Synthetic jet exciter, MEMS device and preparation method of synthetic jet exciter

Abstract

The invention relates to the technical field of semiconductors, particularly provides a synthetic jet exciter, an MEMS device and a preparation method of the synthetic jet exciter, and aims to solve the problem that an existing synthetic jet exciter is difficult to miniaturize. To this end, the present invention provides a synthetic jet exciter comprising: a first glass substrate comprising a first side wall and a cavity surrounded by the first side wall, the cavity having a first opening; the vibrating diaphragm is arranged on one side, opposite to the first opening, of the first glass substrate and comprises a second opening opposite to the first opening; and the piezoelectric vibrator is arranged on the surface, far away from the first glass substrate, of the vibrating diaphragm. Under the condition that the technical scheme is adopted, the miniaturized synthetic jet exciter can be provided so as to meet the heat dissipation requirement of an MEMS (Micro-Electro-Mechanical System) device.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and specifically provides a synthetic jet actuator, a MEMS device and a method for preparing the synthetic jet actuator. Background Art

[0002] With the rapid development of integration and miniaturization technology of microelectronic products, electronic components are evolving towards high performance, miniaturization and long life. The system integration of microelectronic products is constantly improving, and heat dissipation has become a major bottleneck in the development of many high-tech fields. At present, the heat flux density of some microsystems has reached 10 6 -10 7 W / m 2 Especially for high-power electronic components, the heat dissipation demand is more urgent. Miniaturization, energy consumption and heat dissipation issues have become the main obstacles restricting the rapid development of chip performance.

[0003] As the core driving force of economic development, the information industry has seen the emergence of various new high-power heat flux devices, which has greatly increased the output value. However, the increase in heat dissipation per unit volume of electronic devices leads to increased temperature, which in turn causes problems with system reliability and safety, seriously hindering the further development of components. Therefore, heat dissipation technology has gradually become the focus of research in the field of power electronics applications. As components develop towards high performance and compactness, the demand for effective heat dissipation is also increasing, and this demand will become increasingly important in the future. Therefore, the development of efficient cooling systems and high-performance thermal control technologies has become an urgent issue to be solved.

[0004] At present, traditional heat dissipation technologies such as air-cooled fin heat sinks, heat pipes, liquid cooling, etc., face natural limitations in terms of low weight and small size, and it is difficult to meet the development requirements of miniaturization and high integration.

[0005] Micro-Electro-Mechanical System (MEMS) is an advanced industrial technology that combines microelectronics and micromechanical technologies at the millimeter, micron or even nanometer scale to achieve high precision, high integration and other requirements. As one of the most important sub-fields in MEMS, the Synthetic Jet Actuator (SJA) plays an important role in the quantitative and directional delivery of fluids in MEMS, and has lightweight, compact and efficient heat exchange capabilities. Therefore, the cooling technology combining synthetic jets with radiators shows excellent heat dissipation performance and has become a very promising heat dissipation method.

[0006] However, the existing synthetic jet heat exchange device mainly adopts mechanical assembly, including components such as cover plate, piezoelectric vibrator, cavity, outlet plate, etc., but it still has shortcomings in terms of low weight and small volume, and it is difficult to meet the needs of miniaturized processing functional devices. Accordingly, a new synthetic jet actuator solution is needed in the field to solve the above problems. Summary of the invention

[0007] The present invention aims to solve the above technical problem, that is, to solve the problem that the existing synthetic jet actuator is difficult to miniaturize.

[0008] In a first aspect, the present invention provides a synthetic jet actuator, comprising:

[0009] A first glass substrate comprising a first sidewall and a cavity surrounded by the first sidewall, wherein the cavity has a first opening;

[0010] a diaphragm, disposed on a side of the first glass substrate opposite to the first opening, and comprising a second opening opposite to the first opening;

[0011] The piezoelectric vibrator is arranged on a surface of the vibrating membrane away from the first glass substrate.

