Small LED support with built-in IC
By setting an IC chip on the back of the pad and setting multiple luminescent chips on the front, the problem of large pad occupancy is solved, and a design suitable for small LED lamp beads is realized.
Patent Information
- Application Number
- CN202411484507.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-23
- Publication Date
- 2024-12-13
AI Technical Summary
In the prior art, the IC chip and the light emitting chip are arranged on the front of the pad, resulting in a large area of the pad, making it difficult to apply to small LED lamp beads.
The IC chip is arranged on the back of the pad, while a plurality of light emitting chips are arranged on the front of the pad and are electrically connected to the pad through wires to reduce the area occupied by the front of the pad.
It realizes the reduction of the front area of the pad on small LED beads, which is suitable for the design of small LED beads.
Smart Images
Figure CN119133341A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of LEDs, and in particular to an LED bracket with a built-in IC. Background Art
[0002] The Chinese patent document with the authorization announcement number CN210516750U, entitled "A full-color LED with built-in IC", discloses a technology for building IC into LED lamp beads, including a bracket body, a patch, a G patch, a B patch, a solder pad, a solder foot and an IC chip, wherein the solder pad and the solder foot are arranged on the bracket body, and a bowl is arranged on the bracket body, and the R patch, the G patch, the B patch and the IC chip are all arranged on the solder pad and located in the bowl. Although the structure has an IC built into the LED lamp bead, the IC chip, together with the R patch, the G patch and the B patch, are all arranged on the front of the solder pad, resulting in a relatively large area occupied on the front of the solder pad, making the volume of the bracket body and even the entire LED lamp bead larger, so this technology is not suitable for small LED lamp beads. Summary of the invention
[0003] In order to solve the deficiencies of the prior art, the present invention provides an LED bracket which occupies a smaller front area of a soldering pad and is suitable for small LED lamp beads.
[0004] The technical solution adopted by the present invention to solve the problem is:
[0005] A small LED bracket with a built-in IC includes a bracket body with a bowl cup, multiple light-emitting chips, an IC chip, multiple solder pads arranged on the bracket body, and multiple solder feet connected to the multiple solder pads in a one-to-one correspondence, the solder pads extend into the bowl cup, the multiple light-emitting chips are located in the bowl cup and are arranged on the front side of the solder pads, the IC chip is located in the bowl cup and is arranged on the back side of one of the solder pads, and the IC chip is electrically connected to each solder pad and each light-emitting chip through wires.
[0006] As a further improvement, a plurality of light emitting chips are arranged on the front side of one or more of the pads.
[0007] As a further improvement, a plurality of light-emitting chips and the IC chip are all arranged on the same pad.
[0008] As a further improvement, the soldering pad where the light emitting chip and the IC chip are located is located in the middle of the bowl.
[0009] As a further improvement, bumps are also provided on the side surfaces of the pads where the light emitting wafer and the IC chip are located.
[0010] As a further improvement, a barrier line is provided on the front side of the pad where the light emitting chip and the IC chip are located, and the barrier line is located between adjacent light emitting chips.
[0011] As a further improvement, the plurality of solder feet include second solder feet, the number of the second solder feet is the same as the number of the light-emitting chips, and the wires connecting the IC chip and each light-emitting chip pass through the pads corresponding to the second solder feet.
[0012] As a further improvement, the solder foot other than the second solder foot is a first solder foot, the end of the first solder foot extends to the back side of the bracket body, and the end of the second solder foot extends to the side of the bracket body.
[0013] As a further improvement, rubber ribs are provided between adjacent pads.
[0014] Beneficial effects of the present invention: The present invention arranges multiple light-emitting chips on the front side of the pad, and the IC chip on the back side of the pad. Compared with the prior art design of arranging both on the front side of the pad, the area occupied on the front side of the pad can be greatly reduced, making it suitable for small LED lamp beads. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a schematic diagram of the main structure of the present invention;
[0016] Figure 2 It is a rear view structural schematic diagram of the present invention;
[0017] Figure 3 It is a three-dimensional structural schematic diagram of the present invention;
[0018] Figure 4 It is a schematic diagram of the three-dimensional structure of the present invention without the support body. DETAILED DESCRIPTION
[0019] The following will be combined with the embodiments and drawings to clearly and completely describe the concept, specific structure and technical effects of the invention, so as to fully understand the purpose, characteristics and effects of the invention. The various technical features in the invention can be combined interchangeably without conflicting with each other.
