Method and system for analyzing gold wire quality requirements in high-speed automatic bonding scene

Abstract

The invention relates to the field of electronic engineering, and discloses a gold wire quality requirement analysis method and system in a high-speed automatic bonding scene, and the method comprises the steps: obtaining a gold wire sample applied to the high-speed automatic bonding scene, collecting a sample image of the gold wire sample, and carrying out the preprocessing of the sample image, extracting image features of the preprocessed sample image, and analyzing surface parameters of the gold wire sample; measuring the gold wire resistance of the gold wire sample at constant temperature, and calculating the gold wire radius of the gold wire sample; the impurity blackness and the pure gold blackness of the gold wire sample are analyzed, a blackness difference-impurity content curve of the gold wire sample is constructed, and the gold wire purity of the gold wire sample is calculated; and analyzing the mechanical property requirement of the gold wire sample in the high-speed automatic bonding scene, constructing a mechanical property testing environment of the gold wire sample, calculating mechanical property parameters of the gold wire sample, and analyzing a gold wire quality analysis report in the high-speed automatic bonding scene. According to the invention, the quality effect of high-speed bonding can be improved.

Description

Technical Field

[0001] The present invention relates to the field of electronic engineering, and in particular to an analysis method and system for gold wire quality requirements in a high-speed automatic bonding scenario. Background Art

[0002] Gold wire quality requirements refer to the quality standards of gold wire (commonly referred to as gold wire or gold wire) used in the field of electronic manufacturing, especially in the integrated circuit (IC) packaging process, including: gold wire purity, gold wire diameter, gold wire surface quality and gold wire mechanical properties. In high-speed automatic bonding scenarios, the quality of gold wire directly affects production efficiency and product quality, so high-quality gold wire can ensure more stable electrical connections, reduce poor bonding, and improve the overall performance and reliability of the product.

[0003] At present, there are limited means of analyzing gold wire quality requirements. The quality requirements of gold wire are analyzed only through appearance inspection and simple physical testing. This method cannot discover potential quality problems of gold wire, resulting in the inability to meet the high quality requirements in high-speed automatic bonding scenarios. Summary of the invention

[0004] The present invention provides a method and system for analyzing gold wire quality requirements in a high-speed automatic bonding scenario, the main purpose of which is to improve the quality effect of high-speed bonding.

[0005] To achieve the above object, the present invention provides a method for analyzing gold wire quality requirements in a high-speed automatic bonding scenario, comprising:

[0006] Obtaining a gold wire sample applied to the high-speed automatic bonding scenario, taking a sample image of the gold wire sample using a preset optical microscope, preprocessing the sample image to obtain a preprocessed sample image, extracting image features of the preprocessed sample image, and analyzing surface parameters of the gold wire sample based on the image features;

[0007] Measuring the gold wire resistance of the gold wire sample at a constant temperature, and calculating the gold wire radius of the gold wire sample based on the gold wire resistance;

[0008] Analyze the impurity blackness and pure gold blackness of the gold wire sample, construct a blackness difference-impurity content curve of the gold wire sample based on the impurity blackness and pure gold blackness, and calculate the gold wire purity of the gold wire sample based on the blackness difference-impurity content curve;

[0009] Analyze the mechanical performance requirements of the gold wire sample in the high-speed automatic bonding scenario, build a mechanical performance test environment for the gold wire sample based on the mechanical performance requirements, and calculate the mechanical performance parameters of the gold wire sample based on the mechanical performance test environment, wherein the mechanical performance parameters include: elasticity, toughness, hardness, and durability;

[0010] Based on the surface parameters, the gold wire radius, the gold wire purity and the mechanical property parameters, a gold wire quality analysis report in the high-speed automatic bonding scenario is analyzed.

[0011] Optionally, preprocessing the sample image to obtain a preprocessed sample image includes:

[0012] Identifying the noise type of the sample image, and based on the noise type, denoising the sample image to obtain a denoised sample image;

[0013] Performing image contrast enhancement on the denoised sample image to obtain an enhanced sample image;

[0014] Sharpening the enhanced sample image using a preset Laplace operator to obtain a sharpened sample image;

[0015] The sharpened sample image is subjected to image binarization processing by a preset image binarization technology to obtain a preprocessed sample image.

[0016] Optionally, extracting image features of the preprocessed sample image includes:

[0017] Performing morphological operations on the preprocessed sample image to obtain a morphological sample image;

[0018] determining an image threshold of the morphological sample image;

[0019] Based on the image threshold, performing threshold division on the morphological sample image to obtain a sample image of a region of interest;

[0020] Detecting the real edge and potential edge of the sample image of the region of interest by using a preset Canny edge detection algorithm;

[0021] Extracting characteristic parameters of the sample image of the region of interest based on the real edge and the potential edge;

[0022] Based on the feature parameters, image features of the sample image of the region of interest are identified.

[0023] Optionally, measuring the gold wire resistance of the gold wire sample at a constant temperature includes:

[0024] Using a preset constant temperature box to set a constant temperature environment for the gold wire sample, and applying a constant current to the gold wire sample based on the constant temperature environment;

[0025] Based on the constant current and the constant temperature environment, measuring the left end voltage and the right end voltage of the gold wire sample;

[0026] Based on the constant current, the left end voltage and the right end voltage, the gold wire resistance of the gold wire sample is calculated using the following formula:

[0027] R=|V L -IV R |

[0028] Where R represents the wire resistance of the gold wire sample, V L Represents the voltage at the left end of the gold wire sample, V R represents the voltage at the right end of the gold wire sample, and I represents a constant current.

[0029] Optionally, calculating the gold wire radius of the gold wire sample based on the gold wire resistance includes:

[0030] measuring the gold wire length of the gold wire sample;

[0031] Based on the gold wire resistance, determining the gold wire resistivity of the gold wire sample;

[0032] Based on the gold wire length, the gold wire resistance and the gold wire resistivity, the gold wire radius of the gold wire sample is calculated using the following formula:

[0033]

[0034] Among them, r represents the radius of the gold wire, μ represents the resistivity of the gold wire, R represents the resistance of the gold wire, L represents the length of the gold wire, and π represents the circumference of a circle.

[0035] Optionally, the analyzing the impurity blackness and pure gold blackness of the gold wire sample includes:

[0036] constructing a test environment for measuring the gold wire sample;

[0037] Based on the test environment, collecting spectral data of the gold wire sample;

[0038] Based on the spectral data, determining a characteristic wavelength of the gold wire sample;

[0039] Analyzing the light intensity of the gold wire sample at the characteristic wavelength, wherein the light intensity includes the incident light intensity and the light intensity after the gold wire penetrates;

[0040] Obtaining the light intensity of a preset pure gold sample after pure gold penetration at the characteristic wavelength;

[0041] Based on the incident light intensity, the light intensity after the gold wire penetrates, and the light intensity after the pure gold penetrates, the impurity blackness and the pure gold blackness are calculated using the following formula:

[0042]

[0043] Among them, Pz Indicates the impurity blackness, P Au represents the blackness of pure gold, I0 represents the intensity of incident light, I z Indicates the light intensity after the gold wire penetrates, I Au Indicates the light intensity after pure gold penetrates, log 10 Represents the base 10 logarithmic function.