[0012] In one technical solution of the synthetic jet actuator, the diaphragm comprises:

[0013] A cantilever structure extending from the first side wall toward the cavity;

[0014] A first electrode disposed on the cantilever structure;

[0015] A dielectric structure is disposed on the first electrode.

[0016] In a technical solution of the synthetic jet actuator, the following is also included:

[0017] A second electrode is disposed on a surface of the diaphragm away from the first glass substrate to supply power to the piezoelectric vibrator.

[0018] In a technical solution of the synthetic jet actuator, the material of the cantilever structure is polyimide.

[0019] In a technical solution of the synthetic jet actuator, the first glass substrate further includes an extension portion extending from the first side wall toward the cavity, and the extension portion constitutes the cantilever structure.

[0020] In one technical solution of the synthetic jet actuator,

[0021] The material of the first electrode is Cu or Mo;

[0022] The material of the second electrode is Ag.

[0023] In a technical solution of the synthetic jet actuator, the invention further comprises:

[0024] The first heat-conducting layer is at least arranged on a surface of the first side wall adjacent to the cavity.

[0025] In a technical solution of the synthetic jet actuator, the invention further comprises:

[0026] A second glass substrate comprising a second side wall and at least one through hole surrounded by the second side wall;

[0027] A second heat-conducting layer is at least disposed on the second side wall,

[0028] Wherein, the second glass substrate is disposed on the first opening side of the first glass substrate.

[0029] In one technical solution of the synthetic jet actuator, the second heat conductive layer covers the surface of the second glass substrate.

[0030] In a technical solution of the synthetic jet actuator, the second heat conductive layer also fills the through hole.

[0031] In a second aspect, the present application provides a MEMS device, comprising:

[0032] An array of synthetic jet actuators according to any of the above technical solutions;

[0033] a first metal trace along a first direction; and

[0034] a second metal trace along a second direction,

[0035] The synthetic jet actuators are powered by a first electrode and a second electrode, the first electrodes of adjacent synthetic jet actuators in a first direction are connected in series by a first metal trace, and the second electrodes of adjacent synthetic jet actuators in a second direction are connected in series by a second metal trace.

[0036] In a third aspect, the present application provides a method for preparing a synthetic jet actuator, comprising:

[0037] forming a diaphragm on one side of the first glass substrate, wherein the diaphragm comprises a second opening;

[0038] forming a cavity on a side of the first glass substrate opposite to the opening of the diaphragm, wherein the cavity is surrounded by a first side wall of the first glass substrate and has a first opening opposite to the second opening;

[0039] A piezoelectric vibrator is formed on a surface of the vibrating membrane away from the first glass substrate.

[0040] In a technical solution of the method for preparing the synthetic jet actuator, the method further includes: forming a second electrode on a surface of the diaphragm away from the first glass substrate to supply power to the piezoelectric vibrator.

[0041] In one technical solution of the method for preparing the synthetic jet actuator, the method further comprises:

[0042] forming a second glass substrate, wherein the second glass substrate is formed to include a second sidewall and at least one through hole surrounded by the second sidewall;

[0043] forming a heat-conducting layer, at least disposed on the second side wall;

[0044] The first glass substrate and a second glass substrate are bonded together, wherein the second glass substrate is located on the first opening side of the first glass substrate.

[0045] When the above technical solution is adopted, the present invention can provide a miniaturized synthetic jet actuator to meet the heat dissipation requirements of the MEMS device. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings, in which:

[0047] Figure 1 is a schematic diagram of a synthetic jet actuator according to one embodiment of the present application;

[0048] Figure 2 is a schematic diagram of a synthetic jet actuator according to another embodiment of the present application;

[0049] Figure 3 is a schematic diagram of setting a first heat-conducting layer according to a synthetic jet actuator in one embodiment of the present application;

[0050] Figure 4 is a partial schematic diagram of a synthetic jet actuator according to another embodiment of the present application;

[0051] Figure 5 It is a schematic diagram of the cooperation between the first glass substrate and the second glass substrate of the synthetic jet actuator according to one embodiment of the present application;

