Turnover device for top cover of semiconductor transfer cavity

Abstract

The invention discloses a semiconductor transfer cavity top cover turning device which comprises a gear box, a driving assembly, a three-stage transmission assembly installed in the gear box and turning arms symmetrically installed on the two sides of the gear box, and the turning arms are used for being connected with a top cover. The input end of the third-stage transmission assembly is rotationally connected with the driving assembly on the top of the gear box, and the output end of the third-stage transmission assembly is rotationally connected with the overturning arm. Under driving of the driving assembly, the three-stage transmission assembly rotates synchronously and drives the overturning arm to rotate, and then automatic lifting and overturning opening of the top cover are achieved. The device has the advantages of being compact in structure, easy and labor-saving to operate, stable in transmission, high in integration level and the like, and the automation degree of turning the semiconductor transfer cavity top cover is remarkably improved.

Description

Technical Field

[0001] The invention belongs to the technical field of clustered conveying platforms for semiconductors, and in particular relates to a top cover flip-up device for a semiconductor conveying chamber. Background Art

[0002] In the semiconductor chip manufacturing process, with the development of Moore's Law, the line width is getting narrower and narrower, and the requirements for process pollution control and automation are getting higher and higher. It is required that wafers complete more processes in a vacuum environment as much as possible to reduce human intervention and exposure to the atmosphere, thereby effectively reducing particle contamination.

[0003] Cluster transfer platforms are also becoming the mainstream configuration of semiconductor process machines. For example, mainstream machines such as Endura and Centura of Applied Materials in the United States all adopt cluster structures. The main transfer chamber of the cluster transfer platform is a polygonal structure with a vacuum manipulator in the center. When the transfer chamber stops working, the entire chamber and its internal parts need to be cleaned and repaired, and then the top cover needs to be opened to expose the entire aperture of the transfer chamber, and the top cover can be closed after the maintenance is completed.

[0004] A cavity assembly of a certain weight is fixed on the top of the top cover. During the opening and closing process of the top cover of the transmission chamber, due to the gravity of the entire top cover assembly itself, manual operation is not only difficult but also easy to hit other components such as the transmission chamber, causing these components to loosen or be damaged, shortening their service life, and posing certain safety hazards. It also generates tiny particles. The top cover lifting mechanism used in the prior art has an overly complex and bulky mechanical structure, occupies a large space, is costly, and has a low degree of integration for automated lifting.

[0005] Chinese patent application 202210511249.3 discloses a flip cover device for the top cover of a semiconductor transmission chamber, which drives the transmission assembly through a screw drive assembly, thereby driving the connection assembly to realize the lifting and flipping of the top cover. However, because the screw drive force arm is short, although the top cover of the transmission chamber can be flipped, the torque required to rotate the screw is large. When using a motor drive, a motor with higher torque is required, which increases the cost. When using a manual handwheel to rotate, it requires a lot of human strength and is inconvenient to operate. Summary of the invention

[0006] The technical problem to be solved by the present invention is to provide a flip-opening device for a semiconductor transfer chamber top cover with a compact structure, simple and labor-saving operation, stable transmission and high integration in view of the deficiencies in the prior art.

[0007] To achieve the above object, the present invention can adopt the following technical solutions:

[0008] A semiconductor transmission chamber top cover flipping device comprises: a gear box, a driving assembly, a three-stage transmission assembly installed inside the gear box, and flip arms symmetrically installed on both sides of the gear box, wherein the flip arms are used to connect the top cover; the input end of the three-stage transmission assembly is rotationally connected to the driving assembly on the top of the gear box, and the output end of the three-stage transmission assembly is rotationally connected to the flip arm; under the drive of the driving assembly, the three-stage transmission assembly rotates synchronously and drives the flip arm to rotate, thereby realizing automatic lifting and flipping of the top cover.

[0009] As a further improvement of the present invention, the three-stage transmission assembly includes a first-stage worm gear transmission, a second-stage spur gear transmission and a third-stage spur gear transmission that are rotatably connected in sequence, the input end of the first-stage worm gear transmission is rotatably connected to the drive assembly, and the output end of the third-stage spur gear transmission is rotatably connected to the flip arm.

