High-precision large-size multi-laminated chip mounting tool and mounting method

Abstract

The high-precision large-size multi-laminated chip mounting tool comprises a base, a dispensing positioning piece and a plurality of mounting positioning frames, a substrate adsorption table is arranged at the center of the base, a vacuum adsorption hole is formed in the center of the substrate adsorption table, the substrate adsorption table is used for adsorbing a substrate, and the vacuum adsorption hole is formed in the center of the substrate adsorption table. The dispensing positioning sheet is placed on the upward surface of the substrate or the chip, the dispensing positioning sheet is used for determining the dispensing range, the chip mounting positioning frame is detachably arranged at the top of the base, the center of the chip mounting positioning frame is provided with a placement opening matched with the chip, the inner side wall of the placement opening is vertically provided with a plurality of limiting baffles, and the limiting baffles are arranged on the inner side wall of the placement opening. And the placement openings of the plurality of chip loading positioning frames are reduced layer by layer according to the sizes of the chips for lamination. According to the invention, the chip mounting precision can be ensured, the chip mounting strength and porosity requirements can be met after curing, the process reliability is ensured, and the operation process is simple.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated power manufacturing, and in particular to a high-precision large-size multi-stacked chip mounting tool and a chip mounting method. Background Art

[0002] In the field of ceramic packaging, many existing machines use silver glue to mount chips, which is only suitable for single chips or small-sized chips. With the development of semiconductors, there are new requirements for glue-mounted chips. For some unconventional products, large-size multi-layer chip stacking, conventional mounting methods and processes cannot achieve this type of mounting, and the mounting accuracy and yield cannot be guaranteed. Summary of the invention

[0003] The present invention provides a high-precision large-size multi-layer chip mounting tool and a mounting method to solve the problem that the conventional mounting method and process mentioned in the background technology cannot guarantee the mounting accuracy and yield of large-size multi-layer chips.

[0004] A technical solution of the present invention is as follows: A high-precision large-size multi-layer chip loading tooling comprises: a base, a glue dispensing positioning sheet and a plurality of loading positioning frames, a substrate adsorption table is arranged at the center of the base, a vacuum adsorption hole is arranged at the center of the substrate adsorption table, the substrate adsorption table is used to adsorb the substrate, the glue dispensing positioning sheet is placed on the upward side of the substrate or chip, the glue dispensing positioning sheet is used to determine the glue dispensing range, the loading positioning frame is detachably arranged on the top of the base, a placement opening adapted to the chip is opened at the center of the loading positioning frame, a plurality of limit baffles are vertically arranged on the inner side wall of the placement opening, and the placement openings of the plurality of loading positioning frames are reduced layer by layer according to the size of the chip used for stacking.

[0005] Furthermore, a positioning pin is installed on the top of the base, and a positioning hole matched with the positioning pin is provided on the film loading positioning frame.

[0006] Furthermore, a positioning pin installation groove is provided on the top of the base, and the positioning pin is installed in the positioning pin installation groove.

[0007] Furthermore, the base includes a bottom plate and a frame-shaped side wall, the frame-shaped side wall is arranged on the bottom plate, and the size of the frame-shaped side wall is adapted to the substrate.

[0008] Furthermore, an opening is provided on the frame-shaped side wall.

[0009] Furthermore, a plurality of the glue dispensing positioning sheets are provided, and an opening of each glue dispensing positioning sheet corresponds to a glue dispensing position.

[0010] Furthermore, substrate supports are arranged around the substrate adsorption platform.

[0011] Furthermore, handles are provided on both sides of the glue dispensing positioning sheet.

[0012] Another technical solution of the present invention is as follows: A high-precision large-size stacked chip mounting method, using any of the above-mentioned high-precision large-size multi-stacked chip mounting tools, comprising: S10: placing a substrate in the base, and adsorbing the substrate through the vacuum adsorption holes; S20: Install the dispensing positioning sheet on the substrate, use a dispensing machine to dispense glue on the opening of the dispensing positioning sheet, and remove the dispensing positioning sheet after the dispensing is completed; S30: installing a chip mounting and positioning frame on the base, and placing the chip on the substrate through a placement opening of the chip mounting and positioning frame and along a limit stopper of the chip mounting and positioning frame; S40: Use an oven to preliminarily cure the substrate and the chip, the curing temperature is 50~110℃, and the curing time is 30~60min; S50: After the initial curing is completed, S20-S40 are repeated to perform multi-layer dispensing and multi-layer chip mounting; S60: After the multi-layer chip is loaded, a nitrogen oven is used to completely cure the substrate and the multi-layer chip. The curing temperature is 150~200℃ and the curing time is 60~90min.

