Wafer fixing platform for wafer ball mounting

Abstract

The invention provides a wafer fixing platform for wafer reballing. The wafer fixing platform at least comprises a Z-direction lifting and rotating mechanism; the Z-direction lifting and rotating mechanism comprises a first bottom plate, a plurality of first lifting mechanisms, a first mounting plate and a ball mounting steel wire mesh suction plate; the ball mounting steel wire mesh suction plate is detachably attached to the first mounting plate; the first lifting mechanism is configured to do reciprocating motion in the Z direction and drive the first mounting plate and the ball mounting steel wire mesh suction plate to do reciprocating motion in the Z direction; the Z-direction lifting and rotating mechanism further comprises a second bottom plate, a plurality of second lifting mechanisms, a second mounting plate and a wafer suction cup; the wafer suction cup is detachably attached to the second mounting plate, and a plurality of magnet blocks are arrayed between the wafer suction cup and the second mounting plate; the second lifting mechanism is configured to reciprocate in the Z direction and drive the second mounting plate and the wafer suction cup to reciprocate in the Z direction. According to the invention, during wafer ball mounting, the plurality of magnet blocks attract the steel mesh to the surface of the wafer, so that the wafer is smoothly attached to the steel mesh, and the precision of wafer ball mounting is improved.

Description

Technical Field

[0001] The invention relates to the technical field of wafer ball implantation, in particular to a wafer fixing platform used for wafer ball implantation. Background Art

[0002] Wafer ball implantation refers to implanting solder balls on the wafer surface through a steel mesh (template). For example, a steel mesh (template) is set on the wafer surface, and solder balls (such as tin balls, copper balls, etc.) are implanted into the wafer surface through the pores of the steel mesh (template).

[0003] When implanting wafers, the wafer and steel mesh (template) need to be fixed by a wafer fixing platform. The wafer fixing platform in the prior art is not compact and has a large volume. When replacing wafers of different sizes, the replacement process of equipment parts is complicated. Moreover, in the existing wafer fixing platform, when the wafer and the steel mesh (template) are attached during the wafer implantation process, the wafer is often uneven, which affects the accuracy of wafer implantation and reduces the product quality of the wafer after implantation. Summary of the invention

[0004] The present invention proposes a wafer fixing platform for wafer ball implantation to solve the technical problem in the prior art that the wafer fixing platform becomes uneven when the wafer is attached to a steel mesh (template) during wafer ball implantation, thereby affecting the accuracy of wafer ball implantation.

[0005] One aspect of the present invention is to provide a wafer fixing platform for wafer ball implantation, the wafer fixing platform at least comprising: a Z-axis lifting and rotating mechanism;

[0006] The Z-axis lifting and rotating mechanism includes a first bottom plate, a plurality of first lifting mechanisms, a first mounting plate and a ball planting wire mesh suction plate;

[0007] A plurality of the first lifting mechanisms are fixed on the first bottom plate, the first mounting plate is fixed on the tops of the plurality of the first lifting mechanisms, and the ball planting wire mesh suction plate is detachably attached to the first mounting plate;

[0008] The first lifting mechanism is configured to: reciprocate along the Z direction, driving the first mounting plate and the ball planting wire mesh suction plate to reciprocate along the Z direction;

[0009] The Z-axis lifting and rotating mechanism also includes a second base plate, a plurality of second lifting mechanisms, a second mounting plate and a wafer suction cup;

[0010] The second bottom plate is mounted on the first bottom plate, and the second bottom plate is configured to: rotate relative to the first bottom plate around the Z direction;

[0011] A plurality of the second lifting mechanisms are fixed on the second bottom plate, the second mounting plate is fixed on the top of the plurality of the second lifting mechanisms, the wafer suction cup is detachably attached to the second mounting plate, and a plurality of magnet blocks are arrayed between the wafer suction cup and the second mounting plate;

[0012] The second lifting mechanism is configured to: reciprocate along the Z direction, driving the second mounting plate and the wafer chuck to reciprocate along the Z direction;

[0013] The ball planting wire mesh suction plate is provided with a first opening, and the first mounting plate is provided with a second opening, so that the second mounting plate and the wafer suction cup pass through the first mounting plate and the ball planting wire mesh suction plate;

[0014] The Z-axis lifting and rotating mechanism further comprises: a plurality of suction nozzles and an energized demagnetizing electromagnet installed on the second bottom plate; the wafer suction cup is provided with suction nozzle holes for passing the plurality of suction nozzles;

[0015] The second mounting plate is provided with a third opening, so that the plurality of suction nozzles and the energized demagnetization type electromagnet pass through the second mounting plate.

[0016] In a preferred embodiment, the wafer fixing platform further includes an X-axis linear motor module and a Y-axis linear motor module;

[0017] The first bottom plate of the Z-direction lifting and rotating mechanism is connected to the Y-direction linear motor module, and the Y-direction linear motor module is connected to the X-direction linear motor module;

[0018] The Y-axis linear motor module is used to drive the Z-axis lifting and rotating mechanism to reciprocate along the Y-axis;

[0019] The X-axis linear motor module is used to drive the Y-axis linear motor module and the Z-axis lifting and rotating mechanism to reciprocate along the X-axis.

