Power supply and distribution module and method for packaging power supply and distribution module

Abstract

The invention provides a power supply and distribution module and a method for packaging the power supply and distribution module. The power supply and distribution module comprises a transformer; each packaging module comprises a packaging substrate, a conducting layer is arranged on the bottom surface of the packaging substrate, and the two conducting layers are electrically connected with the top and the bottom of the transformer respectively to form vertical stacking; and a plurality of electrical function devices packaged in the packaging substrate, and the two side electrode groups are respectively and electrically connected to the two sides of the two packaging modules along the vertical direction, so that electrical connection and signal transmission between the power supply and distribution module and an external circuit are realized.

Description

Technical Field

[0001] The present disclosure relates to the technical field of microelectronic packaging, and more specifically, to a power supply and distribution module and a method for packaging the power supply and distribution module. Background Art

[0002] Existing power supply and distribution modules such as Figure 1 As shown, the power device 4 and the packaging module 100 integrating the integrated circuit chip and the passive device are stacked, the two packaging modules 100 and the transformer 1 are all installed on the bottom electrode 200, and the two packaging modules 100 are located on both sides of the transformer 1 in the horizontal direction. However, the structural area of ​​this horizontally distributed power supply and distribution module is large, and it cannot meet the structural requirements of the vertical power supply and distribution system that the area of ​​the power supply and distribution module does not exceed the area of ​​the load chip, and the module port and the load chip pin are vertically interconnected. In addition, in order to meet the requirements of high power density, the horizontally distributed power supply and distribution module will generate large lateral interconnection losses from the power supply and distribution module to the processor under high current conditions. At the same time, the current flowing from the integrated circuit chip to the passive device and then back to the processor will also generate round-trip low voltage and large current losses, limiting the efficiency of the power supply and distribution module. Summary of the invention

[0003] To solve at least one of the technical problems in the prior art, the embodiments of the present disclosure provide a power supply and distribution module and a method for packaging the power supply and distribution module, which can reduce the area of ​​the power supply and distribution module used in high current scenarios while reducing losses.

[0004] An embodiment of the present disclosure provides a power supply and distribution module, comprising: a transformer; two packaging modules, each of the packaging modules comprising: a packaging substrate, a bottom surface of the packaging substrate is provided with a conductive layer, the two conductive layers are respectively electrically connected to the top and bottom of the transformer to form a vertical stack; and a plurality of electrical functional devices are packaged inside the packaging substrate; and two side electrode groups, the two side electrode groups are respectively electrically connected to the two sides of the two packaging modules in a vertical direction to achieve electrical connection and signal transmission between the power supply and distribution module and an external circuit.

[0005] According to some embodiments of the present disclosure, each of the above-mentioned packaging substrates includes: a first core board; and a second core board installed on the lower side of the above-mentioned first core board; wherein first through holes are formed on both sides of the above-mentioned packaging substrate, and the above-mentioned first through holes are filled with first electrical connection materials to electrically connect the above-mentioned first core board and the above-mentioned second core board; second through holes are formed on the outer sides of the two above-mentioned first through holes, and the above-mentioned second through holes are configured to lead out the above-mentioned side electrode group.

[0006] According to some embodiments of the present disclosure, the plurality of electrical functional devices include: an integrated circuit chip embedded in the first core board; and passive devices embedded in the second core board.

[0007] According to some embodiments of the present disclosure, the power supply and distribution module further includes: two power devices, respectively electrically connected to the first surfaces of the two first core boards; wherein the first surfaces are configured to have a plurality of insulating gaps spaced apart for electrical insulation.

[0008] According to some embodiments of the present disclosure, the first core board includes: a first metal layer, which is disposed on a second surface of the first core board, and the second surface is opposite to the first surface.

[0009] According to some embodiments of the present disclosure, the second core board includes: a second metal layer, which is arranged on a surface of the second core board away from the conductive layer, and the second metal layer is configured to electrically connect the passive device and the two side electrode groups.

[0010] According to some embodiments of the present disclosure, the integrated circuit chip and the first surface, as well as the passive device and the second metal layer are electrically connected via conductive pillars.

[0011] According to some embodiments of the present disclosure, the power supply and distribution module further includes: a plurality of second electrical connection materials electrically connected in an array between the power device and the first surface to electrically connect the power device and the integrated circuit chip.