[0020] like Figures 1 to 4 As shown, a small LED bracket with a built-in IC includes a bracket body 1, a plurality of light-emitting chips 2, an IC chip 3, a plurality of solder pads 4, and a plurality of solder legs. A bowl 11 is provided on the bracket body 1, and the number of solder pads 4 and solder legs is the same and one-to-one corresponding. The solder legs are arranged around the bracket body 1, and the solder pads 4 are mainly located in the bowl 11. Each solder leg is fixedly connected to the corresponding solder pad 4, and preferably adopts an integrated structure.
[0021] The light emitting chip 2 includes a red light chip, a green light chip and a blue light chip, namely an RGB light emitting chip, which forms a full-color LED by mixing the three primary colors of red, green and blue. Of course, light emitting chips of other colors can also be added according to actual needs, such as using only warm white light chips and cold white light chips, and adjusting the mixing ratio of the two to form an LED with adjustable color temperature. Therefore, the number of light emitting chips 2 is not less than two, and preferably three RGB chips are used, and the actual number is set according to needs.
[0022] These light-emitting chips 2 are arranged on the front of the pads 4 in the bowl 11. When emitting light, the bowl 11 can play a certain light-collecting role. These light-emitting chips 2 can be distributed on two or more pads 4, such as RGB light-emitting chips, in which two light-emitting chips are arranged on one pad 4 and the remaining light-emitting chip is arranged on another pad 4; the three light-emitting chips can also be distributed on three different pads 4.
[0023] The IC chip 3 is arranged on the back of one of the pads 4 in the bowl 11. The IC chip 3 is electrically connected to each pad 4 and each light-emitting chip 2 through wires. The IC chip 3 controls the light intensity of the light-emitting chips 2 according to external control signals to achieve different light mixing ratios.
[0024] By arranging a plurality of light-emitting chips 2 on the front of the pad 4 and the IC chip 3 on the back of the pad 4, the area occupied on the front of the pad 4 can be greatly reduced, so that it can be applied to small LED lamp beads. Figure 1 As shown, the length and width of the lamp bead can be as small as 3.30mm and 3.2mm respectively.
[0025] In one embodiment, referring to Figure 1 , these light emitting chips 2 are arranged on the front side of the same pad 4. And preferably, referring to Figure 2 The IC chip 3 is arranged on the back of the same pad 4 as the light emitting chip 2, so that the overall structure and installation are relatively simple. In addition, the pad 4 where the light emitting chip 2 is located is preferably arranged in the middle of the bowl 11.
[0026] In one embodiment, the plurality of solder legs are divided into first solder legs 51 and second solder legs 52, wherein the number of the second solder legs 52 is the same as the number of the light emitting chips 2. Figures 1 to 4 These second solder legs 52 are arranged side by side on one side of the bracket body 1, and the wires connecting the IC chip 3 and each light-emitting chip 2 pass through the pads 4 corresponding to the second solder legs 52 respectively. Through these second solder legs 52, it is possible to detect whether each light-emitting chip 2 and the IC chip 3 are conductive, and test whether the lamp beads are normal before packaging, which is beneficial to improving the yield rate of the product.
[0027] The second solder legs 52 do not need solder, so their ends extend to the side of the bracket body 1 for easy inspection. The ends of the first solder legs 51 extend to the back of the bracket body 1 for easy soldering.
[0028] In one embodiment, referring to Figures 1 to 3 , rubber ribs 6 are provided between adjacent pads 4, which can effectively improve the anti-permeability and air tightness. Figure 4 As shown, a bump 41 is also provided on the side of the pad 4 where the light emitting chip 2 and the IC chip 3 are located. The bump 41 is wrapped in the rubber rib 6 to play a role of glue fixation.