[0020] In a preferred embodiment, the first bottom plate and the second bottom plate are rotatably connected via a rotating disk;

[0021] A rotary drive motor is fixed on the first bottom plate, and the rotary drive motor is connected to the second bottom plate via a rotary connector;

[0022] The rotary drive motor is used to drive the rotary connector to drive the second base plate to rotate relative to the first base plate around the Z direction.

[0023] In a preferred embodiment, the first mounting plate is provided with a ball planting wire mesh suction plate air port for vacuuming the inside of the ball planting wire mesh suction plate;

[0024] The second mounting plate is provided with a wafer suction cup air port for evacuating the interior of the wafer suction cup.

[0025] In a preferred embodiment, a nozzle base is fixed on the second bottom plate, and a plurality of nozzles are mounted on the nozzle base;

[0026] An energized degaussing type electromagnet base is fixed on the nozzle base, and the energized degaussing type electromagnet is installed on the energized degaussing type electromagnet base.

[0027] In a preferred embodiment, a nozzle air port is provided on the nozzle base for vacuuming the interior of the nozzle.

[0028] In a preferred embodiment, a plurality of magnet grooves are arrayed on the lower surface of the wafer suction cup, and a plurality of magnet blocks are embedded in the plurality of magnet grooves, so that a plurality of magnet blocks are arrayed between the wafer suction cup and the second mounting plate.

[0029] In a preferred embodiment, the ball planting steel mesh suction plate and the first mounting plate are fixed by a plurality of buckles, so that the ball planting steel mesh suction plate and the first mounting plate can be detachably attached.

[0030] In a preferred embodiment, the first lifting mechanism comprises: a first cover shell, the first cover shell is fixed to the first bottom plate;

[0031] A first bearing is installed in the first housing, an outer ring of the first bearing is fixed to an inner wall of the first housing, and an inner ring of the first bearing is fixed to a first pulley;

[0032] A first screw nut is embedded and fixed in the first pulley, a first screw is installed in the first screw nut, a first connecting block is fixed on the top of the first screw, and the first connecting block is fixed to the first mounting plate;

[0033] When the first pulley rotates, the first pulley drives the first screw nut to rotate, and the first screw drives the first connecting block to reciprocate along the Z direction, thereby driving the first mounting plate and the ball planting wire mesh suction plate to reciprocate along the Z direction.

[0034] In a preferred embodiment, the second lifting mechanism comprises: a second cover shell, the second cover shell is fixed to the second bottom plate;

[0035] A second bearing is installed in the second housing, an outer ring of the second bearing is fixed to the inner wall of the second housing, and an inner ring of the second bearing is fixed to a second pulley;

[0036] A second screw nut is embedded and fixed in the second pulley, a second screw is installed in the second screw nut, a second connecting block is fixed on the top of the second screw, and the second connecting block is fixed to the second mounting plate;

[0037] When the second pulley rotates, the second pulley drives the second screw nut to rotate, and the second screw drives the second connecting block to reciprocate along the Z direction, thereby driving the second mounting plate and the wafer suction cup to reciprocate along the Z direction.

[0038] Compared with the prior art, the present invention has the following beneficial effects:

[0039] The present invention proposes a wafer fixing platform for wafer ball implantation, in which a plurality of magnet blocks are arrayed between a wafer suction cup and a second mounting plate. When wafer ball implantation is performed, the plurality of magnet blocks adsorb a steel mesh to the surface of the wafer so that the wafer is flatly attached to the steel mesh. The wafer suction cup is adsorbed by an energized demagnetizing electromagnet so that the wafer suction cup is flatter and more stable, thereby improving the accuracy of wafer ball implantation and the quality of the wafer after ball implantation.

[0040] The present invention proposes a wafer fixing platform for wafer ball implantation. When implanting balls on wafers of different sizes and replacing a wafer suction cup, it is only necessary to energize the energized demagnetizing electromagnet to eliminate the adsorption of the energized demagnetizing electromagnet on the wafer suction cup, and then the wafer suction cup can be replaced. The wafer suction cup is easy to replace, the steps are simplified, and the operation is convenient.

[0041] The present invention proposes a wafer fixing platform for wafer ball planting, in which a ball planting wire mesh suction plate is detachably attached to a first mounting plate by means of buckles. When replacing the ball planting wire mesh suction plate, the buckles need only be loosened to replace the ball planting wire mesh suction plate. The ball planting wire mesh suction plate is easy to replace, the steps are simplified, and the operation is convenient.

[0042] The present invention provides a wafer fixing platform for wafer ball implantation, which has a compact structure, can handle wafers of different sizes, and is simple and quick to operate; the entire platform can realize four-axis motion, has a high degree of freedom and high precision. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the specific implementation of the present invention or the technical solution in the prior art, the following briefly introduces the drawings required for use in the specific implementation or the prior art description. Obviously, the drawings described below are some implementations of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0044] Figure 1 The utility model is a schematic diagram of the overall structure of a wafer fixing platform used for wafer ball implantation of the present invention.

[0045] Figure 2 It is a structural schematic diagram of the Z-direction lifting and rotating mechanism of the present invention.

[0046] Figure 3 It is a side schematic diagram of the Z-direction lifting and rotating mechanism of the present invention.