[0010] As a further improvement of the present invention, the first-stage worm gear transmission includes a first-stage transmission shaft, a worm and a worm wheel. The worm is nested in the outer periphery of the first-stage transmission shaft. The drive assembly is installed concentrically with the first-stage transmission shaft and the worm and rotates synchronously. The worm wheel is meshed with the worm, and the worm wheel is rotationally connected to the second-stage spur gear transmission.

[0011] As a further improvement of the present invention, the secondary spur gear transmission includes a secondary pinion, a secondary transmission shaft and a secondary large gear. The worm gear is coaxially installed on the secondary transmission shaft with the secondary pinion. The secondary pinion is meshed with the secondary large gear. The secondary large gear is rotationally connected to the third-stage spur gear transmission.

[0012] As a further improvement of the present invention, the three-stage spur gear transmission includes a three-stage transmission shaft, a three-stage large gear and a three-stage pinion, the second-stage large gear and the third-stage pinion are coaxially mounted on the three-stage transmission shaft, the third-stage pinion is meshed with the third-stage large gear, and the third-stage large gear is coaxially mounted on the flip shaft with the flip arm.

[0013] As a further improvement of the present invention, the gear ratio of the second-stage pinion to the second-stage large gear is 1:2.5-3.5, and the gear ratio of the third-stage pinion to the third-stage large gear is 1:4-5.

[0014] As a further improvement of the present invention, the three-stage large gear retains the central mounting axis position from the complete circular gear, and retains an effective area of ​​85°±2° and 1 / 3 of the number of teeth of the entire circular gear.

[0015] As a further improvement of the present invention, the flip arm is provided with a first pin shaft hole, a second pin shaft hole and a pin shaft, the first pin shaft hole is close to the end of the flip arm, the second pin shaft hole is close to the gear box, the first pin shaft hole, the second pin shaft hole and the pin shaft are used to connect the adjusting block, and the adjusting block is in contact with the top cover.

[0016] As a further improvement of the present invention, the aperture of the second pin shaft hole is larger than the aperture of the first pin shaft hole, and the parallelism between the top cover and the transmission chamber is adaptively corrected through the gap between the pin shaft and the pin shaft hole.

[0017] As a further improvement of the present invention, the driving component is a hand wheel or a servo motor.

[0018] Compared with the prior art, the advantages of the present invention are:

[0019] 1. The semiconductor transfer chamber top cover flipping device of the present invention improves the integration degree of the flipping device and reduces the operation difficulty of the flipping device by integrating the driving component, the three-stage transmission component and the flip arm for connecting the top cover in the gear box; specifically, the input end of the three-stage transmission component is rotationally connected with the driving component on the top of the gear box, and the output end of the three-stage transmission component is rotationally connected with the flip arm, so that a complete transmission path is formed. Under the drive of the driving component, the three-stage transmission component rotates synchronously and drives the flip arm to rotate, so that the top cover is automatically flipped. The whole operation process is easy and safe, and has the advantages of simple control, stable transmission, safety and reliability.

[0020] 2. The semiconductor transfer chamber top cover flipping device of the present invention forms a three-stage transmission component with compact structure and stable transmission through a first-stage worm gear transmission, a second-stage spur gear transmission and a third-stage spur gear transmission. The worm gear transmission has a relatively large transmission ratio and a compact structure. Since the meshing of the worm and the worm wheel teeth is continuous and the number of meshing tooth pairs is relatively large, the transmission is relatively stable and the noise is relatively low. In addition, the worm gear transmission itself has a self-locking function, which improves the safety of flipping the top cover. The gear transmission has the advantages of high transmission accuracy, high transmission efficiency, reliable operation and long service life. The three-stage transmission component not only improves the reliability of flipping the top cover, but also the torque driving the worm gear transmission and the gear transmission is relatively small, the operation is more stable, the self-locking function is stronger, and it can be flipped to any angle as needed, which significantly improves the convenience of operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the three-dimensional structure principle of the semiconductor transfer chamber top cover flip-opening device in a specific embodiment of the present invention;

[0022] Figure 2 It is a schematic diagram of the top view of the structure principle of the semiconductor transfer chamber top cover flip-opening device in a specific embodiment of the present invention;

[0023] Figure 3 for Figure 2 Schematic diagram of the cross-sectional structure principle in the FF direction;

