Electronic equipment and chip heat dissipation device

Abstract

The embodiment of the invention provides electronic equipment and a chip heat dissipation device, and belongs to the technical field of chip heat dissipation. The chip heat dissipation device comprises at least one supporting assembly, a temperature equalizing assembly and a heat dissipation device, and the supporting assembly is used for being arranged on a circuit board and located on the side of a chip on the circuit board; the temperature equalizing assembly is used for covering the chip and is connected with the circuit board, and the supporting assembly is located below the temperature equalizing assembly so as to support the temperature equalizing assembly; and the radiator covers the temperature equalizing assembly and is used for being connected with the circuit board. According to the electronic equipment and the chip heat dissipation device, the problem that the chip is prone to damage due to the fact that a heat dissipation device impacts the chip is solved.

Description

Technical Field

[0001] The present application relates to the technical field of chip heat dissipation, and in particular to an electronic device and a chip heat dissipation device. Background Art

[0002] The chip will generate heat during use, and the chip needs to be cooled to reduce the impact of excessive chip temperature on the overall performance of the chip.

[0003] In the related art, a heat sink is installed on the chip to help the chip dissipate heat. As the power consumption of the chip continues to increase, the size of the heat sink will also increase accordingly.

[0004] In the case of large vibration and impact (such as during transportation and loading), the heat sink will impact the chip, which may easily cause damage to the chip. Summary of the invention

[0005] The present application provides an electronic device and a chip heat dissipation device, which are used to reduce the pressure exerted by the heat sink on the chip and improve the protection effect on the chip.

[0006] In one aspect, the present application provides a chip heat dissipation device, comprising:

[0007] At least one supporting component, the supporting component is used to be arranged on the circuit board and is located on the side of the chip on the circuit board;

[0008] A temperature balancing component, the temperature balancing component is used to cover the chip and is connected to the circuit board, and the support component is located below the temperature balancing component to support the temperature balancing component;

[0009] A radiator is covered on the temperature balancing component and is used to be connected to the circuit board.

[0010] In a possible implementation, the support assembly includes a support member and a connecting member disposed on the support member, the support member is used to be connected to the circuit board, and the connecting member connects the temperature equalizing assembly and the support member.

[0011] In a possible implementation, the connecting member is a metal member, and the metal member is configured to be heated and melted to connect the temperature equalizing component and the supporting member.

[0012] In a possible implementation manner, the number of the supporting components is at least two, and each of the supporting components is used to be respectively arranged on two opposite sides of the chip.

[0013] In a possible implementation, the temperature uniformity component includes a temperature uniformity plate, and the temperature uniformity plate is connected to the support component.

[0014] In a possible implementation manner, the temperature homogenizing plate is connected to the heat sink.

[0015] In a possible implementation, the temperature balancing assembly further includes a heat conducting plate, wherein the heat conducting plate is disposed on the temperature balancing plate, and the heat conducting plate is located between the temperature balancing plate and the heat sink;

[0016] Alternatively, the heat conducting plate is disposed on the chip, and the heat conducting plate is located between the temperature averaging plate and the chip.

[0017] In a possible implementation manner, at least two first connection components are further included, wherein the first connection component includes a first connection member and a first elastic member, and the first connection member is used to connect the heat sink, the temperature balancing component and the circuit board;

[0018] The first connecting member has a first supporting portion on the end portion facing the temperature-averaging component. The first elastic member is sleeved on the first connecting member and abuts between the first supporting portion and the temperature-averaging component.

[0019] In a possible implementation manner, at least two second connection components are further included, wherein the second connection components include a second connection member and a second elastic member, and the second connection member is used to connect the heat sink and the circuit board;

[0020] The second connecting member has a second supporting portion on the end portion facing the radiator. The second elastic member is sleeved on the second connecting member and abuts between the second supporting portion and the radiator.