[0047] Figure 4 It is a schematic diagram of the Z-axis lifting and rotating mechanism of the present invention, in which the ball planting wire mesh suction plate, the first mounting plate and the wafer suction cup are separated.

[0048] Figure 5 It is a top view of the Z-axis lifting and rotating mechanism of the present invention removing the ball planting wire mesh suction plate, the first mounting plate and the wafer suction cup.

[0049] Figure 6 It is a cross-sectional view of the first lifting mechanism of the present invention.

[0050] Figure 7 It is a top view of the wafer suction cup of the present invention.

[0051] Figure 8 It is a schematic diagram of a wafer suction cup of the present invention having a plurality of magnet slots arranged in an array on the lower surface thereof.

[0052] Fig. 9 It is a schematic diagram of the ball planting wire mesh suction plate, the first mounting plate, the wafer suction cup, and the second mounting plate of the Z-axis lifting and rotating mechanism of the present invention in a separated state.

[0053] Fig.10 It is a top view of the Z-axis lifting and rotating mechanism of the present invention removing the ball planting wire mesh suction plate, the first mounting plate, the wafer suction cup and the second mounting plate.

[0054] Fig.11 It is a cross-sectional view of the second lifting mechanism of the present invention.

[0055] Fig.12 It is a schematic diagram of the suction nozzle of the present invention sucking a wafer.

[0056] Fig.13 It is a schematic diagram of the wafer suction cup of the present invention adsorbing a wafer.

[0057] Fig.14 It is a schematic diagram of the ball planting wire mesh suction plate of the present invention adsorbing the steel mesh.

[0058] Fig.15 It is a schematic diagram of the bonding of the wafer and the steel mesh of the present invention.

[0059] Fig.16 It is a schematic diagram of the ball planting wire mesh suction plate, the first mounting plate, the wafer suction cup and the second mounting plate of the present invention descending until the upper surface of the wafer suction cup is flush with the suction nozzle.

[0060] Fig.17It is a schematic diagram of the ball planting wire mesh suction plate, the first mounting plate, the wafer suction cup and the second mounting plate descending and resetting after the wafer ball planting is completed in the present invention. DETAILED DESCRIPTION

[0061] In order to make the above and other features and advantages of the present invention more clear, the present invention is further described below in conjunction with the accompanying drawings. It should be understood that the specific embodiments given herein are for the purpose of explaining to those skilled in the art and are only exemplary and not restrictive.

[0062] Combination Figures 1 to 11 According to an embodiment of the present invention, a wafer fixing platform for wafer ball implantation is provided, comprising: an X-axis linear motor module 1, a Y-axis linear motor module 2 and a Z-axis lifting and rotating mechanism 3.

[0063] In order to make the present invention more clearly described, an XYZ rectangular coordinate system is established, where the direction of the X axis is the X direction, the direction of the Y axis is the Y direction, and the direction of the Z axis is the Z direction. Figure 1 shown.

[0064] The Z-direction lifting and rotating mechanism 3 is connected to the Y-direction linear motor module 2, and the Y-direction linear motor module 2 is connected to the X-direction linear motor module 1. The Y-direction linear motor module 2 is used to drive the Z-direction lifting and rotating mechanism 3 to reciprocate along the Y direction; the X-direction linear motor module 1 is used to drive the Y-direction linear motor module 2 and the Z-direction lifting and rotating mechanism 3 to reciprocate along the X direction.

[0065] Combination Figures 2 to 11 According to an embodiment of the present invention, the Z-axis lifting and rotating mechanism includes a first base plate 301, a plurality of first lifting mechanisms 312, a first mounting plate 303 and a ball planting wire mesh suction plate 302.

[0066] A plurality of first lifting mechanisms 312 are fixed on the first bottom plate 301 , a first mounting plate 303 is fixed on the top of the plurality of first lifting mechanisms 312 , and the ball planting wire mesh suction plate 302 and the first mounting plate 303 are detachably attached.

[0067] Further, the first bottom plate 301 of the Z-direction lifting and rotating mechanism 3 is connected to the Y-direction linear motor module 2. Specifically, the first bottom plate 301 is connected to the slider of the Y-direction linear motor module 2, so that the Y-direction linear motor module 2 drives the Z-direction lifting and rotating mechanism 3 to reciprocate in the Y direction. The Y-direction linear motor module 2 is connected to the slider of the X-direction linear motor module 1, so that the X-direction linear motor module 1 drives the Y-direction linear motor module 2 and the Z-direction lifting and rotating mechanism 3 to reciprocate in the X direction, as shown in FIG. Figure 1 shown.

[0068] Combination Figure 2 , Figure 3 and Figure 4Furthermore, the ball planting wire mesh suction plate 302 is fixed to the first mounting plate 303 by a plurality of buckles 3031, so that the ball planting wire mesh suction plate 302 and the first mounting plate 303 can be detachably attached. When the ball planting wire mesh suction plate 302 needs to be replaced, the buckles 3031 can be loosened to separate the ball planting wire mesh suction plate 302 from the first mounting plate 303, so as to replace the ball planting wire mesh suction plate 302.

[0069] In this embodiment, four buckles 3031 are provided. In other embodiments, the number of buckles 3031 is set according to specific needs, and the present invention does not make a specific limitation.