[0044] Optionally, constructing a blackness difference-impurity content curve of the gold wire sample based on the impurity blackness and the pure gold blackness includes:

[0045] Calculating a sample blackness difference of the gold wire sample based on the impurity blackness and the pure gold blackness;

[0046] Analyzing the logarithmic relationship between the blackness difference of the sample and the impurity content, and calculating the logarithmic value of the impurity content based on the logarithmic relationship;

[0047] Calculating the sensitivity of the sample blackness difference to the logarithmic value of the impurity content;

[0048] Based on the impurity blackness difference, the logarithm of the impurity content and the sensitivity, the sample blackness difference of the gold wire sample is calculated using the following formula:

[0049] ΔP=a*lgH+b

[0050] Among them, ΔP represents the blackness difference of the samples, lg represents the logarithmic function, lgH represents the logarithmic value of the impurity content of the gold wire sample, a represents the sensitivity of the impurity blackness difference to the logarithmic value of the impurity content, and b represents a constant.

[0051] Optionally, constructing a mechanical property test environment for the gold wire sample based on the mechanical property requirements includes:

[0052] Based on the mechanical property requirements, setting temperature conditions and humidity conditions for testing the gold wire sample;

[0053] Based on the mechanical property requirements, a mechanical property test plan for the gold wire sample is formulated, wherein the mechanical property test plan includes: a tensile test, a hardness test, and a fatigue test;

[0054] Arrange relevant testing equipment for the gold wire sample based on the mechanical property testing scheme;

[0055] Install the sensor of the relevant testing equipment, and build a data acquisition system for the gold wire sample based on the sensor;

[0056] Based on the temperature condition, the humidity condition, the mechanical property test scheme, the relevant test equipment and the data acquisition system, a mechanical property test environment for the gold wire sample is constructed.

[0057] Optionally, the calculating the mechanical property parameters of the gold wire sample based on the mechanical property test environment includes:

[0058] Based on the tensile test corresponding to the mechanical properties test environment, the elasticity and toughness of the gold wire sample were calculated using the following formula:

[0059]

[0060] Wherein, T represents the elasticity of the gold wire sample, G represents the toughness of the gold wire sample, F represents the force acting on the gold wire sample, π represents the circumference, r represents the radius of the gold wire sample, α represents the relative deformation of the gold wire sample, and αf represents the final strain of the gold wire sample;

[0061] Based on the hardness test corresponding to the mechanical property test environment, the hardness of the gold wire sample is calculated using the following formula:

[0062] Where, Y represents the hardness of the gold wire sample, F y represents the pressure acting on the gold wire sample, π represents the circumference of a circle, and D represents the diameter of the indentation on the surface of the gold wire sample;

[0063] Based on the fatigue test corresponding to the mechanical property test environment, the durability of the gold wire sample is calculated using the following formula:

[0064]

[0065] Among them, N represents the durability of the gold wire sample, θ represents the stress concentration factor, M0 represents the stress level, and M1 represents the fatigue strength of the gold wire sample;

[0066] Based on the elasticity, the toughness, the hardness and the durability, the mechanical property parameters of the gold wire sample are determined.

[0067] In order to solve the above problems, the present invention also provides an analysis system for gold wire quality requirements in a high-speed automatic bonding scenario, the system comprising:

[0068] A gold wire surface analysis module is used to obtain a gold wire sample applied to the high-speed automatic bonding scenario, take a sample image of the gold wire sample using a preset optical microscope, pre-process the sample image to obtain a pre-processed sample image, extract image features of the pre-processed sample image, and analyze surface parameters of the gold wire sample based on the image features;

[0069] A gold wire radius measurement module, used to measure the gold wire resistance of the gold wire sample at a constant temperature, and calculate the gold wire radius of the gold wire sample based on the gold wire resistance;

[0070] A gold wire purity analysis module, used for analyzing the impurity blackness and pure gold blackness of the gold wire sample, constructing a blackness difference-impurity content curve of the gold wire sample based on the impurity blackness and pure gold blackness, and calculating the gold wire purity of the gold wire sample based on the blackness difference-impurity content curve;

[0071] A gold wire mechanical property calculation module, used to analyze the mechanical property requirements of the gold wire sample in the high-speed automatic bonding scenario, build a mechanical property test environment for the gold wire sample based on the mechanical property requirements, and calculate the mechanical property parameters of the gold wire sample based on the mechanical property test environment, wherein the mechanical property parameters include: elasticity, toughness, hardness and durability;

[0072] The gold wire quality report analysis module is used to analyze the gold wire quality analysis report in the high-speed automatic bonding scenario based on the surface parameters, the gold wire radius, the gold wire purity and the mechanical property parameters.

[0073] The embodiment of the present invention can provide samples for subsequent testing and analysis of gold wire quality requirements by obtaining gold wire samples applied to the high-speed automatic bonding scenario; optionally, the embodiment of the present invention can improve the quality of the gold wire sample image by preprocessing the sample image to obtain a preprocessed sample image, making it more suitable for further analysis, identification and measurement; the embodiment of the present invention can improve the detection efficiency of the gold wire sample by analyzing the surface parameters of the gold wire sample based on the image features; the embodiment of the present invention can accurately calculate the radius of the gold wire by calculating the gold wire radius of the gold wire sample based on the gold wire resistance, thereby reducing the error; the embodiment of the present invention can accurately determine the relative content of impurities in the sample by constructing a blackness difference-impurity content curve of the gold wire sample based on the impurity blackness and pure gold blackness, quickly detect the purity of the gold wire sample, and reduce the detection cost; finally, the embodiment of the present invention can ensure that the gold wire used in the high-speed automatic bonding scenario has an ideal quality by analyzing the gold wire quality analysis report in the high-speed automatic bonding scenario based on the surface parameters, the gold wire radius, the gold wire purity and the mechanical performance index, thereby improving the efficiency of the entire bonding process and product quality. Therefore, the present invention can improve the quality effect of high-speed bonding. BRIEF DESCRIPTION OF THE DRAWINGS

[0074] Figure 1 A schematic flow chart of a method for analyzing gold wire quality requirements in a high-speed automatic bonding scenario provided by an embodiment of the present invention;

[0075] Figure 2 A functional module diagram of a system for analyzing gold wire quality requirements in a high-speed automatic bonding scenario provided by an embodiment of the present invention;

[0076] Figure 3 A schematic diagram of the structure of an electronic device of a system for analyzing gold wire quality requirements in a high-speed automatic bonding scenario provided by an embodiment of the present invention;

[0077] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0078] It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention.

[0079] The embodiment of the present application provides an analysis method for the quality requirements of gold wires in a high-speed automatic bonding scenario. The execution subject of the analysis method for the quality requirements of gold wires in the high-speed automatic bonding scenario includes but is not limited to at least one of the electronic devices such as a server and a terminal that can be configured to execute the method provided in the embodiment of the present application. In other words, the analysis method for the quality requirements of gold wires in the high-speed automatic bonding scenario can be executed by software or hardware installed on a terminal device or a server device, and the software can be a blockchain platform. The server includes but is not limited to: a single server, a server cluster, a cloud server or a cloud server cluster, etc. The server can be an independent server, or it can be a cloud server that provides cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communications, middleware services, domain name services, security services, content delivery networks (Content Delivery Network, CDN), and basic cloud computing services such as big data and artificial intelligence platforms.