[0052] Figure 6 is a schematic diagram of the cooperation between the first glass substrate and the second glass substrate of a synthetic jet actuator according to another embodiment of the present application;

[0053] Figure 7 is a schematic diagram of a method for preparing a synthetic jet actuator according to an embodiment of the present application;

[0054] Figure 8is a top view of a synthetic jet actuator according to an embodiment of the present application;

[0055] Figures 9A-9F is realized Figure 1 A schematic cross-sectional view of the preparation process of the structure shown;

[0056] Figures 10A-10E is realized Figure 2 A schematic cross-sectional view of the preparation process of the structure shown;

[0057] Fig.11 is a top view corresponding to a process for preparing a second glass substrate according to an embodiment of the present application;

[0058] Figures 12A-12C It is a cross-sectional schematic diagram corresponding to the process of preparing the second glass substrate according to the embodiment of the present application. DETAILED DESCRIPTION

[0059] Some embodiments of the present application are described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are only used to explain the technical principles of the present application and are not intended to limit the protection scope of the present application.

[0060] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme of the embodiments of the present application will be clearly and completely described below in conjunction with the drawings of the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the described embodiments of the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0061] Unless otherwise defined, the technical terms or scientific terms used in this application should be understood by people with ordinary skills in the field to which this application belongs. "First", "second" and similar words used in this application do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0062] In order to solve the problem that existing synthetic jet actuators are difficult to miniaturize, the present application provides a synthetic jet actuator.

[0063] In a specific implementation of this application, please refer to the attached Figure 1 , Figure 1 is a schematic diagram of a synthetic jet actuator according to one embodiment of the present application.

[0064] The synthetic jet actuator comprises:

[0065] A first glass substrate 10, comprising a first side wall 11 and a cavity 12 surrounded by the first side wall 11, wherein the cavity 12 has a first opening 13;

[0066] a diaphragm 14, disposed on a side of the first glass substrate 10 opposite to the first opening 13, and including a second opening 15 opposite to the first opening 13;

[0067] The piezoelectric vibrator 16 is disposed on a surface of the vibrating membrane 14 away from the first glass substrate 10 .

[0068] Furthermore, in this embodiment, the diaphragm 14 includes:

[0069] A cantilever structure 104 extending from the first side wall 11 toward the cavity 12;

[0070] A first electrode 105 disposed on the cantilever structure 104;

[0071] A dielectric structure 106 is disposed on the first electrode 105 .

[0072] Furthermore, the synthetic jet actuator further comprises:

[0073] A second electrode 107 (not shown) is disposed on the surface of the diaphragm 14 away from the first glass substrate 10. Figure 1 As shown), for example, the first electrode 105 and the second electrode 107 are arranged in a cross form to supply power to the piezoelectric vibrator 16.

[0074] Preferably, the cantilever structure 104 is made of polyimide (PI).

[0075] Optionally, the material of the first electrode 105 is Cu (copper) or Mo (molybdenum); the material of the second electrode 107 is Ag (silver).

[0076] Optionally, the dielectric structure 106 is made of dielectric material, such as silicon oxide, silicon nitride or silicon oxynitride.

[0077] In order to further simplify the preparation process, this application provides another embodiment, please refer to the attached Figure 2 . Figure 2 It is a schematic diagram of a synthetic jet actuator according to another embodiment of the present application.

[0078] In this embodiment, the synthetic jet actuator comprises:

[0079] A first glass substrate 20, comprising a first side wall 21 and a cavity 22 surrounded by the first side wall 21, wherein the cavity 22 has a first opening 23;

[0080] a diaphragm 24 disposed on a side of the first glass substrate 20 opposite to the first opening 23 and including a second opening 25 opposite to the first opening 23;

[0081] The piezoelectric vibrator 26 is disposed on a surface of the vibrating membrane 24 away from the first glass substrate 20 .