[0012] According to some embodiments of another aspect of the present disclosure, a method for packaging the above-mentioned power supply and distribution module is provided, comprising: packaging a plurality of electrical functional devices inside a packaging substrate to obtain a packaging module; symmetrically mounting two of the above-mentioned packaging modules on the top and bottom of a transformer to form a vertical stack; and welding side electrode groups along the vertical direction on both sides of the above-mentioned two packaging modules to obtain a power supply and distribution module.

[0013] According to some embodiments of the present disclosure, the packaging of multiple electrical functional devices inside the packaging substrate to obtain a packaging module includes: burying an integrated circuit chip inside the first core board; burying a passive device inside the second core board; pressing the first core board and the second core board to form the packaging substrate; forming a first through hole along the vertical direction on both sides of the packaging substrate to electrically connect the integrated circuit chip and the passive device; forming a second through hole on the outside of the first through hole to lead out the side electrode group; cutting the second through hole to form a connecting through hole; mounting the power device on the first surface of the first core board to obtain the packaging module.

[0014] According to an embodiment of the present disclosure, a power supply and distribution module and a method for packaging the power supply and distribution module are provided. The power supply and distribution module includes a transformer, two packaging modules and two side electrode groups. Each packaging module includes a packaging substrate and a plurality of electrical functional devices. A conductive layer is provided on the bottom surface of the packaging substrate. The two conductive layers are electrically connected to the top and bottom of the transformer, respectively, to form a vertical stack. The plurality of electrical functional devices are packaged inside the packaging substrate. The two side electrode groups are electrically connected to the two sides of the two packaging modules along the vertical direction, respectively, to reduce the resistance introduced by a large number of through holes used between different electrodes in the multi-layer stack, reduce losses, realize electrical connection and signal transmission between the power supply and distribution module and the external circuit, reduce the area of ​​the power supply and distribution module used in high current scenarios, and improve the efficiency of the power supply and distribution module. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The above and other objects, features and advantages of the present disclosure will become more apparent through the following description of the embodiments of the present disclosure with reference to the accompanying drawings, in which:

[0016] Figure 1 is a cross-sectional view of a horizontally distributed power supply and distribution module of the prior art;

[0017] Figure 2 is a composition diagram of a power supply and distribution module according to an exemplary embodiment of the present disclosure;

[0018] Figure 3 is a block diagram of the composition distribution of a power supply and distribution module according to an exemplary embodiment of the present disclosure;

[0019] Figure 4 is a cross-sectional view of a power supply and distribution module according to an exemplary embodiment of the present disclosure;

[0020] Figure 5 is a cross-sectional view of a package substrate according to an exemplary embodiment of the present disclosure;

[0021] Figure 6 is a cross-sectional view of a first core plate and a second core plate according to an exemplary embodiment of the present disclosure;

[0022] Figure 7 is a cross-sectional view of a power device electrically connected to a first surface of a first core board according to an exemplary embodiment of the present disclosure;

[0023] Figure 8 is a flow chart of a method for packaging a power supply and distribution module according to an exemplary embodiment of the present disclosure;

[0024] Fig. 9 is a cross-sectional view of symmetrically mounting two packaging modules on the top and bottom of a transformer according to an exemplary embodiment of the present disclosure;

[0025] Fig.10 It is a flowchart of sub-steps of packaging a plurality of electrical functional devices inside a packaging substrate to obtain a packaging module according to an exemplary embodiment of the present disclosure;

[0026] Fig.11 is a top view of cutting the second through hole to form a connecting through hole according to an exemplary embodiment of the present disclosure.

[0027] In the drawings, the meanings of the reference numerals are as follows:

[0028] 100. Encapsulation module;

[0029] 200, bottom electrode;

[0030] 1. Transformer;

[0031] 2. Side electrode group;

[0032] 3. Packaging substrate;

[0033] 31. The first core board;

[0034] 310, first metal layer;

[0035] 32. The second core board;

[0036] 320, conductive layer;

[0037] 321, second metal layer;

[0038] 4. Power devices;

[0039] 5. Integrated circuit chips;

[0040] 6. Passive components;

[0041] 7. a first through hole;

[0042] 8. Conductive column;

[0043] 9. A second electrical connection material;

[0044] 10. a second through hole;

[0045] 11. Connect through holes;

[0046] A. The first side. DETAILED DESCRIPTION

[0047] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of the present disclosure. In the following detailed description, for ease of explanation, many specific details are set forth to provide a comprehensive understanding of the embodiments of the present disclosure. However, it is apparent that one or more embodiments may also be implemented without these specific details. In addition, in the following description, descriptions of known structures and technologies are omitted to avoid unnecessary confusion of the concepts of the present disclosure.