[0029] In addition, a barrier line 42 is provided on the front side of the pad 4 where the light emitting chip 2 and the IC chip 3 are located, and the barrier line 42 is located between adjacent light emitting chips 2. Figure 1 , Figure 3 and Figure 4 As shown, there are three light emitting chips 2 arranged in a triangle shape, and the blocking line 42 is T-shaped and located in the gap between the light emitting chips 2. Since the light emitting chip 2 and the bottom of the Zener diode are coated with insulating glue, some glue gas will be emitted during baking, causing the light emitting chips next to them to be bonded together, and the provided blocking line 42 can effectively isolate the glue gas and improve the bonding effect of the light emitting chips.
[0030] In the present invention, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance; the term "plurality" refers to two or more, unless otherwise clearly defined. The terms "installed", "connected", "connected", "fixed", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; "connected" can be a direct connection or an indirect connection through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0031] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by terms such as “upper”, “lower”, “left”, “right”, “front” and “back” are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or unit referred to must have a specific direction, be constructed and operated in a specific orientation, and therefore, cannot be understood as a limitation on the present invention.
[0032] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.
[0033] It should be noted that the above is only a further explanation of the present invention in combination with the embodiments, and does not constitute a limitation on the protection scope of the present invention. If simple modifications are made to the present technology, they are only to achieve the purpose of the invention by basically the same means, and they should all fall within the protection scope of the present invention.
Claims
1. A small LED bracket with a built-in IC, comprising a bracket body (1) provided with a bowl (11), a plurality of light-emitting chips (2), an IC chip (3), a plurality of solder pads (4) provided on the bracket body (1), and a plurality of solder feet connected to the plurality of solder pads (4) in a one-to-one correspondence, characterized in that: The solder pad (4) extends into the cup (11); a plurality of light-emitting chips (2) are located in the cup (11) and are arranged on the front side of the solder pad (4); the IC chip (3) is located in the cup (11) and is arranged on the back side of one of the solder pads (4); and the IC chip (3) is electrically connected to each solder pad (4) and each light-emitting chip (2) through wires.
2. The small LED bracket with built-in IC according to claim 1, characterized in that: A plurality of light-emitting chips (2) are arranged on the front side of one or more of the solder pads (4).
3. The small LED bracket with built-in IC according to claim 1, characterized in that: A plurality of light-emitting chips (2) and the IC chip (3) are all arranged on the same solder pad (4).
4. The small LED bracket with built-in IC according to claim 3, characterized in that: The soldering pad (4) where the light-emitting chip (2) and the IC chip (3) are located is located in the middle of the bowl (11).
5. The small LED bracket with built-in IC according to claim 3, characterized in that: The side surface of the soldering pad (4) where the light-emitting chip (2) and the IC chip (3) are located is also provided with a bump (41).
6. The small LED bracket with built-in IC according to claim 3, characterized in that: A barrier line (42) is provided on the front side of the soldering pad (4) where the light-emitting chip (2) and the IC chip (3) are located, and the barrier line (42) is located between adjacent light-emitting chips (2).
7. The small LED bracket with built-in IC according to claim 1, characterized in that: The plurality of solder feet include a second solder foot (52), the number of the second solder feet (52) being the same as the number of the light-emitting chips (2), and the wires connecting the IC chip (3) and each light-emitting chip (2) respectively pass through the solder pads (4) corresponding to the second solder feet (52).
8. The small LED bracket with built-in IC according to claim 7, characterized in that: The solder foot other than the second solder foot (52) is a first solder foot (51), the end of the first solder foot (51) extends to the back side of the bracket body (1), and the end of the second solder foot (52) extends to the side of the bracket body (1).
9. The small LED bracket with built-in IC according to any one of claims 1 to 8, characterized in that: Rubber convex ribs (6) are arranged between adjacent welding pads (4).