[0021] On the other hand, the present application provides an electronic device, including a circuit board and any one of the chip heat dissipation devices in the above-mentioned embodiments arranged on the circuit board.

[0022] The present application provides an electronic device and a chip heat dissipation device, which are provided with a support component, a temperature equalizing component and a heat sink on a circuit board. The temperature equalizing component is used to cover the chip and is connected to the circuit board. The support component is located below the temperature equalizing component to support the temperature equalizing component.

[0023] The temperature-averaging component covers the chip, so that the heat emitted by the chip is transferred to the temperature-averaging component, and then the heat is transferred to the radiator through the temperature-averaging component, thereby achieving chip heat dissipation. When the radiator shakes, the impact force generated by the radiator acts on the temperature-averaging component, and the temperature-averaging component then transfers the impact force to the circuit board through the supporting component.

[0024] Thereby, the problem that the heat sink may impact the chip in the case of large vibration and impact (such as during transportation and loading), thereby easily causing damage to the chip is solved. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0026] Figure 1 Schematic diagram of the chip heat dissipation device structure provided in the embodiment of the present application Figure 1 ;

[0027] Figure 2 Schematic diagram of the chip heat dissipation device structure provided in the embodiment of the present application Figure 2 ;

[0028] Figure 3 for Figure 2 Schematic diagram of the enlarged structure at point A in the middle.

[0029] Description of reference numerals:

[0030] 1. Circuit board; 2. Chip;

[0031] 100. Support assembly; 110. Support member; 120. Connecting member;

[0032] 200, temperature balancing component; 210, temperature balancing board; 220, heat conducting board;

[0033] 300, radiator;

[0034] 400, first connecting assembly; 410, first connecting member; 420, first elastic member;

[0035] 500, second connecting assembly; 510, second connecting member; 520, second elastic member.

[0036] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0037] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0038] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of this application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present application described herein can, for example, be implemented in an order other than those illustrated or described herein.

[0039] In the embodiments of the present application, the words "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0040] During the use of chip 2, a large amount of heat energy will be generated due to loss. Once the temperature of chip 2 is too high, the working speed of the transistor inside chip 2 will be slowed down, thereby affecting the overall performance of chip 2. At present, a heat sink 300 is usually installed on chip 2 to cool down chip 2. The weight of heat sink 300 is proportional to the power consumption of chip 2. The higher the power consumption of chip 2, the larger the volume of heat sink 300. During use, heat sink 300 needs to fit with chip 2 to dissipate heat from chip 2. However, chip 2 generally cannot withstand greater pressure, so the installation between heat sink 300 and chip 2 is not particularly tight, resulting in shaking of heat sink 300 during transportation, which can easily squeeze chip 2 and damage chip 2.

[0041] Based on this, the present application provides an electronic device and a heat dissipation device for a chip 2, by arranging a support component 100, a temperature-averaging component 200 and a radiator 300 on a circuit board 1, the temperature-averaging component 200 is used to cover the chip 2 and is connected to the circuit board 1, and the support component 100 is located below the temperature-averaging component 200 to support the temperature-averaging component 200. During use, the temperature-averaging component 200 covers the chip 2, so that the heat emitted by the chip 2 is transferred to the temperature-averaging component 200, and then the heat is transferred to the radiator 300 through the temperature-averaging component 200, thereby achieving heat dissipation of the chip 2. When the radiator 300 shakes, the impact force generated by the radiator 300 acts on the temperature-averaging component 200, and the temperature-averaging component 200 then transfers the impact force to the circuit board 1 through the support component 100. Thus, the problem that the radiator 300 will impact the chip 2 in the case of large vibration and impact (such as transportation and loading process) is solved, which easily causes damage to the chip 2.

[0042] The technical solution of the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments.

[0043] Reference Figure 1 The present application embodiment provides a chip heat dissipation device, comprising:

[0044] At least one supporting component 100 is used to be arranged on the circuit board 1 and is located on the side of the chip 2 on the circuit board 1 .

