Temperature measurement structure, temperature sensor and temperature sensor manufacturing method

Abstract

The invention provides a temperature measurement structure, a temperature sensor and a temperature sensor manufacturing method, and relates to the technical field of temperature sensors. The temperature measurement structure comprises a thermistor, a conductive piece and a heat conduction layer, the thermistor is electrically connected with the conductive piece, and the thermistor and the conductive piece are covered with a heat conduction layer in an injection molding mode. According to the temperature measurement structure, the heat conduction layer is formed outside the thermistor and the conductive piece which are electrically connected through injection molding, a modular structure capable of measuring temperature can be formed, and when the temperature sensor needs to be manufactured, the modular structure is directly installed in the shell of the temperature sensor; the thermistor and the conductive piece do not need to be installed in a heat-conducting glue layer in the shell, and the processing and manufacturing difficulty of the temperature sensor can be effectively reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of temperature sensors, and in particular to a temperature measurement structure, a temperature sensor and a method for manufacturing the temperature sensor. Background Art

[0002] A temperature sensor is a sensor that can sense temperature and convert it into a usable output signal. A temperature sensor usually includes a probe for measuring temperature and a conductive structure for transmitting signals. The probe is such as a thermistor, and the conductive structure is such as a PIN needle (a needle-shaped object for conduction), a terminal, etc.

[0003] When manufacturing a temperature sensor, the probe and the conductive structure are usually welded together first, and a thermal conductive adhesive layer such as epoxy resin is filled in the housing of the temperature sensor. The welded probe and the conductive structure are then installed in the thermal conductive adhesive layer in the housing.

[0004] However, the process of first filling the shell with a thermally conductive adhesive layer and then installing the welded probe and conductive structure into the thermally conductive adhesive layer requires high operation and is difficult to assemble. Summary of the invention

[0005] The purpose of the present invention is to provide a temperature measuring structure, a temperature sensor and a method for manufacturing a temperature sensor, so as to alleviate the technical problems existing in the prior art that when manufacturing a temperature sensor, a thermal conductive adhesive layer must be first filled in the outer shell, and then the welded probe and the conductive structure must be installed in the thermal conductive adhesive layer, which has high operating requirements and is difficult to assemble.

[0006] In a first aspect, the present invention provides a temperature measurement structure, including a thermistor, a conductive member and a heat conductive layer;

[0007] The thermistor is electrically connected to the conductive member, and the thermistor and the conductive member are covered with the heat-conducting layer by injection molding.

[0008] In an optional embodiment, a heat-conducting shell is further included, and the heat-conducting shell is covered on the outside of the heat-conducting layer by injection molding.

[0009] In an optional embodiment, the material of the heat-conducting shell is the same as the material of the heat-conducting layer.

[0010] In an optional embodiment, the heat-conducting layer includes a first heat-conducting layer and a second heat-conducting layer, the second heat-conducting layer is covered on the outside of the conductive member by injection molding, and one end of the conductive member extends out of the second heat-conducting layer and is connected to the thermistor;

[0011] The first heat-conducting layer covers the thermistor and the conductive member extending out of the second heat-conducting layer.

[0012] In an optional embodiment, a connection hole extending to the conductive member is opened on one side of the heat conductive layer, and a local area of ​​the conductive member is located in the connection hole to form a conductive portion, and the conductive portion is used to electrically connect to an external conductive connecting member.

[0013] In a second aspect, the present invention provides a temperature sensor, comprising a switching module and the temperature measurement structure described in any one of the aforementioned embodiments;

[0014] The adapter module includes a conductive connecting member and an adapter, wherein a through hole is provided in the adapter, and the conductive connecting member is passed through and fixed in the through hole of the adapter;

[0015] The adapter is in contact with one side of the heat-conducting layer, and one end of the conductive connector is electrically connected to the conductive member after passing through the heat-conducting layer, and the other end of the conductive connector is used for being electrically connected to an external wire.

[0016] In an optional embodiment, the adapter and the conductive connecting member both extend in a straight line shape, or the adapter and the conductive connecting member both extend in an L shape.

[0017] In an optional embodiment, a shell is further included, and the shell covers the abutment between the adapter and the heat conductive layer, the adapter and the outside of the conductive connector.