[0070] According to an embodiment of the present invention, the first lifting mechanism 312 is configured to reciprocate along the Z direction to drive the first mounting plate 303 and the ball planting wire mesh suction plate 302 to reciprocate along the Z direction.

[0071] like Figure 4 and Figure 5 As shown, in this embodiment, four first lifting mechanisms 312 are arranged at the four corners of the first bottom plate 301. The four first lifting mechanisms 312 reciprocate along the Z direction, driving the first mounting plate 303 and the ball planting wire mesh suction plate 302 to reciprocate along the Z direction.

[0072] Specifically, Figure 6 As shown, a first lifting mechanism 312 is taken as an example. The first lifting mechanism 312 comprises: a first housing 3126, which is fixed to the first bottom plate 301. A first bearing 3124 is installed in the first housing 3126, the outer ring of the first bearing 3124 is fixed to the inner wall of the first housing 3126, and the inner ring of the first bearing 3124 is fixed to the first pulley 3123.

[0073] The first pulley 3123 is embedded and fixed with the first screw nut 3122 , the first screw nut 3122 is installed in the first screw nut 3122 , the first connecting block 3121 is fixed on the top of the first screw 3127 , and the first connecting block 3121 is fixed to the first mounting plate 303 .

[0074] When the first pulley 3123 rotates, the first pulley 3123 drives the first screw nut 3122 to rotate, and the first screw 3127 drives the first connecting block 3121 to reciprocate along the Z direction, thereby driving the first mounting plate 303 and the ball planting wire mesh suction plate 302 to reciprocate along the Z direction.

[0075] In a preferred embodiment, a first bearing inner ring pressing plate 3125 is provided on the bottom surface of the first bearing 3124 to limit the movement of the inner ring of the first bearing 3124 in the Z direction.

[0076] In a further preferred embodiment, the first slider 31210 is fixed to the outer wall of the first cover shell 3126, the first slider 31210 is slidably connected to the first slide rail 3129, the first slide rail 3129 is fixed to the first slide rail seat 3128, and the top of the first slide rail seat 3128 is fixed to the first mounting plate 303.

[0077] When the first screw rod 3127 drives the first connecting block 3121 to reciprocate along the Z direction, and drives the first mounting plate 303 and the ball planting wire mesh suction plate 302 to reciprocate along the Z direction, the first slide rail 3129 slides relative to the first slider 31210, and the first slide rail 3129 and the first slide rail seat 3128 reciprocate along the Z direction.

[0078] Combination Figure 4 and Figure 5 In this embodiment, the first lifting motor 313 is fixed on the first bottom plate 301, and the output shaft of the first lifting motor 313 and the first pulleys 3123 of the four first lifting mechanisms 312 are connected in a circle through the first belt 314. When the first lifting motor 313 is working, the first belt 314 is driven to drive the first pulleys 3123 of the four first lifting mechanisms 312 to rotate, so that the first connecting blocks 3121 of the four first lifting mechanisms 312 simultaneously reciprocate along the Z direction, thereby driving the first mounting plate 303 and the ball planting wire mesh suction plate 302 to reciprocate along the Z direction.

[0079] Combination Figures 2 to 11 According to an embodiment of the present invention, the Z-axis lifting and rotating mechanism 3 further includes a second base plate 306 , a plurality of second lifting mechanisms 315 , a second mounting plate 305 and a wafer suction cup 304 .

[0080] The second base plate 306 is mounted on the first base plate 301 , and the second base plate 306 is configured to rotate relative to the first base plate 301 around the Z direction.

[0081] Specifically, combined Figure 2 , Figure 3 , Fig. 9 and Fig.10 The first bottom plate 301 and the second bottom plate 306 are connected to each other by a rotating disk 307. Figure 3 shown.

[0082] The first bottom plate 301 is fixed with a rotation drive motor 318, which is connected to the second bottom plate 306 via a rotation connection member 319. The rotation drive motor 318 is used to drive the rotation connection member 319 to drive the second bottom plate 306 to rotate relative to the first bottom plate 301 around the Z direction. Fig.10 As shown by arrow a.

[0083] Combination Fig. 9 and Fig.10According to an embodiment of the present invention, multiple second lifting mechanisms 315 are fixed on the second base plate 306, the second mounting plate 305 is fixed on the top of the multiple second lifting mechanisms 315, the wafer suction cup 304 and the second mounting plate 305 are detachably attached, and multiple magnet blocks 3041 are arrayed between the wafer suction cup 304 and the second mounting plate 305.

[0084] like Figure 8 As shown, a plurality of magnet grooves 3043 are arrayed on the lower surface of the wafer suction cup 304, and a plurality of magnet blocks 3041 are embedded in the plurality of magnet grooves 3043, so that a plurality of magnet blocks 3041 are arrayed between the wafer suction cup 304 and the second mounting plate 305, and the plurality of magnet blocks 3041 adsorb the wafer suction cup 304 and the second mounting plate 305.

[0085] According to an embodiment of the present invention, the second lifting mechanism 315 is configured to reciprocate along the Z direction, driving the second mounting plate 305 and the wafer chuck 304 to reciprocate along the Z direction.