[0045] The temperature balancing component 200 is used to cover the chip 2 and is connected to the circuit board 1 . The support component 100 is located below the temperature balancing component 200 to support the temperature balancing component 200 .

[0046] The heat sink 300 is covered on the temperature-balancing component 200 , and the heat sink 300 is used to be connected to the circuit board 1 .

[0047] A plurality of support components 100 are arranged on the side of the chip 2 to support the temperature balancing component 200. The temperature balancing component 200 covers the chip 2 to transfer the heat energy emitted by the chip 2. The heat sink 300 covers the temperature balancing component 200 so that the heat energy on the temperature balancing component 200 is transferred to the heat sink 300 for heat dissipation. Since the heat sink 300 is arranged on the temperature balancing component 200, the impact force generated when the heat sink 300 shakes acts on the temperature balancing component 200 and is transferred to the circuit board 1 through the support component 100, thereby preventing the heat sink 300 from impacting the chip 2 due to shaking and causing damage to the chip 2.

[0048] Reference Figure 1 In some embodiments, the support assembly 100 includes a support member 110 and a connector 120 disposed on the support member 110 , the support member 110 is used to connect to the circuit board 1 , and the connector 120 connects the temperature equalizing assembly 200 and the support member 110 .

[0049] The connector 120 can connect the support member 110 and the temperature equalizing component 200 , and the support member 110 is fixed on the circuit board 1 , so that the temperature equalizing component 200 is not easy to move relative to the support member 110 , thereby enhancing the supporting effect of the support member 110 on the temperature equalizing component 200 .

[0050] In some embodiments, the connecting member 120 is a metal member, and the metal member is configured to be heated and melted to connect the temperature balancing assembly 200 and the supporting member 110 .

[0051] Specifically, the metal parts can be metals with low melting points such as tin, indium, and bismuth. After the metal is heated and melted, it is closely connected with the temperature equalizing component 200 and the support 110. After the liquefied metal cools and solidifies, the temperature equalizing component 200 and the support 110 are welded into one body, and the metal hot melt connection method is adopted. After the metal connection point after hot melt connection is properly cooled, it can reach or even exceed the tensile stress of the original metal material, ensuring the strength and stability of the connection. This high-strength connection makes it difficult for metal pipes or structures to break when subjected to external forces such as pressure and tension. At the same time, compared with traditional connection methods, hot melt connection does not have obvious weaknesses at the connection, thereby improving the strength and reliability of the overall structure.

[0052] In some embodiments, there are at least two support assemblies 100, and each support assembly 100 is used to be respectively arranged on two opposite sides of the chip 2. The support assembly 100 provides support force for the temperature balancing assembly 200. The more the support assemblies 100 are, the stronger the bearing force of the temperature balancing assembly 200 is. The support assemblies 100 are arranged on both sides of the chip 2 so that the force of the temperature balancing assembly 200 is more uniform.

[0053] Reference Figure 1 In some embodiments, the temperature uniformity component 200 includes a temperature uniformity plate 210 , and the temperature uniformity plate 210 is connected to the support component 100 .

[0054] The temperature plate 210 is a highly efficient heat conducting element that can quickly convert high heat points into low heat flux surfaces, so that the heat energy on the chip 2 is quickly transferred to the surface of the temperature plate 210, thereby enhancing the heat dissipation effect on the chip 2.

[0055] Reference Figure 1 In some embodiments, the temperature vapor chamber 210 is connected to the heat sink 300 .

[0056] The temperature equalizing plate 210 is connected to the heat sink 300, so that the heat energy on the temperature equalizing plate 210 can be quickly transferred to the heat sink 300. At the same time, the heat sink 300 is installed on the temperature equalizing plate 210. The force generated by the shaking of the heat sink 300 directly impacts the temperature equalizing plate 210, and then is transmitted to the circuit board 1 through the support assembly 100, thereby reducing the damage to the chip 2 caused by the impact of the heat sink 300 on the chip 2 due to shaking.