[0018] In a third aspect, the present invention provides a method for manufacturing a temperature sensor, for manufacturing the temperature sensor as described in any one of the aforementioned embodiments, comprising:

[0019] S1: electrically connecting the thermistor and the conductive member in the temperature measuring structure by welding;

[0020] S2: Injecting a thermally conductive material outside the thermistor and the conductive member after welding to form a thermally conductive layer;

[0021] S3: placing the adapter in the adapter module against one side of the heat-conducting layer, and passing one end of the conductive connecting member in the adapter module through the heat-conducting layer to be electrically connected to the conductive member.

[0022] In an optional embodiment, the method further includes the following steps after step S2:

[0023] S20: Injecting a heat-conducting material outside the heat-conducting layer to form a heat-conducting housing;

[0024] Also included after step S3 is the step of:

[0025] S30: Installing a housing at the junction of the adapter and the heat-conducting layer, and outside the adapter and the conductive connector.

[0026] The temperature measuring structure provided by the present invention includes a thermistor, a conductive part and a heat-conducting layer; the thermistor and the conductive part are electrically connected, and the thermistor and the conductive part are covered with a heat-conducting layer by injection molding. The temperature measuring structure provided by the present invention is used to manufacture a temperature sensor. Before manufacturing the temperature sensor, the thermistor and the conductive part are electrically connected by welding or the like, and then the thermistor and the conductive part are injection-molded with heat-conducting materials such as heat-conducting glue, and the heat-conducting layer is formed after the heat-conducting material solidifies. At this time, the thermistor, the conductive part and the heat-conducting layer form a modular structure capable of measuring temperature. When it is necessary to manufacture a temperature sensor, the temperature sensor can be obtained by simply installing the modular structure in the housing of the temperature sensor or processing the housing outside the modular structure. Compared with the existing temperature sensor manufacturing method, the temperature sensor manufacturing process does not need to install the probe and the conductive structure into the heat-conducting glue layer in the housing of the temperature sensor, which can effectively reduce the difficulty of operation in the temperature sensor manufacturing process, not only can the manufacturing efficiency of the temperature sensor be improved, but also the damage rate of the temperature sensor can be reduced. In addition, the temperature measurement structure provided by the present invention is a modular structure capable of measuring temperature and can be produced and sold separately, which is convenient for downstream manufacturers to produce temperature sensors. Downstream manufacturers do not need to obtain all the production qualifications required in the production process of temperature sensors, which is conducive to promotion.

[0027] Compared with the prior art, the temperature measuring structure provided by the present invention can form a modular structure capable of measuring temperature by forming a heat-conducting layer by injection molding outside the electrically connected thermistor and the conductive part. When it is necessary to manufacture a temperature sensor, the modular structure can be directly installed in the housing of the temperature sensor without installing the thermistor and the conductive part in the thermally conductive adhesive layer in the housing, which can effectively reduce the difficulty of processing and manufacturing the temperature sensor.

[0028] The temperature sensor provided by the present invention includes an adapter module and the above-mentioned temperature measurement structure; the adapter module includes a conductive connector and an adapter, a through hole is provided in the adapter, and the conductive connector is passed through and fixed in the through hole of the adapter; the adapter abuts against one side of the heat-conducting layer, and one end of the conductive connector passes through the heat-conducting layer and is electrically connected to the conductive connector, and the other end of the conductive connector is used to be electrically connected to an external wire. The temperature sensor includes the above-mentioned temperature measurement structure, so the temperature sensor has the same beneficial effects as the above-mentioned temperature measurement structure.

[0029] The temperature sensor manufacturing method provided by the present invention is used to manufacture the above-mentioned temperature sensor, including: S1: electrically connecting the thermistor and the conductive part in the temperature measurement structure by welding; S2: injecting thermal conductive material outside the welded thermistor and the conductive part to form a thermal conductive layer; S3: abutting the adapter in the adapter module against one side of the thermal conductive layer, and passing one end of the conductive connector in the adapter module through the thermal conductive layer and electrically connecting it to the conductive part. The temperature sensor manufacturing method provided by the present invention first manufactures the above-mentioned temperature measurement structure through steps S1-S2, and then manufactures the above-mentioned temperature sensor through step S3. Since the temperature sensor manufacturing method uses the above-mentioned temperature measurement structure to manufacture the above-mentioned temperature sensor, it has the same beneficial effects as the above-mentioned temperature measurement structure and temperature sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0031] Figure 1 A schematic diagram of the structure of a temperature measurement structure provided by an embodiment of the present invention;