[0086] like Fig. 9 and Fig.10 As shown, in this embodiment, four second lifting mechanisms 315 are arranged at the four corners of the second bottom plate 306. The four second lifting mechanisms 315 reciprocate along the Z direction, driving the second mounting plate 305 and the wafer chuck 304 to reciprocate along the Z direction.

[0087] In this embodiment, the second lifting mechanism 315 has the same structure as the first lifting mechanism 312. Fig.11 As shown, a second lifting mechanism 315 is taken as an example. The second lifting mechanism 315 comprises: a second housing 3156, and the second housing 3156 is fixed to the second bottom plate 306. A second bearing 3154 is installed in the second housing 3126, and the outer ring of the second bearing 3154 is fixed to the inner wall of the second housing 3156, and the inner ring of the second bearing 3154 is fixed to the second pulley 3153.

[0088] The second pulley 3153 is embedded and fixed with the second screw nut 3152 , the second screw nut 3152 is installed in the second screw nut 3152 , the second connecting block 3151 is fixed on the top of the second screw 3157 , and the second connecting block 3151 is fixed to the second mounting plate 305 .

[0089] When the second pulley 3153 rotates, the second pulley 3153 drives the second screw nut 3152 to rotate, and the second screw 3157 drives the second connecting block 3151 to reciprocate along the Z direction, thereby driving the second mounting plate 305 and the wafer suction cup 304 to reciprocate along the Z direction.

[0090] In a preferred embodiment, a second bearing inner ring pressing plate 3155 is provided on the bottom surface of the second bearing 3154 to limit the movement of the inner ring of the second bearing 3154 in the Z direction.

[0091] In a further preferred embodiment, the second slider 31510 is fixed to the outer wall of the second cover shell 3156, the second slider 31510 is slidably connected to the second slide rail 3159, the second slide rail 3159 is fixed to the second slide rail seat 3158, and the top of the second slide rail seat 3158 is fixed to the second mounting plate 305.

[0092] When the second screw rod 3157 drives the second connecting block 3151 to reciprocate along the Z direction and drives the second mounting plate 305 and the wafer suction cup 304 to reciprocate along the Z direction, the second slide rail 3159 slides relative to the second slider 31510, and the second slide rail 3159 and the second slide rail seat 3158 reciprocate along the Z direction.

[0093] Combination Fig. 9 and Fig.10 In this embodiment, the second lifting motor 316 is fixed on the second bottom plate 306, and the output shaft of the second lifting motor 316 and the second pulleys 3153 of the four second lifting mechanisms 315 are connected in a circular manner through the second belt 317. When the second lifting motor 316 is working, the second belt 317 is driven to drive the second pulleys 3153 of the four second lifting mechanisms 315 to rotate, so that the second connecting blocks 3151 of the four second lifting mechanisms 315 simultaneously reciprocate along the Z direction, thereby driving the second mounting plate 305 and the wafer chuck 304 to reciprocate along the Z direction.

[0094] like Fig. 9 As shown, according to an embodiment of the present invention, the ball-planting wire mesh suction plate 302 is provided with a first opening K1, and the first mounting plate 303 is provided with a second opening K2, so that the second mounting plate 305 and the wafer suction cup 304 pass through the first mounting plate 303 and the ball-planting wire mesh suction plate 302. That is, when the second mounting plate 305 and the wafer suction cup 304 reciprocate along the Z direction, the second mounting plate 305 and the wafer suction cup 304 shuttle between the first opening K1 and the second opening K2.

[0095] Combination Figure 2 , Figure 3 , Figure 4 , Figure 5 , Fig. 9 and Fig.10 According to an embodiment of the present invention, the Z-axis lifting and rotating mechanism 3 further includes: a plurality of suction nozzles 309 and an energized demagnetizing electromagnet 311 installed on the second base plate 305 .

[0096] Specifically, a nozzle base 308 is fixed on the second bottom plate 305, and a plurality of nozzles 309 are installed on the nozzle base 308. In this embodiment, three nozzles 309 are provided. In some embodiments, the number of nozzles is set according to specific needs, which is not specifically limited in the present invention.

[0097] The suction nozzle base 308 is fixed with an electromagnet base 310 , and the electromagnet 311 is mounted on the electromagnet base 310 .

[0098] like Figure 7 As shown, the wafer chuck 304 is provided with nozzle holes 3042 for passing through the plurality of nozzles 309. When the wafer chuck 304 reciprocates along the Z direction, the plurality of nozzles 309 shuttle through the plurality of nozzle holes 3042.

[0099] In this embodiment, three suction nozzle holes 3042 are provided. In some embodiments, the number of suction nozzle holes 3042 is set according to the number of suction nozzles 309 , that is, the number of suction nozzle holes 3042 is the same as the number of suction nozzles 309 .

[0100] like Fig. 9 and Fig.10 As shown, according to an embodiment of the present invention, the second mounting plate 305 is provided with a third opening K3 so that the plurality of suction nozzles 309 and the energized demagnetization type electromagnet 311 pass through the second mounting plate 305 .

[0101] When the second mounting plate 305 reciprocates along the Z direction, the plurality of suction nozzles 309 and the energized demagnetizing electromagnet 311 shuttle in the third opening K3.

