Out-of-plane high-thermal-conductivity composite material and preparation method thereof

Abstract

According to the out-of-plane high-thermal-conductivity composite material and the preparation method thereof provided by the invention, a medium cut fiber and short cut fiber mixing method is adopted, so that the conduction path of heat in the out-of-plane direction is increased, the out-of-plane thermal conductivity coefficient is improved, meanwhile, the composite material is endowed with certain physical and mechanical properties, and the structural strength of the composite material is improved. Besides, the polymer matrix and the curing agent are dissolved in the low-volatility solvent and then mixed with the carbon fibers, so that the glue content can be well controlled, the resin content in the carbon fiber composite product is reduced, fiber lap joint is promoted, the thickness of a resin layer is reduced, and the thermal resistance is reduced. According to the invention, chopped fiber mixing belongs to disordered mixing, and the gel content can be controlled by mixing the polymer matrix with the chopped fibers, so that the heat conductivity coefficient of the composite material is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of thermally conductive composite materials, and in particular relates to an out-of-plane high thermal conductive composite material and a preparation method thereof. Background Art

[0002] As the density of electronic devices gradually increases, the heat generated by electronic devices accumulates rapidly. In order to ensure that electronic devices work reliably for a long time, the operating temperature of the devices must be prevented from rising. Therefore, heat dissipation capacity becomes an important factor affecting the service life of electronic devices. Generally speaking, as an external protective part of electronic devices, due to the out-of-plane direction, large area and thin thickness, it is the main direction of crystal heat dissipation. The size of the out-of-plane thermal conductivity directly affects the application of composite products in the external protective parts of electronic devices.

[0003] Carbon fiber has excellent properties such as low expansion coefficient, high specific strength, high temperature resistance, friction resistance, corrosion resistance, thermal conductivity, and electrical conductivity. The thermal conductivity of carbon fiber mainly depends on the degree of graphitization of the carbon fiber itself and the fiber orientation direction. The higher the degree of graphitization, the better the thermal conductivity. The thermal conductivity along the axial direction is much greater than the radial thermal conductivity. After the carbon fiber is compounded with resin, its in-plane and out-of-plane thermal conductivity are greatly reduced. This is because the resin is a poor conductor of heat, and its thermal conductivity is generally not more than 0.2W / m·K. The resin is filled between the fibers, the interface thermal resistance increases, and the thermal diffusion capacity decreases. The higher the resin content, the thicker the resin layer between the fibers, and the lower the thermal conductivity.

[0004] At present, the research on improving the out-of-plane thermal conductivity of carbon fiber composites at home and abroad mainly focuses on three-dimensional weaving and longitudinal arrangement of fillers. The process is complicated and the cost is high, which is not conducive to engineering promotion. Summary of the invention

[0005] In order to solve the above problems existing in the prior art, the present invention provides an out-of-plane high thermal conductivity composite material and a preparation method thereof. The technical problem to be solved by the present invention is achieved by the following technical solutions:

[0006] In a first aspect, the present invention provides a method for preparing an out-of-plane high thermal conductivity composite material, comprising:

[0007] S100, weighing a polymer matrix, a curing agent and an internal release agent, and placing them in a beaker, adding a certain amount of a low-volatile solvent, and then sealing and standing to dissolve until no solid resin remains in the solution to obtain a resin solution;

[0008] S200, placing the thermally conductive chopped fibers in a resin solution and performing ultrasonic dispersion to obtain a dispersion resin solution;

[0009] S300, placing the middle-cut carbon fiber in a tray covered with a PE film, pouring the dispersion resin solution into the tray in multiple times, and kneading the middle-cut carbon fiber to make it fully mixed with the dispersion resin solution poured each time, so as to obtain a preliminary prepreg;

[0010] S400, placing the preliminary prepreg in a vacuum oven for drying until the solvent in the preliminary prepreg is completely evaporated to obtain a fiber prepreg;

[0011] S500, placing the fiber prepreg into a molding die for curing to obtain an out-of-plane high thermal conductivity carbon fiber composite material.

[0012] Optionally, the out-of-plane high thermal conductivity composite material contains a middle-cut carbon fiber with a mass fraction of 50% to 80%, a thermally conductive chopped fiber with a mass fraction of 0 to 30%, a polymer matrix with a mass fraction of 20% to 30%, a curing agent with a mass fraction of 5% to 40%, and an internal release agent with a mass fraction of 0.1% to 0.5%.