[0082] In this embodiment, the diaphragm 24 includes:

[0083] A cantilever structure 204 extending from the first side wall 21 toward the cavity 22 , wherein the first glass substrate 20 has an extension portion extending from the first side wall 21 toward the cavity 22 , and the extension portion constitutes the cantilever structure 204 ;

[0084] A first electrode 205 disposed on the cantilever structure 204;

[0085] A dielectric structure 206 is disposed on the first electrode 205 .

[0086] Furthermore, the synthetic jet actuator further comprises:

[0087] The second electrode 207 (not shown) is disposed on the surface of the diaphragm 24 away from the first glass substrate 20. Figure 2 As shown), for example, the first electrode 205 and the second electrode 207 are arranged in a cross form to supply power to the piezoelectric vibrator 26.

[0088] Optionally, the material of the first electrode 205 is Cu or Mo; the material of the second electrode 207 is Ag.

[0089] Optionally, the material of the dielectric structure 206 is silicon oxide, silicon nitride or silicon oxynitride.

[0090] The first opening side of the synthetic jet actuator is arranged on a heat source such as a CPU to dissipate heat from the heat source.

[0091] Furthermore, in one embodiment of the present application, based on the above structure, the synthetic jet actuator further includes:

[0092] The first heat conducting layer 17, such as Figure 3As shown, it is at least arranged on the surface of the first side wall 11 adjacent to the cavity 12. Preferably, the first heat-conducting layer 17 is also arranged on the bottom wall of the cavity; more preferably, the first heat-conducting layer 17 is also arranged on the side wall of the second opening 15. It should be noted that, Figure 3 Only Figure 1 The structure shown is based on the first heat conducting layer, but those skilled in the art can understand that Figure 2 A first heat-conducting layer may also exist on the basis of the structure shown, that is, the first heat-conducting layer may be provided in any of the above-mentioned synthetic jet actuators to further improve the thermal conductivity of the synthetic jet actuator.

[0093] The synthetic jet actuator described above can satisfy the heat dissipation requirements of MEMS, but in order to further improve the heat exchange capacity, the present application provides the following implementation method for setting a heat-conducting structure.

[0094] In order to further improve the heat dissipation capability of the synthetic jet actuator, the present application provides another embodiment. Figure 4 . Figure 4 It is a partial schematic diagram of a synthetic jet actuator according to another embodiment of the present application.

[0095] The synthetic jet actuator further comprises:

[0096] A second glass substrate 30, comprising a second side wall 31 and at least one through hole 32 surrounded by the second side wall;

[0097] The second heat-conducting layer 33 is at least disposed on the second side wall 31; preferably, the second heat-conducting layer 33 covers the surface of the second glass substrate 30. More preferably, Figure 6 As shown, the second heat conducting layer 53 also fills the through hole 52 .

[0098] like Figure 5 and Figure 6 As shown, when used in conjunction with the first glass substrate, the second glass substrate is disposed on the first opening side of the first glass substrate.

[0099] In this embodiment, the other side of the second glass substrate is disposed on a heat source such as a CPU to dissipate heat from the heat source.

[0100] It should be noted that the above Figure 5 and Figure 6 All are based on Figure 1 However, those skilled in the art will appreciate that the structure of the second glass substrate is also applicable to Figure 2 or Figure 3 The structure of is not described here.

[0101] In order to obtain the structure of the synthetic jet actuator described in this embodiment, the present application also provides a method for preparing the synthetic jet actuator. Figure 7 . Figure 7 Schematic diagram of a method for preparing a synthetic jet actuator according to an embodiment of the present application, wherein the method at least includes the following steps S1 to S3:

[0102] Step S1, forming a diaphragm on one side of a first glass substrate, wherein the diaphragm includes a second opening;

[0103] Step S2, forming a cavity on a side of the first glass substrate opposite to the opening of the diaphragm, wherein the cavity is surrounded by a first side wall of the first glass substrate and has a first opening opposite to the second opening;

[0104] Step S3, forming a piezoelectric vibrator on a surface of the diaphragm away from the first glass substrate.