[0032] Figure 2 A cross-sectional view of a temperature measurement structure provided by an embodiment of the present invention;

[0033] Figure 3 An exploded diagram of a temperature measurement structure provided by an embodiment of the present invention;

[0034] Figure 4 A schematic diagram of the structure of a temperature sensor including a temperature measurement structure provided by an embodiment of the present invention;

[0035] Figure 5 for Figure 4 Exploded diagram of the temperature sensor in;

[0036] Figure 6 Another schematic diagram of the structure of a temperature sensor including a temperature measurement structure provided by an embodiment of the present invention;

[0037] Figure 7 for Figure 6 Exploded diagram of the temperature sensor in;

[0038] Figure 8 The present invention provides a flow chart of a method for manufacturing a temperature sensor.

[0039] Icon: 1-thermistor; 2-conductive part; 3-thermal conductive layer; 30-first thermal conductive layer; 31-second thermal conductive layer; 310-connection hole; 4-thermal conductive shell; 40-limiting groove; 5-adapter module; 50-conductive connector; 51-adapter; 6-housing. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0041] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0042] Some embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0043] Example:

[0044] like Figure 1 , Figure 2 and Figure 3 As shown, the temperature measurement structure provided in this embodiment includes a thermistor 1, a conductive member 2 and a heat-conducting layer 3; the thermistor 1 and the conductive member 2 are electrically connected, and the thermistor 1 and the conductive member 2 are covered with the heat-conducting layer 3 by injection molding.

[0045] The temperature measurement structure provided in this embodiment is used to manufacture a temperature sensor. Before manufacturing the temperature sensor, Figure 2 The thermistor 1 and the conductive member 2 are electrically connected by welding or the like, and then the thermistor 1 and the conductive member 2 are coated with a thermal conductive material such as a thermal conductive adhesive by injection molding. After the thermal conductive material solidifies and forms a Figure 2 The thermal conductive layer 3 is shown. At this time, the thermistor 1, the conductive member 2 and the thermal conductive layer 3 form a modular structure capable of measuring temperature. When a temperature sensor needs to be manufactured, the temperature sensor can be obtained by simply installing the modular structure in a housing of the temperature sensor or processing the housing outside the modular structure.

[0046] Compared with the existing temperature sensor manufacturing method, the above temperature sensor manufacturing process does not need to install the probe and the conductive structure into the thermal conductive adhesive layer inside the temperature sensor housing, which can effectively reduce the operational difficulty in the temperature sensor manufacturing process, not only improve the temperature sensor manufacturing efficiency, but also reduce the damage rate of the temperature sensor.

[0047] Compared with the prior art, the temperature measurement structure provided in this embodiment can form a modular structure capable of measuring temperature by forming a thermal conductive layer 3 by injection molding outside the electrically connected thermistor 1 and the conductive member 2. When it is necessary to manufacture a temperature sensor, the modular structure can be directly installed in the housing of the temperature sensor. There is no need to install the thermistor 1 and the conductive member 2 in the thermal conductive adhesive layer in the housing, which can effectively reduce the difficulty of processing and manufacturing the temperature sensor.

[0048] In addition, the temperature measurement structure provided in this embodiment is a modular structure capable of measuring temperature and can be produced and sold separately, which is convenient for downstream manufacturers to produce temperature sensors. Downstream manufacturers do not need to obtain all the production qualifications required in the temperature sensor production process, which is conducive to promotion.

[0049] There is no need for downstream manufacturers to obtain production qualifications such as in-shell glue injection process qualifications. Specifically, the existing temperature sensor production process requires injecting glue into the shell of the temperature sensor to form a thermally conductive glue layer, and the probe and conductive structure must be installed in the thermally conductive glue layer within a preset time after the injection. Therefore, the existing temperature sensor production process cannot separate the in-shell glue injection operation from the shell installation operation. Downstream manufacturers need to obtain multiple production qualifications before they can carry out the subsequent assembly of temperature sensors. The requirements for downstream manufacturers are high, which is not conducive to promotion.