[0013] Optionally, the middle-cut carbon fiber is any one of high modulus carbon fibers of specifications of M40J, M50J, M40, and M50, with a diameter of 5 to 10 μm and a length of 200 to 500 mm.

[0014] Optionally, the thermally conductive chopped fibers are mesophase asphalt-based carbon fibers with a diameter of 5 to 10 μm and a length of 25 to 200 μm.

[0015] Optionally, the polymer matrix is ​​a mixture of one or more of bisphenol A epoxy resins of types E-51 and E-20 or phenolic epoxy resins of types F-44 and F-51.

[0016] Optionally, the curing agent is a mixture of one or more of diaminodiphenylmethane, diaminodiphenyl sulfone and methyltetrahydrophthalic anhydride.

[0017] Optionally, the internal release agent is a mixture of one or more of zinc stearate, calcium stearate and magnesium stearate.

[0018] Optionally, the low volatility solvent is a mixture of one or more of acetone, ethanol, chloroform and ethyl acetate.

[0019] Optionally, the ultrasonic dispersion time in S200 is 30 minutes, the vacuum oven temperature during drying in S400 is 60 to 80° C., and the vacuum drying time is 1 to 3 hours.

[0020] In a second aspect, the present invention provides an out-of-plane high thermal conductivity composite material, which is prepared using the preparation method of the out-of-plane high thermal conductivity composite material described in the first aspect.

[0021] Beneficial effects:

[0022] 1) The present invention increases the heat conduction path in the out-of-plane direction by mixing the medium-cut fibers with the short-cut fibers, thereby improving the out-of-plane thermal conductivity and giving the composite material certain physical and mechanical properties, thereby improving its structural strength.

[0023] 2) The present invention dissolves the polymer matrix and the curing agent in a low-volatile solvent and then mixes them with the carbon fiber, so as to control the glue content well, reduce the resin content in the carbon fiber composite product, promote fiber overlap, reduce the thickness of the resin layer, and reduce thermal resistance.

[0024] 3) The preparation method of the present invention is simple, convenient and easy to promote.

[0025] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of a method for preparing an out-of-plane high thermal conductivity composite material provided by the present invention. DETAILED DESCRIPTION

[0027] The present invention is further described in detail below with reference to specific embodiments, but the embodiments of the present invention are not limited thereto.

[0028] When carbon fiber composite materials are used as protective parts for electronic devices, they do not require high mechanical properties. Therefore, medium and short fiber mixed resins can be used. The medium-cut fibers are mixed to give the composite basic mechanical properties while opening up the longitudinal heat conduction path; high thermal conductivity short fibers are used to build a "bridge" between the medium-cut fibers to further improve the longitudinal thermal conductivity; by preparing low-glue prepregs, the resin content in the composite products is reduced, and the interface thermal resistance is reduced, which can effectively improve the out-of-plane thermal conductivity of carbon fiber composite materials. Therefore, based on the above concept, the present invention provides an out-of-plane high thermal conductivity composite material and a preparation method thereof.

[0029] First, as Figure 1 As shown, the present invention provides a method for preparing an out-of-plane high thermal conductivity composite material, comprising:

[0030] S100, weighing a polymer matrix and a curing agent in a certain proportion, placing the mixture in a beaker, adding a certain amount of a low-volatile solvent, and then sealing the beaker and standing it to dissolve until no solid resin remains in the solution to obtain a resin solution;

[0031] This step requires waiting until there is no solid resin residue in the solution, the solution is transparent, and the viscosity is similar to that of water, thus obtaining a resin solution.

[0032] S200, placing the thermally conductive chopped fibers in a resin solution and performing ultrasonic dispersion to obtain a dispersion resin solution;

[0033] The out-of-plane high thermal conductivity composite material comprises 50% to 80% by mass of the middle-cut carbon fibers, 0% to 30% by mass of the thermally conductive chopped fibers, 20% to 30% by mass of the polymer matrix, 5% to 40% by mass of the curing agent, and 0.1% to 0.5% by mass of the internal release agent.

[0034] The ultrasonic dispersion time in this step is 30 min.