[0102] In the present invention, when the second mounting plate 305 and the wafer suction cup 304 move downward along the Z direction to the initial position (the initial position refers to the initial position of the second mounting plate 305 and the wafer suction cup 304 before wafer ball implantation), the energized degaussing electromagnet 311 adsorbs the wafer suction cup 304. When wafers of different sizes are implanted and the wafer suction cup 304 is replaced, the energized degaussing electromagnet 311 only needs to be energized to eliminate the adsorption of the energized degaussing electromagnet 311 on the wafer suction cup 304, and the wafer suction cup 304 can be replaced.

[0103] According to an embodiment of the present invention, a ball planting wire mesh suction plate air port 3021 is installed on the first mounting plate 303 to evacuate the inside of the ball planting wire mesh suction plate 302. Specifically, the ball planting wire mesh suction plate air port 3021 is installed on the lower surface of the first mounting plate 303. Figure 2 and Fig. 9 In this embodiment, four ball-planting steel wire mesh suction plate air ports 3021 are installed at the positions of four buckles 3031 on the lower surface of the first mounting plate 303 .

[0104] The ball planting wire mesh suction plate 302 of the present invention is hollow inside, and has a plurality of suction holes on its upper surface for adsorbing the steel mesh. When the air port 3021 of the ball planting wire mesh suction plate is evacuated, the ball planting wire mesh suction plate 302 adsorbs the steel mesh through the suction holes on its upper surface.

[0105] According to an embodiment of the present invention, a wafer suction cup air inlet 3044 is installed on the second mounting plate 305 to evacuate the inside of the wafer suction cup 304. Specifically, the wafer suction cup air inlet 3044 is installed on the lower surface of the second mounting plate 305. Fig.10 In this embodiment, three wafer suction cup air ports 3044 are installed on the lower surface of the second mounting plate 305, as shown in FIG. Fig.10 shown.

[0106] The wafer suction cup 304 of the present invention is hollow inside, and has a plurality of suction holes on its upper surface for sucking the wafer. When the air port 3044 of the wafer suction cup is evacuated, the wafer suction cup 304 sucks the wafer through the suction holes on its upper surface.

[0107] According to an embodiment of the present invention, a nozzle air port 3091 is provided on the nozzle base 308 for vacuuming the interior of the nozzle 309. Figure 3 When the suction nozzle air port 3091 is evacuated, the suction nozzle 309 absorbs the wafer.

[0108] The working process of a wafer fixing platform for wafer ball implantation of the present invention is described in detail below.

[0109] Combination Figures 12 to 17 Before the wafer fixing platform for wafer ball implantation of the present invention is started, the second mounting plate 305 and the wafer suction cup 304 are located at the initial position, the wafer suction cup 304 is located in the first opening K1 of the ball implantation wire mesh suction plate 302, and the second mounting plate 305 is located in the second opening K2 of the first mounting plate 303. The energized demagnetizing electromagnet 311 passes through the third opening K3 of the second mounting plate 305 to absorb the wafer suction cup 304, and the suction nozzle 309 passes through the third opening K3 of the second mounting plate 305 and the suction nozzle hole 3042 of the wafer suction cup 304, and extends to the upper surface of the wafer suction cup 304, as shown in FIG. Figure 2 and Fig.12 shown.

[0110] The working process of a wafer fixing platform for wafer ball implantation of the present invention comprises the following steps:

[0111] Step S1 : The suction nozzle 309 sucks the wafer J.

[0112] The wafer docking gripper transports the wafer J to the top of the suction nozzle 309, and the suction nozzle 309 draws a vacuum through the suction nozzle air port 3091, and the suction nozzle 309 absorbs the wafer J. Fig.12 shown.

[0113] Step S2: The wafer J is sucked by the wafer suction cup 304 .

[0114] The degaussing electromagnet 311 is energized to eliminate the attraction of the degaussing electromagnet 311 to the wafer chuck 304 .

[0115] The second lifting motor 316 is started, driving the second lifting mechanism 315 to drive the second mounting plate 305 and the wafer suction cup 304 to move upward along Z until the upper surface of the wafer suction cup 304 is flush with the suction nozzle 309. The wafer suction cup 304 is evacuated through the wafer suction cup air port 3044, the suction nozzle 309 breaks the vacuum, and the wafer suction cup 304 absorbs the wafer J. Fig.13 shown.

[0116] The Y-axis linear motor module 2 and the X-axis linear motor module 1 drive the Z-axis lifting and rotating mechanism 3 to move to a station below the steel mesh G, such as Fig.13 shown.

[0117] In one embodiment, if the position of wafer J needs to be adjusted, the rotary drive motor 318 is started to drive the rotary connector 319 to drive the second base plate 306 to rotate relative to the first base plate 301 in the Z direction, so that the second lifting mechanism 315, the nozzle base 308, the energized demagnetizing electromagnet 311, the nozzle 309, the second mounting plate 305 and the wafer suction cup 304 on the second base plate 306 rotate as a whole in the Z direction, thereby adjusting the position of the wafer J adsorbed by the wafer suction cup 304.

[0118] Step S3: The ball-planting wire mesh suction plate 302 adsorbs the steel mesh G.