[0057] Reference Figure 1 and Figure 2 In some embodiments, the temperature balancing assembly 200 further includes a heat conducting plate 220, which is disposed on the temperature balancing plate 210, and the heat conducting plate 220 is located between the temperature balancing plate 210 and the heat sink 300;

[0058] Alternatively, the heat conducting plate 220 is disposed on the chip 2 , and the heat conducting plate 220 is located between the temperature balancing plate 210 and the chip 2 .

[0059] In this embodiment, the heat conducting plate 220 is an object that can be deformed and transfer heat. The reason why the heat conducting plate 220 is arranged between the temperature averaging plate 210 and the radiator 300 is that the radiator 300 will impact the heat conducting plate 220 due to shaking, thereby compressing the heat conducting plate 220, causing the heat conducting plate 220 to deform and fill the gap between the radiator 300 and the temperature averaging plate 210, so that the heat energy can be fully transferred to the temperature averaging plate 210 through the heat conducting plate 220, thereby improving the heat transfer efficiency between the temperature averaging plate 210 and the radiator 300.

[0060] The heat conducting plate 220 is arranged between the temperature averaging plate 210 and the chip 2. When the metal part melts, the force of the temperature averaging plate 210 is concentrated on the heat conducting plate 220, so that the temperature averaging plate 210 moves toward the heat conducting plate 220, and the heat conducting plate 220 is squeezed. The heat conducting plate 220 is deformed to fill the gap between the temperature averaging plate 210 and the chip 2, thereby improving the efficiency of heat transfer between the chip 2 and the heat conducting plate 220. At the same time, since the heat conducting plate 220 can be deformed, when the temperature averaging plate 210 applies pressure to the heat conducting plate 220, the elastic deformation of the heat conducting plate 220 can absorb kinetic energy, reduce the impact of the temperature averaging plate 210 on the chip 2, and thus protect the chip 2.

[0061] Reference Figure 2 and Figure 3 In some embodiments, at least two first connection components 400 are further included. The first connection component 400 includes a first connection member 410 and a first elastic member 420. The first connection member 410 is used to connect the heat sink 300, the temperature balancing component 200 and the circuit board 1;

[0062] The first connecting member 410 has a first supporting portion on the end portion facing the temperature-averaging component 200 . The first elastic member 420 is sleeved on the first connecting member 410 and abuts between the first supporting portion and the temperature-averaging component 200 .

[0063] Specifically, in this embodiment, the first connecting member 410 is a bolt, and in other embodiments, the first connecting member 410 may be a nail or a screw, etc., and the first elastic member 420 may be an elastic object such as a spring or rubber.

[0064] When installing the first connecting component 400, first put the first elastic member 420 on the first connecting member 410, then pass the end of the first connecting member 410 away from the first supporting portion through the heat sink 300 and fix it on the circuit board 1, the first elastic member 420 slides on the first connecting member 410 to the temperature equalizing plate, and when the first connecting member 410 is screwed, the first supporting portion gradually approaches the heat sink 300, and the first supporting portion gradually approaches the first elastic member 420 and presses against the first elastic member 420, and the first supporting The first support portion applies pressure to the first elastic member 420, and the first elastic member 420 is compressed between the first support portion and the radiator 300. The elastic force of the first elastic member 420 on the radiator 300 causes the radiator 300 to move toward the temperature averaging plate 210, thereby squeezing the temperature averaging plate 210. The temperature averaging plate 210 applies the squeezing force to the heat conducting plate 220 and the metal parts, thereby completing the pre-tightening force on the heat conducting plate 220 and the metal parts, so that the radiator 300 and the temperature averaging plate 210 fit more closely.