[0035] S300, placing the middle-cut carbon fiber in a tray covered with a PE film, pouring the dispersion resin solution into the tray in multiple times, and kneading the middle-cut carbon fiber to make it fully mixed with the dispersion resin solution poured each time, so as to obtain a preliminary prepreg;

[0036] S400, placing the preliminary prepreg in a vacuum oven for drying until the solvent in the preliminary prepreg is completely evaporated to obtain a fiber prepreg;

[0037] In this step, the vacuum oven temperature is 60-80°C, and the vacuum drying time is 1-3 hours. The vacuum drying time can be adjusted according to the different solvents used. When the solvent evaporates completely and the fiber is no longer sticky, the fiber prepreg is taken out.

[0038] S500, placing the fiber prepreg into a molding die for curing to obtain an out-of-plane high thermal conductivity carbon fiber composite material.

[0039] In this step, the fiber prepreg is placed into the molding die. During the placing process, it is compacted with a spatula to ensure that there is no prepreg residue in the discharge port area. The mold is then covered and moved to a press for curing to obtain an out-of-plane high thermal conductivity carbon fiber composite material.

[0040] Wherein, the middle-cut carbon fiber is any one of the high modulus carbon fibers of M40J, M50J, M40, and M50 specifications, with a diameter of 5 to 10 μm and a length of 200 to 500 mm. The thermally conductive chopped fibers are mesophase asphalt-based carbon fibers, with a diameter of 5 to 10 μm and a length of 25 to 200 μm. The polymer matrix is ​​a mixture of one or more of bisphenol A epoxy resins of E-51 and E-20 models or phenolic epoxy resins of F-44 and F-51 models. The curing agent is a mixture of one or more of diaminodiphenylmethane, diaminodiphenyl sulfone, and methyltetrahydrophthalic anhydride. The internal demolding agent is a mixture of one or more of zinc stearate, calcium stearate, and magnesium stearate. The low volatility solvent is a mixture of one or more of acetone, ethanol, chloroform, and ethyl acetate.

[0041] In a second aspect, the present invention provides an out-of-plane high thermal conductivity composite material, which is prepared using the preparation method of the out-of-plane high thermal conductivity composite material described in the first aspect.

[0042] The present invention provides an out-of-plane high thermal conductivity composite material and a preparation method thereof. By mixing medium-cut fibers with short-cut fibers, the heat conduction path in the out-of-plane direction is increased, and while the out-of-plane thermal conductivity is improved, the composite material is also endowed with certain physical and mechanical properties, thereby improving its structural strength. In addition, the present invention can well control the glue content by dissolving the polymer matrix and the curing agent in a low-volatile solvent and then mixing them with carbon fibers, thereby reducing the resin content in the carbon fiber composite product, promoting fiber overlap, reducing the thickness of the resin layer, and reducing thermal resistance. The present invention is a chopped fiber mixing, which is a disordered mixing, and the polymer matrix is ​​mixed with the short-cut fibers, so that the glue content can be controlled and the thermal conductivity of the composite material is improved.

[0043] It is worth noting that the existing document CN106584965B records a high thermal conductivity carbon fiber composite material and its preparation method and application, and the document CN103408315B records a three-dimensional mesophase asphalt-based high thermal conductivity carbon-carbon composite material and its preparation process. The schemes recorded in the two documents also involve the mixing of two fibers, but the continuous carbon fiber belongs to an ordered mixture, and the short fibers in this application belong to a disordered mixture, and the mixing mode is inconsistent; furthermore, although the document CN106584965B involves the dissolution of resin in a solvent, the document CN106584965B is a necessary step for the wet prepreg of continuous carbon fiber, which is a general process and it is difficult to accurately control the glue content. The present application belongs to a disordered mixture, and the polymer matrix is ​​mixed with the short fibers, which can accurately control the glue content and increase the thermal conductivity of the out-of-plane high thermal conductivity carbon fiber composite material.

[0044] Specific examples are given below.