[0013] The beneficial effects of the present invention are as follows: the present invention realizes the installation of large-size multi-layer stacked chips by processing a base adapted to the substrate, fixing the substrate by vacuum adsorption, and dispensing positioning sheets and chip positioning frames. The tooling can ensure the chip loading accuracy, and can meet the chip loading strength and porosity requirements after curing, thereby ensuring process reliability and simple operation process. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a structural schematic diagram of the high-precision large-size multi-stacked chip mounting tooling of the present invention.

[0015] Figure 2 It is a schematic diagram of the cross-sectional structure of the high-precision large-size multi-stacked chip mounting tooling of the present invention.

[0016] Figure 3 It is a schematic diagram of the base in the present invention.

[0017] Figure 4 It is a schematic diagram of the film loading positioning frame in the present invention.

[0018] Figure 5 It is a schematic diagram of secondary film loading in the present invention.

[0019] Figure 6 It is a schematic diagram of the glue dispensing point position sheet in the present invention.

[0020] Figure 7 It is a flow chart of the high-precision large-size stacked chip mounting method of the present invention. DETAILED DESCRIPTION

[0021] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiment of the present invention. The described embodiment is only a part of the embodiment of the present invention, not all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work should fall within the scope of protection of the present invention.

[0022] In one technical solution of the present invention, Figure 1 and Figure 2 Schematic diagram of the structure of a high-precision large-size multi-stack chip loading tool according to the present invention. Figure 1 and Figure 2 As shown, the present invention specifically includes: A base 1 , a glue dispensing positioning sheet 6 and a plurality of mounting positioning frames 3 , wherein the base 1 is made according to the substrate, and the size of the base 1 is adapted to the substrate to ensure that the substrate can be completely fitted inside the base 1 .

[0023] like Figure 3 As shown, a substrate adsorption platform 11 is arranged at the center of the base 1, and a vacuum adsorption hole 12 is arranged at the center of the substrate adsorption platform 11. The substrate adsorption platform 11 is used to adsorb the substrate 4. The vacuum adsorption hole is connected to a vacuum pumping device, and the vacuum adsorption hole forms a negative pressure to adsorb and fix the substrate 4. Substrate supports 14 are arranged around the substrate adsorption platform 11, and the substrate is supported and fixed by the substrate supports 14 and the substrate adsorption platform 11.

[0024] The glue dispensing positioning sheet 6 is placed on the upward side of the substrate 4 or the chip 5, and the glue dispensing positioning sheet 6 is used to determine the glue dispensing range. When arranging the chips 5 of the first layer, the glue dispensing positioning sheet 6 is placed on the substrate for glue dispensing positioning. When arranging the chips 5 of the second layer, the glue dispensing positioning sheet 6 is placed on the chips 5 of the first layer for glue dispensing positioning, and so on.

[0025] The mounting and positioning frame 3 is detachably arranged on the top of the base 1. Figure 4 As shown, a placement opening 31 adapted for the chip is provided at the center of the chip loading and positioning frame 3, and a plurality of limit baffles 32 are vertically provided on the inner side wall of the placement opening 31, wherein the chip is placed from the placement opening 31 and slides down onto the substrate along the limit baffles 32, and the limit baffles 32 can prevent the chip 5 from shaking, thereby ensuring the accuracy of the chip loading.

[0026] The placement openings 31 of the plurality of chip placement positioning frames 3 are gradually reduced in size according to the size of the chips used for stacking. Figure 2 and Figure 5 As shown, the placement opening of the chip mounting and positioning frame 3 for positioning the first layer of chips is larger than the placement opening of the chip mounting and positioning frame 3 for positioning the second layer of chips, and so on. The specific size of the placement opening of the chip mounting and positioning frame 3 is adapted to the size of the chip of the corresponding layer.