[0080] Reference Figure 1 FIG. 1 is a flow chart of a method for analyzing the quality requirements of gold wires in a high-speed automatic bonding scenario provided by an embodiment of the present invention. In this embodiment, the method for analyzing the quality requirements of gold wires in a high-speed automatic bonding scenario includes:

[0081] S1. Obtain a gold wire sample applied to the high-speed automatic bonding scenario, take a sample image of the gold wire sample using a preset optical microscope, preprocess the sample image to obtain a preprocessed sample image, extract image features of the preprocessed sample image, and analyze surface parameters of the gold wire sample based on the image features;

[0082] The embodiment of the present invention can provide samples for subsequent testing and analysis of gold wire quality requirements by obtaining gold wire samples applied to the high-speed automatic bonding scenario, wherein the gold wire samples refer to samples randomly selected from gold wires produced according to the quality requirements.

[0083] The embodiment of the present invention can provide a higher magnification, a clearer image and multi-angle observation by taking a sample image of the gold wire sample using a preset optical microscope, so as to better understand and study the structure and characteristics of the gold wire sample. The preset optical microscope is an instrument that uses optical principles to magnify tiny objects for observation, such as a reflection microscope.

[0084] As an embodiment of the present invention, the sample image of the gold wire sample taken by using a preset optical microscope can be collected by a camera attached to the microscope.

[0085] The embodiment of the present invention can improve the quality of the gold wire sample image by preprocessing the sample image to obtain a preprocessed sample image, making it more suitable for further analysis, identification and measurement. The preprocessing refers to a series of operations and processing steps on the sample image, such as denoising, sharpening and threshold processing.

[0086] As an embodiment of the present invention, the preprocessing of the sample image to obtain the preprocessed sample image includes:

[0087] Identifying the noise type of the sample image, and based on the noise type, denoising the sample image to obtain a denoised sample image;

[0088] Performing image contrast enhancement on the denoised sample image to obtain an enhanced sample image;

[0089] Sharpening the enhanced sample image using a preset Laplace operator to obtain a sharpened sample image;

[0090] The sharpened sample image is subjected to image binarization processing by a preset image binarization technology to obtain a preprocessed sample image.

[0091] The noise type refers to the type of noise present in the sample image, such as Gaussian noise, salt and pepper noise, etc. The denoised sample image refers to the image obtained by denoising the sample image. The Laplace operator refers to a second-order derivative operator used to highlight the edges and details in the image. The image binarization technology refers to a basic image processing technology, which aims to set the grayscale value of the pixel points in the image to 0 or 255 (or some other fixed value), thereby converting the image into black and white.

[0092] Optionally, the noise type of the sample image may be identified by a filter response analysis method, which refers to a method of using specific filters for different types of noise, analyzing filtering results, and determining the noise type.

[0093] Exemplarily, based on the noise type, the sample image may be denoised by non-local mean filtering, or other denoising methods may be selected according to the noise type, such as a Strom filter, a median filter or a wavelet transform.

[0094] Optionally, the image contrast enhancement of the denoised sample image may be performed by a local contrast enhancement algorithm, wherein the local contrast enhancement algorithm refers to an algorithm for improving the contrast of a specific area in a picture, such as histogram equalization, adaptive histogram equalization, etc.

[0095] The embodiment of the present invention can improve the accuracy of subsequent image processing tasks and improve the processing speed and efficiency by extracting the image features of the preprocessed sample image, wherein the image features refer to information in the image that can be used to identify, classify or describe the image content, such as texture features, spatial features, and shape features.

[0096] As an embodiment of the present invention, the extracting image features of the preprocessed sample image includes:

[0097] Performing morphological operations on the preprocessed sample image to obtain a morphological sample image;

[0098] determining an image threshold of the morphological sample image;

[0099] Based on the image threshold, performing threshold division on the morphological sample image to obtain a sample image of a region of interest;

[0100] Detecting the real edge and potential edge of the sample image of the region of interest by using a preset Canny edge detection algorithm;

[0101] Extracting characteristic parameters of the sample image of the region of interest based on the real edge and the potential edge;

[0102] Based on the feature parameters, image features of the sample image of the region of interest are identified.

[0103] Among them, the morphological operation refers to a technology in image processing, which changes the shape and structure of the image through a series of basic operations, including: corrosion, expansion, opening operation and closing operation, etc. The image threshold refers to a grayscale value. When the pixel value in the image is greater than (or less than) this value, these pixels will be divided into a category. The sample image of the region of interest refers to the image area divided based on the image threshold, which contains the features or objects of interest. The Canny edge detection algorithm refers to a detection algorithm that captures the edges in the image as accurately as possible while minimizing the errors in edge detection. The real edge refers to the edge that actually exists in the image, which is the actual boundary of the image content. The potential edge refers to the edge that may exist in the image, which is the edge position predicted by the edge detection algorithm. The feature parameter refers to the numerical value extracted from the image to describe the image features.

[0104] Optionally, the image threshold for determining the morphological sample image may be determined by an automatic threshold algorithm, such as a maximum inter-class variance method, a minimum error threshold method, and an adaptive threshold method.

[0105] Optionally, the threshold segmentation of the morphological sample image can be performed by Otsu method, wherein the Otsu method refers to a method for maximizing the image segmentation effect by calculating the intra-class variance and the inter-class variance to determine an optimal threshold.

[0106] The embodiment of the present invention can improve the detection efficiency of the gold wire sample by analyzing the surface parameters of the gold wire sample based on the image features, wherein the surface parameters refer to a series of indicators that describe the surface characteristics of the gold wire, including: surface smoothness and surface defects.

[0107] As an embodiment of the present invention, the surface parameters of the gold wire sample analyzed based on the image features may be analyzed by principal component analysis.

[0108] S2, measuring the gold wire resistance of the gold wire sample at a constant temperature, and calculating the gold wire radius of the gold wire sample based on the gold wire resistance;

[0109] The embodiment of the present invention can be used to determine the conductive properties of the gold wire sample by measuring the gold wire resistance of the gold wire sample at a constant temperature, and provide data for the subsequent calculation of the radius of the gold wire sample. The gold wire resistance refers to the resistance caused by the gold wire to the flow of current when the current passes through the gold wire.

[0110] As an embodiment of the present invention, the step of measuring the gold wire resistance of the gold wire sample at a constant temperature includes:

[0111] Using a preset constant temperature box to set a constant temperature environment for the gold wire sample, and applying a constant current to the gold wire sample based on the constant temperature environment;

[0112] Based on the constant current and the constant temperature environment, measuring the left end voltage and the right end voltage of the gold wire sample;

[0113] Based on the constant current, the left end voltage and the right end voltage, the gold wire resistance of the gold wire sample is calculated using the following formula:

[0114]

[0115] Where R represents the wire resistance of the gold wire sample, V L Represents the voltage at the left end of the gold wire sample, V R represents the voltage at the right end of the gold wire sample, and I represents a constant current.