[0048] The terms used herein are only for describing specific embodiments and are not intended to limit the present disclosure. The terms "comprise", "include", etc. used herein indicate the existence of the features, steps, operations and / or components, but do not exclude the existence or addition of one or more other features, steps, operations or components.

[0049] All terms (including technical and scientific terms) used herein have the meanings commonly understood by those skilled in the art unless otherwise defined. It should be noted that the terms used herein should be interpreted as having a meaning consistent with the context of this specification and should not be interpreted in an idealized or overly rigid manner.

[0050] When using expressions such as "at least one of A, B, and C, etc.", they should generally be interpreted according to the meaning of the expression commonly understood by those skilled in the art (for example, "a system having at least one of A, B, and C" should include but is not limited to a system having A alone, B alone, C alone, A and B, A and C, B and C, and / or A, B, C, etc.).

[0051] In application fields such as high-performance computing and millimeter waves, due to the requirements of high computing power density, high energy efficiency ratio and functional integration, in order to solve the problem of reducing the area of ​​power supply and distribution modules used in high current scenarios, according to the inventive concept of one aspect of the present disclosure, based on a miniaturized transformer, the power supply and distribution module includes a transformer, two packaging modules and two side electrode groups, each packaging module includes a packaging substrate and a plurality of electrical functional devices, a conductive layer is provided on the bottom surface of the packaging substrate, and the two conductive layers are electrically connected to the top and bottom of the transformer, respectively, to form a vertical stack, and a plurality of electrical functional devices are packaged inside the packaging substrate, and the two side electrode groups are electrically connected to the two sides of the two packaging modules in the vertical direction, respectively, to reduce the resistance introduced by a large number of through holes used between different electrodes in the multi-layer stack, reduce losses, realize electrical connection and signal transmission between the power supply and distribution module and the external circuit, and can reduce the area of ​​the power supply and distribution module used in high current scenarios and improve the efficiency of the power supply and distribution module.

[0052] Figure 2 is a composition diagram of a power supply and distribution module according to an exemplary embodiment of the present disclosure, Figure 3 is a block diagram of the composition distribution of a power supply and distribution module according to an exemplary embodiment of the present disclosure, Figure 4 is a cross-sectional view of a power supply and distribution module according to an illustrative embodiment of the present disclosure.

[0053] According to the embodiments of the present disclosure, Figure 2 , Figure 3 and Figure 4 As shown, a power supply and distribution module is provided, which includes a transformer 1, two packaging modules and two side electrode groups 2. Each packaging module includes a packaging substrate 3 and a plurality of electrical functional devices. A conductive layer 320 is provided on the bottom surface of the packaging substrate 3, and the two conductive layers 320 are respectively electrically connected to the top and bottom of the transformer 1 to form a vertical stack. A plurality of electrical functional devices are packaged inside the packaging substrate 3. The two side electrode groups 2 are respectively electrically connected to the two sides of the two packaging modules in the vertical direction to realize electrical connection and signal transmission between the power supply and distribution module and the external circuit.

[0054] According to the embodiment of the present disclosure, the magnetic core structure in the transformer 1 can be a UI structure, an EE structure or an EI structure.

[0055] According to an embodiment of the present disclosure, the transformer 1 is electrically connected to the two packaging modules through the conductive layer 320, and the multiple electrical functional devices packaged in each packaging substrate 3 are electrically connected through the first through holes 7 on both sides of the packaging substrate 3 (the first through holes 7 are described in detail below) and the wiring layer inside the packaging substrate 3.

[0056] According to the embodiment of the present disclosure, two packaging modules and the transformer 1 are stacked vertically, which can optimize space utilization and improve the integration and power density of the power supply and distribution module.

[0057] According to an embodiment of the present disclosure, each side electrode group 2 includes multiple side electrodes, and the multiple side electrodes can be in the form of an array of copper columns. The multiple side electrodes are configured to achieve electrical connection and signal transmission between the power supply and distribution module and the external circuit. The use of multiple side electrodes can achieve input and output of large current signals.