[0024] Figure 4This is one of the schematic diagrams of the structural principle of the top cover flipping open in a specific embodiment of the present invention;

[0025] Figure 5 This is the second schematic diagram of the structural principle of the top cover flipping open in a specific embodiment of the present invention;

[0026] Legend: 1. Primary transmission shaft; 2. Worm; 3. Worm wheel; 4. Secondary pinion; 5. Secondary transmission shaft; 6. Secondary gear; 7. Third-stage transmission shaft; 8. Flip shaft; 9. Flip arm; 91. First pin hole; 92. Second pin hole; 93. Pin; 10. Third-stage gear; 11. Gear box; 12. Hand wheel; 13. Third-stage pinion; 14. Top cover; 15. Adjustment block. DETAILED DESCRIPTION

[0027] The present invention is further described below in conjunction with the accompanying drawings and specific preferred embodiments, but the protection scope of the present invention is not limited thereby.

[0028] In the description of the present invention, it should be understood that the terms "side", "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0029] In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, "multiple" means two or more, unless otherwise clearly and specifically defined.

[0030] Example

[0031] like Figures 1 to 5 As shown, the semiconductor transfer chamber top cover flipping device of the present invention comprises: a gear box 11, a driving assembly, a three-stage transmission assembly installed inside the gear box 11, and flip arms 9 symmetrically installed on both sides of the gear box 11, and the flip arms 9 are used to connect the top cover 14. The input end of the three-stage transmission assembly is rotatably connected to the driving assembly on the top of the gear box 11, and the output end of the three-stage transmission assembly is rotatably connected to the flip arm 9. Under the drive of the driving assembly, the three-stage transmission assembly rotates synchronously and drives the flip arm 9 to rotate, thereby realizing the automatic lifting and flipping of the top cover 14.

[0032] In this embodiment, the driving assembly, the three-stage transmission assembly, and the flip arm 9 for connecting the top cover are all integrated and installed in the gear box 11, so that the integration degree of the flip-opening device is improved and the difficulty of operating the flip-opening device is reduced. Specifically, by rotating the input end of the three-stage transmission assembly with the driving assembly at the top of the gear box 11, and rotating the output end of the three-stage transmission assembly with the flip arm 9, a complete transmission path is formed. Under the drive of the driving assembly, the three-stage transmission assembly rotates synchronously and drives the flip arm to rotate, so that the top cover is automatically flipped open. The entire operation process is easy and safe, and has the advantages of simple control, stable transmission, safety and reliability.

[0033] In this embodiment, the three-stage transmission assembly includes a first-stage worm gear transmission, a second-stage spur gear transmission and a third-stage spur gear transmission that are rotatably connected in sequence. The input end of the first-stage worm gear transmission is rotatably connected to the drive assembly, and the output end of the third-stage spur gear transmission is rotatably connected to the flip arm 9.

[0034] like Figure 1 As shown, the primary worm gear transmission comprises a primary transmission shaft 1, a worm 2 and a worm wheel 3. The worm 2 is nested in the outer periphery of the primary transmission shaft 1. The driving assembly is installed concentrically with the primary transmission shaft 1 and the worm 2 and rotates synchronously. The worm wheel 3 is meshed with the worm 2, and the worm wheel 3 is rotationally connected to the secondary spur gear transmission.

[0035] like Figure 1 As shown, the secondary spur gear transmission comprises a secondary pinion 4, a secondary transmission shaft 5 and a secondary gear 6. The worm gear 3 is coaxially mounted on the secondary transmission shaft 5 with the secondary pinion 4. The secondary pinion 4 is meshed with the secondary gear 6. The secondary gear 6 is rotationally connected to the tertiary spur gear transmission.

[0036] like Figure 1 , Figure 2 and Figure 3 As shown, the three-stage spur gear transmission includes a three-stage transmission shaft 7, a three-stage large gear 10 and a three-stage pinion 13. The second-stage large gear 6 and the third-stage pinion 13 are coaxially mounted on the three-stage transmission shaft 7. The third-stage pinion 13 is meshed with the third-stage large gear 10. The third-stage large gear 10 and the flip arm 9 are coaxially mounted on the flip shaft 8.

