Local temperature control feedback power-adjustable wafer cooling device

Abstract

The invention relates to the technical field of semiconductors, in particular to a local temperature control feedback power-adjustable wafer cooling device, which comprises a mounting frame, a bearing mechanism and a cooling assembly, and is characterized in that the cooling assembly is arranged at the rear end of the mounting frame and is connected with an external air cooling system through a breather pipe; compared with an existing wafer cooling device, the wafer cooling device has the advantages that the distance between the through holes in the lower portion of the cooling pipeline is reduced compared with the distance between the through holes in the upper portion of the cooling pipeline, so that the purpose of accelerating cooling is achieved, the wafer cooling time is shortened, and the risk of wafer oxidation is reduced; when the plurality of groups of bearing mechanisms rotate in the mounting frame, on one hand, the temperature measuring assembly on the fixing frame can detect the temperature of each area of the wafer, so that a worker can conveniently adjust the flow and the temperature of high-purity nitrogen conveyed into the cooling assembly by an external air cooling system in real time, and on the other hand, the cooling uniformity of the wafer can be ensured.

Description

Technical Field

[0001] The invention relates to the field of semiconductor technology, in particular to a power-adjustable chip cooling device with local temperature control feedback. Background Art

[0002] In the semiconductor industry, since furnace tube equipment is high-temperature equipment and has the characteristics of a large number of wafers in a single process, the wafers often need to wait for 40-60 minutes in the equipment loading area. At this time, there is a high risk of oxidation on the surface of the wafer. In order to ensure the quality of the wafer, some factories will install wafer cooling devices to cool the wafers.

[0003] For example, the patents "Announcement No. CN115440613A Wafer Cooling Device" and "Announcement No. CN114383426A Cooling Device, Cooling System and Diffusion Furnace Tube Device" disclose a technical solution for chip cooling. However, existing chip cooling devices also have disadvantages such as slow cooling speed and limited usage scenarios. At the same time, during the cooling process, the staff cannot know the temperature changes of each area of ​​each chip in real time, and cannot adjust the flow and temperature of the cooling gas in time, resulting in low cooling efficiency and a large waste of resources. Finally, the current chip cooling device is difficult to ensure consistent cooling speeds in various areas of the chip, which may affect the quality of the chip. Summary of the invention

[0004] The object of the present invention is to provide a power-adjustable wafer cooling device with local temperature control feedback to solve the problems raised in the prior art.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a power-adjustable wafer cooling device with local temperature control feedback, the wafer cooling device comprising a mounting frame, a bearing mechanism and a cooling assembly, the cooling assembly being arranged at the rear end of the mounting frame, the cooling assembly being connected to an external air cooling system through a vent pipe, and high-purity nitrogen being transported into the cooling assembly through the external air cooling system, a plurality of groups of bearing grooves being arranged on the inner wall of the mounting frame, a group of bearing mechanisms being arranged in each group of the bearing grooves, wafers being carried by the bearing mechanisms, when a plurality of groups of wafers are placed on the plurality of groups of bearing mechanisms, high-purity nitrogen will flow out of the cooling assembly, and then the wafers on the bearing mechanisms will be cooled, finally, the present invention is provided with a group of fixing frames under each group of the bearing grooves, a plurality of groups of temperature measuring assemblies are arranged above each group of the fixing frames, and fixed-point temperature measurement is performed on different regions of different wafers through the plurality of groups of temperature measuring assemblies, so as to facilitate the staff to adjust the flow rate and temperature of the high-purity nitrogen transported to the cooling assembly by the external air cooling system in real time.

[0006] Furthermore, the cooling assembly includes a cooling pipeline, a right-angle compression joint and a T-type compression joint. Four cooling pipelines are provided, three right-angle compression joints are provided, and five T-type compression joints are provided. The four cooling pipelines form a closed pipeline through three right-angle compression joints and five T-type compression joints, and one of the T-type compression joints is connected to the external air cooling system through a ventilation pipe.

[0007] Furthermore, each of the cooling pipelines is provided with a plurality of groups of through holes, and the spacing between the plurality of through holes decreases gradually from bottom to top. Compared with the currently used chip cooling device, the present invention reduces the spacing between the through holes in the lower part of the cooling pipeline compared with the spacing between the through holes in the upper part, thereby achieving the purpose of accelerating the cooling, thereby reducing the cooling time of the chip in the equipment, reducing the risk of chip oxidation, and improving the working efficiency of the equipment.

