Method for manufacturing molded body

Abstract

Provided is a method for producing a molded body, the method comprising: a preparation step for preparing an insert member having a first resin part containing a first thermoplastic resin on the surface thereof; a filling step of inserting and fixing the first resin portion of the insert member into a mold, and filling a space between the first resin portion and the mold with a molten second thermoplastic resin using an injection molding device; and a pressure maintaining step for applying a holding pressure to the second thermoplastic resin filled in the space, in which a first holding pressure is applied until the internal temperature of the first resin part reaches the load deflection temperature of the first thermoplastic resin, and a second holding pressure is applied until the internal temperature of the first resin part reaches the load deflection temperature of the second thermoplastic resin. After the internal temperature reaches the load deflection temperature, a second holding pressure lower than the first holding pressure is applied.

Description

Technical Field

[0001] The present disclosure relates to a method for producing a formed body. Background Art

[0002] In injection molding, a filling process of filling the space (cavity) in the mold with molten resin and a pressure holding process of applying a holding pressure to the resin filled in the above space are usually performed. For example, Japanese Patent Application Laid-Open No. 2006-110905 discloses the following injection molding method: after mold closing, the injection operation is started after confirming that the temperature of the mold cavity has reached a predetermined temperature or above, and the injection filling process is completed after detecting and confirming that the injection screw has reached the set filling completion position and the mold cavity has reached the predetermined temperature, and then the pressure holding process is switched to the pressure holding process, which is completed according to the set pressure holding time and / or the set mold cavity temperature. Summary of the invention

[0003] When injection molding is performed on an insert component having a resin portion containing a thermoplastic resin on its surface, the heat of the injected resin may be transferred to the resin portion, thereby softening the resin portion. If a high holding pressure is applied to the softened resin portion during the holding pressure process, the softened resin portion may deform, thereby deforming the insert component.

[0004] The present disclosure has been made in view of the above circumstances, and a main object of the present disclosure is to provide a method for manufacturing a molded body capable of suppressing deformation of an insert component.

[0005] [1] A method for producing a molded body, comprising: a preparation step of preparing an embedding component having a first resin portion containing a first thermoplastic resin on a surface thereof; a filling step of inserting the first resin portion of the insert component into a mold and fixing it, and filling a molten second thermoplastic resin into a space between the first resin portion and the mold using an injection molding device; and a pressure holding step of applying a holding pressure to the second thermoplastic resin filled in the space; In the pressure holding step, a first holding pressure is applied until the internal temperature of the first resin portion reaches the load deflection temperature of the first thermoplastic resin, and a second holding pressure lower than the first holding pressure is applied after the internal temperature reaches the load deflection temperature.

[0006] [2] A method for producing a molded body, comprising: a preparation step of preparing an embedding component having a first resin portion containing a first thermoplastic resin on a surface thereof; a filling step of inserting the first resin portion of the insert component into a mold and fixing it, and filling a molten second thermoplastic resin into a space between the first resin portion and the mold using an injection molding device; and a pressure holding step of applying a holding pressure to the second thermoplastic resin filled in the space; Among them, in the above-mentioned holding pressure process, a first holding pressure is applied until the forward movement amount per unit time (dL / dt) of the screw of the above-mentioned injection molding device reaches the changing point, and after the above-mentioned dL / dt reaches the above-mentioned changing point, a second holding pressure lower than the above-mentioned first holding pressure is applied.

[0007] [3] The method for producing a molded body according to [1] or [2], wherein: The first thermoplastic resin and the second thermoplastic resin are polyolefins, The first holding pressure is 1.5 MPa or more. The second holding pressure is less than 1.5 MPa.

[0008] [4] The method for producing a molded body according to any one of [1] to [3], wherein: The molded body is a component used in a power storage module. The embedding component includes an electrode body in which a plurality of electrodes are stacked in a thickness direction, and a resin sealing portion arranged along an outer edge of the electrode body. The electrode has a current collector and an active material layer. The sealing portion is the first resin portion.

[0009] [5] The method for producing a molded body according to [4], wherein: The electrode body includes bipolar electrodes as the electrodes.