[0058] According to an embodiment of the present disclosure, a power supply and distribution module includes a transformer 1, two packaging modules and two side electrode groups 2, each packaging module includes a packaging substrate 3 and a plurality of electrical functional devices, a conductive layer 320 is provided on the bottom surface of the packaging substrate 3, the two conductive layers 320 are electrically connected to the top and bottom of the transformer 1, respectively, to form a vertical stack, a plurality of electrical functional devices are packaged inside the packaging substrate 3, and the two side electrode groups 2 are electrically connected to the two sides of the two packaging modules in a vertical direction, respectively, to reduce the resistance introduced by a large number of through holes used between different electrodes in a multi-layer stack, to reduce losses, to achieve electrical connection and signal transmission between the power supply and distribution module and an external circuit, to reduce the area of ​​the power supply and distribution module used in high current scenarios, and to improve the efficiency of the power supply and distribution module.

[0059] Figure 5 is a cross-sectional view of a packaging substrate 3 according to an exemplary embodiment of the present disclosure, Figure 6 is a cross-sectional view of a first core plate 31 and a second core plate 32 according to an exemplary embodiment of the present disclosure.

[0060] According to the embodiments of the present disclosure, Figure 5 and Figure 6 As shown, each package substrate 3 includes a first core plate 31 and a second core plate 32. The second core plate 32 is installed on the lower side of the first core plate 31. First through holes 7 are formed on both sides of the package substrate 3, and the first through holes 7 are filled with a first electrical connection material to electrically connect the first core plate 31 and the second core plate 32. Second through holes 10 are formed on the outside of the two first through holes 7, and the second through holes 10 are configured to lead out the side electrode group 2.

[0061] According to an embodiment of the present disclosure, the first electrical connection material may be selected to be copper, for example.

[0062] According to an embodiment of the present disclosure, the first metal layer 310 of the first core board 31 (the first metal layer 310 is described in detail below) and the second metal layer 321 of the second core board 32 (the second metal layer 321 is described in detail below) are bonded, and first through holes 7 are formed on both sides of the packaging substrate 3, and the first through holes 7 are filled with a first electrical connection material, which can electrically connect the first core board 31 and the second core board 32, and at the same time interconnect the first metal layer 310 and the second metal layer 321 to form an integrated metal structure, thereby reducing the area of ​​the packaging substrate 3.

[0063] According to an embodiment of the present disclosure, the plurality of electrical functional devices include an integrated circuit chip 5 and a passive device 6. Figure 6 As shown, the integrated circuit chip 5 is buried inside the first core board 31 and the passive device 6 is buried inside the second core board 32.

[0064] According to an embodiment of the present disclosure, the integrated circuit chip 5 may be, for example, a driver chip, and the passive device 6 may be, for example, a resistor and a capacitor.

[0065] Figure 7 4 is a cross-sectional view of a power device 4 electrically connected to a first surface A of a first core board 31 according to an exemplary embodiment of the present disclosure.

[0066] According to an embodiment of the present disclosure, the power supply and distribution module further includes two power devices 4, such as Figure 7 As shown, two power devices 4 are electrically connected to the first surfaces A of two first core plates 31. The first surface A is configured to have a plurality of insulation gaps arranged at intervals for electrical insulation.

[0067] According to an embodiment of the present disclosure, the material of the first surface A of the first core board 31 is metal material, and the first surface A has a plurality of insulating gaps arranged at intervals. The insulating gaps are formed by a graphic etching process, and the insulating gaps can avoid electrical connection between the wiring on the first surface A.

[0068] In an illustrative embodiment, copper may be plated on the first surface A of the first core board 31 , and then a plurality of insulating gaps disposed at intervals may be formed through a patterning etching process.

[0069] According to the embodiments of the present disclosure, Figure 6 As shown, the first core board 31 includes a first metal layer 310 . The first metal layer 310 is disposed on a second surface of the first core board 31 , and the second surface is opposite to the first surface A.

[0070] According to the embodiments of the present disclosure, Figure 6 As shown, the second core board 32 includes a second metal layer 321 , which is disposed on a surface of the second core board 32 away from the conductive layer 320 , and is configured to electrically connect the passive device 6 and the two side electrode groups 2 .

[0071] According to the embodiments of the present disclosure, Figure 6 As shown, the integrated circuit chip 5 and the first surface A, and the passive device 6 and the second metal layer 321 are electrically connected via the conductive pillars 8 .

[0072] According to an embodiment of the present disclosure, the conductive pillar 8 is made of metal, and the metal material may be copper, for example.

[0073] According to the embodiments of the present disclosure, Figure 7 As shown, the power supply and distribution module further includes a plurality of second electrical connection materials 9. The plurality of second electrical connection materials 9 are electrically connected between the power device 4 and the first surface A in an array to electrically connect the power device 4 and the integrated circuit chip 5.