[0119] The first lifting motor 313 is started, driving the first lifting mechanism 312 to drive the first mounting plate 303 and the ball planting wire mesh suction plate 302 to move upward along Z until the upper surface of the ball planting wire mesh suction plate 302 is in contact with the lower surface of the steel mesh G. The ball planting wire mesh suction plate 302 is vacuumed through the ball planting wire mesh suction plate air port 3021, and the ball planting wire mesh suction plate 302 absorbs the steel mesh G. Fig.14 shown.

[0120] Step S4: The wafer J is bonded to the steel mesh G, and the wafer J is ball-planted.

[0121] The second lifting motor 316 is started, driving the second lifting mechanism 315 to drive the second mounting plate 305 and the wafer suction cup 304 to move upward along the Z direction. The upper surface of the wafer J sucked by the wafer suction cup 304 is attached to the lower surface of the steel mesh G. Fig.15 At this time, the plurality of magnet blocks 3041 between the wafer suction cup 304 and the second mounting plate 305 adsorb the steel mesh G, so that the wafer J fits the steel mesh G more evenly.

[0122] After the upper surface of wafer J is bonded to the lower surface of steel mesh G, solder balls (such as tin balls, copper balls, etc.) are implanted into the upper surface of wafer J through the pores of steel mesh G, and a ball implantation process is performed on wafer J in one station.

[0123] Step S5, ball planting at the next station.

[0124] The ball planting wire mesh suction plate 302 breaks the vacuum, and the first lifting motor 313 is started, driving the first lifting mechanism 312 to drive the first mounting plate 303 and the ball planting wire mesh suction plate 302 to move downward along the Z direction; at the same time, the second lifting motor 316 is started, driving the second lifting mechanism 315 to drive the second mounting plate 305 and the wafer suction cup 304 to move downward along the Z direction until the upper surface of the wafer suction cup 304 is flush with the suction nozzle 309, as shown in FIG. Fig.16 shown.

[0125] Afterwards, the Y-axis linear motor module 2 and the X-axis linear motor module 1 drive the Z-axis lifting and rotating mechanism 3 to move to the next workstation below the steel mesh G.

[0126] The first lifting motor 313 is started, driving the first lifting mechanism 312 to drive the first mounting plate 303 and the ball planting wire mesh suction plate 302 to move upward along Z; at the same time, the second lifting motor 316 is started, driving the second lifting mechanism 315 to drive the second mounting plate 305 and the wafer suction cup 304 to move upward along Z until the upper surface of the wafer J adsorbed by the wafer suction cup 304 is in contact with the lower surface of the steel mesh G.

[0127] The ball planting wire mesh suction plate 302 is vacuumed through the ball planting wire mesh suction plate air port 3021, and the ball planting wire mesh suction plate 302 absorbs the steel mesh G. At this time, the wafer suction cup 304 and the ball planting wire mesh suction plate 302 return to Fig.15 In the working state shown, the plurality of magnet blocks 3041 between the wafer suction cup 304 and the second mounting plate 305 adsorb the steel mesh G, so that the wafer J fits the steel mesh G more evenly.

[0128] After the upper surface of wafer J is bonded to the lower surface of steel mesh G, solder balls (such as tin balls, copper balls, etc.) are implanted into the upper surface of wafer J through the pores of steel mesh G, and a ball implantation process is performed on wafer J in one station.

[0129] Repeat step S5 until wafer ball implantation is completed for all workstations.

[0130] Step S6: Reset.

[0131] When the last station completes wafer implantation, the implantation wire mesh suction plate 302 breaks the vacuum, and the first lifting motor 313 starts, driving the first lifting mechanism 312 to drive the first mounting plate 303 and the implantation wire mesh suction plate 302 to move downward along Z to the initial position.

[0132] At the same time, the second lifting motor 316 starts, driving the second lifting mechanism 315 to drive the second mounting plate 305 and the wafer suction cup 304 to move downward along Z until the upper surface of the wafer suction cup 304 is flush with the suction nozzle 309, the wafer suction cup 304 breaks the vacuum, the suction nozzle 309 draws vacuum through the suction nozzle air port 3091, and the suction nozzle 309 absorbs the wafer J.

[0133] Afterwards, the second lifting motor 316 continues to drive the second lifting mechanism 315 to drive the second mounting plate 305 and the wafer suction cup 304 to move downward along Z to the initial position, the degaussing electromagnet 311 is powered off, and the degaussing electromagnet 311 adsorbs the wafer suction cup 304.

[0134] Finally, after the wafer J is placed in place by the wafer docking gripper, the suction nozzle 309 breaks the vacuum, and the wafer docking gripper grabs away the wafer J after ball implantation.