[0010] The method for producing a molded body in the present disclosure has the effect of being able to suppress deformation of the insert component. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Features, advantages, and technical and industrial significance of exemplary embodiments of the present invention will be described below with reference to the accompanying drawings, in which like reference numerals represent like elements. Figure 1 (A), (B), and (C) are schematic cross-sectional views illustrating a preparation step, a filling step, and a pressure-maintaining step in the present disclosure. Figure 2 This is a graph for explaining pressure control in the pressure holding step in the present disclosure. Figure 3 This is a schematic cross-sectional view for explaining the subject of the present disclosure. Figure 4 (A) and (B) are respectively a schematic top view and a schematic cross-sectional view illustrating an embedding component in the present disclosure. Figure 5 This is a schematic cross-sectional view illustrating a method for manufacturing an insert component in the present disclosure. Figure 6 (A), (B), and (C) are graphs illustrating changes in the amount of advancement (L) of the screw. DETAILED DESCRIPTION

[0012] Hereinafter, the method for manufacturing a molded body disclosed in the present invention will be described in detail using the accompanying drawings. The following figures are schematically shown, and the size and shape of each part are appropriately exaggerated for easy understanding. In addition, in this specification, when expressing the manner in which other components are arranged relative to a certain component, when simply expressed as "above" or "below", unless otherwise specified, it includes two situations: the situation in which other components are arranged directly above or below a certain component in a manner of contacting the certain component, and the situation in which other components are arranged above or below a certain component with another component interposed therebetween.

[0013] The method for producing a molded body in the present disclosure is roughly divided into two embodiments according to the method for controlling the pressure in the pressure holding step. Hereinafter, the method for producing a molded body in the present disclosure will be described separately in the first embodiment and the second embodiment.

[0014] 1. First Implementation Figure 1 (A), (B), and (C) are schematic cross-sectional views illustrating the preparation process, the filling process, and the pressure holding process in the present disclosure. Figure 1 As shown in (A), an insert component 10 having a first resin portion 15 containing a first thermoplastic resin on its surface is prepared (preparation step). Next, the first resin portion 15 in the insert component 10 is inserted into the mold 20 and fixed. Next, the nozzle 31 in the injection molding device 30 is arranged at the gate 21 in the mold 20. Thereafter, as shown in Figure 1 As shown in (B), the screw 33 in the injection molding device 30 is moved toward the nozzle 31 side, and the second thermoplastic resin R2 filled in the cylinder 32 is filled into the space between the first resin portion 15 and the mold 20 (filling process). Next, a holding pressure is applied to the second thermoplastic resin R2 filled into the space (pressure holding process).

[0015] In a first embodiment, if Figure 1As shown in (B), the time (hereinafter referred to as time T1) until the internal temperature of the first resin portion 15 (for example, the temperature at a position P 1 mm from the surface S of the first resin portion 15) reaches the load deflection temperature of the first thermoplastic resin constituting the first resin portion 15 is estimated in advance by, for example, Computer Aided Engineering (CAE). Figure 2 As shown, in the pressure holding step, the first holding pressure is applied until the internal temperature of the first resin portion 15 reaches the deflection temperature under load of the first thermoplastic resin (until time T1 has passed from the start of the pressure holding), and after the internal temperature reaches the deflection temperature under load (after time T1 has passed from the start of the pressure holding), a second holding pressure lower than the first holding pressure is applied. Figure 1 As shown in (B) and (C), the molded body 100 is taken out from the mold 20. Figure 1 As shown in FIG. 2 (C), the molded body 100 includes at least a first resin portion 15 and a second resin portion 16 covering the surface of the first resin portion 15 .

[0016] According to the first embodiment, the first holding pressure is applied until the internal temperature of the first resin portion reaches the load deflection temperature of the first thermoplastic resin and then the second holding pressure lower than the first holding pressure is applied, thereby obtaining a molded body in which deformation of the insert component is suppressed.