[0027] In one embodiment of the present technical solution, Figure 3 As shown, a positioning pin 2 is installed on the top of the base 1, and a positioning hole 33 matching the positioning pin 2 is provided on the film loading positioning frame 3. A positioning pin installation groove 13 is opened on the top of the base 1, and the positioning pin is installed in the positioning pin installation groove 13. The film loading positioning frame 3 is positioned and installed by the positioning pin.

[0028] In one embodiment of the present technical solution, the base 1 includes a bottom plate 16 and a frame-shaped side wall 17, and the frame-shaped side wall 17 is arranged on the bottom plate 16, and the size of the frame-shaped side wall 17 is adapted to the substrate. The shape and size of the frame-shaped side wall 17 are adapted to the substrate. The frame-shaped side wall 17 is provided with an opening 15, and the staff can reach into the base from the opening to facilitate the taking of the film loading positioning frame 3.

[0029] In one embodiment of the present technical solution, a plurality of the glue dispensing positioning sheets 6 are provided, and an opening of each glue dispensing positioning sheet 6 corresponds to a glue dispensing position.

[0030] In one embodiment of the present technical solution, Figure 6 As shown, handles 61 are provided on both sides of the glue dispensing positioning sheet 6 to facilitate taking and placing the glue dispensing positioning sheet 6.

[0031] In another technical solution of the present invention, Figure 7 The flowchart is provided according to the specific steps of a high-precision large-size stacked chip mounting method. The method uses any of the high-precision large-size multi-stacked chip mounting tools described above, such as Figure 7 As shown, the present invention includes: S10: placing a substrate in the base 1 and adsorbing the substrate through the vacuum adsorption holes 12 .

[0032] First, the base 1 needs to be made according to the size of the substrate, and the chip mounting positioning frame 3 needs to be made according to the size of the chip. The size of the substrate is measured, and the base for fixing the substrate is made according to the measured size of the special-shaped substrate and chip, and the dispensing positioning sheet 6 and the chip mounting positioning frame are made according to the drawings.

[0033] S20: Install the glue dispensing positioning sheet 6 on the substrate, use a glue dispensing machine to dispense glue on the opening of the glue dispensing positioning sheet 6, and after the glue dispensing is completed, remove the glue dispensing positioning sheet 6.

[0034] After the substrate is fixed by vacuum adsorption, the glue dispensing gasket is installed on the substrate, and the glue dispensing operation is performed at the fixed position of the substrate. After the glue dispensing is completed, the glue dispensing gasket is removed.

[0035] S30: Install the chip mounting and positioning frame 3 on the base 1, and use a suction pen or tweezers to place the chip from the placement opening 31 of the chip mounting and positioning frame 3 and along the limiting baffle 32 of the chip mounting and positioning frame 3 on the substrate.

[0036] Using the base positioning pins as positioning, install the chip positioning frame on the base, put the chip in from the placement opening 31 of the chip positioning frame 3, and slide down along the limit baffle 32 of the chip positioning frame 3 onto the substrate, use a rubber or manually rub the chip to make the glue overflow around the chip. At the same time, check the surface state of the chip. If there is no chip damage and the porosity is qualified, the first layer of chip loading is completed.

[0037] S40: Use an oven to preliminarily cure the substrate and the chip.

[0038] The substrate is placed in an oven for preliminary curing at a temperature of 50-110°C for 30-60 minutes. The preliminary curing does not mean that the mounting adhesive is completely cured, but the curing is stopped after the first layer of chips is initially fixed.

[0039] S50: After the chip is initially cured, S20-S40 are repeated to perform multi-layer dispensing and multi-layer chip mounting.

[0040] After the initial curing, a dispensing positioning sheet 6 is placed on the first layer of chips to perform the second layer of dispensing and chip loading. Attention should be paid to the position of the second layer of dispensing and chip loading, and multiple layers of dispensing and chip loading should be performed according to actual needs.

[0041] S60: After the multi-layer chip is mounted, a nitrogen oven is used to completely cure the substrate and the multi-layer chip.

[0042] After the second layer of glue dispensing and wafer loading is completed, the substrate is placed in a nitrogen oven for curing at a temperature of 150-200°C and a curing time of 60-90 minutes. After curing, the wafer loading inspection is performed.