[0050] like Figure 1-Figure 3 As shown, the temperature measurement structure provided in this embodiment further includes a heat-conducting shell 4, and the heat-conducting shell 4 is covered on the outside of the heat-conducting layer 3 by injection molding.

[0051] The heat-conducting housing 4 is used to protect the thermistor 1, the conductive member 2 and the heat-conducting layer 3, thereby improving the structural strength of the temperature measurement structure.

[0052] It should be noted that the heat-conducting housing 4 is made of a heat-conducting material, so the heat-conducting housing 4 will not hinder the temperature measurement process of the thermistor 1, and thus will not affect the use effect of the temperature sensor.

[0053] It should also be noted that, since the heat-conducting shell 4 is covered on the outside of the heat-conducting layer 3 by injection molding, there is no need to install the thermistor 1, the conductive member 2 and the heat-conducting layer 3 into the heat-conducting shell 4 when manufacturing the heat-conducting shell 4, which can also reduce the manufacturing difficulty of the temperature measuring structure.

[0054] Furthermore, the material of the heat-conducting shell 4 is the same as that of the heat-conducting layer 3 .

[0055] When the material of the heat-conducting shell 4 is the same as that of the heat-conducting layer 3, the thermal conductivity and thermal expansion coefficient of the heat-conducting shell 4 and the heat-conducting layer 3 are equal, so that no heat-conducting gap will appear in the temperature measurement structure during the temperature measurement process, thereby not reducing the service life of the temperature measurement structure.

[0056] In this embodiment, the material of the heat-conducting shell 4 and the material of the heat-conducting layer 3 can be PPS (polyphenylene sulfide, English name is Polyphenylene sulfide, abbreviated as PPS) resin, or PPA (polyphthalamide, English name is Polyphthalamide, abbreviated as PPA) resin.

[0057] like Figure 3 As shown, the thermal conductive layer 3 includes a first thermal conductive layer 30 and a second thermal conductive layer 31. The second thermal conductive layer 31 is covered on the outside of the conductive member 2 by injection molding. One end of the conductive member 2 extends out of the second thermal conductive layer 31 and is connected to the thermistor 1. The first thermal conductive layer 30 covers the outside of the thermistor 1 and the conductive member 2 extending out of the second thermal conductive layer 31.

[0058] When the heat-conducting layer 3 includes a first heat-conducting layer 30 and a second heat-conducting layer 31, the first heat-conducting layer 30 and the second heat-conducting layer 31 can be successively injection-molded, and the first heat-conducting layer 30 and the second heat-conducting layer 31 are connected to each other to form the heat-conducting layer 3. Specifically, when the heat-conducting layer 3 is formed by processing, the second heat-conducting layer 31 can be firstly formed outside the conductive member 2 by injection molding, and at the same time, one end of the conductive member 2 is extended outside the second heat-conducting layer 31, and then the portion of the conductive member 2 extending outside the second heat-conducting layer 31 is electrically connected to the thermistor 1 by welding or the like, and then the first heat-conducting layer 30 is formed outside the thermistor 1 and the conductive member 2 extending outside the second heat-conducting layer 31 by injection molding, and the first heat-conducting layer 30 is connected to the second heat-conducting layer 31.

[0059] Since the conductive member 2 is usually a small structure such as a PIN needle or a terminal, the second heat-conducting layer 31 is firstly formed by injection molding outside the conductive member 2. The second heat-conducting layer 31 can be used to protect the conductive member 2, thereby facilitating the smooth progress of subsequent processing steps.

[0060] To further extend the service life of the temperature measurement structure, in this embodiment, the material of the second heat-conducting layer 31 is preferably the same as that of the first heat-conducting layer 30. When the temperature measurement structure further includes a heat-conducting housing 4, the materials of the first heat-conducting layer 30, the second heat-conducting layer 31 and the heat-conducting housing 4 are all the same.

[0061] like Figure 2As shown, a connection hole 310 extending to the conductive member 2 is opened on one side of the heat conductive layer 3 , and a local area of ​​the conductive member 2 is located in the connection hole 310 to form a conductive portion, which is used to electrically connect to the external conductive connector 50 .