[0105] Furthermore, the method further includes: forming a second electrode on a surface of the diaphragm away from the first glass substrate to supply power to the piezoelectric vibrator.

[0106] For details, please refer to the attached Figure 8 and Figures 9A-9F ,in, Figure 8 for Figure 1 The top view of the structure corresponding to the preparation process of the structure shown, Figures 9A-9F is a cross-sectional schematic diagram. Figures 9A-9E 2F is a cross-sectional view cut along AA', and 2F is a cross-sectional view cut along BB'. The process specifically includes:

[0107] Step S11, as Fig.9A As shown, a glass substrate 100 is provided, and a polyimide layer 101 is formed on the glass substrate 100 .

[0108] Step S12, as Fig. 9B As shown, a first electrode layer 102 and a first mask layer 103 are formed on the polyimide layer 101; the material of the first electrode layer 102 is Cu or Mo.

[0109] Step S13, as Fig. 9C As shown, the first electrode layer 102 is etched using the first mask layer 103 as a mask to form a first electrode 105 ; and the polyimide layer 101 is etched to form a cantilever structure 104 .

[0110] Step S14, as Fig.9D As shown, a dielectric material is deposited on the first electrode 105 and patterned to form a dielectric structure 106, and an opening 15 is provided on the surface of the dielectric structure 106;

[0111] Still Fig.9D As shown, the glass substrate 100 is etched from the other side to form a first glass substrate 10 with an opening. Specifically, the first glass substrate 10 includes a first sidewall 11 and a cavity 12 surrounded by the first sidewall 11 , wherein the cavity 12 has an opening 13 opposite to the opening 15 .

[0112] After the cavity 12 is formed, the cantilever structure 104 extends from the first side wall 11 toward the cavity 12 . The cantilever structure 104 , the first electrode 105 and the dielectric structure 106 together constitute the diaphragm 14 . Please refer to step S1 and step S2 .

[0113] Step S15, as Fig.9E As shown, a piezoelectric vibrator 16 is bonded to the surface of the diaphragm 14 away from the first glass substrate 10; please refer to step S3. In one embodiment, the piezoelectric vibrator 16 is annular, and the hollow position of the annular shape corresponds to the opening 15; in other embodiments of the present application, the piezoelectric vibrator 16 can also be other shapes and can be arranged near the opening 15.

[0114] Step S16, Fig.9F As shown, a second electrode 107 is formed on the surface of the diaphragm 14 away from the first glass substrate 10 , for example, wherein the first electrode 105 and the second electrode 107 are cross-arranged (ie, the extension directions of the first electrode and the second electrode intersect) to supply power to the piezoelectric vibrator 16 .

[0115] Preferably, the glass substrate is processed by etching using a TGV (Through Glass Via) process.

[0116] Glass substrates processed by TGV process can be micro-drilled and used for subsequent metal electroplating. It can effectively prepare micro-sized synthetic jet actuators to meet the heat dissipation requirements of microelectronic products.

[0117] In another preparation method embodiment, please refer to the attached Figures 10A-10E , Figures 10A-10E is realized Figure 2 The cross-sectional schematic diagram of the preparation process of the structure shown in FIG. Figures 10A-10D 10A is a cross-sectional view taken along AA', and 10E is a cross-sectional view taken along BB'.

[0118] Step S21, as Fig. 10A As shown, a glass substrate 200 is provided, and a first electrode layer 202 and a first mask layer 203 are formed on the glass substrate 200; the material of the first electrode layer 202 is Cu or Mo.

[0119] Step S22, as Fig. 10B As shown, the first mask layer 203 is used as a mask to etch the first electrode layer 202 to form a first electrode 205 .