[0017] Here, as described above, when injection molding is performed on an insert component having a resin portion containing a thermoplastic resin on its surface, the heat of the injected resin may be transferred to the resin portion, thereby softening the resin portion. If a high holding pressure is applied to the softened resin portion during the holding pressure process, the softened resin portion may deform, thereby deforming the insert component. Specifically, there are cases such as Figure 3 As shown, the heat of the injected second thermoplastic resin R2 is transferred to the first resin portion 15 to soften the first resin portion 15. If a high holding pressure is applied to the softened first resin portion 15 in the holding pressure step, the softened first resin portion 15 may deform and the insert component 10 may deform.

[0018] In contrast, in the first embodiment, if Figure 2 As shown, in the pressure holding step, the first holding pressure is applied until the internal temperature of the first resin portion 15 reaches the deflection temperature under load of the first thermoplastic resin (until time T1 has passed from the start of the pressure holding), and after the internal temperature reaches the deflection temperature under load (after time T1 has passed from the start of the pressure holding), a second holding pressure lower than the first holding pressure is applied. This can suppress the softened first resin portion 15 from being deformed by the holding pressure. As a result, deformation of the insert component 10 can be suppressed.

[0019] (1) Preparation process The preparation step in the first embodiment is a step of preparing an insert component having a first resin portion containing a first thermoplastic resin on its surface.

[0020] The embedded component in the first embodiment has at least a first resin portion containing a first thermoplastic resin. In addition, the first resin portion is usually configured in a manner constituting a surface of the embedded component. Among them, the first resin portion is preferably configured in a manner constituting a side surface of the embedded component (a surface extending in the thickness direction of the embedded component).

[0021] As an example of the first thermoplastic resin, polyolefins such as polyethylene (PE) and polypropylene (PP) can be cited. As polyethylene, for example, high-density polyethylene (HDPE) can be cited. The density of high-density polyethylene is, for example, 0.94 g / cm 3 Above 0.973g / cm 3 On the other hand, other examples of the first thermoplastic resin include polyvinyl chloride (PVC), polystyrene (PS), acrylonitrile-butadiene-styrene (ABS), acrylonitrile-styrene (AS), polymethyl methacrylate (PMMA), polybutylene terephthalate (PBT), and polyethylene terephthalate (PET).

[0022] The load deflection temperature of the first thermoplastic resin is not particularly limited, and is, for example, 60° C. to 100° C., or 70° C. to 90° C. The load deflection temperature is determined in accordance with JIS K 7191. The melting point of the first thermoplastic resin is, for example, 100° C. to 140° C., or 110° C. to 130° C.

[0023] The embedded component preferably has a base and a first resin portion arranged on the above-mentioned base. The base can include, for example, an electrode body having an electrode, a metal body made of metal, and a resin body made of resin. In addition, the shape of the embedded component observed from the thickness direction (top view shape) is not particularly limited, and can include, for example, quadrilaterals such as squares and rectangles; circles such as perfect circles and ellipses. The length of each side constituting the top view shape of the embedded component is not particularly limited, and can be, for example, 30 cm or more, 50 cm or more, or 100 cm or more. On the other hand, the lengths of the above-mentioned sides are, for example, less than 200 cm. In addition, the thickness of the embedded component is, for example, more than 5 cm and less than 30 cm. The larger the embedded component is, the larger the area of ​​the first resin portion in contact with the second thermoplastic resin described later is, so the deformation of the first resin portion is more likely to occur. In contrast, in the first embodiment, by controlling the holding pressure in the holding pressure process, the deformation of the first resin portion can be suppressed.

[0024] For an example of an embedded component, use Figure 4 (A) and (B) are explained. Figure 4 (A) is a schematic top view illustrating an embedded component. Figure 4 (B) is Figure 4 AA cross-sectional view of (A). In addition, Figure 4 The insert component 10 shown in (A) and (B) is an electrode body, and is typically a component used in a power storage module.