[0043] Finally, it should be noted that the above specific implementation methods are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to examples, those skilled in the art should understand that the technical solution of the present invention can be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present invention, which should be included in the scope of the claims of the present invention.

Claims

1. A high-precision, large-size, multi-layer chip loading tool, characterized in that: include: A base (1), a glue dispensing positioning sheet (6) and a plurality of chip loading positioning frames (3); a substrate adsorption platform (11) is arranged at the center of the base (1); a vacuum adsorption hole (12) is arranged at the center of the substrate adsorption platform (11); the substrate adsorption platform (11) is used to adsorb a substrate (4); the glue dispensing positioning sheet (6) is placed on the upward side of the substrate (4) or the chip (5); the glue dispensing positioning sheet (6) is used to determine the glue dispensing range; the chip loading positioning frame (3) is detachably arranged on the top of the base (1); a placement opening (31) adapted to the chip (5) is opened at the center of the chip loading positioning frame (3); a plurality of limit baffles (32) are vertically arranged on the inner side wall of the placement opening (31); and the placement openings (31) of the plurality of chip loading positioning frames (3) are reduced layer by layer according to the size of the chip (5) used for stacking.

2. The high-precision large-size multi-layer chip loading tool as claimed in claim 1, characterized in that: A positioning pin (2) is installed on the top of the base (1), and a positioning hole (33) matching the positioning pin (2) is provided on the film loading positioning frame (3).

3. The high-precision large-size multi-layer chip loading tool as claimed in claim 2, characterized in that: A positioning pin installation groove (13) is provided on the top of the base (1), and the positioning pin (2) is installed in the positioning pin installation groove (13).

4. The high-precision large-size multi-layer chip loading tool as claimed in claim 1, characterized in that: The base (1) comprises a bottom plate (16) and a frame-shaped side wall (17); the frame-shaped side wall (17) is arranged on the bottom plate (16); and the size of the frame-shaped side wall (17) is adapted to the base plate (4).

5. The high-precision large-size multi-layer chip loading tool as claimed in claim 2, characterized in that: An opening (15) is provided on the frame-shaped side wall (17).

6. The high-precision large-size multi-layer chip loading tool as claimed in claim 1, characterized in that: A plurality of the glue dispensing positioning sheets (6) are provided, and an opening of each glue dispensing positioning sheet (6) corresponds to a glue dispensing position.

7. The high-precision large-size multi-layer chip loading tool as claimed in claim 1, characterized in that: Substrate supports (14) are arranged around the substrate adsorption platform (11).

8. The high-precision large-size multi-stack chip loading tool as claimed in claim 1, characterized in that: Handles (61) are provided on both sides of the glue dispensing positioning sheet (6).

9. A high-precision large-size stacked chip mounting method, characterized in that: The high-precision large-size multi-stack chip mounting tooling according to any one of claims 1 to 8 comprises: S10: placing a substrate (4) in the base (1), and adsorbing the substrate (4) through the vacuum adsorption holes (12); S20: installing the glue dispensing positioning sheet (6) on the substrate (4), using a glue dispensing machine to dispense glue on the opening of the glue dispensing positioning sheet (6), and after the glue dispensing is completed, removing the glue dispensing positioning sheet (6); S30: installing the chip mounting and positioning frame (3) on the base (1), and placing the chip (5) on the substrate (4) from the placement opening (31) of the chip mounting and positioning frame (3) and along the limiting baffle (32) of the chip mounting and positioning frame (3); S40: using an oven to preliminarily cure the substrate (4) and the chip (5), with the curing temperature being 50-110° C. and the curing time being 30-60 min; S50: after the initial curing is completed, S20-S40 are repeated to perform multi-layer dispensing and multi-layer chip (5) mounting; S60: After the multi-layer chip (5) is mounted, a nitrogen oven is used to completely cure the substrate (4) and the multi-layer chip (5). The curing temperature is 150-200° C. and the curing time is 60-90 minutes.

10. The high-precision large-size stacked chip mounting method according to claim 9, characterized in that: Also includes: The base (1) is manufactured according to the size of the substrate (4), and the chip mounting positioning frame (3) is manufactured according to the size of the chip (5).

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