[0074] In an exemplary embodiment, the power device 4 and the first surface A of the first core board 31 may be connected via an array of solder balls.

[0075] Figure 8 It is a flow chart of a method for packaging a power supply and distribution module according to an illustrative embodiment of the present disclosure.

[0076] According to the embodiments of the present disclosure, Figure 8 As shown, a method for packaging a power supply and distribution module is provided, comprising the following steps S1 to S3.

[0077] Step S1: encapsulate a plurality of electrical functional devices inside the encapsulation substrate 3 to obtain a encapsulation module.

[0078] Fig. 9 It is a cross-sectional view showing two packaging modules symmetrically mounted on the top and bottom of a transformer 1 according to an exemplary embodiment of the present disclosure.

[0079] Step S2: Fig. 9 As shown, two package modules are symmetrically mounted on the top and bottom of the transformer 1 to form a vertical stack.

[0080] According to an embodiment of the present disclosure, two packaging modules are mounted on the top and bottom of the transformer 1 using a welding process to form a vertical stack.

[0081] Step S3: Figure 4 As shown, the side electrode groups 2 are welded along the vertical direction on both sides of the two packaging modules to obtain a power supply and distribution module.

[0082] According to the embodiments of the present disclosure, the power supply and distribution module obtained by the above-mentioned packaging method is suitable for converting the external voltage and outputting it stably, and can be applied to the front-stage high-voltage and high-power density power supply.

[0083] Fig.10 It is a flowchart of sub-steps of packaging a plurality of electrical functional devices inside a packaging substrate 3 to obtain a packaging module according to an exemplary embodiment of the present disclosure.

[0084] According to the embodiments of the present disclosure, Fig.10 As shown, a plurality of electrical functional devices are packaged inside the packaging substrate 3 to obtain a packaging module, including the following steps 11 to 17.

[0085] Step 11: Figure 6 As shown, the integrated circuit chip 5 is buried inside the first core board 31 .

[0086] Step 12: Figure 6 As shown, the passive device 6 is buried inside the second core board 32 .

[0087] Step 13: Figure 5 As shown, the first core board 31 and the second core board 32 are pressed together to form the package substrate 3 .

[0088] Step 14: First through holes 7 are formed along the vertical direction on both sides of the packaging substrate 3 to electrically connect the integrated circuit chip 5 and the passive device 6 .

[0089] Step 15: forming a second through hole 10 outside the first through hole 7 to lead out the side electrode group 2 .

[0090] Fig.11 1 is a top view of cutting the second through hole 10 to form a connecting through hole 11 according to an exemplary embodiment of the present disclosure.

[0091] Step 16: Fig.11 As shown, the second through hole 10 is cut to form a connecting through hole 11 .

[0092] Step 17: Figure 7 As shown, the power device 4 is mounted on the first surface A of the first core board 31 to obtain a packaged module.

[0093] According to an embodiment of the present disclosure, array copper pillars are welded at the connection through holes 11 on both sides of the packaging substrate 3 to achieve electrical connection and signal transmission between the power supply and distribution module and the external circuit. At the same time, the array copper pillars can reduce the loss of the electrical connection path.

[0094] It will be appreciated by those skilled in the art that the features described in the various embodiments and / or claims of the present disclosure may be combined or coupled in a variety of ways, even if such combinations or couplings are not explicitly described in the present disclosure. In particular, the features described in the various embodiments and / or claims of the present disclosure may be combined or coupled in a variety of ways without departing from the spirit and teachings of the present disclosure. All of these combinations and / or couplings fall within the scope of the present disclosure.

[0095] It should also be noted that the directional terms mentioned in the embodiments, such as "upper", "lower", "front", "back", "left", "right", etc., are only reference directions of the drawings and are not intended to limit the scope of protection of the present disclosure. Throughout the drawings, the same elements are represented by the same or similar reference numerals. Conventional structures or configurations will be omitted when they may cause confusion in the understanding of the present disclosure, and the shapes and sizes of the components in the drawings do not reflect the actual size and proportion, but only illustrate the contents of the embodiments of the present disclosure.