[0025] Figure 4 The embedded component 10 shown in (A) and (B) has an electrode body EB in which a plurality of electrodes E are stacked in the thickness direction D1, and a resin sealing portion 5 arranged along the outer edge of the electrode body EB. Figure 4 As shown in (A), when the embedded component 10 is viewed from the thickness direction, the sealing portion 5 is usually arranged along the entire periphery of the outer edge of the electrode E. In addition, the sealing portion 5 corresponds to the first resin portion 15 described above. Figure 4 The electrode body EB shown in (B) includes, as electrodes E, a bipolar electrode BP, a positive electrode side end electrode CA, and a negative electrode side end electrode AN.

[0026] The electrode E in the embedded component 10 has a current collector 1 and an active material layer (at least one of a positive electrode active material layer 2 and a negative electrode active material layer 3). Figure 4 As shown in (B), the bipolar electrode BP has a current collector 1, a positive electrode active material layer 2 arranged on one main surface of the current collector 1, and a negative electrode active material layer 3 arranged on the other main surface of the current collector 1. In addition, the positive electrode side end electrode CA has a current collector 1 and a positive electrode active material layer 2 arranged on one main surface of the current collector 1. In addition, the negative electrode side end electrode AN has a current collector 1 and a negative electrode active material layer 3 arranged on one main surface of the current collector 1.

[0027] like Figure 4 As shown in (B), the embedded component 10 may also have a plurality of power generation units U (U1, U2, U3) stacked in the thickness direction D1. The power generation unit is generally a unit having a positive electrode active material layer, a separator, and a negative electrode active material layer. As described later, by supplying an electrolyte to the power generation unit, it functions as a battery. Figure 4 As shown in (B), a plurality of power generation units U (U1, U2, U3) may be connected in series with each other. In addition, although not particularly shown, a plurality of power generation units may be connected in parallel with each other.

[0028] exist Figure 4In (B), the power generation unit U1 has a positive electrode active material layer 2 in the bipolar electrode BP1, a negative electrode active material layer 3 in the negative electrode side end electrode AN, and a separator 4 arranged therebetween. In addition, the power generation unit U2 has a positive electrode active material layer 2 in the bipolar electrode BP2, a negative electrode active material layer 3 in the bipolar electrode BP1, and a separator 4 arranged therebetween. In this way, a power generation unit can also be formed by two adjacent bipolar electrodes. In addition, the power generation unit U3 has a positive electrode active material layer 2 in the positive electrode side end electrode CA, a negative electrode active material layer 3 in the bipolar electrode BP2, and a separator 4 arranged therebetween.

[0029] Figure 4 The method for producing the embedded component 10 shown in (A) and (B) is not particularly limited, and examples thereof include Figure 5 The method shown in Figure 5 As shown in FIG. 1 , a plurality of electrode sheets ES are stacked in the thickness direction D1. Figure 5 In the embodiment, as the electrode sheet ES, an electrode sheet ES having a bipolar electrode BP, an electrode sheet ES having a positive electrode side end electrode CA, and an electrode sheet ES having a negative electrode side end electrode AN are used. In addition, each electrode sheet ES has an electrode E having a current collector 1 and an active material layer (positive electrode active material layer 2, negative electrode active material layer 3), and a resin frame 51 arranged along the outer edge of the current collector 1. The frame 51 covers a portion of one main surface p of the current collector 1, a portion of the other main surface q of the current collector 1, and the entire side surface r constituting the outer edge of the current collector 1.

[0030] exist Figure 5 In the embodiment, the negative electrode active material layer 3 in the bipolar electrode BP1 and the positive electrode active material layer 2 in the bipolar electrode BP2 are opposite to each other via the spacer 4. At this time, another frame 51 (separator 51a) is arranged between the frame 51 in the bipolar electrode BP1 and the frame 51 in the bipolar electrode BP2. Similarly, the positive electrode active material layer 2 in the bipolar electrode BP1 and the negative electrode active material layer 3 in the negative electrode side end electrode AN are opposite to each other via the spacer 4. At this time, another frame 51 (separator 51a) is arranged between the frame 51 in the bipolar electrode BP1 and the frame 51 in the negative electrode side end electrode AN. Similarly, the negative electrode active material layer 3 in the bipolar electrode BP2 and the positive electrode active material layer 2 in the positive electrode side end electrode CA are opposite to each other via the spacer 4. At this time, another frame 51 (separator 51a) is arranged between the frame 51 in the bipolar electrode BP2 and the frame 51 in the positive electrode side end electrode CA. By stacking a plurality of electrode sheets ES in the thickness direction D1 and fusing the adjacent frames 51 in the thickness direction D1, a sealing portion (eg Figure 1 The sealing part 5 in (A), (B) and (C).

