is fixed on the X-direction slide 55, the Y-direction slide 57 is fixed on the slider of the Y-direction slide group 58, the Y-direction adjusting bolt 56 is threadedly connected to the X-direction transmission block 53, and the Y-direction adjusting bolt 56 is rotated so that its tail end can abut against the Y-direction slide 57; the detection module is installed on the Y-direction slide 57. It can be seen that after manually moving the X-direction slide 55 and the Y-direction slide 57, the X-direction adjusting bolt 52 and the Y-direction adjusting bolt 56 can be rotated to tighten the two slides respectively, thereby completing the positioning operation of the detection module in the X and Y directions.

[0030] The glue dispensing module 2 includes a glue dispensing bracket 21, a glue dispensing X-direction translation mechanism 22, a glue dispensing X-direction translation slide group 23, a glue dispensing X-direction translation slide 24, a glue dispensing Y-direction translation mechanism 25, a glue dispensing Y-direction translation slide group 26, a glue dispensing Y-direction translation slide 27, a glue dispensing head 28 and a glue dispensing head driving mechanism.

[0031] The slide rails of the glue dispensing X-direction translation mechanism 22 and the glue dispensing X-direction translation slide group 23 are fixed on the glue dispensing bracket 21, the glue dispensing X-direction translation slide 24 is fixedly connected to the slider of the glue dispensing X-direction translation slide group 23, the power output end of the glue dispensing X-direction translation mechanism 22 is fixedly connected to the glue dispensing X-direction translation slide 24, the slide rails of the glue dispensing Y-direction translation mechanism 25 and the glue dispensing Y-direction translation slide group 26 are fixed on the glue dispensing X-direction translation slide 24, and the glue dispensing Y-direction translation slide 27 is fixedly connected to the slider of the glue dispensing Y-direction translation slide group 26 and the power output end of the glue dispensing Y-direction translation mechanism 25. When the glue dispensing X-direction translation mechanism 22 and the glue dispensing Y-direction translation mechanism 25 are working, they can drive the glue dispensing head drive mechanism to translate in the X direction and the Y direction.

[0032] Specifically, the dispensing head driving mechanism includes a rotating motor 291, an eccentric shaft 292, a deep groove ball bearing 293, a vertical slide 294 and a dispensing head mounting plate 295. The rotating motor 291 is fixed on the dispensing Y-direction translation slide 27, the eccentric shaft 292 is fixedly connected to the rotating shaft of the rotating motor 291, the deep groove ball bearing 293 is installed at the end of the eccentric shaft 292, and the deep groove ball bearing 293 is embedded in the vertical slide 294. When the rotating motor 291 rotates, it can drive the vertical slide 294 to move up and down. The dispensing head mounting plate 295 is fixed at the bottom end of the vertical slide 294, and the dispensing head 28 is installed on the dispensing head mounting plate 295. When the rotating motor 291 is working, it can drive the dispensing head 28 to move up and down to complete the dispensing operation.

[0033] This embodiment also provides a method for semiconductor packaging quality control, which realizes three processes of semiconductor bracket wire bonding, glue dispensing, and detection of welding points, wire arcs and glue points on one wire bonding machine.

[0034] Specifically, the wire bonding, glue dispensing and testing of the semiconductor bracket include the following steps:

[0035] The semiconductor bracket 200 to be produced first passes through the wire welding module 1 for wire welding, then passes through the glue dispensing module 2 for glue dispensing, then passes through the wire welding detection module 3 for quality inspection of the wire welding, and then passes through the glue dispensing detection module 4 for glue spot inspection; when the wire welding detection module 3 and / or the glue dispensing detection module 4 detects that there are welding wires, wire arcs or glue spots that do not meet the quality requirements, the wire welding machine will immediately stop and alarm, and real-time quality control will be carried out.

[0036] In summary, this embodiment realizes the three processes of wire welding, glue dispensing, and detection of welding points, wire arcs and glue points of the semiconductor bracket 200 on one wire bonding machine, so that the quality of the products produced by the wire bonding machine can be controlled in real time and comprehensively, thereby ensuring the quality of the products and reducing the production costs.

[0037] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor wire bonding machine, characterized in that: It includes a wire welding module, a glue dispensing module and a detection module. The wire welding module is used to weld wires to semiconductor brackets and form welding points and wire arcs. The glue dispensing module is used to dispense glue on the welding points. The detection module is used to collect image information of welding wire arcs, welding points and glue points, and transmit the image information to a host computer for image analysis to determine the quality of the product.