[0062] The connection hole 310 and the conductive part facilitate electrical connection between the external conductive connector 50 and the conductive member 2 by plugging, thereby facilitating the assembly of the temperature measurement structure with other structures of the temperature sensor to form a temperature sensor.

[0063] The external conductive connector 50 may be a conductive connector 50 such as a switching wire, a switching pin, or a switching PIN needle in the temperature sensor.

[0064] When the heat conducting layer 3 includes a first heat conducting layer 30 and a second heat conducting layer 31 , the connection hole 310 may be opened on a side of the second heat conducting layer 31 away from the first heat conducting layer 30 .

[0065] like Figure 4-Figure 7 As shown, this embodiment also provides a temperature sensor, which includes an adapter module 5 and the above-mentioned temperature measurement structure; the adapter module 5 includes a conductive connector 50 and an adapter 51, the adapter 51 is provided with a through hole, and the conductive connector 50 is passed through and fixed in the through hole of the adapter 51; the adapter 51 abuts against one side of the thermal conductive layer 3, and one end of the conductive connector 50 passes through the thermal conductive layer 3 and is electrically connected to the conductive member 2, and the other end of the conductive connector 50 is used to be electrically connected to an external wire.

[0066] The temperature sensor provided in this embodiment includes the above-mentioned temperature measurement structure, so the temperature sensor and the above-mentioned temperature measurement structure can solve the same technical problems and achieve the same technical effects, which will not be described in detail here.

[0067] It should be noted that the temperature sensor provided in this embodiment further includes a switching module 5, which can be used as an extension structure of the temperature measurement structure to be connected to an external controller or other device for receiving a detection signal from the temperature sensor.

[0068] Therefore, the adapter 51 and the conductive connector 50 in the adapter module 5 are used to cooperate with each other to form an extension structure of the temperature measuring structure, thereby extending the connection length of the temperature measuring structure and improving the installation flexibility of the temperature measuring structure.

[0069] The adapter 51 can be made of plastic or other materials, and the conductive connector 50 can be a conductive structure such as a PIN pin or a wire. During use, the adapter 51 can not only protect the conductive connector 50, but also support the conductive connector 50, so as to improve the structural strength of the adapter module 5, thereby improving the installation stability of the adapter module 5.

[0070] To facilitate the connection between the adapter module 5 and the temperature measuring structure, a connection hole 310 extending to the conductive member 2 may be provided on one side of the heat-conducting layer 3 in the temperature measuring structure, and a local area of ​​the conductive member 2 is located in the connection hole 310 to form a conductive portion. When connecting the adapter module 5 and the temperature measuring structure, it is only necessary to insert one end of the conductive connector 50 exposed outside the adapter 51 into the above-mentioned connection hole 310 to achieve electrical connection between the conductive connector 50 and the conductive member 2.

[0071] In order to improve the plugging stability between the adapter module 5 and the temperature measurement structure, Figure 1-Figure 3 As shown, when the temperature measuring structure includes a heat-conducting shell 4, the heat-conducting shell 4 on the side of the heat-conducting layer 3 outside the conductive member 2 can extend in a direction away from the heat-conducting layer 3 to form a limiting groove 40. At this time, the top of the heat-conducting layer 3 is the bottom of the limiting groove 40. When the adapter module 5 and the temperature measuring structure are plugged into each other, the side of the adapter 51 close to the connecting hole 310 not only abuts against one side of the heat-conducting layer 3, but is also located in the limiting groove 40. At this time, the limiting groove 40 can limit the adapter 51 to improve the plugging stability of the adapter module 5 and the temperature measuring structure.

[0072] Further, such as Figure 5 As shown, the adapter 51 and the conductive connector 50 are both extended in a straight line, or, as shown in FIG. Figure 7 As shown, the adapter 51 and the conductive connecting member 50 both extend in an L shape.

[0073] When the adapter 51 and the conductive connector 50 are both extended in a straight line, the adapter module 5 is also extended in a straight line. Figure 4 As shown, at this time, the temperature sensor formed by connecting the adapter module 5 and the temperature measuring structure is in a straight line shape as a whole.