[0008] Furthermore, a transmission box and a power box are provided on the outside of the mounting frame, a transmission mechanism is provided in the transmission box, a power mechanism is provided in the power box, the power mechanism is connected to a plurality of groups of bearing mechanisms through the transmission mechanism, a plurality of groups of fixed frames in the present invention are fixedly connected to the inner wall of the mounting frame, and a plurality of groups of bearing mechanisms are controlled to rotate in the mounting frame by the power mechanism and the transmission mechanism. When the bearing mechanism rotates in the mounting frame, on the one hand, the temperature measuring component on the fixed frame can detect the temperature of each area of ​​the wafer, thereby increasing the detection range and making it convenient for the staff to know the temperature changes of each local area of ​​the wafer. On the other hand, when the bearing mechanism rotates with the wafer, the cooling inconsistency of each area of ​​the wafer can be avoided, thereby ensuring the cooling uniformity of the wafer. Finally, the present invention can enhance the fluidity of high-purity nitrogen by controlling the rotation speed of the bearing mechanism, thereby improving the cooling effect.

[0009] Furthermore, the bearing mechanism includes a bearing ring, a reversing gear and a slider, the reversing gear and the slider are sequentially arranged below the bearing ring, a guide groove is arranged below the bearing groove, a slide groove is arranged in the guide groove, and the slider cooperates with the slide groove.

[0010] Furthermore, a groove is provided at the side end of the carrying ring, a movable block is provided at the upper end of the groove, a first electromagnet is provided at the lower end of the groove, the movable block is movably installed in the groove through a first compression spring, and the end of the movable block close to the first electromagnet is magnetic.

[0011] Furthermore, the transmission mechanism includes a transmission gear, a fixed seat and a transmission rod, the power mechanism includes a motor, a second power gear and a first power gear, the transmission gear is provided with a plurality of groups, each group of the transmission gear is connected to a group of reversing gears, a plurality of groups of fixed seats are provided on the transmission rod, the transmission rod is connected to a plurality of groups of transmission gears through a plurality of groups of fixed seats, the first power gear is provided at the bottom end of the transmission rod, the motor is connected to the first power gear through the second power gear, the upper surface of the carrying ring in the present invention is flush with the bottom surface of the carrying groove, so that the staff can directly push the wafer onto the carrying ring when placing the wafer into the carrying groove, and when the wafer moves to the carrying ring, there will be a gap between the wafer and the movable block, at this time The staff turns on the first electromagnet, which generates a set of magnetic fields that attract the movable block. As the movable block moves downward, the gap between the wafer and the movable block increases, and the pressure inside the wafer and the movable block decreases accordingly. Under the action of the external atmospheric pressure, the wafer will be adsorbed onto the carrying ring to prevent the wafer from being displaced due to centrifugal force when the carrying mechanism rotates with the wafer. Finally, when the wafer is cooled, the motor drives the transmission rod and several sets of transmission gears to rotate through the second power gear and the first power gear, and drives several sets of carrying mechanisms to rotate through several sets of transmission gears. On the one hand, it is convenient for all areas of the wafer to be cooled evenly, and on the other hand, it is convenient for the staff to monitor the temperature of each area of ​​the wafer. Finally, the fluidity of the high-purity nitrogen is enhanced, thereby improving the cooling effect.

[0012] Furthermore, a telescopic slot is provided inside the fixing seat, a positioning slot is provided at one end of the transmission gear close to the telescopic slot, a second electromagnet, a positioning frame and a positioning block are provided inside the telescopic slot, the positioning frame is movably installed in the telescopic slot through a second compression spring, the positioning block is provided at one end of the positioning frame close to the positioning slot, the positioning block cooperates with the positioning slot, and the end of the positioning frame close to the second electromagnet is magnetic. When the present invention is working normally, the second electromagnet will generate a set of magnetic fields that attract the positioning frame, and under the action of the magnetic field, the positioning frame and the second electromagnet are fastened together, and the positioning block is inserted into the positioning slot, thereby ensuring that the transmission gear The wheel is fixed together with the fixed seat, and the power generated by the motor can be transmitted to the bearing mechanism. If a group of transmission gears is stuck due to debris or cannot rotate due to other reasons during operation, the staff can disconnect the second electromagnet matched with the group of transmission gears. At this time, under the action of the second compression spring, the positioning frame and the positioning block matched with the group of transmission gears will move away from the group of transmission gears, thereby ensuring that the transmission rod can rotate normally without being hindered by the group of transmission gears. Through the above technical solution, when a group of bearing mechanisms and transmission gears in the present invention fails, other bearing mechanisms and transmission gears can work normally, thereby ensuring the durability of the present invention.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] 1. Compared with the currently used wafer cooling device, the present invention reduces the through-hole spacing at the lower part of the cooling pipeline compared with the through-hole spacing at the upper part, thereby achieving the purpose of accelerating the temperature reduction, thereby reducing the cooling time of the wafer in the device, reducing the risk of wafer oxidation, and improving the working efficiency of the device;