2. The semiconductor wire bonding machine according to claim 1, wherein: It also includes a control module and an alarm module. The control module receives information fed back by a host computer. When the control module receives information that the current product does not meet the quality requirements, the control module controls the welding module and the dispensing module to stop working; and controls the alarm module to send out an alarm signal, which includes a sound and / or light signal.

3. The semiconductor wire bonding machine according to claim 1, wherein: The detection module includes a welding line detection module and a glue point detection module. The welding line detection module is used to collect image information of welding line arcs and welding points, and the glue point detection module is used to collect image information of glue points.

4. The semiconductor wire bonding machine according to claim 1, wherein: The detection module includes one or more sets of lenses and cameras.

5. The semiconductor wire bonding machine according to claim 1, wherein: The detection module also includes an adjustment pan-tilt, which includes a pan-tilt mounting plate, an X-direction adjustment bolt, an X-direction transmission block, an X-direction sliding group, an X-direction slide table, a Y-direction adjustment bolt, a Y-direction slide table and a Y-direction slide table; the X-direction adjustment bolt is threadedly connected to the pan-tilt mounting plate, the X-direction transmission block is fixedly connected to the X-direction slide table, the slide rail of the X-direction slide group is fixedly connected to the pan-tilt mounting plate, the X-direction slide table is fixedly connected to the slider of the X-direction slide group, and the X-direction adjustment bolt is rotated, and its tail end can abut against the X-direction transmission block; the slide rail of the Y-direction slide group is fixed on the X-direction slide table, the Y-direction slide table is fixed on the slider of the Y-direction slide group, the Y-direction adjustment bolt is threadedly connected to the X-direction transmission block, and the Y-direction adjustment bolt is rotated, and its tail end can abut against the Y-direction slide table; the detection module is mounted on the Y-direction slide table.

6. The semiconductor wire bonding machine according to claim 1, characterized in that: The dispensing module includes a dispensing bracket, a dispensing X-direction translation mechanism, a dispensing X-direction translation slide group, a dispensing X-direction translation slide, a dispensing Y-direction translation mechanism, a dispensing Y-direction translation slide group, a dispensing Y-direction translation slide, a dispensing head and a dispensing head driving mechanism; The slide rails of the glue dispensing X-direction translation mechanism and the glue dispensing X-direction translation slide group are fixed on the glue dispensing bracket, the glue dispensing X-direction translation slide is fixedly connected to the slider of the glue dispensing X-direction translation slide group, the power output end of the glue dispensing X-direction translation mechanism is fixedly connected to the glue dispensing X-direction translation slide, the slide rails of the glue dispensing Y-direction translation mechanism and the glue dispensing Y-direction translation slide group are both fixed on the glue dispensing X-direction translation slide, and the glue dispensing Y-direction translation slide is fixedly connected to the slider of the glue dispensing Y-direction translation slide group and the power output end of the glue dispensing Y-direction translation mechanism; The dispensing head driving mechanism includes a rotating motor, an eccentric shaft, a deep groove ball bearing, a vertical slide and a dispensing head mounting plate. The rotating motor is fixed on the dispensing Y-axis translation slide. The eccentric shaft is fixedly connected to the rotating shaft of the rotating motor. The deep groove ball bearing is installed at the end of the eccentric shaft. The deep groove ball bearing is embedded in the vertical slide. When the rotating motor rotates, it can drive the vertical slide to move up and down. The dispensing head mounting plate is fixed to the bottom end of the vertical slide. The dispensing head is installed on the dispensing head mounting plate.

7. A method for semiconductor packaging quality control, characterized in that: The method comprises: The three processes of semiconductor bracket wire bonding, glue dispensing, and detection of welding points, wire arcs and glue points are all realized on one wire bonding machine.

8. The method according to claim 7, characterized in that The wire bonding, glue dispensing and detection of the semiconductor bracket include the following steps: The semiconductor bracket to be produced first passes through the wire welding module for wire welding, then passes through the glue dispensing module for glue dispensing, then passes through the wire welding detection module for wire welding quality inspection, and then passes through the glue dispensing detection module for glue point inspection; when the wire welding detection module and / or the glue dispensing detection module detects that there are welding wires, wire arcs or glue points that do not meet the quality requirements, the wire welding machine will immediately stop and alarm for real-time quality control.

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