[0116] The constant temperature box refers to a box that can provide a stable temperature environment, which is usually used to control the experimental conditions to ensure that the temperature of the gold wire sample remains constant during the test. The constant temperature environment refers to the temperature condition of the gold wire sample controlled by the constant temperature box. The constant current refers to the current value applied to both ends of the gold wire sample, and this current value remains unchanged during the entire test process. The left-end voltage refers to the voltage value at the left end of the gold wire sample in the circuit, and the right-end voltage refers to the voltage value at the right end of the gold wire sample in the circuit.

[0117] Optionally, the left end voltage and the right end voltage of the gold wire sample can be measured by a four-terminal method, wherein the four-terminal method refers to a measurement method in which a measuring instrument is connected between the two ends of the component to be measured and a reference potential, respectively, thereby eliminating the influence of contact resistance and lead resistance in the measurement circuit.

[0118] The embodiment of the present invention can accurately calculate the radius of the gold wire by calculating the gold wire radius of the gold wire sample based on the gold wire resistance, thereby reducing the error. The gold wire radius refers to a key parameter of the gold wire geometry, which has an important influence on the mechanical and electrical properties of the gold wire, and is also an important factor in determining the physical properties of the gold wire, such as resistivity, current carrying capacity and thermal expansion coefficient.

[0119] As an embodiment of the present invention, the step of calculating the gold wire radius of the gold wire sample based on the gold wire resistance includes:

[0120] measuring the gold wire length of the gold wire sample;

[0121] Based on the gold wire resistance, determining the gold wire resistivity of the gold wire sample;

[0122] Based on the gold wire length, the gold wire resistance and the gold wire resistivity, the gold wire radius of the gold wire sample is calculated using the following formula:

[0123]

[0124] Among them, r represents the radius of the gold wire, μ represents the resistivity of the gold wire, R represents the resistance of the gold wire, L represents the length of the gold wire, and π represents the circumference of a circle.

[0125] The gold wire length refers to the actual length of the gold wire sample. The gold wire resistivity refers to the resistance of the gold wire sample to electric current.

[0126] Optionally, the determination of the gold wire resistivity of the gold wire sample based on the gold wire resistance may be performed by searching for the gold wire resistivity of the constant temperature environment in which the gold wire resistance is located. The gold wire resistivity is approximately 22.4×10^-8Ω·m.

[0127] S3, analyzing the impurity blackness and pure gold blackness of the gold wire sample, constructing a blackness difference-impurity content curve of the gold wire sample based on the impurity blackness and pure gold blackness, and calculating the gold wire purity of the gold wire sample based on the blackness difference-impurity content curve;

[0128] The embodiment of the present invention can provide a data basis for the subsequent calculation of the purity of the gold wire sample by analyzing the impurity blackness and pure gold blackness of the gold wire sample. The impurity blackness refers to the absorption spectrum characteristics of the impurity elements in the gold wire, and the pure gold blackness refers to the absorption spectrum characteristics of pure gold under the same conditions.

[0129] As an embodiment of the present invention, the analysis of the impurity blackness and the pure gold blackness of the gold wire sample includes:

[0130] constructing a test environment for measuring the gold wire sample;

[0131] Based on the test environment, collecting spectral data of the gold wire sample;

[0132] Based on the spectral data, determining a characteristic wavelength of the gold wire sample;

[0133] Analyzing the light intensity of the gold wire sample at the characteristic wavelength, wherein the light intensity includes the incident light intensity and the light intensity after the gold wire penetrates;

[0134] Obtaining the light intensity of a preset pure gold sample after pure gold penetration at the characteristic wavelength;

[0135] Based on the incident light intensity, the light intensity after the gold wire penetrates, and the light intensity after the pure gold penetrates, the impurity blackness and the pure gold blackness are calculated using the following formula:

[0136]

[0137] Among them, P z Indicates the impurity blackness, P Au represents the blackness of pure gold, I0 represents the intensity of incident light, I z Indicates the light intensity after the gold wire penetrates, I Au Indicates the light intensity after pure gold penetrates, log 10 Represents the base 10 logarithmic function.

[0138] Among them, the test environment refers to a set of experimental equipment and conditions established to measure the gold wire sample, such as: a spectrometer, a light source, and a photodetector. The spectral data refers to the data collected by the spectrometer, which shows the light intensity after the light of different wavelengths (or frequencies) interacts with the gold wire sample. The characteristic wavelength refers to the specific wavelength in the spectral data that is related to the specific component (such as pure gold or impurities) in the gold wire sample. The incident light intensity refers to the original light intensity emitted by the light source when no gold wire sample is placed, which is the reference value for measuring blackness. The light intensity after gold wire penetration refers to the light intensity after the light beam passes through the gold wire sample to be tested; the preset pure gold sample refers to the light intensity after the pure gold penetration light beam passes through the preset pure gold sample, which is used as a reference.

[0139] The embodiment of the present invention can accurately determine the relative content of impurities in the sample by constructing the blackness difference-impurity content curve of the gold wire sample based on the impurity blackness and the pure gold blackness, quickly detect the purity of the gold wire sample, and reduce the detection cost. The blackness difference-impurity content curve refers to the relationship between the sample blackness and the impurity content.

[0140] As an embodiment of the present invention, the blackness difference-impurity content curve of the gold wire sample is constructed based on the impurity blackness and the pure gold blackness, including:

[0141] Calculating a sample blackness difference of the gold wire sample based on the impurity blackness and the pure gold blackness;

[0142] Analyzing the logarithmic relationship between the blackness difference of the sample and the impurity content, and calculating the logarithmic value of the impurity content based on the logarithmic relationship;

[0143] Calculating the sensitivity of the sample blackness difference to the logarithmic value of the impurity content;

[0144] Based on the impurity blackness difference, the logarithm of the impurity content and the sensitivity, the sample blackness difference of the gold wire sample is calculated using the following formula:

[0145] ΔP=a*lgH+b

[0146] Among them, ΔP represents the blackness difference of the sample, lg represents the logarithmic function, lgH represents the logarithmic value of the impurity content of the gold wire sample, a represents the sensitivity of the impurity blackness difference to the logarithmic value of the impurity content, and b represents a constant;

[0147] According to the blackness difference of the sample, a blackness difference-impurity content curve of the gold wire sample is constructed.

[0148] The logarithmic relationship refers to a mathematical relationship between the blackness difference of the sample and the impurity content, which is usually presented as a logarithmic relationship. The sensitivity refers to the degree of response of the blackness difference of the sample to the change in the logarithmic value of the impurity content.

[0149] Optionally, the calculation of the impurity blackness difference of the gold wire sample can be obtained by obtaining an average value from average results of three parallel measurements of each of the gold wire samples.

[0150] The embodiment of the present invention can improve detection accuracy, efficiency and reduce costs by calculating the gold wire purity of the gold wire sample based on the blackness difference-impurity content curve. The gold wire purity refers to the percentage of gold in the gold wire.

[0151] As an embodiment of the present invention, the gold wire purity of the gold wire sample based on the blackness difference-impurity content curve can be calculated by the impurity blackness difference of the gold wire sample measured by spectral analysis and the corresponding impurity content on the blackness difference-impurity content curve.