[0031] Other examples of embedded components are not particularly limited, and include, for example, resin components, metal components, and composite components of resin and metal. As resin components, for example, sheets, plates, or three-dimensional objects made of at least one of resin and rubber can be mentioned. As metal components, for example, sheets, plates, or three-dimensional objects made of metal can be mentioned. As composite components of resin and metal, sheets, plates, or three-dimensional objects made of at least one of resin and rubber and metal can be mentioned. Specific examples of composite components of resin and metal include printed circuit boards and integrated circuits.

[0032] (2) Filling process The filling step in the first embodiment is a step of inserting the first resin portion of the insert component into a mold and fixing it, and filling the space between the first resin portion and the mold with the molten second thermoplastic resin using an injection molding device.

[0033] The second thermoplastic resin is the same as the first thermoplastic resin described above, so the description here is omitted. In addition, the second thermoplastic resin is preferably compatible with the first thermoplastic resin constituting the first resin portion. This is because the first resin portion and the second resin portion have good adhesion. The second thermoplastic resin and the first thermoplastic resin are preferably polyolefins, and more preferably polyethylenes.

[0034] like Figure 1 As shown in (A), the injection molding device 30 has a nozzle 31, a cylinder 32 connected to the nozzle 31, a screw 33 that can move in the internal space of the cylinder 32, and a hopper 34 that supplies raw materials to the cylinder 32. In addition, the screw 33 has a main body 33c, a head 33a, and a check ring 33b arranged between the main body 33c and the head 33a. The second thermoplastic resin R2 put into the hopper 34 falls into the heated cylinder 32. The second thermoplastic resin R2 dropped into the cylinder 32 is compressed and kneaded while being sent to the nozzle 31 side by the rotation of the screw 33, and the screw 33 retreats to the metering completion position. The temperature of the second thermoplastic resin R2 in the nozzle 31 is not particularly limited. For example, when the second thermoplastic resin R2 is polyethylene, it is preferably above 190°C and below 210°C.

[0035] like Figure 1 As shown in (B), the second thermoplastic resin R2 is injected from the nozzle 31 to the mold 20 by moving the screw 33 toward the nozzle 31. The screw 33 moves from the metering completion position to the VP switching position. The VP switching position is adjusted so that the filling amount becomes, for example, 0.85 or more and 0.95 or less relative to the target filling amount of the second thermoplastic resin R2. In addition, from the metering completion position to the VP switching position, it is usually controlled by the filling speed.

[0036] (3) Pressure holding process The pressure holding step in the first embodiment is a step of applying a holding pressure to the second thermoplastic resin filled in the space. In addition, the screw is moved from the VP switching position to the nozzle side by the holding pressure to perform the remaining filling of the second thermoplastic resin. By performing the pressure holding step, the second thermoplastic resin is prevented from flowing back from the mold, and by performing the remaining filling of the second thermoplastic resin, the volume reduction of the second thermoplastic resin accompanying cooling is compensated.

[0037] In the first embodiment, a first holding pressure is applied until the internal temperature of the first resin portion reaches the load deflection temperature of the first thermoplastic resin, and a second holding pressure lower than the first holding pressure is applied after the internal temperature reaches the load deflection temperature. The internal temperature of the first resin portion may be, for example, Figure 1 As shown in (B), for example, the temperature of the internal position P which is 1 mm or more and 5 mm or less from the surface S of the first resin portion 15. By controlling the holding pressure in this way, the softened first resin portion 15 can be prevented from being deformed by the holding pressure. As a result, the deformation of the embedded component 10 can be prevented.