[0015] 2. The present invention is provided with several groups of bearing mechanisms so as to cool different wafers synchronously and improve cooling efficiency. Meanwhile, a group of fixing frames are provided under each group of bearing mechanisms, and several groups of temperature measuring components are provided above each group of fixing frames. The several groups of bearing mechanisms are controlled to rotate in the mounting frames by the power mechanism and the transmission mechanism. When the several groups of bearing mechanisms rotate in the mounting frames, on the one hand, the temperature measuring components on the fixing frames can detect the temperature of each area of ​​the wafer, so that the staff can know the temperature change of each local area of ​​the wafer, and then adjust the flow rate and temperature of the high-purity nitrogen delivered to the cooling component by the external air cooling system in real time. On the other hand, when the bearing mechanism rotates with the wafer, the cooling of each area of ​​the wafer can be avoided to be inconsistent, so as to ensure the cooling uniformity of the wafer. Finally, the present invention can enhance the fluidity of the high-purity nitrogen by controlling the rotation speed of the bearing mechanism, so as to improve the cooling effect.

[0016] 3. The present invention is also provided with a second electromagnet, a positioning frame and a positioning block. During normal operation, the second electromagnet can ensure that the transmission gear is fixed to the fixed seat, and ensure that the power generated by the motor can be transmitted to the bearing mechanism. If a group of transmission gears is stuck due to debris or cannot rotate due to other reasons during operation, the staff can disconnect the second electromagnet matched with the group of transmission gears. At this time, the positioning frame and the positioning block matched with the group of transmission gears will be away from the group of transmission gears, so that the transmission rod can rotate normally without being hindered by the group of transmission gears. Compared with the current wafer cooling device, when a group of bearing mechanisms and transmission gears in the present invention fails, the other bearing mechanisms and transmission gears can work normally, thereby ensuring the durability of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0018] Figure 2 It is a schematic diagram of the cooling assembly structure of the present invention;

[0019] Figure 3 It is a schematic diagram of the structure of several groups of bearing mechanisms of the present invention;

[0020] Figure 4 is a cross-sectional view of the carrying mechanism of the present invention;

[0021] Figure 5 For the present invention Figure 4 Schematic diagram of the structure of the middle A part;

[0022] Figure 6 It is a schematic diagram of the structure of the connection between the bearing mechanism and the transmission mechanism of the present invention;

[0023] Figure 7 It is a schematic diagram of the power mechanism and transmission mechanism structure of the present invention;

[0024] Figure 8 It is a schematic diagram of the internal structure of the fixing seat of the present invention.