[0152] S4, analyzing the mechanical performance requirements of the gold wire sample in the high-speed automatic bonding scenario, constructing a mechanical performance test environment for the gold wire sample based on the mechanical performance requirements, and calculating the mechanical performance parameters of the gold wire sample based on the mechanical performance test environment, wherein the mechanical performance parameters include: elasticity, toughness, hardness, and durability;

[0153] The embodiment of the present invention ensures that the gold wire has mechanical properties suitable for high-speed bonding by analyzing the mechanical property requirements of the gold wire sample in the high-speed automatic bonding scenario. The mechanical property requirements refer to a series of physical and mechanical property requirements that the gold wire must meet during the high-speed automatic bonding process, such as elasticity requirements, toughness requirements, hardness requirements, and durability requirements.

[0154] As an embodiment of the present invention, the analysis of the mechanical property requirements of the gold wire sample in the high-speed automatic bonding scenario can be performed by collecting gold wire performance data and any related failure modes in previous bonding processes.

[0155] The embodiment of the present invention can ensure the applicability and reliability of the gold wire in practical applications by constructing a mechanical property test environment of the gold wire sample based on the mechanical property requirements. The mechanical property test environment refers to a set of specially designed experimental devices and conditions for simulating various mechanical stresses experienced by the gold wire during high-speed automatic bonding, and performing quantitative tests and evaluations thereof, such as tensile tests, compression tests, and fatigue tests.

[0156] As an embodiment of the present invention, the step of constructing a mechanical property test environment of the gold wire sample based on the mechanical property requirements includes:

[0157] Based on the mechanical property requirements, setting temperature conditions and humidity conditions for testing the gold wire sample;

[0158] Based on the mechanical property requirements, a mechanical property test plan for the gold wire sample is formulated, wherein the mechanical property test plan includes: a tensile test, a hardness test, and a fatigue test;

[0159] Arrange relevant testing equipment for the gold wire sample based on the mechanical property testing scheme;

[0160] Install the sensor of the relevant testing equipment, and build a data acquisition system for the gold wire sample based on the sensor;

[0161] Based on the temperature condition, the humidity condition, the mechanical property test scheme, the relevant test equipment and the data acquisition system, a mechanical property test environment for the gold wire sample is constructed.

[0162] Among them, the temperature condition refers to the temperature range and stability of the gold wire sample during the test; the humidity condition refers to the relative humidity range and stability of the gold wire sample during the test. The mechanical property test plan refers to a detailed test plan formulated according to the mechanical property requirements of the gold wire. The tensile test refers to a test used to measure the performance of the gold wire sample under tensile load. The hardness test refers to a test used to measure the ability of the gold wire sample to resist local deformation. The fatigue test refers to a test used to evaluate the durability of the gold wire under repeated loads. The relevant testing equipment refers to equipment used to test the mechanical properties of the gold wire sample, such as: universal testing machine and fatigue testing machine. The sensor refers to an instrument used to measure the relevant data of the gold wire sample in the test, such as: force sensor and displacement sensor. The data acquisition system refers to a system used to record relevant test data during the test in real time.

[0163] Optionally, the temperature condition and humidity condition set for testing the gold wire sample may be set by using a temperature controller and a humidity controller.

[0164] In detail, the data acquisition system can be constructed by building an information network connecting the sensors.

[0165] The embodiment of the present invention can effectively determine the mechanical properties of the gold wire sample by calculating the mechanical property parameters of the gold wire sample based on the mechanical property test environment, and screen out the gold wire that meets the quality requirements. The mechanical property parameters refer to a series of properties of the mechanical behavior exhibited by the gold wire sample when subjected to external force.

[0166] As an embodiment of the present invention, the calculating the mechanical property parameters of the gold wire sample based on the mechanical property test environment includes:

[0167] Based on the tensile test corresponding to the mechanical properties test environment, the elasticity and toughness of the gold wire sample were calculated using the following formula:

[0168]

[0169] Wherein, T represents the elasticity of the gold wire sample, G represents the toughness of the gold wire sample, F represents the force acting on the gold wire sample, π represents the circumference, r represents the radius of the gold wire sample, α represents the relative deformation of the gold wire sample, and αf represents the final strain of the gold wire sample;

[0170] Based on the hardness test corresponding to the mechanical property test environment, the hardness of the gold wire sample is calculated using the following formula:

[0171] Where, Y represents the hardness of the gold wire sample, F y represents the pressure acting on the gold wire sample, π represents the circumference of a circle, and D represents the diameter of the indentation on the surface of the gold wire sample;

[0172] Based on the fatigue test corresponding to the mechanical property test environment, the durability of the gold wire sample is calculated using the following formula:

[0173]

[0174] Among them, N represents the durability of the gold wire sample, θ represents the stress concentration factor, M0 represents the stress level, and M1 represents the fatigue strength of the gold wire sample;

[0175] Based on the elasticity, the toughness, the hardness and the durability, the mechanical property parameters of the gold wire sample are determined.

[0176] Among them, the elasticity refers to the ability of the gold wire to return to its original shape after being subjected to external force, and the toughness refers to the energy that the gold wire can absorb before breaking, and its ability to plastically deform under the action of external force. The relative deformation refers to the ratio of the deformation of the gold wire sample during the stretching process to its original length. The final strain refers to the strain of the gold wire from the beginning to the break or reaching the preset deformation in the tensile test. The hardness refers to the ability of the gold wire to resist local indentation or scratching. The durability refers to the ability of the gold wire sample to maintain its performance and function under repeated use or long-term exposure to specific environmental conditions. The stress concentration factor refers to the ratio of local stress to uniform stress caused by surface defects, edge protrusions or other discontinuities of the gold wire. The stress level refers to the stress applied to the gold wire in the fatigue test. The fatigue strength refers to the maximum stress that the gold wire can withstand under infinite life conditions.

[0177] S5. Analyze the gold wire quality analysis report in the high-speed automatic bonding scenario based on the surface parameters, the gold wire radius, the gold wire purity and the mechanical performance index;

[0178] The embodiment of the present invention can ensure that the gold wire used in the high-speed automatic bonding scenario has ideal quality by analyzing the gold wire quality analysis report in the high-speed automatic bonding scenario based on the surface parameters, the gold wire radius, the gold wire purity and the mechanical performance index, thereby improving the efficiency of the entire bonding process and product quality. The gold wire quality analysis report refers to an analysis report on the gold wire quality obtained by analyzing the surface parameters, radius, purity and mechanical performance index of the gold wire.

[0179] As an embodiment of the present invention, the gold wire quality analysis report in the high-speed automatic bonding scenario based on the surface parameters, the gold wire radius, the gold wire purity and the mechanical performance indicators can be analyzed by evaluating whether the quality of the gold wire sample meets the requirements according to the actual application needs of the gold wire sample in the high-speed automatic bonding scenario.