[0096] Unless otherwise indicated, the numerical parameters in this specification and the appended claims are approximate values ​​and can be changed according to the desired properties obtained by the content of the present disclosure. Specifically, all numbers used in the specification and claims to express the content of the composition, reaction conditions, etc., should be understood to be modified by the term "about" in all cases. In general, the meaning of the expression is to include changes in some embodiments of ±10%, in some embodiments of ±5%, in some embodiments of ±1%, and in some embodiments of ±0.5% by a specific number.

[0097] The ordinal numbers used in the specification and claims, such as "first", "second", "third", etc., to modify the corresponding elements, do not themselves mean that the elements have any ordinal numbers, nor do they represent the order of one element and another element, or the order in the manufacturing method. The use of these ordinal numbers is only used to clearly distinguish a component with a certain name from another component with the same name.

[0098] In addition, unless the steps are specifically described or must occur in sequence, the order of the above steps is not limited to the above list, and can be changed or rearranged according to the required design. And the above embodiments can be mixed and matched with each other or with other embodiments based on design and reliability considerations, that is, the technical features in different embodiments can be freely combined to form more embodiments.

[0099] The embodiments of the present disclosure are described above. However, these embodiments are only for illustrative purposes and are not intended to limit the scope of the present disclosure. Although the embodiments are described above separately, this does not mean that the measures in the various embodiments cannot be used in combination to advantage. The scope of the present disclosure is defined by the attached claims and their equivalents. Without departing from the scope of the present disclosure, those skilled in the art may make a variety of substitutions and modifications, which should all fall within the scope of the present disclosure.

Claims

1. A power supply and distribution module, wherein: include: transformer; Two packaging modules, each of which comprises: A packaging substrate, wherein a conductive layer is disposed on the bottom surface of the packaging substrate, and two conductive layers are electrically connected to the top and bottom of the transformer respectively to form a vertical stack; and A plurality of electrical functional devices are packaged inside the packaging substrate; and Two side electrode groups are electrically connected to two sides of the two packaging modules in a vertical direction to achieve electrical connection and signal transmission between the power supply and distribution module and the external circuit.

2. The power supply and distribution module according to claim 1, wherein: Each of the packaging substrates comprises: a first core board; and A second core plate, mounted on the lower side of the first core plate; Wherein, first through holes are formed on both sides of the packaging substrate, and the first through holes are filled with a first electrical connection material to electrically connect the first core board and the second core board; A second through hole is formed outside the two first through holes, and the second through hole is configured to lead out the side electrode group.

3. The power supply and distribution module according to claim 2, wherein: The plurality of electrical functional devices include: an integrated circuit chip, embedded in the first core board; and Passive components are embedded in the second core board.

4. The power supply and distribution module according to claim 3, wherein: Also includes: Two power devices are electrically connected to the first surfaces of the two first core boards respectively; The first surface is configured to have a plurality of insulating gaps arranged at intervals for electrical insulation.

5. The power supply and distribution module according to claim 3, wherein: The first core plate comprises: The first metal layer is disposed on a second surface of the first core board, and the second surface is opposite to the first surface.

6. The power supply and distribution module according to claim 4, wherein: The second core plate comprises: A second metal layer is disposed on a surface of the second core board away from the conductive layer, and the second metal layer is configured to electrically connect the passive device and the two side electrode groups.

7. The power supply and distribution module according to claim 6, wherein: The integrated circuit chip and the first surface, and the passive device and the second metal layer are electrically connected via conductive columns.

8. The power supply and distribution module according to claim 6, wherein: Also includes: A plurality of second electrical connection materials are electrically connected in an array between the power device and the first surface to electrically connect the power device and the integrated circuit chip.

9. A method for packaging a power supply and distribution module as claimed in any one of claims 1 to 8, wherein: include: Encapsulating a plurality of electrical functional devices inside a packaging substrate to obtain a packaging module; symmetrically mounting the two packaging modules on the top and bottom of the transformer to form a vertical stack; Side electrode groups are welded along the vertical direction on both sides of the two packaging modules to obtain a power supply and distribution module.

10. The method according to claim 9, wherein: The step of packaging a plurality of electrical functional devices inside a packaging substrate to obtain a packaging module comprises: Embedding the integrated circuit chip inside the first core board; Embedding the passive components inside the second core board; Pressing the first core board and the second core board together to form the packaging substrate; Forming first through holes along the vertical direction on both sides of the packaging substrate to electrically connect the integrated circuit chip and the passive device; forming a second through hole outside the first through hole to lead out the side electrode group; cutting the second through hole to form a connecting through hole; The power device is mounted on the first surface of the first core board to obtain the packaging module.

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