[0025] In the figure: 1. mounting frame; 11. bearing groove; 12. guide groove; 2. bearing mechanism; 21. bearing ring; 211. movable block; 212. first electromagnet; 22. reversing gear; 23. slider; 3. wafer; 4. cooling assembly; 41. cooling pipeline; 42. right-angle ferrule joint; 43. T-type ferrule joint; 5. vent pipe; 6. transmission box; 61. transmission gear; 62. fixing seat; 621. telescopic groove; 622. second electromagnet; 623. positioning frame; 624. positioning block; 63. transmission rod; 64. first power gear; 7. power box; 71. motor; 72. second power gear; 8. fixing frame; 81. temperature measuring assembly. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] Example: Figure 1-Figure 3As shown, the present invention provides a technical solution of a power-adjustable wafer cooling device with local temperature control feedback, the wafer cooling device comprises a mounting frame 1, a bearing mechanism 2 and a cooling assembly 4, the cooling assembly 4 is arranged at the rear end of the mounting frame 1, the cooling assembly 4 is connected to the external air cooling system through a vent pipe 5, and high-purity nitrogen is transported into the cooling assembly 4 through the external air cooling system, a plurality of groups of bearing grooves 11 are arranged on the inner wall of the mounting frame 1, a group of bearing mechanisms 2 are arranged in each group of bearing grooves 11, and wafers 3 are carried by the bearing mechanisms 2. When a plurality of groups of wafers 3 are placed on the plurality of groups of bearing mechanisms 2 Afterwards, high-purity nitrogen will flow out from the cooling component 4, thereby cooling the wafer 3 on the supporting mechanism 2. The present invention can cool different wafers synchronously by setting up multiple groups of supporting mechanisms 2, thereby improving the cooling efficiency. Finally, the present invention is provided with a group of fixing frames 8 under each group of supporting slots 11, and a plurality of groups of temperature measuring components 81 are provided above each group of fixing frames 8. The temperature of different areas of different wafers 3 is measured at a fixed point by the plurality of groups of temperature measuring components 81, so that the staff can adjust the flow rate and temperature of the high-purity nitrogen delivered to the cooling component 4 by the external air cooling system in real time.

[0028] like Figure 1-Figure 2 As shown, the cooling assembly 4 includes a cooling pipeline 41, a right-angle compression fitting 42 and a T-type compression fitting 43. Four cooling pipelines 41 are provided, three right-angle compression fittings 42 are provided, and five T-type compression fittings 43 are provided. The four cooling pipelines 41 form a closed pipeline through three right-angle compression fittings 42 and five T-type compression fittings 43, and one of the T-type compression fittings 43 is connected to the external air cooling system through the ventilation pipe 5.

[0029] like Figure 1-Figure 2 As shown, each cooling pipeline 41 is provided with a plurality of groups of through holes, and the spacing between the plurality of groups of through holes decreases gradually from bottom to top.

[0030] Taking into account the phenomenon of hot air rising, the present invention reduces the through-hole spacing at the bottom of the cooling pipeline 41 compared to the through-hole spacing at the top, compared to the currently used chip cooling device, thereby achieving the purpose of accelerating the cooling, thereby reducing the cooling time of the chip 3 in the equipment, reducing the risk of oxidation of the chip 3, and improving the working efficiency of the equipment.

[0031] like Figure 1 , Figure 3 and Figure 7As shown, a transmission box 6 and a power box 7 are provided on the outside of the mounting frame 1, a transmission mechanism is provided in the transmission box 6, and a power mechanism is provided in the power box 7. The power mechanism is connected to a plurality of groups of supporting mechanisms 2 through the transmission mechanism. A plurality of groups of fixed frames 8 in the present invention are fixedly connected to the inner wall of the mounting frame 1, and a plurality of groups of supporting mechanisms 2 are controlled to rotate in the mounting frame 1 through the power mechanism and the transmission mechanism. When the supporting mechanism 2 rotates in the mounting frame 1, on the one hand, the temperature measuring component 81 on the fixed frame 8 can detect the temperature of each area of ​​the wafer 3, thereby increasing the detection range and facilitating the staff to know the temperature changes of each local area of ​​the wafer 3. On the other hand, when the supporting mechanism 2 rotates with the wafer 3, it can avoid inconsistent cooling of each area of ​​the wafer 3, thereby ensuring the cooling uniformity of the wafer 3. Finally, the present invention can enhance the fluidity of high-purity nitrogen by controlling the rotation speed of the supporting mechanism 2, thereby improving the cooling effect.

[0032] like Figure 1 , Figure 3-Figure 6 As shown, the bearing mechanism 2 includes a bearing ring 21, a reversing gear 22 and a slider 23. The reversing gear 22 and the slider 23 are sequentially arranged below the bearing ring 21. A guide groove 12 is arranged below the bearing groove 11. A slide groove is arranged in the guide groove 12. The slider 23 cooperates with the slide groove.

[0033] like Figure 1 , Figure 3-Figure 6 As shown, a groove is provided at the side end of the carrying ring 21, a movable block 211 is provided at the upper end of the groove, a first electromagnet 212 is provided at the lower end of the groove, the movable block 211 is movably installed in the groove through a first compression spring, and the end of the movable block 211 close to the first electromagnet 212 is magnetic.