[0038] The internal temperature of the first resin portion 15 is preferably estimated in advance using computer-aided engineering (CAE). Specifically, it is preferred to estimate in advance the time T1 from the start of the pressure holding process until the load deflection temperature of the first thermoplastic resin is reached. The first holding pressure is applied from the start of the pressure holding process until the time T1 has passed, and after the time T1 has passed, a second holding pressure that is lower than the first holding pressure is applied. In addition, the internal temperature of the first resin portion 15 can be measured by arranging a thermometer inside the first resin portion 15, and the first holding pressure is applied until the internal temperature of the first resin portion 15 reaches the load deflection temperature of the first thermoplastic resin, and the second holding pressure is applied after the internal temperature of the first resin portion 15 reaches the load deflection temperature of the first thermoplastic resin.

[0039] The difference between the first holding pressure and the second holding pressure is not particularly limited, and may be, for example, 0.1 MPa or more, 0.5 MPa or more, or 1.0 MPa or more. In addition, for example, when the first thermoplastic resin and the second thermoplastic resin are polyolefins, the first holding pressure is preferably 1.5 MPa or more, and the second holding pressure is less than 1.5 MPa.

[0040] (4) Molded body Through each of the above-mentioned steps, a formed body is obtained. The purpose of the formed body is not particularly limited, and it is preferably a component used in a power storage module. In the case where the formed body is a component used in a power storage module, an electrolyte is supplied to the interior of the obtained formed body and sealed to obtain a power storage module. As specific examples of power storage modules, secondary batteries (such as lithium-ion secondary batteries) and double-layer capacitors can be cited. In addition, as the purpose of the power storage module, power sources for vehicles such as hybrid electric vehicles (HEV), plug-in hybrid electric vehicles (PHEV), electric vehicles (BEV), gasoline vehicles, and diesel vehicles can be cited. It is particularly preferred to use it in a driving power supply for a hybrid electric vehicle (HEV), a plug-in hybrid electric vehicle (PHEV) or an electric vehicle (BEV). In addition, the power storage module can also be used as a power source for a mobile body other than a vehicle (such as a train, a ship, an airplane), and can also be used as a power source for electrical products such as an information processing device.

[0041] 2. Second Implementation Figure 1 (A), (B), and (C) are schematic cross-sectional views illustrating the preparation process, the filling process, and the pressure holding process in the present disclosure. Figure 1 As shown in (A), an insert component 10 having a first resin portion 15 containing a first thermoplastic resin on its surface is prepared (preparation step). Next, the first resin portion 15 in the insert component 10 is inserted into the mold 20 and fixed. Next, the nozzle 31 in the injection molding device 30 is arranged at the gate 21 in the mold 20. Thereafter, as shown in Figure 1 As shown in (B), the screw 33 in the injection molding device 30 is moved toward the nozzle 31 side, and the second thermoplastic resin R2 filled in the cylinder 32 is filled into the space between the first resin portion 15 and the mold 20 (filling process). Next, a holding pressure is applied to the second thermoplastic resin R2 filled into the space (pressure holding process).

[0042] In a second embodiment, if Figure 6 As shown in (A), the screw advance amount in the pressure holding process is considered. Figure 3 As shown in FIG. 1 , if the heat of the injected second thermoplastic resin R2 is transferred to the first resin portion 15 and the first resin portion 15 softens, the amount of advancement of the screw increases. Specifically, as Figure 6 As shown in (A), the slope of the screw's advancement increases with the change point C as the boundary. Figure 6 As shown in (B), the amount of advance of the screw per unit time (dL / dt) increases sharply with the change point C as the boundary. Figure 6As shown in (C), in the pressure holding process, the first holding pressure is applied until the advancement amount per unit time (dL / dt) of the screw reaches the changing point C (until time T2 has passed from the start of the pressure holding), and after dL / dt reaches the changing point C (after time T2 has passed from the start of the pressure holding), a second holding pressure lower than the first holding pressure is applied.