[0065] The distance between the heat sink 300 and the temperature averaging plate 210 is reduced, which facilitates the heat energy on the temperature averaging plate 210 to be transferred to the heat sink 300 through the heat conducting plate 220. The first connecting component 400 is mainly used to fix the heat sink 300, improve the fit between the heat sink 300 and the temperature averaging plate 210, and improve the efficiency of heat transfer between the temperature averaging plate 210 and the heat sink 300. At the same time, the first connecting component 400 can also generate pressure on the temperature averaging plate 210, reduce the distance between the temperature averaging plate 210 and the chip 2, and improve the thermal conductivity between the chip 2 and the temperature averaging plate 210.

[0066] Reference Figure 2 In some embodiments, at least two second connection components 500 are further included. The second connection components 500 include a second connection member 510 and a second elastic member 520. The second connection member 510 is used to connect the heat sink 300 and the circuit board 1.

[0067] The second connecting member 510 has a second supporting portion on the end portion facing the heat sink 300 . The second elastic member 520 is sleeved on the second connecting member 510 and abuts between the second supporting portion and the heat sink 300 .

[0068] Specifically, the second connecting component 500 has the same structure as the first connecting component 400. When installing the second connecting component 500, the second elastic member 520 is firstly sleeved on the second connecting member 510, and then one end of the second connecting member 510 is passed through the temperature averaging plate 210 and fixed on the circuit board 1. When the second connecting member 510 is screwed, the second supporting portion moves toward the temperature averaging plate 210, and one end of the second elastic member 520 is pressed against the temperature averaging plate 210, while the other end of the second elastic member 520 is pressed against the second supporting portion. The second supporting portion applies pressure to the second elastic member 520, so that the second elastic member 520 is compressed between the second supporting portion and the temperature averaging plate 210. The temperature averaging plate 210 is moved toward the chip 2 by the reaction force of the second elastic member 520, so that the temperature averaging plate 210 applies a pre-tightening force to the metal part and the heat conducting plate 220, and the temperature averaging plate 210 is pressed against the metal part and the heat conducting plate 220. The second connecting component 500 is mainly used to fix the temperature equalizing plate 210 and reduce the distance between the temperature equalizing plate 210 and the chip 2 as much as possible, so that the heat conducting plate 220 can fill the gap between the temperature equalizing plate 210 and the chip 2. The efficiency of heat energy being transferred to the temperature equalizing plate 210 through the heat conducting plate 220 is faster than that of air transmission, thereby improving the heat dissipation effect of the chip 2 and protecting the chip 2.

[0069] Reference Figure 2 In one embodiment, the support member 110 is fixed to the circuit board 1 on both sides of the chip 2, and the metal member is placed on the top of the support member 110, and a layer of heat conducting plate 220 is placed on the chip 2, and then the temperature averaging plate 210 is simultaneously covered on the metal member and the heat conducting plate 220, and the second connecting component 500 is installed on the temperature averaging plate 210, and the second elastic member 520 is first sleeved on the second connecting member 510, and then one end of the second connecting member 510 is passed through the temperature averaging plate 210 and fixed to the circuit board 1.

[0070] When the second support portion is close to the temperature equalizing plate 210, the second support portion applies pressure to the second elastic member 520, so that the second elastic member 520 is compressed between the second support portion and the temperature equalizing plate 210. The temperature equalizing plate 210 moves toward the chip 2 under the reaction force of the second elastic member 520, so that the temperature equalizing plate 210 applies a pre-tightening force to the metal part and the heat conducting plate 220, so that the temperature equalizing plate 210 is pressed on the metal part and the heat conducting plate 220.

[0071] The metal part is heated until it melts from a solid state into a liquid state. After the metal part is liquefied, the force exerted on it by the second elastic part 520 is small, and most of the pre-tightening force of the second elastic part 520 is concentrated on the heat conducting plate 220, thereby further compressing the heat conducting plate 220, and the distance between the temperature balancing plate 210 and the chip 2 is reduced. The heat conducting plate 220 fills the gap between the temperature balancing plate 210 and the chip 2, thereby improving the heat energy transfer efficiency between the chip 2 and the temperature balancing plate 210.