[0135] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. A wafer fixing platform for wafer ball implantation, It is characterized in that The wafer fixing platform at least includes: a Z-axis lifting and rotating mechanism; The Z-axis lifting and rotating mechanism includes a first bottom plate, a plurality of first lifting mechanisms, a first mounting plate and a ball planting wire mesh suction plate; A plurality of the first lifting mechanisms are fixed on the first bottom plate, the first mounting plate is fixed on the tops of the plurality of the first lifting mechanisms, and the ball planting wire mesh suction plate is detachably attached to the first mounting plate; The first lifting mechanism is configured to: reciprocate along the Z direction, driving the first mounting plate and the ball planting wire mesh suction plate to reciprocate along the Z direction; The Z-axis lifting and rotating mechanism also includes a second base plate, a plurality of second lifting mechanisms, a second mounting plate and a wafer suction cup; The second bottom plate is mounted on the first bottom plate, and the second bottom plate is configured to: rotate relative to the first bottom plate around the Z direction; A plurality of the second lifting mechanisms are fixed on the second bottom plate, the second mounting plate is fixed on the top of the plurality of the second lifting mechanisms, the wafer suction cup is detachably attached to the second mounting plate, and a plurality of magnet blocks are arrayed between the wafer suction cup and the second mounting plate; The second lifting mechanism is configured to: reciprocate along the Z direction, driving the second mounting plate and the wafer chuck to reciprocate along the Z direction; The ball planting wire mesh suction plate is provided with a first opening, and the first mounting plate is provided with a second opening, so that the second mounting plate and the wafer suction cup pass through the first mounting plate and the ball planting wire mesh suction plate; The Z-axis lifting and rotating mechanism further comprises: a plurality of suction nozzles and an energized demagnetizing electromagnet installed on the second bottom plate; the wafer suction cup is provided with suction nozzle holes for passing the plurality of suction nozzles; The second mounting plate is provided with a third opening, so that the plurality of suction nozzles and the energized demagnetization type electromagnet pass through the second mounting plate.

2. The wafer fixing platform according to claim 1, It is characterized in that The wafer fixing platform also includes an X-axis linear motor module and a Y-axis linear motor module; The first bottom plate of the Z-direction lifting and rotating mechanism is connected to the Y-direction linear motor module, and the Y-direction linear motor module is connected to the X-direction linear motor module; The Y-axis linear motor module is used to drive the Z-axis lifting and rotating mechanism to reciprocate along the Y-axis; The X-axis linear motor module is used to drive the Y-axis linear motor module and the Z-axis lifting and rotating mechanism to reciprocate along the X-axis.

3. The wafer fixing platform according to claim 1, It is characterized in that The first bottom plate and the second bottom plate are rotatably connected via a rotating disk; A rotary drive motor is fixed on the first bottom plate, and the rotary drive motor is connected to the second bottom plate via a rotary connector; The rotary drive motor is used to drive the rotary connector to drive the second base plate to rotate relative to the first base plate around the Z direction.

4. The wafer fixing platform according to claim 1, It is characterized in that The first mounting plate is provided with a ball planting steel mesh suction plate air port for vacuuming the inside of the ball planting steel mesh suction plate; The second mounting plate is provided with a wafer suction cup air port for evacuating the interior of the wafer suction cup.

5. The wafer fixing platform according to claim 1, It is characterized in that A nozzle base is fixed on the second bottom plate, and a plurality of nozzles are mounted on the nozzle base; An energized degaussing type electromagnet base is fixed on the nozzle base, and the energized degaussing type electromagnet is installed on the energized degaussing type electromagnet base.

6. The wafer fixing platform according to claim 5, It is characterized in that A nozzle air port is arranged on the nozzle base for vacuuming the inside of the nozzle.

7. The wafer fixing platform according to claim 1, It is characterized in that A plurality of magnet grooves are arranged in an array on the lower surface of the wafer suction cup, and a plurality of magnet blocks are embedded in the plurality of magnet grooves, so that a plurality of magnet blocks are arranged in an array between the wafer suction cup and the second mounting plate.

8. The wafer fixing platform according to claim 1, It is characterized in that The ball planting wire mesh suction plate is fixed to the first mounting plate via a plurality of buckles, so that the ball planting wire mesh suction plate and the first mounting plate can be detachably attached.

9. The wafer fixing platform according to claim 1, It is characterized in that The first lifting mechanism comprises: a first cover shell, the first cover shell is fixed to the first bottom plate; A first bearing is installed in the first housing, an outer ring of the first bearing is fixed to an inner wall of the first housing, and an inner ring of the first bearing is fixed to a first pulley; A first screw nut is embedded and fixed in the first pulley, a first screw is installed in the first screw nut, a first connecting block is fixed on the top of the first screw, and the first connecting block is fixed to the first mounting plate; When the first pulley rotates, the first pulley drives the first screw nut to rotate, and the first screw drives the first connecting block to reciprocate along the Z direction, thereby driving the first mounting plate and the ball planting wire mesh suction plate to reciprocate along the Z direction.

10. The wafer fixing platform according to claim 1, It is characterized in that The second lifting mechanism comprises: a second cover shell, the second cover shell is fixed to the second bottom plate; A second bearing is installed in the second housing, an outer ring of the second bearing is fixed to the inner wall of the second housing, and an inner ring of the second bearing is fixed to a second pulley; A second screw nut is embedded and fixed in the second pulley, a second screw is installed in the second screw nut, a second connecting block is fixed on the top of the second screw, and the second connecting block is fixed to the second mounting plate; When the second pulley rotates, the second pulley drives the second screw nut to rotate, and the second screw drives the second connecting block to reciprocate along the Z direction, thereby driving the second mounting plate and the wafer suction cup to reciprocate along the Z direction.

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