[0045] Example 1

[0046] A method for preparing a high thermal conductivity carbon fiber fabric composite material, comprising:

[0047] The first step is to weigh a polymer matrix composed of 3.16% of E-20 epoxy resin and 12.8% of F-51 epoxy resin, 3.74% of diaminodiphenylmethane and 0.3% of zinc stearate, and place them in a beaker, add a certain amount of low volatility solvent, seal and stand to dissolve until no solid resin remains in the solution to obtain a resin solution;

[0048] In the second step, a mesophase pitch-based carbon fiber with a mass fraction of 10%, a specification of TC-600, a diameter of 10 μm, and a length of 150 μm is placed in a resin solution and ultrasonically dispersed to obtain a dispersion resin solution;

[0049] The third step is to place a 70% by mass fraction, M40J specification, 10 μm in diameter, and 300 mm in length in a tray covered with a PE film, pour the dispersion resin solution into the tray in multiple times, and knead the chopped carbon fiber to make it fully mixed with the dispersion resin solution poured each time to obtain a preliminary prepreg;

[0050] The fourth step is to place the preliminary prepreg in a vacuum oven for drying until the solvent in the preliminary prepreg is completely evaporated to obtain a fiber prepreg;

[0051] The fifth step is to place the fiber prepreg into a compression mold for curing to obtain a carbon fiber composite material with high out-of-plane thermal conductivity of 2.1 W / m·K.

[0052] The method was used to prepare an out-of-plane high thermal conductivity carbon fiber composite material. The thermal conductivity of the composite material was measured by laser flash method, and the result showed that the thermal conductivity of the composite material was 2.1 W / m·K, which was relatively high.

[0053] Example 2

[0054] A method for preparing a high thermal conductivity carbon fiber fabric composite material, comprising:

[0055] The first step is to weigh a polymer matrix composed of 3.16% of E-20 epoxy resin and 12.8% of F-51 epoxy resin, 3.74% of diaminodiphenylmethane and 0.3% of zinc stearate, and place them in a beaker, add a certain amount of low volatility solvent, seal and stand to dissolve until no solid resin remains in the solution to obtain a resin solution;

[0056] The second step is to place 10% by mass of thermally conductive chopped fibers in a resin solution and perform ultrasonic dispersion to obtain a dispersion resin solution;

[0057] The third step is to place a 70% by mass fraction, M50J specification, 10 μm in diameter, and 300 mm in length in a tray covered with a PE film, pour the dispersion resin solution into the tray several times, and knead the chopped carbon fiber to make it fully mixed with the dispersion resin solution poured each time to obtain a preliminary prepreg;

[0058] The fourth step is to place the preliminary prepreg in a vacuum oven for drying until the solvent in the preliminary prepreg is completely evaporated to obtain a fiber prepreg;

[0059] The fifth step is to place the fiber prepreg into a compression mold for curing to obtain a carbon fiber composite material with high out-of-plane thermal conductivity of 2.3 W / m·K.

[0060] The method was used to prepare an out-of-plane high thermal conductivity carbon fiber composite material. The thermal conductivity of the composite material was measured by laser flash method, and the result showed that the thermal conductivity of the composite material was 2.3W / m·K, which was relatively high.

[0061] Example 3

[0062] A method for preparing a high thermal conductivity carbon fiber fabric composite material, comprising:

[0063] The first step is to weigh a polymer matrix composed of 6.32% of E-20 epoxy resin and 25.6% of F-51 epoxy resin, 7.48% of diaminodiphenylmethane and 0.6% of zinc stearate, and place them in a beaker, add a certain amount of low volatility solvent, seal and stand to dissolve until no solid resin remains in the solution to obtain a resin solution;

[0064] The second step is to place 10% by mass of thermally conductive chopped fibers in a resin solution and perform ultrasonic dispersion to obtain a dispersion resin solution;

[0065] The third step is to place a 50% by mass fraction, M40 specification, 10 μm in diameter, and 400 mm in length in a tray covered with a PE film, pour the dispersion resin solution into the tray several times, and knead the chopped carbon fiber to make it fully mixed with the dispersion resin solution poured each time to obtain a preliminary prepreg;

[0066] The fourth step is to place the preliminary prepreg in a vacuum oven for drying until the solvent in the preliminary prepreg is completely evaporated to obtain a fiber prepreg;

[0067] In the fifth step, the fiber prepreg is placed in a molding die for curing to obtain an out-of-plane high thermal conductivity carbon fiber composite material with an out-of-plane thermal conductivity coefficient of 1.2 W / m·K.

[0068] In this embodiment, the resin content is 40%, which leads to an increase in the thickness of the resin layer between the fibers and an increase in the thermal resistance, so the thermal conductivity is 1.2 W / m·K.