[0180] The embodiment of the present invention can provide samples for subsequent testing and analysis of gold wire quality requirements by obtaining gold wire samples applied to the high-speed automatic bonding scenario; optionally, the embodiment of the present invention can improve the quality of the gold wire sample image by preprocessing the sample image to obtain a preprocessed sample image. Make it more suitable for further analysis, identification and Measurement; The embodiment of the present invention is based on the imageFeatures, analyzing the surface parameters of the gold wire sample can improve the detection efficiency of the gold wire sample; the embodiment of the present invention can accurately calculate the radius of the gold wire by calculating the gold wire radius of the gold wire sample based on the gold wire resistance, reducing the error, and the embodiment of the present invention can accurately determine the relative content of impurities in the sample by constructing the blackness difference-impurity content curve of the gold wire sample based on the impurity blackness and pure gold blackness, quickly detect the purity of the gold wire sample, and reduce the detection cost. Finally, the embodiment of the present invention can ensure that the gold wire used in the high-speed automatic bonding scenario has ideal quality by analyzing the gold wire quality analysis report in the high-speed automatic bonding scenario based on the surface parameters, the gold wire radius, the gold wire purity and the mechanical performance indicators, thereby improving the efficiency of the entire bonding process and product quality. Therefore, the present invention can improve the quality effect of high-speed bonding.

[0181] like Figure 2 , is a functional module diagram of a system for analyzing gold wire quality requirements in a high-speed automatic bonding scenario provided by an embodiment of the present invention.

[0182] The analysis system 200 for gold wire quality requirements in the high-speed automatic bonding scenario of the present invention can be installed in an electronic device. According to the functions implemented, the analysis system 200 for gold wire quality requirements in the high-speed automatic bonding scenario can include a gold wire surface analysis module 201, a gold wire radius measurement module 202, a gold wire purity analysis module 203, a gold wire mechanical property measurement module 204 and a gold wire quality report analysis module 205. The module described in the present invention can also be referred to as a unit, which refers to a series of computer program segments that can be executed by an electronic device processor and can complete fixed functions, which are stored in the memory of the electronic device.

[0183] In this embodiment, the functions of each module / unit are as follows:

[0184] The gold wire surface analysis module 201 is used to obtain a gold wire sample applied to the high-speed automatic bonding scenario, take a sample image of the gold wire sample using a preset optical microscope, pre-process the sample image to obtain a pre-processed sample image, extract image features of the pre-processed sample image, and analyze surface parameters of the gold wire sample based on the image features;

[0185] The gold wire radius measuring module 202 is used to measure the gold wire resistance of the gold wire sample at a constant temperature, and calculate the gold wire radius of the gold wire sample based on the gold wire resistance;

[0186] The gold wire purity analysis module 203 is used to analyze the impurity blackness and pure gold blackness of the gold wire sample, construct a blackness difference-impurity content curve of the gold wire sample based on the impurity blackness and pure gold blackness, and calculate the gold wire purity of the gold wire sample based on the blackness difference-impurity content curve;

[0187] The gold wire mechanical property calculation module 204 is used to analyze the mechanical property requirements of the gold wire sample in the high-speed automatic bonding scenario, build a mechanical property test environment for the gold wire sample based on the mechanical property requirements, and calculate the mechanical property parameters of the gold wire sample based on the mechanical property test environment, wherein the mechanical property parameters include: elasticity, toughness, hardness and durability;

[0188] The gold wire quality report analysis module 205 is used to analyze the gold wire quality analysis report in the high-speed automatic bonding scenario based on the surface parameters, the gold wire radius, the gold wire purity and the mechanical property parameters.

[0189] In detail, the modules described in the analysis system 200 for gold wire quality requirements in the high-speed automatic bonding scenario described in the embodiment of the present invention adopt the same technical means as the analysis method for gold wire quality requirements in the high-speed automatic bonding scenario described in the accompanying drawings when used, and can produce the same technical effects, which will not be repeated here.

[0190] An embodiment of the present invention provides an electronic device for implementing a method for analyzing gold wire quality requirements in a high-speed automatic bonding scenario.

[0191] See also Figure 3 As shown, the electronic device may include a processor 30, a memory 31, a communication bus 32 and a communication interface 33, and may also include a computer program stored in the memory 31 and executable on the processor 30, such as an analysis method program for gold wire quality requirements in a high-speed automatic bonding scenario.

[0192] In some embodiments, the processor may be composed of an integrated circuit, for example, a single packaged integrated circuit, or a plurality of packaged integrated circuits with the same or different functions, including one or more central processing units (CPUs), microprocessors, digital processing chips, graphics processors, and a combination of various control chips. The processor is the control core (Control Unit) of the electronic device, and uses various interfaces and lines to connect the various components of the entire electronic device. It runs or executes programs or modules stored in the memory (for example, an analysis program for the quality requirements of gold wires in high-speed automatic bonding scenarios, etc.), and calls data stored in the memory to execute various functions of the electronic device and process data.

[0193] The memory includes at least one type of readable storage medium, and the readable storage medium includes flash memory, mobile hard disk, multimedia card, card-type memory (for example: SD or DX memory, etc.), magnetic memory, disk, optical disk, etc. In some embodiments, the memory may be an internal storage unit of an electronic device, such as a mobile hard disk of the electronic device. In other embodiments, the memory may also be an external storage device of an electronic device, such as a plug-in mobile hard disk, a smart memory card (Smart Media Card, SMC), a secure digital (Secure Digital, SD) card, a flash card (Flash Card), etc. equipped on the electronic device. Further, the memory may also include both an internal storage unit of the electronic device and an external storage device. The memory can be used not only to store application software and various types of data installed in the electronic device, such as the code of the analysis program based on the quality requirements of the gold wire in the high-speed automatic bonding scenario, but also to temporarily store data that has been output or is to be output.

[0194] The communication bus may be a Peripheral Component Interconnect (PCI) bus or an Extended Industry Standard Architecture (EISA) bus, etc. The bus may be divided into an address bus, a data bus, a control bus, etc. The bus is configured to realize connection and communication between the memory and at least one processor, etc.

[0195] The communication interface is used for communication between the above-mentioned electronic device and other devices, including a network interface and a user interface. Optionally, the network interface may include a wired interface and / or a wireless interface (such as a WI-FI interface, a Bluetooth interface, etc.), which is generally used to establish a communication connection between the electronic device and other electronic devices. The user interface may be a display (Display), an input unit (such as a keyboard (Keyboard)), and optionally, the user interface may also be a standard wired interface, a wireless interface. Optionally, in some embodiments, the display may be an LED display, a liquid crystal display, a touch-sensitive liquid crystal display, and an OLED (Organic Light-Emitting Diode, organic light-emitting diode) touch device, etc. Among them, the display may also be appropriately referred to as a display screen or a display unit, which is used to display information processed in the electronic device and to display a visual user interface.

[0196] For example, although not shown, the electronic device may also include a power source (such as a battery) for supplying power to each component. Preferably, the power source may be logically connected to the at least one processor through a power management system, so that the power management system can realize functions such as charging management, discharging management, and power consumption management. The power source may also include any components such as one or more DC or AC power sources, recharging systems, power failure detection circuits, power converters or inverters, and power status indicators. The electronic device may also include a variety of sensors, Bluetooth modules, Wi-Fi modules, etc., which will not be repeated here.

[0197] It should be understood that the embodiment is for illustration only and the scope of the patent application is not limited to this structure.