[0034] like Figure 1 , Figure 6 , Figure 7 As shown, the transmission mechanism includes a transmission gear 61, a fixed seat 62 and a transmission rod 63, the power mechanism includes a motor 71, a second power gear 72 and a first power gear 64, the transmission gear 61 is provided with several groups, each group of transmission gears 61 is connected to a group of reversing gears 22, several groups of fixed seats 62 are provided on the transmission rod 63, the transmission rod 63 is connected to several groups of transmission gears 61 through several groups of fixed seats 62, the first power gear 64 is provided at the bottom end of the transmission rod 63, and the motor 71 is connected to the first power gear 64 through the second power gear 72.

[0035] In the present invention, the upper surface of the carrying ring 21 is flush with the bottom surface of the carrying groove 11, so that when the staff puts the wafer 3 into the carrying groove 11, the wafer 3 can be directly pushed onto the carrying ring 21. When the wafer 3 moves onto the carrying ring 21, there will be a gap between the wafer 3 and the movable block 211. At this time, the staff turns on the first electromagnet 212, and a set of magnetic fields that attract the movable block 211 are generated by the first electromagnet 212. As the movable block 211 moves downward, the gap between the wafer 3 and the movable block 211 will increase, and the pressure inside the wafer 3 and the movable block 211 will decrease accordingly. Under the action of atmospheric pressure, the wafer 3 will be adsorbed onto the carrying ring 21 to prevent the wafer 3 from being displaced due to centrifugal force when the carrying mechanism 2 rotates with the wafer 3. Finally, when the wafer 3 is cooled, the motor 71 drives the transmission rod 63 and several groups of transmission gears 61 to rotate through the second power gear 72 and the first power gear 64, and drives several groups of carrying mechanisms 2 to rotate through several groups of transmission gears 61. On the one hand, it is convenient for various areas of the wafer 3 to be cooled evenly, and on the other hand, it is convenient for the staff to monitor the temperature of various areas of the wafer 3. Finally, the fluidity of the high-purity nitrogen is enhanced, thereby improving the cooling effect.

[0036] like Figure 8 As shown, the interior of the fixing seat 62 is provided with a telescopic slot 621, and the end of the transmission gear 61 close to the telescopic slot 621 is provided with a positioning slot. The telescopic slot 621 is provided with a second electromagnet 622, a positioning frame 623 and a positioning block 624. The positioning frame 623 is movably installed in the telescopic slot 621 through a second compression spring ( Figure 8 The second compression spring in the positioning frame 623 is in an extended state), the positioning block 624 is arranged at one end of the positioning frame 623 close to the positioning slot, the positioning block 624 cooperates with the positioning slot, and one end of the positioning frame 623 close to the second electromagnet 622 is magnetic.

[0037] When the present invention is working normally, the second electromagnet 622 will generate a set of magnetic fields that attract the positioning frame 623. Under the action of the magnetic field, the positioning frame 623 and the second electromagnet 622 are fastened together, and the positioning block 624 is inserted into the positioning groove, thereby ensuring that the transmission gear 61 is fixed together with the fixing seat 62, and the power generated by the motor 71 can be transmitted to the bearing mechanism 2. If a group of transmission gears 61 is stuck due to debris or cannot rotate due to other reasons during operation, the staff can disconnect the second electromagnet 622 matched with the group of transmission gears 61. At this time, under the action of the second compression spring, the positioning frame 623 and the positioning block 624 matched with the group of transmission gears 61 will be away from the group of transmission gears 61, thereby ensuring that the transmission rod 63 can rotate normally without being hindered by the group of transmission gears 61. Through the above technical solution, when a group of bearing mechanisms 2 and transmission gears 61 in the present invention fail, other bearing mechanisms 2 and transmission gears 61 can work normally, thereby ensuring the durability of the present invention.

[0038] The working principle of the present invention is as follows: before working, the wafer 3 is first placed in the carrying groove 11, and then the wafer 3 is pushed onto the carrying ring 21. When the wafer 3 moves to the carrying ring 21, the first electromagnet 212 is turned on, and the movable block 211 is driven downward by the first electromagnet 212, so that the wafer 3 is adsorbed onto the carrying ring 21. Then the motor 71 and the external air cooling system are turned on, and high-purity nitrogen is transported into the cooling component 4 by the external air cooling system, thereby cooling the wafer 3 on the carrying mechanism 2. The motor 71 drives the transmission rod 63 and several groups of transmission gears 61 to rotate through the second power gear 72 and the first power gear 64, and drives several groups of carrying mechanisms 2 to rotate through several groups of transmission gears 61. On the one hand, it is convenient for each area of ​​the wafer 3 to be cooled evenly, and on the other hand, it is convenient for the staff to monitor the temperature of each area of ​​the wafer 3, and then adjust the flow rate and temperature of the high-purity nitrogen transported to the cooling component 4 by the external air cooling system in real time, and finally the fluidity of the high-purity nitrogen is enhanced, thereby improving the cooling effect.