[0074] When the adapter 51 and the conductive connector 50 are both extended in an L shape, the adapter module 5 is also extended in an L shape. Figure 6 As shown, at this time, the temperature sensor formed by connecting the adapter module 5 and the temperature measuring structure is L-shaped as a whole.

[0075] It can be seen that, based on the premise that the temperature sensor can be formed by plugging the adapter module 5 and the temperature measuring structure into each other, temperature sensors of different shapes can be assembled by changing the shape of the adapter module 5, thereby effectively improving the manufacturing flexibility and convenience of the temperature sensor.

[0076] like Figure 4-Figure 7 As shown, the temperature sensor provided in this embodiment further includes a housing 6 , which covers the abutment between the adapter 51 and the heat-conducting layer 3 , the adapter 51 and the outside of the conductive connector 50 .

[0077] The housing 6 is the housing 6 of the aforementioned temperature sensor, which is used to protect the adapter module 5 and the connection between the adapter module 5 and the temperature measurement structure, thereby extending the service life of the temperature sensor.

[0078] When the temperature sensor needs to be assembled, the adapter module 5 and the temperature measuring structure can be plugged into each other first, and then the pre-injection-molded shell 6 can be placed on the adapter module 5 and the connection between the adapter module 5 and the temperature measuring structure. Alternatively, the shell 6 can be directly injection-molded on the adapter module 5 and the connection between the adapter module 5 and the temperature measuring structure.

[0079] like Figure 8 As shown, this embodiment also provides a temperature sensor manufacturing method, which is used to manufacture the above-mentioned temperature sensor, including:

[0080] Step S1: electrically connecting the thermistor 1 and the conductive member 2 in the temperature measuring structure by welding;

[0081] Step S2: injecting a heat-conducting material outside the thermistor 1 and the conductive member 2 after welding to form a heat-conducting layer 3;

[0082] Step S3 : placing the adapter 51 in the adapter module 5 against one side of the heat-conducting layer 3 , and passing one end of the conductive connecting member 50 in the adapter module 5 through the heat-conducting layer 3 to be electrically connected to the conductive member 2 .

[0083] Among them, step S1-step S2 is used to manufacture the above-mentioned temperature measurement structure, and step S3 is used to connect the adapter module 5 in the temperature sensor with the temperature measurement structure. After step S3, the temperature sensor including the above-mentioned temperature measurement structure can be formed.

[0084] The method for manufacturing the temperature sensor can also form a heat-conducting layer 3 by injection molding outside the electrically connected thermistor 1 and the conductive member 2, thereby forming a modular structure capable of measuring temperature. When it is necessary to manufacture the temperature sensor, the modular structure is directly connected to the adapter module 5, and then the connection between the modular structure and the adapter module 5 and the adapter module 5 are installed in the housing 6 of the temperature sensor. Similarly, there is no need to install the thermistor 1 and the conductive member 2 in the thermally conductive adhesive layer in the housing 6, which can effectively reduce the difficulty of processing and manufacturing the temperature sensor.

[0085] like Figure 8 As shown, the temperature sensor manufacturing method provided in this embodiment further includes the following steps after step S2:

[0086] Step S20: Injecting a heat-conducting material outside the heat-conducting layer 3 to form a heat-conducting housing 4;

[0087] The temperature sensor manufacturing method further includes the following steps after step S3:

[0088] Step S30 : installing the housing 6 at the abutment between the adapter 51 and the heat-conducting layer 3 , and outside the adapter 51 and the conductive connector 50 .

[0089] The heat-conducting housing 4 in step S20 is the heat-conducting housing 4 in the above-mentioned temperature measurement structure. The heat-conducting housing 4 can further protect the above-mentioned modular structure, thereby effectively extending the life of the modular structure.

[0090] It should be noted that since the thermally conductive shell 4 is also formed by injection molding, the manufacturing process of the thermally conductive shell 4 is also relatively simple. There is no need to install the conductive part 2 covered with the thermally conductive layer 3 and the thermistor 1 into the thermally conductive shell 4, which can effectively reduce the manufacturing difficulty of the temperature measuring structure.

[0091] Step S30 is used to install the housing 6 of the temperature sensor outside the interconnected adapter module 5 and the temperature measurement structure. After step S30, the complete temperature sensor can be assembled.