[0043] According to the second embodiment, a first holding pressure is applied until the amount of advancement per unit time (dL / dt) of the screw reaches a change point and then a second holding pressure lower than the first holding pressure is applied, thereby obtaining a molded body in which deformation of the insert component is suppressed.

[0044] (1) Preparation and filling process The preparation step and the filling step in the second embodiment are the same as those described in the first embodiment, and thus description thereof will be omitted here.

[0045] (2) Pressure holding process The pressure holding step in the second embodiment is a step of applying a holding pressure to the second thermoplastic resin filled in the space. Furthermore, the screw is moved from the VP switching position to the nozzle side by the holding pressure to perform the remaining filling of the second thermoplastic resin. By performing the pressure holding step, the second thermoplastic resin is prevented from flowing back from the mold, and by performing the remaining filling of the second thermoplastic resin, the volume reduction of the second thermoplastic resin accompanying cooling is compensated.

[0046] In the second embodiment, a first holding pressure is applied until the amount of advance per unit time (dL / dt) of the screw of the injection molding device reaches a change point, and a second holding pressure lower than the first holding pressure is applied after the dL / dt reaches the change point. The amount of advance of the screw can be measured, for example, by a displacement sensor. By controlling the holding pressure in this way, it is possible to suppress the softened first resin portion 15 from being deformed by the holding pressure. As a result, it is possible to suppress the deformation of the embedded component 10.

[0047] Since the amount of advance (dL / dt) increases sharply due to the change point C, it is preferred to switch from the first holding pressure to the second holding pressure when the increase in the amount of advance (dL / dt) exceeds a threshold value. In addition, the difference between the first holding pressure and the second holding pressure is the same as that described in the first embodiment, so the description here is omitted.

[0048] (3) Molded body The molded body obtained through the above-mentioned steps is the same as that described in the above-mentioned first embodiment, and thus the description thereof is omitted here.

[0049] The present disclosure is not limited to the above-mentioned embodiments. The above-mentioned embodiments are merely examples, and any technical solutions having substantially the same configuration and having the same functions and effects as the technical concepts described in the claims of the present disclosure are included in the technical scope of the present disclosure.

Claims

1. A method for producing a molded body, comprising: a preparation step of preparing an embedding component having a first resin portion containing a first thermoplastic resin on a surface thereof; a filling step of inserting the first resin portion in the insert component into a mold and fixing it, and filling a molten second thermoplastic resin into a space between the first resin portion and the mold using an injection molding device; and a pressure holding step of applying a holding pressure to the second thermoplastic resin filled in the space, in, In the pressure holding step, a first holding pressure is applied until the internal temperature of the first resin portion reaches the deflection temperature under load of the first thermoplastic resin, and a second holding pressure lower than the first holding pressure is applied after the internal temperature reaches the deflection temperature under load.

2. A method for producing a molded body, comprising: a preparation step of preparing an embedding component having a first resin portion containing a first thermoplastic resin on a surface thereof; a filling step of inserting the first resin portion in the insert component into a mold and fixing it, and filling a molten second thermoplastic resin into a space between the first resin portion and the mold using an injection molding device; and a pressure holding step of applying a holding pressure to the second thermoplastic resin filled in the space, in, In the holding pressure step, a first holding pressure is applied until the amount of advancement per unit time dL / dt of the screw of the injection molding device reaches a change point, and a second holding pressure lower than the first holding pressure is applied after the dL / dt reaches the change point.

3. The method for producing a molded body according to claim 1 or 2, wherein: The first thermoplastic resin and the second thermoplastic resin are polyolefins, respectively. The first holding pressure is 1.5 MPa or more, The second maintaining pressure is less than 1.5 MPa.

4. The method for producing a molded body according to claim 1 or 2, wherein: The molded body is a component used in a power storage module. The embedding component includes an electrode body in which a plurality of electrodes are stacked in a thickness direction, and a resin sealing portion arranged along an outer edge of the electrode body. The electrode comprises a current collector and an active material layer. The sealing portion is the first resin portion.

5. The method for producing a molded body according to claim 4, wherein: The electrode body has a bipolar electrode as the electrode.

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