[0039] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. A power-adjustable chip cooling device with local temperature control feedback, Features: The wafer cooling device comprises a mounting frame (1), a bearing mechanism (2) and a cooling assembly (4); the cooling assembly (4) is arranged at the rear end of the mounting frame (1); the cooling assembly (4) is connected to an external air cooling system via a ventilation pipe (5); a plurality of groups of bearing grooves (11) are arranged on the inner wall of the mounting frame (1); a group of bearing mechanisms (2) are arranged in each group of the bearing grooves (11); a group of fixing frames (8) are arranged below each group of the bearing grooves (11); and a plurality of groups of temperature measuring assemblies (81) are arranged above each group of the fixing frames (8).

2. A power adjustable wafer cooling device with local temperature control feedback according to claim 1, Features: The cooling assembly (4) comprises a cooling pipeline (41), a right-angled ferrule joint (42) and a T-shaped ferrule joint (43); four cooling pipelines (41) are provided, three right-angled ferrule joints (42) are provided, and five T-shaped ferrule joints (43) are provided; the four cooling pipelines (41) form a closed pipeline through the three right-angled ferrule joints (42) and the five T-shaped ferrule joints (43).

3. A power adjustable wafer cooling device with local temperature control feedback according to claim 2, Features: Each cooling pipeline (41) is provided with a plurality of groups of through holes, and the spacing between the plurality of groups of through holes gradually decreases from bottom to top.

4. A power-adjustable wafer cooling device with local temperature control feedback according to any one of claims 1 to 3, Features: A transmission box (6) and a power box (7) are arranged outside the mounting frame (1); a transmission mechanism is arranged inside the transmission box (6); a power mechanism is arranged inside the power box (7); and the power mechanism is connected to a plurality of groups of bearing mechanisms (2) via the transmission mechanism.

5. A power adjustable wafer cooling device with local temperature control feedback according to claim 4, Features: The bearing mechanism (2) comprises a bearing ring (21), a reversing gear (22) and a sliding block (23); the reversing gear (22) and the sliding block (23) are arranged in sequence below the bearing ring (21); the upper surface of the bearing ring (21) is flush with the bottom surface of the bearing groove (11); a guide groove (12) is arranged below the bearing groove (11); a sliding groove is arranged in the guide groove (12); and the sliding block (23) cooperates with the sliding groove.

6. A power adjustable wafer cooling device with local temperature control feedback according to claim 4, Features: The transmission mechanism comprises a transmission gear (61) and a transmission rod (63); the power mechanism comprises a motor (71); the transmission gear (61) is provided with a plurality of groups, each group of the transmission gear (61) is connected to a group of reversing gears (22); a plurality of groups of fixing seats (62) are provided on the transmission rod (63); the transmission rod (63) is connected to a plurality of groups of transmission gears (61) through the plurality of fixing seats (62); a first power gear (64) is provided at the bottom end of the transmission rod (63); and the motor (71) is connected to the first power gear (64) through a second power gear (72).

7. The power-adjustable wafer cooling device with local temperature control feedback according to claim 5, Features: A groove is provided at the side end of the bearing ring (21), a movable block (211) is provided at the upper end of the groove, a first electromagnet (212) is provided at the lower end of the groove, and the movable block (211) is movably mounted in the groove via a first compression spring.

8. The power-adjustable wafer cooling device with local temperature control feedback according to claim 6, Features: The fixing seat (62) is provided with a telescopic slot (621) inside, and a positioning slot is provided at one end of the transmission gear (61) close to the telescopic slot (621). A second electromagnet (622), a positioning frame (623) and a positioning block (624) are provided inside the telescopic slot (621). The positioning frame (623) is movably installed in the telescopic slot (621) through a second compression spring, and the positioning block (624) is provided at one end of the positioning frame (623) close to the positioning slot, and the positioning block (624) cooperates with the positioning slot.

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