[0120] Step S23, as Fig. 10C As shown, a dielectric material is deposited on the first electrode 205, and a dielectric structure 206 is formed by patterning, and an opening 25 is provided on the surface of the dielectric structure 206;

[0121] Still refer to Fig. 10C , the glass substrate 200 is etched on the other side to form a first glass substrate 20 with an opening, that is, the first glass substrate 20 includes a first sidewall 21 and a cavity 22 surrounded by the first sidewall 21, wherein the cavity 22 has an opening 23 opposite to the opening 25.

[0122] In this embodiment, while the cavity 22 is formed, a cantilever structure 204 extending from the first side wall 21 toward the cavity 22 is formed, that is, during the process of etching the glass substrate 200, a portion close to the first electrode 205 is retained to form a cantilever structure (also called an eaves structure); wherein the cantilever structure 204, the first electrode 205 and the dielectric structure 206 together constitute the diaphragm 24, please refer to step S1 and step S2.

[0123] Step S24, as Fig. 10D As shown, a piezoelectric vibrator 26 is bonded to the surface of the diaphragm 24 away from the first glass substrate 20, please refer to step S3. In one embodiment, the piezoelectric vibrator 26 is annular, and the hollow position of the annular shape corresponds to the second opening 25; in other embodiments of the present application, the piezoelectric vibrator 26 can also be other shapes and can be arranged near the opening 25.

[0124] Step S25, as Fig.10E As shown, a second electrode 207 is formed on the surface of the diaphragm 24 away from the first glass substrate 20 , for example, wherein the first electrode 205 and the second electrode 207 are arranged crosswise to supply power to the piezoelectric vibrator 26 .

[0125] Furthermore, in another preparation method embodiment, the preparation method of the synthetic jet actuator further includes:

[0126] forming a second glass substrate, wherein the second glass substrate is formed to include a second sidewall and at least one through hole surrounded by the second sidewall;

[0127] forming a heat-conducting layer, at least disposed on the second side wall;

[0128] The first glass substrate and a second glass substrate are bonded together, wherein the second glass substrate is located on the first opening side of the first glass substrate.

[0129] Please refer to the attached Fig.11 and Figures 12A-12C . Fig.11 and Figures 12A-12C It is a top view and a cross-sectional schematic diagram corresponding to the process of preparing the second glass substrate according to the embodiment of the present application.

[0130] Step S31, as Fig. 12A As shown, a glass substrate is provided, and a second glass substrate 40 is formed by etching, comprising a second side wall 41 and at least one through hole 42 surrounded by the second side wall 41;

[0131] Step S32, as Fig. 12B As shown, a metal seed layer 401 is deposited around the second glass substrate 40 , and the metal seed layer 401 covers the surface of the second glass substrate 40 .

[0132] Step S33, as Fig. 12C As shown, the second glass substrate 40 is electroplated to form a second heat conducting layer 43 .

[0133] After the above steps S31 to S33 are completed, the heat conduction structure of the embodiment of the present application is obtained.

[0134] Furthermore, by bonding the second glass substrate 40 to the first glass substrate and arranging it on the opening side of the first glass substrate, a synthetic jet actuator with better heat dissipation performance can be obtained. Figure 5 or Figure 6 shown.

[0135] Those skilled in the art should be aware that the synthetic jet actuator is not limited to the structures and combinations provided in the drawings, and the second glass substrate in any of the above embodiments can be used in combination with the first glass substrate in any of the embodiments to achieve the purpose of enhancing thermal conductivity.

[0136] Furthermore, the present application also provides a MEMS device.

[0137] The MEMS device comprises:

[0138] The synthetic jet actuators according to any of the above technical solutions are arranged in an array, wherein, on the one hand, the synthetic jet actuators can be Figure 1 The structure shown can also be Figure 2 On the other hand, the synthetic jet actuator may include only the first glass substrate, or may also include Figure 4 The second glass substrate is shown.

[0139] A first metal trace 81 along a first direction (AA'), such as Figure 8 as shown; and

[0140] A second metal trace 82 along a second direction (BB′).