[0069] Example 4

[0070] A method for preparing a high thermal conductivity carbon fiber fabric composite material, comprising:

[0071] The first step is to weigh a polymer matrix composed of 3.16% of E-20 epoxy resin and 12.8% of F-51 epoxy resin, 3.74% of diaminodiphenylmethane and 0.3% of zinc stearate, and place them in a beaker, add a certain amount of low volatility solvent, seal and stand to dissolve until no solid resin remains in the solution to obtain a resin solution;

[0072] In the second step, a mesophase pitch-based carbon fiber with a mass fraction of 20%, a specification of TC-600, a diameter of 10 μm, and a length of 100 μm is placed in a resin solution and ultrasonically dispersed to obtain a dispersion resin solution;

[0073] The third step is to place a 60% by mass fraction, M55J specification, 10 μm in diameter, and 400 mm in length in a tray covered with a PE film, pour the dispersion resin solution into the tray in multiple times, and knead the chopped carbon fiber to make it fully mixed with the dispersion resin solution poured each time to obtain a preliminary prepreg;

[0074] The fourth step is to place the preliminary prepreg in a vacuum oven for drying until the solvent in the preliminary prepreg is completely evaporated to obtain a fiber prepreg;

[0075] The fifth step is to place the fiber prepreg into a compression mold for curing to obtain a carbon fiber composite material with high out-of-plane thermal conductivity of 5.3 W / m·K.

[0076] The method was used to prepare an out-of-plane high thermal conductivity carbon fiber composite material. The thermal conductivity of the composite material was measured by laser flash method, and the result showed that the thermal conductivity of the composite material was 5.3W / m·K, which was relatively high.

[0077] Comparative Example 1

[0078] A method for preparing a high thermal conductivity carbon fiber fabric composite material, comprising:

[0079] A polymer matrix composed of 3.16% of E-20 epoxy resin and 12.8% of F-51 epoxy resin, 3.74% of diaminodiphenylmethane and 0.3% of zinc stearate were weighed and placed in a beaker, a certain amount of low volatility solvent was added, and the beaker was sealed and allowed to stand for dissolution until no solid resin remained in the solution to obtain a resin solution;

[0080] Place a medium-cut carbon fiber with a mass fraction of 80%, a specification of M40J, a diameter of 10 μm, and a length of 300 mm in a tray covered with a PE film, pour the resin solution into the tray in multiple times, and knead the medium-cut carbon fiber to make it fully mixed with the dispersion resin solution poured each time to obtain a preliminary prepreg;

[0081] Placing the preliminary prepreg in a vacuum oven for drying until the solvent in the preliminary prepreg is completely evaporated to obtain a fiber prepreg;

[0082] The fiber prepreg is placed in a molding die for curing to obtain an out-of-plane high thermal conductivity carbon fiber composite material with an out-of-plane thermal conductivity coefficient of 1.5 W / m·K.

[0083] Comparative Example 2

[0084] A method for preparing a high thermal conductivity carbon fiber fabric composite material, comprising:

[0085] A polymer matrix composed of 3.16% of E-20 epoxy resin and 12.8% of F-51 epoxy resin, 3.74% of diaminodiphenylmethane and 0.3% of zinc stearate were weighed and placed in a beaker, a certain amount of low volatility solvent was added, and the beaker was sealed and allowed to stand for dissolution until no solid resin remained in the solution to obtain a resin solution;

[0086] Place a medium-cut carbon fiber with a mass fraction of 80%, a specification of M55J, a diameter of 10 μm, and a length of 500 mm in a tray covered with a PE film, pour the resin solution into the tray in multiple times, and knead the medium-cut carbon fiber to make it fully mixed with the dispersion resin solution poured each time to obtain a preliminary prepreg;

[0087] Placing the preliminary prepreg in a vacuum oven for drying until the solvent in the preliminary prepreg is completely evaporated to obtain a fiber prepreg;

[0088] The fiber prepreg is placed in a molding die for curing to obtain an out-of-plane high thermal conductivity carbon fiber composite material with an out-of-plane thermal conductivity coefficient of 1.8 W / m·K.