[0072] When the heat conducting plate 220 is no longer compressed, the metal piece is cooled so that the metal piece, the support block and the temperature balancing plate 210 are solidified into one body. At this time, the force of the temperature balancing plate 210 is mainly concentrated on the support piece 110 . Another heat conducting plate 220 is installed on the temperature averaging plate 210, and the heat sink 300 is covered on the heat conducting plate 220, and the first connecting component 400 is installed, and the first elastic member 420 is sleeved on the first connecting member 410, and then one end of the first connecting member 410 passes through the heat sink 300 and is fixed on the circuit board 1. When the first supporting portion is close to the heat sink 300, the first elastic member 420 is compressed between the first supporting portion and the heat sink 300, and the elastic force of the first elastic member 420 on the heat sink 300 causes the heat sink 300 to compress the heat conducting plate 220, and the heat conducting plate 220 is deformed to fill the gap between the heat sink 300 and the temperature averaging plate 210, and the distance between the heat sink 300 and the temperature averaging plate 210 is reduced, so that the heat energy on the temperature averaging plate 210 is transferred to the heat sink 300 through the heat conducting plate 220.

[0073] At the same time, the impact force generated by the shaking of the heat sink 300 is concentrated on the temperature equalizing plate 210, and the main supporting point of the temperature equalizing plate 210 is on the supporting member 110, so that the compression of the temperature equalizing plate 210 is transmitted to the circuit board 1 through the supporting member 110, thereby reducing the direct impact of the heat sink 300 on the chip 2, causing damage to the chip 2.

[0074] Reference Figure 1 In another embodiment, the support member 110 is first fixed to the circuit board 1 on both sides of the chip 2, and the metal member is placed on the top of the support member 110, a heat conducting plate 220 is covered on the chip 2, and then the temperature balancing plate 210 is covered on the heat conducting plate 220 and the metal member at the same time, and finally the heat sink 300 is placed on the temperature balancing plate 210, and the first connecting component 400 is installed to fix the heat sink 300. The first elastic member 420 is sleeved on the first connecting member 410, and then the end of the first connecting member 410 away from the first supporting portion passes through the heat sink 300 and is fixed on the circuit board 1. When the first connecting member 410 is fixed on the circuit board 1, the first supporting portion moves toward the heat sink 300, so that the first supporting portion squeezes the first elastic member 420, causing the first elastic member 420 to undergo elastic deformation, and the elastic force of the first elastic member 420 acts on the heat sink 300, causing the heat sink 300 to squeeze the temperature averaging plate 210, and the temperature averaging plate 210 applies a pre-tightening force to the metal part and the heat conducting plate 220.

[0075] After the elastic force of the first elastic member 420 is balanced, the metal member is heated until the metal is melted. After the metal member is melted, the volume of the metal member decreases, and the pressure of the temperature averaging plate 210 is concentrated on the heat conducting plate 220. The elastic force of the first elastic member 420 is applied to the radiator 300, and a vertical downward pressure is applied to the temperature averaging plate 210, thereby compressing the heat conducting plate 220, and the distance between the temperature averaging plate 210 and the chip 2 is reduced. The heat conducting plate 220 is deformed to fill the gap between the temperature averaging plate 210 and the chip 2, so that the heat energy generated by the chip 2 can be directly transferred to the heat conducting plate 220, and then transferred to the temperature averaging plate 210 through the heat conducting plate 220, thereby improving the heat transfer efficiency between the chip 2 and the temperature averaging plate 210, and reducing the situation where the temperature of the chip 2 is too high due to slow heat dissipation, causing damage to the chip 2.