[0198] The analysis program for gold wire quality requirements in a high-speed automatic bonding scenario stored in the memory in the electronic device is a combination of multiple instructions, and when running in the processor, the following can be achieved:

[0199] Acquire an application scenario and features of the aerial screen, analyze the best viewing angle of the aerial screen compared to a screen application user corresponding to the application scenario based on the application scenario and the features of the aerial screen, and determine the aerial posture of the aerial screen based on the best viewing angle;

[0200] Based on the features of the aerial screen, the load to be carried by the aerial screen is calculated, and based on the load to be carried and the aerial posture, a target UAV of the aerial screen is determined;

[0201] Constructing a power supply system and a length-adaptive cable system for the target UAV and the aerial screen, constructing a running trajectory model of the target UAV based on the aerial posture and the environmental characteristics corresponding to the application scenario, and fixing the aerial screen to the aerial posture using the target UAV based on the length-adaptive cable system and the running trajectory model to obtain a target aerial screen;

[0202] The target aerial screen is powered by the power supply system to obtain an aerial screen display, and an energy consumption AOC model of the power supply system, the target UAV and the aerial screen display is constructed;

[0203] Collect screen display image data of the aerial screen, identify the flight status of the target UAV, configure power supply parameters of the power supply system using the energy consumption AOC model based on the screen display image data and the flight status, and perform stable display of the aerial screen based on the power supply parameters.

[0204] Specifically, the specific implementation method of the processor for the above instructions can refer to the description of the relevant steps in the corresponding embodiment of the accompanying drawings, which will not be repeated here.

[0205] Furthermore, if the module / unit integrated in the electronic device is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. The computer-readable storage medium can be volatile or non-volatile. For example, the computer-readable medium may include: any entity or system capable of carrying the computer program code, a recording medium, a USB flash drive, a mobile hard disk, a magnetic disk, an optical disk, a computer memory, and a read-only memory (ROM).

[0206] The present invention further provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor of an electronic device, the computer program can implement:

[0207] Obtaining a gold wire sample applied to the high-speed automatic bonding scenario, taking a sample image of the gold wire sample using a preset optical microscope, preprocessing the sample image to obtain a preprocessed sample image, extracting image features of the preprocessed sample image, and analyzing surface parameters of the gold wire sample based on the image features;

[0208] Measuring the gold wire resistance of the gold wire sample at a constant temperature, and calculating the gold wire radius of the gold wire sample based on the gold wire resistance;

[0209] Analyze the impurity blackness and pure gold blackness of the gold wire sample, construct a blackness difference-impurity content curve of the gold wire sample based on the impurity blackness and pure gold blackness, and calculate the gold wire purity of the gold wire sample based on the blackness difference-impurity content curve;

[0210] Analyze the mechanical performance requirements of the gold wire sample in the high-speed automatic bonding scenario, build a mechanical performance test environment for the gold wire sample based on the mechanical performance requirements, and calculate the mechanical performance parameters of the gold wire sample based on the mechanical performance test environment, wherein the mechanical performance parameters include:

[0211] Elasticity, toughness, hardness and durability;

[0212] Based on the surface parameters, the gold wire radius, the gold wire purity and the mechanical property parameters, a gold wire quality analysis report in the high-speed automatic bonding scenario is analyzed.

[0213] In the several embodiments provided by the present invention, it should be understood that the disclosed devices, systems and methods can be implemented in other ways. For example, the system embodiments described above are only schematic, for example, the division of the modules is only a logical function division, and there may be other division methods in actual implementation.

[0214] The modules described as separate components may or may not be physically separated, and the components shown as modules may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0215] In addition, each functional module in each embodiment of the present invention may be integrated into one processing unit, each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of hardware plus software functional modules.

[0216] It is obvious to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention.

[0217] Therefore, no matter from which point of view, the embodiments should be regarded as illustrative and non-restrictive, and the scope of the present invention is limited by the appended claims rather than the above description, so it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention. Any attached figure mark in the claims should not be regarded as limiting the claims involved.

[0218] The embodiments of the present application can acquire and process relevant data based on artificial intelligence technology. Among them, artificial intelligence (AI) is the theory, method, technology and application system that uses digital computers or machines controlled by digital computers to simulate, extend and expand human intelligence, perceive the environment, acquire knowledge and use knowledge to obtain the best results.

[0219] In addition, it is clear that the word "comprising" does not exclude other units or steps, and the singular does not exclude the plural. Multiple units or systems stated in a system claim can also be implemented by one unit or system through software or hardware. The words first, second, etc. are used to indicate names, and do not indicate any particular order.

[0220] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solution of the present invention can be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present invention.

Claims

1. A method for analyzing gold wire quality requirements in a high-speed automatic bonding scenario, characterized in that: The method comprises: Obtaining a gold wire sample applied to the high-speed automatic bonding scenario, taking a sample image of the gold wire sample using a preset optical microscope, preprocessing the sample image to obtain a preprocessed sample image, extracting image features of the preprocessed sample image, and analyzing surface parameters of the gold wire sample based on the image features; Measuring the gold wire resistance of the gold wire sample at a constant temperature, and calculating the gold wire radius of the gold wire sample based on the gold wire resistance; Analyze the impurity blackness and pure gold blackness of the gold wire sample, construct a blackness difference-impurity content curve of the gold wire sample based on the impurity blackness and pure gold blackness, and calculate the gold wire purity of the gold wire sample based on the blackness difference-impurity content curve; Analyze the mechanical performance requirements of the gold wire sample in the high-speed automatic bonding scenario, build a mechanical performance test environment for the gold wire sample based on the mechanical performance requirements, and calculate the mechanical performance parameters of the gold wire sample based on the mechanical performance test environment, wherein the mechanical performance parameters include: elasticity, toughness, hardness, and durability; Based on the surface parameters, the gold wire radius, the gold wire purity and the mechanical property parameters, a gold wire quality analysis report in the high-speed automatic bonding scenario is analyzed.

2. The method for analyzing gold wire quality requirements in a high-speed automatic bonding scenario as claimed in claim 1, characterized in that: The preprocessing of the sample image to obtain a preprocessed sample image includes: Identifying the noise type of the sample image, and based on the noise type, denoising the sample image to obtain a denoised sample image; Performing image contrast enhancement on the denoised sample image to obtain an enhanced sample image; Sharpening the enhanced sample image using a preset Laplace operator to obtain a sharpened sample image; The sharpened sample image is subjected to image binarization processing by a preset image binarization technology to obtain a preprocessed sample image.

3. The method for analyzing gold wire quality requirements in a high-speed automatic bonding scenario as claimed in claim 1, characterized in that: The extracting the image features of the preprocessed sample image comprises: Performing morphological operations on the preprocessed sample image to obtain a morphological sample image; determining an image threshold of the morphological sample image; Based on the image threshold, performing threshold division on the morphological sample image to obtain a sample image of a region of interest; Detecting the real edge and potential edge of the sample image of the region of interest by using a preset Canny edge detection algorithm; Extracting characteristic parameters of the sample image of the region of interest based on the real edge and the potential edge; Based on the feature parameters, image features of the sample image of the region of interest are identified.