[0089] It can be seen from the above embodiments that the present invention provides an out-of-plane high thermal conductivity composite material and a preparation method thereof. By mixing the medium-cut fibers with the short-cut fibers, the heat conduction path in the out-of-plane direction is increased, and while the out-of-plane thermal conductivity is improved, the composite material is also endowed with certain physical and mechanical properties, thereby improving its structural strength. In addition, the present invention can well control the glue content by dissolving the polymer matrix and the curing agent in a low-volatile solvent and then mixing them with the carbon fiber, thereby reducing the resin content in the carbon fiber composite product, promoting fiber overlap, reducing the thickness of the resin layer, and reducing thermal resistance. The present invention is a short-cut fiber mixing, which is a disordered mixing, and the mixing of the polymer matrix and the short-cut fibers can control the glue content, thereby improving the thermal conductivity of the composite material. According to the experimental results of the embodiments, the thermal conductivity of the out-of-plane high thermal conductivity composite material provided by the present invention is much higher than that in the prior art.

[0090] The above contents are further detailed descriptions of the present invention in combination with specific preferred embodiments, and it cannot be determined that the specific implementation of the present invention is limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as falling within the protection scope of the present invention.

Claims

1. A method for preparing an out-of-plane high thermal conductivity composite material, characterized in that: include: S100, weighing a polymer matrix, a curing agent and an internal release agent, and placing them in a beaker, adding a certain amount of a low-volatile solvent, and then sealing and standing to dissolve until no solid resin remains in the solution to obtain a resin solution; S200, placing the thermally conductive chopped fibers in a resin solution and performing ultrasonic dispersion to obtain a dispersion resin solution; S300, placing the middle-cut carbon fiber in a tray covered with a PE film, pouring the dispersion resin solution into the tray in multiple times, and kneading the middle-cut carbon fiber to make it fully mixed with the dispersion resin solution poured each time, so as to obtain a preliminary prepreg; S400, placing the preliminary prepreg in a vacuum oven for drying until the solvent in the preliminary prepreg is completely evaporated to obtain a fiber prepreg; S500, placing the fiber prepreg into a molding die for curing to obtain an out-of-plane high thermal conductivity carbon fiber composite material.

2. The method for preparing the out-of-plane high thermal conductivity composite material according to claim 1, characterized in that: The out-of-plane high thermal conductivity composite material comprises 50% to 80% by mass of the middle-cut carbon fibers, 0% to 30% by mass of the thermally conductive chopped fibers, 20% to 30% by mass of the polymer matrix, 5% to 40% by mass of the curing agent, and 0.1% to 0.5% by mass of the internal release agent.

3. The method for preparing the out-of-plane high thermal conductivity composite material according to claim 1, characterized in that: The middle-cut carbon fiber is any one of high modulus carbon fibers of specifications of M40J, M50J, M40, and M50, with a diameter of 5 to 10 μm and a length of 200 to 500 mm.

4. The method for preparing the out-of-plane high thermal conductivity composite material according to claim 1, characterized in that: The thermally conductive chopped fibers are mesophase asphalt-based carbon fibers with a diameter of 5 to 10 μm and a length of 25 to 200 μm.

5. The method for preparing the out-of-plane high thermal conductivity composite material according to claim 1, characterized in that: The polymer matrix is ​​a mixture of one or more of E-51 and E-20 bisphenol A epoxy resins or F-44 and F-51 phenolic epoxy resins.

6. The method for preparing the out-of-plane high thermal conductivity composite material according to claim 1, characterized in that: The curing agent is a mixture of one or more of diaminodiphenylmethane, diaminodiphenyl sulfone and methyltetrahydrophthalic anhydride.

7. The method for preparing the out-of-plane high thermal conductivity composite material according to claim 1, characterized in that: The internal release agent is a mixture of one or more of zinc stearate, calcium stearate and magnesium stearate.

8. The method for preparing the out-of-plane high thermal conductivity composite material according to claim 1, characterized in that: The low volatility solvent is a mixture of one or more of acetone, ethanol, chloroform and ethyl acetate.

9. The method for preparing the out-of-plane high thermal conductivity composite material according to claim 1, characterized in that: The ultrasonic dispersion time in S200 is 30 minutes, the vacuum oven temperature during drying in S400 is 60 to 80°C, and the vacuum drying time is 1 to 3 hours.

10. An out-of-plane high thermal conductivity composite material, characterized in that: The composite material is prepared by the method for preparing the out-of-plane high thermal conductivity composite material according to any one of claims 1 to 9.

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