[0076] When the temperature averaging plate 210 moves down to contact the metal part, the force of the temperature averaging plate 210 is concentrated on the metal part, and the metal part is cooled down at this time, so that the metal part welds the support part 110 and the temperature averaging plate 210 into one. The heat sink 300 is arranged on the temperature averaging plate 210, so that the force generated by the heat sink 300 is transmitted to the support part 110 through the temperature averaging plate 210, and the pressure generated by the heat sink 300 is transmitted to the circuit board 1 through the support part 110. The temperature averaging plate 210 protects the chip 2, thereby reducing the situation where the chip 2 is damaged due to the impact of the heat sink 300.

[0077] An embodiment of the present application further provides an electronic device, including a circuit board 1 and a chip heat dissipation device according to any of the above embodiments arranged on the circuit board 1 .

[0078] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the invention disclosed herein. The present application is intended to cover any modification, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary techniques in the art that are not disclosed in the present application. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present application are indicated by the following claims.

[0079] It should be understood that the present application is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A chip heat dissipation device, characterized in that: include: At least one supporting component (100), the supporting component (100) being used to be arranged on a circuit board (1) and being located to the side of a chip (2) on the circuit board (1); A temperature balancing component (200), the temperature balancing component (200) being used to cover the chip (2) and connected to the circuit board (1), the support component (100) being located below the temperature balancing component (200) to support the temperature balancing component (200); A heat sink (300), the heat sink (300) covers the temperature equalizing component (200), and the heat sink (300) is used to be connected to the circuit board (1).

2. The chip heat dissipation device according to claim 1, characterized in that: The support assembly (100) comprises a support member (110) and a connecting member (120) arranged on the support member (110), wherein the support member (110) is used to be connected to the circuit board (1), and the connecting member (120) connects the temperature equalizing assembly (200) and the support member (110).

3. The chip heat dissipation device according to claim 2, characterized in that: The connecting member (120) is a metal member, and the metal member is configured to be heated and melted to connect the temperature equalizing component (200) and the supporting member (110).

4. The chip heat dissipation device according to claim 1, characterized in that: The number of the supporting components (100) is at least two, and each supporting component (100) is used to be arranged on two opposite sides of the chip (2).

5. The chip heat dissipation device according to claim 1, characterized in that: The temperature-averaging component (200) comprises a temperature-averaging plate (210), and the temperature-averaging plate (210) is connected to the supporting component (100).

6. The chip heat dissipation device according to claim 5, characterized in that: The temperature homogenizing plate (210) is connected to the heat sink (300).

7. The chip heat dissipation device according to claim 5, characterized in that: The temperature balancing component (200) further comprises a heat conducting plate (220), wherein the heat conducting plate (220) is arranged on the temperature balancing plate (210), and the heat conducting plate (220) is located between the temperature balancing plate (210) and the heat sink (300); Alternatively, the heat conducting plate (220) is arranged on the chip (2), and the heat conducting plate (220) is located between the temperature balancing plate (210) and the chip (2).

8. The chip heat dissipation device according to any one of claims 1 to 7, characterized in that: It also comprises at least two first connection components (400), wherein the first connection components (400) comprise a first connection member (410) and a first elastic member (420), and the first connection member (410) is used to connect the heat sink (300), the temperature balancing component (200) and the circuit board (1); The first connecting member (410) has a first supporting portion on the end portion facing the temperature equalizing component (200), and the first elastic member (420) is sleeved on the first connecting member (410) and abuts between the first supporting portion and the temperature equalizing component (200).

9. The chip heat dissipation device according to any one of claims 1 to 7, characterized in that: It also comprises at least two second connection components (500), wherein the second connection components (500) comprise a second connection member (510) and a second elastic member (520), and the second connection member (510) is used to connect the heat sink (300) and the circuit board (1); The second connecting member (510) has a second supporting portion on the end portion facing the radiator (300), and the second elastic member (520) is sleeved on the second connecting member (510) and abuts between the second supporting portion and the radiator (300).

10. An electronic device, comprising a circuit board (1) and the chip heat dissipation device according to any one of claims 1 to 9 arranged on the circuit board (1).

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