[0037] In this embodiment, the primary transmission shaft 1, the secondary transmission shaft 5, the tertiary transmission shaft 7 and the flip shaft 8 are fixed in relative positions by side plates (not shown in the figure) on both sides of the gear box 11 and can rotate.

[0038] In this embodiment, the number of teeth of the secondary pinion 4 is 14, the number of teeth of the secondary large gear 6 is 42, the number of teeth of the tertiary pinion 13 is 14, and the number of teeth of the tertiary large gear 10 is 54, so as to realize the flexible flipping of the top cover 14 under the condition of small torque. It can be understood that in the actual application process, the large gear and the pinion with the corresponding number of gears can be flexibly selected according to the flipping requirements of the top cover 14 to meet the torque and flipping speed required for the rotation of the top cover 14.

[0039] like Figure 3 As shown, the three-stage large gear 10 retains the center mounting axis position from the complete circular gear, and retains an effective area of ​​85°±2°, and 1 / 3 of the number of teeth of the entire circular gear, to ensure that the angle that can be opened when the top cover 14 is flipped is greater than 70°, exposing the entire aperture of the transmission chamber for easy maintenance.

[0040] like Figure 3 and Figure 4 As shown, the flip arm 9 is provided with a first pin shaft hole 91, a second pin shaft hole 92 and a pin shaft 93, the first pin shaft hole 91 is close to the end of the flip arm 9, and the second pin shaft hole 92 is close to the gear box 11, and the first pin shaft hole 91, the second pin shaft hole 92 and the pin shaft 93 are used to connect the adjustment block 15, and the adjustment block 15 is in contact with the top cover 14.

[0041] Furthermore, the aperture of the first pin shaft hole 91 is equivalent to the diameter of the pin shaft 93, and the aperture of the second pin shaft hole 92 is slightly larger than the aperture of the first pin shaft hole 91. The parallelism between the top cover 14 and the transmission chamber is adaptively corrected through the gap between the pin shaft 93 and the pin shaft hole, thereby avoiding sealing failure due to the non-parallelism between the top cover 14 and the transmission chamber caused by the top cover flip-up device.

[0042] like Figure 1 As shown, in this embodiment, the driving component is a hand wheel 12, and the primary transmission shaft 1 is nested and fixed at the center of the hand wheel 12. By turning the hand wheel 12, the primary transmission shaft 1 and the worm 2 can be driven to rotate synchronously, which has the characteristics of compact structure and convenient operation. In other embodiments, the driving component can also use a servo motor, and by adding corresponding upper and lower position sensors, the start and stop of the servo motor can be automatically controlled, thereby realizing the fully automatic opening and closing of the top cover 14, reducing the work pressure of the operator.

[0043] The worm 2 is driven to rotate by a hand wheel 12 or a motor, and the worm 2 drives the secondary pinion 4 on the secondary transmission shaft 5 to rotate through the worm wheel 3. The secondary pinion 4 meshes and rotates with the secondary large gear 6. The secondary large gear 6 drives the tertiary pinion 13 on the tertiary transmission shaft to rotate synchronously. The tertiary pinion 13 meshes with the tertiary large gear 10. The tertiary large gear 10 drives the rotating arm 9 on the flip shaft 8 to rotate synchronously. The rotating arm 9 is connected to the top cover 14 that needs to be flipped open, and moves synchronously to realize the flipping movement of the top cover 14.

[0044] The flip-opening device of this embodiment mainly adopts manual driving mode. When the top cover 14 is in the cavity matching position, covers the cavity, and when the top cover 14 is flipped to a certain angle, it can be observed visually without configuring a position sensor. If an electric control drive is adopted, an additional sensor is required to detect the position. In actual application, the flip-opening angle of the top cover 14 does not need to be precisely controlled, and generally an angle of more than 60° can meet the cavity operation requirements.

[0045] Although the present invention is disclosed as above with preferred embodiments, it is not intended to limit the present invention. Any technician familiar with the art can use the above disclosed methods and technical contents to make many possible changes and modifications to the technical solutions of the present invention without departing from the spirit and technical solutions of the present invention, or modify them into equivalent embodiments of equivalent changes. Therefore, any simple modification, equivalent replacement, equivalent change and modification made to the above embodiments according to the technical essence of the present invention without departing from the content of the technical solutions of the present invention still fall within the scope of protection of the technical solutions of the present invention.