[0092] To further reduce the manufacturing difficulty of the temperature sensor, in step S30 , a curable material may be injection-molded at the abutment between the adapter 51 and the first heat-conducting layer 30 and outside the adapter 51 and the conductive connector 50 to form the housing 6 .

[0093] Therefore, the housing 6 can also be formed by injection molding, without installing the adapter module 5 and the local heat-conducting housing 4 into the housing 6, which can also reduce the installation operation requirements and thus reduce the difficulty of assembly.

[0094] Among them, the material that can be cured, such as plastic, etc., the material of the housing 6 is not limited and can be selected according to the use environment of the temperature sensor.

[0095] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A temperature measurement structure, characterized in that: It comprises a thermistor (1), a conductive element (2) and a heat-conducting layer (3); The thermistor (1) and the conductive member (2) are electrically connected, and the thermistor (1) and the conductive member (2) are covered with the heat-conducting layer (3) by injection molding.

2. The temperature measurement structure according to claim 1, characterized in that: It also comprises a heat-conducting shell (4), wherein the heat-conducting shell (4) is covered on the outside of the heat-conducting layer (3) by injection molding.

3. The temperature measurement structure according to claim 2, characterized in that: The material of the heat-conducting shell (4) is the same as that of the heat-conducting layer (3).

4. The temperature measurement structure according to claim 1, characterized in that: The heat-conducting layer (3) comprises a first heat-conducting layer (30) and a second heat-conducting layer (31), the second heat-conducting layer (31) being covered on the outside of the conductive member (2) by injection molding, and one end of the conductive member (2) extending out of the second heat-conducting layer (31) and connected to the thermistor (1); The first heat-conducting layer (30) covers the thermistor (1) and the conductive member (2) extending outside the second heat-conducting layer (31).

5. The temperature measurement structure according to any one of claims 1 to 4, characterized in that: A connection hole (310) extending to the conductive member (2) is provided on one side of the heat conductive layer (3); a local area of ​​the conductive member (2) is located in the connection hole (310) to form a conductive portion, and the conductive portion is used to be electrically connected to an external conductive connecting member (50).

6. A temperature sensor, characterized in that: It comprises a switching module (5) and a temperature measurement structure according to any one of claims 1 to 5; The adapter module (5) comprises a conductive connecting member (50) and an adapter (51); a through hole is provided in the adapter (51); and the conductive connecting member (50) is passed through and fixed in the through hole of the adapter (51); The adapter (51) abuts against one side of the heat-conducting layer (3), and one end of the conductive connecting member (50) passes through the heat-conducting layer (3) to be electrically connected to the conductive member (2), and the other end of the conductive connecting member (50) is used to be electrically connected to an external wire.

7. The temperature sensor according to claim 6, characterized in that: The adapter (51) and the conductive connecting member (50) both extend in a straight line, or the adapter (51) and the conductive connecting member (50) both extend in an L-shape.

8. The temperature sensor according to claim 6, characterized in that: It also comprises a shell (6), wherein the shell (6) covers the abutment between the adapter (51) and the heat-conducting layer (3), the adapter (51) and the outside of the conductive connecting member (50).

9. A method for manufacturing a temperature sensor, used for manufacturing the temperature sensor according to any one of claims 6 to 8, characterized in that: include: S1: electrically connecting the thermistor (1) and the conductive member (2) in the temperature measurement structure by welding; S2: injecting a heat-conducting material outside the thermistor (1) and the conductive member (2) after welding to form a heat-conducting layer (3); S3: The adapter (51) in the adapter module (5) is placed against one side of the heat-conducting layer (3), and one end of the conductive connecting member (50) in the adapter module (5) is passed through the heat-conducting layer (3) to be electrically connected to the conductive member (2).

10. The method for manufacturing a temperature sensor according to claim 9, characterized in that: Also included after step S2 is the step of: S20: Injecting a heat-conducting material outside the heat-conducting layer (3) to form a heat-conducting housing (4); Also included after step S3 is the step of: S30: installing a housing (6) at the abutment point between the adapter (51) and the heat-conducting layer (3), and outside the adapter (51) and the conductive connecting member (50).

Images