4. The method for analyzing gold wire quality requirements in a high-speed automatic bonding scenario as claimed in claim 1, characterized in that: The step of measuring the gold wire resistance of the gold wire sample at a constant temperature comprises: Using a preset constant temperature box to set a constant temperature environment for the gold wire sample, and applying a constant current to the gold wire sample based on the constant temperature environment; Based on the constant current and the constant temperature environment, measuring the left end voltage and the right end voltage of the gold wire sample; Based on the constant current, the left end voltage and the right end voltage, the gold wire resistance of the gold wire sample is calculated using the following formula: Where R represents the wire resistance of the gold wire sample, V L Represents the voltage at the left end of the gold wire sample, V R represents the voltage at the right end of the gold wire sample, and I represents a constant current.

5. The method for analyzing gold wire quality requirements in a high-speed automatic bonding scenario as claimed in claim 1, characterized in that: The step of calculating the gold wire radius of the gold wire sample based on the gold wire resistance includes: measuring the gold wire length of the gold wire sample; Based on the gold wire resistance, determining the gold wire resistivity of the gold wire sample; Based on the gold wire length, the gold wire resistance and the gold wire resistivity, the gold wire radius of the gold wire sample is calculated using the following formula: Among them, r represents the radius of the gold wire, μ represents the resistivity of the gold wire, R represents the resistance of the gold wire, L represents the length of the gold wire, and π represents the circumference of a circle.

6. The method for analyzing gold wire quality requirements in a high-speed automatic bonding scenario as claimed in claim 1, characterized in that: The analysis of the impurity blackness and pure gold blackness of the gold wire sample includes: constructing a test environment for measuring the gold wire sample; Based on the test environment, collecting spectral data of the gold wire sample; Based on the spectral data, determining a characteristic wavelength of the gold wire sample; Analyzing the light intensity of the gold wire sample at the characteristic wavelength, wherein the light intensity includes the incident light intensity and the light intensity after the gold wire penetrates; Obtaining the light intensity of a preset pure gold sample after pure gold penetration at the characteristic wavelength; Based on the incident light intensity, the light intensity after the gold wire penetrates, and the light intensity after the pure gold penetrates, the impurity blackness and the pure gold blackness are calculated using the following formula: Among them, P z Indicates impurity blackness, P Au represents the blackness of pure gold, I0 represents the intensity of incident light, I z Indicates the light intensity after the gold wire penetrates, I Au Indicates the light intensity after pure gold penetrates, log 10 Represents the base 10 logarithmic function.

7. The method for analyzing gold wire quality requirements in a high-speed automatic bonding scenario as claimed in claim 1, characterized in that: The step of constructing a blackness difference-impurity content curve of the gold wire sample based on the impurity blackness and the pure gold blackness includes: Calculating a sample blackness difference of the gold wire sample based on the impurity blackness and the pure gold blackness; Analyzing the logarithmic relationship between the blackness difference of the sample and the impurity content, and calculating the logarithmic value of the impurity content based on the logarithmic relationship; Calculating the sensitivity of the sample blackness difference to the logarithmic value of the impurity content; Based on the impurity blackness difference, the logarithm of the impurity content and the sensitivity, the sample blackness difference of the gold wire sample is calculated using the following formula: ΔP=a*lgH+b Among them, ΔP represents the blackness difference of the sample, lg represents the logarithmic function, lgH represents the logarithmic value of the impurity content of the gold wire sample, a represents the sensitivity of the impurity blackness difference to the logarithmic value of the impurity content, and b represents a constant; According to the blackness difference of the sample, a blackness difference-impurity content curve of the gold wire sample is constructed.

8. The method for analyzing gold wire quality requirements in a high-speed automatic bonding scenario as claimed in claim 1, characterized in that: The step of constructing a mechanical property test environment for the gold wire sample based on the mechanical property requirements includes: Based on the mechanical property requirements, setting temperature conditions and humidity conditions for testing the gold wire sample; Based on the mechanical property requirements, a mechanical property test plan for the gold wire sample is formulated, wherein the mechanical property test plan includes: a tensile test, a hardness test, and a fatigue test; Arrange relevant testing equipment for the gold wire sample based on the mechanical property testing scheme; Install the sensor of the relevant testing equipment, and build a data acquisition system for the gold wire sample based on the sensor; Based on the temperature condition, the humidity condition, the mechanical property test scheme, the relevant test equipment and the data acquisition system, a mechanical property test environment for the gold wire sample is constructed.

9. The method for analyzing gold wire quality requirements in a high-speed automatic bonding scenario according to claim 1, characterized in that: The calculating the mechanical property parameters of the gold wire sample based on the mechanical property test environment includes: Based on the tensile test corresponding to the mechanical properties test environment, the elasticity and toughness of the gold wire sample were calculated using the following formula: Wherein, T represents the elasticity of the gold wire sample, G represents the toughness of the gold wire sample, F represents the force acting on the gold wire sample, π represents the circumference, r represents the radius of the gold wire sample, α represents the relative deformation of the gold wire sample, and αf represents the final strain of the gold wire sample; Based on the hardness test corresponding to the mechanical property test environment, the hardness of the gold wire sample is calculated using the following formula: Where, Y represents the hardness of the gold wire sample, F y represents the pressure acting on the gold wire sample, π represents the circumference of a circle, and D represents the diameter of the indentation on the surface of the gold wire sample; Based on the fatigue test corresponding to the mechanical property test environment, the durability of the gold wire sample is calculated using the following formula: Among them, N represents the durability of the gold wire sample, θ represents the stress concentration factor, M0 represents the stress level, and M1 represents the fatigue strength of the gold wire sample; Based on the elasticity, the toughness, the hardness and the durability, the mechanical property parameters of the gold wire sample are determined.

10. An analysis system for gold wire quality requirements in high-speed automatic bonding scenarios, characterized in that: A method for analyzing gold wire quality requirements in a high-speed automatic bonding scenario according to any one of claims 1 to 9, the system comprising: A gold wire surface analysis module is used to obtain a gold wire sample applied to the high-speed automatic bonding scenario, take a sample image of the gold wire sample using a preset optical microscope, pre-process the sample image to obtain a pre-processed sample image, extract image features of the pre-processed sample image, and analyze surface parameters of the gold wire sample based on the image features; A gold wire radius measurement module, used to measure the gold wire resistance of the gold wire sample at a constant temperature, and calculate the gold wire radius of the gold wire sample based on the gold wire resistance; A gold wire purity analysis module, used for analyzing the impurity blackness and pure gold blackness of the gold wire sample, constructing a blackness difference-impurity content curve of the gold wire sample based on the impurity blackness and pure gold blackness, and calculating the gold wire purity of the gold wire sample based on the blackness difference-impurity content curve; A gold wire mechanical property calculation module, used to analyze the mechanical property requirements of the gold wire sample in the high-speed automatic bonding scenario, build a mechanical property test environment for the gold wire sample based on the mechanical property requirements, and calculate the mechanical property parameters of the gold wire sample based on the mechanical property test environment, wherein the mechanical property parameters include: elasticity, toughness, hardness and durability; The gold wire quality report analysis module is used to analyze the gold wire quality analysis report in the high-speed automatic bonding scenario based on the surface parameters, the gold wire radius, the gold wire purity and the mechanical property parameters.

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