Claims

1. A semiconductor transfer chamber top cover flip-opening device, characterized in that: include: A gear box (11), a drive assembly, a three-stage transmission assembly installed inside the gear box (11), and flip arms (9) symmetrically installed on both sides of the gear box (11), wherein the flip arms (9) are used to connect a top cover (14); an input end of the three-stage transmission assembly is rotationally connected to the drive assembly at the top of the gear box (11), and an output end of the three-stage transmission assembly is rotationally connected to the flip arm (9); under the drive of the drive assembly, the three-stage transmission assembly rotates synchronously and drives the flip arm (9) to rotate, thereby realizing automatic lifting and flipping of the top cover (14).

2. The semiconductor transfer chamber top cover flip-opening device according to claim 1, characterized in that: The three-stage transmission assembly comprises a primary worm gear transmission member, a secondary spur gear transmission member and a tertiary spur gear transmission member which are rotatably connected in sequence, the input end of the primary worm gear transmission member being rotatably connected to the driving assembly, and the output end of the tertiary spur gear transmission member being rotatably connected to the flip arm (9).

3. The semiconductor transfer chamber top cover flip-opening device according to claim 2, characterized in that: The primary worm gear transmission component comprises a primary transmission shaft (1), a worm (2) and a worm wheel (3); the worm (2) is nested on the outer periphery of the primary transmission shaft (1); the drive assembly is concentrically mounted with the primary transmission shaft (1) and the worm (2) and rotates synchronously; the worm wheel (3) is meshed with the worm (2); and the worm wheel (3) is rotationally connected to the secondary spur gear transmission component.

4. The semiconductor transfer chamber top cover flip-opening device according to claim 3, characterized in that: The secondary spur gear transmission member comprises a secondary pinion (4), a secondary transmission shaft (5) and a secondary gear (6); the worm gear (3) and the secondary pinion (4) are coaxially mounted on the secondary transmission shaft (5); the secondary pinion (4) is meshed with the secondary gear (6); and the secondary gear (6) is rotationally connected to the tertiary spur gear transmission member.

5. The semiconductor transfer chamber top cover flip-opening device according to claim 4, characterized in that: The three-stage spur gear transmission element comprises a three-stage transmission shaft (7), a three-stage large gear (10) and a three-stage small gear (13); the two-stage large gear (6) and the three-stage small gear (13) are coaxially mounted on the three-stage transmission shaft (7); the three-stage small gear (13) is meshed with the three-stage large gear (10); and the three-stage large gear (10) and the flip arm (9) are coaxially mounted on the flip shaft (8).

6. The semiconductor transfer chamber top cover flip-opening device according to claim 5, characterized in that: The gear ratio of the second-stage pinion (4) to the second-stage large gear (6) is 1:2.5-3.5, and the gear ratio of the third-stage pinion (13) to the third-stage large gear (10) is 1:4-5.

7. The semiconductor transfer chamber top cover flip-opening device according to claim 5, characterized in that: The three-stage large gear (10) retains the central installation axis position from the complete circular gear, and retains an effective area of ​​85°±2° and 1 / 3 of the number of teeth of the entire circular gear.

8. The semiconductor transfer chamber top cover flip-opening device according to any one of claims 1 to 7, characterized in that: The flip arm (9) is provided with a first pin shaft hole (91), a second pin shaft hole (92) and a pin shaft (93); the first pin shaft hole (91) is close to the end of the flip arm (9); the second pin shaft hole (92) is close to the gear box (11); the first pin shaft hole (91), the second pin shaft hole (92) and the pin shaft (93) are used to connect an adjustment block (15); and the adjustment block (15) is in contact with the top cover (14).

9. The semiconductor transfer chamber top cover flip-opening device according to claim 8, characterized in that: The aperture of the second pin shaft hole (92) is larger than the aperture of the first pin shaft hole (91), and the parallelism between the top cover (14) and the transmission chamber is adaptively corrected through the gap between the pin shaft (93) and the pin shaft hole.

10. The semiconductor transfer chamber top cover flip-opening device according to any one of claims 1 to 7, characterized in that: The driving component is a hand wheel (12) or a servo motor.

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