[0141] The synthetic jet actuators are powered by a first electrode and a second electrode, the first electrodes of adjacent synthetic jet actuators in a first direction are connected in series by a first metal trace, and the second electrodes of adjacent synthetic jet actuators in a second direction are connected in series by a second metal trace.

[0142] When the above technical solution is adopted, the present invention can provide a miniaturized synthetic jet actuator to meet the heat dissipation requirements of MEMS devices, so as to achieve the development of high-precision and high-integration microelectronic products.

[0143] So far, the technical solutions of the present invention have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is easy for those skilled in the art to understand that the protection scope of the present invention is obviously not limited to these specific embodiments. Without departing from the principle of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present invention.

Claims

1. A synthetic jet actuator, characterized in that: include: A first glass substrate comprising a first sidewall and a cavity surrounded by the first sidewall, wherein the cavity has a first opening; a diaphragm, disposed on a side of the first glass substrate opposite to the first opening, and comprising a second opening opposite to the first opening; The piezoelectric vibrator is arranged on a surface of the vibrating membrane away from the first glass substrate.

2. The synthetic jet actuator according to claim 1, characterized in that: The diaphragm comprises: A cantilever structure extending from the first side wall toward the cavity; A first electrode disposed on the cantilever structure; A dielectric structure is disposed on the first electrode.

3. The synthetic jet actuator according to claim 2, characterized in that: Also includes: A second electrode is disposed on a surface of the diaphragm away from the first glass substrate to supply power to the piezoelectric vibrator.

4. The synthetic jet actuator according to claim 2, characterized in that: The material of the cantilever structure is polyimide.

5. The synthetic jet actuator according to claim 2, characterized in that: The first glass substrate further includes an extension portion extending from the first side wall toward the cavity, and the extension portion constitutes the cantilever structure.

6. The synthetic jet actuator according to claim 3, characterized in that: The material of the first electrode is Cu or Mo; The material of the second electrode is Ag.

7. The synthetic jet actuator according to claim 1, characterized in that: Also includes: The first heat-conducting layer is at least arranged on a surface of the first side wall adjacent to the cavity.

8. The synthetic jet actuator according to any one of claims 1 to 7, characterized in that: Also includes: A second glass substrate comprising a second side wall and at least one through hole surrounded by the second side wall; A second heat-conducting layer is at least disposed on the second side wall, Wherein, the second glass substrate is arranged on the first opening side of the first glass substrate.

9. The synthetic jet actuator according to claim 8, characterized in that: The second heat-conducting layer covers the surface of the second glass substrate.

10. The synthetic jet actuator according to claim 9, characterized in that: The second heat conducting layer also fills the through hole.

11. A MEMS device, characterized in that: include: The synthetic jet actuators arranged in an array according to any one of claims 1 to 10; a first metal trace along a first direction; as well as a second metal trace along a second direction, The synthetic jet actuators are powered by a first electrode and a second electrode, the first electrodes of adjacent synthetic jet actuators in a first direction are connected in series by a first metal trace, and the second electrodes of adjacent synthetic jet actuators in a second direction are connected in series by a second metal trace.

12. A method for preparing a synthetic jet actuator, characterized in that: include: forming a diaphragm on one side of the first glass substrate, wherein the diaphragm comprises a second opening; forming a cavity on a side of the first glass substrate opposite to the opening of the diaphragm, wherein the cavity is surrounded by a first side wall of the first glass substrate and has a first opening opposite to the second opening; A piezoelectric vibrator is formed on a surface of the vibrating membrane away from the first glass substrate.

13. The method according to claim 12, characterized in that The method further includes: forming a second electrode on a surface of the diaphragm away from the first glass substrate to supply power to the piezoelectric vibrator.

14. The method according to claim 12 or 13, characterized in that The method further comprises: forming a second glass substrate, wherein the second glass substrate is formed to include a second sidewall and at least one through hole surrounded by the second sidewall; forming a heat-conducting layer, at least disposed on the second side wall; The first glass substrate and a second glass substrate are bonded together, wherein the second glass substrate is located on the first opening side of the first glass substrate.

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